A robot structure for wafer processing

Abstract

The present invention relates to the field of wafer processing technology, and specifically, to a manipulator structure for wafer processing. The telescopic mechanism includes a hydraulic telescopic rod, a fixed chassis and an adsorption component. The adsorption component is fixedly mounted on the lower surface of the fixed chassis and is adjusted to rise and fall on the lower surface of one side of the support arm through the hydraulic telescopic rod; the rotating mechanism includes a gear ring disc, a connecting block, a sliding rod, a connecting rod and a glue injection and alcohol spraying detection component. The sliding rod is fixedly mounted on the lower surface of the connecting block, and the connecting rod is fixedly sleeved on the lower surface of the sliding rod. The glue injection and alcohol spraying detection component is fixedly mounted on the lower surface of the connecting block through the connecting rod, and rotates with the connecting block on the surface of the gear ring disc; a detection table is fixedly mounted on the upper surface of the fixed plate, and the upper surface of the detection table corresponds vertically to the lower surface of the adsorption component. Only a manipulator is needed to quickly complete the loading and unloading and flatness detection of the wafer suction cup, which simplifies the process and improves the work efficiency of the flatness detection of the wafer suction cup.

Description

Technical Field

[0001] The invention relates to the technical field of wafer processing, and in particular to a manipulator structure used for wafer processing. Background Art

[0002] At a time when the semiconductor industry is booming, wafers, as the basic core components of integrated circuits, have a processing and manufacturing process that covers many precise and complex processes such as lithography, etching, coating, and grinding, which places strict requirements on the degree of automation, precision control, and stability of the processing equipment.

[0003] At present, in the process of processing the wafer suction cup, it is usually necessary to fix the wafer suction cup on the flatness inspection table to keep it stable. However, since the wafer suction cup is made of aluminum, the magnetic suction method cannot fix the wafer suction cup. The aluminum material itself is relatively soft. If a mechanical clamping method is used, it may cause damage to the wafer suction cup during the clamping process. Therefore, it is necessary to manually apply glue around the outer surface of the inspection platform to fix the wafer suction cup on the upper surface of the inspection table. After the inspection is completed, alcohol is manually sprayed again to dissolve the glue, and finally the inspected wafer suction cup is removed from the upper surface of the inspection table. Multiple processes are required, and manual glue coating and alcohol spraying are greatly limited, and uneven glue coating is prone to occur. During the inspection process, the wafer suction cup shifts, the alcohol spraying is not comprehensive, and part of the glue adheres to the outer surface of the inspection table, resulting in damage to the wafer suction cup during the removal process, affecting the work efficiency of the wafer suction cup flatness inspection. Summary of the invention

[0004] The object of the present invention is to provide a robot structure for wafer processing to solve the problems raised in the above background technology.

[0005] To achieve the above object, the present invention aims to provide a robot structure for wafer processing, comprising a base, a telescopic mechanism, a rotating mechanism and a fixed plate;

[0006] A rotating shaft is fixedly mounted on the upper surface of the base, a rotating rod is fixedly sleeved on the upper surface of the rotating shaft, a supporting arm is fixedly mounted on the upper surface of the rotating rod, and a fixing piece is fixedly mounted on one side of the upper surface of the supporting arm;

[0007] The telescopic mechanism includes a hydraulic telescopic rod, a fixed chassis and an adsorption component. The adsorption component is fixedly mounted on the lower surface of the fixed chassis and is raised and lowered on the lower surface of one side of the support arm through the hydraulic telescopic rod.

[0008] The rotating mechanism comprises a gear ring disc, a connecting block, a sliding rod, a connecting rod and a glue injection and alcohol spraying detection assembly, wherein the sliding rod is fixedly mounted on the lower surface of the connecting block, the connecting rod is fixedly sleeved on the lower surface of the sliding rod, the glue injection and alcohol spraying detection assembly is fixedly mounted on the lower surface of the connecting block through the connecting rod, and rotates on the surface of the gear ring disc along with the connecting block;

[0009] A detection platform is fixedly installed on the upper surface of the fixed plate, and the upper surface of the detection platform corresponds vertically to the lower surface of the adsorption component.

