Intelligent temperature control and bubble elimination plasma electrode system and control method thereof

Abstract

The present application relates to the technical field of plasma electrodes, and in particular to an intelligent temperature control and bubble elimination plasma electrode system and a control method thereof, which includes an electrode head, a ceramic insulating layer, an outer electrode, a micro temperature sensor array, an electromagnetic field modulation device, and an optimized electrode surface microstructure design, wherein the electrode head is located at the center of the electrode, the outer layer is a ceramic insulating layer, the outer layer of the ceramic insulating layer is an outer electrode, the micro temperature sensor array covers the key working area and realizes the temperature acquisition function through a parallel temperature sampling circuit, and the electromagnetic field modulation device causes the ceramic insulating layer to produce micro vibrations to promote bubble discharge by regulating the electromagnetic field intensity and frequency. The present application has the effect of achieving temperature acquisition and bubble removal without increasing the volume of the plasma electrode.

Description

Technical Field

[0001] The present application relates to the technical field of plasma electrodes, and in particular to an intelligent temperature control and bubble elimination plasma electrode system and a control method thereof. Background Art

[0002] Plasma processing technology plays an important role in various fields, and its application range covers semiconductor manufacturing, metal processing and other fields. With the continuous improvement of processing accuracy and efficiency requirements, plasma processing technology has gradually become one of the key technologies for achieving high-quality processing, especially in fine processes such as semiconductor thin film deposition, temperature control and bubble removal have become important factors to ensure processing quality.

[0003] In order to achieve good temperature control and bubble removal during plasma processing, existing technologies usually use simple mechanical vibration to remove the gas generated during the processing. At the same time, temperature monitoring relies on external instruments. However, such methods generally lack precision. Mechanical vibration is not only prone to material damage, but also poses a challenge to the timeliness of temperature control. Traditional instrument monitoring methods are difficult to adapt to the needs of modern high-precision processing for rapid temperature adjustment due to problems such as slow response. In addition, there is currently no effective management and control solution for the problems of large temperature fluctuations and residual bubbles, and no intelligent management and remote monitoring support can be provided. These problems seriously affect the processing accuracy and yield rate, and increase production costs. Therefore, there is an urgent need in the prior art for a method that can monitor temperature in real time and effectively remove bubbles to improve processing quality and production efficiency. Summary of the invention

[0004] In order to achieve temperature acquisition and bubble removal without increasing the volume of the plasma electrode, the present application provides an intelligent temperature control and bubble elimination plasma electrode system and a control method thereof.

[0005] In the first aspect, the present application provides an intelligent temperature control and bubble elimination plasma electrode system adopts the following technical solutions:

[0006] An intelligent temperature control and bubble elimination plasma electrode system comprises an electrode head, a ceramic insulating layer, an outer electrode, a micro temperature sensor array, an electromagnetic field modulation device and an optimized electrode surface microstructure design, wherein the electrode head is located at the center of the electrode, the outer layer is a ceramic insulating layer, the outer layer of the ceramic insulating layer is the outer electrode, the micro temperature sensor array covers the key working area and realizes the temperature acquisition function through a parallel temperature sampling circuit, and the electromagnetic field modulation device causes the ceramic insulating layer to produce micro vibrations by regulating the electromagnetic field strength and frequency to promote the discharge of bubbles.

[0007] By adopting the above technical solution and the above structure, the processing accuracy and efficiency can be significantly improved without changing the basic function of the plasma electrode, ensuring that the damage to the material during the processing is minimized, and the optimized electrode surface microstructure design can enhance the bubble capture and discharge efficiency, further improve the bubble elimination performance, ensure that the bubbles are effectively managed and controlled during the entire processing process, and realize the optimization and improvement of the application of plasma processing technology in the field of precision material processing.

[0008] Optionally, the micro temperature sensor array is connected in parallel with the original electrode function for accurate collection of real-time temperature data.

