Display panel, preparation method thereof and display device

Abstract

The invention relates to a display panel, a preparation method thereof and a display device. The preparation method comprises the steps that a substrate is provided, the substrate is provided with a binding area, and a binding conductive part is arranged on the binding area; forming a plurality of piercing parts on one side, deviating from the substrate, of the binding conductive part; providing a conductive adhesive layer, wherein conductive particles are arranged in the conductive adhesive layer; the conductive adhesive layer is arranged on the binding conductive part, pressure is applied to the conductive adhesive layer or the binding area, the piercing part pierces the conductive particles in the conductive adhesive layer, and the piercing part fixes the conductive particles and is electrically connected with the conductive particles. The piercing part firmly fixes the conductive particles in the conductive adhesive layer and is electrically connected with the conductive adhesive layer, the number capture rate of the conductive particles captured by the binding conductive part is improved, meanwhile, the piercing part pierces the conductive particles, displacement of the conductive particles can be avoided, the capture rate of the conductive particles in the binding area is improved, and the binding efficiency is improved. And the requirement of the narrow-frame display panel on the conductive particle capturing capability of the binding area is met.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a method for preparing the same, and a display device. Background Art

[0002] Organic Light-Emitting Diode (OLED) display panels are widely used because of their lightness, energy saving, wide viewing angle, wide color gamut, high contrast and other characteristics. Commonly used OLED display panels include active organic light-emitting diode display panels (AMOLED). AMOLED display panels include a display area and a border area arranged around the display area.

[0003] Currently, AMOLED display panels are developing in the direction of narrow bezels. Summary of the invention

[0004] Based on this, it is necessary to provide a display panel suitable for a narrow frame, a preparation method thereof, and a display device in order to solve the above technical problems.

[0005] In a first aspect, the present application provides a method for preparing a display panel, comprising:

[0006] Providing a substrate, the substrate having a binding area, the binding area being provided with a binding conductive portion;

[0007] forming a plurality of piercing portions on a side of the binding conductive portion facing away from the substrate;

[0008] Providing a conductive adhesive layer, wherein conductive particles are arranged in the conductive adhesive layer;

[0009] The conductive adhesive layer is arranged on the binding conductive part, and pressure is applied to the conductive adhesive layer or the binding area, so that the piercing part pierces the conductive particles inside the conductive adhesive layer, and the piercing part fixes the conductive particles and electrically connects them.

[0010] The preparation method of the above-mentioned display panel forms a piercing portion on the binding conductive portion, applies pressure to the conductive adhesive layer or the binding area, and the piercing portion can pierce the conductive particles inside the conductive adhesive layer, so that the piercing portion firmly fixes the conductive particles inside the conductive adhesive layer and is electrically connected to it, thereby increasing the capture rate of the number of conductive particles captured by the binding conductive portion. At the same time, the piercing portion pierces the conductive particles to avoid the displacement of the conductive particles, thereby increasing the capture rate of the conductive particles in the binding area, and meeting the requirements of the narrow-frame display panel for the conductive particle capture ability of the binding area.

[0011] In one embodiment, forming a plurality of piercing portions on a side of the binding conductive portion away from the substrate comprises: irradiating the binding conductive portion with a laser so that the binding conductive portion forms the piercing portions on a side away from the substrate;

[0012] Preferably, the binding conductive part is irradiated with laser from the substrate toward the binding conductive part;

[0013] Preferably, the binding conductive portion is irradiated with laser light in a direction from the binding conductive portion toward the substrate.

[0014] In this way, the laser irradiation is conducive to the high-precision formation of heat transfer to the binding conductive part, so as to increase the stress of the binding conductive part, release the stress and deform it to form a piercing part, which can prevent the temperature increase of the substrate from affecting the performance of the display panel.

[0015] In one embodiment, forming a plurality of piercing portions on a side of the binding conductive portion away from the substrate comprises: heating the binding area to form the piercing portions on a side of the binding conductive portion away from the substrate;

[0016] Preferably, the heating temperature is 230° C.-600° C.; and the heating time is greater than or equal to 1 min.

[0017] In this way, the method of heating the binding area is simple and easy to operate. At the same time, heating the binding area can reduce the impact of high temperature on other areas of the substrate, which is beneficial to improving the yield and display performance of the display panel.

[0018] In one of the embodiments, the binding conductive portion comprises at least an aluminum metal layer;

[0019] Preferably, the thickness of the aluminum metal layer is 500nm-1um;

[0020] Preferably, the binding conductive part comprises a first titanium metal layer, an aluminum metal layer and a second titanium metal layer stacked in sequence;

[0021] Preferably, the binding conductive part comprises an aluminum metal layer and a titanium metal layer stacked in sequence;

[0022] Preferably, the binding conductive part comprises an aluminum metal layer and a molybdenum metal layer stacked in sequence;

[0023] Preferably, the substrate is a polyimide substrate.

