Optical module

Abstract

The optical module provided by the invention comprises a circuit board and a light emitting component. The driver on the circuit board comprises a first output end and a second output end which respectively output a first modulation signal and a second modulation signal. A first modulation unit in the light emitting component is connected with a first output end through a first path, and a second modulation unit is connected with a second output end through a second path. The first modulation unit performs first modulation on the optical signal according to the first modulation signal, and the second modulation unit performs second modulation on the optical signal according to the second modulation signal. The first modulation and the second modulation are homodromous modulation. The same-direction modulation comprises the following steps: when the first modulation signal and the second modulation signal are the same signal, the attributes of the first modulation unit and the second modulation unit are different, and a phase inversion circuit is arranged on the first path or the second path; and when the first modulation signal and the second modulation signal are differential signals, the first modulation unit and the second modulation unit have the same attribute, and a phase inversion circuit is arranged on the first path or the second path.

Description

An optical module

[0001] This application claims the priority of application number 202310613631.X filed with the China Patent Office on May 26, 2023; the priority of application number 202310610796.1 filed with the China Patent Office on May 26, 2023; and the priority of application number 202310701617.5 filed with the China Patent Office on June 13, 2023; all of which are incorporated by reference into this application. Technical Field

[0002] The present disclosure relates to the field of optical fiber communication technology, and in particular to an optical module. Background Art

[0003] With the development of new services and applications such as cloud computing, mobile internet, and video, the advancement of optical communication technology has become increasingly important. In optical communication technology, optical modules are tools for converting optical and electrical signals. They are key components in optical communication equipment and are at the core of optical communication.

[0004] Summary of the Invention

[0005] The optical module provided by the present disclosure includes a circuit board and an optical emitting component. A driver is provided on the surface of the circuit board, the driver includes a first output terminal and a second output terminal, the driver outputs a first modulation signal through the first output terminal, and the driver outputs a second modulation signal through the second output terminal; the optical emitting component is electrically connected to the circuit board, the emitting component includes a laser component, the laser component includes a first modulation unit and a second modulation unit, the optical output terminal of the first modulation unit is optically connected to the optical input terminal of the second modulation unit, the first modulation unit is connected to the first output terminal through a first path, and the second modulation unit is connected to the second output terminal through a second path; the first modulation unit is configured to perform a first modulation according to the first modulation signal and output a first optical signal; the second modulation unit is configured to perform a second modulation on the first optical signal according to the second modulation signal; wherein the first modulation and the second modulation are co-directional modulations, so that the optical output terminal of the first modulation unit is optically connected to the optical input terminal of the second modulation unit. The optical power modulation superposition of the optical signal corresponding to the special signal; wherein the first modulation and the second modulation are co-directional modulations including: the first modulation signal and the second modulation signal are differential signals with opposite phases, and the modulation properties of the first modulation unit and the second modulation unit are different; or, the first modulation signal and the second modulation signal are differential signals with opposite phases, and the modulation properties of the first modulation unit and the second modulation unit are the same, and a phase reversal circuit is connected in series on the first path or the second path; or, the first modulation signal and the second modulation signal are signals with the same phase, and the modulation properties of the first modulation unit and the second modulation unit are the same; or, the first modulation signal and the second modulation signal are signals with the same phase, and the modulation properties of the first modulation unit and the second modulation unit are different, and a phase reversal circuit is connected in series on the first path or the second path. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] To more clearly illustrate the technical solutions of the present disclosure, the following briefly introduces the drawings required for use in some embodiments of the present disclosure. Obviously, the drawings described below are only drawings of some embodiments of the present disclosure, and those skilled in the art can also derive other drawings based on these drawings. Furthermore, the drawings described below are schematic diagrams and are not intended to limit the actual dimensions of the products, actual processes of the methods, actual timing of signals, and the like involved in the embodiments of the present disclosure.

[0007] FIG1 is a partial structural diagram of an optical communication system according to some embodiments of the present disclosure;

[0008] FIG2 is a partial structural diagram of a host computer according to some embodiments of the present disclosure;

[0009] FIG3 is a schematic structural diagram of an optical module provided according to some embodiments of the present disclosure;

[0010] FIG4 is an exploded view of an optical module according to some embodiments of the present disclosure;

[0011] FIG5 is a schematic diagram of the internal structure of an optical module according to some embodiments of the present disclosure;

[0012] FIG6 is a schematic structural diagram of a light emitting component provided according to some embodiments of the present disclosure;

[0013] FIG7 is a schematic diagram of a partial structure of a light emitting component according to some embodiments of the present disclosure;

[0014] FIG8 is a schematic diagram showing a connection principle between a laser assembly and a driver according to some embodiments of the present disclosure;

[0015] FIG9 is a schematic structural diagram of a laser assembly according to some embodiments of the present disclosure;

[0016] FIG10 is a circuit diagram of a laser assembly according to some embodiments of the present disclosure;

[0017] FIG11 is a circuit diagram of another laser assembly according to some embodiments of the present disclosure;

[0018] FIG12 is a schematic diagram of the signal modulation principle of the laser assembly in FIG11 ;

[0019] FIG13 is a circuit diagram of another laser assembly according to some embodiments of the present disclosure;

[0020] FIG14 is a schematic diagram of the signal modulation principle of the laser assembly in FIG13;

[0021] FIG15 is a circuit diagram of a fourth laser assembly according to some embodiments of the present disclosure;

[0022] FIG16 is a circuit diagram of a fifth laser assembly according to some embodiments of the present disclosure;

[0023] FIG17 is an exploded schematic diagram of FIG16;

[0024] FIG18 is an exploded view of a light emitting component according to some embodiments of the present disclosure;

[0025] FIG19 is a schematic diagram of a partial structure of a light emitting component according to some embodiments of the present disclosure;

[0026] FIG20 is a partially exploded schematic diagram of a light emitting component according to some embodiments of the present disclosure;

[0027] FIG21 is a schematic structural diagram of an electrical connector according to some embodiments of the present disclosure;

[0028] FIG22 is a schematic structural diagram of a base provided according to some embodiments of the present disclosure;

[0029] FIG23 is a diagram illustrating a base in use according to some embodiments of the present disclosure;

[0030] FIG24 is a structural diagram of an optical module testing system according to some embodiments;

[0031] FIG25 is a structural diagram of an optical module without a housing according to some embodiments;

[0032] FIG26 is another structural diagram of an optical module with a housing removed according to some embodiments;

[0033] FIG27 is an assembly diagram of a laser chip, a power chip, and an MCU according to some embodiments;

[0034] FIG28 is a structural diagram of an MCU according to some embodiments;

[0035] FIG29 is a flowchart 1 of a debugging method according to some embodiments;

[0036] FIG30 is a flowchart 2 of a debugging method provided according to some embodiments;

[0037] FIG31 is a flowchart 3 of a debugging method provided according to some embodiments. DETAILED DESCRIPTION

[0038] In optical communication technology, to establish information transmission between information processing devices, it is necessary to load the information onto light and use the propagation of light to achieve information transmission. Here, the light loaded with information is an optical signal. When transmitting optical signals within information transmission equipment, they can reduce optical power loss, thereby enabling high-speed, long-distance, and low-cost information transmission. The signals that information processing equipment can recognize and process are electrical signals. Information processing equipment typically includes optical network units (ONUs), gateways, routers, switches, mobile phones, computers, servers, tablets, televisions, etc., and information transmission equipment typically includes optical fibers and optical waveguides.

[0039] Optical modules can convert optical signals into electrical signals between information processing devices and information transmission devices. For example, at least one of the optical signal input or output ends of an optical module is connected to an optical fiber, and at least one of the electrical signal input or output ends of the optical module is connected to an optical network terminal. A first optical signal from the optical fiber is transmitted to the optical module, which converts the first optical signal into a first electrical signal and transmits the first electrical signal to the optical network terminal. A second electrical signal from the optical network terminal is transmitted to the optical module, which converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber. Because multiple information processing devices can transmit information via electrical signals, at least one of the multiple information processing devices needs to be directly connected to the optical module, rather than all of them. Here, the information processing device directly connected to the optical module is referred to as the optical module's host computer. Furthermore, the optical signal input or output end of the optical module can be referred to as an optical port, and the electrical signal input or output end of the optical module can be referred to as an electrical port.

[0040] Figure 1 is a partial structural diagram of an optical communication system according to some embodiments of the present disclosure. As shown in Figure 1 , the optical communication system mainly includes a remote information processing device 1000, a local information processing device 2000, a host computer 100, an optical module 200, an optical fiber 101, and a network cable 103.

[0041] One end of optical fiber 101 extends toward remote information processing device 1000, and the other end of optical fiber 101 is connected to optical module 200 through the optical port of optical module 200. Optical signals can be totally reflected in optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal undergoes multiple total reflections in optical fiber 101 to transmit the optical signal from remote information processing device 1000 to optical module 200, and vice versa, thereby achieving long-distance, low-power information transmission.

[0042] The optical communication system may include one or more optical fibers 101, and the optical fibers 101 may be detachably connected or fixedly connected to the optical module 200. The host computer 100 is configured to provide data signals to the optical module 200, receive data signals from the optical module 200, or monitor or control the operating status of the optical module 200.

[0043] The host computer 100 includes a substantially rectangular housing and an optical module interface 102 disposed on the housing. The optical module interface 102 is configured to connect to the optical module 200 to establish a unidirectional or bidirectional electrical signal connection between the host computer 100 and the optical module 200.

[0044] The host computer 100 also includes an external electrical interface that can access an electrical signal network. For example, the external electrical interface includes a Universal Serial Bus (USB) interface or a network cable interface 104. The network cable interface 104 is configured to access a network cable 103 so that the host computer 100 establishes a unidirectional or bidirectional electrical signal connection with the network cable 103. One end of the network cable 103 is connected to the local information processing device 2000, and the other end of the network cable 103 is connected to the host computer 100, so that an electrical signal connection is established between the local information processing device 2000 and the host computer 100 via the network cable 103. For example, a third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 via the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal and transmits the second optical signal to the optical fiber 101. The second optical signal is then transmitted to the remote information processing device 1000 via the optical fiber 101. For example, a first optical signal from the remote information processing device 1000 is transmitted through the optical fiber 101. The first optical signal from the optical fiber 101 is transmitted to the optical module 200. The optical module 200 converts the first optical signal into a first electrical signal. The optical module 200 transmits the first electrical signal to the host computer 100. The host computer 100 generates a fourth electrical signal based on the first electrical signal and transmits the fourth electrical signal to the local information processing device 2000. It should be noted that optical modules are tools for converting optical signals into electrical signals. During this conversion process, the information does not change, but the encoding and decoding methods of the information can change.

[0045] In addition to the optical network terminal, the host computer 100 also includes an optical line terminal (OLT), an optical network device (ONT), or a data center server.

[0046] Figure 2 is a partial structural diagram of a host computer according to some embodiments of the present disclosure. In order to clearly illustrate the connection relationship between the optical module 200 and the host computer 100, Figure 2 only shows the structure of the host computer 100 related to the optical module 200. As shown in Figure 2, the host computer 100 also includes a PCB circuit board 105 disposed within the housing, a cage 106 disposed on the surface of the PCB circuit board 105, a heat sink 107 disposed on the cage 106, and an electrical connector disposed within the cage 106. The electrical connector is configured to connect to the electrical port of the optical module 200; the heat sink 107 has a protruding structure such as fins that increase the heat dissipation area.

[0047] The optical module 200 is inserted into the cage 106 of the host computer 100. The cage 106 secures the optical module 200. Heat generated by the optical module 200 is transferred to the cage 106 and then dissipated through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical port of the optical module 200 connects with the electrical connector inside the cage 106, thereby establishing a bidirectional electrical signal connection between the optical module 200 and the host computer 100. Furthermore, the optical port of the optical module 200 connects to the optical fiber 101, thereby establishing a bidirectional optical signal connection between the optical module 200 and the optical fiber 101.

