Mainboard non-contact type semi-immersion liquid cooling server

Abstract

The invention provides a mainboard non-contact type semi-immersion liquid cooling server, and relates to the technical field of server heat dissipation. The server comprises a mainboard bin, a partition plate and a fluid bin which are sequentially arranged from top to bottom, wherein the partition plate is arranged between the mainboard bin and the fluid bin; a main board is arranged in the main board bin, the main board is installed in the main board bin in an inverted mode, and the back of the main board is arranged upwards; a CPU module, a memory bank module, a GPU module, a hard disk module and a power supply module are respectively mounted on the mainboard; the GPU module is connected with the mainboard in parallel through a cable, and the CPU module, the memory bank module, the GPU module, the hard disk module and the power module are all provided with heat-conducting fins. Thermal interface materials are filled between the heat-conducting fins and the CPU module, the memory bank module, the GPU module, the hard disk module and the power supply module; the heat-conducting fins penetrate through the partition plate and extend into the fluid bin. The heat dissipation performance of the server can be remarkably improved, meanwhile, liquid is prevented from making contact with the mainboard, the structure is simple, modification is easy, and the heat dissipation device is suitable for cabinet server equipment.

Description

Technical Field

[0001] The invention relates to the technical field of server heat dissipation, and in particular to a mainboard non-contact semi-immersion liquid cooling server. Background Art

[0002] In traditional server design and cooling solutions, key modules such as motherboards, CPUs, memory modules, GPUs, and power supplies are usually installed in a forward direction and cooled by air. However, this traditional method has many shortcomings. First, the efficiency of air cooling is relatively low, especially in high-density server deployment environments such as data centers, where it is difficult to meet the cooling requirements of high heat loads. Second, the failure rate of moving parts such as fans is high, resulting in increased maintenance costs. In addition, air cooling is prone to dust accumulation, affecting server performance and life.

[0003] In response to the above problems, patent technologies in recent years have attempted to use liquid cooling systems to improve heat dissipation efficiency. For example, the "liquid-cooled server" with patent number CN202410136851.2 proposes a solution that closely integrates the liquid cooling system with the server. Its main components include a liquid cooling plate, a liquid cooling link, a conversion device, etc. This patent directly cools the key heat source through circulating cooling liquid. However, the disadvantage of this solution is that the contact area between the liquid cooling plate and the heat source is limited, leakage causes equipment failure, and the liquid circulation efficiency is limited by the internal space layout of the server.

[0004] Another patent number CN202410162029.3, "A server and immersed liquid cooling server system", adopts a design that immerses the server components in the coolant. The patent adopts a box-type structure, with the motherboard vertically inserted into the liquid cooling box, and the motherboard is arranged horizontally in the box. This type of liquid cooling server is not suitable for standard server cabinets, and it is difficult to use the vertical space in the data center, and it occupies a large space.

[0005] Although the above existing patent solutions have improved the heat dissipation problem of the server to a certain extent, they still have shortcomings such as leakage, poor sealing, low space utilization and high system complexity. Summary of the invention

[0006] In order to solve the above technical problems existing in the prior art, the embodiment of the present invention provides a motherboard non-contact semi-immersion liquid cooling server, which not only improves the heat conduction efficiency and heat dissipation effect, but also enhances the sealing and safety of the system, and reduces energy consumption and maintenance costs through inverted module installation, optimized heat conduction system design, and innovative partition plate and fluid compartment structure. The technical solution is as follows:

[0007] A motherboard non-contact semi-immersion liquid cooling server comprises a motherboard compartment, a partition plate and a fluid compartment arranged in sequence from top to bottom, wherein the partition plate is arranged between the motherboard compartment and the fluid compartment;

[0008] A mainboard is arranged in the mainboard compartment, and the mainboard is installed in the mainboard compartment in an inverted manner, with the back of the mainboard facing upwards;

[0009] The mainboard is equipped with a CPU module, a memory module, a GPU module, a hard disk module and a power module;

[0010] The CPU module, memory module, GPU module, hard disk module and power module are all equipped with heat conducting sheets;

[0011] The heat conducting sheet passes through the partition plate and extends into the fluid compartment, and the heat conducting sheet is in close contact with the partition plate;

[0012] The mainboard compartment is connected to the fluid compartment via a side connector.

[0013] The GPU module is connected in parallel with the mainboard via cables.

[0014] Thermal interface materials are filled between the heat conducting sheet and the CPU module, memory module, GPU module, hard disk module and power module.

