Wafer drying device and wafer drying method

Abstract

The invention discloses a wafer drying device. The wafer drying device comprises a base and at least two top knives, the top of each top cutter is provided with a plurality of top cutter grooves used for placing wafers. The bottom of each top cutter is arranged on the base in parallel, so that the plurality of top cutter grooves of the adjacent top cutters are distributed in a one-to-one correspondence manner; the projections of the notches of the top cutter grooves aligned with the adjacent top cutters in the parallel arrangement direction are at least partially overlapped, and the projections of the bottoms of the top cutter grooves aligned with the same position in the parallel arrangement direction are at least partially staggered, so that a certain included angle is formed between the wafer placed in the top cutter grooves and the vertical plane. According to the technical scheme, through staggered arrangement of the groove openings and the groove bottoms of the adjacent top cutter grooves, the wafers incline backwards or forwards, mutual adsorption or shaking of the wafers due to surface tension of water is avoided, and the watermark problem in the wafer drying process is reduced. The invention further discloses a wafer drying method using the wafer drying device.

Description

Technical Field

[0001] The invention relates to the technical field of semiconductor wafers, and in particular to a wafer drying device and a wafer drying method. Background Art

[0002] The mass production cleaning technology of semiconductor substrates mainly adopts the wet cleaning process - RCA cleaning, which mainly involves liquid tank cleaning and wafer drying. The drying part is currently widely used by high-speed centrifugal spin drying and Marangoni drying. High-speed centrifugal spin drying has good drying effect, but it is easy to cause mechanical damage to the wafer. In the terminal cleaning process of the substrate, most of the drying methods currently use the Marangoni drying method, which is a drying technology based on the gradient change of surface tension.

[0003] When drying using the Marangoni drying method, conventional equipment cannot solve the problem of wafer adsorption due to water surface tension during the wafer drying process. During the drying process, especially during the drying process after multiple wafers have been cleaned, the wafers are affected by the water surface tension and will adsorb to each other, resulting in watermark residues during the drying process. Summary of the invention

[0004] In view of this, the present invention provides a wafer drying device, which allows the wafer to tilt backward or forward, thereby preventing the wafers 3 from being adsorbed to each other due to the influence of water surface tension, thereby reducing the watermark problem during the wafer drying process.

[0005] The present invention also provides a method for drying wafers comprising the wafer drying device.

[0006] To achieve the above object, the present invention provides the following technical solutions:

[0007] A wafer drying device comprises: a base and at least two top knives;

[0008] The top of each of the top knives is provided with a plurality of top knife grooves for placing wafers; the bottom of each of the top knives is arranged in parallel on the base, so that the plurality of top knife grooves of adjacent top knives are aligned and distributed one by one;

[0009] The slot openings of the top knife grooves of adjacent top knife positions at least partially overlap in the projection in the parallel arrangement direction, and the slot bottoms of the top knife grooves of the same position are at least partially staggered in the projection in the parallel arrangement direction, so that the wafer placed in the top knife groove forms a certain angle with the vertical plane.

[0010] Preferably, the number of the top knives is three, namely a first top knife, a second top knife and a third top knife arranged in parallel;

[0011] The second top knife is located between the first top knife and the third top knife, and the notches of the first top knife and the third top knife are located on the first horizontal plane, and the notch of the second top knife is located on the second horizontal plane, and the first horizontal plane is located above the second horizontal plane.

[0012] Preferably, the projections of the first top knife and the third top knife in the parallel arrangement direction thereof are such that the notch of the first top knife completely overlaps with the notch of the third top knife in the corresponding position, and the groove bottom of the first top knife completely overlaps with the groove bottom of the third top knife in the corresponding position;

[0013] The projections of the first top knife and the second top knife in the parallel arrangement direction thereof, the notch of the first top knife and the notch of the corresponding second top knife at least partially overlap, and the groove bottom of the first top knife and the corresponding groove bottom of the second top knife are at least partially staggered with each other.

[0014] Preferably, the interval between the first horizontal plane and the second horizontal plane ranges from 6 mm to 6.5 mm.

[0015] Preferably, the top blade groove is a V-shaped groove.

[0016] Preferably, the projections of the first top knife and the second top knife in the parallel arrangement direction, the spacing between the groove bottom of the first top knife and the groove bottom of the second top knife is in the range of 0.2mm-1mm.

