Optical engine assembly and optical module

Abstract

According to the embodiment of the invention, an optical engine assembly and an optical module are provided. The light engine assembly comprises a substrate which comprises a first surface and a second surface which are opposite to each other, and a containing space is formed in the substrate; the temperature control unit is arranged in the accommodating space; the multi-mode photoelectric device is arranged adjacent to the first surface of the substrate and has a light transmission direction perpendicular to the first surface, the projection of the multi-mode photoelectric device and the projection of the containing space in the light transmission direction are at least partially overlapped, the temperature control unit is thermally coupled to the multi-mode photoelectric device, and the multi-mode photoelectric device is arranged adjacent to the first surface of the substrate and has a light transmission direction perpendicular to the first surface. Therefore, the temperature of the multimode photoelectric device is adjusted.

Description

Technical Field

[0001] Embodiments of the present disclosure generally relate to the field of optical communication technology, and more particularly, to an optical engine assembly and an optical module. Background Art

[0002] As the speed of short-distance multimode optical modules in data centers continues to increase, the performance requirements of core optical chips are also increasing. For example, vertical cavity surface emitting lasers (VCSELs), as key optoelectronic devices in optical modules, must be able to operate stably at high data rates. However, the sensitivity of VCSEL chips to noise may be different in different temperature ranges, making it difficult to ensure the stability and reliability of VCSEL chips over the full temperature range. For example, the sensitivity of VCSEL chips to external noise increases significantly in low temperature environments, which leads to unstable performance in the low temperature range. This temperature sensitivity problem limits the application of optical modules in different working environments. Summary of the invention

[0003] In one aspect of the present disclosure, a light engine assembly is provided. The light engine assembly includes: a substrate including a first surface and a second surface opposite to each other, wherein a receiving space is provided in the substrate; a temperature control unit is provided in the receiving space; and a multi-mode optoelectronic device is provided adjacent to the first surface of the substrate and has a light transmission direction perpendicular to the first surface, wherein the multi-mode optoelectronic device at least partially overlaps with a projection of the receiving space in the light transmission direction, and the temperature control unit is thermally coupled to the multi-mode optoelectronic device to adjust the temperature of the multi-mode optoelectronic device.

[0004] In a second aspect of the present disclosure, an optical module is provided, comprising the optical engine assembly of the first aspect of the present disclosure.

[0005] It should be understood that the content described in this content section is not intended to limit the key features or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will become easily understood through the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] The above and other features, advantages and aspects of the embodiments of the present disclosure will become more apparent with reference to the following detailed description in conjunction with the accompanying drawings. In the accompanying drawings, the same or similar reference numerals represent the same or similar elements, wherein:

[0007] Figure 1 A schematic top view of a light engine assembly according to an embodiment of the present disclosure is shown;

[0008] Figure 2 Shows Figure 1 An enlarged schematic diagram of portion B shown in FIG.

[0009] Figure 3 Shows Figure 2 A schematic cross-sectional view of the portion B shown in FIG. 1 taken along line AA;

[0010] Figure 4 shows a schematic cross-sectional view of a portion of a light engine assembly according to another embodiment of the present disclosure;

[0011] Figure 5 A schematic cross-sectional view showing a portion of a light engine assembly according to another embodiment of the present disclosure; and

[0012] Figure 6 A schematic cross-sectional view of a portion of a light engine assembly according to another embodiment of the present disclosure is shown.

[0013] Description of reference numerals:

[0014] 100. Light engine assembly;

[0015] 1. substrate; 11. first surface; 12. second surface; 13. accommodation space; 130. through hole; 131. first groove; 132. second groove; 133. internal space; 141. first thermal via hole; 142. second thermal via hole;

[0016] 2. Temperature control unit; 21. First side; 22. Second side;

[0017] 3. Multimode optoelectronic devices; 31. Vertical cavity surface emitting laser; 32. Photodiode; 33. Monitor photodiode; 34. Wire;

[0018] Z, light transmission direction;

[0019] 4. Heat sink;

[0020] 5. Electronic chips. DETAILED DESCRIPTION

[0021] The preferred embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although the preferred embodiments of the present disclosure are shown in the accompanying drawings, it should be understood that the present disclosure can be implemented in various forms and should not be limited by the embodiments set forth herein. On the contrary, these embodiments are provided to make the present disclosure more thorough and complete, and to fully convey the scope of the present disclosure to those skilled in the art.

