A heat dissipation structure of an all-in-one computer

Abstract

The present invention discloses a heat dissipation structure of an all-in-one computer, which belongs to the field of computer heat dissipation and cooling technology, and includes a mounting frame, a heat dissipation motor, a heat dissipation shaft, a support bar, and a local heat dissipation mechanism for enhancing heat dissipation around displacement; wherein the local heat dissipation mechanism for enhancing heat dissipation around displacement includes a reduction motor, a rotating block, and a displacement motor; and also includes a multi-directional displacement local heat dissipation mechanism and a local heat dissipation enhancement detection component. The present invention has the advantages of being able to automatically and quickly know the local high-temperature position of the mainboard of the all-in-one computer through the local heat dissipation mechanism for enhancing heat dissipation around displacement, and being able to automatically enhance heat dissipation and cooling operations according to the local high-temperature position of the mainboard of the all-in-one computer, thereby greatly improving the heat dissipation and cooling effect, thereby solving the problem that it is difficult to automatically know the local high-temperature position of the mainboard of the all-in-one computer, and it is difficult to automatically enhance heat dissipation and cooling according to the local high-temperature position of the mainboard of the all-in-one computer, resulting in poor heat dissipation and cooling effect.

Description

Technical Field

[0001] The invention relates to the technical field of computer heat dissipation and cooling, and in particular to a heat dissipation structure of an all-in-one computer. Background Art

[0002] The heat dissipation and cooling structure of the computer all-in-one plays a vital role, mainly in protecting the hardware. The main purpose of the heat dissipation and cooling structure is to prevent the hardware inside the computer all-in-one from overheating. When the hardware CPU, GPU, and hard disk work for a long time or run under high load, they will generate a lot of heat. Without an effective heat dissipation system, this heat will continue to accumulate, causing the hardware temperature to rise, which may eventually cause overheating failures and even damage the hardware. Therefore, the heat dissipation and cooling structure is crucial to protect the hardware from overheating damage.

[0003] In the existing published technical literature, the utility model patent with Chinese patent announcement number CN215526580U discloses a motherboard heat dissipation structure and a computer all-in-one. The heat dissipation structure mainly uses a heat dissipation structure of a pendant, a pressure strip and an I-shaped heat dissipation piece. Compared with the traditional method of fixing the heat dissipation board directly to the working surface of the motherboard by screwing, the heat dissipation effect is better and the assembly is simpler, which reduces the cost of assembly work and materials. At the same time, since there is no need for a traditional heat dissipation fan, the shell of the computer all-in-one provided by the utility model can be set to a fully enclosed structure, which can effectively avoid damage to the computer all-in-one in harsh industrial application environments such as high dust, high humidity, and high temperature, which is conducive to providing end customers with a variety of industrial application scenarios that can be applied to various harsh environments, and has strong adaptability to the use environment. However, the heat dissipation structure still has the following problems.

[0004] When the heat dissipation structure is used to dissipate heat for the motherboard inside the all-in-one computer, it needs to rotate through a fan to generate flowing air for heat dissipation and cooling. However, during the heat dissipation and cooling process, the fan is driven at a specified speed, and during the operation of the all-in-one computer motherboard, there will be local locations where higher temperatures are generated, while other areas can meet normal heat dissipation. The high local temperature will continue to affect the normal operating performance of the entire all-in-one computer motherboard. It is difficult to automatically know the local high-temperature location of the all-in-one computer motherboard, and it is difficult to automatically enhance the heat dissipation and cooling according to the local high-temperature location of the all-in-one computer motherboard, resulting in poor heat dissipation and cooling effect. For this purpose, a heat dissipation structure for an all-in-one computer is provided. Summary of the invention

[0005] To this end, the present invention provides a heat dissipation structure of an all-in-one computer to solve the problems existing in the prior art.

[0006] In order to achieve the above-mentioned purpose, the present invention provides the following technical solutions: a heat dissipation structure of an all-in-one computer, comprising a mounting frame, a heat dissipation motor and a heat dissipation shaft, wherein the heat dissipation motor is fixed to the inner wall of the mounting frame, the heat dissipation shaft is fixedly connected to the output end of the heat dissipation motor, the outer wall of the heat dissipation motor is provided with a support bar, and one side of the support bar is provided with a local enhanced heat dissipation mechanism around displacement; the local enhanced heat dissipation mechanism around displacement comprises a reduction motor fixedly arranged on one side of the support bar, and the output end of the reduction motor is fixedly connected with a rotating block, one end of the rotating block is fixedly installed with a displacement motor, one side of the displacement motor is fixedly connected with a sleeve frame, the inner wall of the sleeve frame is rotatably connected with a transmission screw, and the displacement motor is used to drive the transmission screw to rotate; the outer wall of the transmission screw is threadedly connected with a sleeve block, one side of the sleeve frame and near the position of the displacement motor is fixedly connected with a connecting column, and one end of the connecting column is fixedly installed with a guide roller, and the outer wall of the guide roller is slidably connected with a guide inner ring; one side of the sleeve block is provided with a multi-directional displacement local enhanced heat dissipation mechanism.

