Industrial computer-based humidity monitoring and control system and monitoring and control method

Abstract

The present application provides a humidity monitoring and control system and a monitoring and control method based on an industrial computer. The first temperature module detects the temperature value inside the industrial computer in real time as the first measurement value; the measured first measurement value is compared with a preset temperature threshold. When the temperature value exceeds the threshold, the system starts the cooling and dehumidification module. The cooling and dehumidification module starts to inhale external air and performs cooling and dehumidification processing. The treated air is blown into the installation space, lowering the internal temperature and reducing humidity at the same time. By controlling the temperature and humidity, it ensures that the internal electronic components operate in the best working environment. The cooling and dehumidification module effectively avoids the short circuit and corrosion problems caused by moisture entering during the heat dissipation process of traditional industrial computers, and enhances the reliability of the equipment in humid environments. Real-time monitoring of temperature and humidity, and automatic control of cooling and dehumidification ensure that the equipment works stably for a long time, thereby extending the service life of the industrial computer.

Description

Technical Field

[0001] The present application relates to the field of industrial computers, and in particular to a humidity monitoring and control system and a monitoring and control method based on industrial computers. Background Art

[0002] Industrial PCs (IPCs) are computers designed and manufactured specifically for industrial environments. Compared to standard consumer-grade computers, IPCs differ significantly in structure, performance, reliability, and durability. They are typically used in manufacturing, automation, transportation, energy, healthcare, and other environments requiring high stability and durability.

[0003] Industrial computers are used in humid production environments. Moisture can enter the device through the fan openings. Therefore, many industrial computers adopt a fanless design and use a passive heat dissipation structure (such as an aluminum alloy casing as a heat sink). This passive heat dissipation structure can lead to high internal temperatures, causing internal components of the industrial computer to malfunction due to high temperatures.

[0004] Using fans for heat dissipation, however, can lead to high humidity (e.g., during the return of the south wind) and moisture entering the industrial computer as the fan dissipates heat. This moisture can condense on the circuit boards. Because water is conductive, this can cause short circuits between circuit boards, disrupting normal electrical signal transmission and even causing the entire system to fail. Moisture vapor is particularly prone to accumulating in the small gaps between electronic components, increasing the risk of short circuits.

[0005] Secondly, moisture accelerates oxidation and corrosion of metal parts on electronic components, connectors, and circuit boards. Common metals such as copper and aluminum are prone to oxidation in humid environments. The resulting oxides reduce electrical conductivity, leading to poor contact and performance degradation.

[0006] Corrosion not only damages circuit components but also affects the reliability of electronic connections, causing system instability or even failure.

[0007] In high humidity environments, the insulation materials inside industrial computers may absorb moisture, causing their insulation performance to degrade. This can cause current to "leak" between electronic components, affecting the normal operation of the system and leading to electrical failures.

[0008] In a humid environment, the dielectric strength of the circuit will decrease and the electrical insulation capability will deteriorate, increasing the risk of equipment breakdown failure.

[0009] A Chinese patent application, CN112965559B, discloses a humidity monitoring and control system and method for industrial computers. This method utilizes a desiccant placed inside the industrial computer to absorb moisture from the air inside the computer, achieving a drying effect. However, in hot and humid weather, the temperature inside the computer is high, and the desiccant's water absorption is significantly affected by temperature. This results in poor dehumidification, resulting in high humidity inside the industrial computer and making it inconvenient to use.

[0010] Secondly, many desiccants release a certain amount of heat during the moisture absorption process. When the desiccant absorbs moisture, the local temperature may rise, especially in a confined space. This temperature rise may affect the desiccant's ability to continue absorbing moisture, further increasing the temperature in the industrial computer and weakening the desiccant's moisture absorption capacity.

[0011] In the process of using existing semiconductor cooling chips for cooling, a water-absorbing desiccant is generally placed at the air inlet, and then the semiconductor cooling chip is placed at the air outlet of the fan to cool the air blown into the industrial computer by the fan. This cooling method has the following problems:

[0012] The cooling effect of the semiconductor refrigeration chip cannot adjust the power of the semiconductor refrigeration chip according to the temperature, cooling effect, and dehumidification effect, so it cannot better cool the industrial computer.

[0013] If the semiconductor cooler is kept running at high power for a long time, while the cooling effect may be better, the power consumption of the semiconductor cooler will increase significantly during the long-term high-power operation. This will not only reduce the energy efficiency of the equipment, but may also cause the overall power consumption of the industrial computer to exceed the standard.

[0014] During extended periods of high power operation, the temperature at the cold end of the refrigeration unit will continue to drop, while the temperature at the hot end will rise. This accumulated temperature difference can prevent the hot end from dissipating heat quickly enough, causing heat to be transferred back to the cold end. This ultimately reduces the cooling effect and can even prevent the cold end from cooling any further, affecting the overall cooling performance of the system.

[0015] If the air inside an industrial computer is overcooled, the water vapor in the air may condense into droplets, which in turn increases the humidity inside the equipment and affects the humidity control effect, thereby increasing the risk of short circuits and corrosion of electronic components.

[0016] When the cold end temperature is too low, water vapor in the air can quickly condense, forming condensate. Even if the system is initially cooled by the refrigeration fins, any remaining water vapor in the air can condense into droplets at low temperatures and adhere to circuit boards or other electronic components. This increases the risk of short circuits and can even cause corrosion damage.

[0017] Prolonged high-power operation of the cooling fins can cause the internal temperature to drop too quickly, potentially increasing the relative humidity inside the industrial computer system. Although the temperature drops, the humidity level doesn't adjust in time, leading to condensation inside the equipment. This defeats the purpose of lowering humidity, but instead, moisture forms due to the excessively low temperature, compromising humidity control effectiveness. Summary of the Invention

[0018] In view of this, it is necessary to provide an industrial computer-based humidity monitoring and control system and a monitoring and control method to solve the above problems.

[0019] The embodiment of the present application provides an industrial computer-based humidity monitoring and control system, which is applied to humidity defects caused by the heat dissipation process of industrial computers. The industrial computer-based humidity monitoring and control system includes:

[0020] The industrial computer body has an installation space formed therein, and the installation space is provided with electronic components;

[0021] A first temperature module is provided in the installation space and is used to monitor the temperature of the internal environment of the industrial computer body;

[0022] A cooling and dehumidification module is provided in the installation space, one end of the module is connected to the outside, and the other end of the module is connected to the installation space;

[0023] The first temperature module obtains the temperature value in the installation space, records the temperature value in the installation space as a first measurement value, and compares the first measurement value with a temperature threshold. If the temperature threshold is greater than the first measurement value, the cooling and dehumidification module inhales external air, cools and dehumidifies the inhaled air, and blows the cooled and dehumidified air into the installation space to cool the electronic components in the installation space.

[0024] In at least one embodiment of the present application, the cooling and dehumidification module includes:

[0025] a communication duct located in the installation space, the communication duct being provided with an air inlet channel and an air outlet channel, the air inlet channel being in communication with the outside, the air outlet channel being in communication with the installation space, and the air outlet channel being in communication with the air inlet channel;

[0026] An air suction member, one end of which is connected to the outside and the other end of which is connected to the air inlet channel;

[0027] A dehumidification and heat dissipation component is partially located in the air inlet channel and partially located in the air outlet channel, so as to cool and dehumidify the air sucked into the communicating duct.

[0028] In at least one embodiment of the present application, the dehumidification and heat dissipation component includes:

[0029] a heat conducting member, one end of which is disposed in the air inlet passage;

[0030] A cooling condensation component, one end of which is arranged in the air outlet channel;

[0031] A semiconductor refrigeration chip is arranged in the installation space, the other end of the heat-conducting member is in contact with the hot end of the semiconductor refrigeration chip, and the other end of the cold-conducting condensing member is in contact with the cold end of the semiconductor refrigeration chip;

[0032] The air blown into the air inlet channel is heated by the heat-conducting component and then enters the air outlet channel. The heated air condenses when passing through the cooling condensation component, and water droplets generated by condensation adhere to the cooling condensation component.

