LED support and LED support manufacturing method

Abstract

The LED support comprises a plurality of pins, a cup body is arranged on the pins, the pins are exposed out of the bottom face of the cup body and are flush with the cup body, the exposed sides of the pins are used for making contact with a circuit board, the pins are close to one another to form a functional area, and a silver coating is arranged at the position, corresponding to a window of the cup body, of the functional area. A tin coating is arranged on one side, deviating from the cup body, of each pin; the pins of the LED support are exposed out of the bottom face of the cup body and are flush with the bottom face of the cup body, so that the pins are designed to be flat pins, the size of the LED support is further reduced, the silver plating layer is arranged at the position, corresponding to the window of the cup body, of the functional area, the conductivity can be improved, meanwhile, the silver plating cost is reduced, and through the pair of the functional area, the service life of the LED support is prolonged. The tin plating layer is arranged on the side, away from the cup body, of the pin, the tin plating layer has good electrical conductivity and thermal conductivity, the use of the silver element is further reduced, the cost is further reduced, when the tin plating layer is used for welding the pin and the circuit board, an operator can directly heat the tin plating layer, and the process is simplified.

Description

Technical Field

[0001] The invention belongs to the technical field of LED brackets, and in particular to an LED bracket and a method for manufacturing the LED bracket. Background Art

[0002] LED (Light Emitting Diode) is a semiconductor electronic component that emits light when current passes through it. Its working principle is based on the electroluminescent effect of semiconductor materials. LED has the advantages of high efficiency, long life and low power consumption, and is widely used in display screens, lighting, indicator lights and other electronic devices. In order to improve the overall performance of LED brackets, electroplating is usually required in the processing technology, that is, a thin layer of other metals or alloys is plated on the metal surface to prevent metal oxidation, improve conductivity or other functions.

[0003] In the patent document "CN 109161944 A", the technical solution of "An LED bracket and an LED bracket manufacturing method" is as follows: a pre-silver-plated layer is plated on the entire surface of the nickel-plated LED bracket substrate; the LED bracket substrate plated with the pre-silver-plated layer is placed on a silver-plating mold to expose a preset functional area, and a selected silver-plated layer is plated in the preset functional area.

[0004] It can be seen that the patent solution first silver-plates the entire surface of the LED bracket substrate for the first time, and then silver-plates the preset functional area for the second time. This patent uses a large number of silver layers, which increases the cost. When the LED bracket substrate is welded to the circuit board, it is necessary to use a soldering iron and solder wire for welding, and the process is cumbersome. Summary of the invention

[0005] The object of the present invention is to provide an LED bracket and a method for manufacturing the LED bracket to solve the problems raised in the above background technology.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] An LED bracket comprises a plurality of pins, a cup body is arranged on a plurality of the pins, a plurality of the pins are exposed from the bottom surface of the cup body and are flush with the bottom surface of the cup body, the exposed side of the pins is used to contact with a circuit board, the pins are close to each other to form a functional area, a silver-plated layer is arranged at a position of the functional area corresponding to a window of the cup body, and a tin-plated layer is arranged on a side of the pin away from the cup body.

[0008] According to a further technical solution, the side surface of the pin is flush with the side surface of the cup body, and the side surface of the pin and the side surface of the cup body are provided with anti-reflective plastic, and the anti-reflective plastic is used to prevent the side surface of the pin from reflecting light.

[0009] A method for manufacturing an LED bracket comprises the following steps:

[0010] Step 1: stamping the metal material to obtain the pin;

[0011] Step 2: A shielding member is provided to cover the upper surface of the pin;

[0012] Step 3: electroplating the pins for the first time, including: cleaning the pins, and tinning the cleaned pins: placing the cleaned pins in a primary electrolytic cell, plating a tin layer in an alkaline environment, and using a flame gun to evenly spray the surface of the tin layer after air drying to make it melt, and naturally cooling after homogenization to form a tin layer structure;

[0013] Step 4: First injection molding: remove the shielding member, seal the pin in the injection mold 1, inject liquid thermosetting material into the injection mold 1, and heat the injection mold 1 so that the thermosetting material is solidified on the pin to obtain a plastic body; the thermosetting material is SMC material and is liquid at room temperature;

[0014] Step 5: electroplating the pin for the second time, including: using the shielding member to cover the tin-plated layer of the pin, placing the pin shielding the tin-plated layer into a secondary electrolytic cell, plating a silver-plated layer in an alkaline environment, and using a flame gun to evenly spray the surface of the silver-plated layer after air drying to make it tend to melt, and naturally cooling after homogenization to form a silver-plated layer;

[0015] Step 6: Cutting off the redundant pins along the side of the plastic body, so that the side of the pins is flush with the side of the plastic body, forming a semi-finished LED bracket;

[0016] Step 7: Perform a second injection molding, remove the shielding piece, seal the semi-finished LED bracket in the second injection mold, inject the liquid thermosetting material into the second injection mold, and heat the second injection mold so that the thermosetting material forms anti-reflective plastic at both ends of the plastic body;

[0017] Step 8: Cut off the excess.

