Mini LED backlight circuit board, display screen and preparation method of Mini LED backlight circuit board

Abstract

The invention discloses a Mini LED backlight circuit board, a display screen and a preparation method of the Mini LED backlight circuit board, the circuit board comprises an insulating substrate, an LED positive electrode power supply circuit, a negative electrode circuit and a driving chip bonding pad, one surface of the insulating substrate is a bonding pad circuit arrangement surface, a plurality of Mini LED chip bonding pads are arranged on the bonding pad circuit arrangement surface, and the Mini LED chip bonding pads are arranged on the bonding pad circuit arrangement surface. The LED positive electrode power supply circuit and the LED negative electrode circuit are both arranged on the bonding pad circuit arrangement face, the driving chip bonding pad is arranged on the bonding pad circuit arrangement face or the outer portion of the insulating substrate, a driving chip is welded to the driving chip bonding pad, and all the Mini LED chip bonding pads are arranged along the LED positive electrode power supply circuit and / or the LED negative electrode circuit. And each circuit is connected with the bonding pad through a single-sided circuit technology, so that the usage amount of materials is reduced, and the production process is simplified. And the single-sided circuit technology is adopted, so that the manufacturing cost is saved, the manufacturing process is simplified, and the production efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the field of display technology, and in particular to a Mini LED backlight circuit board, a display screen and a preparation method thereof. Background Art

[0002] With the advancement of display technology, Mini LED backlight technology, as an emerging backlight technology, has shown significant advantages in the application of LCD displays. Compared with traditional edge-type or direct-type backlight technology, Mini LED backlight technology achieves multi-zone dimming, which not only improves display brightness and contrast, but also reduces energy consumption and provides better color expression. However, in order to achieve these advantages, Mini LED backlight technology faces some challenges in the manufacturing process, especially the increase in cost and complexity.

[0003] At present, Mini LED backlight technology mainly relies on a double-layer substrate structure. This is because Mini LED chips, driver ICs and other electronic components need their own space for installation, which is difficult to achieve on a single-layer board and requires a double-layer structure to carry them separately. In order to ensure electrical safety and signal integrity, sufficient isolation measures are required to prevent interference between different functional components. Therefore, Mini LED chips and driver chip ICs and other electronic components usually need to be arranged on different levels. This non-planar arrangement increases the difficulty of manufacturing and leads to higher material costs. In addition, as the number of partitions increases, the complexity of the control system also increases. Summary of the invention

[0004] In order to overcome at least one of the defects described in the above-mentioned prior art, the present invention provides a Mini LED backlight circuit board, a display screen and a preparation method thereof, which can solve the problems of high manufacturing difficulty and high cost caused by the eccentric arrangement of components and circuits.

[0005] The technical solution adopted by the present invention to solve the problem is:

[0006] A Mini LED backlight circuit board, comprising:

[0007] An insulating substrate, wherein one side of the insulating substrate is a pad circuit layout surface, a plurality of Mini LED chip pads are arranged on the pad circuit layout surface, and all the Mini LED chip pads are arranged on the pad circuit layout surface;

[0008] An LED positive power supply circuit, wherein the LED positive power supply circuit is arranged on the pad circuit layout surface;

[0009] A negative electrode circuit, the negative electrode circuit is arranged on the pad circuit layout surface;

[0010] A driving chip pad, the driving chip pad being arranged on the pad circuit layout surface or outside the insulating substrate, and a driving chip being welded on the driving chip pad;

[0011] Among them, the LED positive power supply circuit is electrically connected to the negative power supply circuit, all the Mini LED chip pads are arranged along the LED positive power supply circuit and / or the negative power supply circuit, and all the Mini LED chip pads are electrically connected to the driving chip.

[0012] By adopting the above solution, the LED positive power supply line, negative line and Mini LED chip pad are all set on the pad line layout surface, avoiding the need for a double-layer board structure, thereby reducing material costs. The single-sided line technology connects the driver chip pad and the Mini LED chip pad in an orderly manner according to the routing requirements, reducing the amount of materials used and simplifying the production process. In addition, the use of single-sided line technology not only saves manufacturing costs, but also simplifies the manufacturing process and improves production efficiency.

[0013] In addition, the LED positive power supply line is connected to the Mini LED chip pad and then to the negative line, and no closed loop is formed on the insulating substrate, so no electromagnetic coupling phenomenon will occur, which further reduces the risk of electromagnetic interference within the system and ensures the quality of signal transmission, thus providing a basis for the integration of high-density Mini LED chips.

[0014] Furthermore, it also includes an LED branch line, and the electrical connection mode of the LED branch line and the driver chip relative to the LED positive power supply line and the negative line includes one or a combination of the following:

[0015] (1) One end of the LED branch circuit is electrically connected to the LED positive power supply circuit, and the other end is electrically connected to the driver chip, and the driver chip is electrically connected to the negative circuit;

[0016] (2) One end of the LED branch circuit is electrically connected to the negative electrode circuit, and the other end is electrically connected to the driving chip;

[0017] The LED branch line is arranged along at least a portion of the Mini LED chip pad to supply power to the conductive member arranged on the Mini LED chip pad along the LED branch line.

[0018] By adopting the above solution, some or all of the Mini LED chip pads are connected in series / parallel through the LED branch line, the routing is freer, the mutual interference of the line branches is further reduced, and the setting of the LED positive power supply line can also be optimized.

[0019] Furthermore, the driver chip pad is arranged on the pad circuit layout surface, the pad circuit layout surface is divided into a plurality of Mini LED chip pad layout partitions, and each of the Mini LED chip pad layout partitions is independently set, each of the Mini LED chip pad layout partitions is provided with the driver chip pad, and each of the Mini LED chip pad layout partitions is divided into a plurality of Mini LED chip pad layout sub-partitions according to the LED branch line electrically connected to the driver chip, the range of each Mini LED chip pad layout sub-partition is the setting position of the LED branch line corresponding to each Mini LED chip pad layout sub-partition, and each of the Mini LED chip pad layout sub-partitions is independently set.

[0020] By adopting the above scheme, the pad circuit layout surface is divided into multiple Mini LED chip pad layout partitions, and each layout partition is further divided into multiple Mini LED chip pad layout sub-partitions, and each is independently set. This design method effectively avoids the crossing of lines. Since each partition and sub-partition is independently set, there is no need to perform complex processes such as punching when designing the routing, and single-sided routing can be achieved. In addition, the single-sided routing design avoids the closed loop existing in the multi-layer circuit board, thereby reducing the electromagnetic coupling phenomenon, ensuring the signal transmission quality, and improving the electromagnetic compatibility of the system.

[0021] Furthermore, one or more branch lines are provided between the LED branch line and the driver chip;

[0022] When the Mini LED chip pads are arranged on the branch lines, each of the branch lines on which the Mini LED chip pads are arranged is a sub-partition for arranging the Mini LED chip pads.