[0007] Preferably, the output end of the displacement motor is fixedly connected to the transmission screw, and the outer wall of the sleeve block is slidably connected to the sleeve frame. A guide groove is provided on the inner wall of the guide inner ring, and the guide roller is slidably connected to the guide inner ring to which the guide groove belongs, and the guide inner ring is fixedly connected to the mounting frame. A positioning shaft is fixedly connected to one side of the sleeve frame near the sleeve block, and a guide shaft is fixedly installed at one end of the positioning shaft; a guide outer ring is slidably connected to the outer wall of the guide shaft, and a sliding groove is provided on the inner wall of the guide outer ring, and the guide shaft is slidably connected to the guide outer ring to which the sliding groove belongs, and the guide outer ring is fixedly connected to the mounting frame.

[0008] Preferably, a sensing block is fixedly installed on the other side of the sleeve block, a displacement distance sensor is provided on one side of the sensing block, and the displacement distance sensor is fixedly connected to the sleeve frame; the top surface of the displacement distance sensor and the top surface of the sensing block are in the same horizontal plane; a plurality of cooling blades are fixedly connected to the outer wall of the heat dissipation shaft, mounting bolts are threadedly connected to the inner wall of the mounting frame near its four corner lines, and a controller is fixedly installed on the upper surface of the mounting frame.

[0009] When the present technology is in use, the reduction motor drives the rotating block to rotate forward one circle and then reverse one circle, the rotating block drives the displacement motor to rotate forward one circle and then reverse one circle, the sleeve frame drives the transmission screw to rotate forward one circle and then reverse one circle, the sleeve block drives the sleeve support block to rotate forward one circle and then reverse one circle, and the rotating shaft drives the enhanced shell to rotate forward one circle and then reverse one circle. At the same time, the sleeve frame drives the positioning shaft to rotate forward one circle and then reverse one circle, the positioning shaft drives the guide shaft to rotate forward one circle and then reverse one circle on the inner wall of the sliding groove, the sleeve frame drives the connecting column to rotate forward one circle and then reverse one circle, the guide roller rotates forward one circle along the inner wall of the guide groove and then reverse one circle, and the guide roller can also rotate forward one circle and then reverse one circle along the inner wall of the guide inner ring, and at the same time, the transmission screw is driven forward by the displacement motor, the transmission screw drives the sleeve block to move right under the action of the thread transmission force, the rotating shaft drives the enhanced shell to move right, and the enhanced shell drives the V-shaped sleeve strip to move the main temperature sensor to the right. When the sensing block approaches the displacement distance sensor to a specified distance, the displacement motor drives the transmission screw to reverse, the sleeve block drives the sleeve support block to move left, the sleeve support block drives the rotating shaft to move left, and the V-shaped sleeve strip causes the main temperature sensor to move left.

[0010] Preferably, the multi-directional displacement local enhanced heat dissipation mechanism comprises a micro-electric cylinder fixedly arranged on one side of the sleeve block; the output end of the micro-electric cylinder is fixedly connected with a push block, the bottom end of the push block is fixedly connected with a linkage rack, and a displacement gear is meshingly connected on one side of the inner wall of the linkage rack; a rotating shaft is fixedly installed on the inner wall of the displacement gear, a sleeve support block is provided below the displacement gear, the sleeve support block is fixedly connected with the sleeve block, and the rotating shaft is rotationally connected with the sleeve support block; an enhanced housing is fixedly installed at the bottom end of the rotating shaft, an angle sensor is fixedly installed at the top end of the rotating shaft, and the angle sensor is fixedly connected with the micro-electric cylinder, and the angle sensor is used to sense the rotation angle of the rotating shaft; the inner wall of the enhanced housing is provided with a local heat dissipation enhancement detection component. The micro-electric cylinder is slidably connected with the sleeve frame, and the cross-sectional shape of the linkage rack is concave. The center point of the rotating shaft and the center point of the output end of the angle sensor are on the same vertical line, and the vertical cross-sectional shape of the enhanced housing is circular.

[0011] When this technology is in use, the micro-electric cylinder pushes the push block to move right, the linkage rack moves right along the sleeve frame, the displacement gear causes the rotating shaft to rotate ninety degrees clockwise, the rotating shaft drives the enhanced shell to rotate ninety degrees clockwise, and the V-shaped sleeve drives the main temperature sensor to rotate ninety degrees clockwise. If the angle sensor senses positive ninety degrees, the micro-electric cylinder is started through the controller, the push block drives the linkage rack to move left, the displacement gear drives the rotating shaft to rotate ninety degrees counterclockwise, the rotating shaft drives the enhanced shell to rotate ninety degrees counterclockwise, and the V-shaped sleeve drives the main temperature sensor to rotate ninety degrees counterclockwise. When the angle sensor senses reverse ninety degrees, the micro-electric cylinder is started through the controller to drive the push block to move right.