[0010] As a further improvement of the technical solution, the telescopic mechanism includes a hydraulic cylinder, which is fixedly mounted on the upper surface of the fixing member, and a hydraulic sleeve rod is fixedly mounted on the lower surface of the fixing member, and the hydraulic telescopic rod is telescopically sleeved on the lower surface of the hydraulic sleeve rod;

[0011] The adsorption assembly includes a mounting part, which is fixedly installed on the lower surface of the fixed chassis. Mounting rods are fixedly installed around the lower surface of the mounting part. A Bernoulli suction cup is fixedly installed on the lower surface of the mounting rod. An air injection pipe is fixedly installed at the center position of the upper surface of the Bernoulli suction cup. Through grooves are opened around the surface of the Bernoulli suction cup, and an air outlet is opened at the center position of the lower surface of the Bernoulli suction cup.

[0012] As a further improvement of the present technical solution, support discs are fixedly installed around the lower surface of the hydraulic sleeve, and sliding grooves are opened around the bottom surface of the support disc. The glue injection and alcohol spraying detection assembly includes a colloid storage box, one side of the surface of the colloid storage box is fixedly connected to the connecting rod, and alcohol storage boxes and electronic levels are fixedly installed on both sides of the surface of the colloid storage box. A glue spraying port is opened on the lower surface of the colloid storage box, and a spraying port is opened on the lower surface of the alcohol storage box. Control valves are fixedly installed on the lower surfaces of the colloid storage box and the alcohol storage box, and a probe is provided on one side of the surface of the electronic level. A connecting piece is fixedly connected to the outer surface of the gear ring disc, and a drive motor is fixedly installed on one side of the surface of the hydraulic sleeve, and the output shaft of the drive motor is fixedly connected to a shaft rod, and a drive gear is fixedly sleeved on the lower surface of the shaft rod.

[0013] As a further improvement of the technical solution, the Bernoulli suction cup is rotated and adjusted on the surface of the detection table through a rotating shaft and a supporting arm.

[0014] As a further improvement of the technical solution, the Bernoulli suction cup is raised and lowered on the surface of the testing table by a hydraulic telescopic rod.

[0015] As a further improvement of the technical solution, the glue spraying port and the spraying port are distributed on the side outer wall of the detection table, and are rotated and adjusted on the side outer wall of the detection table through the gear ring disk and the connecting block.

[0016] As a further improvement of the technical solution, a controller and a displacement sensor are installed on the surface of the colloid storage box and the alcohol storage box. The controller adjusts the control valve to control the glue spray port and the spray port.

[0017] As a further improvement of the present technical solution, the driving motor is running, the shaft drives the driving gear to rotate, the gear ring disc is rotatably sleeved on the outer surface of the hydraulic sleeve rod, and the driving gear is meshed and rotated with the gear ring disc. The connecting block is fixedly connected to one side of the lower surface of the gear ring disc. When the gear ring disc rotates, the connecting block is synchronously driven to rotate. Since the slide rod rotates synchronously with the connecting block through the slide groove, and the colloid storage box, alcohol storage box and electronic level are rotatably sleeved on the lower surface of the slide rod through the connecting rod, the colloid storage box, alcohol storage box and electronic level are driven to rotate synchronously. The diameter of the gear ring disc is larger than the diameter of the Bernoulli suction cup and the test bench, so that the glue spray port, spray port and probe are distributed on the outer surface of the test bench.

[0018] As a further improvement of the technical solution, the probe surface and the upper surface of the detection platform correspond in parallel.

[0019] Compared with the prior art, the present invention has the following beneficial effects:

[0020] 1. The robot structure for wafer processing uses an air injection pipe to transmit external air to the air outlet position, and the air circulates through the through slot. The air outlet position has a fast air circulation speed, which causes the air pressure to drop, while the air circulation speed around the through slot is slow, and the air pressure rises, forming a pressure difference, which sucks the wafer suction cup to the low-pressure area, so that the wafer suction cup can be adsorbed without direct contact, and the wafer suction cup is placed on the surface of the inspection table to avoid squeezing and grabbing the surface of the wafer suction cup, thereby reducing the problem of damage to the surface of the wafer suction cup.

