Golden finger PCB and set parting line setting method

Abstract

The invention relates to the technical field of printed circuit boards, in particular to a golden finger PCB and a set parting line setting method, the PCB comprises a conductive copper block, a plurality of golden fingers and a plurality of leads used for connecting the conductive copper block and the golden fingers; wherein one ends of the leads are connected to the conductive copper block, the other ends of the leads are connected with the corresponding golden fingers, the leads are arranged at intervals, the golden fingers are arranged at intervals, and the method comprises the steps that DI pattern exposure information is obtained, category analysis is conducted on the DI pattern exposure information, and pattern category information is obtained; and according to the pattern category information, performing set segmentation line position adjustment on the DI pattern exposure information to obtain adjusted image information, thereby solving the problem of poor conduction caused by translation dislocation of the gold finger lead and improving the stability of the electroplated gold finger.

Description

Technical Field

[0001] The present application relates to the technical field of printed circuit boards, and in particular to a gold finger PCB board and a set dividing line setting method. Background Art

[0002] PCB board is a printed circuit board. Its electroplating gold finger is a common surface treatment technology for electronic components. It has high wear resistance and corrosion resistance, so it has been widely used in the electronics industry.

[0003] PCB boards will expand and shrink during the production process, which may cause the finished size of the PCB board to exceed the design tolerance. Therefore, it is necessary to forcibly adjust the set size of the printed circuit board, that is, the delivery panel size, to meet the design size tolerance. When using a DI machine to make outer layer graphics, in order to control the set size tolerance, it is necessary to translate the center point of the set at different panel positions, stretch or shrink the set size. However, adjusting the set size may cause the leads connecting the conductive end and the gold finger on the board to be disconnected or misaligned, resulting in poor conduction during the gold finger electroplating process, causing the electroplating operation to be interrupted, affecting the stability of the electroplated gold finger. The above problems need to be solved. Summary of the invention

[0004] In order to solve the problem of poor conduction caused by the translational displacement of the gold finger guide line and improve the stability of the electroplated gold finger, the present application provides a gold finger PCB board and a set dividing line setting method, which adopts the following technical solutions:

[0005] In a first aspect, the present application provides a gold finger PCB board, comprising a conductive copper block, a plurality of gold fingers, and a plurality of leads for connecting the conductive copper block and the gold fingers;

[0006] Among them, one end of the lead wire is connected to the conductive copper block, and the other end of the lead wire is connected to the corresponding gold finger. Several of the lead wires are arranged at intervals, and several of the gold fingers are arranged at intervals.

[0007] Preferably, the lead wire is provided with an anti-stretching portion for setting a set dividing line.

[0008] Preferably, a plurality of the anti-stretching parts are provided, each of the anti-stretching parts is provided at a corresponding lead wire, the lead wires are provided at both ends of the anti-stretching part, and the plurality of the anti-stretching parts are provided at intervals.

[0009] Preferably, a plurality of the anti-stretching parts are provided, each of the anti-stretching parts is provided on a corresponding lead, one end of the anti-stretching part is connected to a conductive copper block, and the other end of the anti-stretching part is connected to the lead, and the plurality of anti-stretching parts are arranged at intervals.

[0010] Preferably, the anti-stretching portion is provided as one, the anti-stretching portion is connected to a plurality of leads, the anti-stretching portion is arranged transversely along the lead spacing arrangement direction, and the leads are arranged on both sides of the anti-stretching portion.

[0011] In a second aspect, the present application provides a set dividing line setting method, comprising:

[0012] Acquire DI graphic exposure information, perform category analysis on the DI graphic exposure information, and obtain graphic category information;

[0013] According to the graphic category information, the position of the set dividing line is adjusted for the DI graphic exposure information to obtain the adjusted image information.

[0014] Preferably, the specific steps of adjusting the position of the set dividing line of the DI graphic exposure information according to the graphic category information to obtain the adjusted image information are:

[0015] When the graphic category information indicates that there is no anti-stretching portion, the conductive copper block position information in the DI graphic exposure information is obtained, the position is adjusted according to the conductive copper block position information, and the set dividing line is divided into the conductive copper block.