[0012] Preferably, the local heat dissipation enhancement detection component includes a reinforcement strip fixedly arranged on the inner wall of the enhanced outer shell; an enhancement motor is fixedly installed at the bottom end of the reinforcement strip, and an enhancement roller is fixedly installed at the output end of the enhancement motor, and a plurality of enhancement blades are fixedly connected to the outer wall of the enhancement roller; a V-shaped sleeve strip is fixedly installed on one side of the enhanced outer shell, a main temperature sensor is fixedly installed on the inner wall of the V-shaped sleeve strip, a sleeve rod is fixedly connected on one side of the V-shaped sleeve strip, and a secondary temperature sensor is fixedly installed on the inner wall of the sleeve rod. The V-shaped sleeve strip is used to support the main temperature sensor, and the V-shaped sleeve strip and the sleeve rod are both made of carbon fiber material.

[0013] When the technology is in use, the enhanced shell supports the V-shaped sleeve strip, and the V-shaped sleeve strip supports the main temperature sensor, and the sleeve rod supports the auxiliary temperature sensor. When the temperature of the local area sensed by the main temperature sensor is higher than the temperature value set by the controller, the reduction motor, the displacement motor and the micro-electric cylinder are shut down by the controller, so that the auxiliary temperature sensor can perform temperature calibration on the local high-temperature area of ​​the computer all-in-one motherboard, and ensure that when the sensing temperatures of the main temperature sensor and the auxiliary temperature sensor exceed the set local temperature values, the enhanced motor starts the enhanced roller to rotate, and realizes high-speed operation of the enhanced motor, so that the local high-temperature area of ​​the computer all-in-one motherboard covered by the enhanced shell can achieve high-speed flow heat dissipation cooling until the temperature values ​​sensed by the main temperature sensor and the auxiliary temperature sensor are lower than the temperature set by the controller.

[0014] The present invention has the following advantages:

[0015] 1. The present invention locally enhances the heat dissipation mechanism by driving the reduction motor to drive the rotating block to rotate forward one circle and then reverse one circle, the displacement motor causes the sleeve frame to rotate forward one circle and then reverse one circle, the sleeve frame drives the transmission screw to rotate forward one circle and then reverse one circle, the sleeve block drives the sleeve support block to rotate forward one circle and then reverse one circle, the rotating shaft drives the enhanced shell to rotate forward one circle and then reverse one circle, the sleeve frame drives the connecting column to rotate forward one circle and then reverse one circle, the connecting column causes the guide roller to rotate forward one circle and then reverse one circle, the displacement motor drives the transmission screw to rotate forward, the transmission screw drives the sleeve block to move right under the action of the thread transmission force, when the sensing block approaches the displacement distance sensor to a specified distance, the displacement motor drives the transmission screw to reverse, so that the main temperature sensor and multiple enhanced blades can be surrounded in a circle and moved laterally, the local high-temperature position of the computer integrated machine motherboard can be automatically and quickly known, and the automatic enhanced heat dissipation cooling operation can be automatically performed according to the local high-temperature position of the computer integrated machine motherboard, thereby greatly improving the heat dissipation cooling effect;

[0016] 2. The present invention has a multi-directional displacement local enhanced heat dissipation mechanism. The micro-electric cylinder is started by a controller, and the micro-electric cylinder pushes the push block to move right, and the push block drives the linkage rack to move right, and the linkage rack moves right along the sleeve frame. The rotating shaft rotates ninety degrees clockwise inside the sleeve support block, and the enhanced shell drives the V-shaped sleeve to rotate ninety degrees clockwise. The main temperature sensor rotates ninety degrees clockwise, and the micro-electric cylinder drives the push block to move left, and the push block drives the linkage rack to move left. The rotating shaft rotates ninety degrees counterclockwise along the inner wall of the sleeve support block, and the rotating shaft drives the enhanced shell to rotate ninety degrees counterclockwise. The micro-electric cylinder is started by the controller to drive the push block to move right, so that the main temperature sensor and multiple enhanced blades can be displaced in multiple directions, and the local high-temperature position of the computer all-in-one motherboard is automatically and quickly known, and the enhanced heat dissipation cooling operation is automatically performed.

[0017] 3. The present invention uses a local heat dissipation enhancement detection component, a rotating shaft to support the enhanced shell, the enhanced shell supports the reinforcement strip, the V-shaped sleeve strip supports the main temperature sensor, the V-shaped sleeve strip supports the sleeve rod, and the sleeve rod supports the auxiliary temperature sensor. When the temperature of the local area sensed by the main temperature sensor is higher than the temperature value set by the controller, the reduction motor, the displacement motor and the micro-electric cylinder are turned off by the controller, and the auxiliary temperature sensor can perform temperature calibration on the local high-temperature area of ​​the computer all-in-one motherboard. The enhanced motor starts the enhanced roller to rotate, and the enhanced roller drives multiple enhanced blades to rotate, so that the local high-temperature area of ​​the computer all-in-one motherboard covered by the enhanced shell can achieve high-speed flow heat dissipation cooling, and the local high-temperature position of the computer all-in-one motherboard is automatically and quickly known to achieve positioning heat dissipation cooling operation.