[0033] In at least one embodiment of the present application, the air outlet channel includes a condensation end, and the condensation end is formed by being inclined and bent in a vertically downward direction from an end of the air inlet channel away from the air suction member;

[0034] The cooling condensation component includes a cooling fin portion, which is arranged in the condensation end and is inclined relative to the bending direction of the condensation end. The cooling fin portion is inclined to the axis of the air inlet channel.

[0035] In at least one embodiment of the present application, the cooling condensation component further includes a cooling portion provided at one end of the cooling fin portion, and the cooling portion passes through the condensing end and is in contact with the cold end of the semiconductor refrigeration plate.

[0036] In at least one embodiment of the present application, the air outlet channel further includes an air outlet end connected to one end of the condensation end, and the air outlet end is formed by being inclined and bent in a vertically upward direction away from one end of the air inlet channel from the condensation end;

[0037] The air outlet is in communication with the installation space;

[0038] The intersection of the condensation end and the air outlet end forms an intersection curve, and the farthest point of the intersection curve away from the semiconductor refrigeration plate is recorded as the intersection point. The air inlet channel is arranged parallel to the semiconductor refrigeration plate, and the maximum distance from the air inlet channel to the semiconductor refrigeration plate is recorded as a, and the maximum distance from the intersection point to the semiconductor refrigeration plate is recorded as b, satisfying the relationship: a>b.

[0039] In at least one embodiment of the present application, a liquid outlet channel is provided on the gas outlet end, the liquid outlet channel is located at the junction of the condensation end and the gas outlet end, and the liquid outlet channel is provided close to the semiconductor refrigeration plate;

[0040] The dehumidification and heat dissipation component further includes a one-way circulation valve, one end of which is connected to the liquid outlet channel, and the other end of which is connected to an external liquid outlet pipe.

[0041] In at least one embodiment of the present application, the industrial computer-based humidity monitoring and control system further includes:

[0042] a first humidity module, disposed in the installation space, for obtaining a humidity value in the installation space;

[0043] A second temperature module is provided on the industrial computer body and is used to monitor the ambient temperature of the industrial computer body;

[0044] A second humidity module is provided on the industrial computer body and is used to detect the humidity value of the environment surrounding the industrial computer body;

[0045] Among them, the second temperature module obtains the ambient temperature value of the industrial computer body to obtain a second measurement value; the first humidity module obtains the humidity value in the installation space to obtain a third measurement value, and the second humidity module obtains the humidity value of the ambient environment of the industrial computer body to obtain a fourth measurement value; the power of the semiconductor refrigeration plate is calculated based on the first measurement value, the second measurement value, the third measurement value and the fourth measurement value to obtain a cooling and dehumidification power value.

[0046] In at least one embodiment of the present application, the cooling and dehumidification power value is compared with the maximum power value of the semiconductor refrigeration chip. If the cooling and dehumidification power value is greater than the maximum power value of the semiconductor refrigeration chip, the semiconductor refrigeration chip is controlled to operate at the maximum power value.

[0047] If the cooling and dehumidification power value is less than the maximum power value of the semiconductor refrigeration plate, the semiconductor refrigeration plate is controlled to operate at the cooling and dehumidification power value.

[0048] In at least one embodiment of the present application, the industrial computer-based humidity monitoring and control system further includes:

[0049] A heat conducting member, one end of which is arranged in the air outlet channel, and the other end of which is provided with a cold end bonding portion and a hot end bonding portion, wherein the cold end bonding portion is located on the cold end side close to the semiconductor refrigeration chip, and the hot end bonding portion is located on the hot end side close to the semiconductor refrigeration chip;

[0050] A magnetic attraction member is provided on a side of the hot end bonding portion away from the semiconductor refrigeration plate;

[0051] A magnetic induction component is disposed in the installation space and coupled with the magnetic attraction component;

[0052] Among them, the magnetic field direction of the magnetic induction component is controlled according to the temperature difference between the inside and outside of the industrial computer body, so that the magnetic attraction component and the magnetic induction component are attracted or repelled, so that the cold end bonding part is bonded to the cold end of the semiconductor refrigeration plate or the hot end bonding part is bonded to the hot end of the semiconductor refrigeration plate, so as to change the temperature of the air passing through the cooling condensation component and blown into the installation space.

[0053] A monitoring and control method is applied to any of the above-mentioned industrial computer-based humidity monitoring and control systems, and the monitoring and control method includes:

[0054] Acquire a real-time temperature value in the installation space through a first temperature module to obtain a first measurement value;

[0055] Comparing the first measurement value with a temperature threshold, and generating a cooling and dehumidification signal if the temperature threshold is greater than the first measurement value;

[0056] The cooling and dehumidification signal is executed to control the cooling and dehumidification module to cool and dehumidify the installation space.

[0057] The implementation of the industrial computer-based humidity monitoring and control system and monitoring and control method of this embodiment will have at least the following beneficial effects:

[0058] 1. In the above-mentioned industrial computer humidity monitoring and control system and monitoring and control method, the first temperature module detects the temperature value inside the industrial computer in real time as the first measurement value; the measured first measurement value is compared with a preset temperature threshold. When the temperature value exceeds the threshold, the system will start the cooling and dehumidification module.

[0059] The cooling and dehumidification module begins to inhale external air and performs cooling and dehumidification processing. The treated air is blown into the installation space, lowering the internal temperature and reducing moisture. By controlling the temperature and humidity, it ensures that the internal electronic components operate in the best working environment.

[0060] The cooling and dehumidification module effectively avoids the short circuit and corrosion problems caused by moisture entering during the heat dissipation process of traditional industrial computers, enhancing the reliability of the equipment in humid environments.

[0061] Real-time monitoring of temperature and humidity, and automatic control of cooling and dehumidification ensure long-term stable operation of the equipment, extending the service life of the industrial computer.

[0062] 2. When the temperature inside the installation space is higher or lower than the ambient temperature, a magnetic induction element is used to adjust the contact between the thermal conductor and the hot or cold end of the semiconductor refrigeration chip, thereby adjusting the conduction temperature of the thermal conductor. Multi-stage temperature regulation is used to avoid excessive temperature differences between the inside and outside. When approaching the target temperature, the cooling rate should be gradually slowed to avoid a sharp drop in temperature and reduce thermal stress inside the equipment. This reduces the risk of moisture condensation and the formation of condensed water in the installation space.

[0063] Using magnetic fields for temperature control avoids the friction and wear associated with physical contact. Magnetic field control offers exceptionally fast response times, enabling temperature adjustments in milliseconds. In industrial environments, especially when experiencing drastic temperature fluctuations, this provides greater stability and real-time control.

[0064] Secondly, in high humidity environments, motors and mechanical components are easily affected by moisture or jams, while magnetic field control is not affected by moisture and dust and has high reliability.

[0065] The magnetic control system can control the adsorption or repulsion state between the cooling and heating components by adjusting the magnetic field strength, thereby achieving precise temperature regulation. BRIEF DESCRIPTION OF THE DRAWINGS

[0066] Figure 1 This is the structural diagram of the humidity monitoring and control system based on industrial computers;

[0067] Figure 2 It is a three-dimensional diagram of the humidity monitoring and control system based on industrial computers;

[0068] Figure 3 This is an exploded view of the humidity monitoring and control system based on an industrial computer;

[0069] Figure 4 This is the exploded view of the cooling and dehumidification module;

[0070] Figure 5 This is a three-dimensional diagram of the cooling and dehumidification module;

[0071] Figure 6 This is the usage status of the cooling and dehumidification module Figure 1 (Cross-sectional view, where solid arrows represent hot air, dashed arrows represent cold air, and circles represent small water droplets);

[0072] Figure 7 This is the usage status of the cooling and dehumidification module Figure 2 (Solid arrows represent heat conduction, and dashed arrows represent cold conduction);

[0073] Figure 8 This is a partial structural diagram of an industrial computer-based humidity monitoring and control system in another embodiment;

[0074] Figure 9 for Figure 8 Schematic diagram of the embodiment in use (cross-sectional view).