[0023] By adopting the above solution, the flexibility of the Mini LED chip pad setting can be further improved through the branch line setting. By electrically connecting all the Mini LED chip pads in the corresponding Mini LED chip pad arrangement sub-partition through more subdivided branch lines, independent power supply and control can be achieved.

[0024] Furthermore, it also includes:

[0025] A driving chip power supply circuit, wherein the driving chip power supply circuit is arranged on the pad circuit layout surface;

[0026] A driving chip control signal line circuit, wherein the driving chip control signal line circuit is arranged on the pad circuit layout surface;

[0027] The driver chip pad is arranged on the pad circuit layout surface, the driver chip power circuit and the driver chip control signal line circuit are both electrically connected to the driver chip, and the driver chip pad is located on the LED branch circuit.

[0028] By adopting the above solution, the driver chip pad is arranged on the pad circuit layout surface, and the driver chip power supply circuit and the driver chip control signal line circuit are correspondingly arranged on the pad circuit layout surface, and the driver chip power supply circuit and the driver chip control signal line circuit are connected to the driver chip. Especially in the AM backlight solution, only one or two signal lines are required to realize the control of multiple Mini LED chips, which greatly simplifies the layout difficulty of the driver chip power supply circuit and the control signal line circuit, reduces the circuit complexity, and avoids the electromagnetic interference problem that may be caused by complex wiring. Especially in the high-density MiniLED backlight scenario, simplifying the circuit design helps to reduce mutual interference between signals and improve the stability and reliability of the system.

[0029] In addition, the driver chip power circuit and the driver chip control signal line circuit are also arranged on the pad circuit layout surface. By integrating the driver chip power circuit and the control signal line circuit on the same substrate, the overall circuit design is simplified, making the layout of the Mini LED backlight circuit board more compact and orderly, and reducing the complexity of wiring. In addition, the single-layer circuit board technology avoids the double-layer board structure, reduces the use of materials, and thus reduces manufacturing costs. At the same time, the simplified design also helps to improve production efficiency and further reduce costs.

[0030] Furthermore, the driver chip pad is arranged on the pad circuit layout surface, the pad circuit layout surface is divided into a plurality of Mini LED chip pad layout partitions, and each of the Mini LED chip pad layout partitions is independently set, each of the Mini LED chip pad layout partitions is provided with the driver chip pad, and the driver chip power supply circuit and the driver chip control signal line circuit are connected in series to all the driver chips.

[0031] By adopting the above solution, each Mini LED chip pad layout partition is independently set, which means that the Mini LED chip in each partition can be independently controlled, thereby achieving a more delicate local dimming effect and improving the contrast and clarity of the display. Each partition is independently set with a driver chip pad and a corresponding driver chip, and the driver chip power supply line and control signal line are connected in series to all driver chips, which simplifies the circuit design and makes the wiring more concise.

[0032] Furthermore, the driving chip pad is arranged on the pad circuit layout surface, the negative electrode circuit is provided with an extension circuit, the extension circuit is connected to the driving chip pad, and is electrically connected to the driving chip.

[0033] By adopting the above solution, by connecting multiple LED branch lines to the same number of Mini LED chip pads and then converging them to the driver chip pads, it is possible to ensure uniform current distribution, avoid hot spots caused by current concentration, and improve system reliability. And because multiple LED branch lines eventually converge to the driver chip pads, if a fault occurs, the problem can be quickly located by detecting the driver chip pads, simplifying the troubleshooting process.

[0034] Furthermore, the insulating substrate comprises:

[0035] A plate body, wherein the plate body is a glass plate, a BT resin substrate, an epoxy resin plate, a silicone resin plate, a polyphthalamide plate or an ABF plate;

[0036] A pad layer, wherein the driver chip pad and the Mini LED chip pad are both arranged on the pad layer;

[0037] A circuit layer, wherein the LED positive power supply circuit, the negative circuit and the LED branch circuit are all arranged on the circuit layer;

[0038] Among them, one side of the board body is the pad circuit layout surface, and the pad layer and the circuit layer are both arranged on the pad circuit layout surface.

[0039] By adopting the above solution and single-sided circuit design, the manufacturing process can be simplified and the complexity of the manufacturing process can be reduced, thereby improving production efficiency and reducing costs, and providing more options for insulating substrates.

[0040] Furthermore, the driving chip pad is arranged outside the insulating substrate, and one end of the negative electrode line is connected to a constant current output port of the driving chip.

[0041] By adopting the above solution, since the driver chip pads are not on the insulating substrate, the wiring complexity on the insulating substrate is reduced, the design inside the insulating substrate is simplified, and the layout of the Mini LED chip pads is more flexible. Placing the driver chip pads outside the substrate helps reduce electromagnetic interference, ensure the quality of signal transmission, and improve the electromagnetic compatibility of the system.

[0042] Furthermore, a window position is provided on the pad circuit layout surface of the insulating substrate, and a marking point window or a test point window is provided at the window position.

[0043] By adopting the above scheme, a window position is set on the pad circuit layout surface, and a marking point window or a test point window is provided at the window position, which can be used as a test point and a marking point.

[0044] Furthermore, the window positions are arranged in plurality along the LED positive power supply circuit, and / or the window positions are arranged in plurality along the LED branch circuit, and / or the window positions are arranged on one side of the driver chip pad.

[0045] By adopting the above scheme, multiple window positions are set on the LED positive power supply line, which can facilitate the testing of the positive power supply line and ensure the correct connection and working state of the power supply line. Similarly, setting window positions on the LED branch line also facilitates the testing of the LED branch line.

[0046] Setting a window position on one side of the driver chip pad can not only provide a clear position mark during the subsequent installation of the driver chip, but also help identify the correct polarity direction to ensure the correct installation of the driver chip, thereby improving installation accuracy and efficiency.

[0047] The present invention also provides a Mini LED display screen, comprising the above-mentioned Mini LED backlight circuit board, a Mini LED chip is welded on the MiniLED chip pad, a driver chip is welded on the driver chip pad, and the driver chip is used to control the brightness of the Mini LED chip.

[0048] By adopting the above solution, single-layer circuit board technology not only reduces material costs, but also reduces manufacturing costs by simplifying the design, making the Mini LED display more price competitive.

[0049] The present invention also provides a method for preparing a Mini LED backlight circuit board, which is used to prepare the above-mentioned Mini LED backlight circuit board, comprising the following steps:

[0050] S1, using a glass plate, a BT resin substrate, an epoxy resin plate, a silicone resin plate, a polyphthalamide plate or an ABF plate as the insulating substrate;

[0051] S2, providing a metal layer on the pad circuit layout surface of the insulating substrate;

[0052] S3, arranging the LED positive power supply circuit, the negative circuit and the LED branch circuit on the pad circuit layout surface of the insulating substrate to form a circuit layer;

[0053] S4, arranging a plurality of the Mini LED chip pads on the pad circuit layout surface, or arranging the Mini LED chip pads and the driver chip pads at the same time;

[0054] S5, setting a gold finger area on the pad circuit layout surface of the insulating substrate to connect the LED positive power supply circuit and the negative circuit of the insulating substrate;

[0055] S6. Cover the pad layer and the circuit layer with an ink layer, and provide ink windows at the LED positive power circuit, the negative circuit, the LED branch circuit, the Mini LED chip pad, the driver chip pad and the gold finger area.

