A high-efficiency radio frequency light emitting component package structure

Abstract

The present invention relates to the technical field of radio frequency optical transmission component packaging, and in particular to a high-efficiency radio frequency optical transmission component packaging structure, comprising a temperature-controlled coaxial laser, a packaging shell, a microwave processing unit, and a drive control unit; the packaging shell comprises an outer shell, a radio frequency input port, a middle cover plate, an upper cover plate, a lower cover plate, a coupling terminal, and a through-wall connection terminal. The microwave circuit, control drive circuit, gold wire bonding process, and shell structure design of the high-efficiency radio frequency optical transmission component packaging structure of the present invention are all designed and simulated using simulation software such as ADS / HFSS / MATLAB / CAXA, ultimately realizing high-efficiency packaging of a multifunctional radio frequency optical transmission component that integrates electrical / optical conversion within 18 GHz, automatic optical power control (APC) of the laser, automatic temperature control (ATC), and radio frequency signal processing.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of radio frequency optical transmission component packaging, in particular to an efficient radio frequency optical transmitting component packaging structure. BACKGROUND

[0002] In recent years, small-sized radio frequency optoelectronic components are widely applied to radio frequency signal remote transmission in scenarios such as satellite communication, electronic countermeasures, electromagnetic spectrum sensing and monitoring. Since such application scenarios have rigid requirements such as small size, low power consumption, high reliability and high environmental adaptability, high integration and packaging requirements are put forward for the radio frequency optoelectronic components. A radio frequency optical transmission link is mainly composed of an optical transmitting component and an optical receiving component connected to an optical fiber to form a transmission path. In a small-sized application scenario, the packaging structure of the optical receiving micro-component is relatively simple, and the application does not make a main description. At present, such small-sized radio frequency optoelectronic optical transmitting components generally adopt a radio frequency optoelectronic hybrid integration technology based on a BOX optoelectronic micro-assembly process to uniformly package optical (electrical) bare chips, optical elements and circuit boards in a single shell to form a structure with air tightness. However, this packaging structure has the following disadvantages: 1. The standardization degree of the optical path design is not high, and needs to be specially designed according to the optical element or structure layout; 2. The optical path assembly has high difficulty, low efficiency and high precision; 3. The optical path cannot be fully automated, and the yield and consistency are relatively low; 4. The optical path packaging part is difficult to maintain; 5. Special fixtures need to be customized for components of different sizes, which has a long cycle and high cost.

[0003] A coaxial optical device is a device packaging widely applied to high-speed digital optical transmission, which has the advantages of high standardization, mature process, large batch production capacity, full automation, good reliability, good consistency, low cost and high industrialization degree. In recent years, due to the increasing application of civilian security level wavelength division multiplexing (DWDM) optical transmission and the wide promotion of ROF in 5G base station signal transmission and all-optical WIFI, the integration of industrial temperature-controlled coaxial lasers has been rapidly improved. At present, TO56 laser packaging can be integrated with COC, semiconductor cooler (TEC), small-sized lens and optical isolator containing loaded optical chips, and the integration and key optoelectronic technology indicators are comparable to those of laser packaging based on the BOX optoelectronic micro-assembly process, and the same air tightness is also provided. Due to the obvious advantages of large volume and mature industrial support of the coaxial optical device, high-performance and high-environmental-adaptability devices selected through large samples have the possibility to be applied to high-reliability demand platforms, and the cost performance and packaging efficiency are extremely high.

[0004] However, the temperature-controlled coaxial laser also has the disadvantages of poor heat dissipation performance and difficulty in integrated air-tight packaging with microwave bare chip circuits, which need to be overcome in design. SUMMARY

[0005] The application aims at making up for the deficiency of the BOX photoelectric micro-assembly process packaging technology, combining with the industrial advantage of the temperature control coaxial laser, and providing a high-efficiency radio frequency light emitting assembly packaging structure, which realizes the high-density integration of the temperature control coaxial laser, the driving control unit and the microwave processing unit in a small shell, and realizes the three-dimensional reinforced heat dissipation of the temperature control coaxial laser and the integrated airtight packaging of the micro-assembly.

