Control panel integrated gasket, control panel integrated heat dissipation device and vehicle-mounted equipment
By setting up the installation hole and forming a pad on the control board, the lock is locked on the radiator, the risk and cost problem of increasing the increased risk and cost of the cushion and the convex platform in the existing technologies can be solved, and the effect of steady connection and reducing adverse rates is achieved.
Patent Information
- Application Number
- CN202310940558.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2023-07-27
- Publication Date
- 2025-01-28
AI Technical Summary
In the prior art, gaskets increase materials and preparation processes, and there is a risk of misassembly assembly and falling. The machining boss method increases processing costs and processes. The processing burrs are not cleaned and the risk of short circuit failure and sand holes are high. The control board is added. the rate of failure.
Set up a installation hole on the control board, form a pad through the processing process of the patch, and lock it on the heat sink to form a gap to replace the ordinary pads and convex deals, simplify the process and reduce the cost.
A stable connection between the control board and the radiator, reducing the adverse rate and processing costs, while avoiding the risk of the use of pads and convex.
Smart Images

Figure CN119383893A_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of control panel heat dissipation, and in particular to an integrated control panel gasket, an integrated control panel heat dissipation device and a vehicle-mounted device. Background Art
[0002] With the continuous development of science and technology, current vehicle-mounted equipment is highly centralized and modularized. Therefore, some internal electronic components will generate a certain amount of heat in a small and confined space when working. If the heat cannot be dissipated in time, it will indirectly affect the stability and service life of the product.
[0003] Therefore, in order to improve this problem during design, a 0.3mm boss is usually added to the heat sink to achieve the purpose of auxiliary heat dissipation, and the distance between the control board and the heat sink is ensured by machining. There is also a method of adding a gasket between the control board and the heat sink, but the gasket will increase the material and preparation process, and there is a risk of missing assembly and falling. The machining method also requires additional processing on the heat sink, which increases the processing cost and process. In addition, if the processing burrs are not cleaned up properly, short circuit failures will occur. The risk of sand holes after processing is high, which increases the defective rate of the control board.
[0004] Therefore, the existing technology still needs to be improved and developed. Summary of the invention
[0005] The technical problem to be solved by the present invention is that, in response to the above-mentioned defects of the prior art, a control panel integrated gasket, a control panel integrated heat dissipation device and a vehicle-mounted equipment are provided, aiming to solve the problems in the prior art that the gasket will increase the material and preparation process, and there is a risk of missing assembly and falling, and the method of machining the boss will increase the processing cost and process, and the processing burrs are not cleaned properly and short circuit failures may occur. There is a high risk of sand holes after processing, which leads to an increase in the defective rate of the control panel.
[0006] In a first aspect, the present application provides an integrated gasket for a control panel, which adopts the following technical solution:
[0007] A control panel integrated gasket, comprising: a control panel and a radiator,
[0008] The soldering pad of the control board is provided with a mounting hole, and the control board is locked on the radiator through the mounting hole by screws, and the mounting hole is formed into a gasket through a patch processing technology.
[0009] The height of the gasket ranges from 0.3 to 0.5 mm.
[0010] Furthermore, the number of the mounting holes is at least three.
[0011] Furthermore, the mounting holes are used to lock the control board onto the radiator by means of screws.
[0012] In a second aspect, the present application provides a control panel integrated heat dissipation device, which adopts the following technical solution:
[0013] A control panel integrated heat dissipation device comprises a control panel and a radiator. The control panel is provided with the control panel integrated gasket as described above.
[0014] Furthermore, the gap between the control board and the radiator ranges from 0.2 to 0.3 mm.
[0015] Furthermore, a wizard hole is provided on the control panel.
[0016] Furthermore, the height of the wizard hole ranges from 0.3 to 0.4 mm.
[0017] Furthermore, the control board and the heat sink are both grounded.
[0018] In a third aspect, the present application provides a vehicle-mounted device, which adopts the following technical solution:
[0019] A vehicle-mounted device comprises the control panel integrated heat dissipation device as described above.