[0017] Preferably, the multiple top knife grooves of each top knife are evenly spaced along the extension direction of the top knife.

[0018] Preferably, it also includes: a limit assembly and a plug;

[0019] The plug is provided with a plurality of storage slots along its longitudinal direction for storing the wafers, and the number of the plurality of storage slots corresponds to the number of the plurality of top knife slots;

[0020] The limiting assembly is arranged on the base, and is used to limit the jammer so that the longitudinal direction of the jammer and the parallel arrangement direction of the top knives are arranged at a certain angle;

[0021] Among them, after the plug is installed on the base through the limiting component, the bottoms of the wafers located in the storage groove all fall into the aligned top knife grooves one by one.

[0022] Preferably, the limiting assembly comprises: a first group of limiting blocks and a second group of limiting blocks arranged along the longitudinal direction of the base;

[0023] The first group of limit blocks includes: a first limit block and a second limit block arranged in the transverse direction of the base; the second group of limit blocks includes: a third limit block and a fourth limit block arranged in the transverse direction of the base, and the interval between the first limit block and the second limit block is equal to the interval between the third limit block and the fourth limit block;

[0024] A limiting space is formed between the first limiting block, the second limiting block, the third limiting block and the fourth limiting block to assemble the bottom of the plug;

[0025] The end face of the first limit block contacting the bottom of the plug and the end face of the third limit block contacting the bottom of the plug are staggered in the longitudinal projection of the base; the end face of the second limit block contacting the bottom of the plug and the end face of the fourth limit block contacting the bottom of the plug are staggered in the longitudinal projection of the base.

[0026] Preferably, the end surface of the first limit block contacting the bottom of the plug and the end surface of the third limit block contacting the bottom of the plug are projected in the range of 0.5mm-1.5mm in the longitudinal direction of the base;

[0027] The end surface of the second limiting block contacting the bottom of the plug and the end surface of the fourth limiting block contacting the bottom of the plug are projected in the range of 0.5mm-1.5mm in the longitudinal direction of the base.

[0028] Preferably, the end surfaces of the first limiting block, the second limiting block, the third limiting block and / or the fourth limiting block contacting the bottom of the plug include: an inclined surface and a vertical surface connected to each other, and the inclined surface is located on the upper side of the vertical surface.

[0029] A method for drying a wafer, using the above-mentioned wafer drying device, comprises the steps of:

[0030] Placing the plurality of wafers in a one-to-one correspondence in a plurality of top knife grooves;

[0031] Drying the wafer in the top knife groove according to the Marangoni drying process;

[0032] After the wafer is dried, the dried wafer is taken out from the plurality of top knife grooves.

[0033] Preferably, the wafer drying device further comprises: a limit assembly and a plug;

[0034] The plug is provided with a plurality of storage slots along its longitudinal direction for storing the wafers, and the number of the plurality of storage slots corresponds to the number of the plurality of top knife slots;

[0035] The limiting assembly is arranged on the base, and is used to limit the jammer so that the longitudinal direction of the jammer and the parallel arrangement direction of the top knives are arranged at a certain angle;

[0036] Placing the plurality of wafers in a one-to-one correspondence in a plurality of top knife grooves specifically includes:

[0037] Placing the plurality of wafers in a one-to-one correspondence in the plurality of storage slots of the plug;

[0038] The plug is installed on the base through the limiting assembly, and the bottoms of the wafers in the storage slot all fall into the aligned top knife grooves one by one.

[0039] It can be seen from the above technical scheme that the wafer drying device provided by the present invention, through the staggered setting of the notches of adjacent top knife grooves and the bottom of the grooves, allows the wafer to tilt backward or forward, thereby preventing the wafers from being adsorbed or shaken by each other due to the surface tension of water, thereby reducing the watermark problem in the wafer drying process.

