Filter, communication equipment and filter manufacturing method

Abstract

The invention relates to the technical field of communication, and provides a filter, communication equipment and a filter manufacturing method. The filter comprises a first plate and a resonance assembly, the resonance assembly comprises a first insulating plate and at least one resonance conducting layer, the first insulating plate is vertically arranged on the first plate, and the resonance conducting layer is arranged on part of the surface of the first insulating plate. The main body structure of the resonance assembly is the first insulating plate, compared with the resonance assembly which is completely made of metal materials, the cost of the resonance assembly is reduced, and the technical problem that an existing filter is high in cost is solved.

Description

Technical Field

[0001] The present invention relates to the field of communication technology, and in particular to a filter, a communication device and a filter manufacturing method. Background Art

[0002] As a radio frequency device, the filter can pass signals in a certain frequency band with minimum loss and suppress signals in other frequency bands, thereby playing the role of selecting signals in the required frequency band. In some embodiments, the filter includes a metal base plate and a plurality of sheet metal resonant rods. The sheet metal resonant rods are made of metal material into the required shape and are fixed to the metal base plate by laser welding. However, existing filters have the technical problem of high cost. Summary of the invention

[0003] The object of the present invention is to provide a filter, a communication device and a filter manufacturing method, aiming to solve the technical problem of high cost of existing filters.

[0004] In a first aspect, the present application provides a filter, which includes a first plate and a resonant component, wherein the resonant component includes a first insulating plate and a resonant conductive layer arranged on a portion of the surface of the first insulating plate, and the first insulating plate is vertically arranged on the first plate.

[0005] In one embodiment, the first plate includes a first insulating substrate and a first shielding metal layer disposed on at least one side surface of the first insulating substrate.

[0006] In one embodiment, the first insulating substrate and the first insulating plate are integrally formed.

[0007] In one embodiment, the first insulating plate is a plastic plate, the first insulating substrate is a plastic material, and the first insulating plate and the first insulating substrate are integrally injection molded.

[0008] In one embodiment, the resonant conductive layer is arranged on at least one side surface of the first insulating plate and on the end surface of the first insulating plate facing away from the first plate member, and the resonant conductive layer arranged on the end surface of the first insulating plate facing away from the first plate member is connected to the resonant conductive layer arranged on the side surface of the first insulating plate.

[0009] In one embodiment, there are multiple resonant conductive layers, and the multiple resonant conductive layers are sequentially distributed on the surface of the first insulating plate at intervals, and the multiple resonant conductive layers are sequentially coupled and connected to form a main signal channel.

[0010] In one embodiment, the first insulating plate is disposed around the first plate member, and a plurality of the resonant conductive layers are distributed on an outer side of the first insulating plate.

[0011] In one of the embodiments, the resonant component further includes a first rib-shaped conductive layer, which is disposed on a portion of the surface of the first insulating plate and connected between two adjacent resonant conductive layers on the main signal channel.

[0012] In one embodiment, the filter further includes a second insulating plate and a second rib-shaped conductive layer disposed on a portion of the surface of the second insulating plate, the second insulating plate is vertically disposed on the first plate, and the second rib-shaped conductive layer is located between the two resonant conductive layers.

[0013] In one embodiment, the second rib-shaped conductive layer is distributed on a side of the second insulating plate facing away from the first plate.

[0014] In one embodiment, the filter further comprises a side plate, one end of which is connected to the four edges of the first plate member, and the side plate surrounds the resonant component and is spaced apart from the resonant component.

[0015] In one embodiment, the side plate includes a second insulating substrate and a second shielding metal layer, and the second shielding metal layer is disposed on at least one side surface of the second insulating substrate close to the resonant component.

[0016] In one embodiment, the side plate has a signal transmission hole, and the filter further includes a signal transmission end, which is installed in the signal transmission hole, and one end of the signal transmission end abuts against a side surface of the resonant conductive layer away from the first insulating plate.

[0017] In one embodiment, the side panel has a signal transmission hole, the filter also includes a signal transmission end, the signal transmission end is installed in the signal transmission hole, the resonant component also includes a tap conductive layer, the tap conductive layer is arranged on a portion of the surface of the first insulating plate and connected to the resonant conductive layer, and one end of the signal transmission end abuts against a side surface of the tap conductive layer away from the first insulating plate.

[0018] In a second aspect, the present application provides a communication device, comprising any one of the filters described above.

[0019] In a third aspect, the present application provides a filter manufacturing method, the method comprising the following steps:

[0020] providing a first plate;

[0021] A first insulating plate is erected on the first plate member;

[0022] At least one resonant conductive layer is processed on a portion of the surface of the first insulating plate.

[0023] In one embodiment, the step of erecting the first insulating plate on the first plate member specifically includes: injection molding the first insulating plate on the first plate member.

[0024] In one embodiment, the step of machining at least one resonant conductive layer on a portion of the surface of the first insulating plate specifically includes: electroplating the resonant conductive layer on a portion of the surface of the first insulating plate.

[0025] In a fourth aspect, the present application provides a filter manufacturing method, the method comprising the following steps:

[0026] Injection-molding a first insulating substrate and a first insulating plate as a whole, wherein the first insulating plate is vertically arranged on the first insulating substrate;

[0027] Processing a first shielding metal layer on the first insulating substrate;

[0028] At least one resonant conductive layer is processed on a portion of the surface of the first insulating plate.

[0029] The filter, communication equipment and filter manufacturing method provided by the present invention have the following beneficial effects: the resonant component includes a first insulating plate and at least one resonant conductive layer, the resonant conductive layer is arranged on a partial surface of the first insulating plate, and the main structure of the resonant component is the first insulating plate. Compared with the resonant component made entirely of metal materials, the cost of the resonant component is reduced, and the technical problem of high cost in existing filters is solved. BRIEF DESCRIPTION OF THE DRAWINGS

[0030] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative labor.

