A soldering operation table for soldering precision electronic components

Abstract

The present invention relates to the field of welding operation tables for welding, and discloses a welding operation table for welding precision electronic components, which includes a bottom plate. Support columns are fixedly installed at the bottom end of the bottom plate. A toolbox and a solder storage bin are arranged at the top end of the bottom plate. A moving device is arranged on the solder storage bin; the moving device includes a first fixing plate, a first moving column and a moving member. Two first threaded rods are rotatably installed on the upper part of the first fixing plate. The outer wall of the first threaded rod is engaged with the first moving column. The rotation of the first threaded rod is used to drive the first moving column and the moving member to move. A liquid receiving device is arranged on the moving member; in the present invention, the first damping rod and the second damping rod on the direction detection device expand and contract to drive the direction transmission member to adjust the angle, so as to detect and determine the movement direction of the solder collection tube. The equal-distance transmission member drives the equal-distance transmission member to adjust the direction and move to directly below the circuit board pins after welding, preventing the solder liquid from dripping and causing sputtering and difficult cleaning problems.

Description

Technical Field

[0001] The present invention relates to the technical field of welding operation tables for welding, and more specifically, it relates to a welding operation table for welding precision electronic components. Background Art

[0002] Precision electronic components refer to electronic components with extremely high precision and stability, including resistors, capacitors, inductors, transistors, diodes, integrated circuits, etc.; these components play a key role in electronic technology and are widely used in fields such as communication, computers, and household appliances. There are many welding methods for precision electronic components, including selective wave soldering.

[0003] A patent with the publication number CN117324716A discloses a precision electronic component welding device and its operation table, including a workbench, an operation surface and a welding device fixedly installed on the workbench; the welding device includes a solder state maintaining device and a circuit board mounting device; a welding position recognition device for welding position recognition and a solder delivery device are also provided inside the welding state maintaining device; the solder delivery device includes a delivery pipe, and a lifting cover and a protective frame are respectively arranged on the outer periphery of the top end of the delivery pipe from the inside to the outside, and several groups of springs are arranged at the bottom end of the lifting cover; first, the precise recognition and matching positioning of the position are carried out through three cameras, then the precise positioning of the three cameras is carried out, and then the welding is carried out through the delivery pipe, so that the overall welding accuracy is greatly increased during the welding process, and the efficiency is also increased during the overall welding process through the welding of the delivery pipe, and the loss of solder is reduced.

[0004] During the use of the above device, there are openings around the solder bath, so the air circulation is increased during the welding process, making the solder prone to oxidation during the welding process. When using selective wave soldering for the welded pins, after the solder is welded, due to surface tension, the solder will still continuously drop. When the solder drops, it is easy to fall outside the solder spraying port. If a plate is set below the solder spraying port, after the solder drops, it will quickly solidify and cannot return to the solder bath, and reheating is a waste of time and rather troublesome. Summary of the Invention

[0005] The present invention provides a welding operation table for welding precision electronic components, which solves the technical problem that when using selective wave soldering for the welded pins, after the solder is welded, due to surface tension, the solder will still continuously drop, and when the solder drops, it is easy to fall outside the solder spraying port. If a plate is set below the solder spraying port, after the solder drops, it will quickly solidify and cannot return to the solder bath, and reheating is a waste of time.

[0006] The present invention provides a soldering operation table for soldering precision electronic components, including a bottom plate. Support columns are fixedly installed at the bottom end of the bottom plate. A toolbox and a solder bin are arranged at the top end of the bottom plate. A moving device is arranged on the solder bin. The moving device includes a first fixing plate, a first moving column and a moving member. Two first threaded rods are rotatably installed on the upper part of the first fixing plate. The outer wall of the first threaded rod meshes with the first moving column. The rotation of the first threaded rod is used to drive the first moving column and the moving member to move. A liquid receiving device is arranged on the moving member. The moving device drives the liquid receiving device to move for soldering electronic components. The liquid receiving device includes a liquid receiving member. A direction detection device is arranged on the first moving column. The direction detection device is used to adjust the direction of the liquid receiving member to receive the solder liquid dripping after soldering when the moving device moves.

[0007] As a further optimized solution of the present invention, the solder bin includes a solder pool fixedly installed at the top end of the bottom plate. A clamping base is arranged at the top end of the solder pool. A clamping plate is arranged at the top end of the clamping base. After the clamping base and the clamping plate mesh, a clamping frame is formed inside for placing a circuit board. A first opening is formed in the solder pool. The first opening is used for the moving device to drive the liquid receiving device to move. A first sliding groove is formed in the solder pool below the first opening.