[0040] The present invention also provides a method for drying wafers. Since the above-mentioned active wafer drying device is adopted, it also has corresponding beneficial effects. The details can be referred to the above description, which will not be repeated here. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0042] Figure 1 The schematic diagram of the overall structure of the wafer drying device;

[0043] Figure 2 for Figure 1 Schematic diagram of the structure behind the hidden wafer;

[0044] Figure 3 for Figure 1 Schematic diagram of the structure after the wafer is hidden and jammed (3D);

[0045] Figure 4 for Figure 1 Schematic diagram of the structure after the wafer is hidden and jammed (plane);

[0046] Figure 5 It is a schematic diagram of the structure of the top cutter and other parts;

[0047] Figure 6It is a schematic diagram of the structure of the top cutter and the support frame from the first perspective;

[0048] Figure 7 A schematic diagram of the structure of the top knife and the support frame in the second perspective;

[0049] Figure 8 for Figure 7 A partial enlarged view of

[0050] Fig. 9 A schematic diagram of the side view of the top cutter and the support frame;

[0051] Fig.10 This is a top view of the top cutter installed on the support frame (the support frame is hidden);

[0052] Fig.11 It is the specific layout diagram between the limit blocks;

[0053] Fig.12 Schematic diagram of the overall structure of the jam;

[0054] Fig.13 Picture 1 is a picture of a wafer surface after being dried using a conventional wafer drying apparatus;

[0055] Fig.14 Picture 2 is a wafer surface after drying using a conventional wafer drying apparatus;

[0056] Fig.15 This is a picture of the wafer surface after drying using the present wafer drying apparatus.

[0057] Among them, 1 is the base;

[0058] 2 is a top knife, 21 is a top knife groove, 22 is a groove opening, 23 is a groove bottom, 24 is a first top knife, 25 is a second top knife, and 26 is a third top knife;

[0059] 3 is a wafer;

[0060] 4 is a limit block assembly, 41 is a first limit block, 42 ​​is a second limit block, 43 is a third limit block, and 44 is a fourth limit block;

[0061] 5 is a plug, 51 is a storage slot;

[0062] 6 is a supporting frame. DETAILED DESCRIPTION

[0063] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0064] The wafer drying device provided by the embodiment of the present invention is as follows: Figure 1-Figure 12 As shown, a base 1 and at least two top knives 2;

[0065] The top of each top knife 2 is provided with a plurality of top knife grooves 21 for placing the wafer 3; the bottom of each top knife 2 is arranged in parallel on the base 1, so that the top knife grooves 21 of adjacent top knives 2 are arranged one by one; it should be noted that the top knives 2 arranged in parallel can be on the same horizontal plane or on multiple horizontal planes;

[0066] The notches 22 of the top knife grooves 21 of adjacent top knives 2 are at least partially overlapped in the projection in the parallel arrangement direction, and the groove bottoms 23 of the same top knife grooves 21 are at least partially staggered in the projection in the parallel arrangement direction, so that the wafer 3 placed in the top knife groove 21 forms a certain angle with the vertical plane; it should be noted that the parallel arrangement direction is the spacing direction between adjacent top knives 2.

[0067] In the above technical solution, if Figure 5 As shown, the wafer 3 is placed in the top knife groove 21. Since the groove bottoms 23 of the adjacent top knives 2 are offset in the parallel arrangement direction, the bottom of the wafer 3 is subjected to the force of the groove bottoms 23 of the adjacent top knives 2. The force acts on the bottom of the wafer 3 (causing the bottom of the wafer 3 to tilt forward or backward), causing the upper half of the wafer 3 to tilt backward or forward due to gravity (the wafer tilts backward corresponding to Figure 5 The wafer tilts forward and the lower left in the figure corresponds to Figure 5 The wafer is tilted to the upper right in the middle), and then the entire wafer changes from a vertical state to a backward tilted state.

[0068] It should be noted that when the bottom of the wafer 3 tilts forward, the upper part of the wafer 3 tilts backward due to the action of gravity; when the bottom of the wafer 3 tilts backward, the upper part of the wafer 3 tilts forward due to the action of gravity.

[0069] Compared with the prior art, the present technical solution, through the setting of the slot 22 of adjacent top knife slots 21 and the position of the slot bottom 23, allows the wafer to tilt backward or forward, thereby preventing the wafers 3 from being adsorbed or shaken against each other due to the surface tension of water, thereby reducing the watermark problem during the wafer drying process.

