Complete machine thermal image monitoring and heat dissipation system and method for thin film capacitor

Abstract

The invention discloses a thermal image monitoring and heat dissipation system and method for a whole thin film capacitor, and belongs to the field of thin film capacitor monitoring. The system adopts an infrared thermal image technology to research the thermal state of the whole thin film capacitor, and can perform visual imaging and real-time monitoring on the surface thermal state of the whole thin film capacitor during operation; meanwhile, in order to guarantee reliable operation of the whole machine and prevent damage caused by too high temperature, the heat dissipation device is adopted for effective heat dissipation of the whole machine; besides, in consideration of the fact that the infrared CCD is a precise instrument and the temperature of the working environment of the infrared CCD affects the imaging effect of the infrared CCD, an intelligent heat dissipation system for the infrared CCD is set to cool the infrared CCD in time, so that dark current noise is reduced, and image quality is improved. In conclusion, the system provided by the invention is simple in structure, the monitoring and heat dissipation method is convenient and effective, and the operability is high.

Description

Technical Field

[0001] The present invention belongs to the field of film capacitor monitoring, and more specifically, relates to a film capacitor complete machine thermal imaging monitoring and heat dissipation system and method. Background Art

[0002] Film capacitors play a key role in filtering, energy storage and voltage stabilization in electronic equipment. During operation, when the current carried by the capacitor exceeds its rated value, heat will be generated due to internal resistance. The capacitor will have certain internal losses during the charging and discharging process, which are converted into heat. Over time, the internal materials of the capacitor may age, resulting in a decline in its performance, including heat dissipation performance, which will cause the operating temperature of the entire machine to rise. If the temperature of the entire machine is too high, it may accelerate the aging process of the internal materials of the film capacitor, reduce its service life, accelerate the chemical reaction inside the capacitor, form thermal runaway, further increase the temperature, affect the dielectric properties of the film capacitor, cause its capacity to decrease or increase losses, cause thermal expansion of the internal or external structure of the capacitor, affect its mechanical stability, reduce the insulation resistance of the capacitor, increase leakage current, and even cause insulation breakdown, reduce its self-healing function, affect the connection stability of the capacitor terminals or solder joints, and cause poor contact or disconnection. In extreme cases, high temperatures may cause capacitors to rupture, catch fire or other forms of failure, posing a safety hazard. Summary of the invention

[0003] In view of the above defects or improvement needs of the prior art, the present invention provides a thermal imaging monitoring and heat dissipation system and method for a film capacitor as a whole, which can ensure the stable and reliable operation of the film capacitor and the whole machine.

[0004] To achieve the above-mentioned object, according to a first aspect of the present invention, a film capacitor thermal imaging monitoring and heat dissipation system is provided, including a first intelligent heat dissipation system and a second intelligent heat dissipation system;

[0005] The first intelligent heat dissipation system includes an infrared lens, an infrared CCD, a thermal imaging device, a thermal imaging monitor, an infrared camera device, a host computer, a microprocessor and a first cooling device;

[0006] The infrared lens is used to collect infrared radiation signals of the target film capacitor; the infrared CCD is used to convert the infrared radiation signals into electrical signals; the thermal imaging device is used to process the electrical signals to obtain a thermal image of the target film capacitor; the thermal imaging monitor is used to analyze the thermal image to obtain the operating temperature of the target film capacitor; the host computer is used to control the first cooling device to cool the target film capacitor through a microprocessor when the operating temperature of the target film capacitor exceeds a first threshold value;

[0007] The second intelligent heat dissipation system includes a temperature sensor, a microcontroller and a second cooling device;

[0008] The temperature sensor is used to detect the working temperature of the infrared CCD, and the microcontroller is used to control the second cooling device to cool the infrared CCD when the working temperature of the infrared CCD exceeds a second threshold.

[0009] According to a second aspect of the present invention, a method for thermal imaging monitoring and heat dissipation of a film capacitor is provided, which is applied to the thermal imaging monitoring and heat dissipation system of the film capacitor as described in the first aspect, comprising:

[0010] monitoring the operating temperature of the target film capacitor in real time, and controlling the first cooling device to cool the target film capacitor through a microprocessor when the operating temperature exceeds a first threshold;

[0011] The operating temperature of the infrared CCD is monitored in real time, and when the operating temperature exceeds the second threshold, the second cooling device is controlled to cool the infrared CCD.

