Heat Dissipation Control Method and Device for GOB LED Display Screen
By obtaining the display parameters of the GOB LED display, determining the heat parameters, and selecting the appropriate heat dissipation device and its working method, the problems of low heat dissipation efficiency and high energy consumption are solved, intelligent heat dissipation management is realized, and system performance and safety are improved.
Patent Information
- Application Number
- CN202411572387.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-06
- Publication Date
- 2025-07-25
- Estimated Expiration
- 2044-11-06
AI Technical Summary
Existing GOB LED displays have low heat dissipation efficiency and high cost and energy consumption.
By obtaining display parameters, determining the heat parameters, selecting a suitable heat dissipation device and its working mode according to the correspondence between the heat dissipation device and the heat parameter, and dynamically adjusting the working state of the heat dissipation device to optimize the heat dissipation efficiency.
It realizes intelligence and automation of thermal dissipation management, improves the overall performance and security of the system, extends the service life of the equipment, reduces energy consumption, and improves the user experience.
Smart Images

Figure CN119383915B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of computer technologies, and more particularly, to a heat dissipation control method, apparatus, computer-readable medium, and electronic device for a GOB LED display screen. Background Art
[0002] The Glue On Board (GOB) technology is a special LED display screen encapsulation method. After fixing the LED lamp beads on the PCB (printed circuit board), a special optical heat-conducting nano-level encapsulating material is used to fill the gaps between the lamp beads, forming a tightly connected and highly protected whole. This encapsulation method not only enhances the connection strength between the lamp beads and the PCB board, but also improves the protection performance and heat dissipation ability of the LED display screen. Although the GOB encapsulation technology uses a special optical heat-conducting nano-level encapsulating material, the heat dissipation performance of this material still needs to be continuously optimized. It is necessary to find new materials with better heat dissipation performance and lower cost to improve the heat dissipation efficiency of the GOB LED display screen. However, the existing GOB LED display screens often face the problems of low heat dissipation efficiency, high cost, and high energy consumption. Summary of the Invention
[0003] Embodiments of this application provide a heat dissipation control method, apparatus, computer-readable medium, and electronic device for a GOB LED display screen, which can, to at least some extent, solve the problems of low heat dissipation efficiency, high cost, and high energy consumption.
[0004] Other features and advantages of this application will become apparent through the following detailed description, or be learned in part through the practice of this application.
[0005] According to one aspect of this application, a heat dissipation control method for a GOB LED display screen is provided, including: obtaining display parameters of the GOB LED display screen, where the display parameters include screen size, pixel density, working voltage, brightness information, and display duration; determining a heat parameter for characterizing the current heat state of the display screen according to the display parameters; determining at least one heat dissipation device corresponding to the heat parameter according to the correspondence between the heat dissipation device and the heat parameter; determining a heat dissipation method corresponding to the heat dissipation device by performing heat dissipation fitting on the display screen according to the heat dissipation device; and controlling the heat dissipation device to dissipate heat from the display screen according to the heat dissipation method.
[0006] In this application, based on the foregoing solution, determining the heat parameter used to characterize the current heat state of the display screen according to the display parameter includes: determining the voltage parameter of the display screen according to the working voltage and the rated voltage in the display parameter; determining the brightness parameter used to characterize the brightness state of the display screen according to the brightness information in the display parameter; and determining the heat parameter used to characterize the current heat state of the display screen according to the voltage parameter and the brightness parameter.
[0007] In this application, based on the foregoing solution, determining at least one heat dissipation device corresponding to the heat parameter according to the correspondence between the heat dissipation device and the heat parameter includes: obtaining the preset correspondence between the heat dissipation device and the heat parameter; and determining at least one heat dissipation device corresponding to the heat parameter according to the heat parameter and the correspondence.
[0008] In this application, based on the foregoing solution, performing heat dissipation fitting on the display screen according to the heat dissipation device to determine the heat dissipation method corresponding to the heat dissipation device includes: obtaining the heat dissipation power corresponding to the heat dissipation device; and performing fitting on the heat parameter and the heat dissipation power to determine the heat dissipation method corresponding to the heat dissipation device.
[0009] In this application, based on the foregoing solution, controlling the heat dissipation device to dissipate heat from the display screen according to the heat dissipation method includes: obtaining the working duration and the working mode corresponding to each heat dissipation device in the heat dissipation method; and controlling the heat dissipation device to dissipate heat from the display screen according to the working duration and the working mode.
[0010] In this application, based on the foregoing solution, it further includes: obtaining the temperature data output by the temperature sensor; and dynamically adjusting the working state of the heat dissipation device according to the temperature data.
