Multi-faceted detection method and system based on electronic parts

Abstract

The present invention discloses a multi-faceted detection method and system based on electronic components, which defines a clamping combination according to the clamping area, the corresponding surface and the overall shape of the electronic component, realizes the synchronous detection of multiple surfaces of the electronic component, and ensures the accuracy of the clamping combination. Based on the clamping combination, the position of the electronic component and the current posture of the electronic component, multiple clamping points are defined, and corresponding clamping tools are constructed according to the multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component; the conveying speed of the electronic component and the clamping speed of the clamping tool are dynamically interacted, and the clamping force and clamping angle of multiple clamping points are collected according to the clamping of the electronic component by the clamping tool, and the dynamic clamping system of the electronic component is constructed according to the clamping force of multiple clamping points, the corresponding clamping angle and the posture balance coefficient of the electronic component, which ensures the accuracy of the dynamic clamping system of the electronic component and realizes the dynamic clamping, clamping control and dynamic protection of the electronic component.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic components, and in particular to a multi-faceted detection method and system based on electronic components. Background Art

[0002] With the development of science and technology, electronic components are gradually applied to electronic equipment and appear in people's lives. Electronic components are dynamically transported in factories and assembled and tested at different locations. In the prior art, electronic components are tested on one side and conventionally clamped based on preset clamping positions. It is impossible to control the clamping area, the corresponding surface and the overall shape of the electronic component in multiple dimensions, and thus it is impossible to achieve overall consideration of the clamping force of multiple clamping points, the corresponding clamping angle and the posture balance coefficient of the electronic component. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art. The present invention provides a multi-faceted detection method and system based on electronic components, which collects multiple surfaces of electronic components based on the dynamic transportation of electronic components; defines corresponding detection models according to the multiple surfaces of the electronic components, the postures of the electronic components and the transportation speed of the electronic components; defines corresponding clamping areas based on the multiple surfaces of the electronic components and the corresponding detection models; defines clamping combinations according to the clamping areas, the corresponding surfaces and the overall shape of the electronic components, thereby realizing synchronous detection of multiple surfaces of the electronic components, and introducing the clamping areas, the corresponding surfaces and the overall shape of the electronic components in the synchronous detection, thereby realizing multi-dimensional control of the clamping areas, the corresponding surfaces and the overall shape of the electronic components, and ensuring the accuracy of the clamping combination.

[0004] Furthermore, multiple clamping points are defined based on the clamping combination, the position of the electronic component and the current posture of the electronic component, and a corresponding clamping tool is constructed according to the multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component; the conveying speed of the electronic component and the clamping speed of the clamping tool are dynamically interacted, and the clamping strength and clamping angle of multiple clamping points are collected according to the clamping of the electronic component by the clamping tool; a dynamic clamping system for the electronic component is constructed according to the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, which is compatible with the overall consideration of the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, and realizes multi-dimensional control of the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, thereby ensuring the accuracy of the dynamic clamping system of the electronic component and realizing dynamic clamping, clamping control and dynamic protection of the electronic component.

[0005] The embodiment of the present invention provides a multi-faceted detection method based on electronic components, which is applied to multi-faceted detection scenarios based on electronic components;

[0006] The multi-faceted detection method based on electronic components comprises:

[0007] Collecting multiple surfaces of the electronic component based on the dynamic transport of the electronic component;

[0008] Defining a corresponding detection model according to multiple surfaces of the electronic component, the posture of the electronic component, and the conveying speed of the electronic component;

[0009] Defining corresponding clamping areas based on multiple surfaces of the electronic component and corresponding detection models;

[0010] Define the clamping combination according to the clamping area, the corresponding surface and the overall shape of the electronic component;

[0011] Based on the clamping combination, the position of the electronic component and the current posture of the electronic component, a plurality of clamping points are defined, and a corresponding clamping tool is constructed according to the plurality of clamping points, the overall shape of the electronic component and the core area of ​​the electronic component;

[0012] The conveying speed of the electronic component and the clamping speed of the clamping tool interact dynamically, and the clamping force and clamping angle of multiple clamping points are collected according to the clamping of the electronic component by the clamping tool. A dynamic clamping system for the electronic component is constructed based on the clamping force of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component.

[0013] Optionally, the collecting of multiple surfaces of the electronic component based on the dynamic transport of the electronic component includes:

[0014] Collect transmission signals of electronic components;

[0015] Defining the conveying position of the electronic component based on the tracing of the conveying signal of the electronic component;

[0016] Triggering the marking of the electronic component according to the conveying position of the electronic component, and triggering dynamic monitoring of the electronic component along the marking of the electronic component;

[0017] In the dynamic monitoring of the electronic component, the flip node of the electronic component is collected, and multiple frames are shot based on the flip node of the electronic component to collect an image set;

[0018] A corresponding screening mechanism is defined according to the image set and the three-dimensional model of the electronic component, and multiple surfaces of the electronic component are collected according to the dynamic screening of the screening mechanism and the image combination.

[0019] Optionally, the step of defining a corresponding detection model according to multiple surfaces of the electronic component, the posture of the electronic component, and the conveying speed of the electronic component includes:

[0020] Freeze multiple surfaces of electronic components;

[0021] Based on the matching of the multiple surfaces of the electronic component, a corresponding matching coefficient is defined, and according to the matching coefficient and the connecting part of two adjacent surfaces, a complete coefficient of the multiple surfaces of the electronic component is defined;

[0022] If the integrity coefficients of the multiple surfaces of the electronic component are greater than a preset integrity coefficient threshold, the posture of the electronic component and the conveying speed of the electronic component are collected;

[0023] Associating multiple surfaces of the electronic component, the posture of the electronic component, and the conveying speed of the electronic component;

[0024] A first training set is defined based on multiple surfaces of the electronic component and the posture of the electronic component, and a second training set is defined based on multiple surfaces of the electronic component and the conveying speed of the electronic component;

[0025] A corresponding detection model is defined based on the first training set, the second training set and the corresponding model training system.