[0056] By adopting the above scheme and the above steps, the manufacturing process of the Mini LED backlight circuit board is simplified, the production difficulty is reduced, and the production efficiency is improved. In addition, by optimizing the circuit design and covering the ink layer, electromagnetic interference is reduced and the quality of signal transmission is ensured.

[0057] Further, in step S3, when the driver chip pad is set on the pad layer, the driver chip power line and the driver chip control signal line are both etched on the line layer, and the driver chip power line and the driver chip control signal line are both connected to the driver chip pad.

[0058] By adopting the above solution, by setting the driver chip pads on the pad layer, and etching the driver chip power supply line and control signal line on the line layer, the overall layout can be simplified, making the line more regular, reducing unnecessary cross wiring, reducing intermediate links, and improving the reliability and stability of signal transmission. And on the basis of setting the driver chip pads on the pad layer, the routing of the LED branch line can be designed to reduce electromagnetic interference, ensure the purity of signal transmission, and improve the electromagnetic compatibility of the system.

[0059] In summary, the Mini LED backlight circuit board, display screen and preparation method thereof provided by the present invention have the following technical effects:

[0060] 1. The LED positive power supply circuit, negative circuit and Mini LED chip pad are all placed on the pad circuit layout surface, avoiding the need for a double-layer board structure, thereby reducing material costs;

[0061] 2. Single-sided circuit technology connects the driver chip pads and Mini LED chip pads in an orderly manner according to the routing requirements, reducing the use of materials and simplifying the production process. The use of single-sided circuit technology not only saves manufacturing costs, but also simplifies the manufacturing process and improves production efficiency;

[0062] 3. The LED positive power supply line is connected to the Mini LED chip pad and then to the negative line. No closed loop is formed on the insulating substrate, so no electromagnetic coupling phenomenon occurs, which further reduces the risk of electromagnetic interference within the system and ensures the quality of signal transmission, thus providing a basis for the integration of high-density Mini LED chips. BRIEF DESCRIPTION OF THE DRAWINGS

[0063] Figure 1 This is a schematic diagram of the first wiring layout of the circuit board of the present invention;

[0064] Figure 2 It is a schematic diagram of the second wiring layout of the circuit board of the present invention;

[0065] Figure 3 This is a schematic diagram of the third wiring layout of the circuit board of the present invention;

[0066] Figure 4 This is a schematic diagram of the fourth wiring layout of the circuit board of the present invention;

[0067] Figure 5 For the present invention Figure 4 A magnified view of part A;

[0068] Figure 6 This is a schematic diagram of the fifth wiring layout of the circuit board of the present invention;

[0069] Figure 7 For the present invention Figure 6 Enlarged view of part B.

[0070] Among them, the meanings of the figure marks are as follows: 1. Insulating substrate; 11. Mini LED chip pad layout partition; 12. Mini LED chip pad layout sub-partition; 2. LED positive power supply line; 3. Negative line; 4. Mini LED chip pad; 5. Driver chip pad; 6. LED branch line; 61. Branch line; 7. Driver chip power supply line; 8. Driver chip control signal line line; 9. Extension line; 10. Window position. DETAILED DESCRIPTION

[0071] For better understanding and implementation, the technical solutions in the embodiments of the present invention will be clearly and completely described and discussed below in conjunction with the accompanying drawings of the present invention. Obviously, what is described here is only a part of the examples of the present invention, not all the examples. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0072] In order to facilitate the understanding of the embodiments of the present invention, the following will be further explained by taking specific embodiments as examples in conjunction with the drawings, and each embodiment does not constitute a limitation on the embodiments of the present invention.

[0073] In the description of the present invention, it should be noted that the terms "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside" and "outside" etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction. Therefore, they cannot be understood as limiting the present invention.

[0074] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used in the specification of the present invention herein are only for the purpose of describing specific embodiments and are not intended to limit the present invention.

[0075] See also Figure 1-Figure 3 The present invention discloses a Mini LED backlight circuit board, comprising an insulating substrate 1, an LED positive power supply circuit 2, a negative circuit 3 and a driving chip pad 5, one side of the insulating substrate 1 is a pad circuit layout surface, a plurality of Mini LED chip pads 4 are arranged on the pad circuit layout surface, and all Mini LED chip pads 4 are arranged on the pad circuit layout surface, the LED positive power supply circuit 2 is arranged on the pad circuit layout surface, the negative circuit 3 is arranged on the pad circuit layout surface, the driving chip pad 5 is arranged on the pad circuit layout surface or outside the insulating substrate 1, and a driving chip is welded on the driving chip pad 5, wherein the LED positive power supply circuit 2 is electrically connected to the negative circuit 3, all Mini LED chip pads 4 are arranged along the LED positive power supply circuit 2 and / or the negative circuit 3, and all Mini LED chip pads 4 are electrically connected to the driving chip.

[0076] Specifically, one side of the insulating board is a pad circuit layout surface, and a plurality of MiniLED chip pads 4 are arranged on the pad circuit layout surface, and all the MiniLED chip pads 4 are arranged on the pad circuit layout surface. As an optional arrangement method, all the MiniLED chip pads 4 can be arranged in a matrix, a regular quadrilateral, a circle, and a polygon, etc., specifically in a rectangle, a rhombus, a parallelogram, etc., that is, adjacent MiniLED chip pads 4 are arranged in the shape of a rectangle, a rhombus or a parallelogram, the LED positive power supply circuit 2 is arranged on the pad circuit layout surface, and the negative circuit 3 is arranged on the pad circuit layout surface. Specifically, the LED positive power supply circuit 2 and the negative circuit 3 can be arranged on the pad circuit layout surface by 3D printing technology, mask plate technology or etching technology. The driving chip pad 5 can be selected to be arranged on the pad circuit layout surface or outside the insulating substrate 1 according to the specific AM backlight scheme or PM backlight scheme adopted by the circuit board. When the AM backlight solution is adopted, it is best to arrange the driver chip pad 5 on the pad circuit layout surface, so as to facilitate the precise control of single / multiple Mini LED chips; when the PM backlight solution is adopted, the driver chip pad 5 can be arranged outside the insulating substrate 1, and the corresponding driver chip is arranged outside the insulating substrate 1, and the driver chip transmits the control signal to the conductive member arranged on the pad circuit layout surface from the outside. The LED positive power supply line 2 is electrically connected to the negative line 3, and all the Mini LED chip pads 4 are arranged along the LED positive power supply line 2 and / or the negative line 3. Specifically, the Mini LED chip pad 4 is arranged on the LED positive power supply line 2 and / or the negative line 3, and can be arranged according to specific needs, so as to meet the imaging requirements of the normal Mini LED backlight circuit board. All Mini LED chip pads 4 are electrically connected to the driver chip, so that the driver chip can control all Mini LED chips or other conductive members installed on the Mini LED chip pads 4.