[0021] 2. The manipulator structure for wafer processing, after the wafer suction cup is adsorbed and placed on the upper surface of the inspection table by the Bernoulli suction cup, the glue spray port is first used to spray glue on the outer wall of the inspection table surface, and a layer of glue is applied to the bottom of the wafer suction cup to fix it. At the same time, the probe surface is arranged to be parallel to the upper surface of the inspection table, and the surface of the wafer suction cup fixed on the upper surface of the inspection table is subjected to a rotational flatness detection. When the detection is completed, the spray port is used to spray alcohol on the glue coating position to dissolve the glue. Finally, the wafer suction cup that has completed the flatness detection is removed from the upper surface of the inspection table by the Bernoulli suction cup, and placed in the qualified / unqualified area. Only the manipulator is needed to quickly complete the loading and unloading and flatness detection of the wafer suction cup, which simplifies the process and improves the work efficiency of the flatness detection of the wafer suction cup. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 It is a schematic diagram of the connection structure of the rotating shaft, the supporting arm and the fixing member of the present invention;

[0023] Figure 2 It is a schematic diagram of the telescopic mechanism structure of the present invention;

[0024] Figure 3It is a schematic diagram of the through groove and the air outlet connection structure of the present invention;

[0025] Figure 4 It is a schematic diagram of the structure of the rotating mechanism of the present invention;

[0026] Figure 5 It is a schematic diagram of the connection structure between the gear ring disk and the driving gear of the present invention;

[0027] Figure 6 It is a schematic diagram of the connection structure of the hydraulic sleeve rod, the support disc and the gear ring disc of the present invention;

[0028] Figure 7 for Figure 6 A schematic diagram of the enlarged structure at A in the middle;

[0029] Figure 8 It is a schematic diagram of the connection structure of the connecting rod, the colloid storage box, the alcohol storage box and the electronic level meter of the present invention;

[0030] Fig. 9 for Figure 8 A schematic diagram of the enlarged structure at B in the middle;

[0031] Fig.10 It is a schematic diagram of the connection structure of the colloid storage box, the alcohol storage box, the electronic level and the control valve of the present invention;

[0032] The meaning of each number in the figure is:

[0033] Base; 101, rotating shaft; 102, rotating rod; 103, supporting arm; 104, fixing member;

[0034] 200, telescopic mechanism; 201, hydraulic cylinder; 202, hydraulic sleeve rod; 203, hydraulic telescopic rod; 204, fixed chassis; 205, mounting piece; 206, mounting rod; 207, Bernoulli suction cup; 208, air injection pipe; 209, through groove; 210, air outlet;

[0035] 300, rotating mechanism; 301, supporting disc; 302, gear ring disc; 303, connecting piece; 304, connecting block; 305, driving motor; 306, slide groove; 307, slide rod; 308, connecting rod; 309, colloid storage box; 310, alcohol storage box; 311, electronic level; 312, probe; 313, control valve; 314, glue spraying port; 315, spraying port; 316, shaft rod; 317, driving gear;

[0036] 400. Fixing plate; 401. Testing table. DETAILED DESCRIPTION

[0037] The following will be combined with the accompanying drawings in the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0038] See also Figure 1-Figure 10 As shown, the purpose of this embodiment is to provide a manipulator structure for wafer processing, including a base 100, a telescopic mechanism 200, a rotating mechanism 300 and a fixed plate 400; a rotating shaft 101 is fixedly installed on the upper surface of the base 100, a rotating rod 102 is fixedly sleeved on the upper surface of the rotating shaft 101, a supporting arm 103 is fixedly installed on the upper surface of the rotating rod 102, and a fixing member 104 is fixedly installed on one side of the upper surface of the supporting arm 103; the telescopic mechanism 200 includes a hydraulic telescopic rod 203, a fixed chassis 204 and an adsorption component, the adsorption component is fixedly installed on the lower surface of the fixed chassis 204, and is hydraulically telescopic. The rod 203 is raised and lowered and adjusted on the lower surface of one side of the support arm 103; the rotating mechanism 300 includes a gear ring disc 302, a connecting block 304, a sliding rod 307, a connecting rod 308 and a glue injection and alcohol spraying detection component, the sliding rod 307 is fixedly installed on the lower surface of the connecting block 304, the connecting rod 308 is fixedly sleeved on the lower surface of the sliding rod 307, the glue injection and alcohol spraying detection component is fixedly installed on the lower surface of the connecting block 304 through the connecting rod 308, and rotates on the surface of the gear ring disc 302 with the connecting block 304; a detection table 401 is fixedly installed on the upper surface of the fixed plate 400, and the upper surface of the detection table 401 is vertically corresponding to the lower surface of the adsorption component.