[0031] Figure 1 A schematic diagram of the external structure of a filter provided by an embodiment of the present invention;

[0032] Figure 2 A schematic diagram of the internal structure of a filter provided by an embodiment of the present invention;

[0033] Figure 3 A schematic structural diagram of a first plate component and a resonant component of a filter provided in an embodiment of the present invention;

[0034] Figure 4 Another perspective view of the first plate and the resonant component provided in the embodiment of the present invention;

[0035] Figure 5 Another perspective view of the first plate and the resonant component provided in the embodiment of the present invention;

[0036] Figure 6 for Figure 1 Provided filter simulation waveform diagram;

[0037] Figure 7 A schematic diagram of another structure of the first plate and the resonance component provided in an embodiment of the present invention;

[0038] Figure 8 A schematic diagram of an integrated first plate and a first insulating plate provided in an embodiment of the present invention;

[0039] Fig. 9 A schematic structural diagram of a side plate of a filter provided in an embodiment of the present invention;

[0040] Fig.10 Another perspective view of the side plate of the filter provided by the embodiment of the present invention;

[0041] Fig.11 A schematic structural diagram of a second plate member of a filter provided in an embodiment of the present invention;

[0042] Fig.12 A schematic diagram of a filter manufacturing method according to an embodiment of the present invention;

[0043] Fig.13 A schematic flow chart of another filter manufacturing method provided by an embodiment of the present invention.

[0044] Among them, the reference numerals in the figure are:

[0045] X, first direction; Y, second direction; Z, third direction;

[0046] 100, first plate; 110, first insulating substrate; 120, first shielding metal layer; 130, first connecting hole; 140, third connecting hole;

[0047] 200, resonant component; 210, first insulating plate; 211, notch; 220, resonant conductive layer; 230, first rib-shaped conductive layer;

[0048] 310, second insulating plate; 320, second rib-shaped conductive layer;

[0049] 410, side plate; 411, signal transmission hole; 412, limit step; 413, second connection hole; 420, partition wall; 421, coupling window; 422, fourth connection hole; 430, second plate; 431, tuning part; 432, through hole;

[0050] 510, signal transmission end; 520, coupling adjustment structure. DETAILED DESCRIPTION

[0051] Embodiments of the present invention are described in detail below, examples of which are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to be used to explain the present invention, and should not be construed as limiting the present invention.

[0052] Reference throughout the specification to "one embodiment" or "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least one embodiment of the present application. Thus, when the phrases "in one embodiment" or "in some embodiments" appear in various places throughout the specification, not all references are to the same embodiment. Furthermore, in one or more embodiments, the particular features, structures, or characteristics may be combined in any suitable manner.

[0053] In the description of the present invention, it should be understood that the terms "length", "width", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating the orientation or position relationship are based on the orientation or position relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0054] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features.

[0055] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0056] Embodiment 1

[0057] Combination Figure 1 and Figure 2 , the filter provided in the present application has a first direction X, a second direction Y and a third direction Z that are perpendicular to each other. For example, when the shape of the filter is a rectangular parallelepiped, the first direction X is the length direction of the filter, the second direction Y is the width direction of the filter, and the third direction Z is the height direction of the filter. It can be understood that the first direction X can also be the width direction, height direction or other direction of the filter with a rectangular shape, which is not uniquely limited here. In other embodiments, the shape of the filter can also be a sphere, cone, prism, pyramid or other polyhedron, which is not uniquely limited here.

[0058] Combination Figures 3 to 5 The filter includes a first plate 100 and a resonant component 200. The resonant component 200 includes a first insulating plate 210 and at least one resonant conductive layer 220. The first insulating plate 210 is vertically arranged on the first plate 100, and the resonant conductive layer 220 is arranged on a part of the surface of the first insulating plate 210. The resonant conductive layer 220 is used to achieve signal transmission and coupling. In this way, the main structure of the resonant component 200 is the first insulating plate 210. Compared with the resonant component 200 made entirely of metal materials, the cost of the resonant component 200 is reduced, thereby reducing the cost of the filter.

[0059] In addition, first, the resonant conductive layer 220 is a conductive layer structure with a small thickness, which is conducive to reducing the weight and volume of the filter and realizing a lightweight design of the filter. Second, compared with the irregularly shaped metal resonant rod, the plate-shaped first insulating plate 210 is easy to process and manufacture, which is conducive to reducing the production cost of the resonant component 200. Third, a part of the surface of the first insulating plate 210 can be provided with resonant conductive layers 220 of different numbers, shapes, and sizes, which can be suitable for the shape and size requirements of different filters and different resonant components 200, reducing the types of materials for the resonant component 200, reducing the types and number of production molds, further reducing production costs, and being able to meet the customization needs of customers, with a wide range of application scenarios, high design flexibility, and strong versatility. Fourth, compared with the laser welding assembly of the metal resonant rod, which is complicated to operate, requires high skills of the operator, and has poor assembly consistency, the first insulating plate 210 can be installed on the first plate 100 by injection molding, riveting, crimping, screw fastening, threaded connection, additive manufacturing or clamping, which greatly reduces the difficulty of assembly. Different manufacturers can flexibly choose the assembly method according to the conditions of the assembly equipment, the degree of process proficiency, and the production rhythm, which is conducive to reducing the assembly cost, greatly reducing the assembly error, improving the assembly consistency, and thus improving the stability of product indicators (see Figure 6 ).

[0060] The first insulating plate 210 is a whole plate-like structure with a regular shape, and a resonant conductive layer 220 of various shapes can be formed on the surface of the first insulating plate 210 according to actual filtering requirements.

[0061] In some embodiments, the material of the resonant conductive layer 220 may be a metal material, such as copper, silver, or aluminum, or a semiconductor material, such as silicon, gallium arsenide, or gallium nitride.

[0062] In some embodiments, in combination Figures 3 to 5 The resonant conductive layer 220 is disposed on a portion of the surface of the first insulating plate 210 by electroplating, bonding, additive manufacturing, physical vapor deposition, spraying or hot pressing.

[0063] For example, the resonant conductive layer 220 is disposed on a portion of the surface of the first insulating plate 210 by selective electroplating, so that the thickness of the resonant conductive layer 220 can be accurately controlled, and the thickness can be controlled to the micron level, thereby reducing the use of metal materials, further reducing the cost and weight of the filter, and facilitating the lightweight design of the filter; at the same time, the resonant conductive layer 220 of different shapes and sizes can be electroplated according to actual filtering requirements to adapt to different index requirements, thereby improving the applicability of the filter.

[0064] For example, the resonant conductive layer 220 is a metal sheet, which may be copper foil. After the resonant conductive layer 220 is processed and manufactured to be qualified, it is bonded or hot-pressed to the surface of the first insulating plate 210, so as to avoid dimensional errors caused by direct electroplating, spraying, additive manufacturing or physical vapor deposition of the resonant conductive layer 220 on the first insulating plate 210, which does not meet the performance requirements and causes the entire first insulating plate 210 to be scrapped, which is conducive to reducing the defective rate and thus reducing production costs.