[0022] As used herein, the term "including" and its variations mean open inclusion, i.e., "including but not limited to". Unless otherwise stated, the term "or" means "and / or". The term "based on" means "based at least in part on". The terms "an example embodiment" and "an embodiment" mean "at least one example embodiment". The term "another embodiment" means "at least one additional embodiment". The terms "first", "second", etc. may refer to different or the same objects.

[0023] As briefly mentioned above, multi-mode optoelectronic devices such as VCSEL chips are significantly more sensitive to external noise in low temperature environments, which results in unstable performance in the low temperature range, limiting the application of optical modules in different working environments. An embodiment of the present disclosure provides an optical engine assembly, which can adjust the temperature of the multi-mode optoelectronic device as needed by thermally coupling the multi-mode optoelectronic device to a temperature control unit provided in a substrate, so that it operates within a predetermined temperature range, thereby ensuring the working stability and reliability of the multi-mode optoelectronic device. In addition, the optical engine assembly of the embodiment of the present disclosure has a compact structure, saves space, and can be easily applied to various usage scenarios. Next, the embodiments of the present disclosure will be described in detail in conjunction with the accompanying drawings.

[0024] Figure 1 FIG. 1 shows a schematic top view of a light engine assembly according to an embodiment of the present disclosure, Figure 2 Shows Figure 1 An enlarged schematic diagram of part B shown in FIG. Figure 3 Shows Figure 2 The portion B shown in FIG. 1 is a schematic cross-sectional view taken along line AA. The light engine assembly may also be referred to as a light engine packaging structure in this article.

[0025] like Figures 1 to 3 As shown, the light engine assembly 100 described herein generally includes a substrate 1, a temperature control unit 2 and a multi-mode optoelectronic device 3. The substrate 1 includes a first surface 11 and a second surface 12 opposite to each other. A receiving space 13 is provided in the substrate 1 for receiving the temperature control unit 2. The temperature control unit 2 is used to adjust the temperature of the multi-mode optoelectronic device 3. The multi-mode optoelectronic device 3 is arranged adjacent to the first surface 11 of the substrate 1 and has a light transmission direction Z perpendicular to the first surface 11. The multi-mode optoelectronic device 3 can emit light along the light transmission direction Z or receive light incident along the light transmission direction Z. The multi-mode optoelectronic device 3 at least partially overlaps with the projection of the receiving space 13 in the light transmission direction Z. The temperature control unit 2 is thermally coupled to the multi-mode optoelectronic device 3 to adjust the temperature of the multi-mode optoelectronic device 3.

[0026] In one embodiment, Figure 2 and Figure 3As shown, the multi-mode optoelectronic device 3 includes a vertical cavity surface emitting laser (VCSEL) 31, a photodiode (PD) 32 and a monitoring photodiode (MPD) 33. VCSEL 31 can emit light along the light transmission direction Z. PD 32 can receive light incident along the light transmission direction Z. MPD 33 can receive light incident along the light transmission direction Z. VCSEL 31 can be electrically connected to an electric chip 5 disposed on the first surface 11 of the substrate 1 through a wire 34. The electric chip 5 may include, for example, a driver, a transconductance amplifier (TIA) or other types of devices. It should be understood that, according to design requirements, the multi-mode optoelectronic device 3 may include more or fewer optoelectronic devices, or other types of devices, and the scope of the present disclosure is not limited in this respect.

[0027] In one embodiment, the substrate 1 may be a printed circuit board (PCB). In another embodiment, the substrate 1 may be a ceramic substrate or a silicon substrate. In other embodiments, the substrate 1 may be any other suitable type, and the scope of the present disclosure is not limited in this respect. A metal plating layer is provided on the substrate 1 to achieve electrical connection.

[0028] Depending on the position of the multi-mode optoelectronic device 3 relative to the first surface 11 of the substrate 1, the receiving space 13 can be arranged at an appropriate position in the substrate 1. As an example, Figure 1 and Figure 2 As shown, the accommodation space 13 may be disposed near the middle of the substrate 1. In other embodiments, the accommodation space 13 may be disposed away from the middle of the substrate 1, or even disposed in the substrate 1 near the edge of the substrate 1.