[0016] Preferably, the specific step of adjusting the position of the set dividing line of the DI graphic exposure information according to the graphic category information to obtain the adjusted image information further includes:

[0017] When the graphic category information indicates that there is an anti-stretching portion, the anti-stretching portion position information in the DI graphic exposure information is obtained, the position is adjusted according to the anti-stretching portion position information, and the set dividing line is divided into the anti-stretching portion.

[0018] In a third aspect, the present application provides a set dividing line setting device, comprising a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the set dividing line setting method as described above.

[0019] In a fourth aspect, the present application provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the set dividing line setting method as described above when running.

[0020] In summary, compared with the prior art, the technical solution provided by this application has at least the following beneficial effects:

[0021] The PCB board of the present application includes a conductive copper block, a gold finger and a lead, and the lead connects the conductive copper block and the gold finger. When the gold finger needs to be electroplated, the conductive copper block is connected to an external power supply device or device, and the gold finger is electroplated through the lead. Before the electroplating operation, the DI graphic exposure information is classified and analyzed, and the position of the set dividing line is adjusted according to the analysis result, thereby retaining the set translation and stretching process to ensure the set size tolerance, solving the problem of poor conduction caused by translational misalignment of the gold finger guide line, and improving the stability of the electroplated gold finger. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a structural schematic diagram of a gold finger PCB board described in an embodiment of the present application.

[0023] Figure 2 It is a first structural schematic diagram of a gold finger PCB board provided with an anti-stretching portion according to an embodiment of the present application.

[0024] Figure 3 This is a second structural schematic diagram of the gold finger PCB board provided with an anti-stretching portion according to the embodiment of the present application.

[0025] Figure 4 This is a third structural schematic diagram of the gold finger PCB board provided with an anti-stretching portion according to the embodiment of the present application.

[0026] Description of reference numerals:

[0027] 1. Conductive copper block; 2. Gold finger; 3. Lead; 4. Anti-stretching part; 5. Set dividing line; 6. Gong plate forming line. DETAILED DESCRIPTION

[0028] The following combination Figure 1-Figure 4 The present application is described in further detail. The terms used in the embodiments of the present application are only for the purpose of describing specific embodiments and are not intended to be limiting.

[0029] Precision circuits, i.e., PCBs with line widths less than 50μm and line spacing less than 50μm, are difficult to transfer and produce, and require exposure using a DI machine. At the same time, the finished product size tolerance of the PCB is also relatively strict, for example, the finished product size tolerance is less than or equal to ±50μm. However, the PCB will expand and shrink during the production process, which may cause the finished product size of the PCB to exceed the design tolerance. At this time, the set size of the printed board, i.e., the delivery panel size, needs to be forcibly adjusted to meet the design size tolerance.

[0030] In the existing electroplating gold finger process, the width of the gold finger lead 3 is usually designed to be 75-100μm, and the set dividing line 5 overlaps with the gong plate forming line 6. When using a DI machine to make the outer layer graphics, in order to control the set size tolerance, it is necessary to translate the center point of the set at different plate positions, stretch or shrink the set size. For the set, the area of ​​translation, stretching or shrinking of the set is limited to the graphics contained in the set dividing line 5. The conductive copper block 1 at the edge of the set or the edge of the board and part of the gold finger lead 3 are distributed outside the set dividing line 5, and cannot be synchronously translated, stretched or shrunk with the gold finger lead 3 within the set dividing line 5, resulting in the same gold finger lead 3 being misaligned and disconnected, affecting the conduction between the conductive copper block 1 and the gold finger, and the finger cannot be gold-plated according to the design requirements, so the present application is proposed to solve this problem.

[0031] Reference Figure 1 The present application relates to a gold finger PCB board, comprising a conductive copper block 1, a plurality of gold fingers and a plurality of leads 3 for connecting the conductive copper block 1 and the gold fingers;

[0032] Among them, one end of the lead wire 3 is connected to the conductive copper block 1, and the other end of the lead wire 3 is connected to the corresponding gold finger 2. A plurality of lead wires 3 are arranged at intervals, and a plurality of gold fingers 2 are arranged at intervals.