[0065] For another example, the resonant conductive layer 220 is disposed on a portion of the surface of the first insulating plate 210 by physical vapor deposition, additive manufacturing or spraying. Physical vapor deposition can use a magnetic field to control the deposition position and deposition thickness. Spraying can control the nozzle position, spray direction and spray angle through a program. Additive manufacturing can control the deposition position and deposition thickness through digital design. That is, all three methods can flexibly design the resonant conductive layer 220, which can be easily modified and customized to meet specific design requirements. There is no need for additional machining and cutting to obtain a specific shape of the resonant conductive layer 220. The same equipment can be used to manufacture resonant conductive layers 220 of different shapes, sizes and thicknesses, thereby reducing the types and quantity of processing equipment and reducing production costs.

[0066] In some embodiments, in combination Figures 3 to 5The first insulating plate 210 can be erected on the first plate 100 by injection molding, welding, riveting, crimping, screw fastening, threaded connection, hot melt connection, additive manufacturing or clamping. At this time, the first plate 100 can be a metal substrate or an insulating substrate with a metal layer, that is, the first insulating plate 210 is erected on the metal substrate or the insulating substrate.

[0067] In some embodiments, in combination Figure 7 The first plate 100 includes a first insulating substrate 110 and a first shielding metal layer 120 disposed on at least one side of the first insulating substrate 110. Compared with the first plate 100 made entirely of metal, the first insulating substrate 110 of the first plate 100 is a non-metallic part, which reduces the use of metal materials, can reduce the cost and weight of the filter, and is conducive to the lightweight design of the filter.

[0068] Optionally, the first shielding metal layer 120 is used to shield the signal to prevent external signals from interfering with the resonant component 200 and to prevent signal leakage of the resonant component 200. The first shielding metal layer 120 is also used to enclose together with other panels of the filter to form a closed cavity to generate resonance and provide electromagnetic signal transmission. The first shielding metal layer 120 can only cover one side surface of the first insulating substrate 110, or the first shielding metal layer 120 can also cover the opposite two side surfaces of the first insulating substrate 110; the first shielding metal layer 120 can also cover the entire surface of the first insulating substrate 110, that is, the entire outer surface of the first insulating substrate 110 is covered with the first shielding metal layer 120.

[0069] Optionally, the first shielding metal layer 120 is coated on the surface of the first insulating substrate 110 by electroplating, bonding, additive manufacturing, physical vapor deposition, spraying or hot pressing. For example, the first shielding metal layer 120 is coated on the surface of the first insulating substrate 110 by selective electroplating. For example, the first shielding metal layer 120 is processed and manufactured to be qualified and then bonded or hot pressed to cover the surface of the first insulating substrate 110. For another example, the first shielding metal layer 120 is coated on the surface of the first insulating substrate 110 by physical vapor deposition, additive manufacturing or spraying.

[0070] Specifically, the first insulating substrate 110 and the first insulating plate 210 are integrally formed. For example, the first insulating substrate 110 and the first insulating plate 210 are integrally injection molded, which does not require assembly and has high position accuracy, can ensure the dimensional stability and assembly consistency of the product, greatly reduce assembly errors, improve assembly consistency, and thus improve product index stability. For another example, the first insulating plate 210 is additively manufactured on the first insulating substrate 110, which can accurately control the stacking amount of the first insulating plate 210, reduce material waste, reduce production costs, and have a firm connection.

[0071] In some embodiments, the first insulating plate 210 may be a plastic plate, a ceramic plate, or a composite material plate.

[0072] In one embodiment, in combination Figure 8 The first insulating plate 210 is a plastic plate, the first insulating substrate 110 is a plastic material, and the first insulating plate 210 and the first insulating substrate 110 are integrally injection molded.

[0073] On the one hand, compared with composite materials or ceramic materials, the first insulating plate 210 utilizes the low density of plastics, which is conducive to the miniaturization and lightweight design of the filter, and the first insulating plate 210 has good plasticity, and can be made into various shapes (especially surrounding curved shapes) of the first insulating plate 210 through processing methods such as injection molding, extrusion, and blow molding, meeting the design requirements of filters of different scenes, different sizes, and different specifications. On the other hand, the first insulating substrate 110 made of plastic material can further reduce the weight of the filter, which is more conducive to the miniaturization and lightweight of the filter; and the first insulating plate 210 and the first insulating substrate 110 are both plastic parts and the two are integrally injection molded, which is simple and convenient to process and mold, and has high molding precision, better consistency of the molded product, and high structural stability after integral injection molding, which is conducive to the stability and consistency of the filter indicators.

[0074] In some embodiments, in combination Figure 2 , Figure 3 and Figure 5 , the resonant conductive layer 220 is arranged on at least one side surface of the first insulating plate 210, and is arranged on the end surface of the first insulating plate 210 facing away from the first plate 100, and the resonant conductive layer 220 arranged on the end surface of the first insulating plate 210 facing away from the first plate 100 is connected to the resonant conductive layer 220 arranged on the side surface of the first insulating plate 210. Among them, the resonant conductive layer 220 is arranged on the end surface of the first insulating plate 210 facing away from the first plate 100, and can be used as a resonant disk of the resonant component 200, and is used to be spaced apart from the second plate 430 mentioned below to form a loading capacitor, so as to further optimize the performance index of the filter.

[0075] It should be noted that the resonant conductive layer 220 may be disposed on one side of the first insulating plate 210, or may be disposed on two opposite sides of the first insulating plate 210 along the thickness direction. When the resonant conductive layer 220 is disposed on two opposite sides of the first insulating plate 210, in order to ensure the consistency of the performance indicators of the resonant conductive layer 220, the resonant conductive layer 220 located on two opposite sides of the first insulating plate 210 should be completely symmetrical along the thickness direction of the first insulating plate 210.

[0076] In this embodiment, the resonant component 200 includes one, two or more than two resonant conductive layers 220, which play the role of selecting the required frequency band signal. Optionally, when the number of resonant conductive layers 220 exceeds two, the required coupling relationship is established between each resonant conductive layer 220 to form a complete and orderly main signal channel inside the filter. When the number of resonant conductive layers 220 is more than two, the solid first insulating plate 210 separates two adjacent resonant conductive layers 220 and supports the resonant conductive layer 220 to avoid deformation, instability or tilt of the resonant conductive layer 220 during use or transportation, thereby ensuring the performance stability of the filter product, and compared with air isolation, the first insulating plate 210 can more effectively avoid signal interference between two adjacent resonant conductive layers 220.

[0077] In some embodiments, in combination Figures 3 to 5 There are multiple resonant conductive layers 220, and the multiple resonant conductive layers 220 are sequentially spaced and distributed on the surface of the first insulating plate 210, so that the structure of the resonant component 200 is more compact, which is conducive to the sequential coupling and connection of the multiple resonant conductive layers 220 to form a main signal channel.