[0029] In one embodiment, Figure 2 and Figure 3 As shown, the accommodation space 13 includes a through hole 130 extending from the first surface 11 to the second surface 12 of the substrate 1. The through hole 130 may penetrate the entire thickness of the substrate 1. The temperature control unit 2 is disposed in the through hole 130 and supports the multi-mode optoelectronic device 3. The multi-mode optoelectronic device 3 is disposed on the first side 21 of the temperature control unit 2 adjacent to the first surface 11 of the substrate 1. The first side 21 of the temperature control unit 2 may be substantially flush with the first surface 11 of the substrate 1, as shown in FIG. Figure 3 However, it should be understood that the first side 21 of the temperature control unit 2 may also be higher or lower than the first surface 11 of the substrate 1. With this arrangement, the temperature control unit 2 can be used to control the temperature of the multi-mode optoelectronic device 3, so that the multi-mode optoelectronic device 3 works within an appropriate range, thereby improving the performance and stability of the multi-mode optoelectronic device 3.

[0030] By setting the multi-mode optoelectronic device 3 on the first side 21 of the temperature control unit 2, the packaging structure of the optical engine can be optimized, the operating temperature of the multi-mode optoelectronic device 3 can be improved, the performance of the optical module including the optical engine assembly 100 can be optimized, the application scenarios of high-speed optical modules and long optical fibers can be effectively supported, and the production yield of the optical module can be improved.

[0031] In one embodiment, the temperature control unit 2 may include at least one of a thermoelectric cooler (TEC) and a thermistor. The thermoelectric cooler may heat or cool the multi-mode optoelectronic device 3 by using the temperature difference between its upper and lower surfaces to control the temperature of the multi-mode optoelectronic device 3. The thermistor may heat the multi-mode optoelectronic device 3 to control the temperature of the multi-mode optoelectronic device 3.

[0032] In some embodiments, the material of the thermoelectric cooler can be selected from: ceramics (such as aluminum nitride ceramics or aluminum oxide ceramics), polysilicon or metals with low expansion coefficients (such as tungsten copper alloy or iron nickel cobalt alloy). In other embodiments, the material of the temperature control unit 2 can be other types, and the scope of the present disclosure is not limited in this respect.

[0033] In some embodiments, the thermistor may include a nickel germanium (NiGe) thin film resistor or a tantalum nitride (TaN) thin film resistor. In other embodiments, the thermistor may be of other types, and the scope of the present disclosure is not limited in this respect.

[0034] In one embodiment, Figure 3 As shown, the light engine assembly 100 further includes a heat sink 4, which is thermally coupled to the second surface 12 of the substrate 1 and the second side 22 of the temperature control unit 2 adjacent to the second surface 12 of the substrate 1. The heat sink 4 can be fixed to the second surface 12 of the substrate 1 and the second side 22 of the temperature control unit 2 by thermal conductive adhesive or surface mount technology (SMT). The surface mount technology can be soldered using low-temperature solder such as gold-tin solder or tin-bismuth solder.

[0035] In the example where the temperature control unit 2 includes a thermistor, when the multi-mode optoelectronic device 3 operates at a high temperature under the control of the temperature control unit 2, the heat sink 4 can dissipate heat for the temperature control unit 2 well, so that the multi-mode optoelectronic device 3 operates within an appropriate temperature range.

[0036] In the example where the temperature control unit 2 includes a thermoelectric cooler, the second side 22 of the temperature control unit 2 can be closer to the ambient temperature as a temperature reference under the action of the heat sink 4, thereby more accurately controlling the temperature of the first side 21 of the temperature control unit 2. In addition, when the multi-mode optoelectronic device 3 operates at a high temperature under the control of the thermoelectric cooler, the heat sink 4 can perform good heat dissipation on the temperature control unit 2 to avoid affecting the working performance of the multi-mode optoelectronic device 3.

[0037] Alternatively, in some embodiments, the heat sink 4 and the temperature control unit 2 may be an integrated structure. The heat sink 4 may be fixed to the second surface 12 of the substrate 1 by means of a thermally conductive adhesive or surface mounting technology. With this arrangement, precise temperature control of the multi-mode optoelectronic device 3 can also be achieved.