[0070] Optimize the above technical solutions, such as Figure 5-Figure 8As shown, there are three top knives 2, namely a first top knife 24, a second top knife 25 and a third top knife 26 arranged in parallel;

[0071] The second top knife 25 is located between the first top knife 24 and the third top knife 26, and the notches 22 of the first top knife 24 and the third top knife 26 are located on the first horizontal plane, and the notch 22 of the second top knife 25 is located on the second horizontal plane, and the first horizontal plane is located above the second horizontal plane.

[0072] In the above technical scheme, the height difference between the first top knife 24 and the second top knife 25, and the height difference between the third top knife 26 and the second top knife 25 are the same, which is conducive to better fixing the wafer 3; and after the wafer 3 is tilted, it only contacts the first top knife 24, the second top knife 25 and the third top knife 26, the first top knife 24 and the third top knife 26 are in contact with the wafer 3 at one point (that is, the bottom fixing point of the wafer 3), and the second top knife 25 and the wafer 3 have two points of contact (that is, the bottom fixing point of the wafer 3 and the contact point of the wafer 3 after the wafer 3 is tilted). With this arrangement, the device has fewer contact points with the wafer during drying, avoiding film rupture during the alternation of the isopropyl alcohol gas film and the water film, and further solving problems such as watermark residue.

[0073] Further optimize the above technical solution, such as Figure 5-Figure 8 As shown, the first top knife 24 and the third top knife 26 are arranged in parallel (the parallel arrangement direction here is the spacing direction between the first top knife 24 and the third top knife 26, as shown in FIG. Fig. 9 , the projection on the direction indicated by the arrow in segment C), the notch 22 of the first top knife 24 and the notch 22 of the third top knife 26 in the opposite position completely overlap, and the groove bottom 23 of the first top knife 24 and the groove bottom 23 of the third top knife 26 in the opposite position completely overlap;

[0074] The first top knife 24 and the second top knife 25 are arranged in parallel in the direction (the parallel arrangement direction here is the spacing direction between the first top knife 24 and the second top knife 25, such as Fig. 9 , the projection on the direction indicated by the arrow in section A), the notch 22 of the first top knife 24 and the notch 22 of the second top knife 25 at least partially overlap, and the groove bottom 23 of the first top knife 24 and the groove bottom 23 of the second top knife 25 at least partially staggered with each other; it should be noted that the projection of the second top knife 25 and the third top knife 26 in the parallel arrangement direction (the parallel arrangement direction here is the spacing direction between the second top knife 25 and the third top knife 26, as shown in FIG. Fig. 9 , the direction indicated by the arrow in section B), the notch 22 of the second top knife 25 and the notch 22 of the third top knife 26 at least partially overlap, and the groove bottom 23 of the second top knife 25 and the groove bottom 23 of the third top knife 26 at least partially staggered with each other;

[0075] In the above scheme, through the coordination between the notch 22 and the groove bottom 23 of the first top knife 24, the notch 22 and the groove bottom 23 of the second top knife 25, and the notch 22 and the groove bottom 23 of the third top knife 26, the stability of the wafer after tilting backward or forward can be further improved, and the watermark problem in the wafer drying process is further reduced; preferably, the first top knife 24 and the third top knife 26 are arranged symmetrically about the second top knife 25, and the intervals between the top knives 2 are equal, wherein the interval range between the top knives 2 is 2.5mm-3.5mm.

[0076] Further optimize the above technical solution, such as Fig. 9 As shown, the interval between the first horizontal plane and the second horizontal plane is in the range of 6mm-6.5mm, which better matches the surface size and curvature of the wafer 3 and is conducive to better fixing the wafer 3; it should be noted that because the interval range value is small, it is not reflected in other drawings of this specification.

[0077] Further optimize the above technical solution, such as Figure 8 and Fig.10 As shown, the top cutter groove 21 is a V-shaped groove;

[0078] The projections of the first top knife 24 and the second top knife 25 in the direction in which they are arranged in parallel, the notch 22 of the first top knife 24 and the corresponding notch 22 of the second top knife 25 at least partially overlap, and the groove bottom 23 of the first top knife 24 and the groove bottom 23 of the second top knife 25 are staggered with each other; it should be noted that the projections of the second top knife 25 and the third top knife 26 in the direction in which they are arranged in parallel, the notch 22 of the second top knife 25 and the corresponding notch 22 of the third top knife 26 at least partially overlap, and the groove bottom 23 of the second top knife 25 and the groove bottom 23 of the third top knife 26 are staggered with each other.