[0015] The partition plate is provided with a through hole for the heat conducting sheet to pass through, and a sealing ring is provided at the edge of the through hole. The through hole is in close contact with the heat conducting sheet through the sealing ring.

[0016] A sealing gasket is provided between the partition plate and the fluid compartment, and the sealing gasket is arranged along the edge of the partition plate.

[0017] The fluid warehouse adopts a bottom-in-top-out liquid supply method, a liquid inlet is provided at the lower part of one side of the fluid warehouse, and a liquid outlet is provided at the upper part of the other side of the fluid warehouse, and the liquid inlet and the liquid outlet are distributed diagonally.

[0018] A liquid level detector is provided at a corner of the fluid bin, and at least two spaced baffles are provided in the fluid bin. The height of the baffle is the internal depth of the fluid bin, and the multiple baffles are arranged in an S-shape or a step-shape in the fluid bin.

[0019] Fans are provided at both left and right ends of the mainboard compartment.

[0020] The heat conducting sheet is a heat conducting material with a large thermal conductivity (copper or aluminum material is used, and the thermal conductivity is generally required to be greater than 200 W / (m·K)), and the heat conducting sheet is a heat pipe.

[0021] When the server is maintained, the process is as follows:

[0022] S1. Empty the liquid in the fluid tank through the pump;

[0023] S2. Turn off the computer and disconnect the power cord and network cable.

[0024] S3. Pull the server out of the cabinet;

[0025] S4. Open the connector, lift up the mainboard compartment together with the partition plate, and turn it over;

[0026] S5, remove the partition plate;

[0027] S6. Remove the screws connecting the heat conducting sheet and take it off.

[0028] S7. Remove one or more of the CPU module, memory module, GPU module, and fan accessories for maintenance.

[0029] The liquid in step S1 is a non-conductive liquid with a large specific heat capacity and good thermal conductivity. Generally, the specific heat capacity is required to be ≥ 0.96 J / (g·K) and the liquid thermal conductivity is required to be ≥ 0.06 W / (m·K).

[0030] The beneficial effects brought about by the technical solution provided by the embodiment of the present invention include at least:

[0031] 1. The present invention achieves non-contact between the coolant and the mainboard through the inverted installation of the mainboard, thereby avoiding the mainboard short circuit problem caused by the coolant; the use of heat conductive sheets and thermal interface materials can improve the heat conduction efficiency, reduce thermal resistance, and further optimize the heat dissipation performance of the server.

[0032] 2. The present invention adopts an innovative structural design of the partition plate and the fluid bin, which effectively prevents leakage of the coolant, reduces the risk of server failure, and facilitates maintenance and repair; through the structure of the fluid bin and the design of its internal liquid level detector and baffle, the coolant flow is more reasonable, the cooling efficiency is improved, and the energy consumption is reduced.

[0033] 3. The present invention makes the flow of coolant inside the server smoother and the heat distribution more uniform, effectively improving the heat dissipation efficiency, reducing the operating temperature of the server, and extending the service life of the hardware. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0035] Figure 1This is a schematic diagram of the structure of a motherboard non-contact semi-immersion liquid cooling server provided by an embodiment of the present invention;

[0036] Figure 2 This is a schematic diagram of the internal structure of a motherboard compartment of a motherboard non-contact semi-immersion liquid cooling server provided by an embodiment of the present invention;

[0037] Figure 3 It is a schematic diagram of the exploded structure of a motherboard non-contact semi-immersion liquid cooling server provided by an embodiment of the present invention;

[0038] Figure 4 This is a schematic diagram of the connection between a CPU module and a heat conducting sheet in a motherboard non-contact semi-immersion liquid cooling server provided by an embodiment of the present invention;

[0039] Figure 5 This is a schematic diagram of the connection between a memory module and a heat conducting sheet in a motherboard non-contact semi-immersion liquid cooling server provided in an embodiment of the present invention;

[0040] Figure 6 This is a schematic diagram of the connection between a GPU module and a heat conducting sheet in a motherboard non-contact semi-immersion liquid cooling server provided in an embodiment of the present invention;

[0041] Figure 7 This is a schematic diagram of the connection between a power module and a heat conducting sheet in a motherboard non-contact semi-immersion liquid cooling server provided in an embodiment of the present invention;

[0042] Figure 8 This is a schematic diagram of the connection between a partition plate and a heat conducting sheet in a motherboard non-contact semi-immersion liquid cooling server provided in an embodiment of the present invention;

[0043] Fig. 9 yes Figure 1 A magnified schematic diagram of the middle part;

[0044] Fig.10 It is a schematic diagram of a double-layer structure of a heat conducting plate in a motherboard non-contact semi-immersion liquid cooling server provided in an embodiment of the present invention;

[0045] Fig.11 It is a schematic diagram of a fluid bin with baffles in a motherboard non-contact semi-immersion liquid cooling server provided in an embodiment of the present invention;

[0046] Fig.12 It is a schematic diagram of a motherboard compartment with a fan in a motherboard non-contact semi-immersion liquid cooling server provided in an embodiment of the present invention.