[0026] Optionally, the defining corresponding clamping areas based on multiple surfaces of the electronic component and corresponding detection models includes:

[0027] Freeze multiple surfaces of electronic components and match corresponding detection models to each surface;

[0028] In each surface, a corresponding contour is defined based on each surface and a detection model;

[0029] Define corresponding sub-clamping areas according to the contour, closed nodes and the electronic control part of the electronic component;

[0030] Real-time monitoring of the sub-clamping area in each surface of the electronic component;

[0031] A clamping area for electronic components is formed according to the association of a plurality of sub-clamping areas.

[0032] Optionally, the clamping combination is defined according to the clamping area, the corresponding surface and the overall shape of the electronic component, including:

[0033] Freeze the clamping area;

[0034] Dynamically interact with the clamping area and the corresponding surface;

[0035] defining a first combination coefficient according to a dynamic interaction of the clamping region and the corresponding surface;

[0036] Dynamically interact with the clamping area and the overall shape of the electronic parts;

[0037] A second combination coefficient is defined according to the dynamic interaction of the clamping area and the overall shape of the electronic component;

[0038] Constructing a corresponding combination mechanism based on the first combination coefficient and the second combination coefficient;

[0039] The clamping area, the corresponding surface and the overall shape of the electronic component are associated, and the clamping combination is defined based on the clamping area, the corresponding surface, the overall shape of the electronic component and the combination mechanism.

[0040] Optionally, the method of defining a plurality of clamping points based on the clamping combination, the position of the electronic component and the current posture of the electronic component, and constructing a corresponding clamping tool according to the plurality of clamping points, the overall shape of the electronic component and the core area of ​​the electronic component includes:

[0041] Fixed frame clamping combination;

[0042] Locate the position of the electronic component, and collect the current posture of the electronic component based on the positioning detection of the position of the electronic component;

[0043] Associating the clamping combination, the location of the electronic component, and the current posture of the electronic component;

[0044] A plurality of clamping points are defined according to the clamping combination, the position of the electronic component and the current posture of the electronic component.

[0045] Optionally, the method of defining a plurality of clamping points based on the clamping combination, the position of the electronic component and the current posture of the electronic component, and constructing a corresponding clamping tool according to the plurality of clamping points, the overall shape of the electronic component and the core area of ​​the electronic component, further includes:

[0046] Defining a core area of ​​the electronic component based on the traversal of the electronic component, and associating a plurality of clamping points, an overall shape of the electronic component, and the core area of ​​the electronic component;

[0047] According to the multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component, the corresponding clamping scene is matched, the clamping action trajectory is simulated according to the clamping scene, multiple clamping points and the clamping tool producer, and the corresponding clamping tool is constructed according to the clamping action trajectory and the electronic component.

[0048] Optionally, the conveying speed of the electronic component and the clamping speed of the clamping tool are dynamically interacted, and the clamping force and clamping angle of multiple clamping points are collected according to the clamping of the electronic component by the clamping tool, and a dynamic clamping system for the electronic component is constructed according to the clamping force of the multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, including:

[0049] Freeze the clamping tool and monitor the clamping of the electronic parts by the clamping tool in real time;

[0050] When the clamping tool approaches the electronic component, the conveying speed of the electronic component and the clamping speed of the clamping tool are collected, and the conveying speed of the electronic component and the clamping speed of the clamping tool are dynamically interacted to maintain the synchronization of the conveying speed of the electronic component and the clamping speed of the clamping tool.

[0051] Optionally, the conveying speed of the electronic component and the clamping speed of the clamping tool are dynamically interacted, and the clamping force and clamping angle of multiple clamping points are collected according to the clamping of the electronic component by the clamping tool, and a dynamic clamping system for the electronic component is constructed according to the clamping force of the multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, which also includes:

[0052] The clamping force and the clamping angle of multiple clamping points are collected according to the clamping of the electronic component by the clamping tool;

[0053] Associating the clamping force of multiple clamping points, the corresponding clamping angle and the posture balance coefficient of the electronic component;

[0054] A first system coefficient is defined according to the clamping forces of the multiple clamping points and the corresponding clamping angles, and a second system coefficient is defined according to the clamping forces of the multiple clamping points and the posture balance coefficient of the electronic component;

[0055] A dynamic clamping system for the electronic component is constructed according to the first system coefficient, the second system coefficient and the electronic component.

[0056] In addition, an embodiment of the present invention further provides a multi-faceted detection system based on electronic components, characterized in that the multi-faceted detection system based on electronic components is applied to the multi-faceted detection method based on electronic components, and the multi-faceted detection system based on electronic components includes:

[0057] A collection module, used for collecting multiple surfaces of the electronic component based on the dynamic transportation of the electronic component;

[0058] A detection module, used to define a corresponding detection model according to multiple surfaces of the electronic component, the posture of the electronic component and the conveying speed of the electronic component;

[0059] A clamping area module, used to define corresponding clamping areas based on multiple surfaces of the electronic component and corresponding detection models;

[0060] A clamping combination module, used to define a clamping combination according to the clamping area, the corresponding surface and the overall shape of the electronic component;

[0061] A clamping tool module is used to define multiple clamping points based on the clamping combination, the position of the electronic component and the current posture of the electronic component, and to construct a corresponding clamping tool according to the multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component;

[0062] The dynamic clamping system module is used to dynamically interact the conveying speed of the electronic component and the clamping speed of the clamping tool, and collect the clamping force and clamping angle of multiple clamping points according to the clamping of the electronic component by the clamping tool, and build a dynamic clamping system for the electronic component based on the clamping force of multiple clamping points, the corresponding clamping angle and the posture balance coefficient of the electronic component.

[0063] In an embodiment of the present invention, through the method in the embodiment of the present invention, multiple surfaces of an electronic component are collected based on the dynamic transportation of the electronic component; a corresponding detection model is defined according to the multiple surfaces of the electronic component, the posture of the electronic component and the transportation speed of the electronic component; a corresponding clamping area is defined based on the multiple surfaces of the electronic component and the corresponding detection model; a clamping combination is defined according to the clamping area, the corresponding surface and the overall shape of the electronic component, thereby realizing synchronous detection of multiple surfaces of the electronic component, and introducing the clamping area, the corresponding surface and the overall shape of the electronic component in the synchronous detection, thereby realizing multi-dimensional control of the clamping area, the corresponding surface and the overall shape of the electronic component, and ensuring the accuracy of the clamping combination.