[0078] Optionally, the plurality of resonant conductive layers 220 are sequentially arranged at intervals along the length direction of the first insulating plate 210 , and may be arranged in the same column or in different columns, which is not limited in this embodiment.

[0079] Optionally, the thickness and height of each resonant conductive layer 220 are the same, so as to reduce the physical variables between the resonant conductive layers 220, so as to facilitate the subsequent filter frequency modulation to controllably and accurately adjust the filter frequency through a few variables.

[0080] In one embodiment, in combination Figures 3 to 5 The first insulating plate 210 is disposed around the first plate 100. The surrounding arrangement of the first insulating plate 210 can make full use of the installation area on the first plate 100 and extend the length of the first insulating plate 210 as much as possible to set more resonant conductive layers 220, which is conducive to the miniaturization design of the filter.

[0081] Specifically, a plurality of resonant conductive layers 220 are distributed on the outer side of the first insulating plate 210. On the one hand, the outer side of the first insulating plate 210 has a large operating space, which is convenient for setting the resonant conductive layer 220 and reduces the manufacturing difficulty. Figure 3The first insulating plate 210 shown is arranged in a surrounding manner, including two rows of insulating plate members arranged opposite to each other, and the resonant conductive layer 220 is arranged on a side surface of the insulating plate member away from the other insulating plate member, that is, the outer surface of the first insulating plate 210, with a large processing operation space, and it is easy to use electroplating, bonding, additive manufacturing, physical vapor deposition, spraying or hot pressing to cover the outer surface of the first insulating plate 210. On the other hand, if both resonant conductive layers 220 are located on the inner side of the first insulating plate 210, the distance between the two is short, and signal interference is likely to occur. Therefore, the resonant conductive layer 220 is arranged on the outer side of the first insulating plate 210 to reduce the risk of signal interference.

[0082] Optionally, the resonant conductive layer 220 is also distributed on the end surface of the first insulating plate 210 facing away from the first plate 100 to increase the area of ​​the resonant conductive layer 220 and improve the signal transmission performance. Similarly, the end surface of the first insulating plate 210 facing away from the first plate 100 has a large operating space, which is convenient for setting the resonant conductive layer 220. The resonant conductive layer 220 is not distributed on the inner side surface of the first insulating plate 210 to reduce the manufacturing difficulty and signal interference risk.

[0083] In one embodiment, in combination Figure 3 and Figure 5 The resonant component 200 further includes a first rib-shaped conductive layer 230, which is disposed on a portion of the surface of the first insulating plate 210 and connected between two adjacent resonant conductive layers 220 on the main signal channel. The first rib-shaped conductive layer 230 facilitates the transmission of signals from one resonant conductive layer 220 to another resonant conductive layer 220, thereby improving the stability of signal transmission. The extension direction of the first rib-shaped conductive layer 230 may be straight, bent, etc., and this embodiment does not impose a unique restriction on the extension path of the first rib-shaped conductive layer 230.

[0084] It should be noted that two adjacent resonant conductive layers 220 on the main signal channel may be connected in structure, or may be connected only by signal coupling but not in structure. Figures 3 to 5 In the illustrated embodiment, some two adjacent resonant conductive layers 220 are connected via the first rib-shaped conductive layer 230 , while some two adjacent resonant conductive layers 220 are not connected via the first rib-shaped conductive layer 230 , but are connected by signal coupling but not structurally connected.

[0085] By disposing the first rib-shaped conductive layer 230 on a portion of the surface of the first insulating plate 210 , the weight of the filter can be further reduced, which is beneficial to reducing the cost of the filter.

[0086] Optionally, the first ribbed conductive layer 230 is covered on a portion of the surface of the first insulating plate 210 by electroplating, bonding, additive manufacturing, physical vapor deposition, spraying or hot pressing. For example, the first ribbed conductive layer 230 is covered on a portion of the surface of the first insulating plate 210 by selective electroplating. For example, the first ribbed conductive layer 230 is processed and manufactured to obtain a qualified shape and then bonded or hot pressed to cover a portion of the surface of the first insulating plate 210. For another example, the first ribbed conductive layer 230 is covered on a portion of the surface of the first insulating plate 210 by physical vapor deposition, additive manufacturing or spraying.

[0087] In some other embodiments, when the first plate 100 includes the first insulating substrate 110, the first rib-shaped conductive layer 230 may also be disposed on both the first insulating plate 210 and the first insulating substrate 110. That is, the first rib-shaped conductive layer 230 may be disposed at the connection between the first insulating plate 210 and the first insulating substrate 110. Of course, the first rib-shaped conductive layer 230 may not be disposed at the connection between the first insulating plate 210 and the first insulating substrate 110, or the connection between the first insulating plate 210 and the first insulating substrate 110 may be spaced apart from the first rib-shaped conductive layer 230.

[0088] In one embodiment, in combination Figure 5 The filter further includes a second insulating plate 310 and a second rib-shaped conductive layer 320 disposed on a portion of the surface of the second insulating plate 310. The second insulating plate 310 is vertically disposed on the first plate 100, and the second rib-shaped conductive layer 320 is located between the two resonant conductive layers 220. The two non-adjacent resonant conductive layers 220 on the main signal channel are cross-coupled through the second rib-shaped conductive layer 320 to generate a transmission zero point, thereby improving the out-of-band suppression effect of the filter; or, by disposing the second insulating plate 310 and the second rib-shaped conductive layer 320 between the two resonant conductive layers 220, the coupling connection of the signals between the two resonant conductive layers 220 can be achieved.

[0089] Specifically, combined Figure 5 The second insulating plate 310 is located between the surrounding first insulating plates 210. By arranging the second rib-shaped conductive layer 320 on a part of the surface of the second insulating plate 310, the weight of the filter can be further reduced, which is conducive to reducing the cost of the filter.

[0090] In some other embodiments, there are multiple first insulating plates 210 , and the second insulating plate 310 is located between two adjacent first insulating plates 210 .

[0091] Optionally, the second rib-shaped conductive layer 320 is distributed on a side of the second insulating plate 310 facing away from the first plate 100 , which provides a large operating space, facilitates the arrangement of the second rib-shaped conductive layer 320 , and reduces manufacturing difficulty.