[0024] In this way, by reasonably setting the material of the binding conductive part, it is ensured that the heat increases after being irradiated by laser or heated, so that the stress can be released and deformed in the direction away from the substrate to form a piercing part. At the same time, it is ensured that the size and sharpness of the piercing part are sufficient to pierce and fix the conductive particles inside the conductive adhesive layer, thereby effectively improving the conductive particle capture capacity of the binding area.

[0025] In one embodiment, at least some of the piercing portions are arranged at intervals, and grooves are formed between adjacent piercing portions, and some of the conductive particles are located in the grooves and are electrically connected to the binding conductive portion. In this way, the grooves formed between adjacent piercing portions can fix the conductive particles inside the conductive adhesive layer, further improving the capture rate of the conductive particles in the binding area, and meeting the requirements of the narrow-frame display panel for the conductive particle capture capacity of the binding area.

[0026] In a second aspect, the present application provides a display panel, including:

[0027] A substrate, the substrate having a binding area, and a binding conductive portion is provided on the binding area;

[0028] A plurality of piercing portions, arranged on a side of the binding conductive portion away from the substrate;

[0029] The conductive adhesive layer is arranged on the side of the binding conductive part away from the substrate. The conductive adhesive layer is provided with conductive particles. The piercing part pierces the conductive particles inside the conductive adhesive layer. The piercing part fixes the conductive particles and electrically connects them.

[0030] The above-mentioned display panel increases the capture rate of the number of conductive particles captured by the binding conductive part by providing a piercing part on the binding conductive part, and piercing the conductive particles inside the conductive adhesive layer through the piercing part. At the same time, the piercing part pierces the conductive particles to avoid displacement of the conductive particles, thereby increasing the capture rate of the conductive particles in the binding area, and meeting the requirements of the narrow-frame display panel for the conductive particle capture ability of the binding area.

[0031] In one embodiment, the piercing portion is formed by laser irradiation or heating the binding conductive portion.

[0032] In this way, heat can be accurately applied to the binding area to increase the heat of the binding conductive part to deform it to form a piercing part, thereby avoiding high temperature damage to other areas of the substrate, which is beneficial to improving the yield and display performance of the display panel.

[0033] In one of the embodiments, the binding conductive portion comprises at least an aluminum metal layer;

[0034] Preferably, the thickness of the aluminum metal layer is 500nm-1um;

[0035] Preferably, the binding conductive part comprises a first titanium metal layer, an aluminum metal layer and a second titanium metal layer stacked in sequence;

[0036] Preferably, the binding conductive part comprises an aluminum metal layer and a titanium metal layer stacked in sequence;

[0037] Preferably, the binding conductive part comprises an aluminum metal layer and a molybdenum metal layer stacked in sequence;

[0038] Preferably, the substrate is a polyimide substrate.

[0039] In this way, by reasonably setting the material of the binding conductive part, it is ensured that the heat increases after being irradiated by laser or heated, so that the stress can be released and deformed in the direction away from the substrate to form a piercing part. At the same time, it is ensured that the size and sharpness of the piercing part are sufficient to pierce and fix the conductive particles inside the conductive adhesive layer, thereby effectively improving the conductive particle capture capacity of the binding area.

[0040] In one embodiment, at least some of the piercing portions are arranged at intervals, and grooves are provided between adjacent piercing portions, and some of the conductive particles are located in the grooves and are electrically connected to the binding conductive portion.

[0041] In this way, the grooves between adjacent piercing portions can fix the conductive particles inside the conductive adhesive layer, further improving the capture rate of the conductive particles in the binding area, and meeting the requirements of the narrow-frame display panel for the conductive particle capture capability in the binding area.

[0042] In a third aspect, the present application provides a display device, including a display panel obtained by the method for preparing a display panel as described in the first aspect, or including a display panel as described in the second aspect.

[0043] The above-mentioned display device forms a piercing portion on the binding conductive portion and applies pressure to the conductive adhesive layer or the binding area. The piercing portion can pierce the conductive particles inside the conductive adhesive layer, so that the piercing portion firmly fixes the conductive particles inside the conductive adhesive layer and is electrically connected to it, thereby increasing the capture rate of the number of conductive particles captured by the binding conductive portion. At the same time, the piercing portion pierces the conductive particles to avoid displacement of the conductive particles, thereby increasing the capture rate of the conductive particles in the binding area and meeting the requirements of the narrow-frame display panel for the conductive particle capture ability of the binding area. BRIEF DESCRIPTION OF THE DRAWINGS

[0044] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the conventional technology, the drawings required for use in the embodiments or the conventional technology descriptions are briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0045] Figure 1 A process flow chart of a method for preparing a display panel provided in one embodiment of the present application;

[0046] Figure 2 A schematic diagram of a substrate provided in one embodiment of the present application;

[0047] Figure 3 for Figure 2 The binding area of ​​the substrate Figure 2 Cross-section along line AA;

[0048] Figure 4 In one embodiment of the present application, the laser irradiates the binding conductive part to form a plurality of piercing parts. Figure 2 Schematic diagram of the middle AA line;

[0049] Figure 5 In one embodiment of the present application, the laser irradiates the binding conductive part to form a plurality of piercing parts. Figure 2 Schematic diagram of the middle AA line;

[0050] Figure 6 In one embodiment of the present application, the bonding area is heated so that the bonding conductive part forms a plurality of piercing parts. Figure 2 Schematic diagram of the middle AA line;

[0051] Figure 7 In one embodiment of the present application, a conductive adhesive layer is disposed on the binding conductive portion. Figure 2 Schematic diagram of the middle AA line;

[0052] Figure 8 The display panel prepared in one embodiment of the present application is Figure 2 Schematic diagram of the AA line.

