A TOP RGB LED lamp bead structure based on indicator light type and its preparation method

Abstract

The present invention discloses a TOP RGB LED lamp bead structure based on an indicator light type and a preparation method thereof, relating to the technical field of surface mount LED devices. The lamp bead structure includes an insulating base, a metal bracket, an RGB LED chip, a wire bonding station, a common electrode pin, and a packaging colloid. The metal bracket includes a metal packaging cup body, the bottom of which protrudes from the bottom surface of the insulating base to form a negative electrode pin. The RGB LED chip is mounted in the die bonding area of ​​the metal packaging cup body. The RGB LED chip is electrically connected to the wire bonding area of ​​the wire bonding station via bonding wires. The common electrode pin is disposed outside the insulating base, and the wire bonding station and the common electrode pin are electrically connected. The present invention improves the lamp bead structure to combine the RGB lamp beads into one lamp bead, which can enhance the display effect of the indicator light and facilitate integration. In addition, through structural improvements, the lamp bead structure of the present invention also has the advantages of high heat dissipation, high brightness, and high airtightness, solving the shortcomings of existing LED lamp beads, such as poor heat dissipation performance and difficulty in integration.

Description

Technical Field

[0001] The present invention relates to the technical field of surface mount LED devices, and in particular to a TOP RGB LED lamp bead structure based on an indicator light type and a preparation method thereof. Background Art

[0002] The LEDs used in modern traffic lights feature intelligent control and adaptive capabilities, allowing them to adjust signal durations in real time based on traffic flow, thereby improving traffic efficiency. This intelligent development trend helps optimize urban traffic flow management, reduce congestion, and enhance road safety. High-brightness LEDs ensure excellent visibility in adverse weather conditions, ensuring safe driving. This characteristic is crucial for improving road safety, especially at night or in inclement weather, significantly improving driver visibility and reaction time. Compared to traditional traffic lights, LED lights offer significant advantages in energy efficiency and environmental friendliness. This trend aligns with sustainable development requirements, helping to reduce energy consumption and environmental impact, and aligns with modern society's pursuit of green and low-carbon living. Furthermore, industry experts conducted an in-depth discussion on the development trends of the LED traffic light industry, predicting that the application of LED technology in traffic signals will become even more widespread in the future, providing more intelligent, efficient, and environmentally friendly solutions for urban traffic management and safety.

[0003] Currently, the primary type of LED used in traffic lights is a plug-in type. These are a common type of LED and are widely used in traffic lights. These LEDs come in a variety of colors and sizes, such as 5mm bullet-shaped square lamps, 2mm long nipple-shaped lamps, and 4mm round-headed LEDs, to suit various signal light requirements. Plug-in LEDs feature low power consumption, high brightness, compact size, light weight, and a long lifespan, making them ideal for traffic lights. Compared to traditional incandescent and low-voltage halogen lamps, LEDs offer significant advantages in brightness, lifespan, and energy efficiency, and are therefore gradually replacing traditional light sources in traffic lights.

[0004] While plug-in LEDs offer advantages in brightness, lifespan, and energy efficiency, their typically large size and thick package limit effective heat transfer, resulting in poor heat dissipation. This means that under high-intensity use, they will operate at higher temperatures, potentially affecting their lifespan and stability. Furthermore, their design also results in a larger size, making them difficult to integrate. In modern electronic devices and lighting, space efficiency is crucial, and the larger size of plug-in LEDs may limit their use in certain applications. Summary of the Invention

[0005] In view of the above-mentioned deficiencies in the prior art, the purpose of the present invention is to propose a TOP RGBLED lamp bead structure based on the indicator light type. By improving the lamp bead structure and merging the RGB (red, green, and blue) lamp beads into one lamp bead, the indicator light display effect can be improved and integration is facilitated. Moreover, through structural improvement, the lamp bead structure of the present invention has the advantages of high heat dissipation, high brightness and high air tightness, which solves the shortcomings of poor heat dissipation performance and difficult integration of existing LED lamp beads.

[0006] Another object of the present invention is to provide a method for preparing a TOP RGB LED lamp bead structure based on an indicator light type, which is used to prepare the above-mentioned TOP RGB LED lamp bead structure based on an indicator light type.