[0079] In the above technical solution, the V-shaped groove is used to better fix the wafer 3, further improve the drying effect, and further avoid the watermark problem during the wafer drying process.

[0080] Optimize the above technical solutions, Fig.10 As shown, the projections of the first top knife 24 and the second top knife 25 in the direction of their parallel arrangement, the interval between the groove bottom 23 of the first top knife 24 and the groove bottom 23 of the second top knife 25 is 0.2mm-1mm. With such an arrangement, the wafer can be placed behind the top knife and tilted forward or backward; it should also be noted that since the first top knife 24 and the third top knife 26 are aligned, the interval between the groove bottom 23 of the third top knife 2 and the groove bottom 23 of the second top knife 25 is also 0.2mm-1mm.

[0081] Figure 7 and Figure 8As shown, the multiple top knife grooves 21 of each top knife 2 are evenly spaced along the extension direction of the top knife 2. The evenly spaced arrangement of the top knife grooves 21 is more conducive to the stability of the structure when placing wafers, and multiple wafers can be dried at the same time.

[0082] In this technical solution, if Figure 5 , Fig.11 as well as Fig.12 As shown, it also includes: a limit assembly 4 and a plug 5;

[0083] The plug 5 is provided with a plurality of storage slots 51 along its longitudinal direction for storing the wafers 3, and the number of the plurality of storage slots 51 corresponds to the number of the plurality of top knife slots 21;

[0084] The limiting assembly 4 is arranged on the base 1, and is used to limit the plug 5 so that the longitudinal direction of the plug and the parallel arrangement direction of the top knife are arranged at a certain angle;

[0085] After the plug 5 is installed on the base 1 through the limiting assembly 4, the bottoms of the wafers 3 in the storage groove 51 all fall into the aligned top knife grooves 21 one by one.

[0086] In the above technical solution, due to the cooperation between the plug 5 and the limiting assembly 4, when the plug 5 falls into the base 1, the plug 5 is offset to the upper left side and the lower right side of the base 1 in the longitudinal direction ( Figure 5 The upper left and lower right sides of the wafer 3 and the storage groove 51 in the plug 5 are broken, and after the bottoms of the wafers 3 fall into the aligned top knife grooves 21 one by one, the upper half of the wafer 3 tilts forward or backward due to the action of gravity; it should be noted that when the plug 5 deviates to the lower right side when falling into the base 1, after the bottom of the wafer 3 falls into the aligned top knife groove 21, the upper half tilts backward due to the action of gravity; when the plug 5 deviates to the upper left side when falling into the base 1, the same is true and will not be stated one by one.

[0087] Optimize the above technical solutions, such as Fig.11 As shown, the limiting assembly 4 includes: a first group of limiting blocks and a second group of limiting blocks arranged along the longitudinal direction of the base 1;

[0088] The first group of limit blocks includes: a first limit block 41 and a second limit block 42 are arranged along the lateral direction of the base 1; the second group of limit blocks includes: a third limit block 43 and a fourth limit block 44 are arranged along the lateral direction of the base 1, and the interval between the first limit block 41 and the second limit block 42 is equal to the interval between the third limit block 43 and the fourth limit block 44; it should be noted that the lateral direction of the base 1 is Fig.11 The vertical direction of the base 1 is Fig.11 The direction indicated by the arrow;

[0089] A limiting space is formed between the first limiting block 41, the second limiting block 42, the third limiting block 43 and the fourth limiting block 44 to assemble the bottom of the plug 5;

[0090] The end face of the first limit block 41 contacting the bottom of the plug 5 and the end face of the third limit block 43 contacting the bottom of the plug 5 are staggered in the longitudinal projection of the base 1; the end face of the second limit block 42 contacting the bottom of the plug 5 and the end face of the fourth limit block 44 contacting the bottom of the plug 5 are staggered in the longitudinal projection of the base 1.