[0038] Alternatively, in some embodiments, the temperature control unit 2 may be bonded to the sidewall of the through hole 130, and the second side 22 of the temperature control unit 2 may be substantially flush with the second surface 12 of the substrate 1. In this case, the heat sink 4 may be formed on the housing of the optical module, rather than directly formed on the second surface 12 of the substrate 1. When the light engine assembly 100 is assembled into the housing of the optical module, the second side 22 of the temperature control unit 2 may contact the heat sink 4 on the housing. In this way, the temperature control unit 2 and the heat sink 4 may also be reliably heat-conducted.

[0039] In some embodiments, the multi-mode optoelectronic device 3 such as the MPD 33 may be electrically connected to the first surface 11 of the substrate 1 via a wire (not shown) to transmit an electrical signal.

[0040] Alternatively, in some embodiments, the multi-mode optoelectronic device 3 may be electrically connected to the second surface 12 of the substrate 1 via a trace arranged along the surface of the temperature control unit 2 and the surface of the heat sink 4. Specifically, the trace may start from a pad (not shown) on the multi-mode optoelectronic device 3, extend along the surface of the temperature control unit 2, and then extend along the surface of the heat sink 4 to the pad on the second surface 12 of the substrate 1, thereby transmitting an electrical signal.

[0041] Alternatively, in some embodiments, the multi-mode optoelectronic device 3 can be electrically connected to the second surface 12 of the substrate 1 via a conductive via (not shown) passing through the temperature control unit 2 and a trace arranged along the surface of the heat sink 4. Specifically, a hole can be punched in the temperature control unit 2 to form a conductive via. The conductive via extends from the first side 21 of the temperature control unit 2 to the second side 22 and is connected to the trace arranged along the surface of the heat sink 4. The trace arranged along the surface of the heat sink 4 can extend to the pad on the second surface 12 of the substrate 1, thereby realizing the electrical connection between the multi-mode optoelectronic device 3 and the substrate 1. By punching a hole in the temperature control unit 2, the wire bonding process can be reduced, making the structure of the light engine assembly 100 more compact and can be conveniently applied to various scenarios. In addition, the temperature control unit 2 can solve the problem of poor matching of thermal expansion coefficients between the multi-mode optoelectronic device 3 and the substrate 1.

[0042] Alternatively or alternatively, in some embodiments, the electric chip 5 may be thermally coupled to the temperature control unit 2 or an additional temperature control unit separately provided from the temperature control unit 2 to adjust the temperature of the electric chip 5. In this way, the electric chip 5 can be operated within a suitable temperature range.

[0043] Figure 4 A schematic cross-sectional view of a portion of a light engine assembly according to another embodiment of the present disclosure is shown. Figure 4 The structure and combination of the light engine assembly 100 shown Figures 1 to 3 The structures of the light engine assembly 100 described are similar. The differences between them will be mainly described below, and the same parts will not be repeated.

[0044] like Figure 4 As shown, the accommodating space 13 includes a first groove 131 formed at the first surface 11 of the substrate 1. The temperature control unit 2 is disposed in the first groove 131 and coupled to the bottom of the first groove 131. The multi-mode optoelectronic device 3 is disposed on a first side 21 of the temperature control unit 2 opposite to the bottom of the first groove 131, so that the temperature of the multi-mode optoelectronic device 3 can be adjusted by the temperature control unit 2. The second side 22 of the temperature control unit 2 is bonded to the bottom of the first groove 131. The first side 21 of the temperature control unit 2 can be substantially flush with the first surface 11 of the substrate 1. However, it should be understood that the first side 21 of the temperature control unit 2 can also be higher or lower than the first surface 11 of the substrate 1. The depth of the first groove 131 can be adjusted according to the size of the temperature control unit 2 so as to match the corresponding temperature control unit 2.

[0045] like Figure 4 As shown, a first heat-conducting via 141 is further provided in the substrate 1, and the first heat-conducting via 141 extends from the bottom of the first groove 131 to the second surface 12 of the substrate 1. One end of the first heat-conducting via 141 is thermally coupled to the second side 22 of the temperature control unit 2. The first heat-conducting via 141 can be made of, for example, metal (such as copper) or other materials with high thermal conductivity.