[0006] To achieve the above-mentioned purpose, the application provides a high-efficiency radio frequency light emitting assembly packaging structure, which comprises a temperature control coaxial laser, a packaging shell, a microwave processing unit and a driving control unit.

[0007] The temperature control coaxial laser is connected with the shell and located inside the temperature control coaxial laser mounting cavity, the microwave processing unit is connected with the shell and located inside the microwave processing unit mounting cavity, and the driving control unit is connected with the shell and located inside the driving control unit mounting cavity.

[0008] The LD-pin of the temperature control coaxial laser satisfies 50Ω impedance matching, and the internal bias inductance selects a tapered inductance.

[0009] The LD-pin of the temperature control coaxial laser is a radio frequency input pin, which maintains a distance greater than 1.5mm from other pins in the pin packaging layout, and is connected with the microwave processing unit; the CASE pin of the temperature control coaxial laser is welded on the Kovar isolation layer between the microwave processing unit mounting cavity and the driving control unit mounting cavity, and other pins of the temperature control coaxial laser are connected with the corresponding pin pads of the driving control unit.

[0010] The temperature control coaxial laser mounting cavity uses tungsten copper material, other structural parts of the shell use Kovar alloy material, and the surface of the shell is gold-plated; the radio frequency input port, the coupling wiring terminal and the wall-penetrating connection terminal form an integrated structure with the shell by sintering or brazing.

[0011] The temperature control coaxial laser mounting cavity is divided into two separate cavities in the length direction, namely an outer cavity and an inner cavity, the outer cavity is close to the output light interface, and the inner cavity is close to the laser tube base electrical interface; the temperature control coaxial laser mounting cavity is punched through the entire tungsten copper frame in the middle, the through hole size is the outer diameter of the temperature control coaxial laser Φ d +0.1mm.

[0012] The outer cavity is a sealed cavity, and the inside is filled with epoxy structural adhesive; the inner cavity is a heat conduction cavity, and the inside is filled with high thermal conductivity heat conduction mud.

[0013] The middle cover plate is embedded on the upper part of the microwave processing unit mounting cavity and is fixed on the middle cover plate mounting screw thread boss of the microwave processing unit mounting cavity through screws.

[0014] The high-efficiency radio frequency light emitting assembly packaging structure of the application, microwave circuit, control driving circuit, gold wire bonding process and shell structure design are designed and simulated by using simulation software such as ADS / HFSS / MATLAB / CAXA, and finally the high-efficiency packaging of a multifunctional radio frequency light emitting assembly integrating current / light conversion, laser automatic optical power control (APC), automatic temperature control (ATC) and radio frequency signal processing within 18GHz can be realized; and the key technical problems such as three-dimensional heat dissipation of the light emitting assembly frame of the temperature control coaxial laser and gas tightness enhancement are solved. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the embodiments of the application or the prior art, the drawings needed to be used in the embodiment or prior art description will be briefly introduced.

[0016] Figure 1 It is a schematic diagram of the high-efficiency radio frequency light emitting assembly packaging structure of the application.

[0017] Figure 2 It is a schematic diagram of the typical pin arrangement of the application.

[0018] Figure 3 It is a schematic diagram of the assembly cross section of the temperature control coaxial laser of the application.

[0019] Figure 4 It is an implementation schematic diagram of the drive control unit of the application.

[0020] Figure 5 It is a schematic diagram of the drive control unit mounting structure of the application.