[0018] According to a further technical solution, in step three, the pins are cleaned, including electrolytic degreasing of the pins, including washing the pins with water and then using the pins as anodes to remove oil stains on the surfaces of the pins through oxidation reaction; the pins are pickled and activated, including: placing the cleaned pins in an acid solution to remove an oxide layer or impurities generated when the pins are electrolytically degreased, and immersing the pins in an activation solution for activation.

[0019] According to a further technical solution, the thickness of the tin-plated layer and the silver-plated layer are set to 6-12 μm and 10-18 μm respectively.

[0020] A further technical solution is to place the cleaned pins into a primary electrolytic cell for tinning, including

[0021] S1: prepare electroplating tin solution;

[0022] S2: pouring the electroplating tin solution into an electroplating tank, and installing the tin alloy and the pin;

[0023] S3: connecting the pin to the negative pole of the power supply, and connecting the tin alloy to the positive pole of the power supply;

[0024] S4, adjusting the tin ion concentration and current density of the electroplating tin solution according to the thickness of the tin layer;

[0025] S5: applying electricity in the electroplating tank to reduce the tin ions on the surface of the pin to form a uniform tin plating layer;

[0026] A further technical solution is to place the cleaned pins into a primary electrolytic cell for tinning, including

[0027] S1: preparing electroless plating solution;

[0028] S2: pouring the electroless plating solution into the plating tank;

[0029] S3: Control the solution temperature, pH value and treatment time according to the thickness of the tin layer;

[0030] S4: immersing the pin in an electroless plating solution;

[0031] According to a further technical solution, in the first injection molding step, after the thermosetting material is injected, the pressure in the cavity of the injection mold is maintained at 8 kPa to 9 kPa.

[0032] According to a further technical solution, in the injection molding step, after injecting the thermosetting material, the injection mold is heated to 130° C. to 140° C.

[0033] Beneficial effects of the present invention:

[0034] The pins of the novel LED bracket provided by the present invention are exposed from the bottom surface of the cup body and are flush with the bottom surface of the cup body, so that the pins are designed as "flat feet". The volume of the LED bracket is further reduced by using the pins. A silver-plated layer is provided at the position of the cup body window corresponding to the functional area, which can reduce the silver plating cost while improving the conductivity. Through the alignment of the functional areas, a tin-plated layer is provided on the side of the pin away from the cup body. The tin-plated layer has good conductivity and thermal conductivity, further reducing the use of silver elements, thereby reducing costs. When the tin-plated layer is used to weld the pins to the circuit board, the operator can directly heat them, thereby simplifying the process.

[0035] Other features and advantages of the present invention will be described in detail in the following detailed description. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 : A top view of the LED support structure of the present invention.

[0037] Figure 2 : A bottom view of the LED support structure of the present invention.

[0038] Figure 3 : A cross-sectional view of the LED support structure of the present invention.

[0039] Figure 4 : LED bracket manufacturing flow chart of the present invention.

[0040] Reference numerals: 1, pin; 2, cup body; 3, functional area; 4, anti-reflective plastic DETAILED DESCRIPTION

[0041] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the accompanying drawings in the embodiments of the present invention.

[0042] Please refer to Figure 1-4 ;

[0043] An LED bracket includes a plurality of pins 1, a cup body 2 is arranged on one side of the plurality of pins 1, the inner diameter of the side of the cup body 2 close to the pins 1 is smaller than the inner diameter of the side away from the pins 1, so that the opening of the cup body 2 is trumpet-shaped, thereby concentrating the light emitted by the LED chip, thereby improving the brightness; in this embodiment, the plurality of pins 1 include a common pin and three control pins, and the control pins are electrically connected to an external control panel, thereby enabling an operator to control the control pins on the external control panel; in this embodiment, the pins 1 are arranged horizontally, and four pins 1 are exposed from the bottom surface of the cup body 2 and are flush with the bottom surface of the cup body 2, so that the exposed part of the pins 1 can directly contact the circuit board, thereby conducting current to the LED chip, that is, the pins 1 adopt a "flat foot" design, and the flat foot design can effectively reduce the overall volume of the package bracket, that is, the LED chip is powered by directly contacting the circuit board through the side of the pin 1 away from the cup body 2, which is conducive to the thinness of the display or other products composed of RGB LEDs, the traditional "C"-shaped package foot will partially protrude from the side wall of the package bracket, and the pin 1 is easy to break when bent, and the flat foot design makes the package bracket smoother after being attached to the board;