[0064] Furthermore, multiple clamping points are defined based on the clamping combination, the position of the electronic component and the current posture of the electronic component, and a corresponding clamping tool is constructed according to the multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component; the conveying speed of the electronic component and the clamping speed of the clamping tool are dynamically interacted, and the clamping strength and clamping angle of multiple clamping points are collected according to the clamping of the electronic component by the clamping tool; a dynamic clamping system for the electronic component is constructed according to the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, which is compatible with the overall consideration of the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, and realizes multi-dimensional control of the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, thereby ensuring the accuracy of the dynamic clamping system of the electronic component and realizing dynamic clamping, clamping control and dynamic protection of the electronic component. BRIEF DESCRIPTION OF THE DRAWINGS

[0065] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0066] Figure 1 is a flow chart of a multi-faceted detection method based on electronic components in an embodiment of the present invention;

[0067] Figure 2is a flow chart of S11 in the multi-faceted detection method based on electronic components in an embodiment of the present invention;

[0068] Figure 3 is a flow chart of S12 in the multi-faceted detection method based on electronic components in an embodiment of the present invention;

[0069] Figure 4 is a flow chart of S13 in the multi-faceted detection method based on electronic components in an embodiment of the present invention;

[0070] Figure 5 is a flow chart of S14 in the multi-faceted detection method based on electronic components in an embodiment of the present invention;

[0071] Figure 6 is a flow chart of S15 in the multi-faceted detection method based on electronic components in an embodiment of the present invention;

[0072] Figure 7 is a flow chart of S16 in the multi-faceted detection method based on electronic components in an embodiment of the present invention;

[0073] Figure 8 is a schematic diagram of the structure of a multi-faceted detection system based on electronic components in an embodiment of the present invention;

[0074] Fig. 9 The figure is a hardware diagram of an electronic device according to an exemplary embodiment. DETAILED DESCRIPTION

[0075] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0076] See also Figures 1 to 9 , a multi-faceted detection method based on electronic components, applied to multi-faceted detection scenarios based on electronic components; the multi-faceted detection method based on electronic components includes:

[0077] Step S11: collecting multiple surfaces of the electronic component based on the dynamic transportation of the electronic component;

[0078] Step S12: defining a corresponding detection model according to multiple surfaces of the electronic component, the posture of the electronic component, and the conveying speed of the electronic component;

[0079] Step S13: defining corresponding clamping areas based on multiple surfaces of the electronic component and corresponding detection models;

[0080] Step S14: defining a clamping combination according to the clamping area, the corresponding surface and the overall shape of the electronic component;

[0081] Step S15: defining a plurality of clamping points based on the clamping combination, the position of the electronic component and the current posture of the electronic component, and constructing a corresponding clamping tool according to the plurality of clamping points, the overall shape of the electronic component and the core area of ​​the electronic component;

[0082] Step S16: Dynamically interact the conveying speed of the electronic component and the clamping speed of the clamping tool, and collect the clamping force and clamping angle of multiple clamping points according to the clamping of the electronic component by the clamping tool, and build a dynamic clamping system for the electronic component according to the clamping force of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component.

[0083] In an embodiment of the present invention, through the method in the embodiment of the present invention, multiple surfaces of an electronic component are collected based on the dynamic transportation of the electronic component; a corresponding detection model is defined according to the multiple surfaces of the electronic component, the posture of the electronic component and the transportation speed of the electronic component; a corresponding clamping area is defined based on the multiple surfaces of the electronic component and the corresponding detection model; a clamping combination is defined according to the clamping area, the corresponding surface and the overall shape of the electronic component, thereby realizing synchronous detection of multiple surfaces of the electronic component, and introducing the clamping area, the corresponding surface and the overall shape of the electronic component in the synchronous detection, thereby realizing multi-dimensional control of the clamping area, the corresponding surface and the overall shape of the electronic component, and ensuring the accuracy of the clamping combination.

[0084] Furthermore, multiple clamping points are defined based on the clamping combination, the position of the electronic component and the current posture of the electronic component, and a corresponding clamping tool is constructed according to the multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component; the conveying speed of the electronic component and the clamping speed of the clamping tool are dynamically interacted, and the clamping strength and clamping angle of multiple clamping points are collected according to the clamping of the electronic component by the clamping tool; a dynamic clamping system for the electronic component is constructed according to the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, which is compatible with the overall consideration of the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, and realizes multi-dimensional control of the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, thereby ensuring the accuracy of the dynamic clamping system of the electronic component and realizing dynamic clamping, clamping control and dynamic protection of the electronic component.

[0085] refer to Figure 2 , in step S11, multiple surfaces of the electronic component are collected based on the dynamic transportation of the electronic component;

[0086] In the specific implementation process of the present invention, the specific steps may be:

[0087] S111: collecting transmission signals of electronic components;

[0088] S112: defining a conveying position of the electronic component based on tracing back a conveying signal of the electronic component;

[0089] S113: triggering a mark of the electronic component according to the conveying position of the electronic component, and triggering dynamic monitoring of the electronic component along the mark of the electronic component;

[0090] S114: in the dynamic monitoring of the electronic component, collecting the flip nodes of the electronic component, and performing multi-frame shooting based on the flip nodes of the electronic component to collect an image set;

[0091] S115: defining a corresponding screening mechanism according to the image set and the three-dimensional model of the electronic component, and collecting multiple surfaces of the electronic component according to dynamic screening combining the screening mechanism and the images.

[0092] In an embodiment of the present application, the delivery signal of the electronic component is collected and introduced, and the delivery signal of the electronic component is controlled, so that the delivery position of the electronic component is defined based on the tracing of the delivery signal of the electronic component, thereby realizing the tracing of the delivery signal of the electronic component and ensuring the accuracy of the delivery position of the electronic component.

[0093] Therefore, the mark of the electronic component is triggered according to the conveying position of the electronic component, and the dynamic monitoring of the electronic component is triggered along the mark of the electronic component, thereby realizing the dynamic monitoring of the electronic component, so as to facilitate the control of the electronic component during dynamic conveyance.

