Conductive adhesive sheet adjusting system and adjusting method

Abstract

The invention relates to an adjusting system and an adjusting method for a conductive adhesive mounting piece. The adjusting system comprises an acquisition module and an image processing module which are electrically connected with a processor module, the processor module is configured to compare the thickness, the climbing height and the flatness of the conductive adhesive with corresponding preset standard ranges so as to judge whether the thickness, the climbing height and the flatness of the conductive adhesive are all in the preset standard ranges or not, and if any one of the thickness, the climbing height and the flatness of the conductive adhesive is not in the preset standard ranges, the processor module sends the conductive adhesive to the processor module; if yes, the processor module controls the alarm module to give an alarm, and the processor module adjusts parameters of the chip in the conductive adhesive mounting process, so that the thickness, the climbing height and the flatness of the conductive adhesive are all in corresponding preset standard ranges; the thickness, the climbing height and the flatness of the conductive adhesive are accurately obtained, whether the thickness, the climbing height and the flatness of the conductive adhesive meet the standard or not is conveniently judged, and the conductive adhesive can be timely adjusted to the required state when the thickness, the climbing height and the flatness do not meet the standard.

Description

Technical Field

[0001] The invention belongs to the field of semiconductor dispensing, and in particular relates to a conductive adhesive sheet adjustment system and an adjustment method. Background Art

[0002] In recent years, with the rapid development of semiconductors, the chip dispensing process has been continuously improved, and the corresponding detection technology is also a hot topic of research. Traditional manual detection technology relies on naked eye observation, which will bring a lot of errors. With the rapid development of conductive adhesive films, the demand for chips is increasing and the indicators for chip yield are getting higher and higher, manual detection will be gradually eliminated.

[0003] Manual inspection is gradually being replaced by automatic inspection technology due to its shortcomings such as low inspection efficiency, low precision, high cost, high labor intensity and inconsistent standards. Early automatic inspection technology mainly revolved around machine vision technology, which has been widely studied and applied for its high precision, high reliability, non-contact and strong objectivity. However, most of the current inspection devices measure overflow and contamination, and lack the measurement of conductive adhesive thickness, flatness and climbing height.

[0004] Therefore, due to the technical problem that the thickness, flatness and climbing height of the conductive adhesive cannot be detected and judged, it is necessary to design a new conductive adhesive mounting adjustment system and adjustment method.

[0005] It should be noted that the above information disclosed in this background technology section is only used to understand the background technology of the present application concept, and therefore, the above description is not considered to constitute information of the prior art. Summary of the invention

[0006] The embodiments of the present disclosure at least provide a conductive adhesive sheet adjustment system and an adjustment method.

[0007] In a first aspect, an embodiment of the present disclosure provides a conductive adhesive sheet adjustment system, comprising: A processor module, and an acquisition module and an image processing module electrically connected to the processor module; The acquisition module is configured to acquire an image of the chip after the conductive adhesive sheet is attached; The image processing module is configured to process the image collected by the collection module to obtain the thickness, height and flatness of the conductive adhesive; The processor module is configured to compare the thickness, creepage and flatness of the conductive adhesive with the corresponding preset standard range to determine whether the thickness, creepage and flatness of the conductive adhesive are all within the preset standard range. If any one of the thickness, creepage and flatness of the conductive adhesive is not within the preset standard range, the processor module controls the alarm module to alarm, and the processor module adjusts the parameters of the chip during the conductive adhesive mounting process to ensure that the thickness, creepage and flatness of the conductive adhesive are within the corresponding preset standard range.

[0008] In an optional embodiment, the image processing module is configured to process the image collected by the collection module to obtain the thickness, height and flatness of the conductive adhesive. The image processing module is configured to filter and remove noise from the image of the chip after conductive adhesive bonding by using a filtering method of median filtering and Gaussian filtering; and The image processing module is configured to, after filtering and denoising the image, use principal component analysis and least squares algorithm to fit the chip after conductive glue bonding, and use sub-pixel edge detection algorithm to fit the side contour of the chip and the contour formed by the conductive glue in the processed image to form a model of the chip and the conductive glue, and measure the thickness, height and flatness of the conductive glue based on the model.