[0008] As a further optimized solution of the present invention, the moving device includes a first fixing plate fixedly installed on the solder pool. A first fixing block is fixedly installed at the top end of the first fixing plate. A first threaded rod is rotatably installed inside the first fixing block. The two first threaded rods are symmetrically arranged with respect to the first fixing plate. The outer wall of the first threaded rod is threadedly installed with a first moving column. A first slider is rotatably arranged outside the first moving column. The first slider slides on the inner wall of the first sliding groove. Sixth protrusions are symmetrically arranged on both side walls of the first slider. A moving member is slidably installed inside the two sixth protrusions.

[0009] As a further optimized solution of the present invention, a first gear is arranged at the top end of the first moving column. A first tooth is fixedly installed on the first moving column. The outer wall of the first gear meshes with the moving member. The moving member includes a first moving tooth plate slidably installed inside the two sixth protrusions. A first limiting ring is fixedly installed at one end of the first moving tooth plate close to the center of the solder pool. A first protrusion is fixedly installed on the first moving tooth plate. A fixed frame is fixedly installed on the first moving tooth plate. A second protrusion is fixedly installed at one end of the first moving tooth plate far from the center of the solder pool.

[0010] As a further optimized solution of the present invention, the direction detection device includes a second fixed block fixedly installed on the first fixed plate. A first damping rod is fixedly installed on the second fixed block, and a second damping rod is fixedly installed on the second protrusion. A direction transmission member is provided at the top of the sixth protrusion. The first damping rod and the second damping rod are both connected to the direction transmission member. An equidistant transmission member is slidably installed inside the fixed frame, and a first motor is provided outside the equidistant transmission member.

[0011] As a further optimized solution of the present invention, the direction transmission member includes a first cylinder fixedly installed at the top of the sixth protrusion. A third limiting block is fixedly installed on the outer wall of the first cylinder. A second limiting ring is provided inside the third limiting block. A first spherical ball is movably installed inside the second limiting ring. Second telescopic rods are symmetrically arranged at the top and bottom of the first spherical ball. Two first circular blocks are fixedly installed on the outer wall of the second telescopic rod. A second rotating block is rotatably installed on the outer wall of the first circular block. First square chutes are respectively fixedly installed on the first damping rod and the second damping rod, and the two first square chutes are connected in a staggered manner according to height. The second rotating block at the end far from the center of the first spherical ball is slidably installed inside the first square chute. A third fixed column is fixedly installed at the top of the third limiting block. A direction limiting frame is fixedly installed at the top of the third fixed column. A first spring is fixedly installed on the inner wall of the direction limiting frame. The first spring is connected to the second telescopic rod provided at the top of the first spherical ball.

[0012] As a further optimized solution of the present invention, the equidistant transmission member includes a third rotating block rotatably installed on the outer wall of the upper second telescopic rod. A fourth fixed column is rotatably installed on the outer wall of the third rotating block.

[0013] As a further optimized solution of the present invention, the liquid receiving device includes a solder collecting pipe rotatably installed on the inner wall of the first limiting ring. A fifth protrusion is fixedly installed on the inner wall of the solder collecting pipe. A tin spraying pipe is fixedly installed on the fifth protrusion. A liquid receiving member is provided on the outer wall of the solder collecting pipe. A first liquid leakage port is provided inside the solder collecting pipe and is communicated with the liquid receiving member. A sixth cylinder is rotatably installed at the top of the first limiting ring. A fifth cylinder is rotatably installed at the top of the first protrusion. A fourth gear is fixedly installed at the top of the sixth cylinder. A third gear is fixedly installed at the top of the fifth cylinder. The third gear is meshed with the liquid receiving member through the fourth gear. One end of the fourth fixed column close to the center of the tin spraying pipe is rotatably installed on the third gear. A seventh protrusion is provided inside the fixed frame. A sixth slider is slidably installed inside the fourth fixed column. The sixth slider slides inside the fixed frame through the seventh protrusion.

[0014] As a further optimization solution of the present invention, the liquid receiving member includes a liquid receiving rotating block fixedly installed on the outer wall of the solder collecting pipe. A second tooth is fixedly installed at the bottom end of the liquid receiving rotating block, and the second tooth is used to mesh with the fourth gear. A liquid receiving groove is fixedly installed on the liquid receiving rotating block. A second liquid leakage port is arranged inside the liquid receiving groove, and the second liquid leakage port is connected to the first liquid leakage port. An inclined block is arranged on the liquid receiving groove.

[0015] As a further optimization solution of the present invention, a fourth protrusion is fixedly installed on the first moving tooth plate. The fourth protrusion is used to detect the distance between the first ball and the third gear, and the first motor is started according to the distance to adjust the equal-distance transmission member.