[0094] Furthermore, in the dynamic monitoring of electronic components, the flip nodes of the electronic components are collected, and multiple frames are shot based on the flip nodes of the electronic components to collect an image set; a corresponding screening mechanism is defined according to the image set and the three-dimensional model of the electronic component, and multiple surfaces of the electronic component are collected based on the dynamic screening of the screening mechanism and the image combination, and the image set and the three-dimensional model of the electronic component are introduced, and multiple interactions of the image set and the three-dimensional model of the electronic component are realized, thereby ensuring the accuracy of the screening mechanism, and then ensuring the accuracy of multiple surfaces of the electronic component, and realizing the control of multiple surfaces of the electronic component.

[0095] refer to Figure 3 , in step S12, a corresponding detection model is defined according to multiple surfaces of the electronic component, the posture of the electronic component, and the conveying speed of the electronic component;

[0096] In the specific implementation process of the present invention, the specific steps may be:

[0097] S121: Freeze multiple surfaces of electronic components;

[0098] S122: defining corresponding matching coefficients based on matching of multiple surfaces of the electronic component, and defining complete coefficients of the multiple surfaces of the electronic component according to the matching coefficients and the connecting parts of two adjacent surfaces;

[0099] S123: if the integrity coefficients of the multiple surfaces of the electronic component are greater than a preset integrity coefficient threshold, collecting the posture of the electronic component and the conveying speed of the electronic component;

[0100] S124: associating multiple surfaces of the electronic component, the posture of the electronic component, and the conveying speed of the electronic component;

[0101] S125: defining a first training set based on multiple surfaces of the electronic component and the posture of the electronic component, and defining a second training set based on multiple surfaces of the electronic component and the conveying speed of the electronic component;

[0102] S126: Define a corresponding detection model based on the first training set, the second training set and the corresponding model training system.

[0103] In an embodiment of the present application, multiple surfaces of an electronic component are frozen, multiple surfaces of an electronic component are introduced, and the multiple surfaces of the electronic component are managed and controlled. At the same time, corresponding matching coefficients are defined based on the matching of the multiple surfaces of the electronic component, and the complete coefficients of the multiple surfaces of the electronic component are defined according to the matching coefficients and the connecting parts of two adjacent surfaces. This is compatible with the overall consideration of the matching coefficients and the connecting parts of two adjacent surfaces, realizes multiple interactions of the matching coefficients and the connecting parts of two adjacent surfaces, and ensures the accuracy of the complete coefficients of the multiple surfaces of the electronic component.

[0104] Furthermore, the integrity coefficients of multiple surfaces of the electronic component are compared with a preset integrity coefficient threshold. At this time, if the integrity coefficients of multiple surfaces of the electronic component are greater than the preset integrity coefficient threshold, the posture of the electronic component and the conveying speed of the electronic component are collected, and the posture of the electronic component and the conveying speed of the electronic component are introduced to facilitate the association between the posture of the electronic component and the conveying speed of the electronic component.

[0105] Therefore, the multiple surfaces of the electronic components, the postures of the electronic components and the conveying speeds of the electronic components are associated; the first training set is defined based on the multiple surfaces of the electronic components and the postures of the electronic components, and the second training set is defined according to the multiple surfaces of the electronic components and the conveying speeds of the electronic components; the corresponding detection model is defined based on the first training set, the second training set and the corresponding model training system, the first training set, the second training set and the corresponding model training system are introduced, and the first training set, the second training set and the corresponding model training system are controlled in multiple dimensions to ensure the accuracy and adaptability of the detection model.

[0106] refer to Figure 4, in step S13, defining corresponding clamping areas based on multiple surfaces of the electronic component and corresponding detection models;

[0107] In the specific implementation process of the present invention, the specific steps may be:

[0108] S131: freeze multiple surfaces of the electronic component, and match corresponding detection models to each surface;

[0109] S132: In each surface, define a corresponding contour based on each surface and the detection model;

[0110] S133: defining corresponding sub-clamping areas according to the contour, the closed node and the electronic control part of the electronic component;

[0111] S134: monitoring the sub-clamping area in each surface of the electronic component in real time;

[0112] S135: forming a clamping area for the electronic component according to the association of the plurality of sub-clamping areas.

[0113] In an embodiment of the present application, multiple surfaces of an electronic component are frozen, and a corresponding detection model is matched to each surface. At this time, a corresponding contour is defined in each surface based on each surface and the detection model, and each surface and the detection model are introduced to achieve matching of each surface and the detection model.

[0114] Furthermore, corresponding sub-clamping areas are defined according to the contours, closed nodes and the electrical control parts of electronic components, which is compatible with the overall consideration of the contours, closed nodes and the electrical control parts of electronic components, realizes multi-dimensional control of the contours, closed nodes and the electrical control parts of electronic components, and ensures the accuracy of the sub-clamping areas.

[0115] Therefore, the sub-clamping areas in each surface of the electronic component are monitored in real time; the clamping area of ​​the electronic component is formed according to the association of multiple sub-clamping areas, the association of multiple sub-clamping areas in different dimensions is realized, and the multiple interactions of multiple sub-clamping areas are realized, thereby ensuring the accuracy of the clamping area of ​​the electronic component and being compatible with electronic components in different scenarios.

[0116] refer to Figure 5 , S14: defining a clamping combination according to the clamping area, the corresponding surface and the overall shape of the electronic component;

[0117] In the specific implementation process of the present invention, the specific steps may be:

[0118] S141: freeze clamping area;

[0119] S142: Dynamically interact with the clamping area and the corresponding surface;

[0120] S143: defining a first combination coefficient according to a dynamic interaction between the clamping area and the corresponding surface;

[0121] S144: Dynamic interaction of the clamping area and the overall shape of the electronic parts;

[0122] S145: defining a second combination coefficient according to the dynamic interaction between the clamping area and the overall shape of the electronic component;

[0123] S146: constructing a corresponding combination mechanism based on the first combination coefficient and the second combination coefficient;

[0124] S147: Associating the clamping area, the corresponding surface and the overall shape of the electronic component, and defining a clamping combination based on the clamping area, the corresponding surface, the overall shape of the electronic component and the combination mechanism.