[0009] In an optional embodiment, the thickness of the conductive adhesive is the average value of the heights of the four corners of the top surface of the chip; The flatness is the difference between the maximum and minimum values ​​of the heights of the four corners of the chip top surface.

[0010] In an optional implementation, the processor module adjusts the parameters of the chip during the conductive adhesive bonding process so that the thickness, height and flatness of the conductive adhesive are within the corresponding preset standard ranges, including: The processor module controls the glue output of the glue dispenser, that is, The processor module controls the gas flow rate of the glue dispenser to increase so as to increase the glue output; The processor module controls the dispensing delay of the dispensing machine to increase the amount of glue discharged; The processor module controls the pre-dispensing delay of the dispensing machine to increase the amount of glue discharged; When the amount of glue output increases, the thickness of the conductive glue increases; If the air flow adjustment, dispensing delay adjustment and pre-dispensing delay adjustment of the dispensing machine cannot make the thickness of the conductive glue meet the corresponding preset standard range, the processor module controls the loading device to perform height compensation. The lower the loading compensation height, the thinner the thickness of the conductive glue. When the glue output increases and the compensation height of the loading device is constant, the climbing height increases; The processor module controls the film loading device to perform height compensation, and reduces the film loading height compensation to increase the climbing height; When the glue output is constant, the processor module controls the loading device to perform height compensation, and reduces the loading height compensation to make the flatness within the corresponding preset standard range.

[0011] In an optional embodiment, the processor module is also electrically connected to a lighting module, and the lighting module is suitable for illuminating the chip after the conductive adhesive sheet is completed; The lighting module comprises: a light source, a brightness adjustment submodule and a brightness detection submodule electrically connected to the processor module; The brightness detection submodule is suitable for detecting the brightness of the light source; The processor module is configured to control the brightness adjustment submodule to adjust the brightness of the light source according to the requirements of the acquisition module when acquiring images.

[0012] In an optional implementation, the lighting module further includes: a stability control submodule, a short circuit protection submodule and a power-off saving submodule electrically connected to the processor module; The stability control submodule is adapted to maintain stable illumination of the light source; The short-circuit protection submodule is suitable for monitoring the circuit state of the light source and protecting the light source when the circuit is short-circuited; The power-off saving submodule is adapted to save the operating parameters and status information of the light source when the power is off; The short circuit protection unit is used to monitor the status of the circuit of the LED light source and the halogen lamp; and The power-off saving unit is used to save the working parameters and status information of the light source when the power is off.

[0013] In a second aspect, the embodiment of the present disclosure further provides an adjustment method using the above conductive adhesive sheet adjustment system, comprising: The processor module compares the thickness, creepage and flatness of the conductive adhesive with the corresponding preset standard range to determine whether the thickness, creepage and flatness of the conductive adhesive are all within the preset standard range. If any one of the thickness, creepage and flatness of the conductive adhesive is not within the preset standard range, the processor module controls the alarm module to alarm, and the processor module adjusts the parameters of the chip during the conductive adhesive mounting process to ensure that the thickness, creepage and flatness of the conductive adhesive are within the corresponding preset standard range.

[0014] In a third aspect, an embodiment of the present disclosure further provides a computer device including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the steps of the above-mentioned adjustment method.

[0015] In a fourth aspect, an embodiment of the present disclosure further provides a computer-readable storage medium having a computer program / instruction stored thereon, wherein the computer program / instruction implements the steps of the above-mentioned adjustment method when executed by a processor.

[0016] In a fifth aspect, an embodiment of the present disclosure further provides a computer program product, including a computer program / instruction, characterized in that the computer program / instruction implements the steps of the above-mentioned adjustment method when executed by a processor.