[0077] Among them, in the PM solution, the cathode line 3 is the cathode line of the LED chip, and in the AM solution, the cathode line is the power ground line.

[0078] It should be noted that the PM backlight solution (PassiveMatrix) is PM drive, which is a Mini LED backlight technology drive method. In this solution, the Mini LED chips are arranged in a matrix or other shape, and the Mini LED chips are lit up by scanning row by row through the control circuit. The AM backlight solution (ActiveMatrix) is AM drive, which is a more advanced Mini LED backlight technology drive method. It achieves precise control of the backlight by equipping each Mini LED chip pixel partition with an independent drive circuit.

[0079] The working principle of the above structure is:

[0080] The external power source is transmitted to the negative line 3 through the LED positive power line 2. The LED positive power line 2 supplies power to all the Mini LED chip pads 4 and then flows into the low-potential negative line 3. Then, it is guided by the negative line 3 to flow to the outside. The driver chip is electrically connected to the Mini LED chip pad 4. The specific electrical connection method can be connected through etching circuits or other flying wires, so that the driver chip installed on the driver chip pad 5 can control all Mini LED chips. The circuits on the entire pad circuit layout surface do not form a closed circuit on the insulating substrate 1, so no electromagnetic coupling phenomenon will occur, thereby further reducing the risk of electromagnetic interference in the system, ensuring the quality of signal transmission, and thus providing a basis for the integration of high-density Mini LED chips.

[0081] In some embodiments, the Mini LED backlight circuit board further includes an LED branch line 6, and the electrical connection method between the LED branch line 6 and the driver chip relative to the LED positive power supply line 2 and the negative line 3 includes one or a combination of the following:

[0082] (1) One end of the LED branch line 6 is electrically connected to the LED positive power supply line 2, and the other end is electrically connected to the driver chip, and the driver chip is electrically connected to the negative line 3;

[0083] (2) One end of the LED branch line 6 is electrically connected to the negative electrode line 3, and the other end is electrically connected to the driving chip;

[0084] The LED branch line 6 is arranged along at least a portion of the Mini LED chip pad 4 to supply power to the conductive member arranged on the Mini LED chip pad 4 along the LED branch line 6 .

[0085] In the above, part or all of the Mini LED chip pads 4 are connected in series / parallel through the LED branch line 6, and the routing is freer, which further reduces the mutual interference of the line branches and can also optimize the setting of the LED positive power supply line. The Mini LED chip pads 4 that are not set on the LED branch line 6 can be selected to be set on the LED positive power supply line 2. In this embodiment, all Mini LED chip pads 4 are set along the LED branch line 6. Specifically, at least one LED branch line 6 is provided between the LED positive power supply line 2 and the negative line 3, one end of the LED branch line 6 is electrically connected to the LED positive power supply line 2, and the other end is electrically connected to the negative line 3. The LED branch line 6 is set along all Mini LED chip pads 4 to supply power to the conductive parts set on all Mini LED chip pads 4. The specific setting number and line direction of the LED branch line 6 can be selected according to specific needs, and are not limited here, as long as it is ensured that it is not subject to electromagnetic interference and meets its heat dissipation requirements. The conductive part can be a Mini LED chip. When the Mini LED chip is not required or other functional parts are required, other conductive parts that do not affect the normal conduction of the circuit or have other functions can be set on the Mini LED chip pad 4. In the setting of mode (2), a pin can be selected on the driver chip to power the LED branch line 6, that is, the LED positive power line 2 transmits electricity to the LED branch line 6 through one of the pins of the driver chip. In addition, based on the structure of setting the driver chip power line 7, the driver chip power line 7 can also be used to power the LED branch line 6.

[0086] In some embodiments, in order to facilitate the arrangement of multiple Mini LED chip pads 4, the driver chip pads are arranged on the pad circuit arrangement surface, and the pad circuit arrangement surface is divided into multiple Mini LED chip pad arrangement partitions 11, and each Mini LED chip pad arrangement partition 11 is independently arranged, and the independent arrangement is such that adjacent Mini LED chip pad arrangement partitions 11 do not cross. Each Mini LED chip pad arrangement partition 11 is provided with a driver chip pad 5, and each of the Mini LED chip pad arrangement partitions 11 is divided into multiple Mini LED chip pad arrangement sub-partitions 12 according to the LED branch line 6 electrically connected to the driver chip, and the range of each Mini LED chip pad arrangement sub-partition 12 is the setting position of the LED branch line 6 corresponding to each Mini LED chip pad arrangement sub-partition 12, and each Mini LED chip pad arrangement sub-partition 12 is independently arranged, and the independent arrangement is such that adjacent Mini LED chip pad arrangement partitions 11 do not cross.

[0087] In some embodiments, in order to further facilitate the arrangement of the Mini LED chip pads 4, one or more branch lines 61 are arranged between the LED branch lines 6 and the driver chip according to needs, and one or more branch lines 61 are arranged between the LED branch lines 6 and the driver chip. When the Mini LED chip pads 4 are arranged on the branch lines 61, each branch line 61 arranged with the Mini LED chip pads 4 is a Mini LED chip pad arrangement sub-area 12.

[0088] It should be noted that in Figure 1 , 2 , 4 and 5, in order to facilitate the clear expression of the circuit diagram, only one Mini LED chip pad arrangement sub-partition 12 is marked in each figure. The actual Mini LED chip pad arrangement sub-partition 12 is divided into one or more according to the above-mentioned division criteria. Due to limited drawing space, they are no longer marked one by one.

[0089] In order to prevent electrical problems caused by large voltage differences between adjacent circuits, such as electromagnetic interference problems, thermal management problems, etc., the number of Mini LED chip pads 4 arranged in adjacent Mini LED chip pad arrangement sub-partitions 12 can be set to a similar number or the same number to achieve the effect of balancing the voltage difference between adjacent circuits.

[0090] In some embodiments, the Mini LED backlight circuit board also includes a driver chip power supply circuit 7 and a driver chip control signal line circuit 8, the driver chip power supply circuit 7 is arranged on the pad circuit layout surface, and the driver chip control signal line circuit 8 is arranged on the pad circuit layout surface, wherein the driver chip pad 5 is arranged on the pad circuit layout surface, the driver chip power supply circuit 7 and the driver chip control signal line circuit 8 are both connected to the driver chip pad 5, and the driver chip pad 5 is located on the LED branch line 6.