[0125] In an embodiment of the present application, multiple surfaces of an electronic component are collected based on the dynamic transportation of the electronic component; a corresponding detection model is defined according to the multiple surfaces of the electronic component, the posture of the electronic component and the transportation speed of the electronic component; a corresponding clamping area is defined based on the multiple surfaces of the electronic component and the corresponding detection model; a clamping combination is defined according to the clamping area, the corresponding surface and the overall shape of the electronic component, thereby realizing synchronous detection of multiple surfaces of the electronic component, and introducing the clamping area, the corresponding surface and the overall shape of the electronic component in the synchronous detection, thereby realizing multi-dimensional control of the clamping area, the corresponding surface and the overall shape of the electronic component, and ensuring the accuracy of the clamping combination.

[0126] At this time, the clamping area is frozen and controlled, and at the same time, the clamping area and the corresponding surface are dynamically interacted to achieve dynamic interaction between the clamping area and the corresponding surface, so that the first combination coefficient is defined according to the dynamic interaction between the clamping area and the corresponding surface, thereby ensuring the accuracy of the first combination coefficient.

[0127] At the same time, the clamping area and the overall shape of the electronic component are dynamically interacted; the second combination coefficient is defined according to the dynamic interaction of the clamping area and the overall shape of the electronic component, thereby realizing the dynamic interaction of the clamping area and the overall shape of the electronic component and ensuring the accuracy of the second combination coefficient.

[0128] Therefore, a corresponding combination mechanism is constructed based on the first combination coefficient and the second combination coefficient; the clamping area, the corresponding surface and the overall shape of the electronic component are associated, and the clamping combination is defined based on the clamping area, the corresponding surface, the overall shape of the electronic component and the combination mechanism, which is compatible with the overall consideration of the clamping area, the corresponding surface and the overall shape of the electronic component, realizes multi-dimensional control of the clamping area, the corresponding surface and the overall shape of the electronic component, and ensures the rationality and accuracy of the clamping combination.

[0129] At the same time, the clamping combination is defined according to the clamping area, the corresponding surface and the overall shape of the electronic component, thereby realizing the simultaneous detection of multiple surfaces of the electronic component. The clamping area, the corresponding surface and the overall shape of the electronic component are introduced into the simultaneous detection, thereby realizing multi-dimensional control of the clamping area, the corresponding surface and the overall shape of the electronic component, and ensuring the accuracy of the clamping combination.

[0130] refer to Figure 6 , S15: defining a plurality of clamping points based on the clamping combination, the position of the electronic component and the current posture of the electronic component, and constructing a corresponding clamping tool according to the plurality of clamping points, the overall shape of the electronic component and the core area of ​​the electronic component;

[0131] In the specific implementation process of the present invention, the specific steps may be:

[0132] S151: Fixed-grip clamping assembly;

[0133] S152: Locate the position of the electronic component, and collect the current posture of the electronic component according to the positioning detection of the position of the electronic component;

[0134] S153: Associating the clamping combination, the position of the electronic component, and the current posture of the electronic component;

[0135] S154: defining a plurality of clamping points according to the clamping combination, the position of the electronic component, and the current posture of the electronic component;

[0136] S155: defining a core area of ​​the electronic component based on the traversal of the electronic component, and associating a plurality of clamping points, an overall shape of the electronic component, and the core area of ​​the electronic component;

[0137] S156: Match the corresponding clamping scene according to multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component, simulate the clamping action trajectory according to the clamping scene, multiple clamping points and the clamping tool producer, and construct the corresponding clamping tool according to the clamping action trajectory and the electronic component.

[0138] In an embodiment of the present application, a clamping combination is fixed, a clamping combination is introduced, and at the same time, the position of the electronic component is located, and the current posture of the electronic component is collected based on the positioning detection of the position of the electronic component; the clamping combination, the position of the electronic component and the current posture of the electronic component are associated; a plurality of clamping points are defined according to the clamping combination, the position of the electronic component and the current posture of the electronic component, and the overall consideration of the clamping combination, the position of the electronic component and the current posture of the electronic component is compatible, and multiple interactions of the clamping combination, the position of the electronic component and the current posture of the electronic component are realized, thereby ensuring accurate evaluation of multiple clamping points, so as to facilitate accurate control of multiple clamping points.

[0139] Therefore, the core area of ​​the electronic component is defined based on the traversal of the electronic component, and multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component are associated; the corresponding clamping scene is matched according to the multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component, multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component are introduced, and multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component are multiple interacted, so as to realize the precise control of the clamping scene.

[0140] At the same time, according to the clamping scene, multiple clamping points and the clamping tool producer, the clamping action trajectory is simulated, and the corresponding clamping tool is constructed according to the clamping action trajectory and the electronic components. The clamping scene, multiple clamping points and the clamping tool producer are introduced, and the clamping scene, multiple clamping points and the clamping tool producer are considered as a whole. The multiple interactions of the clamping scene, multiple clamping points and the clamping tool producer are realized, and the accuracy of the clamping action trajectory is ensured, so as to facilitate the further utilization of the clamping action trajectory and the electronic components, realize the construction of the clamping tool, and ensure the autonomous construction and use accuracy of the clamping tool.

[0141] refer to Figure 7 S16: dynamically interacting the conveying speed of the electronic component and the clamping speed of the clamping tool, collecting the clamping force and the clamping angle of multiple clamping points according to the clamping of the electronic component by the clamping tool, and constructing a dynamic clamping system for the electronic component according to the clamping force of the multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component;

[0142] In the specific implementation process of the present invention, the specific steps may be:

[0143] S161: freeze the clamping tool and monitor the clamping of the clamping tool on the electronic component in real time;

[0144] S162: When the clamping tool approaches the electronic component, the conveying speed of the electronic component and the clamping speed of the clamping tool are collected, and the conveying speed of the electronic component and the clamping speed of the clamping tool are dynamically interacted to maintain synchronization between the conveying speed of the electronic component and the clamping speed of the clamping tool;

[0145] S163: collecting clamping forces and clamping angles of multiple clamping points according to the clamping of the electronic component by the clamping tool;

[0146] S164: Associating the clamping forces of the plurality of clamping points, the corresponding clamping angles, and the posture balance coefficient of the electronic component;

[0147] S165: defining a first system coefficient according to the clamping forces of the plurality of clamping points and the corresponding clamping angles, and defining a second system coefficient according to the clamping forces of the plurality of clamping points and the posture balance coefficient of the electronic component;

[0148] S166: Constructing a dynamic clamping system for the electronic component according to the first system coefficient, the second system coefficient and the electronic component.