[0048] Figure 3 is a structural diagram of an optical module provided according to some embodiments of the present disclosure, and Figure 4 is an exploded schematic diagram of an optical module provided according to some embodiments of the present disclosure. As shown in Figures 3 and 4, the optical module 200 includes a housing, a circuit board 300 disposed within the housing, a light emitting component 400, and a light receiving component 500. However, the present disclosure is not limited to this. In some embodiments, the optical module 200 includes either the light emitting component 400 or the light receiving component 500.

[0049] The housing includes an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing with two openings. The outer contour of the housing is generally a square.

[0050] In some embodiments of the present disclosure, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicular to the base plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0051] In some embodiments, the lower shell 202 includes a base plate 2021 and two lower side plates 2022 located on both sides of the base plate 2021 and arranged perpendicularly to the base plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and arranged perpendicularly to the cover plate 2011. The two upper side plates are combined with the two lower side plates 2022 to achieve the upper shell 201 covering the lower shell 202.

[0052] The direction of the line connecting the two openings 203 and 204 can be consistent with the length direction of the optical module 200, or it can be inconsistent with the length direction of the optical module 200. For example, opening 203 is located at the end of the optical module 200 (the right end in Figure 3), and opening 204 is also located at the end of the optical module 200 (the left end in Figure 3). Alternatively, opening 203 is located at the end of the optical module 200, while opening 204 is located on the side of the optical module 200. Opening 203 is an electrical port, from which the gold finger of the circuit board 300 extends and is inserted into the host computer 100 (for example, an optical network terminal); opening 204 is an optical port, configured to connect to the optical fiber 101, so that the optical fiber 101 can connect to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0053] The combined assembly of the upper housing 201 and the lower housing 202 facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the housing, with the upper housing 201 and the lower housing 202 providing encapsulation and protection for these components. Furthermore, during the assembly of the circuit board 300, the light emitting component 400, and the light receiving component 500, the positioning components, heat dissipation components, and electromagnetic shielding components of these components are easily arranged, facilitating automated production.

[0054] In some embodiments, the upper shell 201 and the lower shell 202 are generally made of metal materials, which are conducive to electromagnetic shielding and heat dissipation.

[0055] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0056] Exemplarily, the unlocking component 600 is located on the outside of the two lower side panels 2022 of the lower housing 202 and includes a snap-fit ​​component that mates with the cage 106 of the host computer 100. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 secures the optical module 200 in the cage 106. When the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection between the snap-fit ​​component and the host computer, thereby releasing the optical module 200 from the cage 106 and allowing the optical module 200 to be removed from the cage 106.

[0057] The circuit board 300 includes circuit traces, electronic components, and chips. The electronic components and chips are connected according to the circuit design through the circuit traces to achieve functions such as power supply, electrical signal transmission, and grounding. Electronic components may include, for example, capacitors, resistors, transistors, and metal-oxide-semiconductor field-effect transistors (MOSFETs). Chips may include, for example, a microcontroller unit (MCU), a laser driver chip, a transimpedance amplifier (TIA), a limiting amplifier (LIA), a clock and data recovery chip (CDR), a power management chip, and a digital signal processing (DSP) chip. Exemplarily, a driver 310 is provided on the circuit board 300. The driver 310 outputs a modulation signal to drive the light emitting component 400, causing the light emitting component 400 to generate an emitted light signal. In some embodiments, the driver 310 includes a first output terminal and a second output terminal. The driver 310 outputs a first modulated signal through the first output terminal, and the driver 310 outputs a second modulated signal through the second output terminal. Exemplarily, the first modulated signal and the second modulated signal are differential signals, i.e., the first modulated signal and the second modulated signal have the same amplitude and opposite phase; or the first modulated signal and the second modulated signal are identical.

[0058] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board can also be inserted into the electrical connector in the cage 106 of the host computer 100.

[0059] The circuit board 300 also includes a gold finger formed on the surface of its end, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be set only on the surface of one side of the circuit board 300 (for example, the upper surface shown in Figure 4), or it can be set on the upper and lower surfaces of the circuit board 300 to provide a larger number of pins, thereby adapting to occasions where a large number of pins are required. The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, two-wire synchronous serial (Inter-Integrated Circuit, I2C) signal transmission, data signal transmission, etc. Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0060] At least one of the light emitting component 400 or the light receiving component 500 is located on a side of the circuit board 300 away from the gold finger.

[0061] In some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300 and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors.

[0062] In some embodiments, at least one of the light emitting component or the light receiving component may be directly disposed on the circuit board 300. For example, at least one of the light emitting component or the light receiving component may be disposed on a surface of the circuit board 300 or a side of the circuit board 300.

[0063] In some embodiments, the optical emitting component 400 is configured to transmit an optical signal, and the optical receiving component 500 is configured to receive an optical signal. Exemplarily, the optical emitting component 400 and the optical receiving component 500 are combined to form an integrated optical transceiver component, i.e., the optical emitting component 400 and the optical receiving component 500 are combined together via an optical receiving component 800. Of course, in some embodiments of the present disclosure, the optical emitting component 400 and the optical receiving component 500 are separate, i.e., the optical emitting component 400 and the optical receiving component 500 are not combined together via the optical receiving component 800.

[0064] FIG5 is a schematic diagram of the internal structure of an optical module provided according to some embodiments of the present disclosure. As shown in FIG5 , in some embodiments, the optical module 200 further includes an optical accommodating component 800, the optical accommodating component 800 is connected to the optical emitting component 400 or the optical receiving component 500, and the interior of the optical accommodating component 800 forms an accommodating cavity, and the optical accommodating component 800 accommodates optical devices through the accommodating cavity, such as filters, reflectors, etc., and the optical devices are configured to adjust the transmission direction of the optical signal. FIG4 and FIG5 show a coaxially packaged optical module, wherein the optical emitting component 400 or the optical receiving component 500 adopts a coaxial packaging structure, but the optical emitting component 400 or the optical receiving component 500 in the embodiments of the present disclosure are not limited to the coaxial packaging structure.

[0065] In some embodiments, one end of the optical receiving component 800 is connected to the fiber optic adapter 700, the other end of the optical receiving component 800 is connected to the light emitting component 400, and the side of the optical receiving component 800 is connected to the light receiving component 500. By packaging the light emitting component 400 and the light receiving component 500 together through the optical receiving component 800, the total volume of the optical module required to accommodate the light emitting component 400 and the light receiving component 500 is controlled, thereby saving space within the optical module. Of course, in some embodiments, the optical receiving component 800 may only contain the light emitting component 400.

[0066] In some embodiments, the fiber optic adapter 700 is configured to connect to the optical fiber 101. The optical signal generated by the optical transmitting component 400 is transmitted to the optical receiving component 800, then to the fiber optic adapter 700, and then to the optical fiber 101. The optical signal input to the optical module 200 via the optical fiber 101 is then transmitted to the optical receiving component 800 via the fiber optic adapter 700, and then to the optical receiving component 500.

[0067] FIG6 is a schematic diagram of the structure of an optical emitting component provided according to some embodiments of the present disclosure, and FIG7 is a schematic diagram of a partial structure of an optical emitting component provided according to some embodiments of the present disclosure. FIG6 and FIG7 illustrate a coaxially packaged optical emitting component. As shown in FIG6 and FIG7, in some embodiments, the optical emitting component 400 includes a tube base 410 and a tube cap 420. The tube cap 420 is mounted on the tube base 410 and is fixedly connected to the tube base 410 to form a receiving cavity. A laser assembly 430 is disposed in the receiving cavity; the laser assembly 430 is disposed on the top surface of the tube base 410 and is configured to generate an optical signal. A semiconductor electric cooler (TEC), a thermistor, or a base, etc. may also be disposed in the receiving cavity.

[0068] In some embodiments, as shown in FIG7 , a TEC 440, a base 450, and a thermistor 460 are further mounted on the tube base 410. The laser assembly 430 is mounted on the base 450, the thermistor 460 is mounted on the base 450, and the base 450 is mounted on the TEC 440. Of course, in the disclosed embodiments, the assembly of components on the tube base 410 is not limited to this. The laser assembly 430 can also be mounted directly on the TEC 440.

[0069] In the disclosed embodiment, the laser assembly 430 is electrically connected to the first output terminal and the second output terminal of the driver 310, respectively, so that the laser assembly 430 performs two unidirectional modulations according to the first modulation signal and the second modulation signal in the process of generating the transmitted light signal. Furthermore, in the two unidirectional modulations to generate the transmitted light signal, the optical power modulations of the optical signal corresponding to the bit signal are superimposed, so that the positions with high optical power in the optical signal are higher and the positions with low optical power are lower. This makes the difference in optical power in the transmitted light signal output by the laser assembly more obvious, thereby increasing the extinction ratio of the laser assembly. Specifically, the first modulation generates a certain extinction ratio, and the second modulation further increases the extinction ratio based on the extinction ratio generated by the first modulation. That is, the extinction ratios generated by the two modulations are superimposed, thereby improving the extinction ratio of the laser assembly 430.

[0070] Figure 8 is a schematic diagram illustrating the connection principle of a laser assembly and a driver according to some embodiments of the present disclosure. The schematic structure of a laser assembly is shown in Figure 8. As shown in Figure 8, laser assembly 430 includes a first modulation unit 430a and a second modulation unit 430b. The first modulation unit 430a is connected to the first output terminal of driver 310 via a first path, and the second modulation unit 430b is connected to the second output terminal of driver 310 via a second path.

[0071] In some embodiments, the modulation properties of the first modulation unit 430a and the modulation properties of the second modulation unit 430b are different, or the modulation properties of the first modulation unit 430a and the modulation properties of the second modulation unit 430b are the same. The modulation property refers to the modulation state of the optical signal by the modulation unit in a high-level or low-level state. For example: a high-level bit signal modulates to produce an optical signal with high optical power; a low-level bit signal modulates to produce an optical signal with low optical power (the above modulation property is recorded as the first modulation property); or, a high-level bit signal modulates to produce an optical signal with low optical power, and a low-level bit signal modulates to produce an optical signal with high optical power (the above modulation property is recorded as the second modulation property). When the modulation properties of the first modulation unit 430a and the second modulation unit 430b are different, the modulation property of the first modulation unit 430a is the first modulation property, and the modulation property of the second modulation unit 430b is the second modulation property; or, the modulation property of the first modulation unit 430a is the second modulation property, and the modulation property of the second modulation unit 430b is the first modulation property.

[0072] For example, taking the case where the modulation attribute of the first modulation unit 430a is the first modulation attribute and the modulation attribute of the second modulation unit 430b is the second modulation attribute, the first modulation unit 430a performs modulation based on a high-level bit signal to generate a high-power optical signal, while the second modulation unit 430b performs modulation based on a high-level bit signal to generate a low-power optical signal. Therefore, the first modulation attribute and the second modulation attribute produce opposite responses to bit signals of the same level attribute. Therefore, when the modulation attributes of the first modulation unit 430a and the second modulation unit 430b are different, the modulation attributes of the two modulation units can also be considered to be opposite.

[0073] In some embodiments, when the first modulation signal and the second modulation signal are differential signals, if the modulation properties of the first modulation unit 430a and the modulation properties of the second modulation unit 430b are the same, a phase reversal circuit is provided on the first path or the second path to achieve two co-directional modulations. In some embodiments, when the first modulation signal and the second modulation signal are the same, if the modulation properties of the first modulation unit 430a and the modulation properties of the second modulation unit 430b are different, a phase reversal circuit is provided on the first path or the second path to achieve two co-directional modulations. The phase reversal circuit is configured to invert the phase of the first modulation signal or the second modulation signal so that the phase-inverted modulation signal has the same phase as the phase-uninverted modulation signal, thereby achieving two co-directional modulations by the first modulation unit 430a and the second modulation unit 430b in the process of generating the transmitted optical signal.