[0012] In general, the above technical solutions conceived by the present invention can achieve the following beneficial effects compared with the prior art:

[0013] The system provided by the present invention adopts infrared thermal imaging technology to study the thermal state of the film capacitor as a whole machine, designs a non-contact, high-sensitivity temperature measurement method, can monitor the temperature distribution changes and thermal state of the film capacitor as a whole machine in real time, and record thermal image information, providing instant feedback for thermal design and fault diagnosis; by visualizing and real-time monitoring the surface thermal state of the film capacitor as a whole machine during operation, the reliability temperature rise data of the whole machine during operation is obtained, and at the same time, in order to ensure the reliable operation of the whole machine and prevent the harm caused by excessive temperature, the designed heat dissipation device can effectively dissipate the heat; in addition, considering that the infrared CCD is a precision instrument, the temperature of its working environment affects its imaging effect, so an intelligent heat dissipation system for the infrared CCD is set to cool it in time to reduce dark current noise and improve image quality; in summary, the system structure provided by the present invention is simple, the monitoring and heat dissipation methods are convenient and effective, and the operability is strong.

[0014] Furthermore, the method provided by the present invention uses a coolant circulation device to cool the entire film capacitor, which can effectively absorb and transfer a large amount of heat. The circulating coolant helps to evenly distribute the heat and avoid the generation of local hot spots. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 A schematic diagram of a thermal imaging monitoring and heat dissipation system for a film capacitor provided in an embodiment of the present invention;

[0016] Figure 2A schematic flow chart of a method for thermal imaging monitoring and heat dissipation of a film capacitor provided in an embodiment of the present invention. DETAILED DESCRIPTION

[0017] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention. In addition, the technical features involved in the various embodiments of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0018] In order to ensure the stable and reliable operation of the film capacitor and the whole machine, appropriate heat dissipation measures need to be taken. Therefore, there is an urgent need for thermal imaging monitoring and heat dissipation methods for the film capacitor whole machine, which is of great significance to the reliability of the operation of the film capacitor whole machine. Based on this, the embodiment of the present invention provides a thermal imaging monitoring and heat dissipation system for the film capacitor whole machine, such as Figure 1 As shown, it includes a first intelligent cooling system and a second intelligent cooling system;

[0019] The first intelligent heat dissipation system includes an infrared lens, an infrared CCD, a thermal imaging device, a thermal imaging monitor, an infrared camera device, a host computer, a microprocessor and a first cooling device;

[0020] The infrared lens is used to collect infrared radiation signals of the target film capacitor; the infrared CCD is used to convert the infrared radiation signals into electrical signals; the thermal imaging device is used to process the electrical signals to obtain a thermal image of the target film capacitor; the thermal imaging monitor is used to analyze the thermal image to obtain the operating temperature of the target film capacitor; the host computer is used to control the first cooling device to cool the target film capacitor through a microprocessor when the operating temperature of the target film capacitor exceeds a first threshold value;

[0021] The second intelligent heat dissipation system includes a temperature sensor, a microcontroller and a second cooling device;

[0022] The temperature sensor is used to detect the working temperature of the infrared CCD, and the microcontroller is used to control the second cooling device to cool the infrared CCD when the working temperature of the infrared CCD exceeds a second threshold.

[0023] Preferably, the host computer is also used to display the operating temperature of the target film capacitor.

[0024] Preferably, the first intelligent heat dissipation system further comprises an infrared camera for analyzing the thermal image to obtain the thermal distribution of the target film capacitor and transmitting it to a host computer for viewing by a user.

[0025] Preferably, the operating temperature of the target film capacitor is the highest temperature of the entire surface of the film capacitor.

[0026] Preferably, the first cooling device is a cooling liquid circulation device.

[0027] Preferably, the second cooling device is a thermoelectric refrigerator.