[0017] The beneficial effect of the present invention is that the conductive glue mounting adjustment system comprises: a processor module, and an acquisition module and an image processing module electrically connected to the processor module; the acquisition module is configured to acquire an image of a chip after conductive glue mounting is completed; the image processing module is configured to process the image acquired by the acquisition module to obtain the thickness, creepage and flatness of the conductive glue; the processor module is configured to compare the thickness, creepage and flatness of the conductive glue with the corresponding preset standard range to determine whether the thickness, creepage and flatness of the conductive glue are all within the preset standard range. If any one of the thickness, creepage and flatness of the conductive glue is not within the preset standard range, the processor module controls the alarm module to alarm, and the processor module adjusts the parameters of the chip during the conductive glue mounting process so that the thickness, creepage and flatness of the conductive glue are all within the corresponding preset standard range; the thickness, creepage and flatness of the conductive glue are accurately acquired, which is convenient for determining whether the thickness, creepage and flatness of the conductive glue meet the standards, and when they do not meet the standards, they can be adjusted to the required state in time.

[0018] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description, claims and drawings.

[0019] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, this article specifically cites preferred embodiments and provides detailed descriptions as follows in conjunction with the attached drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1A principle block diagram of a conductive adhesive sheet adjustment system provided in an embodiment of the present disclosure; Figure 2 A specific principle block diagram of a conductive adhesive sheet adjustment system provided in an embodiment of the present disclosure; Figure 3 A flow chart of an adjustment method provided in an embodiment of the present disclosure. DETAILED DESCRIPTION

[0022] In order to make the purpose, technical solution and advantages of the embodiments of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] As used herein, the phrases "in one embodiment," "according to one embodiment," "in some embodiments," and the like generally refer to the fact that the particular feature, structure, or characteristic following the phrase may be included in at least one embodiment of the present disclosure. Therefore, a particular feature, structure, or characteristic may be included in more than one embodiment of the present disclosure, so that these phrases do not necessarily refer to the same embodiment. As used herein, the terms "example," "exemplary," and the like are used to "serve as an example, instance, or illustration." Any implementation, aspect, or design described herein as "example" or "exemplary" is not necessarily to be construed as preferred or superior to other implementations, aspects, or designs. On the contrary, the use of the terms "example," "exemplary," and the like is intended to present concepts in a concrete manner.

[0024] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0025] like Figure 1As shown, at least one disclosed embodiment provides a conductive glue mounting adjustment system, comprising: a processor module, and an acquisition module and an image processing module electrically connected to the processor module; the acquisition module is configured to acquire an image of a chip after conductive glue mounting; the image processing module is configured to process the image acquired by the acquisition module to obtain the thickness, creepage and flatness of the conductive glue; the processor module is configured to compare the thickness, creepage and flatness of the conductive glue with the corresponding preset standard range to determine whether the thickness, creepage and flatness of the conductive glue are all within the preset standard range. If any one of the thickness, creepage and flatness of the conductive glue is not within the preset standard range, the processor module controls the alarm module to alarm, and the processor module adjusts the parameters of the chip during the conductive glue mounting process so that the thickness, creepage and flatness of the conductive glue are all within the corresponding preset standard range; the thickness, creepage and flatness of the conductive glue are accurately acquired, which is convenient for determining whether the thickness, creepage and flatness of the conductive glue meet the standards, and when they do not meet the standards, they can be adjusted to the required state in a timely manner.

[0026] In an optional embodiment, the image processing module is configured to process the image captured by the acquisition module to obtain the thickness, height and flatness of the conductive adhesive, that is, the image processing module is configured to use median filtering and Gaussian filtering methods to filter and denoise the image of the chip after the conductive adhesive is mounted; and the image processing module is configured to use principal component analysis and least squares algorithm to fit the chip after the conductive adhesive is mounted after filtering and denoising the image, and use a sub-pixel edge detection algorithm to fit the side contour of the chip and the contour formed by the conductive adhesive in the processed image to form a model of the chip and the conductive adhesive, and measure the thickness, height and flatness of the conductive adhesive according to the model.

[0027] The image processing module is used to use an algorithm to extract feature information from the image data filtered by the image filtering submodule, including length, width, height, edge contour, etc. The algorithm is one or more of principal component analysis, least squares method and edge detection; the image processing module uses the three-dimensional information of the chip after mounting extracted by the image filtering submodule to perform deep processing again. First, the information of the surface and surrounding sides of the chip after mounting is extracted by principal component analysis and least squares method, including the irregular shape formed by the conductive adhesive climbing around the chip after the chip is mounted on the conductive adhesive. The edge detection uses the sub-pixel edge detection method to fit the length, width and height edges around the chip and the surface, and the shape formed by the conductive adhesive to obtain the contour characteristics of the conductive adhesive and the chip.