[0016] The beneficial effects of the present invention are as follows:

[0017] For the soldering operation table for precision electronic components of the present invention, by synchronously rotating two first fixing blocks inside the moving device, the solder collecting pipe is adjusted to move along the length direction of the first fixing plate. By rotating the first fixing plate individually, the solder collecting pipe is adjusted to move along the width direction of the first fixing plate. There is no need to set multiple openings to drive the movement of the solder collecting pipe, thereby reducing the contact between the tin liquid inside the solder pool and the air and reducing the oxidation speed of the tin liquid. By the telescopic movement of the first damping rod and the second damping rod on the direction detection device, the direction transmission member is driven to adjust the angle, thereby detecting the movement direction of the solder collecting pipe. The direction is adjusted by the equal-distance transmission member and moved to directly below the circuit board pins after soldering, preventing the problem of tin liquid dripping and causing sputtering and difficult cleaning. Description of the Drawings

[0018] Figure 1 is the external view of the overall device of the present invention;

[0019] Figure 2 is the rear view of the overall device of the present invention;

[0020] Figure 3 is the structural diagram of the solder storage position of the present invention;

[0021] Figure 4 is the partial connection diagram of the solder storage of the present invention;

[0022] Figure 5 is the internal transmission diagram of the solder storage of the present invention;

[0023] Figure 6 is the overall transmission diagram of the moving device of the present invention;

[0024] Figure 7 is the overall cooperation diagram of the moving device and the direction detection device of the present invention;

[0025] Figure 8It is the transmission mating diagram of the direction transmission part of the present invention;

[0026] Figure 9 It is the position structure diagram of the direction transmission part of the present invention;

[0027] Figure 10 The internal connection diagram of the liquid receiving device of the present invention;

[0028] Figure 11 It is the internal transmission diagram of the liquid receiving device of the present invention.

[0029] In the figure:

[0030] 1. Base plate; 11. Support column; 12. Tool box; 13. Solder storage bin; 131. Solder bath; 132. Clamping base; 133. Clamping plate; 134. Clamping frame; 135. First opening; 136. First sliding groove;

[0031] 2. Moving device; 21. First fixing plate; 22. First fixing block; 23. First threaded rod; 24. First slider; 241. Sixth protrusion; 25. First moving column; 251. First gear; 252. First tooth; 26. Moving part; 261. First moving tooth plate; 262. First limiting ring; 263. Fixed frame; 264. First protrusion; 265. Second protrusion; 266. Fourth protrusion; 267. Seventh protrusion;

[0032] 3. Direction detection device; 31. Second fixing block; 32. First damping rod; 33. Second limiting ring; 34. Direction transmission part; 341. First cylinder; 342. Third limiting block; 343. First spherical ball; 344. Second telescopic rod; 345. First round block; 346. Second rotating block; 3461. First square sliding groove; 347. Third fixing column; 348. Direction limiting frame; 349. First spring; 35. Second damping rod; 36. First motor; 37. Equally spaced transmission part; 371. Third rotating block; 372. Fourth fixing column; 373. Sixth slider;

[0033] 4. Liquid receiving device; 41. Solder collection pipe; 411. Fifth protrusion; 412. First liquid leakage port; 42. Tin spraying pipe; 43. Liquid receiving part; 431. Liquid receiving rotating block; 432. Second tooth; 433. Liquid receiving groove; 434. Second liquid leakage port; 435. Inclined block; 44. Fifth cylinder; 45. Sixth cylinder; 46. Third gear; 47. Fourth gear. Detailed implementation mode

[0034] Reference will now be made to exemplary embodiments to discuss the subject matter described herein. It should be understood that discussing these embodiments is only to enable those skilled in the art to better understand and thus implement the subject matter described herein. Without departing from the scope of protection of the content of this specification, changes can be made to the functions and arrangements of the elements discussed. Each example can omit, substitute, or add various processes or components as needed. Additionally, the features described relative to some examples can also be combined in other examples.

[0035] As Figures 1 to 3 shown, a soldering operation table for soldering precision electronic components according to an embodiment of the present invention includes a bottom plate 1. A support column 11 is fixedly installed at the bottom end of the bottom plate 1. A toolbox 12 and a solder storage bin 13 are arranged at the top end of the bottom plate 1. A moving device 2 is arranged on the solder storage bin 13;

[0036] As Figures 5 to 7 shown, the moving device 2 includes a first fixing plate 21, a first moving column 25, and a moving member 26. Two first threaded rods 23 are rotatably installed on the upper part of the first fixing plate 21. The outer wall of the first threaded rod 23 meshes with the first moving column 25. The rotation of the first threaded rod 23 is used to drive the first moving column 25 and the moving member 26 to move. A liquid receiving device 4 is arranged on the moving member 26. The moving device 2 drives the liquid receiving device 4 to move for soldering electronic components;

[0037] As Figures 8 to 10 shown, the liquid receiving device 4 includes a liquid receiving member 43. A direction detection device 3 is arranged on the first moving column 25. The direction detection device 3 is used to adjust the direction of the liquid receiving member 43 to receive the solder liquid dripping after soldering when the moving device 2 moves.