[0149] In the specific implementation process of the present invention, multiple clamping points are defined based on the clamping combination, the position of the electronic component and the current posture of the electronic component, and a corresponding clamping tool is constructed according to the multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component; the conveying speed of the electronic component and the clamping speed of the clamping tool are dynamically interacted, and the clamping strength and clamping angle of multiple clamping points are collected according to the clamping of the electronic component by the clamping tool; a dynamic clamping system for the electronic component is constructed according to the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, which is compatible with the overall consideration of the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, and realizes multi-dimensional control of the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, thereby ensuring the accuracy of the dynamic clamping system of the electronic component and realizing dynamic clamping, clamping control and dynamic protection of the electronic component.

[0150] At this time, the clamping tool is frozen, and the clamping of the electronic component by the clamping tool is monitored in real time, and the clamping of the electronic component by the clamping tool is controlled. At the same time, when the clamping tool approaches the electronic component, the conveying speed of the electronic component and the clamping speed of the clamping tool are collected, and the conveying speed of the electronic component and the clamping speed of the clamping tool are dynamically interacted to maintain the synchronization of the conveying speed of the electronic component and the clamping speed of the clamping tool, thereby ensuring the synchronization of the conveying speed of the electronic component and the clamping speed of the clamping tool, realizing the dynamic clamping of the electronic component by the clamping tool, and ensuring the clamping stability of the electronic component.

[0151] Furthermore, the clamping force and clamping angle of multiple clamping points are collected based on the clamping of the electronic component by the clamping tool, and the clamping force and clamping angle of multiple clamping points are introduced. At the same time, the clamping force of multiple clamping points, the corresponding clamping angle and the posture balance coefficient of the electronic component are associated, and the clamping force of multiple clamping points, the corresponding clamping angle and the posture balance coefficient of the electronic component are introduced. The clamping force of multiple clamping points, the corresponding clamping angle and the posture balance coefficient of the electronic component are considered as a whole.

[0152] Therefore, a first system coefficient is defined according to the clamping force of multiple clamping points and the corresponding clamping angles, and a second system coefficient is defined according to the clamping force of multiple clamping points and the posture balance coefficient of the electronic component; a dynamic clamping system for electronic components is constructed according to the first system coefficient, the second system coefficient and the electronic components, which is compatible with the first system coefficient, the second system coefficient and the overall consideration of the electronic components, and realizes multi-dimensional control of the first system coefficient, the second system coefficient and the electronic components, ensuring the accuracy of the dynamic clamping system of the electronic components, thereby accurately controlling the clamping of the electronic components by the clamping tool based on the dynamic clamping system of the electronic components, ensuring the accuracy of the dynamic clamping system of the electronic components, and realizing dynamic clamping, clamping control and dynamic protection of the electronic components.

[0153] In an embodiment of the present invention, through the method in the embodiment of the present invention, multiple surfaces of an electronic component are collected based on the dynamic transportation of the electronic component; a corresponding detection model is defined according to the multiple surfaces of the electronic component, the posture of the electronic component and the transportation speed of the electronic component; a corresponding clamping area is defined based on the multiple surfaces of the electronic component and the corresponding detection model; a clamping combination is defined according to the clamping area, the corresponding surface and the overall shape of the electronic component, thereby realizing synchronous detection of multiple surfaces of the electronic component, and introducing the clamping area, the corresponding surface and the overall shape of the electronic component in the synchronous detection, thereby realizing multi-dimensional control of the clamping area, the corresponding surface and the overall shape of the electronic component, and ensuring the accuracy of the clamping combination.

[0154] Furthermore, multiple clamping points are defined based on the clamping combination, the position of the electronic component and the current posture of the electronic component, and a corresponding clamping tool is constructed according to the multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component; the conveying speed of the electronic component and the clamping speed of the clamping tool are dynamically interacted, and the clamping strength and clamping angle of multiple clamping points are collected according to the clamping of the electronic component by the clamping tool; a dynamic clamping system for the electronic component is constructed according to the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, which is compatible with the overall consideration of the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, and realizes multi-dimensional control of the clamping strength of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component, thereby ensuring the accuracy of the dynamic clamping system of the electronic component and realizing dynamic clamping, clamping control and dynamic protection of the electronic component.

[0155] See also Figure 8 , Figure 8 It is a schematic diagram of the structural composition of a multi-faceted detection system based on electronic components in an embodiment of the present invention.

[0156] like Figure 8 As shown, a multi-faceted detection system based on electronic components, the multi-faceted detection system based on electronic components comprises:

[0157] A collection module 21, used for collecting multiple surfaces of the electronic component based on the dynamic transportation of the electronic component;

[0158] A detection module 22, used to define a corresponding detection model according to multiple surfaces of the electronic component, the posture of the electronic component and the conveying speed of the electronic component;

[0159] A clamping area module 23, used to define corresponding clamping areas based on multiple surfaces of the electronic component and corresponding detection models;

[0160] A clamping combination module 24, for defining a clamping combination according to a clamping area, a corresponding surface and an overall shape of an electronic component;

[0161] A clamping tool module 25 is used to define multiple clamping points based on the clamping combination, the position of the electronic component and the current posture of the electronic component, and to construct a corresponding clamping tool according to the multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component;

[0162] The dynamic clamping system module 26 is used to dynamically interact the conveying speed of the electronic component and the clamping speed of the clamping tool, and collect the clamping force and clamping angle of multiple clamping points according to the clamping of the electronic component by the clamping tool, and construct a dynamic clamping system for the electronic component according to the clamping force of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component.