[0044] In this embodiment, four pins 1 are close to each other to form a functional area 3. In order to further reduce the silver-plated area on the pins 1, a silver-plated layer is provided at the position of the window of the functional area 3 corresponding to the cup body 2. The thickness of the silver-plated layer is set to 10-18μm. In this embodiment, the thickness of the silver-plated layer is preferably 15μm. In this embodiment, the bottom surface of the cup body 2 where several pins 1 are injected is a closed curve type, and the bottom surface of the cup body 2 is preferably a four-sided curve, so that the silver-plated area is a four-sided curve; a tin-plated layer is provided on the side of the pin 1 away from the cup body 2, and the thickness of the tin-plated layer is 6-12μm. In this embodiment, it is preferably 8μm. The 8μm tin-plated layer can improve the welding performance and ensure the reliability and durability of the solder joint on the one hand; on the other hand, it can further reduce the contact resistance and improve the conductive performance.

[0045] In actual use, the operator needs to cut off the excess pin 1 after injection molding the cup body 2, so that the side of the pin 1 is flush with the side of the cup body 2. However, the side of the pin 1 after cutting will be reflective. In order to solve the problem of pin 1 reflection, anti-reflective plastic 4 is provided on the side of the pin 1 and the side of the cup body 2. The anti-reflective plastic 4 can prevent the side of the pin 1 from being reflective. During specific injection molding, the excess pin 1 is cut off according to the side of the cup body 2, and then the cup body 2 after the pin 1 is cut off is injection molded for the second time, so that the side of the pin 1 and the side of the cup body 2 are injection molded with anti-reflective plastic 4, so that the anti-reflective plastic 4 can prevent the side of the pin 1 from reflecting. Then a second cutting is performed, and the excess plastic is cut off and then packaged. In some embodiments, the height of the anti-reflective plastic 4 is 0.2mm-0.3mm, and in this embodiment, it is preferably 0.25mm. The height of the cup body 22 is 0.4mm-0.6mm, and in this embodiment, it is preferably 0.53mm.

[0046] The present invention also discloses a method for manufacturing an LED bracket, comprising the steps of:

[0047] Step 1: stamping the metal material to obtain the pin 1;

[0048] Step 2: A shielding member is provided to cover the upper surface of the pin 1;

[0049] Step 3: electroplating the pin 1 for the first time, including: cleaning the pin 1, and tinning the cleaned pin 1: placing the cleaned pin 1 in a primary electrolytic cell, plating a tin layer in an alkaline environment, and using a flame gun to evenly spray the surface of the tin layer after air drying to make it tend to melt, and naturally cooling after homogenization to form a tin layer structure;

[0050] Step 4: First injection molding: remove the shielding member, seal the pin 1 in the injection mold 1, inject liquid thermosetting material into the injection mold 1, and heat the injection mold 1 so that the thermosetting material is solidified on the pin 1 to obtain a plastic body; the thermosetting material is SMC material and is liquid at room temperature;

[0051] Step 5: electroplating the pin 1 for the second time, including: using the shielding member to cover the tin-plated layer of the pin 1, placing the pin 1 shielding the tin-plated layer into a secondary electrolytic cell, plating a silver-plated layer in an alkaline environment, and using a flame gun to evenly spray the surface of the silver-plated layer after air drying to make it tend to melt, and naturally cooling after homogenization to form a silver-plated layer;

[0052] Step 6: Cut off the redundant pins 1 along the side of the plastic body, so that the side of the pins 1 is flush with the side of the plastic body, forming a semi-finished LED bracket;

[0053] Step 7: Perform the second injection molding, remove the shielding piece, seal the semi-finished LED bracket in the second injection mold, inject the liquid thermosetting material into the second injection mold, and heat the second injection mold so that the thermosetting material forms an anti-reflective plastic 4 at both ends of the plastic body;

[0054] Step 8: Cut off the excess.