[0011] In this application, based on the foregoing solution, it further includes: real-time monitoring the operating state of the heat dissipation device, and automatically alarming if an abnormality is found.
[0012] According to one aspect of the present application, there is provided a heat dissipation control device for a GOB LED display screen, including:
[0013] An acquisition unit, configured to acquire the display parameters of the GOB LED display screen, where the display parameters include the screen size, pixel density, working voltage, brightness information, and display duration;
[0014] A parameter unit, configured to determine a heat parameter used to characterize the current heat state of the display screen according to the display parameter;
[0015] A device unit, configured to determine at least one heat dissipation device corresponding to the heat parameter according to the correspondence between the heat dissipation device and the heat parameter;
[0016] A fitting unit, configured to perform heat dissipation fitting on the display screen according to the heat dissipation device, and determine a heat dissipation method corresponding to the heat dissipation device;
[0017] A heat dissipation unit, configured to control the heat dissipation device to dissipate heat from the display screen according to the heat dissipation method.
[0018] In this application, based on the foregoing solution, determining a heat parameter for characterizing the current heat state of the display screen according to the display parameter includes: determining a voltage parameter of the display screen according to the working voltage and the rated voltage in the display parameter; determining a brightness parameter for characterizing the brightness state of the display screen according to the brightness information in the display parameter; and determining a heat parameter for characterizing the current heat state of the display screen according to the voltage parameter and the brightness parameter.
[0019] In this application, based on the foregoing solution, determining at least one heat dissipation device corresponding to the heat parameter according to the correspondence between the heat dissipation device and the heat parameter includes: obtaining a preset correspondence between the heat dissipation device and the heat parameter; and determining at least one heat dissipation device corresponding to the heat parameter according to the heat parameter and the correspondence.
[0020] In this application, based on the foregoing solution, performing heat dissipation fitting on the display screen according to the heat dissipation device and determining a heat dissipation method corresponding to the heat dissipation device includes: obtaining a heat dissipation power corresponding to the heat dissipation device; and performing fitting on the heat parameter and the heat dissipation power to determine a heat dissipation method corresponding to the heat dissipation device.
[0021] In this application, based on the foregoing solution, controlling the heat dissipation device to dissipate heat from the display screen according to the heat dissipation method includes: obtaining a working duration and a working mode corresponding to each heat dissipation device in the heat dissipation method; and controlling the heat dissipation device to dissipate heat from the display screen according to the working duration and the working mode.
[0022] In this application, based on the foregoing solution, it further includes: obtaining temperature data output by a temperature sensor; and dynamically adjusting the working state of the heat dissipation device according to the temperature data.
[0023] In this application, based on the foregoing solution, it further includes: monitoring the running state of the heat dissipation device in real time, and automatically alarming if an abnormality is found.
[0024] According to one aspect of this application, there is provided a computer-readable medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the heat dissipation control method of the GOB LED display screen as described in the above embodiments.
[0025] According to one aspect of the present application, an electronic device is provided, including: one or more processors; a storage device for storing one or more programs, which, when executed by the one or more processors, cause the one or more processors to implement the heat dissipation control method of the GOB LED display screen as described in the above embodiments.
[0026] According to one aspect of the present application, a computer program product or a computer program is provided. The computer program product or the computer program includes computer instructions that are stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, causing the computer device to execute the heat dissipation control method of the GOB LED display screen provided in the above various optional implementation manners.
[0027] In the technical solution of the present application, display parameters of the GOB LED display screen are obtained, and heat parameters corresponding to the current display screen are determined according to the display parameters; at least one heat dissipation device corresponding to the heat parameters is determined according to the corresponding relationship between the heat dissipation device and the heat parameters; a heat dissipation method corresponding to the heat dissipation device is determined according to the heat dissipation fitting of the heat dissipation device to the display screen; and the heat dissipation device is controlled to dissipate heat from the display screen according to the heat dissipation method. By accurately calculating the current heat parameters, it is ensured that the selection of the heat dissipation device matches the actual heat load of the display screen. Determining a suitable heat dissipation device and its working mode according to the heat parameters can optimize the heat dissipation efficiency, avoid overheating of the device, extend the service life, achieve more efficient energy utilization, reduce energy consumption, improve the user experience, and ensure the stability and reliability of the display effect. The intelligent and automatic heat dissipation management is realized, and the overall performance and security of the system are improved.