[0091] In the above technical solution, the first limiting block 41, the second limiting block 42, the third limiting block 43 and the fourth limiting block 44 are arranged in different directions, so that the limiting space is a virtual parallelogram (such as Fig.11 As shown by the dotted line in the figure, the center line of the virtual parallelogram forms a certain angle with the longitudinal direction of the base 1. The arrangement is such that when the plug 5 falls into the base 1, it deviates to both sides of the longitudinal direction of the base 1.

[0092] In order to optimize the above technical solutions, Fig.11 As shown, the projection interval between the end surface of the first limit block 41 contacting the bottom of the plug 5 and the end surface of the third limit block 43 contacting the bottom of the plug 5 in the longitudinal direction of the base 1 is 0.5mm-1.5mm;

[0093] The projection interval between the end surface of the second limiting block 42 contacting the bottom of the plug 5 and the end surface of the fourth limiting block 44 contacting the bottom of the plug 5 in the longitudinal direction of the base 1 is in the range of 0.5 mm to 1.5 mm.

[0094] In the above technical solution, the projection interval range is 0.5 mm-1.5 mm, so that the plug 5 can be better offset to the longitudinal sides of the base 1 when falling into the base 1, thereby improving the drying effect.

[0095] In order to further optimize the above technical solution, Fig.11 As shown, the end faces of the first limit block 41, the second limit block 42, the third limit block 43 and / or the fourth limit block 44 contacting the bottom of the plug 5 include: an inclined surface and a vertical surface connected to each other, the inclined surface is located on the upper side of the vertical surface, and the inclined surface is a slope. Guided by the slope, the plug 5 is offset to the longitudinal sides of the base 1 when falling into the base 1, and the parallel relationship between the wafer 3 and the storage groove 51 in the plug 5 is destroyed; it should also be noted that the wafer 3 tilts backward under the action of the second top knife 25 and the gravity of the wafer 3 itself, and the top position of the groove 51 of the plug 5 offset to the right front is in contact with the lower left side of the wafer 3 (the back side of the wafer 3), which increases the stability of the wafer 3. During the process of the wafer entering the device and being lifted and the process of slow drying, the wafer 3 is prevented from shaking back and forth due to the surface tension of water, thereby reducing the generation of watermarks.

[0096] In the present technical solution, it also includes: a support frame 6; the top knife 2 is installed on the base 1 through the support frame 6. By using the setting of the support frame 6, the top knife 2 and the base 1 are separated by a certain distance, which is beneficial to isolate the water vapor at the bottom and improve the drying effect.

[0097] A method for drying a wafer, using the above-mentioned wafer drying device, comprises the following steps:

[0098] S1, placing a plurality of wafers 3 in a plurality of top knife grooves 21 in a one-to-one correspondence, and after the wafers 3 are placed in the top knife grooves 21, the wafers 3 are tilted forward or backward;

[0099] S2, drying the wafer 3 in the top knife groove 21 according to the Marangoni drying process;

[0100] It should be noted that the specific process of Marangoni drying includes: the first step is to form a water film - using flowing ultrapure water to form a thin water film on the outer surface of the wafer 3; the second step is to introduce a large amount of nitrogen carrying isopropyl alcohol (IPA) gas; the third step is to control the movement speed of the ultrapure water layer and the isopropyl alcohol gas layer on the wafer surface to generate a surface tension gradient, thereby taking away moisture.

[0101] S3 , after the wafer 3 is dried, the dried wafer 3 is taken out from the plurality of top knife grooves 21 .

[0102] Optimizing the above technical solution, the wafer drying device further includes: a limit assembly 4 and a plug 5;

[0103] The plug 5 is provided with a plurality of storage slots 51 along its longitudinal direction for storing the wafers 3, and the number of the plurality of storage slots 51 corresponds to the number of the plurality of top knife slots 21;

[0104] The limiting assembly 4 is arranged on the base 1, and is used to limit the stopper 5 so that the longitudinal direction of the stopper 5 and the parallel arrangement direction of the top knife 2 are arranged at a certain angle;

[0105] Placing the plurality of wafers 3 in a one-to-one correspondence in the plurality of top knife grooves 21 specifically includes:

[0106] The plug 5 is mounted on the base 1 through the limiting components 4 , and the bottoms of the wafers 3 in the storage slots 51 all fall into the aligned top knife grooves 21 one by one.