[0091] Specifically, when adopting the AM backlight solution, in order to facilitate the subsequent precise control of the Mini LED chip by the driver chip, the driver chip pad 5 is arranged on the pad circuit layout surface. In order to facilitate the transmission of driver chip signals and power, the driver chip power supply circuit 7 and the driver chip control signal line circuit 8 are arranged on the pad circuit layout surface accordingly. Specifically, the driver chip power supply circuit 7 and the driver chip control signal line circuit 8 can be arranged on the pad circuit layout surface through 3D printing technology, mask plate technology or etching technology. The driver chip is powered by the driver chip power supply circuit 7, and the driver chip is controlled by the driver chip control signal line circuit 8 to receive the corresponding signal, and the received signal is used to control the current size of the Mini LED chip and the time of the current on or off. When there are more Mini LED chip pads 4, in the case of AM backlight solution, it is necessary to set a plurality of driver chip pads 5 accordingly. When multiple driver chip pads 5 are set, all driver chip pads 5 can be connected in series through the driver chip power supply line 7 and the driver chip control signal line 8, thereby realizing the power supply and driving of multiple driver chips by two lines, which greatly simplifies the layout difficulty of the driver chip power supply line 7 and the driver chip control signal line 8, reduces the complexity of the line, and avoids the electromagnetic interference problem that may be caused by complex wiring.

[0092] In this embodiment, the driver chip control signal line 8 is arranged in a combination of a clock signal line and a data signal line. The clock signal line provides a synchronization signal for the driver chip to ensure the accurate timing of data transmission; while the data signal line carries the actual data information to be transmitted to the driver chip to adjust the brightness of the Mini LED chip. The combination of the two can ensure the synchronization and accuracy of signal transmission and improve the stability and consistency of the display effect.

[0093] In some embodiments, in order to facilitate the transmission of signals processed after the subsequent installation of the driver chip on the driver chip pad 5, the driver chip pad 5 is arranged on the pad circuit layout surface, and the negative line 3 is provided with an extension line 9, and the extension line 9 is connected to the driver chip. After connecting the same or similar number of Mini LED chip pads 4, multiple LED branch lines 6 are connected to the driver chip pad 5. The multiple LED branch lines 6 finally converge at the driver chip pad 5, which can improve the control effect of the subsequent driver chip on the Mini LED chip, and if a fault occurs, the problem can be quickly located by detecting the driver chip pad 5, which simplifies the troubleshooting process.

[0094] In some embodiments, an equal number of all Mini LED chip pads 4 are arranged in series on an LED branch line 6 , or an LED branch line 6 is provided with a plurality of branch lines 61 , and an equal number of all Mini LED chip pads 4 are arranged on the branch lines 61 .

[0095] The specific configuration methods of the LED branch line 6 and the branch line 61 mainly include the following three methods:

[0096] 1. See Figure 1 As shown, the LED positive power supply line 2 is arranged along three adjacent sides of the pad line layout surface, and the negative line 3 is arranged in the middle of the pad line layout surface, so that the driver chip pads 5 arranged on both sides of the negative line 3 are connected to the negative line 3, and when the negative line 3 is arranged in the middle of the pad line layout surface, a more regular and ample layout space will be reserved for the Mini LED chip pads 4 arranged in a matrix, which is conducive to the single-sided routing design of the circuit board. A plurality of LED branch lines 6 are extended from the LED positive power supply line 2 on the opposite sides of the pad line layout surface, and each LED branch line 6 is provided with two branch lines 61, and the two branch lines 61 can be routed as far as possible apart from the LED positive power supply line 2 and the negative line 3, thereby avoiding line crossing and facilitating the single-sided design of the circuit board. Each branch line 61 is connected in series with a MiniLED chip pad 4. The branch line 61 is connected in series with the MiniLED chip pad 4 and then connected to the driver chip pad 5, so that the driver chip can control the MiniLED chip later. The above structure is mainly in the parallel setting mode of MiniLED. Since the driver chip pad 5 is connected to the negative line 3, the corresponding driver chip power supply line 7 and driver chip control signal line 8 are arranged around the edge of the negative line 3, so as to save space and connect all the driver chip pads 5 in series, thereby avoiding line crossing and completing the effect of single-sided routing. In this circuit layout, the LED positive power supply circuit 2 is arranged along the three adjacent sides of the pad circuit layout surface, and the negative line 3 is arranged in the middle of the pad circuit layout surface. When a multi-channel arrangement is required, when the above circuit layout is arranged in parallel, since the LED positive power supply circuit 2 is arranged along the three adjacent sides of the pad circuit layout surface, in the adjacent circuit layout, the respective LED positive power supply circuits 2 are arranged adjacent to each other. Since they are all positive lines, the voltage difference between each other is small, and there will be no electrical problems caused by the voltage difference between the lines, thereby reducing the line spacing between multiple channels. Of course, the LED positive power supply circuit 2 also has a variety of layout methods, such as setting an LED positive power supply circuit 2 on each of the two opposite sides of the pad circuit layout surface to power the Mini LED chip, which will not be elaborated here.

[0097] 2. See Figure 2As shown, the LED positive power supply line 2 is arranged along one side of the pad circuit layout surface, and the negative line 3 is arranged on the pad circuit layout surface, and, on the side opposite to the LED positive power supply line 2, multiple LED branch lines 6 are evenly arranged along the setting direction of the LED positive power supply line 2, and conveniently extend toward the negative line 3, and when passing through the Mini LED chip pad 4, it bends and connects multiple Mini LED chip pads 4 in series and then connects to the driver chip pad 5. In this embodiment, each LED branch line 6 is connected in series with four Mini LED chip pads 4 to ensure that the current of each Mini LED chip is consistent, thereby achieving brightness consistency. The driver chip pad 5 is connected to the negative line 3 through an extension line 9, so that the length and direction of the extension line 9 can be adjusted to adapt to the position of the driver chip pad 5. The corresponding driver chip power supply line 7 and the driver chip control signal line 8 are arranged around the edge of the negative line 3, so as to take into account the purpose of saving space and connecting all the driver chip pads 5 in series, thereby avoiding line crossing and completing the effect of single-sided routing. When more Mini LED chip pads 4 need to be set, the above structure can be translated and copied on the pad circuit layout surface to increase the number of Mini LED chip pads 4 installed. In this circuit layout, it is ensured that the current can flow back to the power supply smoothly to maintain the stable operation of the circuit, and the negative electrode can realize the entire surface series connection of the negative line 3, which can significantly reduce this asymmetry, thereby reducing the level of interference and noise. Of course, the LED positive power supply line 2 also has a variety of layout methods, such as setting an LED positive power supply line 2 on each of the two opposite sides of the pad circuit layout surface to power the Mini LED chip, which will not be repeated here.