[0053] Description of reference numerals:

[0054] 10. Substrate; 101. Binding area; 102. Display area; 103. Frame area; 20. Binding conductive part; 21. Piercing part; 22. Groove; 30. Conductive adhesive layer; 31. Conductive particles; 32. Insulating adhesive film layer. DETAILED DESCRIPTION

[0055] In order to facilitate the understanding of the present application, the present application will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present application are provided in the drawings. However, the present application can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the understanding of the disclosure of the present application more thorough and comprehensive.

[0056] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The term "and / or" used herein includes any and all combinations of one or more of the related listed items.

[0057] When describing positional relationships, unless otherwise specified, when an element such as a layer, film, or substrate is referred to as being "on" another element, it can be directly on the other element or there can be intervening elements. Further, when a layer is referred to as being "under" another layer, it can be directly below or there can be one or more light-emitting units. It is also understood that when a layer is referred to as being "between" two layers, it can be the only layer between the two layers or there can be one or more light-emitting units.

[0058] In the case of using “including”, “having”, and “comprising” described herein, another component may be added unless a clear limiting term such as “only”, “consisting of”, etc. is used. Unless mentioned otherwise, a term in the singular form may include a plural form and should not be understood as being one in number.

[0059] It should be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another element. For example, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element without departing from the scope of the present application.

[0060] It should also be understood that when interpreting an element, even if not explicitly described, the element is interpreted as including a range of error, which should be within the acceptable deviation range of the specific value determined by those skilled in the art. For example, "approximately", "approximately" or "substantially" can mean within one or more standard deviations, which are not limited here.

[0061] Furthermore, in the specification, the phrase “planar distribution schematic diagram” refers to a drawing when a target portion is viewed from above, and the phrase “cross-sectional schematic diagram” refers to a drawing when a section taken by vertically cutting the target portion is viewed from the side.

[0062] In addition, the drawings are not drawn to a 1:1 scale, and the relative sizes of the elements in the drawings are drawn only as examples and not necessarily according to the true scale.

[0063] As described in the background art, AMOLED display panels are developing towards narrow borders. Narrow borders mean that the size of the binding circuit is reduced. In order to ensure the conductivity of the binding area, a higher requirement is placed on the capture rate of the conductive particles in the binding area.

[0064] Based on the above reasons, the present invention provides a display panel and a preparation method thereof, and a display device. By forming a piercing portion on the binding conductive portion and applying pressure to the conductive adhesive layer or the binding area, the piercing portion can pierce the conductive particles inside the conductive adhesive layer, so that the piercing portion firmly fixes the conductive particles inside the conductive adhesive layer and is electrically connected to it, thereby increasing the capture rate of the number of conductive particles captured by the binding conductive portion. At the same time, the piercing portion pierces the conductive particles to avoid the displacement of the conductive particles, thereby increasing the capture rate of the conductive particles in the binding area, and meeting the requirements of the narrow-frame display panel for the conductive particle capture ability of the binding area.

[0065] In a first aspect, an embodiment of the present application provides a method for preparing a display panel, wherein the display panel may include a flexible display panel having only a display function, or may include a flexible display panel having a touch function. The flexible display panel may, for example, be a flexible OLED (Organic Light-Emitting Diode) display panel, an active organic light-emitting diode display panel (AMOLED), or other types of flexible display panels.

[0066] Specifically, Figure 1 As shown, the method for preparing the display panel includes:

[0067] Step S11: providing a substrate 10, wherein the substrate 10 has a binding area 101, and a binding conductive portion 20 is disposed on the binding area 101;

[0068] Reference Figure 2 , Figure 3 The substrate 10 may be a flexible polyimide (PI), rigid glass or a thin metal sheet. The present application embodiment will not discuss in detail the substrate 10 made of other materials. Those skilled in the art may select different types of materials according to actual needs. The substrate 10 includes a display area 102 and a frame area 103 disposed outside the display area 102. The binding area 101 is disposed in the frame area 103.

[0069] Step S12: forming a plurality of piercing portions 21 on a side of the binding conductive portion 20 facing away from the substrate 10;

[0070] Reference Figure 4 , Figure 5 or Figure 6 The plurality of piercing portions 21 extend in a direction away from the substrate 10 , and the top of the piercing portion 21 may have a sharp shape.