[0092] Optionally, the second rib-shaped conductive layer 320 is covered on a portion of the surface of the second insulating plate 310 by electroplating, bonding, additive manufacturing, physical vapor deposition, spraying or hot pressing. For example, the second rib-shaped conductive layer 320 is covered on a portion of the surface of the second insulating plate 310 by selective electroplating. For example, the second rib-shaped conductive layer 320 is processed and manufactured to obtain a qualified coupling rib shape and then bonded or hot-pressed to cover a portion of the surface of the second insulating plate 310. For another example, the second rib-shaped conductive layer 320 is covered on a portion of the surface of the second insulating plate 310 by physical vapor deposition, additive manufacturing or spraying.

[0093] In some embodiments, in combination Figure 2 , Fig. 9 and Fig.10 The filter further includes a side plate 410, one end of which is connected to the four edges of the first plate 100, and the side plate 410 surrounds the resonant component 200 and is spaced apart from the resonant component 200. The side plate 410 can protect the resonant component 200. The side plate 410 and the first plate 100 jointly shield the interference of external signals on the resonant component 200, and also prevent the signal leakage of the resonant component 200.

[0094] It should be noted that the first plate 100 can be formed independently or integrally with the side plate 410, and this embodiment does not limit this. When the first plate 100 and the side plate 410 are manufactured separately, the first plate 100 and the side plate 410 are connected by welding, riveting, crimping, screw fastening, threaded connection or clamping. Figure 3 and Fig.10 The first plate 100 is provided with a first connection hole 130, the side plate 410 is provided with a second connection hole 413, and the filter further comprises a first fastener, which is passed through the first connection hole 130 and the second connection hole 413 to achieve a stable connection between the first plate 100 and the side plate 410. Optionally, there are multiple first connection holes 130, which are spaced apart along the circumference of the first plate 100, and the numbers of the first fasteners and the second connection holes 413 correspond to the first connection holes 130 one by one.

[0095] It should also be noted that the side plate 410 and the first plate 100 are combined to form a filter housing. The side plate 410 can be annular, so that the filter housing is a circular cylinder; or, the filter can include multiple side plates 410 connected end to end in sequence, so that the filter housing is a polygonal cylinder; or, the filter housing can be a cylinder of any other irregular shape. Among them, the filter housing can be an integrally formed structure, or a structure in which multiple side plates 410 are separately connected, and this embodiment does not limit this.

[0096] In one embodiment, in combination Figure 2, the side plate 410 includes a second insulating substrate and a second shielding metal layer, and the second shielding metal layer is arranged on at least one side surface of the second insulating substrate. The second shielding metal layer can only cover the inner surface of the second insulating substrate, or the second shielding metal layer can also cover the inner and outer surfaces of the second insulating substrate; the second shielding metal layer can also cover the entire surface of the second insulating substrate, that is, the entire outer surface of the second insulating substrate is covered with the second shielding metal layer. Compared with the side plate 410 made of metal material as a whole, the second insulating substrate of the side plate 410 is a non-metallic part, which reduces the use of metal materials and can reduce the cost and weight of the filter, such as the lightweight design of the filter.

[0097] Optionally, the second shielding metal layer is used to shield the signal to prevent external signals from interfering with the resonant component 200 and to prevent signal leakage of the resonant component 200. The second shielding metal layer can be disposed on a side surface of the second insulating substrate close to the resonant component 200, or on opposite inner and outer side surfaces of the second insulating substrate.

[0098] Optionally, the second shielding metal layer is coated on the surface of the second insulating substrate by electroplating, bonding, additive manufacturing, physical vapor deposition, spraying or hot pressing. For example, the second shielding metal layer is coated on the surface of the second insulating substrate by selective electroplating. For example, the second shielding metal layer is processed and manufactured to be qualified and then bonded or hot pressed to cover the surface of the second insulating substrate. For another example, the second shielding metal layer is coated on the surface of the second insulating substrate by physical vapor deposition, additive manufacturing or spraying.

[0099] Optionally, the second insulating substrate, the first insulating substrate 110 and the first insulating plate 210 are integrally formed without the need for assembly and with high positioning accuracy, which can ensure the dimensional stability and assembly consistency of the product, greatly reduce assembly errors, improve assembly consistency, and thereby improve product indicator stability.

[0100] Optionally, the second insulating substrate may be a plastic substrate, a ceramic substrate or a composite material substrate.

[0101] In one embodiment, in combination Figure 2 and Fig.10, the side plate 410 has a signal transmission hole 411, and the filter also includes a signal transmission end 510, which is installed in the signal transmission hole 411, and one end of the signal transmission end 510 abuts against the side surface of the resonant conductive layer 220 away from the first insulating plate 210. In this way, the signal transmission end 510 extends from the outside into the inside of the side plate 410 through the signal transmission hole 411 and connects with the resonant conductive layer 220 to achieve signal input or output. Among them, the signal transmission end 510 abuts against the side surface of the resonant conductive layer 220 away from the first insulating plate 210, that is, abuts against the surface of the resonant conductive layer 220, which increases the contact area and stabilizes the signal transmission. If a mounting hole for the signal transmission end 510 is opened on the first insulating plate 210, the strength of the first insulating plate 210 will be damaged, and the resonant conductive layer 220 located on the surface will be damaged, resulting in the wear of the resonant conductive layer around the mounting hole. Although the signal transmission end 510 is inserted into the mounting hole, it cannot be electrically connected to the resonant conductive layer 220.

[0102] In one embodiment, the resonant component 200 further includes a tap conductive layer, which is disposed on a portion of the surface of the first insulating plate 210 and connected to the resonant conductive layer 220, and one end of the signal transmission end 510 abuts against a surface of the tap conductive layer away from the first insulating plate 210. The signal of the signal transmission end 510 is fed into the resonant conductive layer 220 via the tap conductive layer, or the signal of the resonant conductive layer 220 is fed into the signal transmission end 510 via the tap conductive layer.

[0103] By providing a tap conductive layer on a portion of the surface of the first insulating plate 210 , external structures such as a tap rod and a tap sheet can be omitted, which can further reduce the weight of the filter and help reduce the cost of the filter.

[0104] Optionally, the tap conductive layer is covered on a portion of the surface of the first insulating plate 210 by electroplating, bonding, additive manufacturing, physical vapor deposition, spraying or hot pressing. For example, the tap conductive layer is covered on a portion of the surface of the first insulating plate 210 by selective electroplating. For example, the tap conductive layer is processed and manufactured to obtain a qualified shape and then bonded or hot pressed to cover a portion of the surface of the first insulating plate 210. For another example, the tap conductive layer is covered on a portion of the surface of the first insulating plate 210 by physical vapor deposition, additive manufacturing or spraying.