[0163] See also Fig. 9 , refer to the following Fig. 9 The electronic device 40 according to this embodiment of the present invention will be described. Fig. 9 The electronic device 40 shown is only an example and should not bring any limitation to the functions and scope of use of the embodiments of the present invention.

[0164] like Fig. 9 As shown, the electronic device 40 is in the form of a general computing device. The components of the electronic device 40 may include but are not limited to: at least one processing unit 41, at least one storage unit 42, and a bus 43 connecting different system components (including the storage unit 42 and the processing unit 41).

[0165] The storage unit stores program codes, which can be executed by the processing unit 41, so that the processing unit 41 executes the steps according to various exemplary embodiments of the present invention described in the above “Embodiment Method” section of this specification.

[0166] The storage unit 42 may include a readable medium in the form of a volatile storage unit, such as a random access memory unit (RAM) 421 and / or a cache memory unit 422 , and may further include a read-only memory unit (ROM) 423 .

[0167] The storage unit 42 may also include a utility 424 having a set (at least one) of program modules 425, such program modules 425 including but not limited to: an operating system, one or more application programs, other program modules and program data, each of which or some combination may include the implementation of a network environment.

[0168] Bus 43 may represent one or more of several types of bus structures, including a memory unit bus or memory unit controller, a peripheral bus, an accelerated graphics port, a processing unit, or a local bus using any of a variety of bus architectures.

[0169] The electronic device 40 may also communicate with one or more external devices (e.g., keyboards, pointing devices, Bluetooth devices, etc.), one or more devices that enable a user to interact with the electronic device 40, and / or any device that enables the electronic device 40 to communicate with one or more other computing devices (e.g., routers, modems, etc.). Such communication may be performed via an input / output (I / O) interface 44. Furthermore, the electronic device 40 may also communicate with one or more networks (e.g., a local area network (LAN), a wide area network (WAN), and / or a public network, such as the Internet) via a network adapter 45. Fig. 9 As shown, the network adapter 45 communicates with other modules of the electronic device 40 via the bus 43. It should be understood that although Fig. 9 Not shown, other hardware and / or software modules may be used in conjunction with the electronic device 40, including but not limited to: microcode, device drivers, redundant processing units, external disk drive arrays, RAID systems, tape drives, and data backup planning systems.

[0170] Through the description of the above implementation, it is easy for those skilled in the art to understand that the example implementation described here can be implemented by software, or by software combined with necessary hardware. Therefore, the technical solution according to the implementation of the present disclosure can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (which can be a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, and includes a number of instructions to enable a computing device (which can be a personal computer, a server, a terminal device, or a network device, etc.) to execute the method according to the implementation of the present disclosure.

[0171] Those skilled in the art can understand that all or part of the steps in the various methods of the above embodiments can be completed by instructing related hardware through a program, and the program can be stored in a computer-readable storage medium, and the storage medium can include: a read-only memory (ROM), a random access memory (RAM), a disk or an optical disk, etc. In addition, it stores computer program instructions, and when the computer program instructions are executed by a computer, the computer executes the above method.

[0172] In addition, the above is a detailed introduction to the multi-faceted detection method and system based on electronic parts provided by the embodiments of the present invention. Specific examples are used in this article to illustrate the principles and implementation methods of the present invention. The description of the above embodiments is only used to help understand the method of the present invention and its core idea; at the same time, for general technical personnel in this field, according to the ideas of the present invention, there will be changes in the specific implementation methods and application scopes. In summary, the content of this specification should not be understood as a limitation on the present invention.

Claims

1. A multi-faceted detection method based on electronic components, characterized in that: Applied to multi-faceted inspection scenarios based on electronic parts; The multi-faceted detection method based on electronic components comprises: Collecting multiple surfaces of the electronic component based on the dynamic transport of the electronic component; Defining a corresponding detection model according to multiple surfaces of the electronic component, the posture of the electronic component, and the conveying speed of the electronic component; Defining corresponding clamping areas based on multiple surfaces of the electronic component and corresponding detection models; Define the clamping combination according to the clamping area, the corresponding surface and the overall shape of the electronic component; Based on the clamping combination, the position of the electronic component and the current posture of the electronic component, a plurality of clamping points are defined, and a corresponding clamping tool is constructed according to the plurality of clamping points, the overall shape of the electronic component and the core area of ​​the electronic component; The conveying speed of the electronic component and the clamping speed of the clamping tool interact dynamically, and the clamping force and clamping angle of multiple clamping points are collected according to the clamping of the electronic component by the clamping tool. A dynamic clamping system for the electronic component is constructed based on the clamping force of multiple clamping points, the corresponding clamping angles and the posture balance coefficient of the electronic component.

2. The multi-faceted detection method based on electronic components according to claim 1, characterized in that: The method of collecting multiple surfaces of the electronic parts based on the dynamic transportation of the electronic parts includes: Collect transmission signals of electronic components; Defining the conveying position of the electronic component based on the tracing of the conveying signal of the electronic component; Triggering the marking of the electronic component according to the conveying position of the electronic component, and triggering dynamic monitoring of the electronic component along the marking of the electronic component; In the dynamic monitoring of the electronic component, the flip node of the electronic component is collected, and multiple frames are shot based on the flip node of the electronic component to collect an image set; A corresponding screening mechanism is defined according to the image set and the three-dimensional model of the electronic component, and multiple surfaces of the electronic component are collected according to dynamic screening combined with the screening mechanism and the images.

3. The multi-faceted detection method based on electronic components according to claim 1, characterized in that: The method of defining a corresponding detection model according to the multiple surfaces of the electronic component, the posture of the electronic component and the conveying speed of the electronic component includes: Freeze multiple surfaces of electronic components; Based on the matching of the multiple surfaces of the electronic component, a corresponding matching coefficient is defined, and according to the matching coefficient and the connecting part of two adjacent surfaces, a complete coefficient of the multiple surfaces of the electronic component is defined; If the integrity coefficients of the multiple surfaces of the electronic component are greater than a preset integrity coefficient threshold, the posture of the electronic component and the conveying speed of the electronic component are collected; Associating multiple surfaces of the electronic component, the posture of the electronic component, and the conveying speed of the electronic component; A first training set is defined based on multiple surfaces of the electronic component and the posture of the electronic component, and a second training set is defined based on multiple surfaces of the electronic component and the conveying speed of the electronic component; A corresponding detection model is defined based on the first training set, the second training set and the corresponding model training system.