[0009] By adopting the above technical solution, the micro temperature sensor array is distributed in the key working area according to the preset layout method, ensuring the accurate collection of real-time temperature data, and is connected in parallel with the original electrode function to complete the temperature data collection without interfering with the original function. The reasonable layout method enables the temperature sensor array to provide an accurate basis for the adjustment of electromagnetic field parameters based on temperature data without affecting the normal working conditions of the electrode, thereby improving the temperature control accuracy and maintaining the temperature near the set value during plasma processing, which helps to improve the processing quality and production efficiency.

[0010] Optionally, the electromagnetic field modulation device adjusts electromagnetic field parameters through a specific algorithm according to real-time temperature data to achieve a constant operating temperature, and part of the outer electrode area serves as a ceramic electrode and applies voltage to achieve vibration of the ceramic insulating layer.

[0011] By adopting the above technical solution, the electromagnetic field modulation device dynamically adjusts the electromagnetic field parameters through a specific algorithm based on real-time temperature data, controls the ceramic insulation layer to produce micro-vibrations, and improves the efficiency of bubble discharge. This dynamic adjustment method causes the ceramic insulation layer to produce moderate micro-vibrations during the processing process, which helps to quickly discharge bubbles while avoiding damage to the processed materials, ensuring that the bubble removal efficiency is improved without reducing product quality and stability, meeting the requirements of precision material processing.

[0012] Optionally, the electrode surface microstructure design increases the bubble contact area, utilizes the interfacial tension effect to accelerate the bubble detachment, and further improves the bubble discharge efficiency through micro-vibration of the ceramic insulating layer.

[0013] By adopting the above technical solution, the electrode surface microstructure design increases the bubble contact area, and uses the interfacial tension effect to accelerate the bubble detachment. Combined with the micro-vibration of the ceramic insulating layer, the bubble discharge efficiency is further improved, thereby significantly improving the bubble elimination performance. The unique electrode surface microstructure design enhances the bubble capture and discharge capabilities without changing the original electrode design, ensuring that the bubbles are discharged in a timely and effective manner, and ensuring that the bubbles are effectively managed during use.

[0014] Optionally, it also includes a remote monitoring module that supports wireless communication. Users can monitor the electrode status in real time through a mobile terminal. The remote monitoring module is equipped with a dedicated cloud service that integrates temperature and bubble emission data streams and transmits them to the user's mobile device through an API interface. When signs of potential faults are found, early warning notifications are actively sent to the user's device.

[0015] By adopting the above technical solution, the remote monitoring module supports wireless communication function, allowing users to monitor the status of plasma electrodes in real time through mobile terminals. The remote monitoring module has a dedicated cloud service, integrated temperature and bubble emission data streams, and synchronizes data transmission to the user's mobile device through the API interface. When potential fault signs are detected, the system actively sends an early warning notification to the user's device to ensure that the user can take corresponding preventive maintenance measures at the first time, reduce production interruptions caused by equipment failure, and improve the reliability and continuity of the production process.

[0016] In a second aspect, the present application provides a control method for the above-mentioned intelligent temperature control and bubble elimination plasma electrode system, which adopts the following technical solutions:

[0017] An intelligent temperature control and bubble elimination plasma electrode control method, the intelligent temperature control and bubble elimination plasma electrode control method comprising the steps of:

[0018] Obtain the operating temperature and electromagnetic data of the plasma electrode;

[0019] Inputting the working temperature and electromagnetic data of the plasma electrode into a preset dynamic analysis model to obtain dynamic correlation data between the working temperature and the electromagnetic data;

[0020] Acquiring electromagnetic control parameters based on the associated data, and controlling the electromagnetic field of the plasma electrode according to the electromagnetic control parameters;

[0021] The vibration frequency of the electrode head of the plasma electrode is obtained according to the regulated electromagnetic field, and bubbles are eliminated based on the vibration frequency.