[0071] Step S13: providing a conductive adhesive layer 30, wherein the conductive adhesive layer 30 is provided with conductive particles 31;

[0072] Reference Figure 7The conductive adhesive layer 30 is used to electrically connect the binding area 101 and the circuit on the substrate 10 after the substrate 10 is bound. The conductive adhesive layer 30 includes an insulating film layer 32 and conductive particles 31 dispersed inside the insulating film layer 32. The material of the insulating film layer 32 may include resin, such as polyimide resin, etc., and the material of the conductive particles 31 includes conductive metal.

[0073] Step S14: placing the conductive adhesive layer 30 on the binding conductive part 20, applying pressure to the conductive adhesive layer 30 or the binding area 101, and the piercing part 21 pierces the conductive particles 31 inside the conductive adhesive layer 30, and the piercing part 21 fixes the conductive particles 31 and electrically connects it.

[0074] Reference Figure 8 , a pressure head may be used to press the conductive adhesive layer 30 or the substrate 10 of the binding area 101, and pressure may be applied to the contact surface between the conductive adhesive layer 30 and the piercing portion 21, so that the piercing portion 21 pierces the insulating adhesive film layer 32 of the conductive adhesive layer 30 and the conductive particles 31 inside the conductive adhesive layer 30, so that the conductive particles 31 are fixed to the piercing portion 21 and form an electrical connection. In one example, a pressure head is used to press the conductive adhesive layer 30, and the conductive adhesive layer 30 is forced to move toward the piercing portion 21, so that the piercing portion 21 pierces the insulating adhesive film layer 32 inside the conductive adhesive layer 30 and the conductive particles 31 inside the conductive adhesive layer 30. In another example, a pressure head is used to press the substrate 10 of the binding area 101, and the piercing portion 21 moves toward the conductive adhesive layer 30, pierces the insulating adhesive film layer 32 inside the conductive adhesive layer 30 and the conductive particles 31 inside the conductive adhesive layer 30.

[0075] The preparation method of the above-mentioned display panel forms a piercing portion 21 on the binding conductive portion 20, applies pressure to the conductive adhesive layer 30 or the binding area 101, and the piercing portion 21 can pierce the conductive particles 31 inside the conductive adhesive layer 30, so that the piercing portion 21 firmly fixes the conductive particles 31 inside the conductive adhesive layer 30 and is electrically connected thereto, thereby improving the capture rate of the number of conductive particles 31 captured by the binding conductive portion 20. At the same time, the piercing portion 21 pierces the conductive particles 31, which can avoid the displacement of the conductive particles 31, thereby improving the capture rate of the conductive particles 31 in the binding area 101, and meeting the requirements of the narrow-frame display panel for the capture ability of the conductive particles 31 in the binding area 101.

[0076] In one embodiment, referring to Figure 4 , Figure 5, a plurality of piercing portions 21 are formed on the side of the binding conductive portion 20 away from the substrate 10, including: laser irradiation of the binding conductive portion 20, the stress of the binding conductive portion 20 increases after receiving heat, the binding conductive portion 20 releases the stress and deforms in the direction away from the substrate 10, so that the binding conductive portion 20 forms the piercing portion 21 on the side away from the substrate 10. In this way, the laser irradiation is conducive to the high-precision formation of heat conduction to the binding conductive portion 20, so as to increase the stress of the binding conductive portion 20, release the stress and deform to form the piercing portion 21, which can prevent the temperature increase of the substrate 10 from affecting the performance of the display panel.

[0077] For example, an infrared laser or a far-infrared laser can be used to irradiate the binding area 101 to apply heat to the binding conductive part 20. The heat in the binding conductive part 20 continues to accumulate. After the stress of the binding conductive part 20 increases to a deformation threshold, the binding conductive part 20 releases the stress and deforms in a direction away from the substrate 10 to form a piercing part 21.

[0078] In one example, referring to Figure 5 , Figure 5 The direction pointed by the arrow below the middle substrate 10 is the laser irradiation direction, and the laser irradiates the binding conductive part 20 from the substrate 10 toward the binding conductive part 20; that is, the laser irradiates the binding conductive part 20 from the bottom of the substrate 10 in the binding area 101. This is helpful to control the size and structure of the piercing part 21, making it sharper and improving its ability to pierce and capture the conductive particles 31.

[0079] In another example, referring to Figure 4 , the laser irradiates the binding conductive part 20 from the top surface of the binding conductive part 20 toward the substrate 10; that is, the laser irradiates the top surface of the binding conductive part 20 to deform it to form the piercing part 21. In this way, the influence of laser irradiation on the substrate 10 is reduced, and the yield rate and display performance of the display panel are improved.

[0080] In one of the embodiments, after the conductive adhesive layer 30 is disposed on the binding conductive part 20, a laser is used to irradiate the binding conductive part 20 so that the binding conductive part 20 releases stress in a direction away from the substrate 10 and deforms to form a piercing part 21. The piercing part 21 pierces the conductive particles 31 inside the conductive adhesive layer 30, and the piercing part 21 fixes the conductive particles 31 and electrically connects it.