[0028] It should be understood that the above general description and the following detailed description are only exemplary and explanatory, and cannot limit the present application. BRIEF DESCRIPTION OF THE DRAWINGS
[0029] The accompanying drawings herein are incorporated into the specification and constitute a part of this specification, showing embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application. Obviously, the accompanying drawings in the following description are only some embodiments of the present application, and those of ordinary skill in the art can obtain other drawings based on these drawings without creative efforts.
[0030] Figure 1 Schematically shows a flowchart of the heat dissipation control method of the GOB LED display screen in an embodiment of the present application.
[0031] Figure 2Schematically shows a flowchart for determining a heat parameter in an embodiment of the present application.
[0032] Figure 3 Schematically shows a schematic diagram of a heat dissipation control device for a GOB LED display screen in an embodiment of the present application.
[0033] Figure 4 Shows a schematic structural diagram of a computer system of an electronic device suitable for implementing the embodiments of the present application. Detailed implementation manners
[0034] Now, example embodiments will be described more fully with reference to the accompanying drawings. However, the example embodiments can be implemented in various forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this application will be more complete and comprehensive, and will fully convey the concept of the example embodiments to those skilled in the art.
[0035] In addition, the described features, structures, or characteristics can be combined in any suitable manner in one or more embodiments. In the following description, numerous specific details are provided to give a thorough understanding of the embodiments of the present application. However, those skilled in the art will realize that the technical solutions of the present application can be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, well-known methods, devices, implementations, or operations are not shown or described in detail to avoid obscuring aspects of the present application.
[0036] The block diagrams shown in the drawings are only functional entities and do not necessarily correspond to physically independent entities. That is, these functional entities can be implemented in software form, or in one or more hardware modules or integrated circuits, or in different networks and / or processor devices and / or microcontroller devices.
[0037] The flowcharts shown in the drawings are only illustrative and do not necessarily include all the content and operations / steps, nor are they necessarily executed in the described order. For example, some operations / steps can be decomposed, and some operations / steps can be combined or partially combined, so the actual execution order may change according to the actual situation.
[0038] The implementation details of the technical solutions of the present application are elaborated in detail below:
[0039] Figure 1 Shows a flowchart of a heat dissipation control method for a GOB LED display screen according to an embodiment of the present application. Refer to Figure 1 As shown, the heat dissipation control method for the GOB LED display screen at least includes steps S110 to S150, which are introduced in detail as follows:
[0040] In step S110, obtain the display parameters of the GOB LED display screen, where the display parameters include screen size, pixel density, operating voltage, brightness information, and display duration.
[0041] In an embodiment of the present application, obtaining the display parameters of the GOB LED display screen specifically includes that the display parameters include screen size, pixel density, operating voltage, brightness information, and display duration.
[0042] In an embodiment of the present application, the screen size includes the diagonal size of the display screen, usually in inches. For example, the display screen size is 55 inches. Obtain the operating voltage of the display screen, usually provided by the manufacturer, and common values are 5V, 12V or higher. The brightness information is the brightness of the display screen (unit: nit), which can be obtained through a test device or from the product manual. Record the operating duration of the display screen, usually in hours, which can be obtained through the system log or monitoring software. After collecting the above parameters completely, it can provide a basis for subsequent calculation of the heat parameter and selection of the heat dissipation device.
[0043] In step S120, according to the display parameters, determine the heat parameter used to characterize the current heat state of the display screen.
[0044] As Figure 2 shown, in an embodiment of the present application, according to the display parameters, determining the heat parameter used to characterize the current heat state of the display screen includes:
[0045] S210, according to the operating voltage and rated voltage in the display parameters, determine the voltage parameter of the display screen;
[0046] S220, according to the brightness information in the display parameters, determine the brightness parameter used to characterize the brightness state of the display screen;
[0047] S230, according to the voltage parameter and the brightness parameter, determine the heat parameter used to characterize the current heat state of the display screen.
[0048] In an embodiment of the present application, according to the operating voltage Vol_tim and rated voltage Vol_rea in the display parameters, determine the voltage parameter Par_vol of the display screen as:
[0049]
[0050] where α represents the mode coefficient, which is adjusted according to the usage situation of the screen. For example, different values are set when the screen displays dynamic or static content respectively. It represents the power factor, which takes into account the phase difference between the current and the voltage and is used to affect the actual power calculation. In this embodiment, the voltage parameter is used to represent the difference between the current working voltage and the rated voltage of the display screen, so as to measure the energy consumption of the display screen through the voltage parameter, and further measure the working state of the display screen.