[0105] The signal transmission end 510 abuts against the surface of the tap conductive layer away from the first insulating plate 210, that is, abuts against the surface of the tap conductive layer, thereby increasing the contact area and stabilizing signal transmission. If a mounting hole for the signal transmission end 510 is provided on the first insulating plate 210, the strength of the first insulating plate 210 will be damaged, and the tap conductive layer on the surface will be damaged, resulting in the tap conductive layer around the mounting hole being worn, and the signal transmission end 510 cannot be electrically connected to the tap conductive layer although it is inserted into the mounting hole.

[0106] It should be noted that the signal transmission end 510 includes at least one signal input end and at least one signal output end, the signal input end is used to input the signal and energy into the resonant conductive layer 220 connected thereto, and the signal output end is used to output the signal and energy from the resonant conductive layer 220 connected thereto. Based on this, the filter can input the signal and energy into the resonant conductive layer 220 connected thereto through the signal input end, and then transmit the energy in sequence along the signal channel formed through each resonant conductive layer 220 and gradually filter out and suppress the clutter signal and the interference signal, and then output the signal and energy through the signal output end to complete the filtering operation of the filter.

[0107] Specifically, a limiting step 412 is provided on the hole wall of the signal transmission hole 411, thereby limiting the depth of the signal transmission end 510 extending into the inner part of the side plate 410, so as to ensure that the signal transmission end 510 is well abutted against the resonant conductive layer 220, and the signal transmission end 510 is not extended to a depth that is insufficient and causes a gap between the signal transmission end 510 and the resonant conductive layer 220, nor is the signal transmission end 510 extended to a depth that is too great and wears the resonant conductive layer 220 in contact with the signal transmission end 510.

[0108] In one embodiment, see Figure 2 and Fig. 9 The first insulating plate 210 is disposed around the first plate body, and the filter further includes an isolation wall 420, which is disposed in the middle of the first insulating plate 210 to shield irrelevant signals and prevent signal interference.

[0109] Specifically, a coupling window 421 may be provided on the isolation wall 420, and two resonant conductive layers 220 opposite to each other along the coupling window 421 may establish a coupling relationship via the coupling window 421. Even when the coupling window 421 is provided over a larger range, multiple groups of resonant conductive layers 220 may share the coupling window 421 to establish their own coupling relationship, that is, among the multiple groups of resonant conductive layers 220 sharing the coupling window 421, two opposite resonant conductive layers 220 of each group of resonant conductive layers 220 may establish a coupling relationship via the coupling window 421.

[0110] Specifically, the isolation wall 420 and the first plate 100 are connected by welding, riveting, crimping, screwing, threading or clamping, so that the bottom of the isolation wall 420 is fixed on the first plate 100, so as to avoid the isolation wall 420 being suspended in the air and causing unstable position, thereby ensuring the index stability of the filter. Figure 3 and Fig. 9 The first plate 100 is provided with a third connection hole 140 , the isolation wall 420 is provided with a fourth connection hole 422 , and the filter further includes a second fastener penetrating through the third connection hole 140 and the fourth connection hole 422 , thereby fixing the isolation wall 420 on the first plate 100 .

[0111] In one embodiment, in combination Figure 2 and Fig. 9 The surrounding first insulating plate 210 has a notch 211, and one end of the isolation wall 420 is connected to the side plate 410. For example, the isolation wall 420 and the side plate 410 are fixedly connected by integral molding, welding, riveting, crimping, screw fastening, threaded connection or snap-on connection, and the other end of the isolation wall 420 extends through the notch 211 to the middle of the first insulating plate 210 to isolate the signal.

[0112] In some embodiments, in combination Figure 1 , Figure 2 and Fig.11 The filter includes a second plate 430, and the end of the side plate 410 away from the first plate 100 is connected to the second plate 430. The second plate 430, the side plate 410 and the first plate 100 form a closed inner cavity, which can achieve a shielding function and prevent signal leakage.

[0113] Specifically, the side panel 410 is separately connected to the first panel 100, and the side panel 410 is separately connected to the second panel 430; or, the side panel 410 is integrally connected to the second panel 430, and the side panel 410 is separately connected to the first panel 100; or, the side panel 410 is separately connected to the second panel 430, and the side panel 410 is integrally connected to the first panel 100; the above methods can facilitate the convenient and quick assembly of a closed inner cavity through the second panel 430, the side panel 410 and the first panel 100, and can also facilitate the installation of components such as the resonance component 200.

[0114] Optionally, the second plate 430 includes a third insulating substrate and a third shielding metal layer disposed on a surface of the third insulating substrate.

[0115] In one embodiment, in combination Figure 1 , Figure 2 and Fig.11 , the second plate 430 includes a tuning part 431. Each tuning part 431 can be deformed by force and is arranged corresponding to a resonant conductive layer 220. Based on this, when one end of the resonant conductive layer 220 is connected to the first plate 100 and the end of the resonant conductive layer 220 away from the first plate 100 is arranged at a distance from the tuning part 431, the distance between the tuning part 431 and the resonant conductive layer 220 can be adjusted by deforming the tuning part 431 by force, thereby adjusting the capacitance between the tuning part 431 and the resonant conductive layer 220 and adjusting the resonant frequency, and the adjustment is very convenient.

[0116] By adopting the above scheme, the shielding function can be realized by the first plate 100, the side plate 410 and the second plate 430, and the signal leakage can be prevented. By setting the tuning part 431 on the second plate 430, it is convenient to adjust the distance between the tuning part 431 and the resonant conductive layer 220 by deforming the tuning part 431 under force, and then adjust the capacitance between the tuning part 431 and the resonant conductive layer 220 to adjust the resonant frequency. Thus, the tuning convenience and tuning accuracy of the filter can be effectively guaranteed and improved. In addition, since the filter is adjusted by the deformation of the tuning part 431, the tuning part 431 can be basically avoided from excessively penetrating into the interior of the cavity or even rubbing against the filter housing, thereby effectively reducing the risk of high-power discharge and arcing in the filter, and basically no burrs, debris, etc. will fall into the cavity during tuning, and even the second plate 430 can effectively prevent external impurities from entering the interior of the filter, thereby effectively guaranteeing and improving the intermodulation stability and power index of the filter. Furthermore, compared with the existing filters, the filter can omit tuning elements such as tuning screws, thereby simplifying the structure, saving costs, and facilitating the miniaturization and lightness of the filter.

[0117] It should be noted that the second plate 430 may be a single-layer plate or a multi-layer plate. When the second plate 430 is a multi-layer plate, at least one layer of the second plate 430 is a deformed plate.