[0007] In order to solve the above technical problems, the present invention provides a TOP RGB LED lamp bead structure based on the indicator light type, including an insulating base, a metal bracket, an RGB LED chip, a wire bonding station, a common electrode pin and a packaging colloid, wherein the metal bracket and the wire bonding station are respectively embedded in the interior of the insulating base;

[0008] The metal bracket includes a downwardly concave metal packaging cup body, the inner bottom surface of the metal packaging cup body is a crystal fixing area, and the bottom of the metal packaging cup body protrudes from the bottom surface of the insulating seat to form a negative electrode pin;

[0009] The RGB LED chip is mounted on the die-bonding area of ​​the metal packaging cup, and the bottom end of the RGB LED chip is electrically connected to the die-bonding area of ​​the metal packaging cup;

[0010] The wire bonding station is correspondingly provided on one side of the metal packaging cup body, and the RGB LED chip is electrically connected to the wire bonding area of ​​the wire bonding station through bonding wires;

[0011] The common-pole pin is arranged outside the insulating seat, and the wire bonding station is electrically connected to the common-pole pin;

[0012] The packaging colloid is filled in the interior of the metal packaging cup, and the top of the packaging colloid protrudes from the top surface of the insulating seat, or the top surface of the packaging colloid is flush with the top surface of the insulating seat.

[0013] As an improvement of the above solution, three metal brackets (2) are provided, and each metal bracket (2) is provided with a downwardly concave metal packaging cup (21);

[0014] The RGB LED chip includes a red LED chip, a green LED chip, and a blue LED chip. The red LED chip, the green LED chip, and the blue LED chip are respectively bonded to the die-bonding areas of the three metal packaging cups, and the bottom ends of the red LED chip, the green LED chip, and the blue LED chip are respectively electrically connected to the die-bonding areas of the three metal packaging cups.

[0015] A wire bonding station is correspondingly provided on one side of each metal packaging cup body, and the red LED chip, the green LED chip and the blue LED chip are electrically connected to the corresponding wire bonding area of ​​the wire bonding station through different bonding wires.

[0016] As an improvement of the above solution, the indicator light-type TOP RGB LED lamp bead structure includes two common-pole pins, and the two common-pole pins are respectively arranged on both sides of the insulating seat;

[0017] Two sides of each wire bonding station are respectively connected to the two common electrode pins.

[0018] As an improvement to the above solution, the top of the encapsulating colloid protrudes from the top surface of the insulating seat, and the top of the encapsulating colloid is spherical.

[0019] As an improvement to the above solution, the surfaces of the wire bonding platform, the common electrode pin and the metal bracket are respectively provided with a nickel layer and a silver layer from the inside to the outside.

[0020] As an improvement to the above solution, the wire bonding area of ​​the wire bonding stage is surrounded by a packaging colloid.

[0021] As an improvement to the above solution, the metal packaging cup body is in the shape of an inverted truncated cone.

[0022] As an improvement of the above solution, the length of the indicator light-type TOP RGB LED lamp bead structure is 2.0-4.0 mm, the width is 2.0-4.0 mm, and the height is 1.0-1.6 mm.

[0023] As an improvement to the above solution, the RGB LED chip is a vertical single-electrode RGB chip.

[0024] As an improvement to the above solution, the insulating seat is made of PPA.

[0025] As an improvement to the above solution, the metal bracket, wire bonding platform and common electrode pin are made of copper.

[0026] Accordingly, the present invention also provides a method for preparing a TOP RGB LED lamp bead structure based on an indicator light type, which is used to prepare the above-mentioned TOP RGB LED lamp bead structure based on an indicator light type, comprising the following steps:

[0027] (1) stamping and stretching the metal substrate, and stamping out unnecessary parts to obtain a mother metal bracket including a wire bonding platform and a metal packaging cup body, wherein protrusions are provided on both sides of the mother metal bracket, and a gap is provided between the wire bonding platform and the metal packaging cup body; then electroplating is performed to form a nickel layer and a silver layer on the surface of the metal substrate in sequence;

[0028] (2) Injection molding is performed on the top and bottom surfaces of the parent metal bracket to form an insulating seat, and the bottom of the metal packaging cup body protrudes from the bottom surface of the insulating seat, so that the bottom of the metal packaging cup body serves as the negative electrode pin;

[0029] (3) Punching out the connecting portion between the mother metal bracket and the protrusion, so that the mother metal bracket is divided into three metal brackets, and each metal bracket is provided with a corresponding metal packaging cup body, and the two protrusions are bent to form common-pole pins on both sides of the insulating seat;

[0030] (4) Fixing the RGB LED chip to the inner bottom surface of the metal packaging cup body, and connecting the RGB LED chip and the wire bonding area of ​​the wire bonding station through bonding wires;

[0031] (5) The packaging glue is used for packaging, so that the interior of the metal packaging cup is filled with the packaging glue, and the packaging glue is formed after curing to obtain the TOP RGB LED lamp bead structure based on the indicator light type.