[0018] According to the mutual influence of the above multiple effects, firstly, the main temperature sensor and multiple enhanced blades can be surrounded in a circle and moved laterally, and secondly, the main temperature sensor and multiple enhanced blades can be displaced in multiple directions, and finally, it is known that the temperature of the local area sensed by the main temperature sensor is higher than the temperature value set by the controller, so that the local high-temperature area of ​​the computer all-in-one mainboard covered by the enhanced shell can achieve high-speed flow heat dissipation cooling. In summary, a circle can be surrounded and a horizontal displacement can be performed, and the main temperature sensor and multiple enhanced blades can be displaced in multiple directions, so that the local high-temperature position of the computer all-in-one mainboard can be searched and located, and the local high-temperature position of the computer all-in-one mainboard can be automatically and quickly known, and the automatic enhanced heat dissipation cooling operation can be automatically performed according to the local high-temperature position of the computer all-in-one mainboard, greatly improving the heat dissipation cooling effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0020] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0021] Figure 1 It is a schematic diagram of the main structure of the heat dissipation structure of the all-in-one computer of the present invention;

[0022] Figure 2 It is a schematic diagram of the vertical cross-section structure of the heat dissipation structure of the all-in-one computer of the present invention;

[0023] Figure 3 It is a schematic diagram of a partial structure of the connection between the mounting frame and the heat dissipation motor of the present invention;

[0024] Figure 4 It is a schematic diagram of the partial structure of the connection between the sleeve frame and the positioning shaft of the present invention;

[0025] Figure 5 It is a schematic diagram of a partial structure of a vertical section of the connection between the guide outer ring and the mounting frame of the present invention;

[0026] Figure 6 For the present invention Figure 5 The enlarged structural diagram at A in the middle;

[0027] Figure 7 It is a schematic diagram of the partial structure of the local heat dissipation enhancement detection component of the present invention from a side view;

[0028] Figure 8 This is a schematic diagram of the partial structure of the local heat dissipation enhancement detection component of the present invention from a front view;

[0029] Fig. 9 It is a schematic diagram of the local structure of the connection between the V-shaped sleeve strip and the main temperature sensor of the present invention;

[0030] In the figure: 1. mounting frame; 2. heat dissipation motor; 3. heat dissipation shaft; 4. support bar; 5. reduction motor; 6. rotating block; 7. displacement motor; 8. sleeve frame; 9. transmission screw; 10. sleeve block; 11. connecting column; 12. guide roller; 13. guide inner ring; 14. guide groove; 15. positioning shaft; 16. guide shaft; 17. guide outer ring; 18. sliding groove; 19. induction block; 20. displacement distance sensor; 21. heat dissipation blade; 22. mounting bolt; 23. controller; 24. micro electric cylinder; 25. push block; 26. linkage rack; 27. displacement gear; 28. sleeve support block; 29. ​​rotating shaft; 30. reinforced shell; 31. angle sensor; 32. reinforcement bar; 33. reinforced motor; 34. reinforced roller; 35. reinforced blade; 36. V-shaped sleeve strip; 37. main temperature sensor; 38. sleeve rod; 39. auxiliary temperature sensor. DETAILED DESCRIPTION

[0031] The following is a description of the implementation of the present invention by specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0032] As attached Figure 1-8 A heat dissipation structure of an all-in-one computer is shown, and the heat dissipation structure of the all-in-one computer is provided with a surrounding displacement local enhanced heat dissipation mechanism, a multi-directional displacement local enhanced heat dissipation mechanism, and a local heat dissipation enhancement detection component. The settings of each mechanism and component can be arranged in a circle and moved laterally, and the main temperature sensor 37 and multiple enhanced blades 35 can be displaced in multiple directions, and the local high-temperature position of the mainboard of the all-in-one computer can be found and located, and the local high-temperature position of the mainboard of the all-in-one computer can be automatically and quickly known. According to the local high-temperature position of the mainboard of the all-in-one computer, the all-in-one computer can automatically perform automatic enhanced heat dissipation cooling operations, thereby greatly improving the heat dissipation cooling effect. The specific structural settings of each mechanism and component are as follows.

[0033] In this technical solution, as shown in the attached Figure 1-4As shown, the heat dissipation motor 2 is fixed on the inner wall of the mounting frame 1, the heat dissipation shaft 3 is fixedly connected to the output end of the heat dissipation motor 2, the outer wall of the heat dissipation motor 2 is provided with a support bar 4, and one side of the support bar 4 is provided with a local enhanced heat dissipation mechanism around displacement; the local enhanced heat dissipation mechanism around displacement includes a reduction motor 5 fixedly arranged on one side of the support bar 4, and the output end of the reduction motor 5 is fixedly connected with a rotating block 6, one end of the rotating block 6 is fixedly installed with a displacement motor 7, one side of the displacement motor 7 is fixedly connected with a sleeve frame 8, the inner wall of the sleeve frame 8 is rotatably connected with a transmission screw 9, and the displacement motor 7 is used to drive the transmission screw 9 to rotate; the outer wall of the transmission screw 9 is threadedly connected with a sleeve block 10, one side of the sleeve frame 8 and close to the position of the displacement motor 7 is fixedly connected with a connecting column 11, and one end of the connecting column 11 is fixedly installed with a guide roller 12, and the outer wall of the guide roller 12 is slidably connected with a guide inner ring 13; one side of the sleeve block 10 is provided with a multi-directional displacement local enhanced heat dissipation mechanism. The output end of the displacement motor 7 is fixedly connected to the transmission screw 9 , and the outer wall of the sleeve block 10 is slidably connected to the sleeve frame 8 .

