Assembly method of circuit board

Abstract

The invention discloses an assembly method of a circuit board, which comprises the following steps of: obtaining a buckle which comprises a buckle body, a metal layer and a bonding layer bonded between the buckle body and the metal layer; and synchronously welding the buckle and the electronic component on the circuit board substrate to obtain the circuit board. According to the assembling method of the circuit board, the buckles and the electronic components are fixedly installed on the circuit board substrate in a welding mode, the step of circuit board trepanning can be reduced, the situation that the buckles are installed on the circuit board through new equipment (or tools) is avoided, then the assembling efficiency of the circuit board is improved, and the assembling cost is reduced.

Description

Technical Field

[0001] The invention belongs to the technical field of circuit boards, and in particular relates to a method for assembling a circuit board. Background Art

[0002] With the development of economy, the consumer electronics industry is updating faster and faster. The products in 3C industry are becoming thinner and lighter, and mobile phones and notebooks are becoming thinner and thinner. This will make the internal structure design of the product more compact and the layout more optimized. This also directly leads to the internal wiring of traditional electronic products being routed directly from the edge of the circuit board to the top of the circuit board. This requires that the wiring and components on the circuit board do not interfere with each other, and it is very important to fix the wiring.

[0003] The internal wiring of electronic products currently on the market is fixed by clipping the wiring to the plastic clips of the circuit board, thereby achieving the fixation of the wiring. The circuit board assembly process generally involves first installing plastic clips on the circuit board (PCB board) substrate, then soldering the electronic components to the circuit board substrate to obtain the circuit board, and then fixing the wiring to the plastic clips of the circuit board. However, the process of installing plastic clips on the circuit board substrate generally requires first opening a connection hole on the circuit board substrate, and then pressing and fixing the plastic clips in the connection hole, thereby achieving the assembly of the circuit board substrate and the plastic clips. The step of pressing and fixing the plastic clips in the connection hole requires separate equipment to install the plastic clips and the circuit board, resulting in the need to add additional assembly equipment and man-hours to the assembly process of the circuit board, reducing assembly efficiency.

[0004] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the invention and should not be regarded as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art. Summary of the invention

[0005] The object of the present invention is to provide a circuit board assembly method, which can simplify the assembly steps of the circuit board and the buckle, without adding separate equipment to realize the assembly process of the circuit board and the buckle, thereby reducing assembly costs and improving assembly efficiency.

[0006] In order to achieve the above object, a technical solution provided by a specific embodiment of the present invention is as follows: a method for assembling a circuit board, comprising the following steps:

[0007] Obtaining a buckle, wherein the buckle comprises a buckle body, a metal layer, and a bonding layer bonded between the buckle body and the metal layer;

[0008] The clips and electronic components are simultaneously welded on the circuit board substrate to obtain the circuit board.

[0009] In one or more embodiments of the present invention, the step of soldering the buckle and the electronic components to the circuit board substrate includes:

[0010] The SMT welding process is used to weld the clips and electronic components onto the circuit board substrate.

[0011] In one or more embodiments of the present invention, the buckle body has a through-going slot, and an opening connected to the slot is provided on the surface of the buckle body away from the metal layer, and the opening is close to the edge of the surface of the buckle body away from the metal layer.

[0012] In one or more embodiments of the present invention, the step of soldering the buckle and the electronic components to the circuit board substrate includes:

[0013] Determine the assembly positions of the clips and electronic components on the circuit board, and solder the clips and electronic components to the circuit board substrate in sequence.

[0014] In one or more embodiments of the present invention, the step of obtaining the buckle includes:

[0015] The bottom of the buckle body is coated with adhesive, and then the metal material is attached to the adhesive on the bottom of the buckle body to obtain the buckle.

[0016] In one or more embodiments of the present invention, the step of obtaining the buckle further includes:

[0017] After the metal material is attached to the adhesive at the bottom of the buckle body, it is heated and cooled to obtain the buckle.

[0018] In one or more embodiments of the present invention, the buckle body is a buckle body made of rubber material.

[0019] In one or more embodiments of the present invention, a primer layer is provided between the buckle body and the adhesive layer to increase the adhesion between the buckle body and the adhesive layer.

[0020] In one or more embodiments of the present invention, the bonding layer is a high temperature resistant silicone bonding layer.

[0021] In one or more embodiments of the present invention, the assembly method further comprises:

[0022] Insert the cable and snap it onto the clip on the circuit board.