[0039] By driving the rotating shaft 101, the rotating rod 102 and the supporting arm 103 are driven to rotate and adjust, and the telescopic mechanism 200 and the adsorption assembly fixedly installed under the fixing part 104 are first moved to the lower surface of the wafer suction cup. When the suction cup assembly is vertically corresponding to the lower surface of the wafer suction cup, the hydraulic telescopic rod 203 drives the adsorption assembly to move downward, and the upper surface of the wafer suction cup is adsorbed on the surface of the adsorption assembly, and is moved and placed on the upper surface of the inspection table 401. The rotating mechanism 300 is used to drive the glue injection and alcohol spraying detection assembly to rotate on the lower surface of the inspection table 401, and the surface of the inspection table 401 is coated with glue all around, so that the wafer suction cup is fixed on the upper surface of the inspection table 401, and the flatness of the surface of the wafer suction cup is detected. After the detection is completed, the surface of the inspection table 401 is sprayed with alcohol all around to dissolve the glue, and then the suction cup assembly is used to remove the wafer suction cup that has completed the flatness detection from the upper surface of the inspection table 401, and finally placed in the qualified / unqualified area.

[0040] Therefore, based on the above structure, combined with Figure 2As shown, the structure of the telescopic mechanism 200 is further disclosed. The telescopic mechanism 200 includes a hydraulic cylinder 201, which is fixedly mounted on the upper surface of the fixing member 104, a hydraulic sleeve rod 202 is fixedly mounted on the lower surface of the fixing member 104, and a hydraulic telescopic rod 203 is telescopically sleeved on the lower surface of the hydraulic sleeve rod 202.

[0041] Furthermore, when the support arm 103 and the fixing part 104 drive the telescopic mechanism 200 to move until the small surface of the wafer suction cup is vertical, the hydraulic cylinder 201 is started to make the hydraulic telescopic rod 203 telescope and adjust on the lower surface of the hydraulic sleeve rod 202, so that the adsorption assembly descends to the upper surface of the wafer suction cup.

[0042] Therefore, based on the above structure, combined with Figure 2-Figure 3 As shown, the structure of the adsorption component is further disclosed, the adsorption component includes a mounting member 205, the mounting member 205 is fixedly mounted on the lower surface of the fixed chassis 204, the mounting member 205 is fixedly mounted with mounting rods 206 around the lower surface of the mounting member 205, a Bernoulli suction cup 207 is fixedly mounted on the lower surface of the mounting rod 206, an air injection pipe 208 is fixedly mounted at the center of the upper surface of the Bernoulli suction cup 207, through grooves 209 are opened around the surface of the Bernoulli suction cup 207, and an air outlet 210 is opened at the center of the lower surface of the Bernoulli suction cup 207.

[0043] Furthermore, when the adsorption assembly descends to the upper surface of the wafer suction cup, the gas injection pipe 208 is provided to transmit the gas transmitted from the outside to the position of the gas outlet 210, and a rapid gas flow is generated in the vertical direction of the lower surface of the gas outlet 210, and the through groove 209 provided can generate gas flow around the outer surface of the gas outlet 210, but the flow speed is slower than the position of the gas outlet 210, so that the gas pressure at the vertical position below the gas outlet 210 is lower than the gas pressure around the through groove 209, effectively allowing the wafer suction cup to rise upward;

[0044] It should be noted that the increase in air flow velocity will cause the air pressure flowing through the gap to decrease, thus forming a low-pressure area between the suction cup and the object. The relatively high pressure of the surrounding air will suck the object into the low-pressure area, so that the object can be adsorbed without direct contact. This is the Bernoulli principle and is a prior art.

[0045] according to Figure 4 and Figure 8 It can be seen that the through groove 209 is opened to penetrate the outer surface of the Bernoulli suction cup 207. The upper surface of the Bernoulli suction cup 207 is connected to a support member, and the support member is fixedly connected to the mounting rod 206 to fix the ring on the outer surface of the through groove 209 so that the ring and the Bernoulli suction cup 207 are integrated.