[0034] In this technical solution, as shown in the attached Figure 3-4 As shown, a guide groove 14 is provided on the inner wall of the guide inner ring 13, and the guide roller 12 is slidingly connected to the guide inner ring 13 to which the guide groove 14 belongs, and the guide inner ring 13 is fixedly connected to the mounting frame 1, so that the guide roller 12 can rotate forward one circle and then reverse one circle along the inner wall of the guide groove 14, thereby realizing the guide rotation operation of the guide roller 12.

[0035] A positioning shaft 15 is fixedly connected to one side of the sleeve frame 8 and close to the sleeve block 10, and a guide shaft 16 is fixedly installed at one end of the positioning shaft 15; a guide outer ring 17 is slidably connected to the outer wall of the guide shaft 16, and a sliding groove 18 is provided on the inner wall of the guide outer ring 17, the guide shaft 16 is slidably connected to the guide outer ring 17 to which the sliding groove 18 belongs, and the guide outer ring 17 is fixedly connected to the mounting frame 1, so that the sleeve frame 8 drives the positioning shaft 15 to rotate forward one circle and then reverse one circle, the positioning shaft 15 drives the guide shaft 16 to rotate forward one circle on the inner wall of the sliding groove 18 and then reverse one circle, and the guide outer ring 17 guides the guide shaft 16 to realize the guided rotation operation of the guide shaft 16.

[0036] In this technical solution, as shown in the attached Figure 1-4As shown, a sensing block 19 is fixedly installed on the other side of the sleeve block 10, and a displacement distance sensor 20 is provided on one side of the sensing block 19, and the displacement distance sensor 20 is fixedly connected to the sleeve frame 8; the top surface of the displacement distance sensor 20 and the top surface of the sensing block 19 are in the same horizontal plane; a plurality of heat dissipation blades 21 are fixedly connected to the outer wall of the heat dissipation shaft 3, and mounting bolts 22 are threadedly connected to the inner wall of the mounting frame 1 and near its four corner lines, and a controller 23 is fixedly installed on the upper surface of the mounting frame 1, so that the four mounting bolts 22 on the mounting frame 1 can be respectively docked at the heat dissipation position of the computer all-in-one motherboard, so that by rotating the plurality of mounting bolts 22, the mounting bolts 22 can be installed and docked with the computer all-in-one, and the distance of the sensing block 19 is sensed by the displacement distance sensor 20, and when the sensing block 19 approaches the displacement distance sensor 20 to a specified distance, the transmission screw 9 is driven to reverse by the displacement motor 7.

[0037] In this technical solution, as shown in the attached Figure 4-6 As shown, the multi-directional displacement local enhanced heat dissipation mechanism includes a micro-electric cylinder 24 fixedly arranged on one side of the sleeve block 10; a push block 25 is fixedly connected to the output end of the micro-electric cylinder 24, a linkage rack 26 is fixedly connected to the bottom end of the push block 25, and a displacement gear 27 is meshingly connected to one side of the inner wall of the linkage rack 26; a rotating shaft 29 is fixedly installed on the inner wall of the displacement gear 27, a sleeve support block 28 is provided below the displacement gear 27, the sleeve support block 28 is fixedly connected to the sleeve block 10, and the rotating shaft 29 is rotationally connected to the sleeve support block 28; an enhanced housing 30 is fixedly installed on the bottom end of the rotating shaft 29, an angle sensor 31 is fixedly installed on the top end of the rotating shaft 29, and the angle sensor 31 is fixedly connected to the micro-electric cylinder 24, and the angle sensor 31 is used to sense the rotation angle of the rotating shaft 29; a local heat dissipation enhancement detection component is provided on the inner wall of the enhanced housing 30. The micro-electric cylinder 24 is slidably connected to the sleeve frame 8, and the cross-sectional shape of the linkage rack 26 is concave. The center point of the rotating shaft 29 and the center point of the output end of the angle sensor 31 are located on the same vertical line, and the vertical cross-section of the reinforced housing 30 is in the shape of a circular ring.

[0038] In this technical solution, as shown in the attached Figure 7-9As shown, the local heat dissipation enhancement detection assembly includes a reinforcement strip 32 fixedly arranged on the inner wall of the enhancement housing 30; an enhancement motor 33 is fixedly installed at the bottom end of the reinforcement strip 32, and an enhancement roller 34 is fixedly installed at the output end of the enhancement motor 33, and a plurality of enhancement blades 35 are fixedly connected to the outer wall of the enhancement roller 34; a V-shaped sleeve strip 36 is fixedly installed on one side of the enhancement housing 30, a main temperature sensor 37 is fixedly installed on the inner wall of the V-shaped sleeve strip 36, a sleeve rod 38 is fixedly connected to one side of the V-shaped sleeve strip 36, and an auxiliary temperature sensor 39 is fixedly installed on the inner wall of the sleeve rod 38. The V-shaped sleeve strip 36 is used to support the main temperature sensor 37, and the V-shaped sleeve strip 36 and the sleeve rod 38 are both made of carbon fiber material.