[0075] Description of main component symbols

[0076] 100. Humidity monitoring and control system based on industrial computer;

[0077] 110. Industrial computer body; 110a. Installation space;

[0078] 120. First temperature module;

[0079] 130. Cooling and dehumidifying module; 131. Connecting duct; 1311. Air inlet channel; 1312. Air outlet channel; 132. Air suction member; 133. Dehumidification and heat dissipation assembly; 1331. Heat conduction member; 1332. Cooling condensation member; 13321. Cooling fin unit; 13322. Cooling conduction unit; 1333. Semiconductor cooling fin; 13121. Condensation end; 13122. Air outlet; 130a. Junction point; 130b. Liquid outlet channel; 134. One-way flow valve;

[0080] 140. First humidity module;

[0081] 150. Second temperature module;

[0082] 160, second humidity module;

[0083] 170, thermal conductive member; 171, cold end bonding portion; 172, hot end bonding portion; 173, thermal conductive fins; 174, thermal conductive portion; 175, thermal conductive rolling wheel; 176, thermal conductive vertical plate; 170a, groove;

[0084] 180, magnetic parts;

[0085] 190. Magnetic sensing parts. DETAILED DESCRIPTION

[0086] The embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments.

[0087] It should be noted that when a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component. When a component is considered to be "disposed on" another component, it can be directly disposed on the other component or there may be an intermediate component. The terms "top", "bottom", "upper", "lower", "left", "right", "front", "back", and similar expressions used herein are for illustrative purposes only.

[0088] The following embodiments of the present application are described in detail with reference to the accompanying drawings. In the absence of conflict, the following embodiments and features therein may be combined with each other.

[0089] An embodiment of the present application provides an industrial computer humidity monitoring and control system 100, which is applied to humidity defects caused by the heat dissipation process of industrial computers. The industrial computer humidity monitoring and control system 100 includes:

[0090] The industrial computer body 110 has an installation space 110a formed therein, and electronic components are arranged in the installation space 110a;

[0091] A first temperature module 120 is provided in the installation space 110a and is used to detect the temperature of the internal environment of the industrial computer body 110;

[0092] The cooling and dehumidification module 130 is disposed in the installation space 110a, with one end connected to the outside and the other end connected to the installation space 110a;

[0093] The first temperature module 120 obtains the temperature value in the installation space 110a, records the temperature value in the installation space 110a as a first measurement value, and compares the first measurement value with a temperature threshold. If the temperature threshold is greater than the first measurement value, the cooling and dehumidification module 130 inhales external air, cools and dehumidifies the inhaled air, and blows the cooled and dehumidified air into the installation space 110a to cool the electronic components in the installation space 110a.

[0094] Please refer to Figure 1-Figure 7 In this embodiment, the first temperature module 120 detects the temperature value inside the industrial computer in real time as the first measurement value; the measured first measurement value is compared with a preset temperature threshold. When the temperature value exceeds the threshold, the industrial computer humidity monitoring and control system 100 will start the cooling and dehumidification module 130.

[0095] The cooling and dehumidification module 130 starts to inhale external air and performs cooling and dehumidification processing. The processed air is blown into the installation space 110a, lowering the internal temperature and reducing humidity. By controlling the temperature and humidity, it ensures that the internal electronic components operate in the best working environment.

[0096] The cooling and dehumidification module 130 effectively avoids the short circuit and corrosion problems caused by moisture entering during the heat dissipation process of traditional industrial computers, thereby enhancing the reliability of the equipment in a humid environment.

[0097] Real-time monitoring of temperature and humidity, and automatic control of cooling and dehumidification ensure long-term stable operation of the equipment, extending the service life of the industrial computer.

[0098] It should be noted that the first temperature module 120 is a digital thermometer. When the industrial computer is operating, the internal electronic components generate heat, causing the temperature in the installation space 110a to rise. The first temperature module 120 monitors this temperature in real time, and the collected temperature value is the "first measurement value."

[0099] When the first temperature module 120 detects a temperature rise (higher than a set threshold), the cooling and dehumidification module 130 starts to operate. It draws in external air, cools and dehumidifies the air, and then blows the treated cool air into the installation space 110a, thereby lowering the internal temperature of the industrial computer and reducing humidity.

[0100] It should be further explained that electronic components include: PCB boards, central processing units, graphics cards, resistors and other electronic components.

[0101] The installation space 110 a is a cavity inside the industrial computer body 110 . The industrial computer body 110 is a cubic structure in this embodiment.

[0102] In at least one embodiment of the present application, the cooling and dehumidification module 130 includes:

[0103] A communication duct 131 is located in the installation space 110a. The communication duct 131 is provided with an air inlet channel 1311 and an air outlet channel 1312. The air inlet channel 1311 is in communication with the outside, the air outlet channel 1312 is in communication with the installation space 110a, and the air outlet channel 1312 is in communication with the air inlet channel 1311.

[0104] The air suction member 132 has one end connected to the outside and the other end connected to the air inlet channel 1311;

[0105] The dehumidification and heat dissipation component 133 is partially located in the air inlet channel 1311 and partially located in the air outlet channel 1312 to cool and dehumidify the air sucked into the communicating duct 131 .

[0106] Please refer to Figure 1-Figure 7 In this embodiment, the air suction member 132 draws air from the outside and sends the air into the connecting pipe 131. The air is processed by the dehumidification and heat dissipation component 133 in the connecting pipe 131. The dehumidification and heat dissipation component 133 cools the air and removes moisture from the air.

[0107] The processed cooled and dry air enters the installation space 110a through the air outlet duct 1312, lowering the internal temperature and reducing humidity.

[0108] The entire industrial computer-based humidity monitoring and control system 100 dynamically adjusts the cooling and dehumidification operations according to the real-time monitored temperature and humidity conditions to ensure that the internal environment of the industrial computer-based humidity monitoring and control system 100 is suitable.

[0109] By providing the dehumidification and heat dissipation component 133, the industrial computer-based humidity monitoring and control system 100 can effectively process the air, ensuring that the air entering the installation space 110a is both cooled and dry, thereby avoiding short circuits and corrosion problems that may be caused by moisture condensation on the circuit board.

[0110] In high-humidity environments, moisture entering the interior of industrial computers can cause serious short circuits and corrosion. The cooling and dehumidification module 130 not only lowers the internal temperature but also reduces the impact of moisture on the equipment, significantly improving its operational stability and lifespan.

[0111] It should be noted that traditional industrial computers cannot effectively deal with moisture problems due to their heat dissipation design. However, the industrial computer humidity monitoring and control system 100 significantly improves the environmental adaptability of industrial computers by introducing external air and processing it.

[0112] The humidity monitoring and control system 100 based on an industrial computer can intelligently adjust the air handling process according to the actual detected temperature and humidity conditions, optimize the dehumidification and heat dissipation effects, and avoid unnecessary energy waste.

[0113] It should be further explained that the air suction member 132 is a fan that draws external air into the industrial computer body 110. The air suction member 132, through its connection to the outside air, draws the external air into the communication duct 131. Through this process, the drawn air enters the dehumidification and heat dissipation assembly 133 for processing.

[0114] The dehumidification and heat dissipation component 133 not only dissipates heat but also removes moisture from the air. This effectively solves the problem of short circuits and corrosion of electronic components caused by moisture ingress when industrial computers operate in humid environments.

[0115] Since the dehumidification and heat dissipation component 133 is partially located in the communication duct 131, the air is fully processed before entering the installation space 110a, ensuring that the installation space 110a is always maintained within a suitable temperature and humidity range.