[0020] Beneficial effects of the present invention: The present invention forms a gap between the control board and the radiator by setting a mounting hole on the control board and forming a certain height after processing, thereby replacing the use of ordinary gaskets and bosses. The process is simple and the cost is low, and the same effect as the gasket and boss can be achieved at the same time. In addition, the design is integrated with the control board, and is not prone to the risk of falling, and no additional processing is added. In addition, the control board and the radiator can be locked together through the mounting hole, which improves the stability between the two. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] Figure 1 It is a structural schematic diagram of a control board of the control board integrated heat dissipation device provided in an embodiment of the present invention.
[0022] Figure 2 It is a side view of the integrated heat dissipation device for a control panel provided in an embodiment of the present invention.
[0023] Figure numerals: 1. control board; 2. mounting hole; 3. gasket; 4. elf hole; 5. radiator; 6. screw. DETAILED DESCRIPTION
[0024] The present invention discloses a control panel integrated gasket, a control panel integrated heat dissipation device and a vehicle-mounted device. In order to make the purpose, technical solution and effect of the present invention clearer and more specific, the present invention is further described in detail with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.
[0025] When the control panel needs to actively dissipate heat, a radiator needs to be installed to assist in the heat dissipation. However, the radiator is generally made of metal and cannot be in full contact with the control panel when in use. Therefore, a gap needs to be left between the control panel and the radiator. Due to the purpose of heat dissipation, the gap distance cannot be too large.
[0026] At present, the commonly used method is to add a 0.3mm boss on the heat sink, but the machining method also requires additional processing on the heat sink, which increases the processing cost and process. In addition, if the processing burrs are not cleaned up properly, it will cause short circuit failures. The risk of sand holes after processing is high, which increases the defective rate of the control board. There is also a method of directly adding a gasket between the control board and the heat sink, but the gasket will increase the material and preparation process, and there is a risk of missing assembly and falling, which is inconvenient to use.
[0027] In order to solve the above problems, the present invention provides a control panel integrated gasket, which is arranged on the control panel 1 of the vehicle-mounted equipment, referring to Figure 1 and Figure 2 ,
[0028] The control board 1 is provided with a mounting hole 2, which is used to lock the control board 1 on the heat sink 5. The mounting hole 2 forms a gasket 3 during the patch processing process.
[0029] In practical applications, the purpose of designing the mounting hole 2 on the control board 1 is to lock the control board 1 on the radiator 5 to prevent the two from separating and ensure stability. The mounting hole 2 can be formed at a certain height during the SMT patch processing in the manufacturing process of the control board 1, thereby achieving a function and effect similar to that of an ordinary gasket. Compared with directly using an ordinary gasket, the design of the present application is integrated with the control board 1, is not easy to fall off, and is directly formed when the control board 1 is tinned in the furnace, does not increase the processing technology and cost, and has great practical value.
[0030] In some embodiments, the number of mounting holes 2 is at least three, which is specifically designed according to actual conditions. Specifically, in the embodiment of the present application, the number is designed to be four. The function of the mounting holes 2 is to lock the control board 1 on the radiator 5. The number of mounting holes 2 is at least three to ensure installation stability. In the embodiment of the present application, screws 6 are used as locking parts. The screws 6 pass through the mounting holes 2 to lock the control board 1 on the radiator 5, which is simple and practical.
[0031] In some embodiments, the height of the gasket 3 is in the range of 0.3 to 0.5 mm.
[0032] In some embodiments, the present invention further provides an integrated heat dissipation device for a control panel 1, referring to Figure 1 and Figure 2 , which comprises: a control board 1 and a radiator 5, wherein the control board 1 is provided with the control board integrated gasket as described above.
[0033] The gap between the control board 1 and the radiator 5 is in the range of 0.2-0.3 mm, which is a relatively safe distance setting, which can ensure that the heat generated by the control board 1 is better transferred out, and will not cause electrical conduction when the two are in contact.
[0034] In some embodiments, the control board 1 is further provided with a wizard hole 4. Specifically, the wizard hole 4 is designed according to actual needs, and soldering is performed around some modules with large heat generation. The embodiment of the present application has four wizard holes 4, mainly around the power module, the conversion module, etc.