[0021] In the figure: 1-temperature control coaxial laser, 2-encapsulation shell, 3-microwave processing unit, 4-driving control unit, 5-outer shell, 6-radio frequency input port, 7-middle cover plate, 8-upper cover plate, 9-lower cover plate, 10-coupling terminal, 11-wall-penetrating connection terminal, 12-temperature control coaxial laser mounting cavity, 13-microwave processing unit mounting cavity, 14-power access cavity, 15-driving control unit mounting cavity, 16-outer cavity, 17-inner cavity, 18-cavity Kovar barrier, 19-laser driving control interface, 20-microwave processing unit power supply control interface, 21-external power supply / communication introduction interface, 22-high-frequency ceramic circuit board, 23-input interface microstrip, 24-output interface microstrip, 25-first positioning groove, 26-second positioning groove, 27-third positioning groove. DETAILED DESCRIPTION

[0022] The embodiments of the present application are described in detail below, examples of which are shown in the accompanying drawings, the embodiments described below by referring to the accompanying drawings are exemplary, and are intended to explain the present application, and cannot be understood as a limitation of the present application.

[0023] Please refer to Figures 1 to 5 , wherein Figure 1 is a schematic diagram of the high-efficiency radio frequency light emitting assembly packaging structure of the application, Figure 2 is a schematic diagram of the typical pin arrangement of the application, Figure 3 is a schematic diagram of the temperature control coaxial laser assembly cross section of the application, Figure 4 is a schematic diagram of the driving control unit implementation of the application, Figure 5 is a schematic diagram of the driving control unit mounting structure of the application.

[0024] The present application provides a high-efficiency radio frequency light emitting assembly packaging structure, comprising a temperature control coaxial laser 1, an encapsulation shell 2, a microwave processing unit 3 and a driving control unit 4, the encapsulation shell 2 comprises an outer shell 5, a radio frequency input port 6, a middle cover plate 7, an upper cover plate 8, a lower cover plate 9, a coupling terminal 10 and a wall-penetrating connection terminal 11, the outer shell 5 has a temperature control coaxial laser mounting cavity 12, a microwave processing unit mounting cavity 13, a power access cavity 14 and a driving control unit mounting cavity 15.

[0025] For this specific embodiment, the packaging shell 2 includes an outer shell 5, a radio frequency input port 6, a middle cover plate 7, an upper cover plate 8, a lower cover plate 9, a coupling terminal 10, and a wall connection terminal 11, the radio frequency input port 6 is connected with the outer shell 5 and located on one side of the outer shell 5, the middle cover plate 7 is embedded on the upper part of the microwave processing unit mounting cavity 13, the upper cover plate 8 is connected with the outer shell 5 and located on the top of the outer shell 5, the lower cover plate 9 is connected with the outer shell 5 and located on the bottom of the outer shell 5, the coupling terminal 10 is connected with the outer shell 5 and arranged on the outer shell 5, and the wall connection terminal 11 is connected with the outer shell 5 and arranged on the outer shell 5; the temperature-controlled coaxial laser 1 is connected with the outer shell 5 and located inside the temperature-controlled coaxial laser mounting cavity 12, the microwave processing unit 3 is connected with the outer shell 5 and located inside the microwave processing unit mounting cavity 13, and the drive control unit 4 is connected with the outer shell 5 and located inside the drive control unit mounting cavity 15.

[0026] The temperature-controlled coaxial laser 1 integrates TO tube base, tube cap (including aspherical lens), COC (loading laser chip, back light detector chip, bias inductor), thermistor, high-efficiency semiconductor refrigerator (TEC), optical isolator, tail fiber and other photoelectric elements, and can realize the functions of input of wideband radio frequency signal and electric / optical conversion, temperature control of laser chip, output of optical power through tail fiber and the like.

[0027] Further, the bias inductor should select a tapered inductor as the laser chip bias inductor in the wideband high-frequency light emitting assembly.

[0028] Further, the temperature-controlled coaxial laser 1 shell must be installed with a stainless steel metal jacket to enhance its structural strength and have better anti-shock and impact performance.