[0098] 3. See Figure 3 As shown, the LED positive power supply line 2 is arranged along the length direction of the pad line layout surface, and multiple LED branch lines 6 are extended at equal intervals along the setting direction of the LED positive power supply line 2. After the LED branch line 6 is bent through the Mini LED chip pad 4, it is connected to the negative line 3, and after connecting the negative line 3, it is connected to the constant current output port of the driver chip. The driver chip pad 5 is arranged outside the insulating substrate 1. Since the driver chip pad 5 is not on the insulating substrate 1, the wiring complexity on the substrate is reduced, the design inside the substrate is simplified, and the layout of the Mini LED chip pad 4 is more flexible. Placing the driver chip pad 5 outside the substrate helps to reduce electromagnetic interference, ensure the quality of signal transmission, and improve the electromagnetic compatibility of the system.

[0099] 4. See Figure 4 and Figure 5As shown, the LED positive power supply line 2 is arranged along three adjacent sides of the pad line layout surface, and the negative line 3 is arranged in the middle of the pad line layout surface, so that the driver chip pads 5 arranged on both sides of the negative line 3 are connected to the negative line 3, and when the negative line 3 is arranged in the middle of the pad line layout surface, a more regular and sufficient layout space will be reserved for the Mini LED chip pads 4 arranged in a matrix, which is conducive to the single-sided routing design of the circuit board. A plurality of LED branch lines 6 extend from the LED positive power supply line 2 on the opposite sides of the pad line layout surface, and each LED branch line 6 is connected in series with the Mini LED chip pads 4 arranged in a three-by-three matrix, and then connected to the driver chip, so that the subsequent driver chip controls the Mini LED chip. The above structure is mainly arranged in a series arrangement of the Mini LED chip pads 4. Since the driver chip pad 5 is connected to the negative line 3, the corresponding driver chip power supply line 7 and the driver chip control signal line 8 are arranged around the edge of the negative line 3, so as to take into account the purpose of saving space and connecting all the driver chip pads 5 in series, thereby avoiding line crossing and completing the effect of single-sided routing. In this line layout, the LED positive power supply line 2 is arranged along the three adjacent sides of the pad line layout surface, and the negative line 3 is arranged in the middle of the pad line layout surface. When multiple channels are required, when the above line layout is arranged in parallel, since the LED positive power supply line 2 is arranged along the three adjacent sides of the pad line layout surface, in the adjacent line layout, the respective LED positive power supply lines 2 are arranged adjacently. Since they are all positive lines, the voltage difference between each other is small, and there will be no electrical problems caused by the voltage difference between the lines, thereby reducing the line spacing between multiple channels. Of course, the LED positive power supply line 2 also has a variety of layout methods, such as setting an LED positive power supply line 2 on each of the two opposite sides of the pad line layout surface to power the Mini LED chip, which will not be repeated here.

[0100] 5. See Figure 6 and Figure 7As shown, the LED positive power supply line 2 is arranged along three adjacent sides of the pad circuit layout surface, and the negative line 3 is arranged in the middle of the pad circuit layout surface, so that the driver chip pads 5 arranged on both sides of the negative line 3 are connected to the negative line 3, and when the negative line 3 is arranged in the middle of the pad circuit layout surface, a more regular and sufficient layout space will be reserved for the Mini LED chip pads 4 arranged in a matrix, which is conducive to the single-sided routing design of the circuit board. A plurality of LED branch lines 6 are extended from the LED positive power supply line 2 on the opposite sides of the pad circuit layout surface. After each LED branch line 6 is connected in series with six Mini LED chip pads 4, each three adjacent LED branch lines 6 are merged into a branch line 61, and then connected to the driver chip through the branch line 61, so that the subsequent driver chip controls the Mini LED chip. The above structure is mainly located in the serial arrangement of the Mini LED chip pads 4. Since the driver chip pad 5 is connected to the negative line 3, the corresponding driver chip power supply line 7 and the driver chip control signal line 8 are arranged around the edge of the negative line 3, so as to take into account the purpose of saving space and connecting all the driver chip pads 5 in series, thereby avoiding line crossing and completing the effect of single-sided routing. In this line layout, the LED positive power supply line 2 is arranged along the three adjacent sides of the pad line layout surface, and the negative line 3 is arranged in the middle of the pad line layout surface. When multiple channels are required, when the above line layout is arranged in parallel, since the LED positive power supply line 2 is arranged along the three adjacent sides of the pad line layout surface, in the adjacent line layout, the respective LED positive power supply lines 2 are arranged adjacently. Since they are all positive lines, the voltage difference between each other is small, and there will be no electrical problems caused by the voltage difference between the lines, thereby reducing the line spacing between multiple channels. Of course, the LED positive power supply line 2 also has a variety of layout methods, such as setting an LED positive power supply line 2 on each of the two opposite sides of the pad line layout surface to power the Mini LED chip, which will not be repeated here.

[0101] Among the above five routing methods, the third routing method is the best for PM backlight solutions, which can light up the Mini LED chips by scanning row by row through the constant current output port of the driver chip. The other four are the best for AM backlight solutions, where the driver chip can individually control a preset number of Mini LED chips to achieve precise control of the backlight.

[0102] It should be noted that the above five routing methods are for illustration only and do not constitute a limitation to the lines of this application.

[0103] In some embodiments, the insulating substrate 1 includes a board body, a pad layer and a circuit layer, and the board body is a glass board, a BT resin substrate, an epoxy resin board, a silicone resin board, a polyphthalamide board or an ABF board. The driver chip pad 5 and the Mini LED chip pad 4 are both arranged on the pad layer. The LED positive power supply circuit 2, the negative circuit 3 and the LED branch circuit 6 are all arranged on the circuit layer. Among them, the pad layer and the circuit layer are both arranged on the pad circuit layout surface.

[0104] Specifically, the insulating substrate 1 has a variety of materials to choose from. If good thermal stability and backlight effect are required, a glass plate can be selected; for applications requiring low dielectric constant and good thermal conductivity, a BT resin substrate is preferred; epoxy resin boards have good mechanical properties and cost-effectiveness and can be selected according to demand; silicone resin boards are suitable for occasions requiring high temperature resistance and flexibility; polyphthalamide boards are suitable for environments requiring high strength and dimensional stability; and ABF boards are ideal for those pursuing lightweight and environmentally friendly designs because of their lightness, high thermal conductivity and environmental friendliness.

[0105] In some embodiments, in order to facilitate the testing and identification of each circuit or component, a window position 10 is provided on the pad circuit layout surface of the insulating substrate 1, and a marking point window or a test point window is provided at the window position 10.

[0106] As an optional solution, multiple window positions 10 are set along the LED positive power supply line 2, and / or, multiple window positions 10 are set along the LED branch line 6, and / or, the window position 10 is set on one side of the driver chip pad 5.