[0074] In other embodiments, when the first modulation signal and the second modulation signal are differential signals, if the modulation properties of the first modulation unit 430a and the modulation properties of the second modulation unit 430b are different, the two modulations are co-directional modulation, and no phase inversion circuit is required to achieve co-directional modulation. Alternatively, when the first modulation signal and the second modulation signal are the same, if the modulation properties of the first modulation unit 430a and the modulation properties of the second modulation unit 430b are the same, the two modulations are co-directional modulation, and no phase inversion circuit is required to achieve co-directional modulation.

[0075] Exemplarily, the first modulation unit 430a is a distributed feedback laser (LD) or an electro-absorption modulator (EAM), and the second modulation unit 430b is an EAM or a semiconductor optical amplifier (SOA). The modulation property of the LD is the first modulation property, the EAM is the second modulation property, and the SOA is the first modulation property. Exemplarily, when the first modulation unit 430a is an LD and the second modulation unit 430b is an EAM, the modulation property of the first modulation unit 430a and the modulation property of the second modulation unit 430b are different; when the first modulation unit 430a is an EAM and the second modulation unit 430b is an SOA, the modulation property of the first modulation unit 430a and the modulation property of the second modulation unit 430b are different; when the first modulation unit 430a is an EAM and the second modulation unit 430b is an EAM, the modulation property of the first modulation unit 430a and the modulation property of the second modulation unit 430b are the same.

[0076] The following is a detailed description based on the specific structure of the laser assembly.

[0077] Figure 9 is a schematic diagram of the structure of a laser assembly provided according to some embodiments of the present disclosure. As shown in Figure 9, laser assembly 430 includes an EML and an SOA. The SOA is located at the output end of the EML and is configured to increase the intensity of the optical signal output by the EML. The EML includes an EAM and a LD. The LD emits direct current light, and the EAM modulates the DC light emitted by the LD through electrical absorption to obtain an optical signal. In some embodiments, laser assembly 430, including EML and SOA, is configured to meet link budget requirements where the optical power emitted by the EML alone cannot meet the link budget. For example, for a 50G PON (Passive Optical Network) OLT (Optical Line Terminal), in order to reuse the existing optical distribution network (ODN) and achieve a link budget comparable to that of a 10G PON, the increased downlink receiver rate will reduce sensitivity. To compensate for the link budget, the output power of the transmitting laser must be increased. Therefore, laser assembly 430, including EML and SOA, is used.

[0078] Figure 10 is a circuit diagram of a laser assembly according to some embodiments of the present disclosure. As shown in Figure 10, laser assembly 430 includes LD 431, EAM 432, and SOA 433. A bias current is input to the positive terminal of LD 431, which is configured to cause LD 431 to generate DC light. Exemplarily, the positive terminal of LD 431 is connected to a power management chip, which supplies the bias current to LD 431. EAM 432 is located at the optical output terminal of LD 431. Driver 310 drives the positive terminal of EAM 432 to input a modulation signal to EAM 432, causing EAM 432 to modulate the light emitted by LD 431, thereby causing the EML to output an optical signal. SOA 433 is located at the optical signal output terminal of EAM 432. A bias current is input to the positive terminal of SOA 433, which is configured to cause SOA 433 to amplify the optical signal output by the EML. Exemplarily, the positive terminal of SOA 433 is connected to the power management chip, which supplies the bias current to SOA 433. In some embodiments, to ensure the bandwidth of laser assembly 430, the positions of EAM 432 and SOA 433 cannot be interchanged. It should be noted that the embodiments of the present disclosure only use the laser assembly 430 configured as a light emitting component 400 in a coaxial package structure as an example. The laser assembly 430 provided in the embodiments of the present disclosure is not limited to a light emitting component 400 in a coaxial package. The laser assembly 430 can also be configured as a light emitting component 400 in a micro-optical package structure.

[0079] In some embodiments, the driver 310 is a driver with differential input and differential output. The driver 310 receives a differential signal input by the gold finger of the optical module, which is processed by a DSP chip or a CDR chip and then transmitted to the driver 310; the same-direction output end of the driver 310 is connected to the positive pole of the EAM432. In order to avoid reflection of the signal line and to avoid ringing that affects the operation of the EAM432, the reverse output end of the driver 310 is terminated by a capacitor and a resistor. Exemplarily, the reverse output end of the driver 310 is connected to the first capacitor 320 and the resistor 330 in sequence, one end of the first capacitor 320 is connected to the reverse output end of the driver 310, the other end of the first capacitor 320 is connected to one end of the resistor 330, and the other end of the resistor 330 is grounded.

[0080] In some embodiments, a second capacitor 340 is disposed between the non-inverting output of the driver 310 and the positive electrode of the EAM 432. One end of the second capacitor 340 is connected to the non-inverting output of the driver 310, and the other end of the second capacitor 340 is connected to the positive electrode of the EAM 432. In some embodiments, the driver 310 outputs a modulated signal, which is loaded onto the positive electrode of the EAM 432 via the non-inverting output of the driver 310 via AC coupling, thereby modulating the electrical signal onto an optical carrier. The SOA 433 amplifies the optical signal modulated by the EAM 432. The optical power emitted by the LD 431 is modulated by the EAM 432, thereby converting the electrical signal into an optical signal. For example, the driver 310 is a 50G driver, and the LD 431 and EAM 432 form a 50G EML. However, in the disclosed embodiments, the EML formed by the LD 431 and EAM 432 is not limited to 50G and can also be 10G, 100G, etc.

[0081] In some embodiments, driver 310 utilizes a complementary metal oxide semiconductor (CMOS) process and is integrated into a DSP chip. However, the disclosed embodiments are not limited to driver 310 being integrated into a DSP chip; driver 310 can also be a separate driver chip. The output signal amplitude of driver 310 using CMOS technology is limited and cannot be very high, typically only 1.5V. This is sufficient to meet the extinction ratio ≥ 3.5dB requirement for optical modules in the data communications field. In the PON field, the laser assembly 430 requires an ER ≥ 7dB. To achieve this ER ≥ 7dB, the drive signal amplitude output by driver 310 must be increased to at least 2V, which is difficult to achieve using current CMOS technology. Alternatively, SiGe technology can be used, but SiGe and CMOS processes are difficult to integrate, and thus driver 310 cannot be integrated into a CMOS DSP chip. Consequently, the optical module would require the driver 310 and the DSP chip to be two separate chips, complicating the circuit design.

[0082] Figure 11 is a circuit diagram of another laser assembly provided according to some embodiments of the present disclosure. As shown in Figure 11, in some embodiments, laser assembly 430 includes LD 431, EAM 432, and SOA 433. A bias current is input to the positive terminal of LD 431 to cause LD 431 to emit light. A first modulation unit 430a includes EAM 432, and a second modulation unit 430b includes SOA 433. The modulation properties of EAM 432 differ from those of SOA 433, and the first modulation signal and the second modulation signal are differential signals. EAM 432 is located at the optical output terminal of LD 431. The first output terminal of driver 310 is connected to the positive terminal of EAM 432 via a first path to input a first modulation signal to EAM 432. EAM 432 performs a first modulation on the DC light emitted by LD 431 according to the first modulation signal, generating a first optical signal, thereby causing the EML to output an optical signal. SOA433 is located at the optical signal output end of EAM432. A bias current is input to the positive terminal of SOA433, and the positive terminal of SOA433 is also connected to the second output terminal of driver 310 via a second path, causing SOA433 to perform a second modulation on the first optical signal according to the second modulation signal and amplify the second modulated optical signal. Therefore, the EAM432 modulation of the light emitted by LD431, combined with the SOA433's further modulation of the optical signal, superimposes the optical power modulation of the optical signal corresponding to the bit signal. This increases the optical power at locations with higher optical power and lower optical power at locations with lower optical power, thereby making the optical power difference in the transmitted optical signal output by the laser assembly more pronounced, thereby increasing the extinction ratio of the laser assembly.

[0083] In some embodiments, the first output terminal of the driver 310 is the same-direction output terminal of the driver 310, and the second output terminal of the driver 310 is the opposite-direction output terminal. Of course, in the embodiment of the present disclosure, the first output terminal of the driver 310 can also be the opposite-direction output terminal of the driver 310, and the second output terminal of the driver 310 can also be the same-direction output terminal of the driver 310. Exemplarily, the same-direction output terminal of the driver 310 is connected to the positive electrode of the EAM 432, and the opposite-direction output terminal of the driver 310 is connected to the positive electrode of the SOA 433. In some examples, the positive electrode of the SOA 433 is connected to a power management chip, and a bias current is input to the SOA 433 through the power management chip. The opposite-direction output terminal of the driver 310 is connected between the positive electrode of the SOA 433 and the power management chip.

[0084] FIG12 is a schematic diagram of the signal modulation principle of the laser assembly in FIG11 , and FIG12 illustrates the effect of an EAM432 performing first modulation according to a first modulation signal and an SOA433 performing second modulation according to a second modulation signal. As shown in FIG12 , in the disclosed embodiment, the optical signal modulated by the EAM432 is modulated again by the SOA433, so that the DC light generated by the LD431 undergoes two modulations. The two modulations superimpose the optical power modulations corresponding to the optical signal (e.g., F) so that the positions with high optical power in the optical signal are higher and the positions with low optical power are lower, thereby making the difference in optical power in the transmitted optical signal output by the laser assembly more obvious. During the process of transmitting the optical signal from the optical module, the extinction ratio of the transmitted optical signal is positively correlated with the amplitude of the modulation signal loaded on the EAM432. The amplitude of the electrical signal output by the driver 310 is limited, and the characteristics of the EAM432 will also saturate. After the DC light generated by the LD431 is modulated once by the EAM432, the extinction ratio of the laser assembly will not be able to increase further after reaching a certain index. Therefore, in the embodiment of the present disclosure, the DC light generated by LD431 is modulated in the same direction by EAM432 and SOA433 in sequence, so that the two modulations superimpose the extinction ratio of the laser component, and thus the extinction ratio of the laser component 430 is further improved on the basis of only one modulation by EAM432.

[0085] In some embodiments, the two co-directional modulations by the EAM 432 and the SOA 433 refer to the time taken for the bit signals outputted from the first output terminal and the second output terminal of the driver 310 to be transmitted to the EAM 432 and modulated by the EAM 432 to generate an optical signal and then transmitted to the SOA 433, and the time taken for the other bit signal to be transmitted to the SOA 433 is the same, so that the bits are aligned during the two modulation processes.

[0086] The EAM432 is a negative voltage device. For a 1 level, its operating voltage is negative and close to 0V; for a 0 level, its operating voltage is negative and far from 0V. For the SOA433, the electrical signal output by the driver 310 is a voltage-type signal, with a high amplitude for a 1 level and a low amplitude for a 0 level. Applying a high voltage to the SOA433 further increases the optical signal power corresponding to a 1 level, while applying a low voltage to the SOA433 further decreases the optical signal power corresponding to a 0 level. The EAM432 and SOA433 then modulate the optical signal twice in the same direction, superimposing the extinction ratios generated by the two modulations to improve the extinction ratio of the transmitted optical signal.

[0087] In some embodiments, to ensure bit alignment, the optical signal generated by the primary modulation of the electrical signal output from the first output terminal through EAM 432 arrives at SOA 433 at the same time as the electrical signal output from the second output terminal arrives at SOA 433. In some embodiments, the second path is slightly longer than the first path so that the difference between the first and second paths compensates for the time it takes for the primary modulated optical signal to travel from EAM 432 to SOA 433.

[0088] Exemplarily, driver 310 includes a first output terminal A and a second output terminal E, a positive terminal position B for EAM 432, a positive terminal position D for SOA 433, and a distance C between EAM 432 and SOA 433 in laser assembly 430. The length AB + C is equal to ED. This ensures bit alignment between the electrical signal received by the positive terminal of EAM 432 and the electrical signal received by SOA 433, ensuring signal transmission quality. In some embodiments, the wiring length of the signal line on circuit board 300 is controlled so that the length AB + C is equal to ED.