[0029] Further, the selection of the temperature-controlled coaxial laser 1 should be determined according to the technical requirements for use, including technical parameters such as tube base electrical interface type, working temperature, working bandwidth, wavelength, electric / optical conversion slope efficiency, maximum optical power, in-band flatness, noise coefficient, optical interface type, etc. In this embodiment, a temperature-controlled coaxial laser with an integrated wavelength of 1310 nm, a 25G rate DFB optical chip, an electric / optical conversion slope efficiency greater than 0.2 W / A after packaging, and a maximum fiber optical power greater than 10 mW is selected as an electric / optical conversion device.

[0030] Further, the temperature-controlled coaxial laser 1 needs to include the following pins, the actual object and the typical pin layout diagram are as shown in the accompanying drawings, and the application selects one of them as an embodiment. Figure 2

[0031] ​

[0032] Further, the temperature control coaxial laser 1 emits LD-pin as radio frequency input pin, which should be kept at a distance greater than 1.5mm from other pins in the pin packaging layout. The LD-assembly needs to be placed and welded (bonded) on the microwave processing unit 3. The CASE pin needs to be directly welded on the cavity Kovar barrier 18 between the microwave processing unit mounting cavity 13 and the drive control unit mounting cavity 15. Other pin assemblies need to be placed and welded on the corresponding pin pads of the drive control unit 4. The assembly cross-sectional view of the temperature control coaxial laser 1 is shown in Figure 3 .

[0033] Wherein, the size of the shell 5 varies according to the index parameters and the complexity of the function, but the specific packaging structure remains unchanged; the coupling terminal 10 refers to the terminal connecting the external power supply / communication signal of the assembly, which is fixed on the four peripheral sides of the shell 5; the through-wall connection terminal 11 is the terminal connecting the power supply and control driving signal of the upper and lower layers of the assembly, which is fixed on the internal cavity barrier of the assembly.

[0034] Further, the radio frequency input port 6 can be a general or special radio frequency interface such as SMA, SMP, SMPM, and button, which is fixed on the shell 5 by means of signal pin sintering, connector external screw fixing, or connector body welding.

[0035] Further, the temperature control coaxial laser mounting cavity 12 is designed as a tungsten-copper alloy frame structure to improve the heat dissipation and air tightness of the temperature control coaxial laser 1. It penetrates the shell 5 in the depth direction, with the upper top surface flush with the position of the upper cover plate 8 and the lower bottom surface flush with the bottom surface of the shell 5. The length direction size is equal to the external stainless steel sleeve of the temperature control coaxial laser 1, and the width direction size is Φd+1mm of the temperature control coaxial laser 1.

[0036] Further, the temperature control coaxial laser mounting cavity 12 is divided into two separate cavities in the length direction, namely the outer cavity 16 and the inner cavity 17. The outer cavity 16 is close to the output light interface, and the inner cavity 17 is close to the laser tube base electrical interface. The temperature control coaxial laser mounting cavity 12 has a through hole passing through the entire tungsten-copper frame in the middle. The through hole size is Φd+0.1mm of the temperature control coaxial laser 1. d

[0037] Further, the outer cavity 16 is designed as a sealed cavity, which needs to be filled with epoxy structural glue. This type of glue has low shrinkage and excellent sealing and waterproof performance. The inner cavity 17 is designed as a heat conduction cavity, which needs to be filled with high thermal conductivity heat conduction mud to enhance the heat conduction capacity of the entire frame. The operation timing of the epoxy glue and the filling of the heat conduction mud is after the completion of the assembly debugging test.

[0038] ​Further, the microwave processing unit installation cavity 13 is used to install the microwave processing unit 3, which is in a back-to-back structure with the drive control unit installation cavity 15, separated by a cavity Kovac spacer layer 18. The microwave processing unit 3 is connected to the drive control unit 4 through the wall connection terminal 11 passing through the cavity Kovac spacer layer 18. The cavity bottom is flat without protrusions. The microwave processing unit 3 is adhered to the cavity bottom through conductive glue, ensuring good contact between the bottom ground plane of the microwave processing unit 3 high-frequency circuit board and the cavity bottom. The upper part of the microwave processing unit installation cavity 13 is provided with middle cover plate 7 mounting screw hole positions for installing the middle cover plate 7.