[0022] By adopting the above technical solution, the dynamic correlation data between the working temperature and electromagnetic data of the plasma electrode can be accurately obtained through the dynamic analysis model, thereby obtaining more accurate electromagnetic control parameters and finely controlling the electromagnetic field. Furthermore, the specific vibration frequency of the electrode head is obtained based on the regulated electromagnetic field, effectively eliminating the bubble phenomenon caused by the electromagnetic field, and improving the stability and quality of plasma electrode processing.

[0023] In a preferred example, the present application can be further configured as follows: before inputting the working temperature and electromagnetic data of the plasma electrode into a preset dynamic analysis model, the intelligent temperature control and bubble elimination plasma electrode control method further includes the steps of:

[0024] Acquire historical operating temperature data and historical electromagnetic data of the plasma electrode, and use the historical operating temperature data and historical electromagnetic data as a training set;

[0025] The training set is input into an initial dynamic model, and the initial dynamic model is trained to obtain a dynamic analysis model.

[0026] By adopting the above technical solution, by collecting the historical working temperature data and historical electromagnetic data of the plasma electrode as a training set, and inputting these data into the initial dynamic model for training, a more accurate dynamic analysis model can be obtained. By using this model to analyze the working temperature and electromagnetic data of the plasma electrode, the dynamic correlation data between the working temperature and the electromagnetic data can be more accurately calculated. The electromagnetic control parameters obtained based on these correlation data further optimize the control effect of the electromagnetic field, making the working state of the plasma electrode more stable.

[0027] In a preferred example, the present application can be further configured as follows: the vibration frequency of the electrode head of the plasma electrode is obtained according to the regulated electromagnetic field, and bubbles are eliminated based on the vibration frequency, specifically including:

[0028] Acquire regulated electromagnetic data according to the regulated electromagnetic field to obtain the current bubble state;

[0029] Based on the current bubble state and the regulated electromagnetic data, the vibration frequency of the electrode head is obtained in a preset vibration frequency database.

[0030] By adopting the above technical solution, the regulated electromagnetic data is obtained according to the regulated electromagnetic field, and the current bubble state is further obtained. Specifically, under the action of the regulated electromagnetic field, the system can monitor the changes in the electromagnetic data generated by the plasma electrode in real time, and use these data to judge the formation of bubbles around the plasma electrode and their severity in real time. Then, the system will quickly match the most suitable electrode head vibration frequency in the pre-set vibration frequency database based on the current bubble state and the regulated electromagnetic data. Finally, by driving the electrode head to vibrate at this vibration frequency, the bubble interference around the plasma electrode can be effectively eliminated, making the electrode work more stable, thereby improving the efficiency and quality of plasma generation. In addition, the automated operation of this process not only reduces the need for human intervention and enhances the intelligence of the system, but also can adapt to the characteristics of bubble formation under different working conditions by dynamically adjusting the vibration frequency, ensuring the continuous optimization of the plasma generation process.

[0031] In summary, the present application includes at least one of the following beneficial technical effects:

[0032] The above structure can significantly improve the processing accuracy and efficiency without changing the basic function of the plasma electrode, ensuring that the damage to the material during the processing is minimized, and the optimized electrode surface microstructure design can enhance the bubble capture and discharge efficiency, further improve the bubble elimination performance, ensure that the bubbles are effectively managed and controlled during the entire processing process, and achieve optimization and improvement of the application of plasma processing technology in the field of precision material processing;

[0033] The micro temperature sensor array is distributed in the key working area according to the preset layout method to ensure the accurate collection of real-time temperature data, and is connected in parallel with the original electrode function to complete the temperature data collection without interfering with the original function. The reasonable layout method enables the temperature sensor array to provide an accurate basis for the adjustment of electromagnetic field parameters based on temperature data without affecting the normal working conditions of the electrode, improve the temperature control accuracy, and maintain the temperature near the set value during plasma processing, which helps to improve the processing quality and production efficiency;

[0034] The electromagnetic field modulation device dynamically adjusts the electromagnetic field parameters through a specific algorithm based on real-time temperature data, controls the ceramic insulation layer to produce micro-vibrations, and improves the efficiency of bubble discharge. This dynamic adjustment method causes the ceramic insulation layer to produce moderate micro-vibrations during the processing process, which helps to quickly discharge bubbles while avoiding damage to the processed materials, ensuring that the bubble removal efficiency is improved without reducing product quality and stability, meeting the requirements of precision material processing. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] Figure 1 It is a structural schematic diagram of an intelligent temperature control and bubble elimination plasma electrode system according to an embodiment of the present application.