[0107] Among them, a plurality of window positions 10 are set on the LED positive power supply line 2, and a test point window is set at the window position 10, which can facilitate the testing of the positive power supply line and ensure the correct connection and working state of the power supply line. Similarly, a window position 10 is set on the LED branch line 6, and a test point window is set at the window position 10, which is also convenient for testing the LED branch line 6. A window position 10 is set on one side of the driver chip pad 5, and an identification point window is set at the window position 10, which can not only provide a clear position identification when the driver chip is installed later, but also help identify the correct polarity direction, ensure the correct installation of the driver chip, thereby improving the installation accuracy and efficiency.

[0108] Of course, according to specific needs, a window position 10 can be set on the LED positive power supply circuit 2 or the LED branch circuit 6 as an identification point, and a window position 10 can be set on one side of the driver chip pad 5 as a test point. The function, setting position and setting quantity of the specific window position 10 can be set according to specific needs and are not limited here.

[0109] In this embodiment, the window opening position 10 is set by using white oil window opening.

[0110] The present invention also provides a Mini LED display screen, including the above-mentioned Mini LED backlight circuit board, a Mini LED chip is welded on the Mini LED chip pad 4, and a driver chip is welded on the driver chip pad 5, and the driver chip is used to control the brightness of the Mini LED chip. As an option, a liquid crystal panel, a polarizer, a filter, a touch panel, a diffuser, a brightness enhancement film, a prism, a connector, a control circuit board, a housing, and a signal processing chip can also be set according to requirements. The above optional components can be selected and assembled according to specific requirements, and the specific setting method is not repeated here.

[0111] The present invention also provides a method for preparing a Mini LED backlight circuit board, which is used to prepare the above-mentioned Mini LED backlight circuit board, comprising the following steps:

[0112] S1, using a glass plate, a BT resin substrate, an epoxy resin plate, a silicone resin plate, a polyphthalamide plate or an ABF plate as an insulating substrate 1;

[0113] S2, a metal layer is provided on the pad circuit layout surface of the insulating substrate 1;

[0114] S3, arranging the LED positive power supply circuit 2, the negative circuit 3 and the LED branch circuit 6 on the pad circuit layout surface of the insulating substrate 1 to form a circuit layer;

[0115] S4, setting a plurality of Mini LED chip pads 4 on the pad circuit layout surface, or setting a Mini LED chip pad 4 and a driver chip pad 5 at the same time;

[0116] S5, setting a gold finger area on the pad circuit layout surface of the insulating substrate 1, for connecting the LED positive power supply circuit 2 and the negative circuit 3 of the insulating substrate 1;

[0117] S6. Cover the pad layer and the circuit layer with an ink layer, and provide ink windows on the LED positive power supply circuit 2, the negative circuit 3, the LED branch circuit 6, the Mini LED chip pad 4, the driver chip pad 5 and the gold finger area.

[0118] Specifically, in step S1, different insulating substrate materials are provided for users to choose from, which can achieve the effect of satisfying performance requirements while controlling costs.

[0119] In some embodiments, before step S2, a layer of insulating primer layer may be provided on the pad circuit layout surface of the insulating substrate 1 to improve the adhesion of the metal layer in step S2.

[0120] In step S2, a metal layer is arranged on the pad circuit layout surface of the insulating substrate, wherein the metal layer includes but is not limited to copper, an alloy layer and a copper upper protective layer. In addition, if it is necessary to further improve the service life of the circuit, a copper alloy or other copper upper protective layer can be further arranged on the ink layer. In addition, as an option, the material of the copper upper protective layer includes but is not limited to a nickel layer, a nickel-copper alloy layer, a nickel-silver layer, a nickel-gold layer, a nickel-silver-gold layer, a Sn layer or an organic solder protection film (OSP) One or more combinations thereof. The protective layer can be realized by PVD film formation, CVD deposition, chemical plating, electroplating, etc. By adding one or more metal protective layers to the pad layer and the circuit layer, the conductive performance can be significantly improved to ensure the stability and reliability of current transmission.

[0121] It should be noted that PVD film formation includes PVD sputtering, which is a method of depositing materials onto a substrate surface by physical vapor deposition (Physical Vapor Deposition), and is suitable for depositing high-purity thin films. Of course, PVD film formation also includes many other methods, which will not be described here.

[0122] CVD deposition is chemical vapor deposition (Chemical Vapor Deposition), which is a method of forming a thin film on the surface of a substrate through gas reaction and is suitable for depositing complex compound films.

[0123] Chemical plating is the process of forming a metal coating on the surface of a substrate through a chemical reaction.

[0124] Electroplating is the process of depositing a metal coating on a substrate surface through an electrolytic process.

[0125] In step S3, the etching of the LED positive power supply line 2, the negative line 3 and the LED branch line 6 can be arranged using the above-mentioned routing method to achieve the effect of reducing electromagnetic interference and improving the stability of signal transmission.

[0126] In step S4, the Mini LED chip pads 4 and the driver chip pads 5 can be selected whether to set the driver chip pads 5 at the pad layer according to the setting position of the driver chip. Correspondingly, all the driver chip pads 5 and the Mini LED chip pads 4 are concentrated on the same layer to improve integration and simplify design.

[0127] In addition, as an option, a non-metallic protective layer can be set on the alloy layer or the copper upper protective layer to achieve the purpose of water-proof and oxygen-proof protection of the internal metal layer, circuit layer, Mini LED chip pad 4 and driver chip pad 5.

[0128] Further, when the driver chip pad 5 is set on the pad layer in step S3, the driver chip power supply circuit 7 and the driver chip control signal line circuit 8 are both etched on the circuit layer, and the driver chip power supply circuit 7 and the driver chip control signal line circuit 8 are both connected to the driver chip pad 5.

[0129] Specifically, the driver chip power supply line 7 and the driver chip control signal line 8 can be arranged in the same way as the routing in the Mini LED backlight circuit board. Of course, other routing methods can also be used as long as they do not affect the integration of each circuit and the pad on the pad circuit layout surface.

[0130] The technical means disclosed in the scheme of the present invention are not limited to the technical means disclosed in the above-mentioned implementation mode, but also include technical schemes composed of any combination of the above-mentioned technical features. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications are also regarded as the protection scope of the present invention.

Claims

1. A Mini LED backlight circuit board, characterized in that: include: An insulating substrate (1), wherein one side of the insulating substrate (1) is a pad circuit layout surface, a plurality of Mini LED chip pads (4) are provided on the pad circuit layout surface, and all of the Mini LED chip pads (4) are arranged on the pad circuit layout surface; An LED positive electrode power supply circuit (2), the LED positive electrode power supply circuit (2) being arranged on the pad circuit arrangement surface; A negative electrode circuit (3), the negative electrode circuit (3) being arranged on the pad circuit arrangement surface; A driving chip pad (5), the driving chip pad (5) being arranged on the pad circuit arrangement surface or outside the insulating substrate (1), and a driving chip being welded on the driving chip pad (5); The LED positive power supply circuit (2) is electrically connected to the negative power supply circuit (3), all the Mini LED chip pads (4) are arranged along the LED positive power supply circuit (2) and / or the negative power supply circuit (3), and all the Mini LED chip pads (4) are electrically connected to the driver chip.