[0038] It should be noted that the wave soldering currently in use generally combines the two working systems of transporting the circuit board and coating the flux into one integrated unit. It is less common to perform soldering separately with wave soldering. To facilitate wave soldering, a soldering operation table is designed. When using selective wave soldering to solder precision electronic components, the circuit board and the pins of the metal components mounted on the circuit board are coated with flux, and then the solder liquid contacts the pins to achieve the soldering effect. However, since the solder liquid is a heated liquid, the surface tension effect of the liquid will occur during soldering. When the soldered solder liquid cools, small drops of soldering liquid will drip downward. However, since the nozzle of the solder liquid has moved away, it may drip onto other positions of the wave soldering. Moreover, the temperature of the solder liquid is relatively high. If sputtering occurs, it is difficult to clean, and at the same time, there will be a problem of scalding. If a relatively large plate is directly set below the solder spraying port, the solder liquid will completely adhere to the plate, making it difficult to clean and wasting solder liquid. To solve this problem, the following improvements are made:

[0039] The circuit board is placed on the solder storage bin 13 and clamped stably by a fixture. The motor is used to drive the rotation of two first threaded rods 23, so as to drive the first moving column 25 to slide on the side of the solder storage bin 13 for movement. When the motor drives the rotation of one first threaded rod 23, the moving part 26 is driven to move. And a liquid receiving device 4 is arranged at the end of the moving part 26, so that the liquid receiving device 4 can be driven to move to the position to be soldered at the lower end of the circuit board. The solder liquid is placed at the lower part of the solder storage bin 13, and devices for adding solder bars and heating are arranged at the bottom and the lower periphery of the solder storage bin 13 to add tin liquid into the solder storage bin 13. A pump is arranged in the center inside the liquid receiving part 43, so that the melted tin liquid is sprayed out from the upper part of the liquid receiving device 4. Then the motor is started to adjust the rotation of a single first fixing block 22 or multiple first fixing blocks 22, and soldering can be achieved. During the movement of the first moving column 25 and the moving part 26, the direction detection device 3 is inclined, and the inclination angle of the direction detection device 3 is the same as the moving direction, so as to drive the liquid receiving part 43 to rotate and adjust the angle, so that the orientation of the liquid receiving part 43 is opposite to the moving direction. Thus, after the liquid receiving device 4 sprays the liquid, it can pass through the bottom of the pins after soldering, so as to receive the solder liquid after soldering, preventing the splashing and waste of the solder liquid. And the dripping solder liquid flows back into the solder storage bin 13 through the liquid receiving part 43 again, so as to be heated and melted for reuse.

[0040] Such as Figures 3 to 5As shown, the solder bin 13 includes a solder pool 131 fixedly installed at the top of the bottom plate 1. A clamping base 132 is provided at the top of the solder pool 131. A clamping plate 133 is provided at the top of the clamping base 132. After the clamping base 132 and the clamping plate 133 are engaged, a clamping frame 134 is formed inside for placing the circuit board. A first opening 135 is formed in the solder pool 131 for the moving device 2 to drive the liquid receiving device 4 to move. A first chute 136 is formed in the solder pool 131 below the first opening 135.

[0041] It should be noted that considering that the circuit board needs to be placed above the liquid receiving device 4 for fixation, a clamping base 132 and a clamping plate 133 are placed above the solder pool 131. The clamping frame 134 formed by the installation of the clamping base 132 and the clamping plate 133, that is, the placement position of the circuit board, and then the clamping plate 133 and the clamping frame 134 are fixed to the upper end of the solder pool 131, and then welding can be carried out.

[0042] As Figures 6 to 7 As shown, the moving device 2 includes a first fixing plate 21 fixedly installed on the solder pool 131. A first fixing block 22 is fixedly installed at the top of the first fixing plate 21. A first threaded rod 23 is rotatably installed inside the first fixing block 22. The two first threaded rods 23 are symmetrically arranged with respect to the first fixing plate 21. A first moving column 25 is threadedly installed on the outer wall of the first threaded rod 23. A first slider 24 is rotatably arranged outside the first moving column 25. The first slider 24 slides on the inner wall of the first chute 136. Sixth protrusions 241 are symmetrically arranged on both side walls of the first slider 24. A moving member 26 is slidably installed inside the two sixth protrusions 241.