[0089] FIG13 is a circuit diagram of another laser assembly provided according to some embodiments of the present disclosure. As shown in FIG13 , the laser assembly 430 includes an LD 431, an EAM 432, and an SOA 433. The first output terminal of the driver 310 is connected to the EAM 432 via a first path, and the second output terminal of the driver 310 is connected to the SOA 433 via a second path. The first modulation signal and the second modulation signal output by the driver 310 are identical signals, and a phase inversion circuit is provided on the first path. The phase inversion circuit is configured to invert the phase of the first modulation signal. The EAM 432 performs a first modulation on the DC light output by the LD 431 according to the phase-inverted first modulation signal to generate a first optical signal. Exemplarily, the phase inversion circuit inverts the limit of the first modulation signal by 180 degrees.

[0090] Figure 14 shows the signal modulation principle of the laser assembly in Figure 13. Figure 14 illustrates an alternative method of performing first modulation by an EAM 432 based on a first modulation signal and second modulation by an SOA 433 based on a second modulation signal. As shown in Figure 14, the EAM 432 performs first modulation on the DC light output by the LD 431 based on the phase-inverted first modulation signal, generating a first optical signal. The SOA 433 then performs second modulation on the first optical signal. These two modulations combine to modulate the optical power of the optical signal corresponding to the bit signal, increasing the optical power at higher locations and lower locations within the optical signal. This further enhances the difference in optical power within the transmitted optical signal output by the laser assembly. During the first modulation, the laser assembly 430 generates a certain extinction ratio. The second modulation further increases the extinction ratio generated by the first modulation. The combined extinction ratios of the two modulations further enhance the extinction ratio of the laser assembly 430.

[0091] Of course, in the disclosed embodiments, the phase inversion circuit is not limited to being provided on the first path; a phase inversion circuit can also be provided on the second path. When provided on the second path, the phase inversion circuit inverts the phase of the second modulation signal, and SOA 433 performs a second modulation on the first optical signal modulated by EAM 432 based on the phase-inverted second modulation signal. For details on the specific implementation of driver 310 driving EAM 432 and SOA 433 in the disclosed embodiments, please refer to the specific implementation of laser assembly 430 illustrated in the embodiment of FIG. 11 .

[0092] Figure 15 is a circuit diagram for using a fourth laser assembly according to some embodiments of the present disclosure. As shown in Figure 15 , laser assembly 430 includes LD 431 and EAM 432, with EAM 432 located at the optical output end of LD 431. A first modulation unit 430a includes LD 431, and a second modulation unit 430b includes EAM 432. The modulation properties of LD 431 differ from the modulation properties of EAM 432. The first output of driver 310 is connected to the positive electrode of LD 431 via a first path, and the second output of driver 310 is connected to the positive electrode of EAM 432 via a second path.

[0093] In some embodiments, when the first modulation signal and the second modulation signal output by the driver 310 are differential signals, the LD 431 generates a first optical signal by direct modulation (first modulation) according to the first modulation signal; and the EAM 432 performs a second modulation on the first optical signal according to the second modulation signal.

[0094] In some embodiments, when the first modulation signal and the second modulation signal output by the driver 310 are the same, a phase inversion circuit is provided on the first path or the second path. Exemplarily, a phase inversion circuit is provided on the first path to invert the phase of the first modulation signal; LD 431 directly modulates the first optical signal based on the phase-inverted first modulation signal, and EAM 432 performs a second modulation on the first optical signal based on the second modulation signal. Alternatively, a phase inversion circuit is provided on the second path to invert the phase of the second modulation signal; and EAM 432 performs a second modulation on the first optical signal based on the phase-inverted second modulation signal.

[0095] In the disclosed embodiment, the first modulation performed by LD 431 and the second modulation performed by EAM 432 cause laser assembly 430 to undergo two modulations during the process of generating a transmitted optical signal. This allows the optical power modulations corresponding to the bit signal to be superimposed, thereby increasing the positions of high optical power in the optical signal to be higher and the positions of low optical power to be lower, thereby making the difference in optical power in the transmitted optical signal output by laser assembly 430 more pronounced. During the first modulation, laser assembly 430 generates a certain extinction ratio. The second modulation further increases the extinction ratio generated by the first modulation, thereby superimposing the extinction ratios generated by the two modulations, thereby improving the extinction ratio of laser assembly 430.

[0096] The SOA433 is set at the output end of the EAM432, and the positive input bias current of the SOA433 causes the SOA433 to amplify the optical power of the optical signal modulated by the EAM432.

[0097] In the disclosed embodiment, the details of driving the LD 431 and the EAM 432 to perform two co-directional modulations by the driver 310 can be seen in the specific implementation process of the laser assembly 430 shown in the embodiment of FIG. 11 .

[0098] FIG16 is a circuit diagram for use of a fifth laser assembly according to some embodiments of the present disclosure. As shown in FIG16 , laser assembly 430 includes LD 431, a first EAM 434, and a second EAM 435. First modulation unit 430a includes first EAM 434, and second modulation unit 430b includes second EAM 435. The modulation properties of first EAM 434 are the same as the modulation properties of second EAM 435. A bias current is input to the positive electrode of LD 431 to cause LD 431 to emit light. The first output terminal of driver 310 is connected to the positive electrode of first EAM 434 via a first path, and the second output terminal of driver 310 is connected to the positive electrode of second EAM 435 via a second path.

[0099] In some embodiments, when the first modulation signal and the second modulation signal output by the driver 310 are differential signals, a phase inversion circuit is provided on the first path or the second path. Exemplarily, a phase inversion circuit is provided on the first path to invert the phase of the first modulation signal; the first EAM 434 performs a first modulation on the DC light output by the LD 431 according to the phase-inverted first modulation signal to generate a first optical signal; and the second EAM 435 performs a second modulation on the first optical signal according to the second modulation signal. Alternatively, a phase inversion circuit is provided on the second path to invert the phase of the second modulation signal; the first EAM 434 performs a first modulation on the DC light output by the LD 431 according to the first modulation signal to generate a first optical signal; and the second EAM 435 performs a second modulation on the first optical signal according to the phase-inverted second modulation signal.

[0100] When the first modulation signal and the second modulation signal output by the driver 310 are the same, the first EAM 434 performs a first modulation on the DC light output by the LD 431 according to the first modulation signal to generate a first optical signal; the second EAM 435 performs a second modulation on the first optical signal according to the second modulation signal.

[0101] In the disclosed embodiment, the first modulation performed by the first EAM 434 and the second modulation performed by the second EAM 435 cause the laser assembly 430 to undergo two modulations during the generation of the transmitted optical signal. This results in the optical power modulations of the optical signal corresponding to the bit signal being superimposed, thereby increasing the optical power at locations higher in the optical signal and lowering the optical power at locations lower in the signal. This further enhances the difference in optical power within the transmitted optical signal output by the laser assembly 430. During the first modulation, the laser assembly 430 generates a certain extinction ratio. The second modulation further increases the extinction ratio generated by the first modulation, resulting in the superposition of the extinction ratios generated by the two modulations, thereby improving the extinction ratio of the laser assembly 430.

[0102] The output end of the second EAM 435 is provided with an SOA 433 , and a positive electrode of the SOA 433 inputs a bias current, so that the SOA 433 amplifies the optical power of the optical signal modulated by the EAM 432 .

[0103] In the disclosed embodiment, for details of driving the first EAM 434 and the second EAM 435 to perform two co-directional modulations by the driver 310 , reference may be made to the specific implementation process of the laser assembly 430 shown in the embodiment of FIG. 11 .

[0104] In some embodiments, the phase inversion circuit is disposed on the circuit board 300, and the phase inversion circuit includes a phase inverter, which is disposed on the circuit board 300 and electrically connected to the circuit board 300. Exemplarily, the phase inverter is a NOT gate.

[0105] In some embodiments, the laser assembly 430 includes three modulation units. By providing three modulation signals, three modulations are performed during the process of the laser assembly generating the transmitted optical signal. This allows the optical power modulation of the optical signal corresponding to the bit signal to be superimposed, so that the locations with high optical power in the optical signal are higher and the locations with low optical power are lower. This further makes the difference in optical power in the transmitted optical signal output by the laser assembly more obvious, thereby increasing the extinction ratio of the laser assembly. For example, the three modulation signals are output through the driver 310, or through two drivers.

[0106] Figure 17 is an exploded schematic diagram of Figure 16. As shown in Figure 17, the light emitting component 400 adopts a micro-optical packaging structure and includes a light emitting cavity 470. The light emitting cavity 470 is configured to accommodate a laser assembly 430. The laser assembly 430 is the laser assembly provided in the above embodiment.

[0107] In some embodiments, the optical receiving component 500 includes three optical receiving assemblies, each of which is a coaxially packaged optical receiving assembly. The three optical receiving assemblies are configured to enable the optical receiving component 500 to receive optical signals of three wavelengths, i.e., each optical receiving assembly is configured to receive optical signals of one wavelength. Exemplarily, the optical receiving component 500 includes a first optical receiving assembly 510, a second optical receiving assembly 520, and a third optical receiving assembly 530; the first optical receiving assembly 510, the second optical receiving assembly 520, and the third optical receiving assembly 530 are sequentially disposed on the sides of the optical receiving component 800.

[0108] In some embodiments, light emitting cavity 470 includes not only laser assembly 430 but also laser assemblies of other structural forms. Exemplarily, light emitting cavity 470 also includes a first laser assembly and a second laser assembly. Laser assembly 430, the first laser assembly, and the second laser assembly are configured to enable light emitting component 400 to generate three different wavelengths of transmitted optical signals.

[0109] In some embodiments, filters, reflectors, wavelength division multiplexing components, etc. are provided in the optical accommodation component 800 to realize the combination of three wavelengths of transmitted optical signals and the splitting of three wavelengths of received optical signals.

[0110] FIG18 is an exploded view of a light emitting component provided according to some embodiments of the present disclosure. As shown in FIG18 , the light emitting cavity 470 includes a housing 471 and an upper cover 472. The housing 471 forms an inner cavity, and the upper cover 472 covers and connects to the housing 471, forming a relatively sealed housing cavity. An electrical connector 350 is provided at one end of the light emitting cavity 470 away from the optical housing 800. The electrical connector 350 is embedded in the end of the light emitting cavity 470, so that one end of the electrical connector 350 extends into the light emitting cavity 470 and the other end is located outside the light emitting cavity 470.

[0111] The laser assembly 430 , the first laser assembly 481 and the second laser assembly 482 are disposed in the inner cavity of the housing 471 . The laser assembly 430 , the first laser assembly 481 and the second laser assembly 482 are disposed on the side of one end of the electrical connector 350 .

[0112] A wavelength division multiplexer 490 is also disposed within the inner cavity of the housing 471. The wavelength division multiplexer 490 is configured to combine the optical signals generated by the laser assembly 430, the first laser assembly 481, and the second laser assembly 482. In some embodiments, lenses are disposed in the optical paths between the laser assembly 430, the first laser assembly 481, the second laser assembly 482, and the wavelength division multiplexer 490. The corresponding lenses collimate and converge the transmitted optical signals generated by the laser assembly 430, the first laser assembly 481, and the second laser assembly 482.

[0113] In some embodiments, the first laser assembly 481 is located between the laser assembly 430 and the second laser assembly 482, and the light emitting directions of the laser assembly 430, the first laser assembly 481, and the second laser assembly 482 are toward the wavelength division multiplexer 490. In some embodiments, the laser assembly 430 emits a first wavelength optical signal, the first laser assembly 481 emits a second wavelength optical signal, and the second laser assembly 482 emits a third wavelength optical signal, and the optical axes of the first wavelength optical signal, the second wavelength optical signal, and the third wavelength optical signal are parallel to the longitudinal extension direction of the second housing. Exemplarily, the wavelength range of the first wavelength optical signal is 1340-1344nm, such as the wavelength of the first wavelength optical signal is 1342nm; the wavelength range of the second wavelength optical signal is 1480-1500nm, such as the wavelength of the second wavelength optical signal is 1490nm; and the wavelength range of the third wavelength optical signal is 1575-1580nm, such as the wavelength of the third wavelength optical signal is 1577nm.