[0046] In some embodiments, Figure 4 As shown, the heat sink 4 is thermally coupled to the second surface 12 of the substrate 1 and the end of the first thermal via 141 away from the temperature control unit 2. The heat sink 4 can be fixed to the second surface 12 of the substrate 1 and the end of the first thermal via 141 away from the temperature control unit 2 by thermal conductive adhesive or surface mounting technology. With this arrangement, a reliable heat conduction path can be established between the temperature control unit 2 and the heat sink 4.

[0047] Alternatively or alternatively, in some embodiments, one end of the first heat-conducting via 141 away from the temperature control unit 2 may be substantially flush with the second surface 12 of the substrate 1. In this case, the heat sink 4 may be formed on the housing of the optical module, rather than directly formed on the second surface 12 of the substrate 1. When the light engine assembly 100 is assembled into the housing of the optical module, one end of the first heat-conducting via 141 away from the temperature control unit 2 may contact the heat sink 4 on the housing. In this way, the temperature control unit 2 and the heat sink 4 can also be reliably heat-conducted.

[0048] Figure 5 A schematic cross-sectional view of a portion of a light engine assembly according to another embodiment of the present disclosure is shown. Figure 5 The structure and combination of the light engine assembly 100 shown Figures 1 to 4 The structures of the light engine assembly 100 described are similar. The differences between them will be mainly described below, and the same parts will not be repeated.

[0049] like Figure 5 As shown, the accommodating space 13 includes a second groove 132 formed at the second surface 12 of the substrate 1. The temperature control unit 2 is disposed in the second groove 132 and coupled to the bottom of the second groove 132. The first side 21 of the temperature control unit 2 can be bonded to the bottom of the second groove 132 by a thermally conductive adhesive. The multi-mode optoelectronic device 3 is disposed on the first surface 11 of the substrate 1. The depth of the second groove 132 can be adjusted according to the size of the temperature control unit 2 so as to match the corresponding temperature control unit 2.

[0050] like Figure 5 As shown, a second heat-conducting via 142 is further provided in the substrate 1, and the second heat-conducting via 142 extends from the bottom of the second groove 132 to the first surface 11 of the substrate 1. One end of the second heat-conducting via 142 is thermally coupled to the multi-mode optoelectronic device 3, and the other end of the second heat-conducting via 142 is thermally coupled to the first side 21 of the temperature control unit 2. With this arrangement, the temperature control unit 2 can adjust the temperature of the multi-mode optoelectronic device 3 via the second heat-conducting via 142. The second heat-conducting via 142 can be made of, for example, metal (e.g., copper) or other materials with high thermal conductivity.

[0051] In some embodiments, Figure 5 As shown, the heat sink 4 is thermally coupled to the second surface 12 of the substrate 1 and the second side 22 of the temperature control unit 2 opposite to the bottom of the second groove 132. The heat sink 4 can be fixed to the second surface 12 of the substrate 1 and the second side 22 of the temperature control unit 2 by thermal conductive adhesive or surface mounting technology. With this arrangement, reliable heat conduction can be achieved between the temperature control unit 2 and the heat sink 4.

[0052] Alternatively or alternatively, in some embodiments, the second side 22 of the temperature control unit 2 may be substantially flush with the second surface 12 of the substrate 1. In this case, the heat sink 4 may be formed on the housing of the optical module, rather than directly formed on the second surface 12 of the substrate 1. When the light engine assembly 100 is assembled into the housing of the optical module, the second side 22 of the temperature control unit 2 may contact the heat sink 4 on the housing. In this way, the temperature control unit 2 and the heat sink 4 can also be reliably heat-conducted.

[0053] Figure 6 A schematic cross-sectional view of a portion of a light engine assembly according to another embodiment of the present disclosure is shown. Figure 6 The structure and combination of the light engine assembly 100 shown Figures 1 to 5 The structures of the light engine assembly 100 described are similar. The differences between them will be mainly described below, and the same parts will not be repeated.

[0054] like Figure 6 As shown, the accommodation space 13 includes an inner space 133 formed inside the substrate 1. The temperature control unit 2 is embedded in the inner space 133. The temperature control unit 2 can be directly embedded inside the substrate 1 during the manufacturing process of the substrate 1. The multi-mode optoelectronic device 3 is disposed on the first surface 11 of the substrate 1.