[0043] It should be noted that when one first fixing block 22 rotates, it can drive the first moving column 25 to move. The first slider 24 is arranged on the outer wall of the first moving column 25, and the first slider 24 slides inside the first chute 136, thereby limiting the first slider 24 and the first moving column 25 to prevent the first moving column 25 from tilting during the moving process.

[0044] As Figures 6 to 7As shown, a first gear 251 is provided at the top of the first moving column 25. A first tooth 252 is fixedly installed on the first moving column 25. A moving member 26 is engaged with the outer wall of the first gear 251. The moving member 26 includes a first moving tooth plate 261 slidably installed inside two of the sixth protrusions 241. One end of the first moving tooth plate 261 close to the center of the solder bath 131 is fixedly installed with a first limiting ring 262. A first protrusion 264 is fixedly installed on the first moving tooth plate 261. A fixed frame 263 is fixedly installed on the first moving tooth plate 26. A second protrusion 265 is fixedly installed at one end of the first moving tooth plate 261 away from the center of the solder bath 131.

[0045] It should be noted that when it is necessary to drive the moving member 26 to move, by rotating the two first threaded rods 23, the two first threaded rods 23 drive the first tooth 252 to rotate. The first tooth 252 drives the first moving column 25 to rotate. The first moving column 25 drives the first gear 251 to rotate. The first gear 251 meshes with the side wall of the first moving tooth plate 261. The side of the first slider 24 is provided with sixth protrusions 241 to clamp the first moving tooth plate 261, so as to drive the first moving tooth plate 261 to move and be limited. One end of the first moving tooth plate 261 is provided with a first limiting ring 262 for moving the liquid receiving device 4. The fixed frame 263, the first protrusion 264 and the second protrusion 265 are used to assist the direction detection device 3 and the liquid receiving device 4 to judge the moving direction of the liquid receiving device 4 during the moving process.

[0046] As Figures 7 to 9 As shown, the direction detection device 3 includes a second fixed block 31 fixedly installed on the first fixing plate 21. A first damping rod 32 is fixedly installed on the second fixed block 31. A second damping rod 35 is fixedly installed on the second protrusion 265. A direction transmission member 34 is provided at the top of the sixth protrusion 241. Both the first damping rod 32 and the second damping rod 35 are connected to the direction transmission member 34. An equidistant transmission member 37 is slidably installed inside the fixed frame 263. A first motor 36 is provided outside the equidistant transmission member 37.

[0047] It should be noted that when the first moving column 25 moves, the first damping rod 32 extends or contracts. Since the first damping rod 32 is a damping rod, it will always be in a state of jacking up the lower part of the direction transmission member 34 during the contraction process. The upper part of the direction transmission member 34 moves in the direction of the movement of the first moving column 25, thereby indicating the movement direction of the liquid receiving device 4. The function of the direction transmission member 34 is the same as that of the second damping rod 35. Therefore, during the movement of the moving device 2 driving the liquid receiving device 4, the movement direction of the liquid receiving device 4 is indicated, so as to drive the liquid receiving member 43 to receive the solder liquid after the circuit board pins are welded, preventing the problems of scalding caused by solder liquid sputtering and difficult cleaning.

[0048] As Figures 7 to 9 shown, the direction transmission member 34 includes a first cylinder 341 fixedly installed at the top end of the sixth protrusion 241. A third limit block 342 is fixedly installed on the outer wall of the first cylinder 341. A second limit ring 33 is arranged inside the third limit block 342. A first spherical ball 343 is movably installed inside the second limit ring 33. Second telescopic rods 344 are symmetrically arranged at the top end and the bottom end of the first spherical ball 343. Two first circular blocks 345 are fixedly installed on the outer wall of the second telescopic rod 344. A second rotating block 346 is rotatably installed on the outer wall of the first circular block 345. First square chutes 3461 are respectively fixedly installed on the first damping rod 32 and the second damping rod 35, and the two first square chutes 3461 are connected in a staggered manner according to height. The second rotating block 346 at the end far from the center of the first spherical ball slides inside the first square chute 3461. A third fixing column 347 is fixedly installed at the top end of the third limit block 342. A direction limit frame 348 is fixedly installed at the top end of the third fixing column 347. A first spring 349 is fixedly installed on the inner wall of the direction limit frame 348. The first spring 349 is connected to the second telescopic rod 344 arranged at the top end of the first spherical ball 343.