[0039] The use process of the heat dissipation structure of the computer all-in-one machine of the present invention is as follows:

[0040] Step 1: When installing the heat dissipation cooling, the four mounting bolts 22 on the mounting frame 1 are respectively docked at the heat dissipation mounting position of the computer integrated machine motherboard, so that by rotating multiple mounting bolts 22, the mounting bolts 22 can be installed and docked with the computer integrated machine, and at the same time, there is a certain gap between the guide inner ring 13 and the position of the computer integrated machine motherboard, and the mounting frame 1 can be fixedly installed. At the same time, the controller 23 starts the heat dissipation motor 2, and the heat dissipation motor 2 drives the heat dissipation shaft 3 to rotate. The mounting frame 1 supports the heat dissipation motor 2, so that the heat dissipation shaft 3 drives the multiple heat dissipation blades 21 to rotate, so that the heat generated by the computer integrated machine motherboard can be dissipated and discharged, and the heat dissipation operation of the computer integrated machine motherboard can be realized.

[0041] Step 2: When the heat dissipation is enhanced around the displacement, the controller 23 drives the reduction motor 5, the reduction motor 5 drives the rotating block 6 to rotate forward one circle and then reverse one circle, the rotating block 6 drives the displacement motor 7 to rotate forward one circle and then reverse one circle, the displacement motor 7 makes the sleeve frame 8 rotate forward one circle and then reverse one circle, the sleeve frame 8 drives the transmission screw 9 to rotate forward one circle and then reverse one circle, and the transmission screw 9 drives the sleeve block 10 to rotate forward one circle and then reverse one circle, the sleeve block 10 drives the sleeve support block 28 to rotate forward one circle and then reverse one circle, the sleeve support block 28 drives the rotating shaft 29 to rotate forward one circle and then reverse one circle, and the rotating shaft 29 drives the enhanced shell 30 to rotate forward one circle and then reverse one circle. At the same time, the sleeve frame 8 drives the positioning shaft 15 to rotate forward one circle and then reverse one circle, the positioning shaft 15 drives the guide shaft 16 to rotate forward one circle and then reverse one circle on the inner wall of the sliding groove 18, and the guide outer ring 17 guides the guide shaft 16. At the same time, the sleeve frame 8 drives the connecting column 11 to rotate forward one circle and then reverse one circle. The connecting column 11 causes the guide roller 12 to rotate forward one circle and then reverse one circle. The guide roller 12 rotates forward one circle and then reverse one circle along the inner wall of the guide groove 14, and the guide roller 12 can also rotate forward one circle and then reverse one circle along the inner wall of the guide inner ring 13.

[0042] At the same time, the transmission screw 9 is driven to rotate forward through the displacement motor 7, and the transmission screw 9 rotates forward on the inner wall of the sleeve frame 8. The transmission screw 9 drives the sleeve block 10 to move right under the action of the thread transmission force, and the sleeve block 10 drives the sleeve support block 28 to move right, and the sleeve support block 28 drives the rotating shaft 29 to move right, and the rotating shaft 29 drives the reinforced shell 30 to move right, and the reinforced shell 30 drives the V-shaped sleeve strip 36 to make the main temperature sensor 37 move right. The distance sensing of the induction block 19 is performed through the displacement distance sensor 20. When the induction block 19 approaches the displacement distance sensor 20 to a specified distance, the transmission screw 9 is driven to reverse by the displacement motor 7. The transmission screw 9 drives the sleeve block 10 to move left under the action of the thread transmission force. At the same time, the sleeve block 10 drives the sleeve support block 28 to move left, the sleeve support block 28 drives the rotating shaft 29 to move left, the rotating shaft 29 drives the enhanced shell 30 to move left, the enhanced shell 30 drives the V-shaped sleeve strip 36 to move left, and the V-shaped sleeve strip 36 causes the main temperature sensor 37 to move left. As the reduction motor 5 continuously switches between positive and negative rotations, and the displacement motor 7 continuously switches between positive and negative rotations, the main temperature sensor 37 and the multiple enhanced blades 35 can be surrounded in a circle, and the main temperature sensor 37 and the multiple enhanced blades 35 synchronously perform lateral displacement movement, and the local high-temperature position of the computer all-in-one motherboard is detected, so as to know the specific position of the local enhanced heat dissipation.