[0039] Further, the coupling terminal 10 outside the shell 5 is connected to the wall connection terminal 11 inside the power access cavity 14, and the connection method is gold wire bonding or soft cable soldering.

[0040] Further, the drive control unit installation cavity 15 is used to install the drive control unit 4. The drive control unit installation cavity 15 is provided with an installation ground protrusion or screw mounting hole position. The drive control unit 4 is adhered to the gold-plated ground pad on the periphery of the bottom surface of the drive control unit 4 circuit board to the ground protrusion or uses a small screw to assemble on the screw mounting hole position on the cavity bottom. The upper part of the drive control unit 4 is reserved 1mm in height for installing the lower cover plate 9.

[0041] Further, the middle cover plate 7 is embedded in the upper part of the microwave processing unit installation cavity 13 and fixed on the middle cover plate 7 mounting screw hole protrusion of the microwave processing unit installation cavity 13 through screws. The function of the middle cover plate 7 is to provide a layer of physical protection when the upper cover plate 8 is not parallel seam welded, protecting the bare chips micro-assembled on the microwave processing unit 3 from being damaged by foreign matter during the debugging process.

[0042] Further, the lower cover plate 9 is embedded in the bottom of the drive control unit installation cavity 15. After debugging is completed, the lower cover plate 9 and the shell 5 are sealed as a whole by laser sealing, completing the air-tight packaging of the drive control unit 4.

[0043] Further, the upper cover plate 8 is implemented by parallel seam welding process, and the lower cover plate 9 is implemented by laser sealing process to realize the air-tight sealing of each cavity of the shell 5.

[0044] Further, the coupling terminal 10 is fixed on the side of the shell 5 by sintering, brazing and other methods, mainly to complete the physical connection of the shell power, data and radio frequency signal with the external connection cable.

[0045] The microwave processing unit 3 realizes the microwave function from the radio frequency interface input radio frequency signal to the output to the laser, including but not limited to amplification, coupling detection, filtering, limiting, switching, digital control attenuation and other microwave functions.

[0046] Further, the microwave processing unit 3 contains a high-frequency ceramic circuit board 22 and a microwave function bare chip, the high-frequency ceramic circuit board 22 contains an input interface microstrip 23, an output interface microstrip 24 and the input and output pins connected to the microwave function bare chip, and some U-shaped slot positions (three are shown in the figure, which are first positioning slot 25, second positioning slot 26 and third positioning slot 27) are reserved on the high-frequency ceramic circuit board 22 to position the microwave function bare chip.

[0047] Further, the high-frequency ceramic circuit board 22 is adhered to the bottom of the microwave processing unit mounting cavity 13 by conductive adhesive, the input interface microstrip 23 is coupled and connected to the radio frequency interface coupling terminal by conductive adhesive or welding, the output interface microstrip 24 is connected to the laser LD-pin by conductive adhesive or welding, the microwave function bare chip can be directly or through a molybdenum copper carrier using conductive adhesive to the bottom of the mounting cavity, and the input / output pins of the bare chip on the high-frequency ceramic board are connected by gold wire bonding, the power supply and control of the high-frequency ceramic circuit board 22 are implemented by connecting the through-wall connection terminal 11 by gold wire bonding, and the specific implementation schematic diagram is shown in Figure 4

[0048] Further, in order to ensure high-frequency performance, the gold wire bonding selects wedge bonding process.

[0049] The drive control unit 4 mainly realizes the introduction of external power supply / communication, internal power supply voltage conversion, laser bias drive and TEC temperature control, power supply and control of the microwave processing unit 3, reporting of internal state information and access of external communication control information.