[0116] One end of the communication pipe 131 is a horizontally arranged middle-through pipe (corresponding to the air inlet channel 1311 ), and the other end is a C-shaped middle-through elbow (corresponding to the air outlet channel 1312 ).

[0117] In at least one embodiment of the present application, the dehumidification and heat dissipation component 133 includes:

[0118] A heat conducting member 1331 , one end of which is disposed in the air inlet channel 1311 ;

[0119] A cooling condensation member 1332 , one end of which is disposed in the air outlet channel 1312 ;

[0120] The semiconductor refrigeration sheet 1333 is provided in the installation space 110a. The other end of the heat conducting member 1331 is in contact with the hot end of the semiconductor refrigeration sheet 1333. The other end of the cold conducting condensation member 1332 is in contact with the cold end of the semiconductor refrigeration sheet 1333.

[0121] The air blown into the air inlet channel 1311 is heated by the heat conduction member 1331 and then enters the air outlet channel 1312 . The heated air condenses when passing through the cooling condensation member 1332 , and water droplets generated by the condensation adhere to the cooling condensation member 1332 .

[0122] Please refer to Figure 1-Figure 7 In this embodiment, external air enters the industrial computer-based humidity monitoring and control system through the air inlet channel 1311, and first contacts the heat conductive member 1331, heating the air to increase its water vapor content.

[0123] The heated air flows through the cooling condensation element 1332, and the cooling condensation element 1332 condenses water vapor in the air into liquid water through the cold end of the semiconductor refrigeration plate 1333, and adheres to the surface of the condensation element.

[0124] After the condensation process, moisture in the air is removed and dry air is delivered to the installation space 110a, ensuring that the temperature of the electronic components inside the industrial computer is lowered and the humidity is reduced.

[0125] Condensed water is discharged through a preset drainage mechanism based on an industrial computer humidity monitoring and control system to avoid internal water accumulation.

[0126] The heating-condensation cycle effectively reduces the humidity in the air, and the condensation component cools the air, improving the cooling effect. This is particularly important for industrial computers in humid environments, as it can effectively prevent moisture from corroding circuit boards and components.

[0127] Through precise temperature and humidity control, the industrial computer humidity monitoring and control system ensures that industrial computers can maintain normal operation in high-humidity and high-temperature working environments. Due to the effective control of moisture and heat, the aging rate of internal electronic components is slowed, significantly extending the service life of the equipment.

[0128] It is particularly suitable for high-humidity, hot and humid environments, such as the plum rain season and the return of the south wind in southern China. Under these extreme conditions, the industrial computer humidity monitoring and control system automatically adjusts the cooling and dehumidification functions to maintain a stable internal environment, providing the industrial computer with higher operational stability and reliability.

[0129] The industrial computer-based humidity monitoring and control system uses temperature and humidity sensors to monitor the internal environment and automatically adjusts the power of the semiconductor cooling chip 1333 based on the monitoring results, achieving dynamic and intelligent temperature and humidity control. This intelligent control mechanism not only improves energy efficiency but also reduces equipment maintenance frequency, further enhancing the device's practicality in complex industrial environments.

[0130] It should be noted that the heat conductor 1331 is provided with an aluminum heat sink fin group at one end, which consists of multiple parallel heat sink fins. The other end is connected to the hot end of the semiconductor refrigeration plate 1333 through a heat-conducting aluminum plate for heat transfer.

[0131] It should be further explained that the humidity monitoring and control system based on industrial computers first heats the air to increase the water vapor content in the air. Then, when it passes through the condenser, the temperature drops sharply, causing the water vapor to condense into liquid water. In this way, the moisture in the air can be removed more efficiently.

[0132] The heating process utilizes the principle of heat conduction to increase the concentration of water vapor in the air; the condensation process utilizes the dew point characteristics of the air to condense the water vapor into water droplets on the condensing element. The combination of the two can effectively achieve dehumidification and cooling of the air.

[0133] The air is heated by the heat conducting member 1331 so that the moisture in the air exists in gaseous form, thereby increasing the saturated vapor pressure of the air.

[0134] When the air comes into contact with the condensing element, the temperature drops suddenly, and the water vapor condenses into water droplets, which are captured by the condensing element, effectively dehumidifying.

[0135] It should be further explained that the heat conduction part of the thermal conductor is calculated using the following formula:

[0136] Q a =(kA a ΔT a ) / l;

[0137] Among them, Q a is the heat transferred through the heat conductor, k is the thermal conductivity of the heat conductor material; A a is the surface area of ​​the heat conductor, ΔT a is the temperature difference between the heat conductor and the air, and l is the distance from the heat conductor to the semiconductor refrigeration plate.

[0138] The cold conduction part of the condenser is calculated using the following formula:

[0139] Q c =h c A c (ΔT c );

[0140] Among them, Q c is the heat removed by the cooling condenser during the condensation process, h c is the condensation heat transfer coefficient, A c is the surface area of ​​the cooling condenser; ΔT c It is the temperature difference between the air and the surface of the cooling condenser.

[0141] In at least one embodiment of the present application, the air outlet channel 1312 includes a condensation end 13121, and the condensation end 13121 is formed by being inclined and bent in a vertically downward direction from an end of the air inlet channel 1311 away from the air suction member 132;

[0142] The cooling condensation member 1332 includes a cooling fin portion 13321 , which is arranged in the condensation end 13121 and is tilted relative to the bending direction of the condensation end 13121 . The cooling fin portion 13321 is tilted to the axis of the air inlet channel 1311 .

[0143] Please refer to Figure 1-Figure 7 In this embodiment, external air enters the industrial computer-based humidity monitoring and control system through the air inlet channel 1311, is first heated by the heat conductor 1331, and the moisture in the air exists in the form of water vapor and flows to the condensation end 13121 through the air inlet channel 1311.

[0144] When the air reaches the condensation end 13121, since the condensation end 13121 is tilted downward and curved, the air stays in this area for a longer time and contacts the cooling fin portion 13321. The cooling fin portion 13321 is cooled by the cold end of the semiconductor refrigeration plate, causing the water vapor to condense into water droplets on the cooling fin portion 13321.

[0145] The condensed water flows down naturally through the inclined structure of the condensation end 13121, preventing water droplets from being retained in the condensation end 13121, while ensuring that moisture does not affect the electronic components inside the industrial computer-based humidity monitoring and control system.

[0146] The inclined condensation end 13121 prolongs the contact time between the air and the condensation element. In addition, the inclined arrangement of the refrigeration fin portion 13321 further increases the surface area of ​​air flow, improves the condensation efficiency of water vapor in the air, and significantly enhances the dehumidification effect.

[0147] By tilting the cooling fin portion 13321 and the axis of the air inlet channel 1311, the heat dissipation effect of the cooling condensation component 1332 is greatly improved, and heat can be transferred to the air more evenly, while avoiding the phenomenon of excessive local condensation, ensuring that the air can be cooled more evenly.

[0148] It should be further explained that the condensation end 13121 is a downward-bent center-through elbow, so that after the heated air enters along the axis of the air inlet channel 1311, the heated air still hits the inner wall of the condensation end 13121 along the direction of the axis of the air inlet channel 1311, so that a part of the water droplets can adhere to the inner wall of the condensation end 13121, and the other part hits the aluminum fins on the refrigeration fin part 13321, so that most of the water vapor condenses on the refrigeration fin part 13321.

[0149] Secondly, since the axes of the cooling fin portion 13321, the air inlet channel 1311 and the condensation end 13121 are all inclined, the residence time of the hot air can be increased, thereby reducing the temperature of the hot air, and secondly increasing the condensation amount and condensation effect of water vapor.