[0028] In an optional embodiment, the thickness of the conductive glue is the average value of the heights of the four corners of the top surface of the chip; the flatness is the difference between the maximum and minimum values ​​of the heights of the four corners of the top surface of the chip; the preset standard range for the flatness of the conductive glue is 0-20um, that is, the flatness is the difference between the maximum and minimum values ​​of the heights of the four corners of the top surface of the chip is less than 20um, and the given ratio (preset standard range) of the climbing height is set to 1 / 3-2 / 3 of the chip thickness, and the given range (preset standard range) of the glue thickness is 10-20um; the judgment and comparison function can be directly integrated into the processor module, or the corresponding module can be independently set; the specific climbing height comparison can be to extract the data of the highest point of the irregular shape formed by the conductive glue on the side walls around the chip, and compare it with the extracted data of the chip after mounting. The height data of the side walls are compared to obtain the ratio of the two. If the ratio of the two is greater than the given ratio range of the climbing height, it is considered that the climbing height value is higher. If it is less than the given ratio range of the climbing height, it is considered to be lower. The specific glue thickness comparison can be, extracting the vertex data around the chip after mounting, taking the average of the four vertex data, and performing a difference operation with the known actual thickness of the chip. The value after the difference operation is compared with the given glue thickness range. If it is greater than the given thickness, it is considered to be thick glue. If it is less than the given glue thickness range, it is considered to be thin glue. The specific flatness comparison can be, obtaining the difference between the maximum and minimum values ​​of the height of the four corners of the top surface of the chip. If the difference is within the preset standard range of flatness, the flatness is judged to be qualified, otherwise the flatness is judged to be unqualified.

[0029] like Figure 2As shown, in an optional embodiment, the processor module adjusts the parameters of the chip during the conductive glue mounting process so that the thickness, climbing height and flatness of the conductive glue are all within the corresponding preset standard range, including: the processor module controls the glue output of the glue dispenser, that is, the processor module controls the air flow of the glue dispenser to increase so as to increase the glue output; the processor module controls the glue dispensing delay of the glue dispenser to increase so as to increase the glue output; the processor module controls the pre-glue dispensing delay of the glue dispenser to increase so as to increase the glue output; when the glue output increases, the thickness of the conductive glue increases; if the air flow adjustment, glue dispensing delay adjustment and pre-glue dispensing delay adjustment of the glue dispenser When the thickness of the conductive glue cannot meet the corresponding preset standard range, the processor module controls the loading device to perform height compensation. The lower the loading compensation height, the thinner the conductive glue thickness. When the glue output increases and the compensation height of the loading device is constant, the climbing height increases. The processor module controls the loading device to perform height compensation, and reduces the loading height compensation to increase the climbing height. When the glue output is constant, the processor module controls the loading device to perform height compensation, and reduces the loading height compensation to make the flatness within the corresponding preset standard range. The function of adjusting parameters can be directly set in the processor module to directly control the glue dispensing through the processor module. The dispensing machine and the loading device are controlled. The dispensing machine can output conductive glue, and the loading device can press the chip onto the conductive glue. The height compensation of the loading device is the distance that the loading device presses the chip down, and reducing the loading height means increasing the height of pressing the chip down. The function of adjusting parameters can also be set in the dispensing submodule and the loading submodule. The processor module controls the dispensing machine through the dispensing submodule and controls the loading device through the loading submodule. The airflow is the most important factor in controlling the amount of glue. According to the amount of glue dispensed, it can be adjusted in 20 units. As the dispensing delay increases, the amount of glue will increase accordingly. According to the history, According to historical operating experience, it can be adjusted in 10 units; slight changes in the pre-dispensing delay will lead to large changes in the amount of glue. Be cautious when changing this parameter. It is recommended to adjust it in 2 units; the lower the mounting compensation height, the thinner the glue. When other parameter changes are ineffective, you can consider starting with this item; the mounting compensation height has a great influence on the height of the glue creepage. Taking the glue creepage being too low as an example, you can try to lower the mounting compensation height to make the chip and the conductive glue more tightly combined, thereby increasing the glue creepage height; when the flatness does not meet the requirements, you can try to lower the mounting compensation height to make the chip pressed down more flat.