[0055] like Figure 6 As shown, the substrate 1 is also provided with a first heat-conducting via 141 and a second heat-conducting via 142. The first heat-conducting via 141 extends from the bottom side of the internal space 133 to the second surface 12 of the substrate 1. One end of the first heat-conducting via 141 is thermally coupled to the second side 22 of the temperature control unit 2. The first heat-conducting via 141 can be made of, for example, metal (such as copper) or other materials with high thermal conductivity. The second heat-conducting via 142 extends from the top side of the internal space 133 to the first surface 11 of the substrate 1. One end of the second heat-conducting via 142 is thermally coupled to the multi-mode optoelectronic device 3, and the other end of the second heat-conducting via 142 is thermally coupled to the first side 21 of the temperature control unit 2. With this arrangement, the temperature control unit 2 can adjust the temperature of the multi-mode optoelectronic device 3 via the second heat-conducting via 142, and a reliable heat conduction path can be established between the temperature control unit 2 and the heat sink 4 via the first heat-conducting via 141. Similarly, the second thermal via 142 may be made of metal (eg, copper) or other materials with high thermal conductivity.

[0056] In some embodiments, Figure 4 As shown, the heat sink 4 is thermally coupled to the second surface 12 of the substrate 1 and the end of the first thermal via 141 away from the temperature control unit 2. The heat sink 4 can be fixed to the second surface 12 of the substrate 1 and the end of the first thermal via 141 away from the temperature control unit 2 by thermal conductive adhesive or surface mounting technology. With this arrangement, a reliable heat conduction path can be established between the temperature control unit 2 and the heat sink 4.

[0057] Alternatively or alternatively, in some embodiments, one end of the first heat-conducting via 141 away from the temperature control unit 2 may be substantially flush with the second surface 12 of the substrate 1. In this case, the heat sink 4 may be formed on the housing of the optical module, rather than directly formed on the second surface 12 of the substrate 1. When the light engine assembly 100 is assembled into the housing of the optical module, one end of the first heat-conducting via 141 away from the temperature control unit 2 may contact the heat sink 4 on the housing. In this way, the temperature control unit 2 and the heat sink 4 can also be reliably heat-conducted.

[0058] The embodiments of the present disclosure further provide a light module, which may include the light engine assembly 100 of the embodiments of the present disclosure.

[0059] Embodiments of the present disclosure are also embodied in the following examples.

[0060] Example 1. A light engine assembly, comprising:

[0061] A substrate, comprising a first surface and a second surface facing away from each other, wherein a receiving space is provided in the substrate;

[0062] a temperature control unit, disposed in the accommodation space; and

[0063] A multi-mode optoelectronic device is arranged adjacent to the first surface of the substrate and has a light transmission direction perpendicular to the first surface, wherein the multi-mode optoelectronic device at least partially overlaps with a projection of the accommodating space in the light transmission direction, and the temperature control unit is thermally coupled to the multi-mode optoelectronic device to adjust the temperature of the multi-mode optoelectronic device.

[0064] Example 2. A light engine assembly according to Example 1, wherein the accommodating space includes a through hole extending from the first surface to the second surface of the substrate, the temperature control unit is disposed in the through hole, and the multi-mode optoelectronic device is disposed on a first side of the temperature control unit adjacent to the first surface of the substrate.

[0065] Example 3. The light engine assembly of Example 2 further comprises a heat sink thermally coupled to the second surface of the substrate and a second side of the temperature control unit adjacent to the second surface of the substrate.

[0066] Example 4. The light engine assembly according to Example 2, wherein the heat sink is fixed to the second side of the temperature control unit via thermal conductive adhesive or surface mounting technology, or the heat sink and the temperature control unit are an integral structure.

[0067] Example 5. The light engine assembly of Example 2, wherein the multi-mode optoelectronic device is electrically connected to the first surface of the substrate via a wire; or

[0068] wherein the multi-mode optoelectronic device is electrically connected to the second surface of the substrate via traces arranged along the surface of the temperature control unit and the surface of the heat sink; or

[0069] The multi-mode optoelectronic device is electrically connected to the second surface of the substrate via a conductive via passing through the temperature control unit and a trace arranged along the surface of the heat sink.