[0051] In an embodiment of the present application, according to the brightness information Bri_tmi, the rated brightness Bri_rae of the display screen, and the ambient light parameter Par_env, the brightness parameter Par_rig is determined as:
[0052]
[0053] Among them, the brightness information represents the actual brightness of the display screen, expressed in candela per square meter (cd / m2). The rated brightness is the reference brightness value, usually the recommended brightness of the display screen under specific conditions. The ambient light parameter represents the illumination intensity of the surrounding environment, which affects the readability and brightness setting of the screen. By calculating the brightness parameter, the relationship between the actual brightness and the standard brightness is adjusted, and combined with the brightness influence under actual use conditions, it helps to evaluate the power consumption and heat generation of the display screen.
[0054] In an embodiment of the present application, according to the screen size A, pixel density ρ, voltage parameter Par_vol, brightness parameter Par_rig, and display duration T in the display parameters, the current corresponding heat parameter of the display screen is determined as:
[0055] Par_hra = ρ·A·Par_vol·Par_rig·log2T
[0056] In the above process, through parameters such as screen area, power density, pixel density, ambient temperature, brightness, and working voltage, the performance and energy efficiency of the display screen can be effectively improved, and at the same time, the user experience can be improved. Dynamically adjusting the brightness to adapt to the ambient light, optimizing the power consumption according to the usage mode, and effectively managing the heat generated during long-term display can all extend the service life of the device and prevent overheating. Considering these factors comprehensively, the heat parameter provides real-time feedback on the operating condition of the device, promoting the development of the thermal management system and fault warning.
[0057] In step S130, according to the corresponding relationship between the heat dissipation device and the heat parameter, at least one heat dissipation device corresponding to the heat parameter is determined.
[0058] In an embodiment of the present application, determining at least one heat dissipation device corresponding to the heat parameter according to the corresponding relationship between the heat dissipation device and the heat parameter includes:
[0059] Obtain the preset corresponding relationship between the heat dissipation device and the heat parameter;
[0060] Determine at least one heat dissipation device corresponding to the heat parameter according to the heat parameter and the corresponding relationship.
[0061] In an embodiment of the present application, characteristics of different heat dissipation devices are collected and recorded in advance, including heat dissipation capacity (such as thermal conductivity, heat dissipation area), applicable power range, working environmental conditions, etc. According to the calculated heat parameter, the range of the heat parameter is divided (such as low, medium, and high heat), and a threshold is set for each range. According to the heat parameter range, a suitable heat dissipation device is mapped. For example: a low heat parameter corresponds to a small fan and a heat conduction fin; a medium heat parameter corresponds to an aluminum radiator and a liquid cooling system; a high heat parameter corresponds to an efficient heat dissipation fan and a liquid cooling device.
[0062] After calculating the heat parameter, determine at least one heat dissipation device corresponding to the heat parameter according to the heat parameter and the corresponding relationship for subsequent heat dissipation control. Through the above steps, a reasonable corresponding relationship can be effectively established between the heat parameter and the heat dissipation device, thus providing support for the thermal management of the device.
[0063] In step S140, perform heat dissipation fitting on the display screen according to the heat dissipation device, and determine the heat dissipation method corresponding to the heat dissipation device.
[0064] In an embodiment of the present application, performing heat dissipation fitting on the display screen according to the heat dissipation device and determining the heat dissipation method corresponding to the heat dissipation device includes:
[0065] Obtain the heat dissipation power corresponding to the heat dissipation device;
[0066] Perform fitting on the heat parameter and the heat dissipation power to determine the heat dissipation method corresponding to the heat dissipation device.
[0067] In an embodiment of the present application, for each heat dissipation device, collect its maximum heat dissipation power, that is, the heat that can be effectively dissipated under specific conditions. Use linear regression to describe the relationship between heat dissipation power, heat parameter, and heat dissipation time. Consider environmental factors, heat dissipation device characteristics, and working conditions during fitting. According to the fitting result, combined with the matching of heat dissipation power and required heat dissipation capacity, determine the duration corresponding to each heat dissipation device in the heat dissipation method.
[0068] In actual use, verify the effectiveness of the selected heat dissipation method by monitoring the heat dissipation effect (such as temperature change). Adjust the heat dissipation method or heat dissipation device according to the actual situation to optimize the heat dissipation performance. Finally, output the heat dissipation power and heat dissipation method corresponding to the heat dissipation device, where the heat dissipation method includes a working mode and a working duration.
[0069] By precisely matching the heat dissipation power with the heat parameters, more efficient heat dissipation can be achieved, avoiding overheating of the device and extending its service life. Optimizing the heat dissipation solution can effectively reduce energy consumption, especially when dynamically adjusting the heat dissipation method, which helps save electricity. It is possible to flexibly select and adjust the heat dissipation method according to specific requirements, enhancing the adaptability of the system and meeting diverse application scenarios. In summary, this process ensures the effectiveness of heat dissipation management through a systematic approach, having a significant positive impact on improving device performance and user satisfaction.