[0118] In one embodiment, the second plate 430 includes threaded holes. Each threaded hole is arranged corresponding to a resonant conductive layer 220, and the filter further includes a tuning screw threadedly connected to the threaded hole. Based on this, the tuning screw can be rotated relative to the second plate 430 to adjust the length of the tuning screw penetrating into the cavity, thereby adjusting the resonant frequency, and the adjustment is also very convenient.

[0119] It should be noted that a tuning part 431 corresponding to the resonant conductive layer 220 is provided on the second plate 430. In this case, the second plate 430 is not provided with a threaded hole, and the filter does not include a tuning screw; or, a threaded hole corresponding to the resonant conductive layer 220 is provided on the second plate 430. In this case, the second plate 430 is not provided with a tuning part 431; or, a tuning part 431 and a threaded hole are provided on the second plate 430, part of the resonant conductive layer 220 corresponds to the tuning part 431, and part of the resonant conductive layer 220 corresponds to the threaded hole, and the filter also includes a tuning screw threadedly connected to the threaded hole, so that the resonant frequency of the partial resonant conductive layer 220 is adjusted by the force deformation of the tuning part 431, and the resonant frequency of the partial resonant conductive layer 220 is adjusted by rotating the tuning screw.

[0120] In one embodiment, in combination Figure 1 , Figure 2 and Fig.11 , the second plate 430 includes a through hole 432. The through hole 432 is located between the two resonant conductive layers 220. The filter also includes a coupling adjustment structure 520 installed on the through hole 432. The coupling adjustment structure 520 can change the relative coupling area with the resonant conductive layer 220 by rotating relative to the through hole 432, thereby adjusting the coupling strength; or the coupling adjustment structure 520 can change the depth of entering the filter by axially moving relative to the through hole 432, thereby changing the relative coupling area with the resonant conductive layer 220 to adjust the coupling strength. This embodiment does not limit the specific structure of the coupling adjustment structure 520.

[0121] Embodiment 2

[0122] The present application provides a communication device, including any one of the filters in the above-mentioned embodiment 1. The communication device may be a simplexer, a duplexer, a multiplexer, a combiner, an antenna, a base station, and other communication devices. By adopting the above-mentioned scheme, the quality, performance, and service life of the communication device can be guaranteed and improved by adopting the filter provided in the embodiment of the present application.

[0123] Embodiment 3

[0124] Combination Fig.12 The present application provides a filter manufacturing method, the method comprising the following steps:

[0125] S110 : providing a first plate 100 .

[0126] S120 : erecting the first insulating plate 210 on the first plate 100 .

[0127] S130: processing at least one resonant conductive layer 220 on a part of the surface of the first insulating plate 210. The resonant conductive layer 220 and the first insulating plate 210 are combined to form a resonant component 200.

[0128] Combination Figures 3 to 5 The main structure of the resonance component 200 is the first insulating plate 210. Compared with the resonance component 200 made entirely of metal materials, the cost of the resonance component 200 is reduced, thereby reducing the cost of the filter.

[0129] In addition, first, the resonant conductive layer 220 adopts a conductive layer structure, which can reduce the weight of the filter and facilitate the lightweight design of the filter. Second, compared with the irregularly shaped metal resonant rod, the plate-shaped first insulating plate 210 is easy to process and manufacture, which is conducive to reducing the production cost of the resonant component 200. Third, part of the surface of the first insulating plate 210 can be provided with resonant conductive layers 220 of different numbers, shapes, and sizes, which can be suitable for the shape and size requirements of different filters and different resonant components 200, reducing the types of materials for the resonant component 200, reducing the types and number of production molds, further reducing production costs, and being able to meet the customization needs of customers, with a wide range of application scenarios, high design flexibility, and strong versatility. Fourth, compared with the laser welding assembly of the metal resonant rod, which is complicated to operate, requires high skills of the operator, and has poor assembly consistency, the first insulating plate 210 can be installed on the first plate 100 by injection molding, riveting, crimping, screw fastening, threaded connection, additive manufacturing or clamping, which greatly reduces the difficulty of assembly. Different manufacturers can flexibly choose the assembly method according to the conditions of the assembly equipment, the degree of process proficiency, and the production rhythm, which is conducive to reducing the assembly cost, greatly reducing the assembly error, improving the assembly consistency, and thus improving the stability of product indicators (see Figure 6 ).

[0130] In one embodiment, step S120 specifically includes: injection molding a first insulating plate 210 on the first plate 100. The first insulating plate 210 is made and assembled by injection molding, has high size and shape accuracy, does not require assembly, and has high position accuracy, which can ensure the dimensional stability and assembly consistency of the product.

[0131] Compared with composite materials or ceramic materials, the first insulating plate 210 utilizes the low density of plastic, which is conducive to the miniaturization and lightweight design of the filter. The first insulating plate 210 has good plasticity and can be made into first insulating plates 210 of various shapes through injection molding, extrusion, blow molding and other processing methods to meet the design requirements of filters of different scenes, sizes and specifications.

[0132] It can be understood that in other embodiments, the first insulating plate 210 can also be a ceramic insulating plate or a composite insulating plate. The first insulating plate 210 can also be installed on the first plate 100 by riveting, crimping, screw fastening, threaded connection, hot melt connection, additive manufacturing or clamping. Compared with the laser welding assembly, which is complicated to operate, requires high skills of operators and has poor assembly consistency, the connection method of riveting, crimping, screw fastening, threaded connection or clamping is conducive to reducing the assembly difficulty of the first insulating plate 210 and the first plate 100, improving assembly efficiency and assembly consistency, and can further reduce the skill requirements for operators through automated assembly equipment, realize automated assembly, and improve product indicator stability.

[0133] In one of the embodiments, step S130 specifically includes: electroplating a resonant conductive layer 220 on a portion of the surface of the first insulating plate 210, so that the thickness of the resonant conductive layer 220 can be accurately controlled, and the thickness can be controlled to the micron level, thereby reducing the use of metal materials, further reducing the cost and weight of the filter, and facilitating the lightweight design of the filter.

[0134] It can be understood that in other embodiments, the method can also process the resonant conductive layer 220 on a partial surface of the first insulating plate 210 by bonding, additive manufacturing, physical vapor deposition, spraying or hot pressing, which will not be described in detail here.

[0135] In addition, the filter manufacturing method of the third embodiment is used to manufacture any filter in the first embodiment, including the structural features of any filter in the first embodiment, which will not be described one by one here.