[0107] In the above technical solution, the wafer drying device of the present invention (previously placed with a 6-inch silicon carbide wafer) is placed in a Marangoni drying tank and tested on a KLA8520 machine. The wafer surface is observed under the SCN channel and no watermark residue is found (such as Fig.15 shown); Fig.13 and Fig.14 The surface of the wafer is dried using an existing wafer drying device.

[0108] The wafer drying device of the present invention can increase the original SCN white (watermark) yield from 43% to 99.8%.

[0109] In some schemes, the robot arm transfers the plug 5 with the wafer 3 to the device and slowly puts it down, the wafer 3 is gradually separated from the plug, and the wafer 3 is lifted upward.

[0110] The technical features mentioned above, the technical features to be mentioned below, and the technical features shown separately in the drawings can be combined with each other arbitrarily, as long as the combined technical features are not contradictory. All feasible feature combinations are technical contents clearly recorded in this article. Any of the multiple sub-features contained in the same sentence can be applied independently, and does not have to be applied together with other sub-features.

[0111] Beneficial effects of the present invention:

[0112] 1. This solution designs the structure and relative positions of the components in the device. The entire device has only four contact points with the wafer surface. However, the wafer can be stabilized when subjected to the surface tension of water during the drying process. The contact area between the wafer and the plug / top knife is small, which avoids the formation of watermarks on the wafer surface and contamination of the silicon carbide wafer.

[0113] 2. When using this drying device, there is no problem with cleaning the wafer after drying, the SCN white yield is increased, there is no water stain, and there is basically no increase in particles, which improves the application quality of the wafer.

[0114] 3. This drying device can be used for drying 6 / 8 inch silicon carbide (silicon) substrate sheets / epitaxial wafers.

[0115] The various embodiments in this specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same or similar parts between the various embodiments can be referenced to each other.

[0116] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer drying device, characterized in that: include: A base (1) and at least two top knives (2); The top of each of the top knives (2) is provided with a plurality of top knife grooves (21) for placing wafers (3); the bottom of each of the top knives (2) is arranged in parallel on the base (1), so that the plurality of top knife grooves (21) of adjacent top knives (2) are arranged one by one in alignment; The notches (22) of the top knife grooves (21) of adjacent top knives (2) are at least partially overlapped in projection in the parallel arrangement direction, and the groove bottoms (23) of the top knife grooves (21) at the same position are at least partially staggered in projection in the parallel arrangement direction, so that a wafer (3) placed in the top knife groove (21) forms a certain angle with a vertical plane.

2. The wafer drying device according to claim 1, characterized in that: The number of the top knives (2) is three, namely a first top knife (24), a second top knife (25) and a third top knife (26) arranged in parallel; The second top knife (25) is located between the first top knife (24) and the third top knife (26), and the notch (22) of the first top knife (24) and the notch (22) of the third top knife (26) are located on the first horizontal plane, and the notch (22) of the second top knife (25) is located on the second horizontal plane, and the first horizontal plane is located above the second horizontal plane.

3. The wafer drying device according to claim 2, characterized in that: The projections of the first top knife (24) and the third top knife (26) in the direction in which they are arranged in parallel are such that the notch (22) of the first top knife (24) and the notch (22) of the corresponding third top knife (26) completely overlap, and the groove bottom (23) of the first top knife (24) and the groove bottom (23) of the corresponding third top knife (26) completely overlap; The projections of the first top knife (24) and the second top knife (25) in the direction in which they are arranged in parallel are such that the notch (22) of the first top knife (24) and the notch (22) of the corresponding second top knife (25) at least partially overlap, and the groove bottom (23) of the first top knife (24) and the groove bottom (23) of the corresponding second top knife (25) are at least partially offset from each other.

4. The wafer drying device according to claim 2, characterized in that: The interval between the first horizontal plane and the second horizontal plane ranges from 6 mm to 6.5 mm.

5. The wafer drying device according to claim 2, characterized in that: The top blade groove (21) is a V-shaped groove.

6. The wafer drying device according to claim 5, characterized in that: The projections of the first top knife (24) and the second top knife (25) in the direction in which they are arranged in parallel, and the spacing between the groove bottom (23) of the first top knife (24) and the groove bottom (23) of the second top knife (25) in the corresponding position range from 0.2 mm to 1 mm.