[0036] Figure 2 This is a diagram of the implementation steps of an intelligent temperature control and bubble elimination plasma electrode control method according to an embodiment of the present application.

[0037] Figure 3 This is another implementation step diagram of an intelligent temperature control and bubble elimination plasma electrode control method according to an embodiment of the present application.

[0038] Figure 4 This is a diagram of implementation steps of step S40 in a method for controlling a plasma electrode for intelligent temperature control and bubble elimination according to an embodiment of the present application.

[0039] Explanation of the reference numerals: 1. outer electrode; 2. ceramic insulating layer; 3. electrode head. DETAILED DESCRIPTION

[0040] The following is combined with Figure 1-4 This application is described in further detail.

[0041] The present application embodiment discloses an intelligent temperature control and bubble elimination plasma electrode system. Figure 1 The intelligent temperature control and bubble elimination plasma electrode system includes an electrode head 3, a ceramic insulating layer 2, an outer electrode 1, a micro temperature sensor array, an electromagnetic field modulation device and an optimized electrode surface microstructure design, wherein the electrode head 3 is located at the center of the electrode, a ceramic insulating layer 2 is provided on the outside of the electrode head 3, and an outer electrode 1 is provided on the outside of the ceramic insulating layer 2. The micro temperature sensor array is arranged in the key working area, and the temperature acquisition function is realized through a parallel temperature sampling circuit. The electromagnetic field modulation device causes the ceramic insulating layer 2 to produce micro vibrations by regulating the electromagnetic field intensity and frequency to promote the discharge of bubbles, thereby effectively improving the temperature control and bubble removal effect during the processing process. Through the above structure, the processing accuracy and efficiency can be significantly improved without changing the basic function of the plasma electrode, ensuring that the damage to the material during the processing is minimized, and the optimized electrode surface microstructure design can enhance the bubble capture and discharge efficiency, further improve the bubble elimination performance, ensure that the bubbles are effectively managed and controlled, and realize the optimization and improvement of the application of plasma processing technology in the field of precision material processing.

[0042] Specifically, the electrode head 3 includes an electrode end and an electrode body. The electrode end is made of a high-conductivity material, such as copper, graphite, etc., which is used to connect to the plasma source during the processing to provide a stable current input. The electrode body is made of a combination of a high-conductivity material and a high-strength material, such as a copper alloy or an aluminum alloy, to ensure that the electrode body can still maintain its structural strength at high temperatures. The connection between the electrode end and the electrode body is threaded or welded to ensure the stability and durability of the electrode structure.

[0043] Specifically, the ceramic insulating layer 2 is mainly made of high-purity alumina or other ceramic materials with good insulation indexes, and is formed by a high-temperature sintering process. The ceramic insulating layer 2 and the electrode head 3 are matched in an interference fit, and the stability and airtightness of the insulating layer under high temperature conditions are ensured by the pre-tightening force.

[0044] Specifically, the main components of the external electrode 1 include a metal ring and a conductive coating. The metal ring is made of a high conductivity material such as copper alloy or stainless steel, and the conductive coating is made of a metal material with good conductivity, such as copper or gold plating. The metal ring and the ceramic insulating layer 2 are combined by crimping or welding to ensure the stability of the structure of the external electrode 1. The combination of the metal ring and the conductive coating adopts plating technology to ensure the conductivity and corrosion resistance of the external electrode 1.