[0114] In some embodiments, the transmission rate of the laser assembly 430 is greater than the transmission rate of the second laser assembly 482, and the transmission rate of the second laser assembly 482 is greater than the transmission rate of the first laser assembly 481. For example, the transmission rate of the laser assembly 430 is 50G, the transmission rate of the first laser assembly 481 is 2.5G, and the transmission rate of the second laser assembly 482 is 10G.

[0115] In some embodiments, the light-emitting end faces of the laser assembly 430 , the first laser assembly 481 , and the second laser assembly 482 are not flush, that is, the light-emitting end faces of the laser assembly 430 , the first laser assembly 481 , and the second laser assembly 482 are located on different length surfaces of the housing 471 .

[0116] In some embodiments, TEC 460 is disposed in the inner cavity of housing 471 and below laser assembly 430 , first laser assembly 481 , and second laser assembly 482 . TEC 460 is configured to adjust the temperature of laser assembly 430 , first laser assembly 481 , and second laser assembly 482 .

[0117] In some embodiments, the top of the TEC 460 is fixedly connected to the base 450 , and the laser assembly 430 , the first laser assembly 481 , and the second laser assembly 482 are disposed on the base 450 .

[0118] Figure 19 is a schematic diagram of a partial structure of a light emitting component provided according to some embodiments of the present disclosure. In some embodiments, as shown in Figure 19, the left end of the electrical connector 350 is formed with multiple extensions, with spaces between the extensions, so that the left end of the electrical connector 350 forms multiple side surfaces. These multiple side surfaces are configured to coordinate with the sides of the laser assembly 430, the first laser assembly 481, and the second laser assembly 482, increasing the proximity area between the electrical connector 350 and the laser assembly 430, the first laser assembly 481, and the second laser assembly 482, so that the left end of the electrical connector 350 surrounds the laser assembly 430, the first laser assembly 481, and the second laser assembly 482. Multiple solder pads are provided on the top edge of the left end of the electrical connector 350. The solder pads are distributed along the edge of the left side of the electrical connector 350 to facilitate wire bonding between the laser assembly 430, the first laser assembly 481, and the second laser assembly 482. For example, three sides of laser assembly 430 are positioned adjacent to three side surfaces of the left end of electrical connector 350, so that the left end of electrical connector 350 is semi-enclosed by the side of laser assembly 430. One side of first laser assembly 481 is positioned adjacent to one side surface of the left end of electrical connector 350. Two sides of second laser assembly 482 are positioned adjacent to two side surfaces of the left end of electrical connector 350. In some embodiments, electrical connector 350 is a special-shaped circuit board. Of course, in the embodiments of the present disclosure, electrical connector 350 may also be a ceramic substrate.

[0119] Figure 20 is a partially exploded schematic diagram of an optical emitting component provided according to some embodiments of the present disclosure, and Figure 21 is a schematic structural diagram of an electrical connector provided according to some embodiments of the present disclosure. As shown in Figures 20 and 21, an electrical connector 350 includes an electrical connector body 351, and a first extension portion 352 and a second extension portion 353 located at one end of the electrical connector body 351. The first extension portion 352 is located at an edge of the electrical connector 350, and the second extension portion 353 is located in the middle of the electrical connector 350. A second gap 354 is formed between the first extension portion 352 and the second extension portion 353. One end of the electrical connector body 351 is formed with a first side 355, a second side 356, a third side 357, a fourth side 3531, a fifth side 358 and a sixth side 359; the first side 355 is located at the edge of the first extension portion 352 close to the second gap 354, the second side 356 is located at the bottom of the second gap 354, the third side 357, the fourth side 3531 and the fifth side 358 are located at the edge of the second extension portion 353, the sixth side 359 is located on the side of the second extension portion 353 away from the first extension portion 352, and the sixth side 359 is connected to the fifth side 358.

[0120] The first side surface 355, the second side surface 356, and the third side surface 357 surround the sides of the laser assembly 430, so that the three sides of the laser assembly 430 are correspondingly close to the first side surface 355, the second side surface 356, and the third side surface 357. The fourth side surface 3531 is located on the side of the first laser assembly 481, so that one side of the first laser assembly 481 is close to the fourth side surface 3531. The fifth side surface 358 and the sixth side surface 359 surround the sides of the second laser assembly 482, so that two sides of the second laser assembly 482 are correspondingly close to the fifth side surface 358 and the sixth side surface 359.

[0121] A plurality of solder pads are provided along the edge of the top surface of the electrical connector 350, which is connected to the first side 355, the second side 356, the third side 357, the fourth side 3531, the fifth side 358, and the sixth side 359. The laser assembly 430, the first laser assembly 481, and the second laser assembly 482 respectively bond wires to some of the solder pads along the top surface edge of the electrical connector 350. The remaining solder pads are configured for mounting electrical components, such as backlight detectors, resistors, capacitors, and the like.

[0122] Figure 22 is a schematic diagram of the structure of a base provided according to some embodiments of the present disclosure. As shown in Figure 22, base 450 includes a base body 451. A first spacer 454 is provided on one side of base body 451. A first boss 452 is provided on one side of first spacer 454 and at the top of base body 451. A second boss 453 is provided on the other side of first spacer 454 and at the top of base body 451. The heights of first boss 452 and second boss 453 are higher than the top surface of base body 451. In some embodiments, first boss 452 and second boss 453 have different heights.

[0123] FIG23 illustrates a base in use according to some embodiments of the present disclosure. As shown in FIG23 , laser assembly 430 is positioned on first boss 452, first laser assembly 481 is positioned on the top surface of base body 451 near the edge of first spacer 454, and second laser assembly 482 is positioned on second boss 453. First boss 452 and second boss 453 are configured to coordinate the heights of the optical signals output by laser assembly 430, first laser assembly 481, and second laser assembly 482, specifically to ensure that the optical signals output by laser assembly 430, first laser assembly 481, and second laser assembly 482 are at the same or similar heights. Furthermore, first boss 452 and second boss 453 coordinate the heights of the solder pads on laser assembly 430, first laser assembly 481, and second laser assembly 482, thereby controlling the length of the bonding wires to electrical connector 350. In addition, a first spacer 454 is provided between the first boss 452 and the second boss 453 to facilitate thermal isolation between the laser assembly 430, the first laser assembly 481 and the second laser assembly 482, and to facilitate assembly with the electrical connector 350, saving assembly space.

[0124] In some embodiments, electrical connector 350 is electrically connected to circuit board 300 via a flexible circuit board. A first path between the first output of driver 310 and EAM 432 runs sequentially from circuit board 300, the flexible circuit board, electrical connector 350, the bonding wires between laser assembly 430 and electrical connector 350, and then to the bonding wires on laser assembly 430. A second path between the second output of driver 310 and SOA 433 runs sequentially from circuit board 300, the flexible circuit board, electrical connector 350, and then to the bonding wires between laser assembly 430 and electrical connector 350. To facilitate bit alignment of the EAM432 modulated signal and the SOA433 modulated signal, the length of the first path on the circuit board 300 is equal to the length of the second path on the circuit board 300, the length of the first path on the electrical connector 350 is equal to the length of the second path on the electrical connector 350, and the length of the bonding wire from the laser assembly 430 and the electrical connector 350 to the bonding wire on the laser assembly 430 is equal to the length of the second path from the laser assembly 430 to the electrical connector 350. By adjusting the difference in length between the first path and the second path on the flexible circuit board, the time it takes for the modulated optical signal to be transmitted from the EAM432 to the SOA433 is compensated.

[0125] During the first modulation, laser assembly 430 generates a certain extinction ratio. The second modulation further increases the extinction ratio generated by the first modulation. The extinction ratios generated by the two modulations are superimposed, thereby increasing the extinction ratio of laser assembly 430. This improves the eye diagram quality of the optical signal output by laser assembly 430, thereby improving the optical signal quality. This disclosure also provides another method for increasing the extinction ratio, thereby ensuring that the extinction ratio of the optical module meets the eye diagram specifications.

[0126] Figure 24 is a block diagram of an optical module testing system according to some embodiments. As shown in Figure 24 , in some embodiments, the optical module testing system includes a test board 100, an optical module 200 disposed on the test board 100, a bit error tester 700a, an oscilloscope 800a, and a test host 900.

[0127] The test board 100 is provided with a hot-swappable connector. The optical module 200 is inserted into the hot-swappable connector to facilitate performance testing of the optical module 200. The test board 100 is provided with a high-speed signal connector. The bit error tester 700a is connected to the high-speed signal connector via a high-frequency electrical connection line to provide a high-frequency electrical signal to the test system.

[0128] Oscilloscope 800a is connected to the optical module via optical fiber at one end and to the test host 900 at the other end. It is configured to test the transmit-end eye diagram performance of the optical module. The display of oscilloscope 800a shows the output optical power, extinction ratio, and mask margin. The output optical power is the average optical power.

[0129] The test board 100 is provided with a connection socket. A test host 900 is connected to the connection socket via a wire to control the optical module to complete the performance test. The test host 900 is also connected to an oscilloscope 800a, which is configured to obtain various eye diagram parameters, such as output optical power, extinction ratio, and mask margin.

[0130] After the bit error detector 700a sends a high-frequency electrical signal to the optical module 200, the test host 900 writes the first command value of the first command signal to the optical module 200. The optical module 200 determines the second bias current based on the first command value of the first command signal. The test host 900 writes the first command value of the second command signal to the optical module 200. The optical module adjusts the first bias current based on the first command value of the second command signal to ensure that the output optical power is within a first preset range. When the test host 900 reads that the output optical power is within the first preset range, the test host 900 writes the first command value of the third command signal to the optical module 200. The optical module adjusts the bias voltage based on the first command value of the third command signal to ensure that the extinction ratio is within a third preset range. When the test host 900 reads that the extinction ratio is within the third preset range, the test host 900 writes the second instruction value of the second command signal to the optical module 200. The optical module 200 again adjusts the first bias current based on the second instruction value of the second command signal to ensure that the output optical power is within a second preset range. When the test host 900 reads that the output optical power is within the second preset range, the test host 900 writes the second indication value of the third command signal to the optical module 200. The optical module 200 adjusts the bias voltage again based on the second indication value of the third command signal to bring the extinction ratio within the fourth preset range. When the test host 900 reads that the mask margin is greater than the preset value, the test host 900 writes the fourth command signal to the optical module 200. Based on the fourth command signal, the optical module 200 stores the first indication value of the first command signal, the second indication value of the second command signal, and the second indication value of the third command signal. When the test host 900 reads that the mask margin is less than the preset value, the test host 900 does not write the fourth command signal to the optical module 200, but instead writes the second indication value of the first command signal or the third indication value of the first command signal to the optical module 200. Based on the second indication value of the first command signal or the third indication value of the first command signal, the optical module 200 first adjusts the second bias current and then readjusts the first bias current and bias voltage to bring the mask margin of the eye diagram greater than the preset value.

[0131] Figure 25 is a structural diagram of an optical module provided in accordance with some embodiments, without a housing. Figure 26 is another structural diagram of an optical module provided in accordance with some embodiments, without a housing. Figure 27 is an assembly diagram of a laser chip, a power chip, and an MCU provided in accordance with some embodiments. As shown in Figures 25, 26, and 27, the light emitting component 400 includes a laser assembly, which includes a laser chip. The laser chip includes only a light-emitting region. The light-emitting region emits light that does not carry data under the action of a first bias current, and modulates the light that does not carry data into data light under the action of a modulation current.

[0132] In some embodiments, the light emitting component 400 includes a laser assembly, which includes a laser chip. The laser chip includes a light emitting region and a modulation region. The light emitting region emits light that does not carry data under the action of a first bias current. The modulation region electrically absorbs and modulates the light that does not carry data to produce data light under the action of a bias voltage and a modulation signal. The modulation signal is a modulation voltage.

[0133] In some embodiments, the light emitting component 400 includes a laser assembly, which includes a laser chip. The laser chip includes a light emitting region (LD), a modulation region (EA), and an amplifier region (SOA). The first modulation unit and the second modulation unit mentioned above are located in the modulation region. The light emitting region emits light that does not carry data under the action of a first bias current. The modulation region electrically absorbs and modulates the light that does not carry data under the action of a bias voltage and a modulation signal to produce data light. The amplifier region amplifies the data light under the action of a second bias current.