7. The wafer drying device according to claim 1, characterized in that: The plurality of top knife grooves (21) of each top knife (2) are evenly spaced and arranged along the extension direction of the top knife (2).

8. The wafer drying device according to any one of claims 1 to 7, characterized in that: Also includes: A limit assembly (4) and a jammer (5); The plug (5) is provided with a plurality of storage slots (51) along its longitudinal direction for storing the wafers (3), and the number of the plurality of storage slots (51) and the number of the plurality of top knife slots (21) correspond one to one; The limiting assembly (4) is arranged on the base (1) and is used to limit the position of the plug (5) so that the longitudinal direction of the plug (5) and the parallel arrangement direction of the top knife (2) are arranged at a certain angle; Wherein, after the plug (5) is installed on the base (1) through the limiting assembly (4), the bottoms of the wafers (3) located in the storage groove (51) all fall into the aligned top knife grooves (21) one by one.

9. The wafer drying device according to claim 8, characterized in that: The limiting assembly (4) comprises: a first group of limiting blocks and a second group of limiting blocks arranged along the longitudinal direction of the base (1); The first group of limit blocks comprises: a first limit block (41) and a second limit block (42) arranged in a transverse direction of the base (1); the second group of limit blocks comprises: a third limit block (43) and a fourth limit block (44) arranged in a transverse direction of the base (1), and the interval between the first limit block (41) and the second limit block (42) is equal to the interval between the third limit block (43) and the fourth limit block (44); A limiting space is formed between the first limiting block (41), the second limiting block (42), the third limiting block (43) and the fourth limiting block (44) to assemble the bottom of the plug (5); The end surface of the first limiting block (41) contacting the bottom of the plug (5) and the end surface of the third limiting block (43) contacting the bottom of the plug (5) are mutually staggered in projection in the longitudinal direction of the base (1); the end surface of the second limiting block (42) contacting the bottom of the plug (5) and the end surface of the fourth limiting block (44) contacting the bottom of the plug (5) are mutually staggered in projection in the longitudinal direction of the base (1).

10. The wafer drying device according to claim 9, characterized in that: The end surface of the first limiting block (41) contacting the bottom of the plug (5) and the end surface of the third limiting block (43) contacting the bottom of the plug (5) are projected in the longitudinal direction of the base (1) with a spacing range of 0.5 mm to 1.5 mm; The end surface of the second limit block (42) contacting the bottom of the plug (5) and the end surface of the fourth limit block (44) contacting the bottom of the plug (5) are projected at an interval in the longitudinal direction of the base (1) of 0.5 mm to 1.5 mm.

11. The wafer drying device according to claim 10, characterized in that: The end surfaces of the first limiting block (41), the second limiting block (42), the third limiting block (43) and / or the fourth limiting block (44) contacting the bottom of the plug (5) include: an inclined surface and a vertical surface connected to each other, and the inclined surface is located on the upper side of the vertical surface.

12. A method for drying a wafer, characterized in that: The wafer drying device according to any one of claims 1 to 10 comprises the steps of: Placing the plurality of wafers (3) in a one-to-one correspondence in the plurality of top knife grooves (21); Drying the wafer (3) in the top knife groove (21) according to a Marangoni drying process; After the wafer (3) is dried, the dried wafer (3) is taken out from the plurality of top knife grooves (21).

13. The method for drying a wafer according to claim 12, characterized in that: The wafer drying device further comprises: a limiting component (4) and a plug (5); The plug (5) is provided with a plurality of storage slots (51) along its longitudinal direction for storing the wafers (3), and the number of the plurality of storage slots (51) and the number of the plurality of top knife slots (21) correspond one to one; The limiting assembly (4) is arranged on the base (1) and is used to limit the position of the plug (5) so that the longitudinal direction of the plug (5) and the parallel arrangement direction of the top knife (2) are arranged at a certain angle; Placing the plurality of wafers (3) in a one-to-one correspondence in the plurality of top knife grooves (21) specifically comprises: Placing the plurality of wafers (3) in a one-to-one correspondence in the plurality of storage slots (51) of the plug (5); The plug (5) is installed on the base (1) through the limiting assembly (4), and the bottoms of the wafers (3) located in the storage slot (51) all fall into the aligned top knife slots (21) one by one.

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