[0045] Specifically, the micro temperature sensor array uses semiconductor temperature sensors and resistance temperature sensors. Semiconductor temperature sensors are used to achieve a wider temperature monitoring range by distributing multiple semiconductor sensitive elements in parallel or in series in key working areas. Resistance temperature sensors are distributed in key working areas through multiple platinum resistance elements to ensure the accuracy and reliability of temperature monitoring. Multiple semiconductor temperature sensors and resistance temperature sensors are connected through parallel temperature sampling circuits to ensure accurate collection of temperature data. The installation relationship between the temperature sensor array and the electrode body is achieved through embedded installation or surface welding to ensure a close connection between the temperature sensor array and the electrode body structure.

[0046] Specifically, the electromagnetic field modulation device includes a magnet assembly and a coil assembly. The magnet assembly is made of a high coercive force magnet, such as neodymium iron boron and other materials, and is clamped or embedded with the ceramic insulating layer 2. The coil assembly is made of a copper coil or a steel wire coil, and is fixed to a part of the outer electrode 1 by welding or gluing to ensure the stability of the coil and electrode structure position during the electromagnetic field modulation process. The coordination between the magnet assembly and the coil assembly is dynamically adjusted through the electromagnetic field modulation control unit to achieve the purpose of constant operating temperature. In actual use, the electromagnetic field intensity and frequency are regulated by the electromagnetic field modulation control unit to achieve the effect of moderate vibration of the ceramic insulating layer 2, avoid damage to the processed material, and improve the bubble discharge efficiency.

[0047] Specifically, the optimized electrode surface microstructure design includes unique structural elements and special coatings. Structural elements such as micropores and protrusions are used to increase the contact area of ​​bubbles and accelerate the detachment of bubbles by using the interfacial tension effect. The special coating uses low surface energy materials or super hydrophobic materials and is achieved by dipping or spraying. The coordination between the structural elements and the special coating is achieved through micromachining technology and coating technology. The connection between the electrode surface microstructure design and the electrode body is achieved through precision machining to ensure the accuracy of the microstructure size and the fixity of the position. Through the optimized electrode surface microstructure design, the improvement of bubble capture and discharge is achieved, ensuring that bubbles can be discharged in a timely and effective manner, significantly improving the processing quality and efficiency.

[0048] The implementation principle of this embodiment is as follows: the plasma electrode is equipped with a micro-temperature sensor network in applications such as semiconductor thin film deposition. When local overheating is detected, the current temperature and historical data are analyzed through a preset AI algorithm, and the electromagnetic field parameters are automatically adjusted to cause the ceramic insulating layer 2 to produce precise micro-vibrations, accelerate the discharge of bubbles, and maintain uniform temperature. At the same time, the electrode surface microstructure design is also optimized to increase the bubble contact area per unit area, and the interfacial tension effect is used to accelerate the bubble detachment speed and improve the bubble removal efficiency. The remote monitoring system allows operators to check the electrode operation status at any time through mobile terminals, handle abnormalities in a timely manner, and ensure stable operation of the production line.

[0049] In one embodiment, if Figure 2 As shown, the present application also discloses an intelligent temperature control and bubble elimination plasma electrode control method, which specifically includes the following steps:

[0050] S10: Obtaining the operating temperature and electromagnetic data of the plasma electrode.

[0051] Specifically, during the use of the plasma electrode, the working temperature of the plasma electrode can be acquired in real time using a micro temperature sensor array, and the electromagnetic data can be acquired in real time using an electromagnetic sensor of the plasma electrode.

[0052] S20: Inputting the working temperature and electromagnetic data of the plasma electrode into a preset dynamic analysis model to obtain dynamic correlation data between the working temperature and the electromagnetic data.

[0053] Specifically, the working temperature and electromagnetic data of the plasma electrode are input into a preset dynamic analysis model, which can be a pre-established machine learning algorithm framework. The dynamic correlation data between the working temperature and the electromagnetic data is accurately obtained through the dynamic analysis model, thereby obtaining more accurate electromagnetic control parameters.

[0054] S30: Acquire electromagnetic control parameters based on the associated data, and control the electromagnetic field of the plasma electrode according to the electromagnetic control parameters.