[0030] In an optional embodiment, the processor module is also electrically connected to a lighting module, and the lighting module is suitable for illuminating the chip after the conductive glue is mounted; wherein the lighting module includes: a light source electrically connected to the processor module, a brightness adjustment submodule and a brightness detection submodule; the brightness detection submodule is suitable for detecting the brightness of the light source to ensure that the brightness remains at the required brightness during image capture to avoid the impact of too dark brightness on image capture, and the processor module can adjust the brightness of the light source; the processor module is configured to control the brightness adjustment submodule to adjust the brightness of the light source according to the requirements when the acquisition module acquires images; the lighting module may include one or more of direct lighting, annular lighting, and oblique lighting, direct lighting is used for lighting during shooting during the overall flatness detection process of the chip after conductive glue mounting, annular lighting is used for lighting during shooting during the detection process of the edges and contours around the chip after mounting (i.e., the climbing height detection process), and oblique lighting is used for lighting during shooting during the detection process of the height change of the chip surface after mounting (i.e., the thickness detection process).

[0031] In an optional embodiment, the lighting module also includes: a stability control submodule, a short circuit protection submodule and a power-off preservation submodule electrically connected to the processor module; the stability control submodule is suitable for maintaining stable lighting of the light source; the short circuit protection submodule is suitable for monitoring the circuit status of the light source and protecting the light source when the circuit is short-circuited; the power-off preservation submodule is suitable for saving the working parameters and status information of the light source when the power is off; the short circuit protection unit is used to monitor the circuit status of the LED light source and the halogen lamp; and the power-off preservation unit is used to save the working parameters and status information of the light source when the power is off.

[0032] The acquisition module may include an image acquisition submodule and an image filtering submodule; the image acquisition submodule may include a 3D vision camera, a laser sensor, and an image sensor. The 3D vision camera and the laser sensor are used to obtain a three-dimensional image of the chip, and the image sensor is used to convert the image into a digital signal; the image of the image filtering submodule can be used to eliminate noise points in the three-dimensional image of the chip, better identify the edge features around the chip, and correct the image distortion generated during the movement. This function can also be directly integrated into the processor module and / or the image processing module; in the actual image acquisition process, the internal and external noise generated by mechanical movement and light has a great influence on the image, and will have a great influence on the subsequent image analysis and contour recognition. Therefore, it is necessary to filter the image to reduce noise and reduce external interference to facilitate subsequent analysis. Therefore, the image filtering submodule adopts median filtering and Gaussian filtering for filtering and denoising, which effectively improves the clarity of the image, including eliminating noise points in the three-dimensional image of the chip, better identifying the edge features around the chip, and using geometric transformation and resampling strategies to correct the image distortion generated during the movement.

[0033] The processor module can also be electrically connected to the image transmission and storage module, which includes a data transmission interface and a data storage device; the data transmission interface is used to transmit the filtered image data to the analysis module; the data storage device is used to store the image data for a long time.

[0034] The alarm module may include a display screen and an alarm light. The display screen will display the values ​​of flatness, glue thickness, and climbing height output by the calculation module, as well as whether the flatness is qualified, whether the climbing height is within the preset standard range, and whether the glue thickness is within the preset standard range; the alarm light will sound an alarm when the preset standard range is not met to remind the operator.

[0035] like Figure 3 As shown, at least one other disclosed embodiment also provides an adjustment method using the above-mentioned conductive glue mounting adjustment system, including: the processor module compares the thickness, climb height and flatness of the conductive glue with the corresponding preset standard range to determine whether the thickness, climb height and flatness of the conductive glue are all within the preset standard range; if any one of the thickness, climb height and flatness of the conductive glue is not within the preset standard range, the processor module controls the alarm module to sound an alarm, and the processor module adjusts the parameters of the chip during the conductive glue mounting process to ensure that the thickness, climb height and flatness of the conductive glue are within the corresponding preset standard range.