[0134] To maintain the current PON link budget of 29dB / 32dB, the 50G PON standard places higher requirements on the output optical power of OLT optical modules. Conventional 53GBaud EMLs currently cannot meet the output optical power requirements of 50G PON. Therefore, a laser chip with a light-emitting, modulation, and amplification zones is selected, as shown in Figure 6, to meet the output optical power requirements.

[0135] An MCU 301 , a first power chip 302 , a second power chip 303 and a third power chip 304 are provided on the circuit board 300 of the optical module. The MCU 301 is connected to the first power chip 302 , the second power chip 303 and the third power chip 304 respectively.

[0136] The first power chip 302 is connected only to the light-emitting area, and is configured to provide a first bias current to the light-emitting area so that the light-emitting area emits light that does not carry data.

[0137] The first power chip 302 only provides a first bias current for the light-emitting area. To provide a modulation signal for the modulation area, in some embodiments, the optical module further includes a driver chip. The driver chip is connected to the MCU 301 and the modulation area, and is configured to provide a modulation signal for the modulation area.

[0138] In some embodiments, the first power chip 302 is connected not only to the light-emitting area but also to the modulation area. This power chip is configured to provide not only a first bias current to the light-emitting area but also a modulation signal to the modulation area. For example, the first power chip 302 is an integrated chip that provides both the first bias current and the bias voltage. In some embodiments, the second power chip 303 is connected to the modulation area and is configured to provide a bias voltage to the modulation area. This allows the modulation area to electro-absorb and modulate non-data-carrying light to produce data light under the action of the modulation voltage and the bias voltage.

[0139] Exemplarily, the third power chip 304 is connected to the amplifying region and is configured to provide a second bias current to the amplifying region so that the amplifying region amplifies the data light.

[0140] The second bias current has a greater impact on the output optical power than the first bias current and bias voltage. If the first bias current or bias voltage is determined first and then the second bias current is adjusted, the test results may be inaccurate. Therefore, the second bias current is determined first, and the first bias current and bias voltage are adjusted separately while keeping the second bias current unchanged. Because the first bias current has a greater impact on the output optical power than the bias voltage, after determining the second bias current, the first bias current is roughly adjusted first, followed by the bias voltage. However, coarsely adjusting the bias voltage may cause the output optical power to exceed the first preset range. Therefore, it is necessary to fine-tune the first bias current after coarsely adjusting the bias voltage to return the output optical power to the first preset range. However, fine-tuning the first bias current may cause the extinction ratio to exceed the third preset range. Therefore, it is necessary to fine-tune the bias voltage after fine-tuning the first bias current. That is, MCU301 is configured to: control the third power supply chip to determine the second bias current according to the first instruction value of the first instruction signal; control the first power supply chip to adjust the first bias current according to the first instruction value of the second instruction signal, so that the output optical power is within the first preset range; control the second power supply chip to adjust the bias voltage according to the first instruction value of the third instruction signal, so that the extinction ratio is within the third preset range; control the first power supply chip to adjust the first bias current according to the second instruction value of the second instruction signal, so that the output optical power is within the second preset range; control the second power supply chip to adjust the bias voltage according to the second instruction value of the third instruction signal, so that the extinction ratio is within the fourth preset range.

[0141] The second preset range is within the first preset range, and the output optical power is within the second preset range. Even if the bias voltage is further adjusted, the output optical power exceeds the second preset range, but it is impossible to exceed the first preset range, so that the output optical power of the optical module meets the eye diagram index.

[0142] The fourth preset range is within the third preset range, and the extinction ratio is within the fourth preset range. Even if the first bias current is adjusted again and the extinction ratio exceeds the fourth preset range, it is impossible to exceed the third preset range, so that the extinction ratio of the optical module meets the eye diagram index.

[0143] When the second bias current is determined, the first bias current and bias voltage are coarsely adjusted while the second bias current remains unchanged, and then the first bias current and bias voltage are fine-tuned so that the output optical power and extinction ratio both meet the eye diagram indicators of the optical module, thereby making the optical module have better eye diagram quality.

[0144] In this disclosure, the extinction ratio is increased through the above-mentioned embodiments, thereby improving the eye diagram quality of the optical module. In addition to the extinction ratio, eye diagram quality indicators also include the template margin. If the template margin is greater than a preset value, the template margin meets the eye diagram requirements; if the template margin is less than the preset value, the template margin does not meet the eye diagram requirements. To further improve eye diagram quality, this disclosure also provides an embodiment for optimizing the template margin.

[0145] If the template margin of the optical module is greater than a preset value, the first instruction value of the first instruction signal, the second instruction value of the second instruction signal, and the second instruction value of the third instruction signal are stored. That is, the MCU is configured to store the first instruction value of the first instruction signal, the second instruction value of the second instruction signal, and the second instruction value of the third instruction signal according to the fourth instruction signal.

[0146] If the template margin of the optical module is less than the preset value, that is, the fourth instruction signal is not received, the third power supply chip is controlled to adjust the second bias current according to the second instruction value of the first instruction signal, and the first bias current and bias voltage are readjusted so that the output optical power, extinction ratio and template margin all meet the eye diagram requirements. For example, the MCU301 is further configured to: control the third power supply chip to adjust the second bias current according to the second instruction value of the first instruction signal; control the first power supply chip to adjust the first bias current according to the third instruction value of the second instruction signal so that the output optical power is within the first preset range; control the second power supply chip to adjust the bias voltage according to the third instruction value of the third instruction signal so that the extinction ratio is within the third preset range; control the first power supply chip to adjust the first bias current according to the fourth instruction value of the second instruction signal so that the output optical power is within the second preset range; control the second power supply chip to adjust the bias voltage according to the fourth instruction value of the third instruction signal so that the extinction ratio is within the fourth preset range; and store the second instruction value of the first instruction signal, the third instruction value of the second instruction signal and the fourth instruction value of the third instruction signal according to the fourth instruction signal.

[0147] If the template margin of the optical module is still less than the preset value (that is, after adjusting the second bias current and adjusting the first bias current and bias voltage according to the second instruction value of the first instruction signal, the fourth instruction signal is still not received), the third power supply chip is controlled to adjust the second bias current according to the third instruction value of the first instruction signal, and the first bias current and bias voltage are readjusted so that the output optical power, extinction ratio and template margin all meet the eye diagram requirements. By way of example, MCU301 is also configured to: control the third power supply chip to adjust the second bias current according to the third instruction value of the first instruction signal; control the first power supply chip to adjust the first bias current according to the fifth instruction value of the second instruction signal, so that the output optical power is within the first preset range; control the second power supply chip to adjust the bias voltage according to the fifth instruction value of the third instruction signal, so that the extinction ratio is within the third preset range; control the first power supply chip to adjust the first bias current according to the sixth instruction value of the second instruction signal, so that the output optical power is within the second preset range; control the second power supply chip to adjust the bias voltage according to the sixth instruction value of the third instruction signal, so that the extinction ratio is within the fourth preset range; and store the third instruction value of the first instruction signal, the fifth instruction value of the second instruction signal, and the sixth instruction value of the third instruction signal according to the fourth instruction signal.

[0148] The second bias current corresponding to the first command value of the first command signal, the second bias current corresponding to the second command value of the first command signal, and the second bias current corresponding to the third command value of the first command signal are not significantly different in magnitude. The second bias current corresponding to the first command value of the first command signal is more suitable for most optical modules than the other two second bias currents. The second bias current corresponding to the second command value of the first command signal is more suitable for the majority of remaining optical modules than the second bias current corresponding to the third command value of the first command signal. A command signal can only have one command value at a time; it is not possible for a command signal to have two command values ​​at a time.

[0149] Figure 28 is a block diagram of an MCU according to some embodiments. As shown in Figure 28, in some embodiments, MCU 301 includes a first register, a second register, a third register, and a fourth register. The first register is configured to store a first instruction signal, the second register is configured to store a second instruction signal, the third register is configured to store a third instruction signal, and the fourth register is configured to store a fourth instruction signal.

[0150] The MCU301 is further configured to: read and send the first instruction value of the first instruction signal to the third power supply chip to determine the second bias current; read and send the first instruction value of the second instruction signal to the first power supply chip to adjust the first bias current so that the output optical power is within the first preset range; read and send the first instruction value of the third instruction signal to the second power supply chip to adjust the bias voltage so that the extinction ratio is within the third preset range; read and send the second instruction value of the second instruction signal to the first power supply chip to adjust the first bias current so that the output optical power is within the second preset range; read and send the second instruction value of the third instruction signal to the second power supply chip to adjust the bias voltage so that the extinction ratio is within the fourth preset range; read the fourth instruction signal and store the first instruction value of the first instruction signal, the second instruction value of the second instruction signal, and the second instruction value of the third instruction signal. A fifth register is set in the first power supply chip, a sixth register is set in the second power supply chip, and a seventh register is set in the third power supply chip. The fifth register is configured to store the second instruction signal, the sixth register is configured to store the third instruction signal, and the seventh register is configured to store the first instruction signal.

[0151] MCU301 is also configured to: read and write the first instruction value of the first instruction signal into the seventh register to determine the second bias current; read and write the first instruction value of the second instruction signal into the fifth register to adjust the first bias current so that the output optical power is within the first preset range; read and write the first instruction value of the third instruction signal into the sixth register to adjust the bias voltage so that the extinction ratio is within the third preset range; read and write the second instruction value of the second instruction signal into the fifth register to adjust the first bias current so that the output optical power is within the second preset range; read and write the second instruction value of the third instruction signal into the sixth register to adjust the bias voltage so that the extinction ratio is within the fourth preset range; read the fourth instruction signal and store the first instruction value of the first instruction signal, the second instruction value of the second instruction signal and the second instruction value of the third instruction signal.

[0152] The optical module is also provided with a digital-to-analog converter 305, which is provided on the circuit board 300. The digital-to-analog converter 305 is respectively connected to the MCU, the first power chip, the second power chip and the third power chip, and is configured to convert digital quantities into analog quantities.

[0153] The digital-to-analog converter is integrated in the MCU 301 , and the digital-to-analog converter is connected to the first power chip, the second power chip, and the third power chip respectively.

[0154] In addition to providing an optical module, the present disclosure also provides a debugging method. FIG29 is a flowchart 1 of a debugging method provided according to some embodiments. As shown in FIG29 , in some embodiments, the debugging method includes:

[0155] S100: Controlling a third power supply chip to determine a second bias current according to a first instruction value of a first instruction signal.

[0156] The second bias current has a greater impact on the output optical power than the first bias current and bias voltage. If you first determine the first bias current or bias voltage and then adjust the second bias current, the test results may be inaccurate. Therefore, first determine the second bias current, and then adjust the first bias current and bias voltage separately while keeping the second bias current unchanged.

[0157] The first command signal is configured to represent a second bias current. The test host writes a first command value of the first command signal into a first register of the MCU. The MCU reads the first command value of the first command signal and writes the first command value of the first command signal into a seventh register of the third power supply chip. The third power supply chip determines the magnitude of the output second bias current based on the first command value of the first command signal.

[0158] S200: Controlling the first power chip to adjust the first bias current according to the first command value of the second command signal, so that the output optical power is within a first preset range.

[0159] Since the first bias current has a greater influence on the output optical power than the bias voltage, the first bias current is roughly adjusted first and then the bias voltage is roughly adjusted when the second bias current is determined.

[0160] The second command signal is configured to be indicative of the first bias current.

[0161] The test host writes the first command value of the second command signal into the second register of the MCU. The MCU reads the first command value of the second command signal and writes the first command value of the second command signal into the fifth register of the first power supply chip. The first power supply chip adjusts the magnitude of the first output bias current based on the first command value of the second command signal to ensure that the output optical power is within a first preset range.