2. A Mini LED backlight circuit board according to claim 1, characterized in that: It also includes an LED branch line (6), wherein the electrical connection mode between the LED branch line (6) and the driver chip relative to the LED positive power supply line (2) and the negative line (3) includes one or a combination of the following: (1), one end of the LED branch circuit (6) is electrically connected to the LED positive power circuit (2), and the other end is electrically connected to the driver chip, and the driver chip is electrically connected to the negative circuit (3); (2) One end of the LED branch circuit (6) is electrically connected to the negative electrode circuit (3), and the other end is electrically connected to the driving chip; The LED branch line (6) is arranged along at least a portion of the Mini LED chip pad (4) to supply power to a conductive member arranged on the Mini LED chip pad (4) along the LED branch line (6).

3. A Mini LED backlight circuit board according to claim 2, characterized in that: The driver chip solder pad (5) is arranged on the solder pad circuit layout surface, and the solder pad circuit layout surface is divided into a plurality of Mini LED chip solder pad layout partitions (11), and each of the Mini LED chip solder pad layout partitions (11) is independently arranged, and each of the Mini LED chip solder pad layout partitions (11) is provided with the driver chip solder pad (5), and each of the Mini LED chip solder pad layout partitions (11) is divided into a plurality of Mini LED chip solder pad layout sub-partitions (12) according to the LED branch line (6) electrically connected to the driver chip, and the range of each Mini LED chip solder pad layout sub-partition (12) is the setting position of the LED branch line (6) corresponding to each Mini LED chip solder pad layout sub-partition (12), and each of the Mini LED chip solder pad layout sub-partitions (12) is independently arranged.

4. A Mini LED backlight circuit board according to claim 3, characterized in that: One or more branch lines (61) are provided between the LED branch line (6) and the driving chip; When the Mini LED chip pads (4) are arranged on the branch lines (61), each of the branch lines (61) on which the Mini LED chip pads (4) are arranged is a Mini LED chip pad arrangement sub-area (12).

5. The Mini LED backlight circuit board according to claim 1, characterized in that: Also includes: A driving chip power supply circuit (7), wherein the driving chip power supply circuit (7) is arranged on the pad circuit layout surface; A driving chip control signal line circuit (8), wherein the driving chip control signal line circuit (8) is arranged on the pad circuit layout surface; The driver chip pad (5) is arranged on the pad circuit layout surface, the driver chip power supply circuit (7) and the driver chip control signal line circuit (8) are both electrically connected to the driver chip, and the driver chip pad (5) is located on the LED branch circuit (6).

6. A Mini LED backlight circuit board according to claim 5, characterized in that: The driver chip pad (5) is arranged on the pad circuit layout surface, the pad circuit layout surface is divided into a plurality of Mini LED chip pad layout partitions (11), and each of the Mini LED chip pad layout partitions (11) is independently arranged, each of the Mini LED chip pad layout partitions (11) is provided with the driver chip pad (5), and the driver chip power supply circuit (7) and the driver chip control signal line circuit (8) are connected in series to all the driver chips.

7. The Mini LED backlight circuit board according to claim 3, characterized in that: The negative electrode circuit (3) is provided with an extension circuit (9), and the extension circuit (9) is connected to the driving chip pad (5) and is electrically connected to the driving chip.

8. The Mini LED backlight circuit board according to claim 1, characterized in that: The insulating substrate (1) comprises: A plate body, wherein the plate body is a glass plate, a BT resin substrate, an epoxy resin plate, a silicone resin plate, a polyphthalamide plate or an ABF plate; A pad layer, the driver chip pad (5) and the Mini LED chip pad (4) are both arranged on the pad layer; A circuit layer, wherein the LED positive power supply circuit (2), the negative circuit (3) and the LED branch circuit (6) are all arranged in the circuit layer; Among them, one side of the board body is the pad circuit layout surface, and the pad layer and the circuit layer are both arranged on the pad circuit layout surface.

9. The Mini LED backlight circuit board according to claim 1, characterized in that: The driving chip pad (5) is arranged outside the insulating substrate (1), and one end of the negative electrode line (3) is connected to a driving chip constant current output port.

10. The Mini LED backlight circuit board according to claim 1, characterized in that: A window position (10) is provided on the pad circuit layout surface of the insulating substrate (1), and a marking point window or a test point window is provided at the window position (10).

11. A Mini LED backlight circuit board according to claim 10, characterized in that: A plurality of the window positions (10) are arranged along the LED positive power supply line (2), and / or a plurality of the window positions (10) are arranged along the LED branch line (6), and / or the window position (10) is arranged on one side of the driver chip pad (5).

12. A Mini LED display screen, characterized in that: Comprising the Mini LED backlight circuit board according to any one of claims 1 to 11, a Mini LED chip is welded on the Mini LED chip pad (4), a driver chip is welded on the driver chip pad (5), and the driver chip is used to control the brightness of the Mini LED chip.

13. A method for preparing a Mini LED backlight circuit board, used for preparing the Mini LED backlight circuit board according to any one of claims 1 to 11, characterized in that: The following steps are involved: S1, using a glass plate, a BT resin substrate, an epoxy resin plate, a silicone resin plate, a polyphthalamide plate or an ABF plate as the insulating substrate (1); S2, providing a metal layer on the pad circuit layout surface of the insulating substrate (1); S3, arranging the LED positive power supply circuit (2), the negative circuit (3) and the LED branch circuit (6) on the pad circuit layout surface of the insulating substrate (1) to form a circuit layer; S4, arranging a plurality of the Mini LED chip pads (4) on the pad circuit layout surface, or arranging the Mini LED chip pads (4) and the driver chip pads (5) at the same time; S5, providing a gold finger area on the pad circuit layout surface of the insulating substrate (1) for connecting the LED positive power supply circuit (2) and the negative circuit (3) of the insulating substrate (1); S6. An ink layer is covered on the pad layer and the circuit layer, and ink windows are provided on the LED positive power supply circuit (2), the negative circuit (3), the LED branch circuit (6), the Mini LED chip pad (4), the driver chip pad (5) and the gold finger area.

14. A method for preparing a Mini LED backlight circuit board according to claim 13, characterized in that: When the driver chip pad (5) is disposed on the pad layer in step S3, the driver chip power supply circuit (7) and the driver chip control signal line circuit (8) are both etched on the circuit layer, and the driver chip power supply circuit (7) and the driver chip control signal line circuit (8) are both connected to the driver chip pad (5).

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