[0070] In step S150, according to the heat dissipation method, control the heat dissipation device to dissipate heat from the display screen.
[0071] In an embodiment of the present application, controlling the heat dissipation device to dissipate heat from the display screen according to the heat dissipation method includes:
[0072] Obtain the working duration and working mode corresponding to each heat dissipation device in the heat dissipation method;
[0073] According to the working duration and working mode, control the heat dissipation device to dissipate heat from the display screen.
[0074] In an embodiment of the present application, obtain the working duration and working mode of each heat dissipation device. Among them, the working duration includes the time of continuous operation after startup, and the working mode may be a constant mode, a variable speed mode, or an intermittent mode. For example, the working duration: automatically turn off the fan after 10 minutes of startup; the working mode: select the low-speed mode of the fan or the constant flow of the liquid cooling system. According to the working duration and working mode, control the heat dissipation device to dissipate heat from the display screen.
[0075] Optionally, monitor the actual working state of the heat dissipation device, compare it with the preset working duration and mode, and ensure that the system operates as expected.
[0076] Optionally, dynamically adjust the working duration and working mode according to the real-time temperature and heat effect. For example, after the temperature drops, switch the fan to the low-speed mode or the liquid cooling system works intermittently.
[0077] Optionally, record the working duration and mode of each heat dissipation device, analyze its impact on the heat dissipation effect, and optimize the control instructions and strategies according to the data.
[0078] Through the above steps, the working duration and mode of the heat dissipation device can be effectively controlled, ensuring that the display screen remains within a safe temperature range and improving the overall heat dissipation efficiency.
[0079] In an embodiment of the present application, it further includes: obtaining the temperature data output by the temperature sensor; dynamically adjusting the working state of the heat dissipation device according to the temperature data.
[0080] In an embodiment of the present application, a temperature sensor is installed to monitor the temperature of the display screen and the surrounding environment in real time, ensuring accurate temperature data acquisition. According to the real-time temperature feedback, the working state of the heat dissipation device is dynamically adjusted to maximize the heat dissipation effect. For example, when the temperature drops, the fan speed is reduced, which saves energy and extends the device life.
[0081] Optionally, a fault monitoring mechanism is set up to detect the working state of the heat dissipation device in a timely manner and issue an alarm when a fault occurs to ensure system safety.
[0082] Optionally, visual feedback of the real-time temperature and heat dissipation status is provided through the user interface to enhance the user experience and control over the device status.
[0083] Through the above steps, the heat dissipation device can be effectively controlled to ensure that the display screen maintains an appropriate temperature in different working environments, improving the performance and stability of the system.
[0084] In an embodiment of the present application, it further includes: monitoring the operating state of the heat dissipation device in real time and automatically alarming if an abnormality is found.
[0085] In an embodiment of the present application, a temperature sensor, a flow sensor, a current sensor, a wind speed sensor, etc. are integrated in the heat dissipation device to monitor key parameters in real time. A data acquisition system is established to regularly read the sensor data and upload it to the central control unit for processing. Thresholds and ranges for normal operation are set. If the sensor data exceeds the set threshold, the alarm mechanism is triggered.
[0086] An alarm mechanism is set up to support multiple alarm methods, including but not limited to: visual alarm: displaying a warning message on the control interface; sound alarm: emitting an alarm sound through a buzzer; remote notification: sending an alarm message to relevant personnel via text message or email.
[0087] When an abnormality occurs, the fault information and relevant data are recorded for subsequent analysis and troubleshooting of the fault cause. According to the set automatic response strategy, the system can automatically adjust the working mode of the heat dissipation device, such as increasing the fan speed or starting a standby heat dissipation device, to cope with abnormal situations. The operating state of the heat dissipation device, including the current temperature, working mode, and alarm status, is updated in real time on the user interface for the user to monitor conveniently.
[0088] Through the above steps, the system can regularly remind the user to perform device maintenance according to the operation duration and status, reducing the possibility of faults. It can achieve real-time monitoring and abnormal alarm of the heat dissipation device, improve the reliability of the system, and ensure that the device operates within a safe range.