[0081] In one embodiment, referring to Figure 5, a plurality of piercing portions 21 are formed on the side of the binding conductive portion 20 away from the substrate 10, including: heating the binding area 101, the temperature of the binding area 101 increases to transfer heat to the binding conductive portion 20, the stress of the binding conductive portion 20 increases after absorbing the heat, and the binding conductive portion 20 releases the stress and deforms in the direction away from the substrate 10, so that the binding conductive portion 20 forms a piercing portion 21 on the side away from the substrate 10; in this way, the method of heating the binding area 101 is simple and easy to operate, and at the same time, heating the binding area 101 can reduce the impact of high temperature on other areas of the substrate 10, which is beneficial to improving the yield rate and display performance of the display panel.

[0082] In one embodiment, a hot plate may be used to heat the bonding area 101 .

[0083] In one embodiment, the heating temperature is 230°C-600°C; the heating time is greater than or equal to 1 min. For example, the heating temperature can be 230°C, 250°C, 300, 350°C, 400°C, 450°C, 500°C, 550°C or 600°C; the heating time can be set to 1 min, 1.5 min, 3 min or longer according to needs.

[0084] In one embodiment, the binding conductive part 20 includes at least an aluminum metal layer. After the metal aluminum absorbs heat to the deformation threshold, the stress inside the metal aluminum increases, and the lattice is squeezed and deformed by the stress to release the stress, and can be deformed. In this way, this embodiment reasonably sets the material of the binding conductive part 20 to ensure that the heat increases after it is irradiated by laser or heated, and it can release stress and deform in the direction away from the substrate 10 to form a piercing part 21. On the other hand, metal aluminum is sensitive to temperature. Therefore, it is only necessary to process the binding area to deform the binding conductive part 20 to form the piercing part 21 without heating the entire substrate 10. This can reduce the impact of high temperature on other areas of the substrate 10, which is beneficial to improving the yield rate and display performance of the display panel.

[0085] In one embodiment, the thickness of the aluminum metal layer is 500nm-1um; for example, the thickness of the aluminum metal layer can be 500nm, 550nm, 600nm, 650nm, 700nm, 750nm, 800nm, 850nm, 900nm, 950nm or 1um. In this way, the size and sharpness of the piercing portion 21 formed are sufficient to pierce and fix the conductive particles 31 inside the conductive adhesive layer 30, effectively improving the conductive particle 31 capture capability of the binding area 101.

[0086] In one example, the binding conductive part 20 includes a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer stacked in sequence. The thickness of the aluminum metal layer is greater than 500nm, and the thickness of the second titanium metal layer is less than 150nm. For example, the thickness of the second titanium metal layer can be 150nm, 120nm, 100nm or 80nm. The display area 102 of the substrate 10 is formed with stacked metal layers, and the binding conductive part 20 can be formed in the same process as the metal layers stacked in the display area 102, which is conducive to saving manufacturing steps, improving process efficiency, and reducing manufacturing costs.

[0087] In another example, the binding conductive part 20 includes an aluminum metal layer and a titanium metal layer stacked in sequence.

[0088] In yet another example, the binding conductive part 20 includes an aluminum metal layer and a molybdenum metal layer stacked in sequence.

[0089] In one embodiment, referring to Figure 8 The substrate 10 is a polyimide substrate 10. The display panel is an AMOLED panel, the binding area 101 of the display panel has good conductive ion capture capability, and the binding conductive part 20 can have a smaller size, which can avoid the problem of poor electrical properties of the binding area 101 that may occur when the AMOLED panel develops towards a narrow frame.

[0090] In one embodiment, referring to Figure 8 At least some of the piercing parts 21 are arranged at intervals, and grooves 22 are formed between adjacent piercing parts 21. After the piercing parts 21 pierce the conductive particles 31 inside the conductive adhesive layer 30, some of the conductive particles 31 are located in the grooves 22 and are electrically connected to the binding conductive part 20. It can be understood that the grooves 22 have a relatively small size, which has the effect of limiting the movement of the conductive particles 31, so that the positions of the conductive particles 31 accommodated in the grooves 22 are fixed and will not move outside the grooves 22. The conductive particles 31 in the grooves 22 are electrically connected to the piercing parts 21 on both sides or the binding conductive part 20 below.

[0091] In this way, the grooves 22 formed between adjacent piercing portions 21 can fix the conductive particles 31 inside the conductive adhesive layer 30, further improving the capture rate of the conductive particles 31 in the binding area 101, and meeting the requirements of the narrow-frame display panel for the capture ability of the conductive particles 31 in the binding area 101.

[0092] Based on the description of the above embodiments, more specific embodiments are proposed below for detailed description.