[0028] Specifically, the thermal imaging monitoring and heat dissipation system of the film capacitor provided in the embodiment of the present invention includes an infrared lens, an infrared CCD, a temperature sensor, a single-chip microcontroller, a thermoelectric cooler, a thermal imaging device, an infrared camera device, a thermal imaging monitor, a host computer, a microprocessor and a coolant circulation device, wherein:

[0029] The infrared lens is used for infrared imaging, and can transmit infrared radiation of a specific wavelength, thereby optimizing the light transmittance and imaging quality of the infrared band;

[0030] The infrared CCD is an imaging sensor for detecting infrared radiation and is capable of converting infrared radiation into electrical signals;

[0031] The temperature sensor is used to detect the working temperature of the infrared CCD and output a temperature signal to the single chip microcontroller;

[0032] The single chip microcontroller receives the signal of the temperature sensor, and when the working temperature of the infrared CCD exceeds the set threshold, outputs a control signal to the thermoelectric cooler to cool the infrared CCD;

[0033] The thermoelectric cooler receives the signal from the single-chip microcontroller and cools down the infrared CCD to reduce dark current noise and improve image quality.

[0034] The thermal imaging device processes the infrared radiation electrical signal to obtain a visual thermal image; the infrared image monitored by the infrared camera device records the heat distribution;

[0035] The thermal imaging monitor monitors the temperature change of the device under test and the thermal state during operation in real time;

[0036] The host computer allows the user to operate the camera system, such as adjusting settings, viewing images, etc., presenting the infrared thermal image information of the equipment in real time, and regulating the microprocessor to control the coolant circulation device;

[0037] The microprocessor receives a signal from a host computer and outputs a signal to a coolant circulation device;

[0038] The coolant circulation device receives the microprocessor signal and transfers the heat generated by the device to cool down and dissipate the heat of the device.

[0039] An embodiment of the present invention provides a method for thermal imaging monitoring and heat dissipation of a film capacitor as a whole machine, which is applied to a thermal imaging monitoring and heat dissipation system of a film capacitor as described in any of the above embodiments, including:

[0040] monitoring the operating temperature of the target film capacitor in real time, and controlling the first cooling device to cool the target film capacitor through a microprocessor when the operating temperature exceeds a first threshold;

[0041] The operating temperature of the infrared CCD is monitored in real time, and when the operating temperature exceeds the second threshold, the second cooling device is controlled to cool the infrared CCD.

[0042] Specifically, the method provided by the present invention comprises:

[0043] (1) Prepare the target film capacitor equipment and start the equipment. Make circuit connections and start each device.

[0044] (2) Start the infrared imaging lens, adjust the appropriate focal length, and accurately and effectively collect the infrared radiation signal of the target film capacitor.

[0045] (3) Start the infrared CCD, i.e., the infrared imaging sensor, to detect the infrared radiation energy signal emitted by the target film capacitor and convert the infrared radiation signal into an electrical signal.

[0046] (4) The temperature sensor monitors the working temperature of the infrared CCD in real time and transmits the temperature signal to the single-chip microcontroller. The single-chip microcontroller receives the temperature signal and makes a set temperature judgment. When the set temperature T0 (i.e., the first threshold) is reached, the thermoelectric cooler is controlled, thereby starting the thermoelectric cooler to cool the infrared CCD sensor, reduce dark current noise, and improve image quality.

[0047] (5) The thermal imaging device receives and processes the infrared radiation electrical signal to obtain a visual thermal image, which is then transmitted to the thermal imaging monitor.

[0048] (6) The thermal imaging monitor receives and collects thermal images, monitors the temperature changes of the equipment under test and the thermal status during operation in real time, and transmits them to the user host computer interface.

[0049] (7) The user host computer interface presents real-time equipment operating temperature changes and thermal status imaging. Set the threshold temperature T1 (i.e., the second threshold) for equipment operation, determine whether it exceeds the threshold temperature, and control the coolant circulation device through the microprocessor. When the threshold temperature T1 is exceeded, the microprocessor receives the host computer signal and outputs the signal to the coolant circulation device.

[0050] (8) The coolant circulation device starts the pump or other driving equipment to make the coolant start to flow in the circulation system, absorbing the heat generated by the equipment, thereby cooling and dissipating the film capacitor equipment.