[0150] It should be further explained that the refrigeration fin portion 13321 is composed of a plurality of parallel aluminum fins, and there is a gap between each adjacent aluminum fin. In this embodiment, the inclination angle of the refrigeration fin portion 13321 is 30°, the angle of the axis of the air inlet channel 1311 is 0°, and the bending angle of the condensation end 13121 is 45° (the above angles are all relative to the horizontal line) to ensure that when the hot air reaches the condensation end 13121, it can stay for a long time and condense most of the water vapor to avoid the water vapor in the cold air passing through the refrigeration fin portion 13321 being mostly condensed at the condensation end 13121.

[0151] It should be further explained that the heat conductor 1331 and the cooling condensation member 1332 are both located at the bottom of the installation space 110a and are arranged close to the ground. The heat conductor 1331 and the cooling condensation member 1332 are located between the ground and the connecting pipe 131, and the condensation end 13121 of the connecting pipe 131 is bent toward the side close to the ground.

[0152] It should be further explained that the heat conducting component 1331 and the cold conducting condensing component 1332 are both arranged on the side of the communicating pipe 131 close to the ground.

[0153] In at least one embodiment of the present application, the cooling condensation member 1332 further includes a cooling portion 13322 provided at one end of the cooling fin portion 13321 , and the cooling portion 13322 passes through the condensing end 13121 and is bonded to the cold end of the semiconductor refrigeration plate 1333 .

[0154] Please refer to Figure 1-Figure 7In this embodiment, when air passes through the cooling condensation element 1332, it comes into contact with the cooling fins 13321, causing water vapor to condense into water droplets. At this point, the cooling condensation element 13322 is responsible for transferring the cooling energy from the semiconductor cooling plate 1333 to the cooling fins 13321, ensuring that the fins can always maintain a low temperature.

[0155] The cooling portion 13322 enables the cold energy to be quickly transferred to the cooling fin portion 13321 , thereby improving the cooling capacity and condensation efficiency of the fins.

[0156] By providing a cooling portion 13322 at one end of the first cooling fin, the cold energy can be transferred to the first cooling fin more efficiently, so that the first cooling fin always maintains a low temperature during the cooling and condensation process, effectively improving the condensation efficiency and avoiding poor condensation effect caused by excessively high fin temperature.

[0157] The cold end of the semiconductor refrigeration plate 1333 provides continuous cooling, which is conducted to the cooling fin portion 13321 through the cooling conduction portion 13322. The cooling conduction portion runs through the condensing end 13121 to ensure that the cooling is evenly transferred to the entire cooling conduction condensing element 1332.

[0158] The air flows through the condensation end 13121 and contacts the low-temperature refrigeration fin portion 13321. The water vapor in the air condenses into water droplets on the surface of the fin, flows down along the surface of the fin, and is finally discharged based on the industrial computer humidity monitoring and control system.

[0159] The condensed water droplets flow down naturally through the inclined condensation end 13121, preventing moisture from accumulating near electronic components and ensuring that the humidity inside the industrial computer-based humidity monitoring and control system is effectively controlled.

[0160] It should be noted that the cooling part 13322 is composed of a laminated aluminum plate and a connecting plate perpendicular to the laminated aluminum plate. The connecting plate is made of an aluminum plate. One end of the connecting plate is arranged on the laminated aluminum plate, and the other end passes through the condensation end 13121 and is accommodated in the internal space of the condensation end 13121, and is connected to each cooling fin part 13321 to fix the cooling fin part 13321.

[0161] The contact between the cooling element 13322 and the cold end of the semiconductor cooling plate 1333 enables the cooling condenser 1332 to maintain a stable low temperature, significantly improving the efficiency of condensing water vapor in the air. The condensed water is quickly discharged, effectively reducing the humidity inside the industrial computer and preventing moisture from condensing on the circuit boards.

[0162] Effectively solves the problem of moisture accumulation. The cooling element 13322 ensures that the condensing element always maintains a low temperature, quickly removes moisture from the air, and avoids moisture condensation on the circuit board, which can cause short circuits or corrosion. This improves the reliability of industrial computers in high-humidity environments.

[0163] It should be noted that there are two groups of cooling condensation components 1332 , one group of cooling condensation components 1332 is arranged in the condensation end 13121 , and the other group of cooling condensation components 1332 is arranged in the air outlet channel 1312 .

[0164] At the condensation end 13121, since the condensation end 13121 is a curved pipe, the condensed water and the cooled air are separated to achieve gas-liquid separation and prevent the cooled air from containing a large amount of moisture.

[0165] In at least one embodiment of the present application, the air outlet channel 1312 further includes an air outlet end 13122 connected to one end of the condensation end 13121, and the air outlet end 13122 is formed by being inclined and curved in a vertically upward direction from the condensation end 13121 to one end away from the air inlet channel 1311;

[0166] The air outlet 13122 is in communication with the installation space 110a;

[0167] The junction of the condensation end 13121 and the air outlet end 13122 forms a junction curve (not marked in the figure), and the farthest point of the junction curve away from the semiconductor refrigeration plate 1333 is recorded as the junction point 130a. The air inlet channel 1311 is arranged parallel to the semiconductor refrigeration plate. The maximum distance from the air inlet channel 1311 to the semiconductor refrigeration plate is recorded as a, and the maximum distance from the junction point 130a to the semiconductor refrigeration plate is recorded as b, satisfying the relationship: a>b.

[0168] Please refer to Figure 1-Figure 7 In this embodiment, air is drawn in from the outside and enters the industrial computer-based humidity monitoring and control system through air inlet duct 1311. Air inlet duct 1311 is parallel to the semiconductor cooling plate. The air is heated by heat conducting element 1331, and the temperature rises, making it easier for water vapor to condense.

[0169] The heated air enters the condensation end 13121, where it comes into contact with the semiconductor refrigeration plate, causing the water vapor to condense into water droplets. The condensed water is discharged through the inclined design of the condensation end 13121, and the dry air enters the air outlet 13122.

[0170] The dry air flows upward along the air outlet 13122 and finally enters the installation space 110a. The condensed water is blocked at the condensation end 13121 and does not enter the installation space 110a where the electronic components are located, ensuring a dry environment for the electronic components.

[0171] By rationally designing the inclined structure of the air outlet 13122 and the distance ratio a>b, the humidity monitoring and control system based on an industrial computer can effectively condense water vapor into liquid water and ensure that the humidity is effectively controlled before the air enters the installation space 110a, thereby preventing moisture from entering the area where the electronic components are located.

[0172] The airflow in the industrial computer-based humidity monitoring and control system flows smoothly, avoiding airflow obstruction or reverse flow in the industrial computer-based humidity monitoring and control system. The bend of the air outlet 13122 further optimizes the airflow and prevents condensation from flowing back.

[0173] Dry, low-temperature air enters the installation space 110a through the air outlet 13122, helping to reduce the operating temperature of electronic components, extend the life of the components and improve the stability of the equipment.

[0174] It should be noted that since the cooling part 13322 is in direct contact with the condensation end 13121, the temperature of the condensation end 13121 is reduced, the maximum distance from the air inlet channel 1311 to the semiconductor refrigeration plate is recorded as a, and the maximum distance from the intersection 130a to the semiconductor refrigeration plate is recorded as b, satisfying the relationship: a>b, so that the air in contact with the condensation end 13121 can attach the moisture it carries to the inner wall of the condensation end 13121 to reduce the moisture in the air.

[0175] It should be further explained that a waterproof gasket is provided between the cooling portion 13322 and the condensing end 13121 to prevent liquefied water from dripping into the installation space 110a.

[0176] In at least one embodiment of the present application, a liquid outlet channel 130b is provided on the gas outlet end 13122, and the liquid outlet channel 130b is located at the junction of the condensation end 13121 and the gas outlet end 13122, and the liquid outlet channel 130b is provided close to the semiconductor refrigeration plate 1333;

[0177] The dehumidification and heat dissipation component 133 further includes a one-way circulation valve 134 , one end of which is connected to the liquid outlet channel 130 b , and the other end of which is connected to an external liquid outlet pipe.