[0047] Among them: 1-mainboard compartment; 2-mainboard; 3-partition plate; 4-fluid compartment; 5-CPU module; 6-memory module; 7-GPU module; 8-hard disk module; 9-power module; 10-thermal interface material; 11-heat conductive sheet; 12-sealing ring; 13-sealing gasket; 14-liquid inlet; 15-liquid outlet; 16-connector; 17-baffle; 18-liquid level meter; 19-fan. DETAILED DESCRIPTION

[0048] The technical solution of the present invention is described below in conjunction with the accompanying drawings.

[0049] In the embodiments of the present invention, words such as "exemplarily" and "for example" are used to indicate examples, illustrations or explanations. Any embodiment or design described as "example" in the present invention should not be interpreted as being more preferred or more advantageous than other embodiments or designs. Specifically, the use of the word "example" is intended to present the concept in a specific way. In addition, in the embodiments of the present invention, the meaning expressed by "and / or" can be both, or it can be either of the two.

[0050] In the embodiments of the present invention, sometimes a subscript such as W1 may be written as a non-subscript such as W1. When the difference is not emphasized, the meanings to be expressed are the same.

[0051] In order to make the technical problems, technical solutions and advantages to be solved by the present invention more clear, a detailed description will be given below with reference to the accompanying drawings and specific embodiments.

[0052] The embodiment of the present invention provides a motherboard non-contact semi-immersion liquid cooling server. Figure 1 , Figure 2 , Figure 3 The motherboard non-contact semi-immersion liquid cooling server shown includes:

[0053] A mainboard compartment 1, a partition plate 3 and a fluid compartment 4 are arranged in sequence from top to bottom, wherein the partition plate 3 is arranged between the mainboard compartment 1 and the fluid compartment 4;

[0054] A mainboard 2 is arranged in the mainboard compartment 1, and the mainboard 2 is installed in the mainboard compartment 1 in an inverted manner, with the back of the mainboard 2 facing upwards;

[0055] The mainboard 2 is equipped with a CPU module 5, a memory module 6, a GPU module 7, a hard disk module 8 and a power module 9;

[0056] The CPU module 5, the memory module 6, the GPU module 7, the hard disk module 8 and the power module 9 are all equipped with a heat conducting sheet 11, which is made of copper or aluminum alloy;

[0057] The heat conducting sheet 11 passes through the partition plate 3 and extends into the fluid compartment 4, and the heat conducting sheet 11 is in close contact with the partition plate 3;

[0058] like Fig. 9 The mainboard compartment 1 is connected to the fluid compartment 4 via a side connector 16 .

[0059] like Figure 4 , Figure 5 , Figure 6 , Figure 7 As shown, thermal interface material 10 is filled between the heat conducting sheet 11 and the CPU module 5 , the memory module 6 , the GPU module 7 , the hard disk module 8 and the power module 9 .

[0060] like Figure 8 The partition plate 3 is provided with a through hole for the heat conducting sheet 11 to pass through. Fig.10 A sealing ring 12 is provided at the edge of the through hole, and the through hole is in close contact with the heat conducting sheet 11 through the sealing ring 12 .

[0061] A sealing gasket 13 is provided between the partition plate 3 and the fluid compartment 4 .

[0062] like Figure 3 The fluid tank 4 adopts a bottom-in-top-out liquid supply method, a liquid inlet 14 is provided at the lower part of one side of the fluid tank 4, and a liquid outlet 15 is provided at the upper part of the other side of the fluid tank 4, and the liquid inlet 14 and the liquid outlet 15 are distributed diagonally. A liquid level detector 18 is provided at a corner of the fluid tank 4.

[0063] like Fig.11 The fluid compartment 4 is provided with at least two baffles 17 which are spaced apart from each other.

[0064] like Fig.12 A fan 19 is provided at both the left and right ends of the mainboard compartment 1 .