[0032] The implementation of the present invention has the following beneficial effects: the present technical solution improves the overall structure of the lamp bead structure, innovatively integrates the originally dispersed RGB (red, green, and blue) lamp beads into a single package, achieves a better integration effect, makes the overall volume of the lamp bead structure smaller, and is more conducive to integration. Compared with the original structure with a traditional dispersed layout, the lamp bead structure of the present technical solution is conducive to improving the display effect and layout of the indicator light, improving the display clarity, and at the same time helps to simplify the circuit design and assembly process of the indicator light. In addition, the lamp bead structure of the present technical solution has the advantages of high heat dissipation, high brightness and high air tightness, ensuring that it can still maintain a low operating temperature under high-intensity working conditions, effectively extending the service life of the lamp bead structure, and improving the stability and reliability of the system; at the same time, its high brightness characteristics ensure that the indication information can be clearly visible even under darker or long-distance viewing conditions, further broadening the application scenarios; in addition, the high airtightness design effectively resists the erosion of harmful factors such as moisture and dust in the external environment, ensuring the long-term stable operation of the internal electronic components, and is particularly suitable for use in harsh or special environmental conditions. At the application level, this technical solution is based on the indicator light type TOP RGBLED lamp bead structure and is not only suitable for indicator applications, but can also be used as a display screen, such as LED display screens, smart wearable devices, car display screens and other fields. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 This is a schematic diagram of the structure of a TOP RGB LED lamp bead based on an indicator light type in one embodiment of the present invention;

[0034] Figure 2 yes Figure 1 The embodiment shown is based on a cross-sectional view of the AA portion of the structure of the indicator light type TOP RGB LED lamp bead;

[0035] Figure 3 yes Figure 2 Cross-section at the middle BB;

[0036] Figure 4 for Figure 1 The back view of the indicator light type TOP RGB LED lamp bead structure in the embodiment shown;

[0037] Figure 5 This is a structural diagram of a TOP RGB LED lamp bead structure based on an indicator light type in another embodiment of the present invention;

[0038] Figure 6 for Figure 1 A flow chart showing the preparation of a TOP RGB LED lamp bead structure based on an indicator light type in the embodiment shown;

[0039] Figure 7 for Figure 1A schematic diagram of the structure of the metal substrate after the connecting portion between the parent metal bracket and the protrusion is punched out in step (3) of the preparation process of the lamp bead structure shown;

[0040] In the figure, the insulating seat 1, the metal bracket 2, the RGB LED chip 3, the wire bonding station 4, the common electrode pin 5, the packaging colloid 6, the bonding wire 7, the metal packaging cup 21, the red LED chip 31, the green LED chip 32, the blue LED chip 33, and the cathode pin 211. DETAILED DESCRIPTION

[0041] To make the objectives, technical solutions, and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the disclosure of the present invention.

[0042] In the description of the present invention, it should be understood that the terms "up", "down", "left", "right", "top", "bottom", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present invention.

[0043] In the description of the present invention, it should be noted that, unless otherwise expressly specified or limited, the terms "mounted" and "connected" should be understood broadly. For example, they may refer to fixed connections, detachable connections, or integral connections; they may refer to direct connections, indirect connections through an intermediate medium, or internal communication between two components. Those skilled in the art will understand the specific meanings of the above terms in the present invention based on the specific circumstances.

[0044] like Figures 1 to 4 As shown, this embodiment is based on the indicator light type TOP RGB LED lamp bead structure, including an insulating base 1, a metal bracket 2, an RGB LED chip 3, a wire bonding station 4, a common electrode pin 5 and a packaging colloid 6. The metal bracket 2 and the wire bonding station 4 are respectively embedded in the interior of the insulating base 1;

[0045] The metal bracket 2 includes a downwardly concave metal packaging cup 21, the inner bottom surface of the metal packaging cup 21 is a crystal bonding area, and the bottom of the metal packaging cup 21 protrudes from the bottom surface of the insulating base 1 to form a negative electrode pin 211;

[0046] The RGB LED chip 3 is mounted on the die-bonding area of ​​the metal packaging cup 21 , and the bottom end of the RGB LED chip 3 is electrically connected to the die-bonding area of ​​the metal packaging cup 21 ;

[0047] The wire bonding station 4 is correspondingly provided on one side of the metal packaging cup 21, and the RGB LED chip 3 is electrically connected to the wire bonding area of ​​the wire bonding station 4 through the bonding wire 7;

[0048] The common-pole pin 5 is provided outside the insulating seat 1 , and the wire bonding station 4 is electrically connected to the common-pole pin 5 ;

[0049] The encapsulating colloid 6 is filled in the metal encapsulating cup 21 , and the top of the encapsulating colloid 6 protrudes from the top surface of the insulating seat 1 , or the top surface of the encapsulating colloid 6 is flush with the top surface of the insulating seat 1 .