[0051] For example, assuming that the initial ambient temperature is 25°C, when the machine is running, the host computer can monitor the thermal state image and temperature rise of the target film capacitor in real time. Set T0 to 60°C. When the temperature of the infrared CCD sensor exceeds 60°C, the single-chip microcomputer controls the thermoelectric cooler to cool it down to 10°C. Set T1 to 70°C. When the host computer detects that the maximum surface temperature of the whole machine exceeds 70°C, the microprocessor is started to control the coolant circulation device to cool the film capacitor to 30 degrees Celsius.

[0052] Preferably, when the first cooling device is a coolant circulation device and the operating temperature of the target film capacitor exceeds a first threshold, the coolant flow rate in the coolant circulation device is proportional to the percentage by which the operating temperature of the target film capacitor exceeds the first threshold.

[0053] Specifically, through the control system, the flow rate and temperature of the coolant can be accurately adjusted to adapt to different heat dissipation requirements. For example, a maximum temperature threshold is set. When the temperature exceeds 60°C, it is considered that the flow rate needs to be adjusted. When the temperature exceeds 10% of 70°C (i.e. 77°C), the flow rate is adjusted to increase the coolant flow rate by 10%. A minimum temperature threshold is set. When the temperature drops to 40°C, it is considered that the flow rate needs to be adjusted. When the temperature drops to 90% of 30°C (i.e. 27°C), the flow rate is adjusted to reduce the coolant flow rate by 10%.

[0054] It will be easily understood by those skilled in the art that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A thermal imaging monitoring and heat dissipation system for a film capacitor, characterized in that: including a first intelligent cooling system and a second intelligent cooling system; The first intelligent heat dissipation system includes an infrared lens, an infrared CCD, a thermal imaging device, a thermal imaging monitor, an infrared camera, a host computer, a microprocessor and a first cooling device; The infrared lens is used to collect infrared radiation signals of the target film capacitor; the infrared CCD is used to convert the infrared radiation signals into electrical signals; the thermal imaging device is used to process the electrical signals to obtain a thermal image of the target film capacitor; the thermal imaging monitor is used to analyze the thermal image to obtain the operating temperature of the target film capacitor; the host computer is used to control the first cooling device to cool the target film capacitor through a microprocessor when the operating temperature of the target film capacitor exceeds a first threshold value; The second intelligent heat dissipation system includes a temperature sensor, a microcontroller and a second cooling device; The temperature sensor is used to detect the working temperature of the infrared CCD, and the microcontroller is used to control the second cooling device to cool the infrared CCD when the working temperature of the infrared CCD exceeds a second threshold.

2. The system according to claim 1, characterized in that The host computer is also used to display the operating temperature of the target film capacitor.

3. The system according to claim 1 or 2, characterized in that: The first intelligent heat dissipation system also includes an infrared camera for analyzing the thermal image to obtain the heat distribution of the target film capacitor and transmit it to a host computer.

4. The system according to claim 3, characterized in that The target operating temperature of the film capacitor is the highest temperature on the surface of the entire capacitor.

5. The system according to claim 1, wherein: The first cooling device is a cooling liquid circulation device.

6. The system according to claim 1, wherein: The second cooling device is a thermoelectric refrigerator.

7. A method for thermal imaging monitoring and heat dissipation of a film capacitor, applied to the thermal imaging monitoring and heat dissipation system of a film capacitor as claimed in any one of claims 1 to 6, characterized in that: include: monitoring the operating temperature of the target film capacitor in real time, and controlling the first cooling device to cool the target film capacitor through a microprocessor when the operating temperature exceeds a first threshold; The operating temperature of the infrared CCD is monitored in real time, and when the operating temperature exceeds the second threshold, the second cooling device is controlled to cool the infrared CCD.

8. The method according to claim 7, characterized in that When the first cooling device is a coolant circulation device, and the operating temperature of the target film capacitor exceeds a first threshold, the coolant flow rate in the coolant circulation device is proportional to the percentage by which the operating temperature of the target film capacitor exceeds the first threshold.

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