[0055] Specifically, the electromagnetic control parameters mainly include the selection of magnetic field strength and frequency. By adjusting the controllable frequency converter in the power supply circuit, the energy density supplied to the plasma electrode can be changed. For example, if the electromagnetic field strength needs to be increased, the current supply can be increased; conversely, the influence of the electromagnetic field can be reduced by reducing the current.

[0056] Furthermore, the electromagnetic field modulation device dynamically adjusts the electromagnetic field parameters through a specific algorithm based on real-time temperature data, controls the ceramic insulating layer to produce micro-vibrations, and improves the bubble discharge efficiency.

[0057] S40: Acquire the vibration frequency of the electrode head of the plasma electrode according to the regulated electromagnetic field, and eliminate bubbles based on the vibration frequency.

[0058] Specifically, the specific vibration frequency of the electrode head is obtained based on the regulated electromagnetic field, which effectively eliminates the bubble phenomenon caused by the electromagnetic field and improves the stability and quality of plasma electrode processing.

[0059] In this embodiment, the dynamic correlation data between the working temperature and electromagnetic data can be accurately obtained through the dynamic analysis model according to the working temperature and electromagnetic data of the plasma electrode, so as to obtain more accurate electromagnetic control parameters and finely control the electromagnetic field. Furthermore, the specific vibration frequency of the electrode head is obtained based on the regulated electromagnetic field, which effectively eliminates the bubble phenomenon caused by the electromagnetic field and improves the stability and quality of plasma electrode processing.

[0060] In one embodiment, if Figure 3 As shown, before the working temperature and electromagnetic data of the plasma electrode are input into a preset dynamic analysis model, the intelligent temperature control and bubble elimination plasma electrode control method further includes the steps of:

[0061] S201: Acquire historical operating temperature data and historical electromagnetic data of a plasma electrode, and use the historical operating temperature data and historical electromagnetic data as a training set.

[0062] S202: Input the training set into an initial dynamic model, train the initial dynamic model, and obtain a dynamic analysis model.

[0063] Specifically, by collecting the historical working temperature data and historical electromagnetic data of the plasma electrode as a training set and inputting these data into the initial dynamic model for training, a more accurate dynamic analysis model can be obtained. By using this model to analyze the working temperature and electromagnetic data of the plasma electrode, the dynamic correlation data between the working temperature and the electromagnetic data can be more accurately calculated. The electromagnetic control parameters obtained based on these correlation data further optimize the control effect of the electromagnetic field, making the working state of the plasma electrode more stable.

[0064] In one embodiment, if Figure 4 As shown, the vibration frequency of the electrode head of the plasma electrode is obtained according to the regulated electromagnetic field, and bubbles are eliminated based on the vibration frequency, specifically including:

[0065] S41: Acquire regulated electromagnetic data according to the regulated electromagnetic field to obtain the current bubble state.

[0066] S42: Based on the current bubble state and the regulated electromagnetic data, the vibration frequency of the electrode head is obtained in a preset vibration frequency database.

[0067] Specifically, the regulated electromagnetic data is obtained according to the regulated electromagnetic field, and the current bubble state is further obtained. Specifically, under the action of the regulated electromagnetic field, the system can monitor the changes in the electromagnetic data generated by the plasma electrode in real time, and use these data to judge the formation of bubbles around the plasma electrode and their severity in real time. Then, based on the current bubble state and the regulated electromagnetic data, the system will quickly match the most suitable electrode head vibration frequency in the pre-set vibration frequency database. Ultimately, by driving the electrode head to vibrate at this vibration frequency, the bubble interference around the plasma electrode can be effectively eliminated, making the electrode work more stable, thereby improving the efficiency and quality of plasma generation. In addition, the automated operation of this process not only reduces the need for human intervention and enhances the intelligence of the system, but also can adapt to the characteristics of bubble formation under different working conditions by dynamically adjusting the vibration frequency, ensuring the continuous optimization of the plasma generation process.