[0050] It is worth noting that compared with traditional direct-plug LED lamp beads and conventional SMD LED lamp beads, this technical solution improves the overall structure of the lamp bead structure, innovatively integrating the originally dispersed RGB (red, green, and blue) lamp beads into a single package, achieving a better integration effect and making the lamp bead structure more conducive to integration. Compared with the original structure of the traditional dispersed layout, the lamp bead structure of this technical solution is conducive to improving the display effect and layout of the indicator light, improving the display clarity, and at the same time helping to simplify the circuit design and assembly process of the indicator light. In addition, the lamp bead structure of this technical solution has the advantages of high heat dissipation, high brightness and high air tightness, ensuring that it can still maintain a low operating temperature under high-intensity working conditions, effectively extending the service life of the lamp bead structure and improving the stability and reliability of the system; at the same time, its high brightness characteristics ensure that the indication information can be clearly seen even under darker or long-distance viewing conditions, further broadening the application scenarios; in addition, the high airtightness design effectively resists the erosion of harmful factors such as moisture and dust in the external environment, ensuring the long-term stable operation of the internal electronic components, and is particularly suitable for use in harsh or special environmental conditions. At the application level, this technical solution is based on the indicator light type TOP RGB LED lamp bead structure and is not only suitable for indicator applications, but can also be used as a display screen, such as LED display screens, smart wearable devices, car display screens and other fields.

[0051] Specifically, in the lamp bead structure, the chip is the main heat source. The lamp bead structure of the present technical solution directly adheres the RGB LED chip 3 to the metal packaging cup 21. Because the bottom of the metal packaging cup 21 protrudes from the bottom surface of the insulating base 1, the bottom of the metal packaging cup 21 of the present technical solution is used for pins, and the negative electrode pin 211 is located outside the insulating base 1. This allows the lamp bead structure of the present technical solution to dissipate heat directly through the metal negative electrode pin 211 located outside the insulating base 1, facilitating direct heat dissipation of the lamp bead. Metal materials have good thermal conductivity and can quickly transfer heat, thereby effectively improving the heat dissipation of the lamp bead structure. In addition, the common electrode pin 5 of the present technical solution is also located outside the insulating base 1, which can further improve the heat dissipation of the lamp bead structure, giving the lamp bead structure of the present technical solution excellent heat dissipation effect, ensuring that the operating temperature can still be maintained at a low level under high-intensity working conditions, effectively extending the service life of the lamp bead structure, and improving the stability and reliability of the system.

[0052] To further illustrate, the cup-bowl bracket of a conventional RGB LED lamp bead is typically constructed only from metal in the die-bonding area at the bottom, with the sidewalls of the cup-bowl bracket being a plastic insulator. The sidewalls of this structure have little reflective effect, resulting in relatively poor brightness. However, the entire metal encapsulation cup 21 of the present technical solution is constructed from metal, providing a superior reflective effect and effectively increasing the brightness of the lamp bead structure, ensuring clear visibility of the indicated information even in dim or distant viewing conditions. Furthermore, the entire metal encapsulation cup 21 of the present technical solution is constructed from metal, and the RGB LED chip 3 is directly in contact with the metal encapsulation cup 21. Furthermore, the RGB LED chip 3 is surrounded by metal portions and the encapsulation colloid 6, resulting in a substantially seamless periphery of the RGB LED chip 3. This, in turn, makes the lamp bead structure of the present technical solution highly airtight, effectively resisting erosion by harmful factors such as moisture and dust in the external environment, ensuring the long-term stable operation of the internal electronic components and making it particularly suitable for use in harsh or special environmental conditions.