[0065] When the server is maintained, the process is as follows:

[0066] S1, emptying the liquid in the fluid compartment 4 by means of a pump;

[0067] S2. Turn off the computer and disconnect the power cord and network cable.

[0068] S3. Pull the server out of the cabinet;

[0069] S4, open the connecting piece 16, lift up the mainboard compartment 1 together with the partition plate 3, and turn them over;

[0070] S5, remove the partition plate 3;

[0071] S6, remove the screws connecting the heat conducting sheet 11 and remove the heat conducting sheet 11;

[0072] S7, remove one or more of the CPU module 5, the memory module 6, the GPU module 7, and the fan 19 accessories for maintenance.

[0073] This will be described below with reference to specific embodiments.

[0074] Example 1

[0075] Reference Figure 1-Figure 11 A motherboard non-contact semi-immersion liquid cooling server comprises a motherboard compartment 1, a partition plate 3 and a fluid compartment 4 arranged in sequence from top to bottom, wherein the partition plate 3 is arranged between the motherboard compartment 1 and the fluid compartment 4;

[0076] A mainboard 2 is arranged in the mainboard compartment 1, and the mainboard 2 is installed in the mainboard compartment 1 in an inverted manner, with the back of the mainboard 2 facing upwards;

[0077] The mainboard 2 is respectively equipped with a CPU module 5, a memory module 6, a GPU module 7, a hard disk module 8 and a power module 9; the GPU module 7 is connected in parallel with the mainboard 2 via a cable.

[0078] The CPU module 5 , the memory module 6 , the GPU module 7 , the hard disk module 8 and the power module 9 are all equipped with heat conducting sheets 11 .

[0079] In this embodiment, the motherboard 2 is installed upside down, that is, the back of the motherboard 2 is set upward, so that the coolant is not in contact with the motherboard 2, avoiding the problem of motherboard short circuit caused by the coolant. At the same time, the innovative structural design of the partition plate 3 and the fluid compartment 4 effectively prevents the leakage of the coolant, reduces the risk of server failure, and facilitates maintenance and repair.

[0080] Specifically, the thermal interface material 10 is filled between the heat conductive sheet 11 and the CPU module 5, the memory module 6, the GPU module 7, the hard disk module 8 and the power module 9 respectively; the heat conductive sheet 11 passes through the partition plate 3 and extends into the fluid compartment 4, and the heat conductive sheet 11 is in close contact with the partition plate 3.

[0081] The heat conducting sheet 11 is a heat conducting material with a large thermal conductivity, and the heat conducting sheet 11 is a heat pipe.

[0082] In this embodiment, the use of the heat conducting sheet 11 and the thermal interface material 10 can improve the heat conduction efficiency, reduce the thermal resistance, and further optimize the heat dissipation performance of the server.

[0083] Specifically, the partition plate 3 is provided with a through hole for the heat conducting sheet 11 to pass through, and a sealing ring 12 is provided at the edge of the through hole. The through hole is in close contact with the heat conducting sheet 11 through the sealing ring 12 .

[0084] Specifically, a sealing gasket 13 is provided between the partition plate 3 and the fluid compartment 4 , and the main compartment 1 and the fluid compartment 4 are connected via a connector 16 .

[0085] In this embodiment, a sealing ring 12 , a sealing gasket 13 , etc. are used to further improve the sealing performance of the server, and a connector 16 is used to reliably connect the mainboard compartment 1 and the fluid compartment 4 .

[0086] Specifically, the fluid bin 4 adopts a bottom-in-top-out liquid supply method, a liquid inlet 14 is provided at the lower end of one side of the fluid bin 4, and a liquid outlet 15 is provided at the upper end of the other side of the fluid bin 4, and the liquid inlet 14 and the liquid outlet 15 are diagonally distributed.

[0087] Specifically, a liquid level detector 18 is provided at a corner of the fluid bin 4 , and a plurality of baffles 17 distributed at intervals are also provided in the fluid bin 4 .

[0088] In this embodiment, the structure of the fluid bin 4 and the design of the internal liquid level detector 18 and the baffle 17 make the coolant flow more reasonable, improve the cooling efficiency, and reduce energy consumption; make the coolant flow inside the server smoother, and the heat distribution more uniform, effectively improve the heat dissipation efficiency, reduce the server operating temperature, and extend the service life of the hardware. Here, the baffle 17 is set in the fluid bin 4 to increase the turbulence of the fluid, prevent the fluid flow path from "short circuiting", increase the heat exchange capacity of the fluid, and make the fluid fully contact with the heat conducting plate, so as to achieve the purpose of uniform heat dissipation of the motherboard. In actual application, the baffle structure and arrangement form are designed according to the server power and usage conditions.