[0055] In some embodiments, the pin 1 is cleaned, including electrolytic degreasing of the pin 1, including pre-treating the pin 1, dividing the pin 1 into a heavily contaminated pin 1 and a lightly contaminated pin 1, performing preliminary cleaning of the heavily contaminated pin 1 with an alkaline cleaning agent to remove coarse dirt and grease on the surface, rinsing the heavily contaminated pin 1 and the lightly contaminated pin 1 after preliminary cleaning in clean water, preparing a suitable electrolytic degreasing solution, wherein the commonly used electrolytic degreasing solution components include a sodium hydroxide solution and a surfactant, and preparing an electrolytic device, heating the electrolytic degreasing solution to 70° C., immersing the pin 1 in the electrolytic degreasing solution, and applying electricity to remove the oil on the surface of the pin 1 through an oxidation reaction;

[0056] The pin 1 is pickled and activated, including: placing the cleaned pin 1 in an acid solution to remove the oxide layer or impurities generated when the pin 1 is electrolytically degreasing, and then immersing the pickled pin 1 in the activation solution for 1 minute and then taking it out. During the activation process, the solution temperature and activation time are monitored to ensure uniform surface activation.

[0057] In some embodiments, the cleaned pin 1 is placed in a primary electrolytic cell for tinning, including

[0058] S1: preparing an electroplating solution. The electroplating tin solution of this embodiment may include tin chloride, sulfuric acid or nitric acid, and additives. In this embodiment, a tin chloride solution is used for electroplating;

[0059] S2: pour the electroplating solution into the electroplating tank and install the anode. In this embodiment, a tin alloy is used as the anode, and the substrate to be electroplated, i.e., the pin 1 covering the upper surface, is installed as the anode. Considering that the concentration of the electroplating solution has an effect on the thickness of the tin on the pin 1, a tin ion concentration detection device is inserted into the electroplating tank to detect the tin ion concentration in real time, and the tin ion concentration detection device is electrically connected to an external controller, so that the external controller can detect the tin ion concentration signal and transmit the signal to the reminder to send a signal when the tin ion concentration signal is low;

[0060] S3: Connect pin 1 to the negative pole of the power supply and the tin alloy to the positive pole of the power supply. At this time, in order to make the thickness of the tin layer meet the process requirements, the current size needs to be controlled and the current size needs to be reflected to the controller in real time;

[0061] S4, adjusting the electroplating time and current density according to the required thickness of the tin layer on the pin 1;

[0062] S5: Power is applied to the electroplating tank to reduce the tin ions on the surface of the pin 1 to form a uniform tin plating layer;

[0063] In addition, for placing the cleaned pin 1 into the primary electrolytic cell for tinning, a detection process is also included, that is, measuring the thickness of the tin plating layer after the first electroplating of the pin 1 is completed, and determining the thickness of the tin plating layer at a temperature of 25 degrees Celsius in turn, as shown in the following table:

[0064] Current density (A / dm²) Tin ion concentration (g / L) Tin coating thickness (um) First experiment 0.5 25 0.76 Second experiment 0.8 28 0.80 The third experiment 1.2 30 0.91

[0065] It can be seen from the above table that when the current density is 0.8A / dm² and the tin ion concentration is 28g / L, the thickness of the tin-plated layer is 0.80um, which best meets the process requirements. The 8μm tin-plated layer can improve the welding performance and ensure the reliability and durability of the solder joints; it can further reduce the contact resistance, improve the conductivity, and make the LED bracket corrosion-resistant.

[0066] In some other embodiments, placing the cleaned pin 1 into a primary electrolytic cell for tinning may also include:

[0067] S1: preparing an electroless plating solution, the main components of which are a reducing agent and a stabilizer. In this embodiment, the reducing agent is preferably a sodium hypophosphite solution;

[0068] S2: pouring sodium hypophosphite solution into the electroplating tank;

[0069] S3: Control the solution temperature, pH value and treatment time according to the thickness of the tin layer;

[0070] S4: Immerse the pin 1 covering the upper surface in a sodium hypophosphite solution;

[0071] In this embodiment, in step 4, after injecting the thermosetting material, the pressure in the cavity of the injection mold 1 is maintained at 8kPa to 9kPa. In order to prevent bubbles or voids from forming during the solidification of the SMC material, the SMC material is thermoset under a preset pressure by maintaining the pressure. For example, in this embodiment, the preset pressure is 8.5kPa. In other embodiments, the preset pressure may also be 8kPa, 8.2kPa, or 8.8kPa, or other values ​​within the range of 8kPa to 9kPa.

[0072] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0073] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementations that can be understood by those skilled in the art.