[0053] Further explanation, there are three metal brackets 2, each of which is provided with a downwardly concave metal packaging cup 21; the RGB LED chip 3 includes a red LED chip 31, a green LED chip 32, and a blue LED chip 33, and the red LED chip 31, the green LED chip 32, and the blue LED chip 33 are respectively bonded to the solid crystal areas of the three metal packaging cups 21, and the bottom ends of the red LED chip 31, the green LED chip 32, and the blue LED chip 33 are respectively electrically connected to the solid crystal areas of the three metal packaging cups 21;

[0054] A wire bonding station 4 is correspondingly provided on one side of each metal packaging cup 21 , and the electrodes of the red LED chip 31 , the green LED chip 32 , and the blue LED chip 33 are electrically connected to the corresponding wire bonding areas of the wire bonding station 4 through different bonding wires 7 .

[0055] Specifically, this technical solution uses silver glue to fix the red LED chip 31, the green LED chip 32 and the blue LED chip 33 respectively in the solid crystal area of ​​the three metal packaging cup bodies 21, and then connects the chips and the welding wire area through bonding wires to form an electrical connection, thereby merging the RGB lamp beads into one lamp bead, which is beneficial to the indicator light display effect and layout, and improves the display cleanliness.

[0056] It is worth noting that the bottoms of the three metal packaging cups 21 of this technical solution are all used as pins, namely the red light cathode pin, the green light cathode pin and the blue light cathode pin, which facilitate direct heat dissipation of the lamp beads and increase the service life of the lamp beads.

[0057] Preferably, the bonding wire may be gold wire, silver wire, copper wire or aluminum wire.

[0058] Further explanation, the indicator light type TOP RGB LED lamp bead structure includes two common pole pins 5, and the two common pole pins 5 are respectively arranged on both sides of the insulating base 1;

[0059] Both sides of each wire bonding station 4 are connected to the two common electrode pins 5 respectively, that is, each wire bonding station 4 is connected to two common electrode pins 5 .

[0060] It's worth noting that the TOP RGB LED lamp bead structure used in this technical solution, which is based on an indicator lamp, features a dual common-pole design, including two common-pole pins 5, which serve as a common anode. This structural design allows for the subsequent operation of the TOP RGB LED lamp bead structure. If a fault such as a short circuit occurs in one common-pole circuit, the alternate common-pole circuit can be quickly switched to, and the backup common-pole circuit activated promptly, thereby ensuring the continued normal operation of the TOP RGB LED lamp bead structure. Furthermore, because the lamp bead structure of this technical solution is provided with two common-pole pins 5, and the common-pole pins 5 are made of metal, the heat dissipation performance of the lamp bead structure can be further improved.

[0061] To further illustrate, the lamp bead structure based on this technical solution is provided with two common pole pins 5. At the same time, the lamp bead structure also includes a red light negative pole pin, a green light negative pole pin and a blue light negative pole pin, that is, the lamp bead structure of this technical solution is designed with five pins. In one embodiment of this technical solution, the five pins of this technical solution are arranged symmetrically (such as Figure 4The symmetrical structure facilitates the consistent stability of the lamp bead patch, and it is a dual common-pole design. If one common-pole circuit is broken, the backup common-pole circuit can be started in time.

[0062] Preferably, the common-pole pin 5 is bent according to the exterior of the insulating base 1 so that the common-pole pin 5 fits in the insulating base 1, making the overall structure of the lamp bead structure of the present technical solution more compact and more conducive to integration. In one embodiment of the present invention, the common-pole pin 5 is in an "L" shape so that the common-pole pin 5 can fit in the outside of the insulating base 1.

[0063] To further illustrate, the top of the encapsulating body 6 protrudes from the top surface of the insulating seat 1 , and the top of the encapsulating body 6 is spherical.

[0064] The top of the encapsulation colloid 6 of this technical solution is spherical, forming a spherical encapsulation body. This encapsulation method not only protects the chip from the influence of the external environment, but also scatters the light more evenly through its spherical surface, further improving the brightness of the TOP RGB LED lamp bead structure.

[0065] To further illustrate, the surfaces of the wire bonding station 4 , the common electrode pin 5 and the metal bracket 2 are respectively provided with a nickel layer and a silver layer from the inside to the outside.

[0066] This technical solution sequentially applies nickel and silver layers to the surfaces of the wire bonding station 4, common electrode pin 5, and metal bracket 2 (including the metal packaging cup 21), giving these metal structures a silvery-white surface. The silver layer has excellent conductivity and light reflectivity, further enhancing the brightness of the TOP RGB LED lamp bead structure and facilitating wire bonding, helping to form a good electrical connection during bonding. The nickel layer enhances corrosion resistance and improves the adhesion of the silver layer.

[0067] To further illustrate, the wire bonding area of ​​the wire bonding stage 4 is surrounded by the encapsulation colloid 6 .