[0023] Compared with the prior art, the circuit board assembly method of the present invention fixes the clips and electronic components on the circuit board substrate by welding, which can reduce the steps of opening holes in the circuit board and avoid using new equipment (or tooling) to install the clips on the circuit board, thereby improving the assembly efficiency of the circuit board and reducing the assembly cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0025] Figure 1 is a flow chart of a method for assembling a circuit board in one embodiment of the present invention;

[0026] Figure 2 The figure is a schematic structural diagram of a buckle of a circuit board in one embodiment of the present invention. DETAILED DESCRIPTION

[0027] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0028] like Figure 1 and Figure 2 As shown, a circuit board assembly method in one embodiment of the present invention includes the following steps:

[0029] S1. Obtain a buckle, wherein the buckle comprises a buckle body, a metal layer, and a bonding layer bonded between the buckle body and the metal layer;

[0030] S2, synchronously soldering the buckles and electronic components onto the circuit board substrate to obtain a circuit board.

[0031] The invented circuit board assembly method fixes the clips and electronic components on the circuit board substrate by welding, which can reduce the steps of opening holes in the circuit board and avoid using new equipment (or tooling) to install the clips on the circuit board, thereby improving the assembly efficiency of the circuit board and reducing the assembly cost.

[0032] S1. Obtain a buckle, wherein the buckle comprises a buckle body, a metal layer, and a bonding layer bonded between the buckle body and the metal layer.

[0033] In step S1, the buckle body is a buckle body made of rubber material. Different from the existing buckles made of plastic material, when the electronic product is accidentally dropped, the internal structure may break the plastic buckle due to the impact performance, thereby affecting other components fixed on the PCB board near the cable. The buckle body made of rubber material of the present invention can improve the elasticity of the entire buckle, effectively provide product cushioning, better protect electronic components and maximize the use of the internal space of the electronic product.

[0034] In addition, the rubber material of the buckle body can also make it easier to fix the cable after it is inserted, without shaking, and can wrap the cable tightly to make it more stable.

[0035] Furthermore, a primer layer (not shown in the figure) is provided between the buckle body and the adhesive layer to increase the adhesion between the buckle body and the adhesive layer. The primer layer can be formed by coating a common primer on the market, and the primer can be a silicone treatment agent, such as Kanglibang K770-5.

[0036] Furthermore, the bonding layer is a high temperature resistant silicone bonding layer. The high temperature resistant silicone bonding layer can be formed by coating with high temperature resistant silicone water (high temperature resistant silicone adhesive). The high temperature resistant silicone water can be a common high temperature resistant silicone water or high temperature resistant silicone adhesive on the market. For example, Kanglibang KL3636.

[0037] The metal layer can be a common high temperature resistant metal material, such as tinned copper foil, tinned aluminum foil or tinned PI and the like.

[0038] In a specific embodiment, the step of obtaining the buckle includes:

[0039] The bottom of the buckle body is coated with adhesive, and then the metal material is attached to the adhesive at the bottom of the buckle body to obtain the buckle. After the adhesive is coated, a bonding layer is formed at the bottom of the buckle body.

[0040] Furthermore, the step of obtaining the buckle also includes:

[0041] After the metal material is attached to the adhesive at the bottom of the buckle body, it is heated and cooled to obtain the buckle. The heating is to solidify the adhesive so that the metal material is firmly bonded to the bottom of the buckle body, and the cooling is to achieve the effect of shaping.

[0042] In a specific embodiment, since the buckle body is made of rubber material, an extruder can be used in conjunction with a corresponding mold to extrude the buckle body, that is, the buckle body can be integrally formed, thereby improving the production efficiency of the buckle body.

[0043] Furthermore, the above step of obtaining the buckle can form a large-sized buckle in a strip at one time, and then according to the actual size requirements, the large-sized buckle in the strip can be cut into small-sized buckles along its extension direction, thereby improving the production efficiency of the buckle. Of course, the above step of obtaining the buckle can also directly produce buckles that meet the size.

[0044] S2, synchronously soldering the buckles and electronic components onto the circuit board substrate to obtain a circuit board.

[0045] Among them, synchronous welding refers to welding the clips and electronic components to the circuit board substrate in one welding step. The two can be welded alternately or in sequence.

[0046] Preferably, in step S2, the step of soldering the buckle and the electronic components to the circuit board substrate includes:

[0047] Determine the assembly positions of the clips and the electronic components on the circuit board substrate, and solder the clips and the electronic components to the circuit board substrate in sequence.

[0048] It should be noted that such operation can simultaneously weld the clips and electronic components. Compared with the assembly steps in the prior art of first opening a connecting hole on the circuit board substrate and then pressing and fixing the plastic clips in the connecting hole, the above steps can not only save a process, but also reduce additional assembly equipment.