[0046] Therefore, based on the above structure, combined with Figure 4-Figure 10As shown, the structure of the glue injection and alcohol spraying detection component is further disclosed. A support disc 301 is fixedly installed around the lower surface of the hydraulic sleeve 202, and a slide groove 306 is opened around the bottom surface of the support disc 301. The glue injection and alcohol spraying detection component includes a colloid storage box 309, one side of the surface of the colloid storage box 309 is fixedly connected to the connecting rod 308, and alcohol storage boxes 310 and electronic levels 311 are fixedly installed on both sides of the surface of the colloid storage box 309. The lower surface of the colloid storage box 309 is opened with a glue spraying port 310. 14. A spray port 315 is provided on the lower surface of the alcohol storage tank 310, a control valve 313 is fixedly installed on the lower surfaces of the colloid storage tank 309 and the alcohol storage tank 310, a probe 312 is provided on one side of the surface of the electronic level 311, a connecting piece 303 is fixedly connected to a circle on the outer surface of the gear ring disk 302, a driving motor 305 is fixedly installed on one side of the surface of the hydraulic sleeve rod 202, the output shaft of the driving motor 305 is fixedly connected to a shaft rod 316, and a driving gear 317 is fixedly sleeved on the lower surface of the shaft rod 316.

[0047] Furthermore, after the Bernoulli suction cup 207 adsorbs the wafer suction cup, it is moved to the upper surface of the test table 401 through the support arm 103 and the fixing part 104, the Bernoulli suction cup 207 is closed, and the wafer suction cup is placed on the upper surface of the test table 401, and the drive motor 305 is started, and the shaft 316 drives the drive gear 317 to rotate. Since the upper side of the gear ring disk 302 is provided with teeth, it meshes and rotates with the drive gear 317. The lower side of the gear ring disk 302 is cylindrical and is fixedly connected to the connecting block 304. When the gear ring disk 302 rotates, it can synchronously drive the connecting block 304 to rotate on the outer side of the lower surface of the gear ring disk 302, and drive the sliding rod 307 and the connecting rod 308 to rotate synchronously on the lower surface of the slide groove 306. The level 311 is fixedly installed on one side of the surface of the Bernoulli suction cup 207 through the connecting rod 308, and the connecting rod 308 is rotatably sleeved on the lower surface of the sliding rod 307, so that the alcohol storage box 310, the alcohol storage box 310 and the electronic level 311 can be synchronously rotated on the outer surface of the detection table 401 through the connecting rod 308, and the controller and the control valve 313 are used to control the glue spray port 314 and the spray port 315. First, the glue spray port 314 is used to apply glue on all sides of the surface of the detection table 401, and the wafer suction cup is fixed on the upper surface of the detection table 401. Then, the probe 312 is used to perform a rotational flatness test on the surface of the wafer suction cup. When the test is completed, the spray port 315 is finally used to spray alcohol to dissolve the glue, and the wafer suction cup that has been tested is removed from the upper surface of the detection table 401.

[0048] The diameter of the toothed ring disk 302 is larger than the diameter of the Bernoulli suction cup 207 and the test platform 401, so that the alcohol storage box 310, the alcohol storage box 310 and the electronic level 311 are arranged on the outer surface of the test platform 401, and the glue spray port 314 and the spray port 315 correspond to the outer surface of the test platform 401. The support chassis 301 is fixedly installed on the lower surface of the fixing part 104 through the connecting part 303, and is fixedly sleeved on the lower surface of the hydraulic sleeve 202.

[0049] Displacement sensors are installed on the surfaces of the colloid storage box 309 and the alcohol storage box 310. When the colloid storage box 309 and the alcohol storage box 310 rotate on the outer surface of the testing table 401, the displacement sensor feeds back signals to the controller (Note: the model of the controller is Omron ZS-LDC41). The controller issues a command to first let the control valve 313 open the glue spray port 314 to apply glue. After the wafer suction cup is fixed on the upper surface of the testing table 401, the set electronic level 311 performs flatness detection on the surface of the wafer suction cup. Finally, after the detection is completed, the controller issues another command to let the control valve 313 open the spray port 315 to spray alcohol to dissolve the glue.