[0068] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. An intelligent temperature control and bubble elimination plasma electrode system, characterized in that: The invention comprises an electrode head (3), a ceramic insulating layer (2), an outer electrode (1), a micro temperature sensor array, an electromagnetic field modulation device and an optimized electrode surface microstructure design, wherein the electrode head (3) is located at the center of the electrode, the outer layer is a ceramic insulating layer (2), the outer layer of the ceramic insulating layer (2) is an outer electrode (1), the micro temperature sensor array covers a key working area and realizes a temperature acquisition function through a parallel temperature sampling circuit, the electromagnetic field modulation device causes the ceramic insulating layer (2) to generate micro vibrations by regulating the electromagnetic field intensity and frequency to promote the discharge of bubbles, and the electromagnetic field modulation device adjusts the electromagnetic field parameters through a specific algorithm according to real-time temperature data to achieve a constant operating temperature, and the specific algorithm refers to: Obtain the operating temperature and electromagnetic data of the plasma electrode; Inputting the working temperature and electromagnetic data of the plasma electrode into a preset dynamic analysis model to obtain dynamic correlation data between the working temperature and the electromagnetic data; Electromagnetic control parameters are acquired based on the associated data, and the electromagnetic field of the plasma electrode is controlled according to the electromagnetic control parameters.

2. The intelligent temperature control and bubble elimination plasma electrode system according to claim 1 is characterized in that: The micro temperature sensor array is connected in parallel with the original electrode function to accurately collect real-time temperature data.

3. The intelligent temperature control and bubble elimination plasma electrode system according to claim 1, characterized in that: Part of the outer electrode (1) area serves as a ceramic electrode and applies a voltage to achieve vibration of the ceramic insulating layer (2).

4. The intelligent temperature control and bubble elimination plasma electrode system according to claim 1, characterized in that: The electrode surface microstructure design increases the bubble contact area, utilizes the interfacial tension effect to accelerate the bubble detachment, and further improves the bubble discharge efficiency through the micro-vibration of the ceramic insulating layer (2).

5. The intelligent temperature control and bubble elimination plasma electrode system according to claim 1, characterized in that: It also includes a remote monitoring module that supports wireless communication. Users can monitor the electrode status in real time through mobile terminals. The remote monitoring module is equipped with a dedicated cloud service that integrates temperature and bubble emission data streams and transmits them to the user's mobile device through an API interface. When signs of potential faults are found, early warning notifications are actively sent to the user's device.

6. A control method for the intelligent temperature control and bubble elimination plasma electrode system according to any one of claims 1 to 5, characterized in that: The control method comprises the steps of: Obtain the operating temperature and electromagnetic data of the plasma electrode; Inputting the working temperature and electromagnetic data of the plasma electrode into a preset dynamic analysis model to obtain dynamic correlation data between the working temperature and the electromagnetic data; Acquiring electromagnetic control parameters based on the associated data, and controlling the electromagnetic field of the plasma electrode according to the electromagnetic control parameters; The vibration frequency of the electrode head (3) of the plasma electrode is obtained according to the regulated electromagnetic field, and bubbles are eliminated based on the vibration frequency.

7. The control method according to claim 6, characterized in that: Before inputting the operating temperature and electromagnetic data of the plasma electrode into a preset dynamic analysis model, the control method further comprises the steps of: Acquire historical operating temperature data and historical electromagnetic data of the plasma electrode, and use the historical operating temperature data and historical electromagnetic data as a training set; The training set is input into an initial dynamic model, and the initial dynamic model is trained to obtain a dynamic analysis model.

8. The control method according to claim 6, characterized in that: The step of obtaining the vibration frequency of the electrode head (3) of the plasma electrode according to the regulated electromagnetic field and eliminating bubbles based on the vibration frequency specifically includes: Acquire regulated electromagnetic data according to the regulated electromagnetic field to obtain the current bubble state; Based on the current bubble state and the regulated electromagnetic data, the vibration frequency of the electrode head (3) is acquired in a preset vibration frequency database.

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