[0036] Step S1, collecting images of the chip after the conductive adhesive sheet is completed; Step S2, filtering and denoising the collected chip image after the conductive adhesive film is applied with the filtering methods of median filtering and Gaussian filtering, thereby effectively improving the clarity of the image; Step S3, using principal component analysis and least squares algorithm to extract information on the surface and surrounding sides of the chip after mounting, including the irregular shape formed by the conductive adhesive climbing around the chip after the chip is mounted on the conductive adhesive, and fitting the chip after the conductive adhesive is mounted; Step S4, using a sub-pixel edge detection algorithm, fitting the length, width and height edges around the chip and the surface, and the shape formed by the conductive adhesive, to obtain the contour features of the conductive adhesive and the chip; Step S5, judging whether the given conductive adhesive thickness and climbing height, and the range of high and low sheets meet the standards, and adjusting the conductive adhesive and sheet mounting related parameters if the standards are not met.

[0037] At least one other disclosed embodiment further provides a computer device including a memory, a processor, and a computer program stored in the memory, wherein the processor executes the computer program to implement the steps of the above-mentioned adjustment method.

[0038] At least one other disclosed embodiment further provides a computer-readable storage medium having a computer program / instruction stored thereon, wherein the computer program / instruction implements the steps of the above-mentioned adjustment method when executed by a processor.

[0039] At least one other disclosed embodiment further provides a computer program product, comprising a computer program / instruction, characterized in that the computer program / instruction implements the steps of the above-mentioned adjustment method when executed by a processor.

[0040] In summary, the conductive glue mounting adjustment system includes: a processor module, and an acquisition module and an image processing module electrically connected to the processor module; the acquisition module is configured to acquire an image of the chip after the conductive glue mounting is completed; the image processing module is configured to process the image acquired by the acquisition module to obtain the thickness, creepage and flatness of the conductive glue; the processor module is configured to compare the thickness, creepage and flatness of the conductive glue with the corresponding preset standard range to determine whether the thickness, creepage and flatness of the conductive glue are all within the preset standard range. If any one of the thickness, creepage and flatness of the conductive glue is not within the preset standard range, the processor module controls the alarm module to alarm, and the processor module adjusts the parameters of the chip during the conductive glue mounting process so that the thickness, creepage and flatness of the conductive glue are all within the corresponding preset standard range; the thickness, creepage and flatness of the conductive glue are accurately acquired, which is convenient for determining whether the thickness, creepage and flatness of the conductive glue meet the standards, and when they do not meet the standards, they can be adjusted to the required state in a timely manner.

[0041] Based on the above ideal embodiments of the present invention, the relevant staff can make various changes and modifications without departing from the technical concept of the present invention through the above description. The technical scope of the present invention is not limited to the contents of the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A conductive adhesive sheet adjustment system, characterized in that: include: A processor module, and an acquisition module and an image processing module electrically connected to the processor module; The acquisition module is configured to acquire an image of the chip after the conductive adhesive sheet is attached; The image processing module is configured to process the image collected by the collection module to obtain the thickness, height and flatness of the conductive adhesive; The processor module is configured to compare the thickness, creepage and flatness of the conductive adhesive with the corresponding preset standard range to determine whether the thickness, creepage and flatness of the conductive adhesive are all within the preset standard range; if any one of the thickness, creepage and flatness of the conductive adhesive is not within the preset standard range, the processor module controls the alarm module to sound an alarm, and the processor module adjusts the parameters of the chip during the conductive adhesive mounting process to ensure that the thickness, creepage and flatness of the conductive adhesive are within the corresponding preset standard range.

2. The conductive adhesive sheet adjustment system according to claim 1, characterized in that: The image processing module is configured to process the image collected by the collection module to obtain the thickness, height and flatness of the conductive adhesive. The image processing module is configured to filter and remove noise from the image of the chip after conductive adhesive bonding by using the filtering method of median filtering and Gaussian filtering; as well as The image processing module is configured to, after filtering and denoising the image, use principal component analysis and least squares algorithm to fit the chip after conductive glue bonding, and use sub-pixel edge detection algorithm to fit the side contour of the chip and the contour formed by the conductive glue in the processed image to form a model of the chip and the conductive glue, and measure the thickness, height and flatness of the conductive glue based on the model.