[0033] Specifically, the PCB board of the embodiment of the present application includes a conductive copper block 1, a gold finger 2 and a lead 3, and the lead 3 connects the conductive copper block 1 and the gold finger 2. When the gold finger 2 needs to be electroplated, the conductive copper block 1 is connected to an external power supply device or device, and the gold finger 2 is electroplated through the lead 3. Before the electroplating operation, the DI graphic exposure information is analyzed by category, and the position of the set dividing line 5 is adjusted according to the analysis result, so as to solve the problem of poor conduction caused by the translational misalignment of the gold finger lead 3 and improve the stability of the electroplated gold finger 2 while retaining the set translation stretching process to ensure the set size tolerance.

[0034] As one embodiment, the lead wire 3 is provided with an anti-stretching portion 4 for setting the set dividing line 5 .

[0035] Specifically, the embodiment of the present application sets an anti-stretching portion 4 on the lead 3, and the anti-stretching portion 4 is used to set the set dividing line 5, thereby increasing the area of ​​the lead 3 at the set dividing position, so that when the gold finger PCB board is stretched, the anti-stretching performance of the lead 3 can be improved to a certain extent, solving the problem of poor conduction caused by translational misalignment of the gold finger lead 3.

[0036] Since the conductive copper block 1 at the edge of the set or board and part of the gold finger lead 3 are distributed outside the set dividing line 5, they cannot be synchronously translated, stretched or shrunk with the gold finger lead 3 within the set dividing line 5, resulting in the same gold finger lead 3 being misaligned and disconnected. In the process of electroplating the gold finger 2, after the pattern transfer, solder mask and selective gold deposition (if any) are completed on the outer layer, a secondary dry film operation is required, that is, to protect the gold finger lead 3 and the conductive copper block 1, so that the gold finger lead 3 and the conductive copper block 1 are covered with dry film, only the electroplating position is exposed, and the fingers of the PCB board are plated with a certain thickness of gold layer using the electroplating principle, so that the fingers at the plug-in position have higher wear resistance and corrosion resistance, while the gold finger lead 3 and the conductive copper block 1 are covered with dry film and will not be plated with gold. The graphic design that defines the forward resolution capability is line width: line spacing ≤ 1:1, that is, the line resolution graphic design with a smaller line width than line spacing. The graphic design that defines the reverse resolution capability is line width: line spacing ≥ 10:1, that is, a small spacing is designed on a large copper surface. The dry film resolution capability test results show that the reverse resolution capability of the dry film is significantly worse than the forward resolution capability, that is, it is difficult to resolve a small spacing on a large copper surface. Therefore, the embodiment of the present application utilizes this feature, and by setting the anti-stretching part 4 and correspondingly adjusting the set dividing line 5, the problem of poor conduction caused by the translational misalignment of the gold finger guide line 3 is eliminated.

[0037] Before graphic exposure, the micro-etched copper surface is treated first, and the moisture on the copper surface is dried after cleaning. A layer of dry film is pasted on the micro-etched copper surface. Because the 40μm thick dry film can further weaken the resolution of fine spacing on the large copper surface, the dry film thickness is changed from the original 30μm to 40μm. Then DI graphic exposure is performed, and the outer layer graphic is exposed using a laser direct imaging exposure machine. The exposure mode is an automatic translation text including set translation and set expansion and contraction. Specifically, it includes the DI graphic data of the gold finger guide 3 and the conductive block and the unit graphic. In order to eliminate the problem of poor conduction caused by the translational misalignment of the gold finger guide 3, the following 4 graphic structures and finger guide 3 design schemes will be adopted.

[0038] As one implementation manner, the set dividing line 5 is arranged on the conductive copper block 1 .

[0039] Specifically, the width of the gold finger guide 3 in the embodiment of the present application is 75-100μm, and the set dividing line 5 is set on the conductive copper block 1. At this time, since the set dividing line 5 is set on the conductive copper block 1 with a large width and area, it is not easy to be disconnected or misaligned even if a stretching operation is performed, and the fine spacing caused by set translation and set stretching or contraction during DI exposure, which is usually less than 15μm, is not resolved, so there is no risk of poor conduction of the finger guide 3.