[0089] The server maintenance method includes the following steps:

[0090] S1, empty the fluid tank 4 through the pump;

[0091] S2. Turn off the computer and disconnect the power cord and network cable.

[0092] S3. Pull the server out of the cabinet;

[0093] S4, open the connector 16 of the fluid compartment 4, lift up the mainboard compartment 1 together with the partition plate 3, and turn them over;

[0094] S5, remove the partition plate 3;

[0095] S6, remove the screws connecting the heat conducting sheet 11 and remove the heat conducting sheet 11;

[0096] S7. Remove the CPU module 5, the memory module 6, and the GPU module 7 for maintenance.

[0097] Example 2

[0098] Reference Figure 1-10 , Fig.12 A motherboard non-contact semi-immersion liquid cooling server comprises a motherboard compartment 1, a partition plate 3 and a fluid compartment 4 arranged in sequence from top to bottom, wherein the partition plate 3 is arranged between the motherboard compartment 1 and the fluid compartment 4;

[0099] A mainboard 2 is arranged in the mainboard compartment 1, and the mainboard 2 is installed in the mainboard compartment 1 in an inverted manner, with the back of the mainboard 2 facing upwards;

[0100] The mainboard 2 is respectively equipped with a CPU module 5, a memory module 6, a GPU module 7, a hard disk module 8 and a power module 9; the GPU module 7 is connected in parallel with the mainboard 2 via a cable.

[0101] The CPU module 5 , the memory module 6 , the GPU module 7 , the hard disk module 8 and the power module 9 are all equipped with heat conducting sheets 11 .

[0102] In this embodiment, the motherboard 2 is installed upside down, that is, the back of the motherboard 2 is set upward, so that the coolant is not in contact with the motherboard 2, avoiding the problem of motherboard short circuit caused by the coolant. At the same time, the innovative structural design of the partition plate 3 and the fluid compartment 4 effectively prevents the leakage of the coolant, reduces the risk of server failure, and facilitates maintenance and repair.

[0103] Specifically, the thermal interface material 10 is filled between the heat conductive sheet 11 and the CPU module 5, the memory module 6, the GPU module 7, the hard disk module 8 and the power module 9 respectively; the heat conductive sheet 11 passes through the partition plate 3 and extends into the fluid compartment 4, and the heat conductive sheet 11 is in close contact with the partition plate 3.

[0104] The heat conducting sheet 11 is a heat conducting material with a large thermal conductivity, and the heat conducting sheet 11 is a heat pipe.

[0105] In this embodiment, the use of the heat conducting sheet 11 and the thermal interface material 10 can improve the heat conduction efficiency, reduce the thermal resistance, and further optimize the heat dissipation performance of the server.

[0106] Specifically, the partition plate 3 is provided with a through hole for the heat conducting sheet 11 to pass through, and a sealing ring 12 is provided at the edge of the through hole. The through hole is in close contact with the heat conducting sheet 11 through the sealing ring 12 .

[0107] Specifically, a sealing gasket 13 is provided between the partition plate 3 and the fluid compartment 4 , and the main compartment 1 and the fluid compartment 4 are connected via a connector 16 .

[0108] In this embodiment, a sealing ring 12 , a sealing gasket 13 , etc. are used to further improve the sealing performance of the server, and a connector 16 is used to reliably connect the mainboard compartment 1 and the fluid compartment 4 .

[0109] Specifically, the fluid bin 4 adopts a bottom-in-top-out liquid supply method, a liquid inlet 14 is provided at the lower end of one side of the fluid bin 4, and a liquid outlet 15 is provided at the upper end of the other side of the fluid bin 4, and the liquid inlet 14 and the liquid outlet 15 are diagonally distributed.

[0110] Specifically, a liquid level detector 18 is provided at a corner of the fluid compartment 4 .

[0111] Specifically, fans 19 are respectively provided at the left and right ends of the mainboard compartment 1 .

[0112] In this embodiment, the structure of the fluid compartment 4 and the design of the internal liquid level detector 18 make the coolant flow more reasonable, improve the cooling efficiency, and reduce energy consumption; make the coolant flow inside the server smoother, and the heat distribution more uniform, effectively improve the heat dissipation efficiency, reduce the server operating temperature, and extend the service life of the hardware. At the same time, by setting a fan 19 on the motherboard compartment 1 to enhance the heat dissipation of the motherboard 2, since most of the heat of the server has been taken away by the heat conducting sheet 11 and the fluid, the fan 19 mainly takes away the heat of other parts of the motherboard 2, so the fan 19 can use a low speed, and can also reduce the overall noise of the server. At the same time, the use of air-liquid heat dissipation can reduce the cost of transformation.