[0070] Example 6. The light engine assembly according to Example 1, wherein the accommodation space comprises a first groove formed at the first surface of the substrate, the temperature control unit is disposed in the first groove and coupled to a bottom of the first groove, and the multi-mode optoelectronic device is disposed on a first side of the temperature control unit opposite to the bottom of the first groove; and

[0071] A first heat-conducting via is further provided in the substrate, and the first heat-conducting via extends from the bottom of the first groove to the second surface of the substrate and is thermally coupled to a second side of the temperature control unit adjacent to the bottom of the first groove.

[0072] Example 7. The light engine assembly according to Example 6 further includes a heat sink, which is thermally coupled to the second surface of the substrate and an end of the first thermal via away from the temperature control unit.

[0073] Example 8. The light engine assembly of Example 1, wherein the accommodation space comprises a second groove formed at the second surface of the substrate, the temperature control unit is disposed in the second groove and coupled to the bottom of the second groove, and the multi-mode optoelectronic device is disposed on the first surface of the substrate; and

[0074] A second thermal via is also provided in the substrate, and the second thermal via extends from the bottom of the second groove to the first surface of the substrate, and is thermally coupled to the multi-mode optoelectronic device and the first side of the temperature control unit adjacent to the bottom of the second groove.

[0075] Example 9. The light engine assembly of Example 8 further comprises a heat sink thermally coupled to the second surface of the substrate and a second side of the temperature control unit opposite to the bottom of the second groove.

[0076] Example 10. The light engine assembly of Example 1, wherein the accommodation space comprises an internal space formed inside the substrate, the temperature control unit is embedded in the internal space, and the multi-mode optoelectronic device is disposed on the first surface of the substrate; and

[0077] The substrate is further provided with a first thermal conductive via and a second thermal conductive via, wherein the first thermal conductive via extends from the internal space to the second surface of the substrate and is thermally coupled to the temperature control unit, and the second thermal conductive via extends from the internal space to the first surface of the substrate and is thermally coupled to the multi-mode optoelectronic device and the temperature control unit.

[0078] Example 11. The light engine assembly according to Example 10 further includes a heat sink thermally coupled to the second surface of the substrate and an end of the first thermal via away from the temperature control unit.

[0079] Example 12. The light engine assembly of any one of Examples 1 to 11, wherein the multimode optoelectronic device comprises at least one of a vertical cavity surface emitting laser (VCSEL), a photodiode (PD), and a monitor photodiode (MPD).

[0080] Example 13. The light engine assembly of any one of Examples 1 to 11, wherein the temperature control unit comprises at least one of a thermoelectric cooler (TEC) and a thermistor.

[0081] Example 14. The light engine component according to any one of Examples 1 to 11 further includes an electric chip, which is arranged adjacent to the first surface of the substrate and is thermally coupled to the temperature control unit or an additional temperature control unit arranged separately from the temperature control unit to adjust the temperature of the electric chip.

[0082] Example 15. A light module comprising a light engine assembly according to any one of Examples 1 to 14.

[0083] The embodiments of the present disclosure have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or technical improvements in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A light engine assembly (100), comprising: A substrate (1) comprising a first surface (11) and a second surface (12) facing away from each other, wherein a receiving space (13) is provided in the substrate (1); A temperature control unit (2) is arranged in the accommodation space (13); as well as A multimode optoelectronic device (3) is arranged adjacent to the first surface (11) of the substrate (1) and has a light transmission direction (Z) perpendicular to the first surface (11), wherein the multimode optoelectronic device (3) at least partially overlaps with a projection of the accommodating space (13) in the light transmission direction (Z), and the temperature control unit (2) is thermally coupled to the multimode optoelectronic device (3) to adjust the temperature of the multimode optoelectronic device (3).

2. The light engine assembly (100) according to claim 1, wherein the accommodating space (13) comprises a through hole (130) extending from the first surface (11) to the second surface (12) of the substrate (1), the temperature control unit (2) is arranged in the through hole (130), and the multi-mode optoelectronic device (3) is arranged on a first side (21) of the temperature control unit (2) adjacent to the first surface (11) of the substrate (1).

3. The light engine assembly (100) according to claim 2, further comprising a heat sink (4), wherein the heat sink (4) is thermally coupled to the second surface (12) of the substrate (1) and a second side (22) of the temperature control unit (2) adjacent to the second surface (12) of the substrate (1).