[0136] Embodiment 4

[0137] Combination Fig.13 The present application provides a filter manufacturing method, the method comprising the following steps:

[0138] S210 : integrally forming the first insulating substrate 110 and the first insulating plate 210 by injection molding, wherein the first insulating plate 210 is vertically disposed on the first insulating substrate 110 .

[0139] S220 : processing a first barrier metal layer 120 on the first insulating substrate 110 .

[0140] S230: processing at least one resonant conductive layer 220 on a part of the surface of the first insulating plate 210. The resonant conductive layer 220 and the first insulating plate 210 are combined into a resonant component 200.

[0141] Combination Figures 3 to 5Compared with the resonant component 200 and the first plate 100 which are all made of metal materials, the first insulating substrate 110 and the first insulating plate 210 are integrally injection molded, which reduces the cost of the resonant component 200, thereby reducing the cost of the filter. Moreover, the first insulating substrate 110 and the first insulating plate 210 have high size and shape accuracy, do not require assembly, and have high position accuracy, which can ensure the dimensional stability and assembly consistency of the product, greatly reduce assembly errors, improve assembly consistency, and thereby improve product index stability.

[0142] In one embodiment, step S230 specifically includes: electroplating a resonant conductive layer 220 on a portion of the surface of the first insulating plate 210, so that the thickness of the resonant conductive layer 220 can be accurately controlled, and the thickness can be controlled to the micron level, thereby reducing the use of metal materials, further reducing the cost and weight of the filter, and facilitating the lightweight design of the filter.

[0143] It can be understood that in other embodiments, the method can also process the resonant conductive layer 220 on a partial surface of the first insulating plate 210 by bonding, additive manufacturing, physical vapor deposition, spraying or hot pressing, which will not be described in detail here.

[0144] In one embodiment, step S220 and step S230 are performed simultaneously, specifically: a metal layer is electroplated on at least one side surface of the first insulating substrate 110 and a portion of the surface of the first insulating plate 210, the metal layer located on the first insulating substrate 110 forms a first shielding metal layer 120, and the metal layer located on the first insulating plate 210 forms a resonant conductive layer 220, thereby reducing the processing steps and improving production efficiency.

[0145] In addition, the filter manufacturing method of the fourth embodiment is used to manufacture any filter in the first embodiment, including the structural features of any filter in the first embodiment, which will not be described one by one here.

[0146] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A filter, characterized in that: The filter comprises a first plate and a resonant component, wherein the resonant component comprises a first insulating plate and at least one resonant conductive layer, wherein the first insulating plate is vertically arranged on the first plate, and the resonant conductive layer is arranged on a partial surface of the first insulating plate.

2. The filter according to claim 1, characterized in that: The first plate includes a first insulating substrate and a first shielding metal layer disposed on at least one side surface of the first insulating substrate.

3. The filter according to claim 2, characterized in that: The first insulating substrate and the first insulating plate are integrally formed.

4. The filter according to claim 3, characterized in that: The first insulating plate is a plastic plate, the first insulating substrate is a plastic material, and the first insulating plate and the first insulating substrate are integrally injection-molded.

5. The filter according to claim 1, characterized in that: The resonant conductive layer is arranged on at least one side surface of the first insulating plate and on the end surface of the first insulating plate facing away from the first plate member. The resonant conductive layer arranged on the end surface of the first insulating plate facing away from the first plate member is connected to the resonant conductive layer arranged on the side surface of the first insulating plate.

6. The filter according to claim 1, characterized in that: There are multiple resonant conductive layers, and the multiple resonant conductive layers are sequentially distributed on the surface of the first insulating plate at intervals. The multiple resonant conductive layers are sequentially coupled and connected to form a main signal channel.

7. The filter according to claim 6, characterized in that: The first insulating plate is disposed around the first plate member, and a plurality of the resonant conductive layers are distributed on an outer side surface of the first insulating plate.

8. The filter according to claim 6, characterized in that: The resonant component further includes a first rib-shaped conductive layer, which is disposed on a portion of the surface of the first insulating plate and connected between two adjacent resonant conductive layers on the main signal channel.

9. The filter according to claim 6, characterized in that: The filter further includes a second insulating plate and a second rib-shaped conductive layer disposed on a portion of the surface of the second insulating plate. The second insulating plate is vertically disposed on the first plate member, and the second rib-shaped conductive layer is located between the two resonant conductive layers.

10. The filter according to claim 9, characterized in that: The second rib-shaped conductive layer is distributed on a side of the second insulating plate facing away from the first plate.

11. The filter according to any one of claims 1 to 10, characterized in that: The filter further comprises a side plate, one end of which is connected to the four edges of the first plate member, and the side plate surrounds the resonance component and is spaced apart from the resonance component.

12. The filter according to claim 11, characterized in that: The side plate includes a second insulating substrate and a second shielding metal layer, and the second shielding metal layer is arranged on at least one side surface of the second insulating substrate.

13. The filter according to claim 11, characterized in that: The side plate has a signal transmission hole, and the filter further includes a signal transmission end, the signal transmission end is installed in the signal transmission hole, and one end of the signal transmission end abuts against a side surface of the resonant conductive layer away from the first insulating plate; And / or, the side panel has a signal transmission hole, the filter also includes a signal transmission end, the signal transmission end is installed in the signal transmission hole, the resonant component also includes a tap conductive layer, the tap conductive layer is arranged on a partial surface of the first insulating plate and connected to the resonant conductive layer, and one end of the signal transmission end abuts against a side surface of the tap conductive layer away from the first insulating plate.

14. A communication device, characterized in that: A filter comprising the filter according to any one of claims 1 to 13.

15. A filter manufacturing method, characterized in that: The method comprises the following steps: providing a first plate; A first insulating plate is erected on the first plate member; At least one resonant conductive layer is processed on a portion of the surface of the first insulating plate.

16. The filter manufacturing method according to claim 15, characterized in that: The step of erecting the first insulating plate on the first plate member includes: injection molding the first insulating plate on the first plate member.

17. The filter manufacturing method according to claim 15 or 16, characterized in that: The step of machining at least one resonant conductive layer on a portion of the surface of the first insulating plate includes: electroplating the resonant conductive layer on a portion of the surface of the first insulating plate.

18. A filter manufacturing method, characterized in that: The method comprises the following steps: Injection-molding a first insulating substrate and a first insulating plate as a whole, wherein the first insulating plate is vertically arranged on the first insulating substrate; Processing a first shielding metal layer on the first insulating substrate; At least one resonant conductive layer is processed on a portion of the surface of the first insulating plate.

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