[0040] As one embodiment, a plurality of anti-stretching parts 4 are provided, each anti-stretching part 4 is provided on a corresponding lead 3 , the lead 3 is provided at both ends of the anti-stretching part 4 , and a plurality of anti-stretching parts 4 are provided at intervals.

[0041] Specifically, refer to Figure 2 In the embodiment of the present application, the width of the gold finger guide 3 is designed to be 75-100μm, the set dividing line 5 is set on the gong plate forming line 6, and a conductive copper block 1 of at least 250μm in length and 250μm in width is added at the intersection of the set dividing line 5 and the gold finger guide 3. Therefore, the fine spacing caused by the set translation and set stretching or contraction during DI exposure, which is less than 15μm, will not be analyzed, and the 250μm*250μm conductive copper block 1 will only have a slight misalignment and will not cause poor conduction of the finger guide 3. Thus, the problem of poor conduction caused by the translational misalignment of the gold finger guide 3 is solved, and the stability of the electroplated gold finger 2 is improved.

[0042] As one of the embodiments, several anti-stretching parts 4 are provided, each anti-stretching part 4 is provided on the corresponding lead 3, one end of the anti-stretching part 4 is connected to the conductive copper block 1, and the other end of the anti-stretching part 4 is connected to the lead 3, and several anti-stretching parts 4 are arranged at intervals.

[0043] The lead 3 of the embodiment of the present application is divided into two sections, one section is connected between the conductive copper block 1 and the anti-stretching part 4, and the other end is connected between the anti-stretching part 4 and the gold finger 2, and the set dividing line 5 passes horizontally through several anti-stretching parts 4, so as to reduce the occurrence of damage during the stretching process.

[0044] Specifically, refer to Figure 3 In the embodiment of the present application, the set dividing line 5 is arranged on the gong plate forming line 6, and the width of the gold finger lead 3 connected to the conductive copper block 1 is designed to be greater than 250μm wide lead 3, that is, the anti-stretching part 4, and the set dividing line 5 is made to fall within the wide lead 3 interval; at the same time, the lead 3 connected to the lead finger is still designed to be a narrow lead 3 of 75-100μm. Among them, X1≥125μm, X2≥200μm. Therefore, the fine spacing caused by set translation and set stretching or contraction during DI exposure, which is usually less than 15μm, will not be analyzed, and the 250μm wide finger block near the set dividing line 5 will only be slightly misaligned without disconnection, so it will not cause poor conduction of the finger lead 3. Thereby solving the problem of poor conduction caused by translational misalignment of the gold finger lead 3 and improving the stability of the electroplated gold finger 2.

[0045] The lead 3 of the embodiment of the present application is a section, which is connected with a conductive copper block 1, an anti-stretching part 4, a lead 3 and a gold finger 2 from top to bottom, and the set dividing line 5 is adjusted at a certain position of the anti-stretching part 4, so as to reduce the occurrence of damage during the stretching process.

[0046] As one embodiment, one anti-stretching portion 4 is provided, the anti-stretching portion 4 is connected to a plurality of leads 3 , the anti-stretching portion 4 is arranged transversely along the spacing direction of the leads 3 , and the leads 3 are arranged on both sides of the anti-stretching portion 4 .

[0047] Specifically, refer to Figure 4 In the embodiment of the present application, the width of the gold finger guide line 3 is designed to be 75-100μm, and the set dividing line 5 is set on the gong plate forming line 6, but a copper block with a width of at least 250μm is added on the set dividing line 5, namely the anti-stretching part 4. Therefore, the fine spacing caused by the set translation and set stretching or shrinkage during DI exposure, which is usually less than 15μm, is not analyzed. In this way, the problem of poor conduction caused by the translational misalignment of the gold finger guide line 3 is solved, and the stability of the electroplated gold finger 2 is improved.

[0048] The anti-stretching part 4 in this embodiment is a whole copper block, which is specifically arranged parallel to the conductive copper block 1, and the leads 3 are connected to the anti-stretching part 4 on both sides, that is, the conductive copper block 1, the lead 3, the anti-stretching part 4, the lead 3, and the gold finger 2 are connected from top to bottom.