[0178] Please refer to Figure 1-Figure 7 In this embodiment, when air flows through the condensation end 13121, water vapor condenses into water droplets. These condensed water naturally flows to the air outlet end 13122 due to the inclined design of the condensation end 13121.

[0179] A liquid outlet channel 130b is provided at the air outlet end 13122 near the condensation end 13121, through which condensed water is discharged from the interior of the industrial computer-based humidity monitoring and control system to prevent it from accumulating at the condensation end 13121 or entering the installation space 110a.

[0180] Condensed water flows through outlet channel 130b and through one-way valve 134. This valve ensures that the condensed water can only be discharged from within the industrial computer-based humidity monitoring and control system, preventing the backflow of external moisture or gas. The one-way valve guides the condensed water to an external outlet pipe, through which the condensed water is ultimately discharged.

[0181] It should be noted that the liquid outlet channel 130b is opened at the junction of the condensation end 13121 and the gas outlet end 13122 near the semiconductor refrigeration plate 1333, and the liquid outlet channel 130b is opened at the lowest point of the gas outlet end 13122. The lowest point of the gas outlet end 13122 and the lowest point of the condensation end 13121 are both located at the junction between the two.

[0182] The liquid outlet pipe is located on a side of the one-way flow valve 134 away from the communication pipe 131 .

[0183] The liquid outlet channel 130b and the one-way flow valve 134 ensure that the condensed water can be quickly discharged from the industrial computer-based humidity monitoring and control system, while preventing the backflow of external air or moisture, ensuring that the air at the condensation end 13121 and the installation space 110a remains dry, and improving the stability of the industrial computer-based humidity monitoring and control system.

[0184] One-way valve 134 allows condensed water to drain smoothly through outlet channel 130b, preventing secondary condensation caused by condensed water backflow. This design also improves the drainage efficiency of the entire industrial computer-based humidity monitoring and control system, ensuring that the industrial computer-based humidity monitoring and control system can operate stably and for a long time in high-humidity environments.

[0185] By effectively draining condensed water and preventing external moisture from entering, industrial computer-based humidity monitoring and control systems protect electronic components from moisture erosion, reducing the risk of short circuits or component corrosion. This can significantly extend the service life of equipment, especially in humid industrial environments.

[0186] In at least one embodiment of the present application, the industrial computer-based humidity monitoring and control system 100 further includes:

[0187] A first humidity module 140 is provided in the installation space 110a and is used to obtain a humidity value in the installation space 110a;

[0188] The second temperature module 150 is provided on the industrial computer body 110 and is used to detect the ambient temperature of the industrial computer body 110;

[0189] The second humidity module 160 is provided on the industrial computer body 110 and is used to detect the humidity value of the environment around the industrial computer body 110;

[0190] Among them, the second temperature module 150 obtains the ambient temperature value of the industrial computer body 110 to obtain a second measurement value; the first humidity module 140 obtains the humidity value in the installation space 110a to obtain a third measurement value, and the second humidity module 160 obtains the humidity value of the ambient environment of the industrial computer body 110 to obtain a fourth measurement value; the power of the semiconductor refrigeration plate 1333 is calculated based on the first measurement value, the second measurement value, the third measurement value and the fourth measurement value to obtain a cooling and dehumidification power value.

[0191] In at least one embodiment of the present application, the cooling and dehumidification power value is compared with the maximum power value of the semiconductor refrigeration plate 1333. If the cooling and dehumidification power value is greater than the maximum power value of the semiconductor refrigeration plate 1333, the semiconductor refrigeration plate 1333 is controlled to operate at the maximum power value.

[0192] If the cooling and dehumidification power value is less than the maximum power value of the semiconductor refrigeration plate 1333, the semiconductor refrigeration plate 1333 is controlled to operate at the cooling and dehumidification power value.

[0193] Please refer to Figure 1-Figure 7 In this embodiment, the first temperature module 120, the second temperature module 150, the first humidity module 140 and the second humidity module 160 collect temperature and humidity data inside and outside the industrial computer humidity monitoring and control system, including internal temperature, external temperature, internal humidity and external humidity.

[0194] The humidity monitoring and control system based on an industrial computer calculates the current cooling and dehumidification demand according to the four measured values ​​and determines how much power is needed to drive the semiconductor refrigeration plate 1333.

[0195] The industrial computer-based humidity monitoring and control system compares the cooling and dehumidification power value with the maximum power value of the semiconductor cooler 1333 to determine the operating power of the cooling element. If the required power exceeds the maximum power, the semiconductor cooler operates at maximum power; if the required power is less than the maximum power, the semiconductor cooler operates at the required power.

[0196] According to the changes in real-time environmental conditions, the industrial computer humidity monitoring and control system will dynamically adjust the power of the refrigeration components to ensure that the industrial computer can operate stably in different temperature and humidity environments.

[0197] By integrating internal and external temperature and humidity information, the industrial computer humidity monitoring and control system can dynamically adjust the power of the refrigeration components to ensure that the industrial computer maintains stable operation in various environments.

[0198] It effectively avoids moisture accumulation inside the equipment, prevents electronic components from being damaged by a humid environment, and improves the safety and reliability of the industrial computer-based humidity monitoring and control system.

[0199] By calculating the cooling and dehumidification power values, the humidity monitoring and control system based on industrial computers can reasonably allocate the working power of the refrigeration components, reduce unnecessary power waste, and reduce energy consumption while ensuring the cooling and dehumidification effects.

[0200] It can adjust the cooling power according to different environmental conditions, keep the equipment running normally in complex industrial environments such as high humidity and high temperature, thereby extending the service life of industrial computers.

[0201] It should be noted that the first temperature module 120 and the second temperature module 150 are both digital thermometers, and the first humidity module 140 and the second humidity module 160 are both digital humidity meters.

[0202] It should be further explained that the cooling and dehumidification power value is calculated according to the following formula:

[0203] P total =(ρ air V air L v (P water -P out ) / P atm )+(m air C air (T1-T2)); where P total is the cooling and dehumidification power value; ρ air is the density of air; V air is the volume flow rate of air; L v is the latent heat of vaporization of water; P water is the actual water vapor value in the installation space, i.e. the third measurement value; P out is the actual water vapor value outside the installation space, which is the fourth measurement value; P atm is atmospheric pressure; m air is the air mass flow rate; c air is the specific heat capacity of air; T1 is the temperature inside the installation space, the first measured value; T2 is the temperature outside the installation space, the second measured value.

[0204] Please refer to Figure 8-9 In at least one embodiment of the present application, the industrial computer-based humidity monitoring and control system further includes:

[0205] Thermal Conductor 170 (Please refer to Figure 9 The leftmost thermal conductive fin 173 is provided with one end in the air outlet channel 1312 and a cold end fitting portion 171 and a hot end fitting portion 172 at the other end. The cold end fitting portion 171 is located near the cold end of the semiconductor refrigeration plate 1333, and the hot end fitting portion 172 is located near the hot end of the semiconductor refrigeration plate 1333.

[0206] Among them, the cooling condensation component 1332 is located between the thermal conductive component 170 and the heat conductive component 1331. In this embodiment, the air sucked into the connecting pipe 131 passes through the heat conductive component 1331 and then passes through the cooling condensation component 1332 for dehumidification and cooling, and finally passes through the thermal conductive fins 173 of the thermal conductive component 170 and is sent into the installation space 110a through the air outlet channel 1312 to cool the components in the industrial computer body 110, and the cooling condensation component 1332 is a group.

[0207] The magnetic member 180 is provided on a side of the hot end bonding portion 172 away from the semiconductor cooling plate 1333;

[0208] The magnetic induction component 190 is disposed in the installation space 110a and coupled with the magnetic attraction component 180:

[0209] Among them, when the internal and external temperature difference of the industrial computer body between the first measurement value and the second measurement value is not within the difference threshold range, the magnetic field direction of the magnetic induction component 190 is controlled according to the internal and external temperature difference of the industrial computer body, so that the magnetic attraction component 180 and the magnetic induction component 190 are adsorbed or repelled, so that the cold end bonding part 171 is bonded to the cold end of the semiconductor refrigeration plate 1333 or the hot end bonding part 172 is bonded to the hot end of the semiconductor refrigeration plate 1333, so as to change the temperature of the air passing through the cooling condensation component 1332 and blown into the installation space 110a.