[0043] Step three, when multi-directional displacement is used for local enhanced heat dissipation, the micro-electric cylinder 24 is started through the controller 23, and the micro-electric cylinder 24 pushes the push block 25 to move right, and the push block 25 drives the linkage rack 26 to move right, and the linkage rack 26 moves right along the sleeve frame 8, so that the linkage rack 26 drives the displacement gear 27 to rotate clockwise, and the displacement gear 27 causes the rotating shaft 29 to rotate ninety degrees clockwise, and the rotating shaft 29 rotates ninety degrees clockwise inside the sleeve support block 28, and the rotating shaft 29 drives the enhanced shell 30 to rotate ninety degrees clockwise, and the enhanced shell 30 drives the V-shaped sleeve strip 36 to rotate ninety degrees clockwise, and the V-shaped sleeve strip 36 drives the main temperature sensor 37 to rotate ninety degrees clockwise.

[0044] The angle sensor 31 senses the angle of the rotating shaft 29. When the angle sensor 31 senses positive 90 degrees, the controller 23 starts the micro-electric cylinder 24, which drives the push block 25 to move left, the push block 25 drives the linkage rack 26 to move left, the linkage rack 26 drives the displacement gear 27 to rotate counterclockwise by 90 degrees, the displacement gear 27 drives the rotating shaft 29 to rotate counterclockwise by 90 degrees, the rotating shaft 29 rotates counterclockwise by 90 degrees along the inner wall of the sleeve support block 28, the rotating shaft 29 drives the reinforced housing 30 to rotate counterclockwise by 90 degrees, the reinforced housing 30 drives the V-shaped sleeve strip 36 to rotate counterclockwise by 90 degrees, and the V-shaped sleeve strip 36 drives the main temperature sensor 37 to rotate counterclockwise by 90 degrees. When the angle sensor 31 senses negative 90 degrees, the controller 23 starts the micro-electric cylinder 24 to drive the push block 25 to move right, so that the main temperature sensor 37 and the plurality of reinforced blades 35 can be displaced in multiple directions.

[0045] Step 4: During the local heat dissipation enhancement test, the enhanced housing 30 is supported by the rotating shaft 29, the enhanced housing 30 supports the reinforcement strip 32, and the reinforcement strip 32 supports the enhanced motor 33. At the same time, the enhanced housing 30 supports the V-shaped sleeve strip 36, and the V-shaped sleeve strip 36 supports the main temperature sensor 37, the V-shaped sleeve strip 36 supports the sleeve rod 38, and the sleeve rod 38 supports the auxiliary temperature sensor 39, so that the main temperature sensor 37 can perform a circular ring around the local high temperature area of ​​the computer integrated machine motherboard, as well as a lateral displacement test, and can also perform multi-directional displacement test on the local high temperature area of ​​the computer integrated machine motherboard.

[0046] When the temperature of the local area sensed by the main temperature sensor 37 is higher than the temperature value set by the controller 23, the reduction motor 5, the displacement motor 7 and the micro-electric cylinder 24 are turned off by the controller 23, so that the auxiliary temperature sensor 39 can perform temperature calibration on the local high-temperature area of ​​the computer all-in-one motherboard to ensure that the temperatures sensed by the main temperature sensor 37 and the auxiliary temperature sensor 39 exceed the set local temperature values. Then, the enhanced motor 33 is started by the controller 23, and the enhanced motor 33 starts the enhanced roller 34 to rotate, and the enhanced roller 34 drives the multiple enhanced blades 35 to rotate, thereby realizing high-speed operation of the enhanced motor 33, so that the local high-temperature area of ​​the computer all-in-one motherboard covered by the enhanced shell 30 can achieve high-speed flow heat dissipation cooling, until the temperature values ​​sensed by the main temperature sensor 37 and the auxiliary temperature sensor 39 are lower than the temperature set by the controller 23, so that the local high-temperature position of the computer all-in-one motherboard can be automatically known in time, and automatic enhanced heat dissipation cooling can be automatically performed according to the local high-temperature position of the computer all-in-one motherboard, thereby greatly improving the heat dissipation cooling effect of the computer all-in-one motherboard.

[0047] The contents not described in detail in the specification belong to the prior art known to those skilled in the art, and the model parameters of each electrical appliance are not specifically limited, and conventional equipment can be used. In this technical solution, the electrical control components not mentioned are not shown in the figure because they belong to the prior art and will not be described here.

[0048] The present invention has been described in detail above by general description and specific embodiments, but it is obvious to those skilled in the art that some modifications or improvements can be made on the basis of the present invention. Therefore, these modifications or improvements made on the basis of not departing from the spirit of the present invention all belong to the scope of protection claimed by the present invention.