[0089] In the technical solution of the present application, display parameters of the GOB LED display screen are obtained, and heat parameters corresponding to the current state of the display screen are determined according to the display parameters; at least one heat dissipation device corresponding to the heat parameters is determined according to the corresponding relationship between the heat dissipation device and the heat parameters; heat dissipation fitting is performed on the display screen according to the heat dissipation device to determine the heat dissipation method corresponding to the heat dissipation device; and the heat dissipation device is controlled to dissipate heat from the display screen according to the heat dissipation method. By accurately calculating the current heat parameters, it is ensured that the selection of the heat dissipation device matches the actual heat load of the display screen. Determining a suitable heat dissipation device and its working mode according to the heat parameters can optimize the heat dissipation efficiency, avoid overheating of the device, extend the service life, achieve more efficient energy utilization, reduce energy consumption, improve the user experience, and ensure the stability and reliability of the display effect. The intelligentization and automation of heat dissipation management are realized, and the overall performance and safety of the system are improved.
[0090] The following introduces the device embodiments of the present application, which can be used to execute the heat dissipation control method of the GOB LED display screen in the above embodiments of the present application. It can be understood that the device can be a computer program (including program code) running in a computer device, for example, the device is an application software; the device can be used to execute the corresponding steps in the method provided by the embodiments of the present application. For details not disclosed in the device embodiments of the present application, please refer to the embodiments of the heat dissipation control method of the GOB LED display screen in the above of the present application.
[0091] Figure 3 The block diagram of the heat dissipation control device of the GOB LED display screen according to an embodiment of the present application is shown.
[0092] Refer to Figure 3 As shown, the heat dissipation control device of the GOB LED display screen according to an embodiment of the present application includes:
[0093] An acquisition unit 310, configured to acquire display parameters of the GOB LED display screen, where the display parameters include screen size, pixel density, operating voltage, brightness information, and display duration;
[0094] A parameter unit 320, configured to determine heat parameters used to characterize the current heat state of the display screen according to the display parameters;
[0095] A device unit 330, configured to determine at least one heat dissipation device corresponding to the heat parameters according to the corresponding relationship between the heat dissipation device and the heat parameters;
[0096] A fitting unit 340, configured to perform heat dissipation fitting on the display screen according to the heat dissipation device to determine the heat dissipation method corresponding to the heat dissipation device;
[0097] A heat dissipation unit 350, configured to control the heat dissipation device to dissipate heat from the display screen according to the heat dissipation method.
[0098] In this application, based on the foregoing solution, determining a heat parameter for characterizing the current heat state of the display screen according to the display parameter includes: determining a voltage parameter of the display screen according to the operating voltage and the rated voltage in the display parameter; determining a brightness parameter for characterizing the brightness state of the display screen according to the brightness information in the display parameter; and determining a heat parameter for characterizing the current heat state of the display screen according to the voltage parameter and the brightness parameter.
[0099] In this application, based on the foregoing solution, determining at least one heat dissipation device corresponding to the heat parameter according to the correspondence between the heat dissipation device and the heat parameter includes: obtaining a preset correspondence between the heat dissipation device and the heat parameter; and determining at least one heat dissipation device corresponding to the heat parameter according to the heat parameter and the correspondence.
[0100] In this application, based on the foregoing solution, performing heat dissipation fitting on the display screen according to the heat dissipation device to determine the heat dissipation method corresponding to the heat dissipation device includes: obtaining the heat dissipation power corresponding to the heat dissipation device; and performing fitting on the heat parameter and the heat dissipation power to determine the heat dissipation method corresponding to the heat dissipation device.
[0101] In this application, based on the foregoing solution, controlling the heat dissipation device to dissipate heat from the display screen according to the heat dissipation method includes: obtaining the working duration and the working mode corresponding to each heat dissipation device in the heat dissipation method; and controlling the heat dissipation device to dissipate heat from the display screen according to the working duration and the working mode.
[0102] In this application, based on the foregoing solution, it further includes: obtaining temperature data output by a temperature sensor; and dynamically adjusting the working state of the heat dissipation device according to the temperature data.
[0103] In this application, based on the foregoing solution, it further includes: monitoring the operating state of the heat dissipation device in real time, and automatically alarming if an abnormality is found.
[0104] In the technical solution of this application, the display parameters of the GOB LED display screen are obtained, and the current corresponding heat parameter of the display screen is determined according to the display parameters; at least one heat dissipation device corresponding to the heat parameter is determined according to the corresponding relationship between the heat dissipation device and the heat parameter; heat dissipation fitting is performed on the display screen by the heat dissipation device to determine the heat dissipation method corresponding to the heat dissipation device; and the heat dissipation device is controlled to dissipate heat from the display screen according to the heat dissipation method. By accurately calculating the current heat parameter, it is ensured that the selection of the heat dissipation device matches the actual heat load of the display screen. Determining a suitable heat dissipation device and its working mode according to the heat parameter can optimize the heat dissipation efficiency, avoid overheating of the device, extend the service life, achieve more efficient energy utilization, reduce energy consumption, improve the user experience, and ensure the stability and reliability of the display effect. The intelligent and automatic heat dissipation management is realized, and the overall performance and safety of the system are improved.