[0035] In some embodiments, the height of the elf hole 4 ranges from 0.3 to 0.4 mm. When the control board 1 needs the radiator 5 to assist in heat dissipation, the control board 1 needs to be kept as close as possible to the radiator 5, but not in full contact. In addition to the gasket 3 being able to form a certain height, the elf hole 4 can also assist in forming a gap, and the heights of the gasket 3 and the elf hole 4 are both greater than the distance between the control board 1 and the radiator 5, in order to prevent the pressure generated by the screw 6 when locking, which will press down the tin formed by the gasket 3 and the elf hole 4, so that the control board 1 and the radiator 5 are in contact.
[0036] In some embodiments, the control board 1 and the radiator 5 are both grounded. The control board 1 will generate conducted radiation during operation, and at this time it needs to be grounded to absorb it and improve safety of use, which is also a requirement of circuit design. However, there are multiple networks on the control board 1, and not every network needs to be grounded, but only some specific networks need to be grounded. The present application locks the control board 1 and the radiator 5 by means of screws 6, and also realizes the connection between the control board 1 and the radiator 5, so that the network of the control board 1 that needs to be grounded and the radiator 5 are grounded at the same time. Compared with the use of spring clip connection, the design of the present application is easier to use, and has better stability and heat dissipation performance.
[0037] In some embodiments, the present invention further provides a vehicle-mounted device, comprising the control panel integrated heat dissipation device as described above.
[0038] Compared with the prior art, the present invention has the following advantages:
[0039] 1. The present application forms a gap between the control board 1 and the radiator 5 by setting a mounting hole 2 on the control board 1 and forming a height after a processing process, thereby replacing the use of ordinary gaskets and bosses. The process is simple and the cost is low, and the same effect as ordinary gaskets and bosses can be achieved at the same time. In addition, the design is integrated with the control board, and is not prone to the risk of falling, and does not add additional processing. In addition, the control board 1 and the radiator 5 can be locked together through the mounting hole 2, which improves the stability between the two.
[0040] 2. The design of the elf hole 4 can also assist in forming a gap, and the height of the elf hole 4 is designed to be higher than the target gap to prevent the tin formed by the elf hole 4 from being pressed down under the pressure of the screw 6 locking, causing the control board 1 and the heat sink 5 to contact.
[0041] 3. The control board 1 and the radiator 5 are locked together by screws 6, which not only improves the stability of the two, but also realizes the connection between the two, making it more convenient to ground the control board 1 and the radiator 5 at the same time.
[0042] It should be understood that the application of the present invention is not limited to the above examples. For ordinary technicians in this field, improvements or changes can be made based on the above description. All these improvements and changes should fall within the scope of protection of the claims attached to the present invention.
Claims
1. A control panel integrated gasket, arranged on a control panel of a vehicle-mounted device, characterized in that: include: The control board is provided with a mounting hole, and the mounting hole is used to lock the control board on the radiator, and the mounting hole forms a gasket during the patch processing process.
2. The integrated control panel gasket according to claim 1, characterized in that: The height of the gasket ranges from 0.3 to 0.5 mm.
3. The integrated control panel gasket according to claim 1, characterized in that: The number of the mounting holes is at least three.
4. The integrated control panel gasket according to claim 1, characterized in that: The mounting holes are used to lock the control board onto the radiator through screws.
5. A control panel integrated heat dissipation device, characterized in that: It comprises a control board and a radiator, wherein the control board is provided with an integrated control board gasket as claimed in any one of claims 1 to 4.
6. The integrated heat dissipation device for the control panel according to claim 5, characterized in that: The gap between the control board and the radiator ranges from 0.2 to 0.3 mm.
7. The integrated heat dissipation device for the control panel according to claim 5, characterized in that: The control panel is provided with a wizard hole.
8. The integrated heat dissipation device for the control panel according to claim 7, characterized in that: The height of the wizard hole ranges from 0.3 to 0.4 mm.
9. The integrated heat dissipation device for the control panel according to claim 5, characterized in that: The control board and the heat sink are both grounded.
10. A vehicle-mounted device, characterized in that: It comprises an integrated heat dissipation device for a control panel as described in any one of claims 5-9.