4. The light engine assembly (100) according to claim 2, wherein the heat sink (4) is fixed to the second side (22) of the temperature control unit (2) via thermal conductive adhesive or surface mounting technology, or the heat sink (4) and the temperature control unit (2) are an integrated structure.

5. The light engine assembly (100) according to claim 2, wherein the multi-mode optoelectronic device (3) is electrically connected to the first surface (11) of the substrate (1) via a wire; or wherein the multi-mode optoelectronic device (3) is electrically connected to the second surface (12) of the substrate (1) via traces arranged along the surface of the temperature control unit (2) and the surface of the heat sink (4); or The multi-mode optoelectronic device (3) is electrically connected to the second surface (12) of the substrate (1) via a conductive via passing through the temperature control unit (2) and a trace arranged along the surface of the heat sink (4).

6. The light engine assembly (100) according to claim 1, wherein the accommodating space (13) comprises a first groove (131) formed at the first surface (11) of the substrate (1), the temperature control unit (2) is arranged in the first groove (131) and coupled to the bottom of the first groove (131), and the multi-mode optoelectronic device (3) is arranged on a first side (21) of the temperature control unit (2) opposite to the bottom of the first groove (131); and The substrate (1) is further provided with a first heat-conducting via (141), the first heat-conducting via (141) extending from the bottom of the first groove (131) to the second surface (12) of the substrate (1), and thermally coupled to a second side (22) of the temperature control unit (2) adjacent to the bottom of the first groove (131).

7. The light engine assembly (100) according to claim 6, further comprising a heat sink (4), wherein the heat sink (4) is thermally coupled to the second surface (12) of the substrate (1) and an end of the first thermal via (141) away from the temperature control unit (2).

8. The light engine assembly (100) according to claim 1, wherein the accommodating space (13) comprises a second groove (132) formed at the second surface (12) of the substrate (1), the temperature control unit (2) is arranged in the second groove (132) and coupled to the bottom of the second groove (132), and the multi-mode optoelectronic device (3) is arranged on the first surface (11) of the substrate (1); and A second heat-conducting via (142) is also provided in the substrate (1), the second heat-conducting via (142) extending from the bottom of the second groove (132) to the first surface (11) of the substrate (1), and thermally coupled to the multi-mode optoelectronic device (3) and a first side (21) of the temperature control unit (2) adjacent to the bottom of the second groove (132).

9. The light engine assembly (100) according to claim 8, further comprising a heat sink (4), wherein the heat sink (4) is thermally coupled to the second surface (12) of the substrate (1) and a second side (22) of the temperature control unit (2) opposite to the bottom of the second groove (132).

10. The light engine assembly (100) according to claim 1, wherein the accommodating space (13) comprises an internal space (133) formed inside the substrate (1), the temperature control unit (2) is embedded in the internal space (133), and the multi-mode optoelectronic device (3) is arranged on the first surface (11) of the substrate (1); and The substrate (1) is further provided with a first heat-conducting via (141) and a second heat-conducting via (142); the first heat-conducting via (141) extends from the internal space (133) to the second surface (12) of the substrate (1) and is thermally coupled to the temperature control unit (2); the second heat-conducting via (142) extends from the internal space (133) to the first surface (11) of the substrate (1) and is thermally coupled to the multi-mode optoelectronic device (3) and the temperature control unit (2).

11. The light engine assembly (100) according to claim 10, further comprising a heat sink (4), wherein the heat sink (4) is thermally coupled to the second surface (12) of the substrate (1) and an end of the first thermal via (141) away from the temperature control unit (2).

12. The light engine assembly (100) according to any one of claims 1 to 11, wherein the multimode optoelectronic device (3) comprises at least one of a vertical cavity surface emitting laser (VCSEL), a photodiode (PD) and a monitoring photodiode (MPD).

13. The light engine assembly (100) according to any one of claims 1 to 11, wherein the temperature control unit (2) comprises at least one of a thermoelectric cooler (TEC) and a thermistor.

14. The light engine component (100) according to any one of claims 1 to 11, further comprising an electric chip (5), wherein the electric chip (5) is arranged adjacent to the first surface (11) of the substrate (1) and is thermally coupled to the temperature control unit (2) or an additional temperature control unit separately arranged from the temperature control unit (2) to adjust the temperature of the electric chip (5).

15. A light module, comprising the light engine assembly (100) according to any one of claims 1 to 14.

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