[0105] Figure 4 The structural schematic diagram of a computer system of an electronic device suitable for implementing the embodiments of the present application is shown.
[0106] It should be noted that the computer system 400 of the electronic device shown in the figure is only an example, and should not bring any limitation to the functions and usage scopes of the embodiments of the present application.
[0107] Among them, the computer system 400 includes a central processing unit (CPU) 401, which can perform various appropriate actions and processes according to the program stored in the read-only memory (ROM) 402 or the program loaded from the storage part 408 into the random access memory (RAM) 403, such as executing the method described in the above embodiments. In the RAM 403, various programs and data required for system operation are also stored. The CPU 401, ROM 402, and RAM 403 are connected to each other through a bus 404. The input / output (I / O) interface 405 is also connected to the bus 404.
[0108] The following components are connected to the I / O interface 405: an input section 406 including a keyboard, a mouse, etc.; an output section 407 including such as a cathode ray tube (CRT), a liquid crystal display (LCD), etc. and a speaker, etc.; a storage section 408 including a hard disk, etc.; and a communication section 409 including a network interface card such as a LAN (Local Area Network) card, a modem, etc. The communication section 409 performs communication processing via a network such as the Internet. A drive 410 is also connected to the I / O interface 405 as required. A removable medium 411, such as a magnetic disk, an optical disk, a magneto-optical disk, a semiconductor memory, etc., is mounted on the drive 410 as required so that a computer program read therefrom is installed into the storage section 408 as required.
[0109] Specifically, according to an embodiment of the present application, the processes described above with reference to the flowcharts can be implemented as computer software programs. For example, an embodiment of the present application includes a computer program product, which includes a computer program carried on a computer-readable medium, and the computer program includes a computer program for executing the method shown in the flowchart. In such an embodiment, the computer program can be downloaded and installed from the network through the communication section 409, and / or installed from the removable medium 411. When the computer program is executed by a central processing unit (CPU) 401, various functions defined in the system of the present application are executed.
[0110] It should be noted that the computer-readable medium shown in the embodiments of the present application may be a computer-readable signal medium, a computer-readable storage medium, or any combination of the two. A computer-readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination of the above. More specific examples of a computer-readable storage medium may include, but are not limited to: an electrical connection having one or more wires, a portable computer disk, a hard disk, a random access memory (RAM), a read-only memory (ROM), an erasable programmable read-only memory (EPROM), a flash memory, an optical fiber, a portable compact disc read-only memory (CD-ROM), an optical storage device, a magnetic storage device, or any suitable combination of the above. In the present application, a computer-readable storage medium may be any tangible medium that contains or stores a program, and this program can be used by or in combination with an instruction execution system, apparatus, or device. In the present application, a computer-readable signal medium may include a data signal propagated in a baseband or as part of a carrier wave, which carries a computer-readable computer program. Such a propagated data signal may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the above. A computer-readable signal medium may also be any computer-readable medium other than a computer-readable storage medium, and this computer-readable medium can send, propagate, or transmit a program for use by or in combination with an instruction execution system, apparatus, or device. The computer program contained on the computer-readable medium can be transmitted using any appropriate medium, including but not limited to: wireless, wired, etc., or any suitable combination of the above.
[0111] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present application. Among them, each block in the flowchart or block diagram may represent a module, a program segment, or a part of code, and the above module, program segment, or part of code contains one or more executable instructions for implementing the specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram or flowchart, and the combination of blocks in the block diagram or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.
[0112] The units involved in the embodiments described in this application can be implemented in software or in hardware, and the described units can also be provided in a processor. In some cases, the names of these units do not constitute a limitation on the unit itself.
[0113] According to one aspect of the present application, there is provided a computer program product or a computer program, the computer program product or the computer program including computer instructions, the computer instructions being stored in a computer-readable storage medium. A processor of a computer device reads the computer instructions from the computer-readable storage medium, and the processor executes the computer instructions, so that the computer device executes the methods provided in the above various alternative implementation manners.
[0114] As another aspect, the present application further provides a computer-readable medium, which may be included in the electronic device described in the above embodiments; or may exist separately without being assembled into the electronic device. The above computer-readable medium carries one or more programs, and when the one or more programs are executed by an electronic device, the electronic device implements the methods described in the above embodiments.