[0093] Embodiment 1:

[0094] A method for preparing a display panel includes:

[0095] S101: providing a substrate 10, wherein the substrate 10 has a binding area 101, and a binding conductive portion 20 is disposed on the binding area 101;

[0096] S102: The laser irradiates the binding conductive part 20. After the binding conductive part 20 receives heat, stress increases. The binding conductive part 20 releases stress and deforms in a direction away from the substrate 10, so that the binding conductive part 20 forms a piercing part 21 on the side away from the substrate 10;

[0097] S103: providing a conductive adhesive layer 30, wherein the conductive adhesive layer 30 is provided with conductive particles 31;

[0098] S104: placing the conductive adhesive layer 30 on the binding conductive part 20, applying pressure to the conductive adhesive layer 30 or the binding area 101, and the piercing part 21 pierces the conductive particles 31 inside the conductive adhesive layer 30, and the piercing part 21 fixes the conductive particles 31 and electrically connects it.

[0099] Embodiment 2:

[0100] A method for preparing a display panel includes:

[0101] S201: providing a substrate 10, wherein the substrate 10 has a binding area 101, and a binding conductive portion 20 is disposed on the binding area 101;

[0102] S202: heating the binding area 101. The temperature of the binding area 101 increases and transfers heat to the binding conductive part 20. After the binding conductive part 20 absorbs the heat, the stress increases. The binding conductive part 20 releases the stress in a direction away from the substrate 10 and deforms, so that the binding conductive part 20 forms a piercing part 21 on the side away from the substrate 10.

[0103] S203: providing a conductive adhesive layer 30, wherein the conductive adhesive layer 30 is provided with conductive particles 31;

[0104] S204: placing the conductive adhesive layer 30 on the binding conductive part 20, applying pressure to the conductive adhesive layer 30 or the binding area 101, and the piercing part 21 pierces the conductive particles 31 inside the conductive adhesive layer 30, and the piercing part 21 fixes the conductive particles 31 and electrically connects it.

[0105] Embodiment three:

[0106] A method for preparing a display panel includes:

[0107] S301: providing a substrate 10, wherein the substrate 10 has a binding area 101, and a binding conductive portion 20 is disposed on the binding area 101;

[0108] S302: providing a conductive adhesive layer 30, wherein the conductive adhesive layer 30 is provided with conductive particles 31;

[0109] S303: placing the conductive adhesive layer 30 on the binding conductive part 20;

[0110] S304: The laser irradiates the binding conductive part 20 to release stress and deform the binding conductive part 20 in a direction away from the substrate 10, so that the binding conductive part 20 forms a piercing part 21 on the side away from the substrate 10, and the piercing part 21 pierces the conductive particles 31 inside the conductive adhesive layer 30, and the piercing part 21 fixes the conductive particles 31 and electrically connects it.

[0111] It should be understood that, although the steps in the flowchart of the accompanying drawings are displayed in sequence as indicated by the arrows, these steps are not necessarily executed in sequence in the order indicated by the arrows. Unless otherwise specified herein, there is no strict order restriction on the execution of these steps, and these steps can be executed in other orders. Moreover, at least a portion of the steps in the accompanying drawings may include multiple steps or multiple stages, and these steps or stages are not necessarily executed at the same time, but can be executed at different times, and the execution order of these steps or stages is not necessarily sequential, but can be executed in turn or alternately with other steps or at least a portion of the steps or stages in other steps.

[0112] Based on the same inventive concept, the embodiment of the present application also provides a display panel, which may include a flexible display panel having only a display function, or a flexible display panel having a touch function. The flexible display panel may, for example, be a flexible OLED (Organic Light-Emitting Diode) display panel, an active organic light-emitting diode display panel (AMOLED), or other types of flexible display panels.

[0113] Specifically, refer to Figure 8The display panel includes a substrate 10, a binding conductive part 20, a plurality of piercing parts 21 and a conductive adhesive layer 30; the substrate 10 has a binding area 101, and the binding area 101 is provided with the binding conductive part 20, wherein the substrate 10 can be flexible polyimide (PI), rigid glass or a thin metal sheet, etc. The embodiments of the present application will not discuss in detail the substrate 10 of other materials. Those skilled in the art may select different types of materials according to actual needs. The substrate 10 includes a display area 102 and a frame area 103 arranged outside the display area 102, and the binding area 101 is arranged in the frame area 103; a plurality of piercing portions 21 are arranged on the side of the binding conductive portion 20 away from the substrate 10, and the plurality of piercing portions 21 extend in a direction away from the substrate 10, and the top of the piercing portion 21 may have a sharp morphology; a conductive adhesive layer 30 is arranged on the side of the binding conductive portion 20 away from the substrate 10, and conductive particles 31 are arranged in the conductive adhesive layer 30, and the piercing portions 21 pierce the conductive particles 31 inside the conductive adhesive layer 30, and the piercing portions 21 fix the conductive particles 31 and electrically connect them.

[0114] The conductive adhesive layer 30 is used to electrically connect the binding area 101 and the circuit on the substrate 10 after the substrate 10 is bound. The conductive adhesive layer 30 includes an insulating adhesive film layer 32 and conductive particles 31 dispersed inside the insulating adhesive film layer 32. The material of the insulating adhesive film layer 32 may include resin, such as polyimide resin, etc., and the material of the conductive particles 31 includes conductive metal. The piercing portion 21 pierces the insulating adhesive film layer 32 of the conductive adhesive layer 30 and pierces the conductive particles 31 inside the conductive adhesive layer 30, so that the conductive particles 31 are fixed to the piercing portion 21 and form an electrical connection.