[0049] It should be noted that when the first moving column 25 moves towards the second fixed block 31, the first damping rod 32 exerts a damping effect, thus jacking up the first round block 345. A second telescopic rod 344 is slidably installed inside the first round block 345 to adapt to the height of the first damping rod 32. The second telescopic rod 344 drives the first spherical ball 343 to rotate inside the third limiting block 342, thereby driving the second telescopic rod 344 and the first round block 345 installed at the top to move in opposite directions, achieving the effect of driving the equidistant transmission member 37 to move. The end of the equidistant transmission member 37 is connected to the liquid receiving device 4, so that when the equidistant transmission member 37 moves, it can drive the liquid receiving member 43 on the liquid receiving device 4 to adjust the direction. As described above, when the first moving column 25 moves towards or away from the liquid receiving device 4, the second damping rod 35 plays a damping role, thereby driving the equidistant transmission member 37 to adjust the angle, so that the liquid receiving member 43 moves in the opposite direction to the moving direction, achieving the effect of receiving the solder liquid for the circuit board after welding. A first motor 36 is arranged outside the equidistant transmission member 37. When the first moving column 25 moves towards or away from the liquid receiving device 4, the first motor 36 can drive the equidistant transmission member 37 to expand and contract according to the distance between the center of the liquid receiving device 4 and the center of the first moving column 25, so that the equidistant transmission member 37 has the function of driving the liquid receiving device 4 to point.

[0050] As Figures 8 to 10 shown, the equidistant transmission member 37 includes a third rotating block 371 rotatably installed on the outer wall of the upper second telescopic rod 344, and a fourth fixed column 372 is rotatably installed on the outer wall of the third rotating block 371.

[0051] It should be noted that the third rotating block 371 is connected to the direction detection device 3, and the fourth fixed column 372 is connected to the liquid receiving device 4. A first motor 36 is arranged at the end of the fourth fixed column 372. When the distance between the first moving column 25 and the center of the liquid receiving device 4 changes, the distance difference between the two ends of the third rotating block 371 and the fourth fixed column 372 can be adjusted by starting the first motor 36 to rotate, so that the equidistant transmission member 37 has the function of jacking up the liquid receiving device 4 to adjust the angle of the liquid receiving member 43.

[0052] As Figures 10 to 11As shown, the liquid receiving device 4 includes a solder collecting pipe 41 rotatably installed on the inner wall of the first limiting ring 262. A fifth protrusion 411 is fixedly installed on the inner wall of the solder collecting pipe 41, and a solder spraying pipe 42 is fixedly installed on the fifth protrusion 411. A liquid receiving member 43 is arranged on the outer wall of the solder collecting pipe 41. A first liquid leakage port 412 is arranged inside the solder collecting pipe 41 and communicated with the liquid receiving member 43. A sixth cylinder 45 is rotatably installed at the top end of the first limiting ring 262, and a fifth cylinder 44 is rotatably installed at the top end of the first protrusion 264. A fourth gear 47 is fixedly installed at the top end of the sixth cylinder 45, and a third gear 46 is fixedly installed at the top end of the fifth cylinder 44. The third gear 46 is meshed with the liquid receiving member 43 through the fourth gear 47. One end of the fourth fixing column 372 close to the center of the solder spraying pipe 42 is rotatably installed on the third gear 46. A seventh protrusion 267 is arranged inside the fixed frame 263. A sixth slider 373 is slidably installed inside the fourth fixing column 372. The sixth slider 373 slides inside the fixed frame 263 through the seventh protrusion 267.