[0050] Further, the drive control unit 4 mainly contains a drive control circuit board and on-board circuits and devices, and the main interfaces have an external power supply / communication introduction interface 21, a laser drive control interface 19 and a microwave processing unit power supply control interface 20. The external power supply / communication introduction interface 21 is the through-wall connection terminal 11 in the power supply access cavity 14.

[0051] ​Further, the on-board circuit and device include power supply voltage conversion circuit, laser bias drive circuit, TEC temperature control circuit, external communication and control circuit; the power supply voltage conversion circuit realizes the conversion and filtering decoupling processing of the external input voltage to the internal power supply voltage demand, the external power supply input of the embodiment is +5V, the internal power supply demand is +5V, -5V and +3.3V, and the voltage conversion is realized through an LDO chip; the laser bias drive circuit realizes the low-noise current bias and optical power stable output of the temperature-controlled coaxial laser 1; the TEC temperature control circuit cooperates with the temperature-controlled coaxial laser 1 to realize that the DFB laser chip always works at the set working temperature T0±0.1℃ within the super-wide working temperature range (-55℃~+70℃) of the assembly, so as to realize the stable output of the laser wavelength; the external communication and control circuit is connected with the laser bias drive circuit and the TEC temperature control circuit through a single-chip microcomputer to regulate and control the optical power and optical wavelength output of the assembly, is connected with the microwave processing unit power supply control interface 20 to realize the control of the microwave chip, and reports the working state of the assembly such as the output optical power, optical wavelength, gain setting value, switch state and the like through the single-chip microcomputer connected with the external power supply / communication introduction interface 21, and receives the external input control information of the output optical power, optical wavelength, gain setting value, switch state and the like.

[0052] Further, the external power supply / communication introduction interface 21 is connected with the through-wall connection terminal 11 of the power supply access cavity 14 and the drive control unit mounting cavity 15, the microwave processing unit power supply control interface 20 is connected with the through-wall connection terminal 11 of the microwave processing unit mounting cavity 13 and the drive control unit mounting cavity 15, and the external power supply / communication introduction interface 21 on the drive control circuit board and the microwave processing unit power supply control interface 20 are designed to correspond to the position of the corresponding through-wall connection terminal 11, and are provided with a solder pad to be directly soldered and mounted with the corresponding through-wall connection terminal 11.

[0053] Further, the laser drive control interface 19 is designed as a solder pad package to be directly soldered with the corresponding pin of the temperature-controlled coaxial laser.

[0054] The microwave circuit, control drive circuit, gold wire bonding process and shell 5 structure design of the high-efficiency radio frequency optical emission assembly packaging structure of the application are designed and simulated by using ADS / HFSS / MATLAB / CAXA simulation software, and finally the high-efficiency packaging of a multifunctional radio frequency optical emission assembly integrating the collection / light conversion within 18GHz, laser automatic optical power control (APC), automatic temperature control (ATC) and radio frequency signal processing is realized; and the key technical problems such as the frame type three-dimensional heat dissipation of the temperature-controlled coaxial laser 1 and the air tightness enhancement of the optical emission assembly are solved.

[0055] The application has the following advantages:

[0056] 1. High packaging efficiency: using highly standardized and mature process temperature control coaxial devices to replace low-efficiency field BOX laser packaging can greatly improve packaging efficiency;

[0057] 2. Good consistency: based on a large number of temperature control coaxial device screening, selecting consistent devices for later assembly can effectively ensure the performance consistency of the assembly;

[0058] 3. Good reliability: based on a large number of automatic and industrialized production of coaxial temperature control devices, the process is mature and stable, which helps to ensure the long-term reliability of the assembly.

[0059] 4. Low cost: temperature control coaxial devices have low cost and high yield, which can effectively reduce the packaging cost of the assembly.