[0115] The above-mentioned display panel, by providing a piercing portion 21 on the binding conductive portion 20, piercing the conductive particles 31 inside the conductive adhesive layer 30 through the piercing portion 21, the piercing portion 21 firmly fixes the conductive particles 31 inside the conductive adhesive layer 30 and is electrically connected thereto, thereby improving the capture rate of the number of conductive particles 31 captured by the binding conductive portion 20. At the same time, the piercing portion 21 pierces the conductive particles 31, which can avoid the displacement of the conductive particles 31, thereby improving the capture rate of the conductive particles 31 in the binding area 101, and meeting the requirements of the narrow-frame display panel for the capture ability of the conductive particles 31 in the binding area 101.

[0116] In one embodiment, referring to Figure 8 The piercing portion 21 is formed by laser irradiation or heating the binding conductive portion 20. In this way, heat can be accurately applied to the binding area 101 to increase the heat of the binding conductive portion 20 to deform it to form the piercing portion 21, thereby avoiding high temperature damage to other areas of the substrate 10, which is beneficial to improving the yield rate and display performance of the display panel.

[0117] In one embodiment, referring to Figure 8, the binding conductive part 20 includes at least an aluminum metal layer. After the metal aluminum absorbs heat to the deformation threshold, the internal stress of the metal aluminum increases, and the lattice is squeezed and deformed by the stress to release the stress, and can be deformed. In this way, this embodiment reasonably sets the material of the binding conductive part 20 to ensure that the heat increases after it is irradiated by laser or heated, and it can release stress and deform in the direction away from the substrate 10 to form a piercing part 21. On the other hand, metal aluminum is sensitive to temperature. Therefore, it is only necessary to process the binding area to deform the binding conductive part 20 to form the piercing part 21 without heating the entire substrate 10. This can reduce the impact of high temperature on other areas of the substrate 10, which is beneficial to improving the yield rate and display performance of the display panel.

[0118] Preferably, the thickness of the aluminum metal layer is 500nm-1um; for example, the thickness of the aluminum metal layer can be 500nm, 550nm, 600nm, 650nm, 700nm, 750nm, 800nm, 850nm, 900nm, 950nm or 1um. In this way, the size and sharpness of the piercing portion 21 formed are sufficient to pierce and fix the conductive particles 31 inside the conductive adhesive layer 30, effectively improving the conductive particle 31 capture capability of the binding area 101.

[0119] In one example, the binding conductive part 20 includes a first titanium metal layer, an aluminum metal layer, and a second titanium metal layer stacked in sequence. The thickness of the aluminum metal layer is greater than 500nm, and the thickness of the second titanium metal layer is less than 150nm. For example, the thickness of the second titanium metal layer can be 150nm, 120nm, 100nm or 80nm. The display area 102 of the substrate 10 is formed with stacked metal layers, and the binding conductive part 20 can be formed in the same process as the metal layers stacked in the display area 102, which is conducive to saving manufacturing steps, improving process efficiency, and reducing manufacturing costs.

[0120] In another example, the binding conductive part 20 includes an aluminum metal layer and a titanium metal layer stacked in sequence.

[0121] In yet another example, the binding conductive part 20 includes an aluminum metal layer and a molybdenum metal layer stacked in sequence.

[0122] In one embodiment, referring to Figure 8 The substrate 10 is a polyimide substrate 10. The display panel is an AMOLED panel, the binding area 101 of the display panel has good conductive ion capture capability, and the binding conductive part 20 can have a smaller size, which can avoid the problem of poor electrical properties of the binding area 101 that may occur when the AMOLED panel develops towards a narrow frame.

[0123] In one embodiment, referring to Figure 8, at least some of the piercing parts 21 are arranged at intervals, and grooves 22 are provided between adjacent piercing parts 21, and some of the conductive particles 31 are located in the grooves 22 and are electrically connected to the binding conductive part 20. It can be understood that the grooves 22 have a relatively small size, which has the effect of limiting the movement of the conductive particles 31, so that the positions of the conductive particles 31 accommodated in the grooves 22 are fixed and will not move outside the grooves 22, and the conductive particles 31 in the grooves 22 are electrically connected to the piercing parts 21 on both sides or the binding conductive part 20 below.

[0124] In this way, the grooves 22 between adjacent piercing portions 21 can fix the conductive particles 31 inside the conductive adhesive layer 30, further improving the capture rate of the conductive particles 31 in the binding area 101, and meeting the requirements of the narrow-frame display panel for the capture ability of the conductive particles 31 in the binding area 101.

[0125] Based on the same inventive concept, an embodiment of the present application further provides a display device (not shown), including a display panel obtained by the method for preparing the display panel of the above embodiment, or including the display panel of the above embodiment.