3. The conductive adhesive sheet adjustment system according to claim 1, characterized in that: The thickness of the conductive adhesive is the average height of the four corners of the top surface of the chip; The flatness is the difference between the maximum and minimum values ​​of the heights of the four corners of the chip top surface.

4. The conductive adhesive sheet adjustment system according to claim 1, characterized in that: The processor module adjusts the parameters of the chip during the conductive adhesive bonding process so that the thickness, creep height and flatness of the conductive adhesive are within the corresponding preset standard ranges, including: The processor module controls the glue output of the glue dispenser, that is, The processor module controls the gas flow rate of the glue dispenser to increase so as to increase the glue output; The processor module controls the dispensing delay of the dispensing machine to increase the amount of glue discharged; The processor module controls the pre-dispensing delay of the dispensing machine to increase the amount of glue discharged; When the amount of glue output increases, the thickness of the conductive glue increases; If the air flow adjustment, dispensing delay adjustment and pre-dispensing delay adjustment of the dispensing machine cannot make the thickness of the conductive glue meet the corresponding preset standard range, the processor module controls the loading device to perform height compensation. The lower the loading compensation height, the thinner the thickness of the conductive glue. When the glue output increases and the compensation height of the loading device is constant, the climbing height increases; The processor module controls the film loading device to perform height compensation, and reduces the film loading height compensation to increase the climbing height; When the glue output is constant, the processor module controls the loading device to perform height compensation, and reduces the loading height compensation to make the flatness within the corresponding preset standard range.

5. The conductive adhesive sheet adjustment system according to claim 1, characterized in that: The processor module is also electrically connected to a lighting module, and the lighting module is suitable for illuminating the chip after the conductive adhesive sheet is completed; in The lighting module comprises: a light source, a brightness adjustment submodule and a brightness detection submodule electrically connected to the processor module; The brightness detection submodule is suitable for detecting the brightness of the light source; The processor module is configured to control the brightness adjustment submodule to adjust the brightness of the light source according to the requirements of the acquisition module when acquiring images.

6. The conductive adhesive sheet adjustment system according to claim 5, characterized in that: The lighting module further comprises: a stability control submodule, a short circuit protection submodule and a power-off saving submodule electrically connected to the processor module; The stability control submodule is adapted to maintain stable illumination of the light source; The short-circuit protection submodule is suitable for monitoring the circuit status of the light source and protecting the light source when the circuit is short-circuited; The power-off saving submodule is adapted to save the operating parameters and status information of the light source when the power is off; The short circuit protection unit is used to monitor the status of the circuit of the LED light source and the halogen lamp; and The power-off saving unit is used to save the working parameters and status information of the light source when the power is off.

7. An adjustment method using the conductive adhesive sheet adjustment system according to any one of claims 1 to 6, characterized in that: include: The processor module compares the thickness, creepage and flatness of the conductive adhesive with the corresponding preset standard range to determine whether the thickness, creepage and flatness of the conductive adhesive are all within the preset standard range. If any one of the thickness, creepage and flatness of the conductive adhesive is not within the preset standard range, the processor module controls the alarm module to alarm, and the processor module adjusts the parameters of the chip during the conductive adhesive mounting process to ensure that the thickness, creepage and flatness of the conductive adhesive are within the corresponding preset standard range.

8. A computer device comprising a memory, a processor and a computer program stored in the memory, characterized in that: The processor executes the computer program to implement the steps of the adjustment method according to claim 7.

9. A computer-readable storage medium having a computer program / instruction stored thereon, characterized in that: When the computer program / instructions are executed by a processor, the steps of the adjustment method according to claim 7 are implemented.

10. A computer program product comprising a computer program / instructions, characterized in that When the computer program / instructions are executed by a processor, the steps of the adjustment method according to claim 7 are implemented.

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