Claims

1. A heat dissipation structure of an all-in-one computer, comprising a mounting frame (1), a heat dissipation motor (2) and a heat dissipation shaft (3), characterized in that: The heat dissipation motor (2) is fixed to the inner wall of the mounting frame (1), the heat dissipation shaft (3) is fixedly connected to the output end of the heat dissipation motor (2), the outer wall of the heat dissipation motor (2) is provided with a support bar (4), and one side of the support bar (4) is provided with a surrounding displacement local enhanced heat dissipation mechanism; The locally enhanced heat dissipation mechanism around displacement comprises a reduction motor (5) fixedly arranged on one side of the support bar (4), and the output end of the reduction motor (5) is fixedly connected to a rotating block (6), one end of the rotating block (6) is fixedly mounted with a displacement motor (7), one side of the displacement motor (7) is fixedly connected to a sleeve frame (8), the inner wall of the sleeve frame (8) is rotatably connected to a transmission screw (9), and the displacement motor (7) is used to drive the transmission screw (9) to rotate; the outer wall of the transmission screw (9) is threadedly connected to a sleeve block (10), one side of the sleeve frame (8) and close to the position of the displacement motor (7) is fixedly connected to a connecting column (11), and one end of the connecting column (11) is fixedly mounted with a guide roller (12), and the outer wall of the guide roller (12) is slidably connected to a guide inner ring (13); A multi-directional displacement local enhanced heat dissipation mechanism is provided on one side of the sleeve block (10); a positioning shaft (15) is fixedly connected to one side of the sleeve frame (8) and close to the sleeve block (10); a guide shaft (16) is fixedly installed on one end of the positioning shaft (15); a guide outer ring (17) is slidably connected to the outer wall of the guide shaft (16); a sliding groove (18) is provided on the inner wall of the guide outer ring (17); the guide shaft (16) and the guide outer ring (17) to which the sliding groove (18) belongs are slidably connected; the guide outer ring (17) is fixedly connected to the mounting frame (1); A sensing block (19) is fixedly mounted on the other side of the sleeve block (10); a displacement distance sensor (20) is provided on one side of the sensing block (19); and the displacement distance sensor (20) is fixedly connected to the sleeve frame (8); the top surface of the displacement distance sensor (20) and the top surface of the sensing block (19) are in the same horizontal plane; a plurality of cooling blades (21) are fixedly connected to the outer wall of the heat dissipation shaft (3); mounting bolts (22) are threadedly connected to the inner wall of the mounting frame (1) and near the four corner lines thereof; and a controller (23) is fixedly mounted on the upper surface of the mounting frame (1).

2. The heat dissipation structure of the all-in-one computer according to claim 1, characterized in that: The output end of the position-changing motor (7) is fixedly connected to the transmission screw (9), and the outer wall of the sleeve block (10) is slidably connected to the sleeve frame (8).

3. The heat dissipation structure of the all-in-one computer according to claim 1, characterized in that: The inner wall of the guide inner ring (13) is provided with a guide groove (14), the guide roller (12) and the guide inner ring (13) to which the guide groove (14) belongs are slidably connected, and the guide inner ring (13) and the mounting frame (1) are fixedly connected.

4. The heat dissipation structure of the all-in-one computer according to claim 1, characterized in that: The multi-directional displacement locally enhanced heat dissipation mechanism comprises a micro electric cylinder (24) fixedly arranged on one side of the sleeve block (10); The output end of the micro-electric cylinder (24) is fixedly connected to a push block (25), the bottom end of the push block (25) is fixedly connected to a linkage rack (26), and a displacement gear (27) is meshingly connected to one side of the inner wall of the linkage rack (26); A rotating shaft (29) is fixedly mounted on the inner wall of the shifting gear (27); a sleeve support block (28) is provided below the shifting gear (27); the sleeve support block (28) is fixedly connected to the sleeve block (10); and the rotating shaft (29) is rotatably connected to the sleeve support block (28); A reinforced housing (30) is fixedly mounted on the bottom end of the rotating shaft (29), an angle sensor (31) is fixedly mounted on the top end of the rotating shaft (29), and the angle sensor (31) is fixedly connected to the micro electric cylinder (24), and the angle sensor (31) is used to sense the rotation angle of the rotating shaft (29); The inner wall of the enhanced housing (30) is provided with a local heat dissipation enhancement detection component, the micro-electric cylinder (24) is slidably connected to the sleeve frame (8), and the cross-sectional shape of the linkage rack (26) is concave.

5. The heat dissipation structure of the all-in-one computer according to claim 4, characterized in that: The center point of the rotating shaft (29) and the center point of the output end of the angle sensor (31) are located on the same vertical line, and the vertical cross-section of the enhanced housing (30) is in the shape of a circular ring.

6. The heat dissipation structure of the all-in-one computer according to claim 4, characterized in that: The local heat dissipation enhancement detection component comprises a reinforcement strip (32) fixedly arranged on the inner wall of the enhancement housing (30); A reinforcing motor (33) is fixedly mounted on the bottom end of the reinforcing strip (32), and a reinforcing roller (34) is fixedly mounted on the output end of the reinforcing motor (33), and a plurality of reinforcing blades (35) are fixedly connected to the outer wall of the reinforcing roller (34); A V-shaped sleeve strip (36) is fixedly mounted on one side of the reinforced housing (30), a main temperature sensor (37) is fixedly mounted on the inner wall of the V-shaped sleeve strip (36), a sleeve rod (38) is fixedly connected to one side of the V-shaped sleeve strip (36), and a secondary temperature sensor (39) is fixedly mounted on the inner wall of the sleeve rod (38).

7. The heat dissipation structure of the all-in-one computer according to claim 6, characterized in that: The V-shaped sleeve strip (36) is used to support the main temperature sensor (37); the V-shaped sleeve strip (36) and the sleeve rod (38) are both made of carbon fiber material.

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