[0049] This application utilizes the fact that the reverse resolution capability of the dry film is significantly worse than the forward resolution capability, that is, the small spacing is difficult to be resolved on the large copper surface, and provides four gold finger guide wire 3 design schemes. At the same time, a thicker 40μm dry film is used to solve the problem of poor conduction caused by translational misalignment of the gold finger guide wire 3 while retaining the set translational stretching process to ensure the set size tolerance.

[0050] The embodiment of the present application provides a method for setting a set dividing line 5, including:

[0051] Acquire DI graphic exposure information, perform category analysis on the DI graphic exposure information, and obtain graphic category information;

[0052] According to the graphic category information, the position of the set dividing line 5 is adjusted for the DI graphic exposure information to obtain the adjusted image information.

[0053] Specifically, the present application performs a category analysis on the DI graphic exposure information before the electroplating operation, and adjusts the position of the set dividing line 5 according to the analysis result, thereby solving the problem of poor conduction caused by the translational misalignment of the gold finger guide 3 under the premise of retaining the set translational stretching process to ensure the set size tolerance, and improving the stability of the electroplated gold finger 2. Taking advantage of the fact that the reverse resolution capability of the dry film is significantly worse than the forward resolution capability, that is, the small spacing is difficult to be resolved on the large copper surface, 4 gold finger guide 3 design schemes are provided, and at the same time, a thicker 40μm dry film is used to solve the problem of poor conduction caused by the translational misalignment of the gold finger guide 3 under the premise of retaining the set translational stretching process to ensure the set size tolerance. At the same time, because the 4 gold finger guide 3 design schemes of the present invention solve the problem of poor conduction caused by the translational misalignment of the gold finger guide 3, the outer layer graphics can be produced using automatic translation text, reducing the graphics collapse and bad scrapping caused by using fixed coefficient exposure, and improving production efficiency.

[0054] As one implementation method, according to the graphic category information, the position of the set dividing line 5 is adjusted for the DI graphic exposure information, and the specific steps for obtaining the adjusted image information are as follows;

[0055] When the graphic category information indicates that there is no anti-stretching portion 4 , the position information of the conductive copper block 1 in the DI graphic exposure information is obtained, the position is adjusted according to the position information of the conductive copper block 1 , and the set dividing line 5 is divided into the conductive copper block 1 .

[0056] Specifically, the system of the embodiment of the present application further adjusts the position of the set dividing line 5 by judging whether there is an anti-stretching part 4 in the DI graphic exposure image of the PCB board. The graphic category information is that there is no anti-stretching part 4, which is specifically the case that the anti-stretching part 4 is not set on the lead 3. Therefore, by setting the set dividing line 5 on the conductive copper block 1, it is not easy to be disconnected or misaligned even if the stretching operation is performed, and the fine spacing caused by the set translation and set stretching or contraction during DI exposure, which is usually less than 15μm, is not resolved, so that there is no risk of poor conduction of the lead 3.

[0057] As one implementation method, according to the graphic category information, the position of the set dividing line 5 is adjusted for the DI graphic exposure information, and the specific steps of obtaining the adjusted image information further include:

[0058] When the graphic category information indicates that there is an anti-stretching portion 4 , the position information of the anti-stretching portion 4 in the DI graphic exposure information is obtained, the position is adjusted according to the position information of the anti-stretching portion 4 , and the set dividing line 5 is divided into the anti-stretching portion 4 .