[0210] Please refer to Figure 8-Figure 9 , calculating the temperature difference between the inside and outside of the industrial computer body based on the first measurement value and the second measurement value; if the temperature difference between the inside and outside of the industrial computer body is not within the difference threshold range, and the temperature difference between the inside and outside of the industrial computer body is greater than the difference threshold range, calculating the temperature value of the thermal conductive component 170 based on the maximum difference within the difference threshold range;

[0211] ΔT=T1-T2, where the temperature difference between the inside and outside of the industrial computer body is ΔT, the first measurement value is T1, and the second measurement value is T2;

[0212] Set the difference threshold range to: ΔT min and ΔT max , if ΔT exceeds the difference threshold range and ΔT>ΔT max, the temperature value T3 of the thermal conductive element 170 is calculated based on the maximum difference:

[0213] T3=T1-ΔT max ;

[0214] According to the third measurement value P water , the fourth measurement value P out Calculating the dehumidification capacity Q1, and calculating the dehumidification temperature difference between the cooling condensation component and the heat conduction component based on the dehumidification capacity;

[0215] Dehumidification capacity Q1:

[0216] Q1=ρ air V air (P water -P out ) / P atm , where ρ air is the air density, V air is the air flow rate, P atm is atmospheric pressure;

[0217] Dehumidification temperature difference T4:

[0218] T4=Q1 / (m air c air ), where c air is the specific heat capacity of air; m air =ρ air V air is the mass flow rate of air;

[0219] Calculating output temperature values ​​of the cooling and condensing components and the heat conducting components according to the dehumidification temperature difference and the second measurement value;

[0220] Output temperature T5 of the cooling condenser:

[0221] T5=T2-T4,

[0222] Output temperature T6 of heat conductor:

[0223] T6=T2+T4,

[0224] Calculate the output power of the semiconductor refrigeration plate 1333 according to the output temperature value of the cooling condensation element 1332, the output temperature value of the heat conduction element 1331 and the temperature value of the heat conduction element 170;

[0225] Cooling capacity P of semiconductor refrigeration chip output , calculated based on the temperature difference between its hot end and cold end. The hot end temperature of the semiconductor refrigeration chip 1333 is T6, and the cold end temperature of the semiconductor refrigeration chip 1333 is T5, then

[0226] P output=K(T6-T5) / d, K is the thermal conductivity of the semiconductor cooling plate 1333, and d is the thickness of the heat conducting member 1331;

[0227] The power P outputted by the semiconductor refrigeration plate 1333 is adjusted according to the output temperature value of the thermal conductive element 170. final :

[0228] P final =P output +α(T3-T5), α is the adjustment coefficient of the system, which represents the influence of the temperature of the thermal conductive component 170 on the power of the semiconductor refrigeration plate 1333.

[0229] At this time, the temperature in the installation space 110a is higher than the ambient temperature. The air sucked into the outside by the air suction member 132 is first heated, and then condensed and cooled by the cooling condensation member 1332 to perform dehumidification and cooling. The condensed and cooled air is then heated to the cooling temperature required by the installation space 110a through the heat conduction member 170. The cooling temperature required by the installation space 110a is a temperature that reduces the temperature of the installation space 110a while preventing water in the air in the installation space 110a from condensing, thereby dehumidifying and cooling the temperature in the installation space 110a. At the same time, the magnetic induction member 190 (which is a magnetic induction coil) generates a repulsive magnetic field, so that the magnetic attraction member 180 drives the hot end bonding portion 172 to bond with the hot end of the semiconductor refrigeration plate 1333, so as to heat the air passing through the cooling condensation member 1332 to the required cooling temperature, thereby avoiding the relative humidity in the installation space 110a from increasing due to the rapid drop in temperature in the installation space 110a, thereby causing condensed water to form inside the device.

[0230] This solution uses multi-stage temperature regulation to avoid large temperature differences between the inside and outside. When approaching the target temperature, the cooling rate should be gradually slowed to avoid a sharp drop in temperature and reduce thermal stress inside the equipment. It also reduces the risk of moisture condensation and the formation of condensation in the installation space.

[0231] It should be further explained that when the above method is applied to an ambient temperature lower than the temperature of the installation space of the industrial computer, the temperature is initially cooled to a very low temperature. At this time, under the premise that the humidity in the installation space 110a has not changed, the sudden cooling will cause the temperature inside the installation space 110a to be much higher than the cooling temperature, thereby causing a temperature difference, causing water vapor to form in the installation space 110a, affecting the operation of the industrial computer body 110.

[0232] In the early stage of cooling, this solution uses a hot-cold-hot method to perform multi-stage temperature adjustment, thereby changing the humidity value of the inhaled air, and then cools down by heating it to a temperature difference threshold lower than the temperature of the installation space 110a, so as to avoid sudden cooling that causes the humidity inside the installation space 110a to not be discharged, thereby affecting the operation inside the industrial computer body 110.

[0233] It should be further explained that when the temperature in the installation space 110a is higher than the ambient temperature, a heat-cold-heat method is used for cooling.

[0234] When the temperature in the installation space 110a drops to the ambient temperature or lower than the ambient temperature, the temperature is cooled by a hot-cold-cold method. At this time, the magnetic induction component 190 generates an adsorption magnetic field. The magnetic induction component 190 adsorbs the magnetic component 180 so that the cold end bonding portion 171 of the thermal conductive component 170 is bonded to the cold end side of the semiconductor refrigeration plate 1333 to achieve gradual multi-stage temperature adjustment, thereby avoiding the generation of water vapor inside the industrial computer body 110 due to the temperature difference, thereby affecting the operation of the industrial computer body 110.

[0235] It should be noted again that the thermal conductive component 170 is divided into two parts, including a thermal conductive fin 173 and a thermal conductive portion 174 slidingly connected to the thermal conductive fin 173. The thermal conductive portion 174 is connected to the slide groove of the industrial computer body 110, and one side of one end is rollingly connected to the thermal conductive fin 173 through a metal thermal conductive rolling wheel 175, and the other side is adhered to the thermal conductive fin 173 through a thermal conductive vertical plate 176. The other end is provided with a parallel cold end bonding portion 171 and a hot end bonding portion 172. A groove 170a is formed between the cold end bonding portion 171 and the hot end bonding portion 172, and the semiconductor refrigeration plate is located in the groove 170a.

[0236] The magnetic attraction component 180 is a magnet; the magnetic induction component 190 is an induction coil; and the thermal conductive component 170 is made of aluminum.

[0237] A monitoring and control method is applied to any one of the above-mentioned industrial computer-based humidity monitoring and control systems 100, the monitoring and control method comprising:

[0238] Acquire a real-time temperature value in the installation space 110a through the first temperature module 120 to obtain a first measurement value;

[0239] Comparing the first measurement value with a temperature threshold, and generating a cooling and dehumidification signal if the temperature threshold is greater than the first measurement value;

[0240] The cooling and dehumidification signal is executed to control the cooling and dehumidification module 130 to cool and dehumidify the installation space 110 a.

[0241] In this embodiment, the first temperature module 120 continuously monitors the internal temperature of the industrial computer and obtains a first measurement value in real time.

[0242] The industrial computer-based humidity monitoring and control system compares the first measurement value with a preset temperature threshold value. If the first measurement value exceeds the threshold value, the industrial computer-based humidity monitoring and control system generates a cooling and dehumidification signal.

[0243] The cooling and dehumidification signal is transmitted to the cooling and dehumidification module 130 , and the cooling and dehumidification module 130 starts to work, sucking in external air and cooling and dehumidifying it, and blowing cold and dry air into the installation space 110 a .