[0050] To sum up, the working principle of the present scheme is as follows: the operation of the rotating shaft 101 can drive the rotating rod 102 to rotate, so that the support arm 103 and the fixing part 104 drive the telescopic mechanism 200 and the Bernoulli suction cup 207 fixedly installed below to rotate and adjust, and the lower surface of the Bernoulli suction cup 207 and the upper surface of the wafer suction cup are vertically aligned, and the air injection pipe 208 is used to transmit the outside air to the air outlet 210 position, and the air circulates through the through groove 209. The air pressure at the air outlet 210 position decreases due to the fast air circulation speed, while the air circulation speed around the through groove 209 is slow, and the air pressure rises, forming a pressure difference between them, sucking the wafer suction cup to the low-pressure area, so that the wafer suction cup can be adsorbed without direct contact, and the wafer suction cup is placed on the surface of the inspection table 401 to avoid squeezing and grabbing the surface of the wafer suction cup, thereby reducing the problem of damage to the surface of the wafer suction cup.

[0051] After the Bernoulli suction cup 207 adsorbs the wafer suction cup and places it on the upper surface of the detection table 401, the driving motor 305 is started, and the shaft 316 drives the driving gear 317 to rotate. Since the upper side of the gear ring disk 302 is provided with teeth, it meshes and rotates with the driving gear 317. The lower side of the gear ring disk 302 is cylindrical and fixedly connected to the connecting block 304. When the gear ring disk 302 rotates, it can synchronously drive the connecting block 304 to rotate on the outer side of the lower surface of the gear ring disk 302, and synchronously drive the sliding rod 307 and the connecting rod 308 to rotate synchronously on the surface of the slide groove 306. Since the lower surface of the connecting rod 308 is fixedly connected to the colloid storage box 309, the alcohol storage box 310 and the electronic level 311, and the opened glue spray port 314 and the spray port 315 correspond to the surface of the detection table 401. The outer wall of the test table 401 is sprayed with glue by the controller and the control valve 313, and a layer of glue is applied to the bottom of the wafer suction cup to fix it. At the same time, the surface of the probe 312 is parallel to the upper surface of the test table 401, and the surface of the wafer suction cup fixed on the upper surface of the test table 401 is subjected to a rotational flatness test. When the test is completed, the spray port 315 sprays alcohol on the glue coating position to dissolve the glue. Finally, the wafer suction cup that has completed the flatness test is removed from the upper surface of the test table 401 through the Bernoulli suction cup 207 and placed in the qualified / unqualified area. Only a robot is needed to quickly complete the loading and unloading and flatness test of the wafer suction cup, thereby simplifying the process and improving the work efficiency of the flatness test of the wafer suction cup.

[0052] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. The above embodiments and descriptions are only preferred examples of the present invention and are not intended to limit the present invention. Without departing from the spirit and scope of the present invention, the present invention may have various changes and improvements, which fall within the scope of the present invention. The scope of protection of the present invention is defined by the attached claims and their equivalents.

Claims

1. A robot structure for wafer processing, characterized in that: It comprises a base (100), a telescopic mechanism (200), a rotating mechanism (300) and a fixing plate (400); A rotating shaft (101) is fixedly mounted on the upper surface of the base (100); a rotating rod (102) is fixedly sleeved on the upper surface of the rotating shaft (101); a supporting arm (103) is fixedly mounted on the upper surface of the rotating rod (102); and a fixing member (104) is fixedly mounted on one side of the upper surface of the supporting arm (103); The telescopic mechanism (200) comprises a hydraulic telescopic rod (203), a fixed chassis (204) and an adsorption component; the adsorption component is fixedly mounted on the lower surface of the fixed chassis (204) and is raised and lowered and adjusted on the lower surface of one side of the support arm (103) through the hydraulic telescopic rod (203); The rotating mechanism (300) comprises a gear ring disc (302), a connecting block (304), a sliding rod (307), a connecting rod (308) and a glue injection and alcohol spraying detection component, wherein the sliding rod (307) is fixedly mounted on the lower surface of the connecting block (304), the connecting rod (308) is fixedly sleeved on the lower surface of the sliding rod (307), and the glue injection and alcohol spraying detection component is fixedly mounted on the lower surface of the connecting block (304) via the connecting rod (308), and rotates on the surface of the gear ring disc (302) along with the connecting block (304); A detection platform (401) is fixedly mounted on the upper surface of the fixed plate (400), and the upper surface of the detection platform (401) corresponds vertically to the lower surface of the adsorption component; The telescopic mechanism (200) comprises a hydraulic cylinder (201), wherein the hydraulic cylinder (201) is fixedly mounted on the upper surface of a fixing member (104), a hydraulic sleeve rod (202) is fixedly mounted on the lower surface of the fixing member (104), and the hydraulic telescopic rod (203) is telescopically sleeved on the lower surface of the hydraulic sleeve rod (202); A support disc (301) is fixedly mounted around the lower surface of the hydraulic sleeve (202), and a slide groove (306) is provided around the bottom surface of the support disc (301). The glue injection and alcohol spraying detection component comprises a colloid storage box (309), one side of the surface of the colloid storage box (309) is fixedly connected to the connecting rod (308), and both sides of the surface of the colloid storage box (309) are fixedly mounted with an alcohol storage box (310) and an electronic level (311), and a glue spraying port (314) is provided on the lower surface of the colloid storage box (309). A spraying port (315) is provided on the surface, a control valve (313) is fixedly installed on the lower surface of the colloid storage box (309) and the alcohol storage box (310), a probe (312) is provided on one side of the surface of the electronic level (311), a connecting piece (303) is fixedly connected to one circle of the outer surface of the toothed ring disk (302), a driving motor (305) is fixedly installed on one side of the surface of the hydraulic sleeve rod (202), the output shaft of the driving motor (305) is fixedly connected to a shaft rod (316), and a driving gear (317) is fixedly sleeved on the lower surface of the shaft rod (316).