[0059] Specifically, the system of the embodiment of the present application further adjusts the position of the set dividing line 5 by judging whether there is an anti-stretching part 4 in the DI pattern exposure image of the PCB board. The pattern category information is that there is an anti-stretching part 4, specifically, the anti-stretching part 4 is set on the lead 3, specifically including "several anti-stretching parts 4 are set, each anti-stretching part 4 is set at the corresponding lead 3, the lead 3 is set at both ends of the anti-stretching part 4, and several anti-stretching parts 4 are set at intervals", "several anti-stretching parts 4 are set, each anti-stretching part 4 is set at the corresponding lead 3, one end of the anti-stretching part 4 is connected to the conductive copper block 1, the other end of the anti-stretching part 4 is connected to the lead 3, and several anti-stretching parts 4 are set at intervals" and "one anti-stretching part 4 is set, the anti-stretching part 4 is connected to several leads 3, the anti-stretching part 4 is set transversely along the lead 3 spacing arrangement direction, and the lead 3 is set on both sides of the anti-stretching part 4". There are three types of PCB board corresponding DI pattern situations. Therefore, the fine spacing caused by set translation and set stretching or contraction during DI exposure, usually less than 15μm, is not resolved. This solves the problem of poor conduction caused by translational misalignment of the gold finger guide 3 and improves the stability of the electroplated gold finger 2.

[0060] An embodiment of the present application provides a set dividing line 5 setting device, including a memory and a processor, the memory storing a computer program, and the processor being configured to run the computer program to execute the set dividing line 5 setting method as described above.

[0061] An embodiment of the present application provides a computer-readable storage medium, in which a computer program is stored, wherein the computer program is configured to execute the above-mentioned method for setting the set dividing line 5 when running.

[0062] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the above-described device and product can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0063] In several embodiments provided in this application, it should be understood that the disclosed methods, systems, devices and program products may be implemented in other ways.

[0064] In addition, each functional unit in each embodiment of the present application may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0065] As described above, the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A gold finger PCB board, characterized in that: It includes a conductive copper block, a plurality of gold fingers and a plurality of leads for connecting the conductive copper block and the gold fingers; Among them, one end of the lead wire is connected to the conductive copper block, and the other end of the lead wire is connected to the corresponding gold finger. Several of the lead wires are arranged at intervals, and several of the gold fingers are arranged at intervals.

2. The gold finger PCB board according to claim 1, characterized in that: The lead wire is provided with an anti-stretching portion for setting a set dividing line.

3. The gold finger PCB board according to claim 2, characterized in that: There are a plurality of anti-stretching parts, each of which is arranged on a corresponding lead wire, the lead wires are arranged at both ends of the anti-stretching part, and a plurality of anti-stretching parts are arranged at intervals.

4. The gold finger PCB board according to claim 2, characterized in that: There are several anti-stretching parts, each of which is arranged on a corresponding lead, one end of the anti-stretching part is connected to a conductive copper block, and the other end of the anti-stretching part is connected to the lead, and the several anti-stretching parts are arranged at intervals.

5. The gold finger PCB board according to claim 2, characterized in that: The anti-stretching portion is provided as one, the anti-stretching portion is connected to a plurality of lead wires, the anti-stretching portion is arranged transversely along the lead wire spacing arrangement direction, and the lead wires are arranged on both sides of the anti-stretching portion.

6. A method for setting a set dividing line, characterized in that: include: Acquire DI graphic exposure information, perform category analysis on the DI graphic exposure information, and obtain graphic category information; According to the graphic category information, the position of the set dividing line is adjusted for the DI graphic exposure information to obtain the adjusted image information.

7. The method for setting a set dividing line according to claim 6, characterized in that: The specific steps of adjusting the position of the set dividing line of the DI graphic exposure information according to the graphic category information to obtain the adjusted image information are as follows: When the graphic category information indicates that there is no anti-stretching portion, the conductive copper block position information in the DI graphic exposure information is obtained, the position is adjusted according to the conductive copper block position information, and the set dividing line is divided into the conductive copper block.

8. The method for setting a set dividing line according to claim 6, characterized in that: The specific step of adjusting the position of the set dividing line of the DI graphic exposure information according to the graphic category information to obtain the adjusted image information also includes: When the graphic category information indicates that there is an anti-stretching portion, the anti-stretching portion position information in the DI graphic exposure information is obtained, the position is adjusted according to the anti-stretching portion position information, and the set dividing line is divided into the anti-stretching portion.

9. A set dividing line setting device, characterized in that: The method comprises a memory and a processor, wherein the memory stores a computer program, and the processor is configured to run the computer program to execute the set dividing line setting method according to any one of claims 6 to 8.

10. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, wherein the computer program is configured to execute the set dividing line setting method according to any one of claims 6 to 8 when running.

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