[0244] The internal temperature gradually drops, moisture is effectively removed, and the environment in the installation space 110a is restored. The industrial computer-based humidity monitoring and control system dynamically adjusts the working state of the cooling and dehumidification module 130 according to the changes in the internal temperature until the internal temperature drops to a safe range.

[0245] Through real-time temperature monitoring and threshold comparison, it can quickly respond to temperature increases and initiate cooling and dehumidification operations. Based on the humidity monitoring and control system of industrial computers, it not only regulates the temperature but also reduces the humidity in the air, ensuring the stability of the internal environment of the industrial computer.

[0246] The industrial computer-based humidity monitoring and control system automatically responds to temperature changes, reducing manual intervention and improving the intelligence of the equipment. By automatically generating and executing cooling and dehumidification signals, the industrial computer-based humidity monitoring and control system can automatically adjust the environmental conditions within the equipment.

[0247] Through intelligent temperature and humidity management, the environmental pressure inside the equipment is reduced, preventing failures caused by moisture and overheating, thereby effectively extending the service life of industrial computers.

[0248] The above is only an implementation method of the present application. It should be pointed out that for ordinary technicians in this field, improvements can be made without departing from the creative concept of the present application, but these all fall within the scope of protection of the present application.

Claims

1. A humidity monitoring and control system based on industrial computers, applied to humidity defects caused by the heat dissipation process of industrial computers, characterized by: The industrial computer-based humidity monitoring and control system includes: The industrial computer body has an installation space formed therein, and the installation space is provided with electronic components; A first temperature module is provided in the installation space and is used to monitor the temperature of the internal environment of the industrial computer body; A cooling and dehumidification module is provided in the installation space, one end of the module is connected to the outside, and the other end of the module is connected to the installation space; The first temperature module obtains a temperature value in the installation space, records the temperature value in the installation space as a first measurement value, and compares the first measurement value with a temperature threshold. If the temperature threshold is greater than the first measurement value, the cooling and dehumidification module inhales external air, cools and dehumidifies the inhaled air, and blows the cooled and dehumidified air into the installation space to cool the electronic components in the installation space. The cooling and dehumidification module includes: a communication duct located in the installation space, the communication duct being provided with an air inlet channel and an air outlet channel, the air inlet channel being in communication with the outside, the air outlet channel being in communication with the installation space, and the air outlet channel being in communication with the air inlet channel; An air suction member, one end of which is connected to the outside and the other end of which is connected to the air inlet channel; a dehumidification and heat dissipation component, partly located in the air inlet channel and partly located in the air outlet channel, for cooling and dehumidifying the air sucked into the communicating duct; The dehumidification and heat dissipation component includes: a heat conducting member, one end of which is disposed in the air inlet passage; A cooling condensation component, one end of which is arranged in the air outlet channel; A semiconductor refrigeration chip is arranged in the installation space, the other end of the heat-conducting member is in contact with the hot end of the semiconductor refrigeration chip, and the other end of the cold-conducting condensing member is in contact with the cold end of the semiconductor refrigeration chip; The air blown into the air inlet channel is heated by the heat-conducting member and then enters the air outlet channel. The heated air condenses when passing through the cooling condensation member, and water droplets generated by condensation adhere to the cooling condensation member. The industrial computer-based humidity monitoring and control system also includes: A heat conducting member, one end of which is arranged in the air outlet channel, and the other end of which is provided with a cold end bonding portion and a hot end bonding portion, wherein the cold end bonding portion is located on the cold end side close to the semiconductor refrigeration chip, and the hot end bonding portion is located on the hot end side close to the semiconductor refrigeration chip; A magnetic attraction member is provided on a side of the hot end bonding portion away from the semiconductor refrigeration plate; A magnetic induction component is disposed in the installation space and coupled with the magnetic attraction component; Among them, the magnetic field direction of the magnetic induction component is controlled according to the temperature difference between the inside and outside of the industrial computer body, so that the magnetic attraction component and the magnetic induction component are attracted or repelled, so that the cold end bonding part is bonded to the cold end of the semiconductor refrigeration plate or the hot end bonding part is bonded to the hot end of the semiconductor refrigeration plate, so as to change the temperature of the air passing through the cooling condensation component and blown into the installation space.

2. The industrial computer-based humidity monitoring and control system according to claim 1 is characterized in that: The air outlet channel includes a condensation end, which is formed by being inclined and bent in a vertically downward direction from an end of the air inlet channel away from the air suction member; The cooling condensation component includes a cooling fin portion, which is arranged in the condensation end and is inclined relative to the bending direction of the condensation end. The cooling fin portion is inclined to the axis of the air inlet channel.

3. The industrial computer-based humidity monitoring and control system according to claim 2 is characterized in that: The cooling condensation component further includes a cooling portion provided at one end of the cooling fin portion, wherein the cooling portion passes through the condensation end and is in contact with the cold end of the semiconductor refrigeration plate.

4. The industrial computer-based humidity monitoring and control system according to claim 2 is characterized in that: The air outlet channel further includes an air outlet end connected to one end of the condensation end, wherein the air outlet end is formed by being inclined and bent in a vertically upward direction away from one end of the air inlet channel from the condensation end; The air outlet is in communication with the installation space; The intersection of the condensation end and the air outlet end forms an intersection curve, and the farthest point of the intersection curve away from the semiconductor refrigeration plate is recorded as the intersection point. The air inlet channel is arranged parallel to the semiconductor refrigeration plate, and the maximum distance from the air inlet channel to the semiconductor refrigeration plate is recorded as a, and the maximum distance from the intersection point to the semiconductor refrigeration plate is recorded as b, satisfying the relationship: a>b.

5. The industrial computer-based humidity monitoring and control system according to claim 4 is characterized in that: A liquid outlet channel is provided on the gas outlet end, the liquid outlet channel is located at the junction of the condensation end and the gas outlet end, and the liquid outlet channel is arranged close to the semiconductor refrigeration plate; The dehumidification and heat dissipation component further includes a one-way circulation valve, one end of which is connected to the liquid outlet channel, and the other end of which is connected to an external liquid outlet pipe.

6. The industrial computer-based humidity monitoring and control system according to claim 1 is characterized in that: The industrial computer-based humidity monitoring and control system also includes: a first humidity module, disposed in the installation space, for obtaining a humidity value in the installation space; A second temperature module is provided on the industrial computer body and is used to monitor the ambient temperature of the industrial computer body; A second humidity module is provided on the industrial computer body and is used to detect the humidity value of the environment surrounding the industrial computer body; The second temperature module obtains the ambient temperature of the industrial computer main body to obtain a second measurement value; the first humidity module obtains the humidity in the installation space to obtain a third measurement value; and the second humidity module obtains the humidity of the ambient environment of the industrial computer main body to obtain a fourth measurement value; the power of the semiconductor refrigeration chip is calculated based on the first measurement value, the second measurement value, the third measurement value, and the fourth measurement value to obtain a cooling and dehumidification power value; the cooling and dehumidification power value is compared with the maximum power value of the semiconductor refrigeration chip; if the cooling and dehumidification power value is greater than the maximum power value of the semiconductor refrigeration chip, the semiconductor refrigeration chip is controlled to operate at the maximum power value; If the cooling and dehumidification power value is less than the maximum power value of the semiconductor refrigeration plate, the semiconductor refrigeration plate is controlled to operate at the cooling and dehumidification power value.

7. A monitoring and control method, applied to the industrial computer-based humidity monitoring and control system according to any one of claims 1 to 6, characterized in that: The monitoring and control method comprises: Acquire a real-time temperature value in the installation space through a first temperature module to obtain a first measurement value; Comparing the first measurement value with a temperature threshold, and generating a cooling and dehumidification signal if the temperature threshold is greater than the first measurement value; The cooling and dehumidification signal is executed to control the cooling and dehumidification module to cool and dehumidify the installation space.

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