[0115] It should be noted that although several modules or units of a device for action execution are mentioned in the above detailed description, such a division is not mandatory. In fact, according to the embodiments of the present application, the features and functions of the two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.
[0116] Through the description of the above embodiments, those skilled in the art can easily understand that the example embodiments described herein can be implemented by software or by a combination of software and necessary hardware. Therefore, the technical solutions according to the embodiments of the present application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, including several instructions to enable a computing device (such as a personal computer, a server, a touch terminal, or a network device, etc.) to execute the methods according to the embodiments of the present application.
[0117] After considering the specification and practicing the disclosed embodiments herein, those skilled in the art will readily conceive of other embodiments of the present application. The present application is intended to cover any variations, uses, or adaptations of the present application, which follow the general principles of the present application and include known common general knowledge or conventional technical means in the technical field not disclosed in the present application.
[0118] It should be understood that the present application is not limited to the exact structures described above and shown in the drawings, and various modifications and changes can be made without departing from its scope. The scope of the present application is only limited by the appended claims.
Claims
1. A heat dissipation control method for a GOB LED display screen, characterized in that, including: Obtain the display parameters of the GOB LED display screen, where the display parameters include screen size, pixel density, operating voltage, brightness information, and display duration; Determine a heat parameter used to characterize the current heat state of the display screen according to the display parameters; Determine at least one heat dissipation device corresponding to the heat parameter according to the correspondence between the heat dissipation device and the heat parameter; Perform heat dissipation fitting on the display screen according to the heat dissipation device, and determine the heat dissipation method corresponding to the heat dissipation device; Control the heat dissipation device to dissipate heat from the display screen according to the heat dissipation method.
2. The method according to claim 1, wherein Determine a heat parameter used to characterize the current heat state of the display screen according to the display parameters, including: Determine the voltage parameter of the display screen according to the operating voltage and rated voltage in the display parameters; Determine a brightness parameter used to characterize the brightness state of the display screen according to the brightness information in the display parameters; Determine a heat parameter used to characterize the current heat state of the display screen according to the voltage parameter and the brightness parameter.
3. The method according to claim 1, characterized in that Determine at least one heat dissipation device corresponding to the heat parameter according to the correspondence between the heat dissipation device and the heat parameter, including: Obtain the preset correspondence between the heat dissipation device and the heat parameter; Determine at least one heat dissipation device corresponding to the heat parameter according to the heat parameter and the correspondence.
4. The method according to claim 1, wherein Perform heat dissipation fitting on the display screen according to the heat dissipation device, and determine the heat dissipation method corresponding to the heat dissipation device, including: Obtain the heat dissipation power corresponding to the heat dissipation device; Perform fitting on the heat parameter and the heat dissipation power, and determine the heat dissipation method corresponding to the heat dissipation device.
5. The method according to claim 1, wherein Control the heat dissipation device to dissipate heat from the display screen according to the heat dissipation method, including: Obtain the working duration and working mode corresponding to each heat dissipation device in the heat dissipation method; Control the heat dissipation device to dissipate heat from the display screen according to the working duration and working mode.
6. The method according to claim 1, wherein It also includes: Obtain the temperature data output by the temperature sensor; Dynamically adjust the working state of the heat dissipation device according to the temperature data.
7. The method according to claim 1, characterized in that, It also includes: Real-time monitor the operating state of the heat dissipation device, and automatically alarm if any abnormality is found.
8. A heat dissipation control device for a GOB LED display screen, characterized in that, including: An acquisition unit for obtaining the display parameters of the GOB LED display screen, where the display parameters include screen size, pixel density, operating voltage, brightness information, and display duration; A parameter unit for determining a heat parameter used to characterize the current heat state of the display screen according to the display parameters; A device unit for determining at least one heat dissipation device corresponding to the heat parameter according to the correspondence between the heat dissipation device and the heat parameter; A fitting unit for performing heat dissipation fitting on the display screen according to the heat dissipation device, and determining the heat dissipation method corresponding to the heat dissipation device; A heat dissipation unit for controlling the heat dissipation device to dissipate heat from the display screen according to the heat dissipation method.
9. A computer-readable medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the heat dissipation control method of the GOB LED display screen as described in any one of claims 1 to 7.
10. An electronic device, characterized in that, including: One or more processors; A storage device for storing one or more programs, which when executed by the one or more processors, cause the one or more processors to implement the heat dissipation control method of the GOB LED display screen according to any one of claims 1 to 7.
Citation Information
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