[0060] 5. Good maintainability: through the quick disassembly and replacement of the temperature control coaxial laser 1, the optical path packaging and maintenance of the assembly can be realized quickly,

[0061] 6. Simple integration process: based on simple SMT mounting and micro-assembly process, without optical coupling packaging process equipment, the assembly packaging can be completed, which greatly reduces the access threshold.

[0062] The above only discloses one or more preferred embodiments of the application, and cannot limit the scope of the application. Those skilled in the art can understand that all or part of the above-mentioned embodiments can be implemented, and equivalent changes made according to the claims of the application still belong to the scope covered by the application.

Claims

1. A high-efficiency radio frequency optical transmission component packaging structure, characterized in that: It includes a temperature-controlled coaxial laser, a packaging shell, a microwave processing unit and a drive control unit; The packaging shell includes an outer shell, an RF input port, a middle cover, an upper cover, a lower cover, a coupling terminal and a through-wall connection terminal. The outer shell has a temperature-controlled coaxial laser mounting cavity, a microwave processing unit mounting cavity, a power supply access cavity and a drive control unit mounting cavity. The RF input port is connected to the outer shell and is located on one side of the outer shell. The middle cover is embedded in the upper part of the microwave processing unit mounting cavity. The upper cover is connected to the outer shell and is located at the top of the outer shell. The lower cover is connected to the outer shell and is located at the bottom of the outer shell. The coupling terminal is connected to the outer shell and is arranged on the outer shell. The through-wall connection terminal is connected to the outer shell and is arranged on the outer shell. The temperature-controlled coaxial laser is connected to the housing and is located inside the temperature-controlled coaxial laser mounting cavity; the microwave processing unit is connected to the housing and is located inside the microwave processing unit mounting cavity; and the drive control unit is connected to the housing and is located inside the drive control unit mounting cavity; The LD-pin of the temperature-controlled coaxial laser is a radio frequency input pin, which maintains a distance of more than 1.5 mm from other pins in the pin package layout, and the LD-pin is connected to the microwave processing unit; the CASE pin of the temperature-controlled coaxial laser is welded on the Kovar interlayer between the microwave processing unit mounting cavity and the drive control unit mounting cavity, and the other pins of the temperature-controlled coaxial laser are connected to the corresponding pin pads of the drive control unit.

2. The high-efficiency radio frequency optical transmission component packaging structure according to claim 1, characterized in that: The LD-pin of the temperature-controlled coaxial laser meets 50Ω impedance matching; the internal bias inductor uses a conical inductor.

3. The high-efficiency radio frequency optical transmission component packaging structure according to claim 1, characterized in that: The temperature-controlled coaxial laser mounting cavity is made of tungsten-copper material, the other structural parts of the shell are made of Kovar alloy material, and the surface of the shell is gold-plated; the RF input port, the coupling terminal and the through-wall connection terminal are sintered or brazed to form an integrated structure with the shell.

4. The high-efficiency radio frequency optical transmission component packaging structure according to claim 3, characterized in that: The temperature-controlled coaxial laser mounting cavity is divided into two compartments in the length direction, namely the outer cavity and the inner cavity. The outer cavity is close to the output light interface, and the inner cavity is close to the laser tube socket electrical interface. The temperature-controlled coaxial laser mounting cavity has a through hole in the middle that passes through the entire tungsten copper frame. The through hole size is the outer diameter of the temperature-controlled coaxial laser Φ d +0.1mm.

5. The high-efficiency radio frequency optical transmission component packaging structure according to claim 4, characterized in that: The outer cavity is a sealed cavity filled with epoxy structural adhesive; the inner cavity is a heat-conducting cavity filled with heat-conducting mud with high thermal conductivity.

6. The high-efficiency radio frequency optical transmission component packaging structure according to claim 5, characterized in that: The middle cover is embedded in the upper portion of the microwave processing unit installation cavity and is fixed to the middle cover installation threaded hole boss of the microwave processing unit installation cavity by screws.

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