[0053] It should be noted that when welding the pins installed on the circuit board, first continuously heat the tin liquid inside the solder bath 131 so that the heated temperature remains constant and the liquid state is maintained without excessive boiling. Then, through the pump installed inside the lower end of the solder spraying pipe 42, the molten tin liquid is pumped out from the top of the solder spraying pipe 42. After that, start the motor to drive the first threaded rod 23 to rotate, thereby driving the first moving column 25 to move. During the movement of the first moving column 25 and the moving part 26, the first spherical ball 343 is driven to rotate, and the rotation of the first spherical ball 343 drives the fourth fixed column 372 and the sixth slider 373 to slide inside the fixed frame 263 and the seventh protrusion 267, thereby driving the third gear 46 to rotate. The third gear 46 meshes with the fourth gear 47, thereby driving the liquid receiving part 43 to adjust the angle. The equal-spacing transmission part 37 is provided with a first motor 36. When the second damping rod 35 moves, the first motor 36 rotates to automatically adjust the distance between the center of the third gear 46 and the center of the first moving column 25, so that the distance between both ends of the third rotating block 371 and the fourth fixed column 372 is the same as the distance between the center of the third gear 46 and the center of the first moving column 25. Thus, the equal-spacing transmission part 37 has the problem of adjusting the rotation state of the third gear 46 and the angle of the liquid receiving part 43 under the action of the first spherical ball 343. Then, it flows down from the outer wall of the tin liquid spraying pipe 42 and enters the inside of the solder collecting pipe 41. The bottom end of the solder collecting pipe 41 is connected to the bottom end of the solder bath 131, so that the flowing out tin liquid enters the inside of the solder bath 131 again. The inside of the solder collecting pipe 41 is provided with a first liquid leakage port 412, and the first liquid leakage port 412 is connected to the liquid receiving part 43. When the top end of the solder spraying pipe 42 moves forward continuously after welding the circuit board, the tin liquid will drip again due to the surface tension, and thus is received by the liquid receiving part 43. The liquid receiving part 43 is also provided with a heating device, so that when the tin liquid drops on the liquid receiving part 43, it can enter the inside of the solder collecting pipe 41 through the first liquid leakage port 412, and then enter the inside of the solder bath 131, preventing waste and splashing of the tin liquid.

[0054] As Figures 10 to 11 shown, the liquid receiving part 43 includes a liquid receiving rotating block 431 fixedly installed on the outer wall of the solder collecting pipe 41. The bottom end of the liquid receiving rotating block 431 is fixedly installed with a second tooth 432, and the second tooth 432 is used to mesh with the fourth gear 47. A liquid receiving groove 433 is fixedly installed on the liquid receiving rotating block 431. A second liquid leakage port 434 is arranged inside the liquid receiving groove 433, and the second liquid leakage port 434 is connected to the first liquid leakage port 412. An inclined block 435 is arranged on the liquid receiving groove 433.

[0055] It should be noted that the fourth gear 47 meshes with the second tooth 432, thereby driving the liquid-receiving rotating block 431 to rotate. The liquid-receiving groove 433 is used to receive the dripping tin liquid. An inclined block 435 is provided at the bottom of the liquid-receiving groove 433, which can guide the dripping tin liquid. A second liquid leakage port 434 is provided inside the liquid-receiving groove 433, which can be used to guide the tin liquid into the inside of the solder collecting pipe 41 for reuse.

[0056] As Figure 7 and Figure 11 shown, a fourth protrusion 266 is fixedly installed on the first moving tooth plate 261. The fourth protrusion 266 is used to detect the distance between the first ball 343 and the third gear 46, and start the first motor 36 to adjust the equidistant transmission member 37 according to the distance.

[0057] It should be noted that an infrared rangefinder is provided on the fourth protrusion 266, and a baffle is also provided on the side wall of the fourth protrusion 261 at the central position of the first moving column 25, which is used to detect and calculate the distance between the center of the third gear 46 and the center of the first moving column 25.

[0058] The above describes the embodiments of this embodiment, but this embodiment is not limited to the above specific implementation manners. The above specific implementation manners are merely illustrative and not restrictive. Under the inspiration of this embodiment, those of ordinary skill in the art can also make many forms, all of which fall within the protection scope of this embodiment.