2. The robot structure for wafer processing according to claim 1, characterized in that: The adsorption assembly comprises a mounting member (205), the mounting member (205) being fixedly mounted on the lower surface of a fixed chassis (204), mounting rods (206) being fixedly mounted around the lower surface of the mounting member (205), a Bernoulli suction cup (207) being fixedly mounted on the lower surface of the mounting rod (206), an air injection pipe (208) being fixedly mounted at the center position of the upper surface of the Bernoulli suction cup (207), through grooves (209) being provided around the surface of the Bernoulli suction cup (207), and an air outlet (210) being provided at the center position of the lower surface of the Bernoulli suction cup (207).

3. The robot structure for wafer processing according to claim 2, characterized in that: The Bernoulli suction cup (207) is rotated and adjusted on the upper surface of the detection platform (401) via the rotating shaft (101) and the supporting arm (103).

4. The robot structure for wafer processing according to claim 2, characterized in that: The Bernoulli suction cup (207) is raised and lowered on the upper surface of the detection platform (401) by means of a hydraulic telescopic rod (203).

5. The robot structure for wafer processing according to claim 1, characterized in that: The glue spraying port (314) and the spraying port (315) are distributed on the side outer wall of the detection platform (401), and are rotatably adjusted on the side outer wall of the detection platform (401) through the gear ring disk (302) and the connecting block (304).

6. The robot structure for wafer processing according to claim 1, characterized in that: A controller and a displacement sensor are installed on the surfaces of the colloid storage box (309) and the alcohol storage box (310); the controller adjusts the control valve (313) to control the glue spraying port (314) and the spraying port (315).

7. The robot structure for wafer processing according to claim 6, characterized in that: The driving motor (305) is running, the shaft (316) drives the driving gear (317) to rotate, the gear ring disc (302) is rotatably sleeved on the outer surface of the hydraulic sleeve rod (202), and the driving gear (317) and the gear ring disc (302) are meshed and rotated, and the connecting block (304) is fixedly connected to one side of the lower surface of the gear ring disc (302). When the gear ring disc (302) rotates, the connecting block (304) is synchronously driven to rotate. Since the sliding rod (307) rotates synchronously with the connecting block (304) through the sliding groove (306), The colloid storage box (309), the alcohol storage box (310) and the electronic level (311) are rotatably sleeved on the lower surface of the slide bar (307) via a connecting rod (308), thereby driving the colloid storage box (309), the alcohol storage box (310) and the electronic level (311) to rotate synchronously. The diameter of the toothed ring disk (302) is larger than the diameter of the Bernoulli suction cup (207) and the detection table (401), so that the glue spraying port (314), the spraying port (315) and the probe (312) are distributed on the outer surface of the detection table (401).

8. The robot structure for wafer processing according to claim 7, characterized in that: The surface of the probe (312) corresponds to the upper surface of the detection platform (401) in parallel.

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