[0049] In addition, in the prior art, once the plastic clip is installed on the circuit board substrate, the position and type of the wiring and electronic components are basically fixed. When adjustments are made later, the circuit board substrate installed with the plastic clip can basically only be scrapped. However, the present invention simultaneously welds the clip and the electronic components on the circuit board substrate in sequence, that is, before welding the electronic components, the position of the clip and the electronic components can be adjusted and planned according to needs, and there is no need to consider the position of the opening on the circuit board substrate and the position of installing the plastic clip when manufacturing the circuit board substrate, so that the circuit board can be applied to more usage scenarios and purposes.

[0050] Furthermore, the step of soldering the buckle and the electronic components to the circuit board substrate includes:

[0051] The clips and the electronic components are soldered to the circuit board substrate by using the SMT soldering process. That is, the clips and the electronic components can be soldered to the circuit board substrate in sequence by using the SMT soldering process.

[0052] It should be noted that SMT welding, or surface mount technology (SMT for short), is a method of directly mounting electronic components on printed circuit boards. It achieves the connection and assembly of electronic products by soldering components on pads on the surface of PCB boards.

[0053] Among them, the process flow of SMT welding mainly includes the following steps:

[0054] Solder paste printing: Use a solder paste printer to evenly print the solder paste on the pads of the circuit board substrate;

[0055] Chip placement: Electronic components are accurately placed on solder paste using a chip placement machine;

[0056] Reflow soldering: The mounted circuit board is sent into the reflow soldering equipment, and the solder paste is melted by temperature control to form a solid soldering point.

[0057] like Figure 2 As shown, further, the buckle body has a through-set slot, and the surface of the buckle body away from the metal layer is provided with an opening connected to the slot, and the opening is close to the edge of the surface of the buckle body away from the metal layer. Such a configuration can make the top of the buckle body have a larger adsorption surface, that is, in the SMT welding process, when the buckle body is sucked, a better vacuum can be generated, which is more conducive to the automated picking operation process in the SMT welding process.

[0058] It can be understood that such operation can use the same welding equipment to simultaneously weld the clips and electronic components on the circuit board substrate in sequence, avoiding the need to add additional assembly equipment for the clips and circuit board substrate, while also saving equipment time.

[0059] In addition, the buckle in the present invention does not need to be wrapped as a whole after preparation, and can be packaged in a narrow band (for example, by an oscillating plate), mainly to facilitate SMT welding.

[0060] In a specific embodiment, the assembly method of the present invention further comprises:

[0061] S3. Insert the cable and clip it onto the clip of the circuit board.

[0062] The cable is clipped into the slot of the clip to complete the assembly of the entire circuit board to the electronic product.

[0063] In summary, the circuit board assembly method of the present invention fixes the clips and electronic components on the circuit board substrate by welding, which can reduce the steps of opening holes in the circuit board and avoid using new equipment (or tooling) to install the clips on the circuit board, thereby improving the assembly efficiency of the circuit board and reducing the assembly cost.

[0064] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0065] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A method for assembling a circuit board, characterized in that: The following steps are involved: Obtaining a buckle, wherein the buckle comprises a buckle body, a metal layer, and a bonding layer bonded between the buckle body and the metal layer; The clips and electronic components are simultaneously welded on the circuit board substrate to obtain the circuit board.

2. The circuit board assembly method according to claim 1, characterized in that: The steps of soldering the clips and electronic components to the circuit board substrate include: The SMT welding process is used to weld the clips and electronic components onto the circuit board substrate.

3. The circuit board assembly method according to claim 2, characterized in that: The buckle body is provided with a through-going slot, and an opening communicating with the slot is provided on a surface of the buckle body away from the metal layer, and the opening is close to an edge of the surface of the buckle body away from the metal layer.

4. The circuit board assembly method according to claim 1, characterized in that: The steps of soldering the clips and electronic components to the circuit board substrate include: Determine the assembly positions of the clips and the electronic components on the circuit board substrate, and solder the clips and the electronic components to the circuit board substrate in sequence.

5. The circuit board assembly method according to claim 1, characterized in that: The steps to obtain the clip include: The bottom of the buckle body is coated with adhesive, and then the metal material is attached to the adhesive on the bottom of the buckle body to obtain the buckle.

6. The circuit board assembly method according to claim 5, characterized in that: The steps to obtain the buckle also include: After the metal material is attached to the adhesive at the bottom of the buckle body, it is heated and cooled to obtain the buckle.

7. The circuit board assembly method according to claim 1, characterized in that: The buckle body is made of rubber material.

8. The circuit board assembly method according to claim 7, characterized in that: A primer layer is provided between the buckle body and the adhesive layer to increase the adhesion between the buckle body and the adhesive layer.

9. The circuit board assembly method according to claim 1, characterized in that: The bonding layer is a high temperature resistant silicone bonding layer.

10. The circuit board assembly method according to claim 1, characterized in that: The assembly method further comprises: Insert the cable and snap it onto the clip on the circuit board.

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