4. The multi-faceted detection method based on electronic components according to claim 3, characterized in that: The method of defining corresponding clamping areas based on multiple surfaces of the electronic component and corresponding detection models includes: Freeze multiple surfaces of electronic components and match corresponding detection models to each surface; In each surface, a corresponding contour is defined based on each surface and a detection model; Define corresponding sub-clamping areas according to the contour, closed nodes and the electronic control part of the electronic component; Real-time monitoring of the sub-clamping area in each surface of the electronic component; A clamping area for electronic components is formed according to the association of a plurality of sub-clamping areas.

5. The multi-faceted detection method based on electronic components according to claim 4, characterized in that: Defining the clamping combination according to the clamping area, the corresponding surface and the overall shape of the electronic component includes: Freeze the clamping area; Dynamically interact with the clamping area and the corresponding surface; defining a first combination coefficient according to a dynamic interaction of the clamping region and the corresponding surface; Dynamically interact with the clamping area and the overall shape of the electronic parts; A second combination coefficient is defined according to the dynamic interaction of the clamping area and the overall shape of the electronic component; Constructing a corresponding combination mechanism based on the first combination coefficient and the second combination coefficient; The clamping area, the corresponding surface and the overall shape of the electronic component are associated, and the clamping combination is defined based on the clamping area, the corresponding surface, the overall shape of the electronic component and the combination mechanism.

6. The multi-faceted detection method based on electronic components according to claim 5, characterized in that: The method of defining a plurality of clamping points based on the clamping combination, the position of the electronic component and the current posture of the electronic component, and constructing a corresponding clamping tool according to the plurality of clamping points, the overall shape of the electronic component and the core area of ​​the electronic component includes: Fixed frame clamping combination; Locate the position of the electronic component, and collect the current posture of the electronic component based on the positioning detection of the position of the electronic component; Associating the clamping combination, the location of the electronic component, and the current posture of the electronic component; A plurality of clamping points are defined according to the clamping combination, the position of the electronic component and the current posture of the electronic component.

7. The multi-faceted detection method based on electronic components according to claim 6, characterized in that: The method further comprises: defining a plurality of clamping points based on the clamping combination, the position of the electronic component and the current posture of the electronic component, and constructing a corresponding clamping tool according to the plurality of clamping points, the overall shape of the electronic component and the core area of ​​the electronic component. Defining a core area of ​​the electronic component based on the traversal of the electronic component, and associating a plurality of clamping points, an overall shape of the electronic component, and the core area of ​​the electronic component; According to the multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component, the corresponding clamping scene is matched, the clamping action trajectory is simulated according to the clamping scene, multiple clamping points and the clamping tool producer, and the corresponding clamping tool is constructed according to the clamping action trajectory and the electronic component.

8. The multi-faceted detection method based on electronic components according to claim 7, characterized in that: The electronic component conveying speed and the clamping speed of the clamping tool are dynamically interacted, and the clamping force and clamping angle of multiple clamping points are collected according to the clamping of the electronic component by the clamping tool, and a dynamic clamping system of the electronic component is constructed according to the clamping force of multiple clamping points, the corresponding clamping angle and the posture balance coefficient of the electronic component, including: Freeze the clamping tool and monitor the clamping of the electronic parts by the clamping tool in real time; When the clamping tool approaches the electronic component, the conveying speed of the electronic component and the clamping speed of the clamping tool are collected, and the conveying speed of the electronic component and the clamping speed of the clamping tool are dynamically interacted to maintain the synchronization of the conveying speed of the electronic component and the clamping speed of the clamping tool.

9. The multi-faceted detection method based on electronic components according to claim 8, characterized in that: The electronic component conveying speed and the clamping speed of the clamping tool are dynamically interacted, and the clamping force and clamping angle of multiple clamping points are collected according to the clamping of the electronic component by the clamping tool, and a dynamic clamping system for the electronic component is constructed according to the clamping force of multiple clamping points, the corresponding clamping angle and the posture balance coefficient of the electronic component, and also includes: The clamping force and the clamping angle of multiple clamping points are collected according to the clamping of the electronic component by the clamping tool; Associating the clamping force of multiple clamping points, the corresponding clamping angle and the posture balance coefficient of the electronic component; A first system coefficient is defined according to the clamping forces of the multiple clamping points and the corresponding clamping angles, and a second system coefficient is defined according to the clamping forces of the multiple clamping points and the posture balance coefficient of the electronic component; A dynamic clamping system for the electronic component is constructed according to the first system coefficient, the second system coefficient and the electronic component.

10. A multi-faceted inspection system based on electronic components, characterized in that: The multi-faceted detection system based on electronic components is applied to the multi-faceted detection method based on electronic components as claimed in any one of claims 1 to 9, and the multi-faceted detection system based on electronic components includes: A collection module, used for collecting multiple surfaces of the electronic component based on the dynamic transportation of the electronic component; A detection module, used to define a corresponding detection model according to multiple surfaces of the electronic component, the posture of the electronic component and the conveying speed of the electronic component; A clamping area module, used to define corresponding clamping areas based on multiple surfaces of the electronic component and corresponding detection models; A clamping combination module, used to define a clamping combination according to the clamping area, the corresponding surface and the overall shape of the electronic component; A clamping tool module is used to define multiple clamping points based on the clamping combination, the position of the electronic component and the current posture of the electronic component, and to construct a corresponding clamping tool according to the multiple clamping points, the overall shape of the electronic component and the core area of ​​the electronic component; The dynamic clamping system module is used to dynamically interact the conveying speed of the electronic component and the clamping speed of the clamping tool, and collect the clamping force and clamping angle of multiple clamping points according to the clamping of the electronic component by the clamping tool, and build a dynamic clamping system for the electronic component based on the clamping force of multiple clamping points, the corresponding clamping angle and the posture balance coefficient of the electronic component.

Images