[0162] S300: Controlling the second power chip to adjust the bias voltage according to the first instruction value of the third instruction signal so that the extinction ratio is within a third preset range.

[0163] The third command signal is configured to be representative of a bias voltage.

[0164] When the test host detects that the oscilloscope's output optical power is within a first preset range, it writes the first command value of the third command signal to a third register of the MCU. The MCU reads the first command value of the third command signal and writes the first command value of the third command signal to a sixth register of the second power supply chip. The first power supply chip adjusts the output bias voltage based on the first command value of the third command signal to keep the extinction ratio within the third preset range.

[0165] S400: Controlling the first power chip to adjust the first bias current according to the second command value of the second command signal so that the output optical power is within a second preset range.

[0166] Coarse adjustment of the bias voltage may cause the output optical power to exceed the first preset range. Therefore, it is necessary to finely adjust the first bias current after coarse adjustment of the bias voltage to return the output optical power to the first preset range.

[0167] When the test host detects that the oscilloscope's extinction ratio is within a third preset range, the test host writes the second command value of the second command signal to the second register of the MCU. The MCU reads the second command value of the second command signal and writes the second command value of the second command signal to the fifth register of the first power supply chip. The first power supply chip adjusts the magnitude of the output first bias current based on the second command value of the second command signal to ensure that the output optical power is within the second preset range.

[0168] S500: Controlling the second power chip to adjust the bias voltage according to the second instruction value of the third instruction signal so that the extinction ratio is within a fourth preset range.

[0169] Fine-tuning the first bias current may cause the extinction ratio to exceed the third preset range. Therefore, the bias voltage needs to be fine-tuned after fine-tuning the first bias current.

[0170] When the test host detects that the oscilloscope's output optical power is within a second preset range, the test host writes the second command value of the third command signal to a third register of the MCU. The MCU reads the second command value of the third command signal and writes the second command value of the third command signal to a sixth register of the second power supply chip. The first power supply chip adjusts the output bias voltage based on the second command value of the third command signal to keep the extinction ratio within a fourth preset range.

[0171] S600: Determine whether the optical module stores a fourth instruction signal.

[0172] When the test host detects that the oscilloscope's extinction ratio is within a third preset range and that the mask margin is greater than a preset value, it writes a fourth command signal to the MCU's fourth register. The MCU's reading of the fourth command signal indicates that the output optical power, extinction ratio, and mask margin all meet the eye diagram specifications.

[0173] When the test host detects that the oscilloscope's extinction ratio is within the third preset range and the mask margin is less than the preset value, it does not write the fourth command signal to the MCU's fourth register. Instead, it writes the second command value of the first command signal to the first register. The MCU's failure to read the fourth command signal indicates that, while the output optical power and extinction ratio meet the eye diagram specifications, the mask margin does not. Because the mask margin is dependent on the first bias current, second bias current, and bias voltage, the first bias current, second bias current, and bias voltage are readjusted.

[0174] S700: If the optical module stores the fourth command signal, store the first command value of the first command signal, the second command value of the second command signal, and the second command value of the third command signal.

[0175] S800: If the optical module does not store the fourth instruction signal, control the third power chip to adjust the second bias current according to the second instruction value of the first instruction signal, and readjust the first bias current and the bias voltage so that the template margin is greater than the preset value.

[0176] FIG30 is a flowchart 2 of a debugging method according to some embodiments. As shown in FIG30 , in some embodiments, if the template margin of the optical module is less than a preset value, such as S800, the debugging method includes:

[0177] S801: Control the third power chip to adjust the second bias current according to the second instruction value of the first instruction signal.

[0178] S802: Control the first power chip to adjust the first bias current according to the third command value of the second command signal, so that the output optical power is within a first preset range.

[0179] S803: Control the second power chip to adjust the bias voltage according to the third command value of the third command signal, so that the extinction ratio is within a third preset range.

[0180] S804: Control the first power chip to adjust the first bias current according to the fourth command value of the second command signal, so that the output optical power is within a second preset range.

[0181] S805: Control the second power chip to adjust the bias voltage according to the fourth instruction value of the third instruction signal, so that the extinction ratio is within a fourth preset range.

[0182] S806: Determine whether the optical module stores a fourth instruction signal.

[0183] S807: If the optical module stores the fourth command signal, store the second command value of the first command signal, the fourth command value of the second command signal, and the fourth command value of the third command signal.

[0184] S808: If the optical module does not store the fourth instruction signal, control the third power chip to adjust the second bias current, and readjust the first bias current and the bias voltage so that the template margin is greater than a preset value.

[0185] FIG21 is a flowchart 3 of a debugging method according to some embodiments. As shown in FIG31 , in some embodiments, if the template margin of the optical module is less than a preset value, that is, as in S808, the debugging method includes:

[0186] S881: Control the third power chip to adjust the second bias current according to the third instruction value of the first instruction signal.

[0187] S882: Control the first power chip to adjust the first bias current according to the fifth command value of the second command signal, so that the output optical power is within a first preset range.

[0188] S883: Control the second power chip to adjust the bias voltage according to the fifth instruction value of the third instruction signal, so that the extinction ratio is within a third preset range.

[0189] S884: Control the first power chip to adjust the first bias current according to the sixth command value of the second command signal, so that the output optical power is within a second preset range.

[0190] S885: Control the second power chip to adjust the bias voltage according to the sixth command value of the third command signal, so that the extinction ratio is within a fourth preset range.

[0191] S886: Determine whether the optical module stores the fourth instruction signal.

[0192] S887: If the optical module stores the fourth command signal, store the third command value of the first command signal, the sixth command value of the second command signal, and the sixth command value of the third command signal. If the optical module does not store the fourth command signal, end.

[0193] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them. Although the present disclosure has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the various embodiments of the present disclosure.

Claims

1. An optical module, comprising: A circuit board, on the surface of which a driver is arranged, wherein the driver comprises a first output terminal and a second output terminal, wherein the driver outputs a first modulation signal through the first output terminal, and wherein the driver outputs a second modulation signal through the second output terminal; An optical emitting component, electrically connected to the circuit board, the emitting component includes a laser assembly, the laser assembly includes a first modulation unit and a second modulation unit, the optical output end of the first modulation unit is optically connected to the optical input end of the second modulation unit, the first modulation unit is connected to the first output end through a first path, and the second modulation unit is connected to the second output end through a second path; The first modulation unit is configured to perform a first modulation according to the first modulation signal and output a first optical signal; the second modulation unit is configured to perform a second modulation on the first optical signal according to the second modulation signal; wherein the first modulation and the second modulation are co-directional modulations, so that the optical power modulations of the optical signals corresponding to the bit signals are superimposed; Among them, the first modulation and the second modulation are co-directional modulations including: the first modulation signal and the second modulation signal are differential signals with opposite phases, and the modulation properties of the first modulation unit and the second modulation unit are different; or, the first modulation signal and the second modulation signal are differential signals with opposite phases, and the modulation properties of the first modulation unit and the second modulation unit are the same, and a phase reversal circuit is connected in series on the first path or the second path; or, the first modulation signal and the second modulation signal are signals with the same phases, and the modulation properties of the first modulation unit and the second modulation unit are the same; or, the first modulation signal and the second modulation signal are signals with the same phases, and the modulation properties of the first modulation unit and the second modulation unit are different, and a phase reversal circuit is connected in series on the first path or the second path.

2. The optical module according to claim 1, wherein: The first modulation signal and the second modulation signal are differential signals with opposite phases, the laser assembly further comprises an LD, a positive electrode of the LD is input with a bias current so that the LD generates direct current light; the first modulation unit comprises an EAM, the second modulation unit comprises an SOA, and the EAM and the SOA have different modulation properties; The EAM is located at the optical output end of the LD, and the positive electrode of the EAM is connected to the first output end through a first path, so that the EAM performs a first modulation according to the first modulation signal to generate a first optical signal from the DC light generated by the LD; The SOA is located at the optical output end of the EAM, a bias current is input to the positive electrode of the SOA, and the positive electrode of the SOA is also connected to the second output end through a second path, so that the SOA amplifies and performs a second modulation on the first optical signal according to the second modulation signal.

3. The optical module according to claim 1, wherein: The first modulation signal and the second modulation signal are signals with the same phase, the laser assembly further comprises an LD, a positive electrode of the LD is input with a bias current so that the LD generates direct current light; the first modulation unit comprises an EAM, the second modulation unit comprises an SOA, and the EAM and the SOA have different modulation properties; The EAM is located at the optical output end of the LD, the positive electrode of the EAM is connected to the first output end through a first path, and a phase inversion circuit is provided on the first path, so that the EAM performs a first modulation according to the first modulation signal after the phase inversion to first modulate the DC light generated by the LD to generate a first optical signal; The SOA is located at the optical output end of the EAM, a bias current is input to the positive electrode of the SOA, and the positive electrode of the SOA is also connected to the second output end through a second path, so that the SOA amplifies and performs a second modulation on the first optical signal according to the second modulation signal.

4. The optical module according to claim 1, wherein: The first modulation signal and the second modulation signal are signals with the same phase, the laser assembly further comprises an LD, a positive electrode of the LD is input with a bias current so that the LD generates direct current light; the first modulation unit comprises an EAM, the second modulation unit comprises an SOA, and the EAM and the SOA have different modulation properties; The EAM is located at the optical output end of the LD, and the positive electrode of the EAM is connected to the first output end through a first path, so that the EAM performs a first modulation according to the first modulation signal to first modulate the DC light generated by the LD to generate a first optical signal; The SOA is located at the optical output end of the EAM, a bias current is input to the positive electrode of the SOA, and the positive electrode of the SOA is also connected to the second output end through a second path. A phase inversion circuit is arranged on the second path, so that the SOA amplifies and performs a second modulation on the first optical signal according to a second modulation signal after phase inversion.

5. The optical module according to claim 2, wherein: A first path from the positive electrode of the EAM to the first output terminal plus a distance from the EAM to the SOA is equal to a second path from the positive electrode of the SOA to the second output terminal.

6. The optical module according to claim 2, wherein: The first output end is a same-direction output end of the driver, and the second output end is a reverse-direction output end of the driver; Alternatively, the first output end is a reverse output end of the driver, and the second output end is a same-direction output end of the driver.

7. The optical module according to claim 1, wherein: The first modulation signal and the second modulation signal are differential signals with opposite phases, the first modulation unit includes an LD, the second modulation unit includes an EAM, and the LD and the EAM have different modulation properties; The positive electrode of the LD is input with a bias current and connected to the first output terminal, so that the LD generates a first optical signal through a first modulation according to the first modulation signal; The EAM is located at the optical output end of the LD, and the positive electrode of the EAM is connected to the second output end, so that the EAM second modulates the first optical signal according to the second modulation signal; Alternatively, the laser assembly further comprises an SOA, which is located at the optical output end of the EAM, and a positive electrode of the SOA inputs a bias current so that the SOA amplifies the optical signal modulated by the EAM.

8. The optical module according to claim 1, wherein: The first modulation signal and the second modulation signal are signals with the same phase, the first modulation unit includes an LD, the second modulation unit includes an EAM, and the LD and the EAM have different modulation properties; The positive electrode of the LD inputs a bias current and is connected to the first output terminal through a first path, and a phase inversion circuit is provided on the first path. The EAM is located at the optical output end of the LD, and the positive electrode of the EAM is connected to the second output end through a second path; Alternatively, the laser assembly further comprises an SOA, which is located at the optical output end of the EAM, and a positive electrode of the SOA inputs a bias current so that the SOA amplifies the optical signal modulated by the EAM.

9. The optical module according to claim 1, wherein: The first modulation signal and the second modulation signal are signals with the same phase, the first modulation unit includes an LD, the second modulation unit includes an EAM, and the LD and the EAM have different modulation properties; The positive electrode of the LD inputs a bias current and is connected to the first output terminal through a first path, The EAM is located at the optical output end of the LD, the positive electrode of the EAM is connected to the second output end through a second path, and a phase inversion circuit is arranged on the second path; Alternatively, the laser assembly further comprises an SOA, which is located at the optical output end of the EAM, and a positive electrode of the SOA inputs a bias current so that the SOA amplifies the optical signal modulated by the EAM.