[0126] The above-mentioned display device forms a piercing portion 21 on the binding conductive portion 20 and applies pressure to the conductive adhesive layer 30 or the binding area 101. The piercing portion 21 can pierce the conductive particles 31 inside the conductive adhesive layer 30, so that the piercing portion 21 firmly fixes the conductive particles 31 inside the conductive adhesive layer 30 and is electrically connected thereto, thereby improving the capture rate of the number of conductive particles 31 captured by the binding conductive portion 20. At the same time, the piercing portion 21 pierces the conductive particles 31, which can avoid the displacement of the conductive particles 31, thereby improving the capture rate of the conductive particles 31 in the binding area 101, and meeting the requirements of the narrow-frame display panel for the capture ability of the conductive particles 31 in the binding area 101.

[0127] It can be understood that the display device in the embodiments of the present application can be an OLED display device, a QLED display device, electronic paper, a mobile phone, a tablet computer, a television, a monitor, a laptop computer, a digital photo frame, a navigator, a wearable device, an Internet of Things device, or any other product or component with a display function, and the embodiments disclosed in the present application are not limited to this.

[0128] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0129] The above-mentioned embodiments only express several implementation methods of the present invention, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the invention patent. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A method for preparing a display panel, characterized in that: include: Providing a substrate, the substrate having a binding area, the binding area being provided with a binding conductive portion; forming a plurality of piercing portions on a side of the binding conductive portion facing away from the substrate; Providing a conductive adhesive layer, wherein conductive particles are arranged in the conductive adhesive layer; The conductive adhesive layer is arranged on the binding conductive part, and pressure is applied to the conductive adhesive layer or the binding area, so that the piercing part pierces the conductive particles inside the conductive adhesive layer, and the piercing part fixes the conductive particles and electrically connects them.

2. The method for preparing a display panel according to claim 1, characterized in that: Forming a plurality of piercing portions on a side of the binding conductive portion away from the substrate, comprising: irradiating the binding conductive portion with a laser so that the binding conductive portion forms the piercing portions on a side away from the substrate; Preferably, the binding conductive part is irradiated with laser from the substrate toward the binding conductive part; Preferably, the binding conductive portion is irradiated with laser light in a direction from the binding conductive portion toward the substrate.

3. The method for preparing a display panel according to claim 1, characterized in that: Forming a plurality of piercing portions on a side of the binding conductive portion away from the substrate, comprising: heating the binding area to form the piercing portions on a side of the binding conductive portion away from the substrate; Preferably, the heating temperature is 230° C.-600° C.; and the heating time is greater than or equal to 1 min.

4. The method for preparing a display panel according to claim 2 or 3, characterized in that: The binding conductive part at least comprises an aluminum metal layer; Preferably, the thickness of the aluminum metal layer is 500nm-1um; Preferably, the binding conductive part comprises a first titanium metal layer, an aluminum metal layer and a second titanium metal layer stacked in sequence; Preferably, the binding conductive part comprises an aluminum metal layer and a titanium metal layer stacked in sequence; Preferably, the binding conductive part comprises an aluminum metal layer and a molybdenum metal layer stacked in sequence; Preferably, the substrate is a polyimide substrate.

5. The method for preparing a display panel according to claim 1, characterized in that: At least some of the piercing portions are arranged at intervals, and grooves are formed between adjacent piercing portions. Some of the conductive particles are located in the grooves and are electrically connected to the binding conductive portion.

6. A display panel, characterized in that: include: A substrate, the substrate having a binding area, and a binding conductive portion is provided on the binding area; A plurality of piercing portions, arranged on a side of the binding conductive portion away from the substrate; The conductive adhesive layer is arranged on the side of the binding conductive part away from the substrate. The conductive adhesive layer is provided with conductive particles. The piercing part pierces the conductive particles inside the conductive adhesive layer. The piercing part fixes the conductive particles and electrically connects them.

7. The display panel according to claim 6, characterized in that: The piercing portion is formed by laser irradiation or heating of the binding conductive portion.

8. The display panel according to claim 7, characterized in that: The binding conductive part at least comprises an aluminum metal layer; Preferably, the thickness of the aluminum metal layer is 500nm-1um; Preferably, the binding conductive part comprises a first titanium metal layer, an aluminum metal layer and a second titanium metal layer stacked in sequence; Preferably, the binding conductive part comprises an aluminum metal layer and a titanium metal layer stacked in sequence; Preferably, the binding conductive part comprises an aluminum metal layer and a molybdenum metal layer stacked in sequence; Preferably, the substrate is a polyimide substrate.

9. The display panel according to claim 6, characterized in that: At least some of the piercing portions are arranged at intervals, and grooves are provided between adjacent piercing portions. Some of the conductive particles are located in the grooves and are electrically connected to the binding conductive portion.

10. A display device, characterized in that: A display panel obtained by the method for preparing a display panel according to any one of claims 1 to 5, or a display panel according to any one of claims 6 to 9.

Images