Claims

1. An LED bracket, comprising a plurality of pins (1), characterized in that: A cup body (2) is arranged on a plurality of the pins (1); a plurality of the pins (1) are exposed from the bottom surface of the cup body (2) and are flush therewith; the exposed side of the pins (1) is used to contact the circuit board; the pins (1) are close to each other to form a functional area (3); a silver-plated layer is provided at a position of the functional area (3) corresponding to a window of the cup body (2); and a tin-plated layer is provided on a side of the pins (1) facing away from the cup body (2).

2. The LED bracket according to claim 1, characterized in that: The side surface of the pin (1) is flush with the side surface of the cup body (2); the side surface of the pin (1) and the side surface of the cup body (2) are provided with anti-reflective plastic (4); the anti-reflective plastic (4) is used to prevent the side surface of the pin (1) from reflecting light.

3. The LED bracket according to claim 1, characterized in that: The thickness of the tin-plated layer and the silver-plated layer are set to 6-12 μm and 10-18 μm respectively.

4. A method for manufacturing an LED bracket, characterized in that: step: Step 1: stamping the metal material to obtain a pin (1); Step 2: A shielding member is provided to cover the upper surface of the pin (1); Step 3: electroplating the pin (1) for the first time, including: cleaning the pin (1), and tinning the cleaned pin (1): placing the cleaned pin (1) in a primary electrolytic cell, plating a tin layer in an alkaline environment, air-drying the pin, and evenly spraying the surface of the tin layer with a flame gun to make it melt, and naturally cooling the pin after homogenization to form a tin layer structure; Step 4: First injection molding: remove the shielding member, seal the pin (1) in the injection mold 1, inject liquid thermosetting material into the injection mold 1, and heat the injection mold 1 so that the thermosetting material is solidified on the pin (1) to obtain a plastic body; the thermosetting material is SMC material and is liquid at room temperature; Step 5: performing a second electroplating on the pin (1), comprising: using the shielding member to cover the tin-plated layer of the pin (1), placing the pin (1) shielding the tin-plated layer into a secondary electrolytic cell, plating a silver-plated layer in an alkaline environment, air-drying the pin, using a flame gun to evenly spray the surface of the silver-plated layer to make it melt, and naturally cooling the silver-plated layer after homogenization to form a silver-plated layer; Step 6: Cutting off the redundant pins (1) along the side of the plastic body, so that the side of the pins (1) is flush with the side of the plastic body, thereby forming a semi-finished LED bracket; Step 7: Perform a second injection molding, remove the shielding piece, seal the semi-finished LED bracket in the second injection mold, inject liquid thermosetting material into the second injection mold, and heat the second injection mold so that the thermosetting material forms anti-reflective plastic (4) at both ends of the plastic body; Step 8: Cut off the excess.

5. The method for manufacturing an LED bracket according to claim 4, characterized in that: In step 3, the pin (1) is cleaned, including electrolytic degreasing of the pin (1), including washing the pin (1) with water and then using the pin (1) as an anode to remove oil stains on the surface of the pin (1) through oxidation reaction; The pin (1) is pickled and activated, comprising: placing the cleaned pin (1) in an acid solution to remove an oxide layer or impurities generated when the pin (1) is electrolytically degreased, and immersing the pin (1) in an activation solution for activation.

6. The method for manufacturing an LED bracket according to claim 4, characterized in that: Placing the cleaned pin (1) into a primary electrolytic bath for tinning includes: S1: prepare electroplating tin solution; S2: pouring the electroplating tin solution into an electroplating tank, and installing the tin alloy and the pin (1); S3: connecting the pin (1) to the negative electrode of a power source, and connecting the tin alloy to the positive electrode of the power source; S4, adjusting the tin ion concentration and current density of the electroplating tin solution according to the thickness of the tin layer; S5: Passing electricity through the electroplating tank to reduce the tin ions on the surface of the lead (1) to form a uniform tin plating layer.

7. The method for manufacturing an LED bracket according to claim 4, characterized in that: Placing the cleaned pin (1) into a primary electrolytic bath for tinning includes: S1: preparing electroless plating solution; S2: pouring the electroless plating solution into the plating tank; S3: Control the solution temperature, pH value and treatment time according to the thickness of the tin layer; S4: Immerse the lead (1) in an electroless plating solution.

8. The method for manufacturing an LED bracket according to claim 4, characterized in that: In the first injection molding step, after the thermosetting material is injected, the pressure in the cavity of the injection mold is maintained at 8 kPa to 9 kPa.

9. The method for manufacturing an LED bracket according to claim 4, characterized in that: In the injection molding step, after the thermosetting material is injected, the injection mold is heated to 130° C. to 140° C.

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