10. The optical module according to claim 1, wherein: The first modulation signal and the second modulation signal are differential signals with opposite phases, the laser assembly further comprises an LD, a positive electrode of the LD is input with a bias current so that the LD generates direct current light; the first modulation unit comprises a first EAM, the second modulation unit comprises a second EAM, and the modulation properties of the first EAM and the second EAM are the same; The first EAM is located at the optical output end of the LD, the positive electrode of the first EAM is connected to the first output end through a first path, and a phase inversion circuit is connected in series on the first path; The second EAM is located at the optical output end of the first EAM, and the anode of the second EAM is connected to the second output end through a second path.

11. The optical module according to claim 1, wherein: The first modulation signal and the second modulation signal are differential signals with opposite phases, the laser assembly further comprises an LD, a positive electrode of the LD is input with a bias current so that the LD generates direct current light; the first modulation unit comprises a first EAM, the second modulation unit comprises a second EAM, and the modulation properties of the first EAM and the second EAM are the same; The first EAM is located at the optical output end of the LD, and the positive electrode of the first EAM is connected to the first output end through a first path; The second EAM is located at the optical output end of the first EAM, the positive electrode of the second EAM is connected to the second output end through a second path, and a phase inversion circuit is connected in series on the second path.

12. The optical module according to claim 1, wherein: The first modulation signal and the second modulation signal are signals with the same phase, the laser assembly further comprises an LD, a positive electrode of the LD is input with a bias current so that the LD generates direct current light; the first modulation unit comprises a first EAM, the second modulation unit comprises a second EAM, the modulation properties of the first EAM and the second EAM are the same, The first EAM is located at the optical output end of the LD, and the positive electrode of the first EAM is connected to the first output end through a first path; The second EAM is located at the optical output end of the first EAM, and the anode of the second EAM is connected to the second output end through a second path.

13. The optical module according to claim 6, wherein: The driver is integrated in a DSP chip, and the DSP chip is arranged on the circuit board; or, the driver is a separate driver chip; A second capacitor is connected in series between the same-direction output terminal and the positive electrode of the EAM, and a first capacitor is connected in series between the reverse output terminal and the positive electrode of the SOA; The light emitting component further comprises a TEC, and the laser assembly is arranged on the TEC; The phase inversion circuit includes an inverter.

14. The optical module according to claim 1, wherein: The optical module further includes an optical accommodating component and a light receiving component, wherein the light receiving component includes a first light receiving component, a second light receiving component and a third light receiving component, wherein the first light receiving component, the second light receiving component and the third light receiving component are arranged on the side of the optical accommodating component; The light emitting component further comprises a light emitting cavity, one end of which is connected to the optical containing component, and the laser component is arranged in the light emitting cavity; a first laser component and a second laser component are also arranged in the light emitting cavity.

15. The optical module according to claim 14, wherein: An electrical connector is disposed at one end of the light emitting cavity away from the optical containing component, and the electrical connector is embedded in the side wall of the light emitting cavity, so that one end of the electrical connector extends into the light emitting cavity and the other end is located outside the light emitting cavity, and the end located outside the light emitting cavity is electrically connected to the circuit board; The electrical connector comprises an electrical connector body, a first elongated portion and a second elongated portion are arranged at one end of the electrical connector body, and a second interval is arranged between the first elongated portion and the second elongated portion; A first side surface is formed on the first extension portion at one side of the second interval, a second side surface is formed at the bottom of the second interval, a third side surface is formed on the second extension portion at one side of the second interval, a fourth side surface is formed on the top of the second extension portion, a fifth side surface is formed on the other side of the second extension portion away from the second interval, and a sixth side surface is also formed at one end of the electrical connector, and the sixth side surface is connected to the fifth side surface.

16. The optical module according to claim 1, wherein: The laser assembly includes a modulation area, and the first modulation unit and the second modulation unit are located in the modulation area; the laser assembly also includes a light emitting area and an amplifying area; The optical module further includes: A first power chip, connected to the light-emitting area, and configured to provide a first bias current for the light-emitting area; a second power chip connected to the modulation area and configured to provide a bias voltage for the modulation area; a third power chip connected to the amplifying region and configured to provide a second bias current for the amplifying region; The MCU is connected to the first power chip, the second power chip and the third power chip respectively, and is configured as follows: Controlling the third power chip to determine a second bias current according to a first instruction value of the first instruction signal; Controlling the first power chip to adjust the first bias current according to the first instruction value of the second instruction signal so that the output optical power is within a first preset range; Controlling the second power chip to adjust the bias voltage according to the first instruction value of the third instruction signal so that the extinction ratio is within a third preset range; Controlling the first power chip to adjust the first bias current according to the second command value of the second command signal so that the output optical power is within a second preset range; The second power chip is controlled to adjust the bias voltage according to the second instruction value of the third instruction signal so that the extinction ratio is within a fourth preset range.

17. The optical module according to claim 16, wherein: The MCU is also configured to: storing a first instruction value of the first instruction signal, a second instruction value of the second instruction signal, and a second instruction value of the third instruction signal according to a fourth instruction signal, wherein the fourth instruction signal is configured to characterize that a template margin of the eye diagram is greater than a preset value; When the fourth instruction signal is not received, the third power chip is controlled to adjust the second bias current according to the second instruction value of the first instruction signal, and the first bias current and the bias voltage are readjusted.

18. The optical module according to claim 17, wherein: The second preset range is within the first preset range, and the fourth preset range is within the third preset range.

19. The optical module according to claim 17, wherein: The MCU is also configured to: Controlling the third power chip to adjust the second bias current according to the second instruction value of the first instruction signal; Controlling the first power chip to adjust the first bias current according to the third instruction value of the second instruction signal so that the output optical power is within a first preset range; Controlling the second power chip to adjust the bias voltage according to a third instruction value of the third instruction signal so that the extinction ratio is within a third preset range; According to the fourth instruction value of the second instruction signal, the first power chip is controlled to adjust the first bias current so that the output optical power is within the second preset range. within the enclosure; controlling the second power chip to adjust the bias voltage according to a fourth instruction value of the third instruction signal so that the extinction ratio is within a fourth preset range; A second instruction value of the first instruction signal, a third instruction value of the second instruction signal, and a fourth instruction value of the third instruction signal are stored according to a fourth instruction signal.

20. The optical module according to claim 19, wherein: The MCU is also configured to: Controlling the third power chip to adjust the second bias current according to a third instruction value of the first instruction signal; Controlling the first power chip to adjust the first bias current according to the fifth instruction value of the second instruction signal so that the output optical power is within a first preset range; Controlling the second power chip to adjust the bias voltage according to a fifth instruction value of the third instruction signal so that the extinction ratio is within a third preset range; Controlling the first power chip to adjust the first bias current according to a sixth instruction value of the second instruction signal so that the output optical power is within a second preset range; controlling the second power chip to adjust the bias voltage according to a sixth instruction value of the third instruction signal so that the extinction ratio is within a fourth preset range; The third instruction value of the first instruction signal, the sixth instruction value of the second instruction signal, and the sixth instruction value of the third instruction signal are stored according to the fourth instruction signal.

21. The optical module according to claim 16, wherein: The MCU is provided with a plurality of registers; wherein the first register is configured to store a first instruction signal, the second register is configured to store a second instruction signal, the third register is configured to store a third instruction signal, and the fourth register is configured to store a fourth instruction signal; the MCU is further configured to: reading and sending a first instruction value of the first instruction signal to a third power chip to determine a second bias current; Reading and sending a first instruction value of the second instruction signal to a first power chip to adjust a first bias current so that the output optical power is within a first preset range; Reading and sending the first instruction value of the third instruction signal to the second power chip to adjust the bias voltage so that the extinction ratio is within a third preset range; Reading and sending a second instruction value of the second instruction signal to the first power chip to adjust the first bias current so that the output optical power is within a second preset range; reading and sending a second instruction value of the third instruction signal to the second power chip to adjust the bias voltage so that the extinction ratio is within a fourth preset range; The fourth command signal is read, and a first command value of the first command signal, a second command value of the second command signal, and a second command value of the third command signal are stored.

22. The optical module of claim 16, further comprising a digital-to-analog converter; The digital-to-analog converter is connected to the MCU, the first power chip, the second power chip and the third power chip respectively.

23. The optical module according to claim 16, further comprising a driver chip; The driving chip is connected to the MCU and the modulation area respectively, and is configured to provide a modulation signal for the modulation area.

24. The optical module according to claim 16, wherein: The first power chip is provided with a fifth register, the second power chip is provided with a sixth register, and the third power chip is provided with a seventh register; the MCU is configured as follows: reading and writing a first instruction value of the first instruction signal into a seventh register to determine a second bias current; Reading and writing the first instruction value of the second instruction signal into the fifth register to adjust the first bias current so that the output optical power is within a first preset range; Reading and writing a first instruction value of the third instruction signal into a sixth register to adjust the bias voltage so that the extinction ratio is within a third preset range; Reading and writing a second instruction value of the second instruction signal into a fifth register to adjust the first bias current so that the output optical power is within a second preset range; Reading and writing a second instruction value of the third instruction signal into a sixth register to adjust the bias voltage so that the extinction ratio is within a fourth preset range; The fourth command signal is read, and the first command value of the first command signal, the second command value of the second command signal, and the second command value of the third command signal are stored.

25. An optical module, comprising: A circuit board, on the surface of which a driver is arranged, wherein the driver comprises a first output terminal and a second output terminal, wherein the driver outputs a first modulation signal through the first output terminal, and wherein the driver outputs a second modulation signal through the second output terminal; An optical emitting component is electrically connected to the circuit board. The emitting component includes a laser assembly including a light emitting area, a modulation area and an amplification area. The modulation area includes a first modulation unit and a second modulation unit. The optical output end of the first modulation unit is optically connected to the optical input end of the second modulation unit. The first modulation unit is connected to the first output end through a first path, and the second modulation unit is connected to the second output end through a second path. The first modulation unit is configured to perform a first modulation according to the first modulation signal and output a first optical signal. The second modulation unit is configured to perform a second modulation on the first optical signal according to the second modulation signal. The first modulation and the second modulation are co-directional modulations, so that the optical power modulation of the optical signal corresponding to the bit signal is superimposed. A first power chip, connected to the light-emitting area, and configured to provide a first bias current for the light-emitting area; a second power chip connected to the modulation area and configured to provide a bias voltage for the modulation area; a third power chip connected to the amplifying region and configured to provide a second bias current for the amplifying region; MCU, connected to the first power chip, the second power chip and the third power chip respectively, and the MCU is configured as follows: Controlling the third power chip to determine a second bias current according to a first instruction value of the first instruction signal; Controlling the first power chip to adjust the first bias current according to the first instruction value of the second instruction signal so that the output optical power is within a first preset range; Controlling the second power chip to adjust the bias voltage according to the first instruction value of the third instruction signal so that the extinction ratio is within a third preset range; Controlling the first power chip to adjust the first bias current according to the second command value of the second command signal so that the output optical power is within a second preset range; The second power chip is controlled to adjust the bias voltage according to the second instruction value of the third instruction signal so that the extinction ratio is within a fourth preset range.

26. The optical module according to claim 25, wherein: The first modulation signal and the second modulation signal are differential signals with opposite phases, and the modulation properties of the first modulation unit and the second modulation unit are different; or, the first modulation signal and the second modulation signal are the same signal, and the modulation properties of the first modulation unit and the second modulation unit are the same.

27. The optical module according to claim 25, wherein: The first modulation signal and the second modulation signal are differential signals with opposite phases, and the first modulation unit and the second modulation unit have the same modulation property, and a phase inversion circuit is provided in the first path or the second path.

28. The optical module according to claim 25, wherein: The first modulation signal and the second modulation signal are the same signal, and the modulation properties of the first modulation unit and the second modulation unit are different. A phase inversion circuit is set in the first path or the second path.

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