Claims

1. A welding operation table for welding precision electronic components, comprising a base plate (1), a support column (11) being fixedly mounted at the bottom end of the base plate (1), and a tool box (12) and a solder bin (13) being arranged at the top end of the base plate (1), characterized in that: The solder bin (13) is provided with a moving device (2); The moving device (2) comprises a first fixed plate (21), a first moving column (25) and a moving member (26); two first threaded rods (23) are rotatably mounted on the upper portion of the first fixed plate (21); the outer wall of the first threaded rod (23) is meshed with the first moving column (25); the first threaded rod (23) rotates to drive the first moving column (25) and the moving member (26) to move; a liquid contact device (4) is provided on the moving member (26); the moving device (2) drives the liquid contact device (4) to move to weld electronic components; The liquid contact device (4) comprises a liquid contact part (43); the first movable column (25) is provided with a direction detection device (3); the direction detection device (3) is used to adjust the direction of the liquid contact part (43) when the movable device (2) moves so as to receive solder liquid dripping after welding; the solder bin (13) comprises a solder pool (131) fixedly mounted on the top of the bottom plate (1); the top of the solder pool (131) is provided with a clamping base (132); the top of the clamping base (132) is provided with a clamping plate (133); the clamping base (132) and the clamping plate After engagement, the interior of the solder pool (133) forms a clamping frame (134) for placing a circuit board. The solder pool (131) is provided with a first opening (135). The first opening (135) is used for the mobile device (2) to drive the liquid receiving device (4) to move. A first slide groove (136) is provided on the solder pool (131) below the first opening (135). The mobile device (2) comprises a first fixing plate (21) fixedly mounted on the solder pool (131). A first fixing block (22) is fixedly mounted on the top of the first fixing plate (21). A first threaded rod (23) is rotatably mounted inside the fixed block (22), two of the first threaded rods (23) are symmetrically arranged about the first fixed plate (21), a first movable column (25) is threadably mounted on the outer wall of the first threaded rod (23), a first slider (24) is rotatably mounted outside the first movable column (25), the first slider (24) slides on the inner wall of the first slide groove (136), sixth protrusions (241) are symmetrically arranged on both side walls of the first slider (24), and a movable member (26) is slidably mounted on the inner sides of the two sixth protrusions (241);A first gear (251) is provided at the top of the first movable column (25), a first tooth (252) is fixedly mounted on the first movable column (25), a movable member (26) is meshed with an outer wall of the first gear (251), the movable member (26) comprises a first movable tooth plate (261) slidably mounted on the inner sides of the two sixth protrusions (241), a first limiting ring (262) is fixedly mounted on one end of the first movable tooth plate (261) close to the center of the solder pool (131), a first protrusion (264) is fixedly mounted on the first movable tooth plate (261), a fixing frame (263) is fixedly mounted on the first movable tooth plate (261), and a second protrusion (265) is fixedly mounted on one end of the first movable tooth plate (261) away from the center of the solder pool (131); the direction detection device ( 3) comprising a second fixed block (31) fixedly mounted on the first fixed plate (21), a first damping rod (32) fixedly mounted on the second fixed block (31), a second damping rod (35) fixedly mounted on the second protrusion (265), a direction transmission member (34) being arranged at the top end of the sixth protrusion (241), the first damping rod (32) and the second damping rod (35) being connected to the direction transmission member (34), an equidistant transmission member (37) being slidably mounted inside the fixed frame (263), a first motor (36) being arranged outside the equidistant transmission member (37); the equidistant transmission member (37) comprising a third rotating block (371) rotatably mounted on the outer wall of the upper second telescopic rod (344), a fourth fixed column (372) being rotatably mounted on the outer wall of the third rotating block (371);The liquid receiving device (4) comprises a solder collecting tube (41) rotatably mounted on the inner wall of a first limiting ring (262); a fifth protrusion (411) is fixedly mounted on the inner wall of the solder collecting tube (41); a tin spraying tube (42) is fixedly mounted on the fifth protrusion (411); a liquid receiving part (43) is arranged on the outer wall of the solder collecting tube (41); a first liquid leakage port (412) is arranged inside the solder collecting tube (41) and is connected to the liquid receiving part (43); a sixth cylinder (45) is rotatably mounted on the top end of the first limiting ring (262); and the first protrusion (411) is fixedly mounted on the inner wall of the solder collecting tube (41). A fifth cylinder (44) is rotatably mounted on the top of the starter (264), a fourth gear (47) is fixedly mounted on the top of the sixth cylinder (45), a third gear (46) is fixedly mounted on the top of the fifth cylinder (44), the third gear (46) is meshed with the liquid contact part (43) through the fourth gear (47), one end of the fourth fixed column (372) close to the center of the tin spraying tube (42) is rotatably mounted on the third gear (46), a seventh protrusion (267) is provided inside the fixed frame (263), and the fourth fixed column (372) is rotatably mounted on the third gear (46). A sixth slider (373) is slidably mounted inside the fixing frame (263) and the sixth slider (373) slides inside the fixing frame (263) via the seventh protrusion (267); the liquid contacting part (43) comprises a liquid contacting rotating block (431) fixedly mounted on the outer wall of the solder collecting tube (41), a second tooth (432) is fixedly mounted on the bottom end of the liquid contacting rotating block (431), the second tooth (432) is used to mesh with the fourth gear (47), a liquid contacting groove (433) is fixedly mounted on the liquid contacting rotating block (431), and the liquid contacting groove (433) is fixedly mounted on the liquid contacting rotating block (431). 33) is provided with a second liquid leakage port (434) inside, the second liquid leakage port (434) is connected to the first liquid leakage port (412), and a tilting block (435) is provided on the liquid receiving tank (433); the first damping rod (32) and the second damping rod (35) on the direction detection device (3) are extended and retracted to drive the direction transmission member (34) to adjust the angle, thereby detecting the movement direction of the solder collecting tube (41), adjusting the direction through the equidistant transmission member (37), and moving to the right below the pins of the circuit board after soldering, so as to prevent the tin liquid from dripping and causing splashing. ;

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