[0113] The server maintenance method includes the following steps:

[0114] S1, empty the fluid tank 4 through the pump;

[0115] S2. Turn off the computer and disconnect the power cord and network cable.

[0116] S3. Pull the server out of the cabinet;

[0117] S4, open the connector 16 of the fluid compartment 4, lift up the mainboard compartment 1 together with the partition plate 3, and turn them over;

[0118] S5, remove the partition plate 3;

[0119] S6, remove the screws connecting the heat conducting sheet 11 and remove the heat conducting sheet 11;

[0120] S7. Remove the CPU module 5, memory module 6, GPU module 7, and fan 19 accessories for maintenance.

[0121] In summary, the present invention not only improves the heat conduction efficiency and heat dissipation effect, but also enhances the sealing and safety of the system, and reduces energy consumption and maintenance costs through inverted module installation, optimized heat conduction system design, and innovative partition plate and fluid compartment structure.

[0122] The above is only a specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention, which should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention should be based on the protection scope of the claims.

Claims

1. A motherboard non-contact semi-immersion liquid cooling server, characterized in that: It includes a mainboard compartment, a partition plate and a fluid compartment which are arranged in sequence from top to bottom, wherein the partition plate is arranged between the mainboard compartment and the fluid compartment; A mainboard is arranged in the mainboard compartment, and the mainboard is installed in the mainboard compartment in an inverted manner, with the back of the mainboard facing upwards; The mainboard is equipped with a CPU module, a memory module, a GPU module, a hard disk module and a power module; The CPU module, memory module, GPU module, hard disk module and power module are all equipped with heat conducting sheets; The heat conducting sheet passes through the partition plate and extends into the fluid compartment, and the heat conducting sheet is in close contact with the partition plate; The mainboard compartment is connected to the fluid compartment via a side connector.

2. The motherboard non-contact semi-immersion liquid cooling server according to claim 1, characterized in that: The GPU module is connected in parallel with the mainboard via cables.

3. The motherboard non-contact semi-immersion liquid cooling server according to claim 1, characterized in that: Thermal interface materials are filled between the heat conducting sheet and the CPU module, memory module, GPU module, hard disk module and power module.

4. The motherboard non-contact semi-immersion liquid cooling server according to claim 1, characterized in that: The partition plate is provided with a through hole for the heat conducting sheet to pass through, and a sealing ring is provided at the edge of the through hole. The through hole is in close contact with the heat conducting sheet through the sealing ring.

5. The motherboard non-contact semi-immersion liquid cooling server according to claim 1, characterized in that: A sealing gasket is provided between the partition plate and the fluid compartment, and the sealing gasket is arranged along the edge of the partition plate.

6. The motherboard non-contact semi-immersion liquid cooling server according to claim 1, characterized in that: The fluid warehouse adopts a bottom-in-top-out liquid supply method, a liquid inlet is provided at the lower part of one side of the fluid warehouse, and a liquid outlet is provided at the upper part of the other side of the fluid warehouse, and the liquid inlet and the liquid outlet are distributed diagonally.

7. The motherboard non-contact semi-immersion liquid cooling server according to claim 1, characterized in that: A liquid level detector is provided at a corner of the fluid bin, and at least two baffles are provided at intervals in the fluid bin.

8. The motherboard non-contact semi-immersion liquid cooling server according to claim 7, characterized in that: The height of the baffle is the internal depth of the fluid bin, and a plurality of baffles are arranged in an S-shape or a stepped shape in the fluid bin.

9. The motherboard non-contact semi-immersion liquid cooling server according to claim 1, characterized in that: Fans are provided at both left and right ends of the mainboard compartment.

10. The motherboard non-contact semi-immersion liquid cooling server according to claim 9, characterized in that: When the server is maintained, the process is as follows: S1. Empty the liquid in the fluid tank through the pump; S2. Turn off the computer and disconnect the power cord and network cable. S3. Pull the server out of the cabinet; S4. Open the connector, lift up the mainboard compartment together with the partition plate, and turn it over; S5, remove the partition plate; S6. Remove the screws connecting the heat conducting sheet and take it off. S7. Remove one or more of the CPU module, memory module, GPU module, and fan accessories for maintenance.

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