[0068] It is worth noting that the encapsulated colloid 6 of the present technical solution can tightly surround the wire bonding area of ​​the wire bonding station 4, preventing the wire bonding from being corroded by the external environment, such as moisture, dust and chemical substances, thereby improving the stability and reliability of the wire bonding. Figure 3 As shown, the structure of the wire bonding station 4 in one embodiment of the present invention is shown. Figure 5 This is the structural arrangement of the wire bonding station 4 in another embodiment of the present invention. Figure 3 and Figure 5 As shown, the wire bonding areas of the wire bonding platform 4 are tightly surrounded by the encapsulation resin 6 .

[0069] Specifically, the wire bonding area of ​​the wire bonding stage 4 in this technical solution is the top surface of the wire bonding stage 4 .

[0070] Further explanation, the metal packaging cup body 21 described in this technical solution is in the shape of an inverted frustum. Since the negative pin 211 is the bottom of the metal packaging cup body 21, the negative pin 211 is also in the shape of an inverted frustum, which can not only further enhance the heat dissipation effect of the lamp bead structure, but also improve the stability of the electrical connection.

[0071] Further explanation: the length of the indicator light type TOP RGB LED lamp bead structure is 2.0-4.0 mm, the width is 2.0-4.0 mm, and the height is 1.0-1.6 mm.

[0072] It is worth noting that the diameter of a single traditional plug-in LED lamp bead is 2mm to 5mm, and three plug-in LED lamp beads are needed to achieve the three luminous colors of red, green and blue, which makes it difficult to integrate and layout when used in indicator lights. To meet the brightness required by the indicator light, more plug-in LED lamp beads are needed, which will result in a larger overall structure of the indicator light. This solution combines the RGB (red, green and blue) lamp beads into one lamp bead, which is more conducive to integration and layout, making the overall structure of the indicator light smaller while achieving the same brightness.

[0073] To further illustrate, the RGB LED chip is a vertical single-electrode RGB chip.

[0074] Preferably, the RGB LED chip of the present technical solution uses a vertical single-electrode RGB chip. The vertical single-electrode RGB chip has the advantages of less light interference, less brightness loss and high definition, and is suitable for use in indicator lamp bead structures.

[0075] To further illustrate, the insulating seat 1 is made of PPA.

[0076] Specifically, PPA, known as polyphthalamide, is a high-performance engineering plastic with high thermal stability and the ability to maintain its performance in high-temperature environments. It also has good chemical stability and is resistant to a variety of chemicals, such as acids, alkalis, solvents, and the like, exhibiting excellent corrosion resistance. PPA materials also have high strength, stiffness, and wear resistance, as well as good fatigue resistance, and can maintain stable mechanical properties for a long time. At high temperatures, PPA can still maintain excellent mechanical strengths such as bending, tensile strength, and impact resistance, and can resist long-term tensile creep. PPA also has excellent insulation and dielectric properties, and can maintain good insulation properties in harsh environments such as high temperature and high humidity.

[0077] To further illustrate, the metal bracket 2 , the wire bonding platform 4 and the common electrode pin 5 are made of copper.

[0078] It is worth noting that the material of the metal bracket 2 (including the metal packaging cup body 21), the wire bonding platform 4 and the common electrode pin 5 of this technical solution is copper. The copper material has good conductivity, which ensures the stable luminescence of the lamp bead structure. In addition, the copper material has good flexibility, so that the metal bracket 2 can be stamped and stretched to form the metal packaging cup body 2.

[0079] Preferably, the encapsulating colloid 6 is made of a highly transparent and high-viscosity encapsulating glue, which can ensure the encapsulation effect and improve the luminous efficiency and light color uniformity of the lamp bead structure. For example, epoxy resin, silicone, glass glue and other materials can be used.

[0080] like Figure 6 As shown, this technical solution is based on a method for preparing a TOP RGB LED lamp bead structure of an indicator light type, and includes the following steps:

[0081] (1) The metal substrate is punched and stretched, and unnecessary parts are punched out to obtain a mother metal bracket including a wire bonding platform and a metal packaging cup body, and protrusions are provided on both sides of the mother metal bracket, and a gap is provided between the wire bonding platform and the metal packaging cup body; then electroplating is performed to form a nickel layer and a silver layer on the surface of the metal substrate in sequence, such as Figure 6 As shown in a and b;

[0082] (2) Injection molding is performed on the top and bottom surfaces of the parent metal bracket to form an insulating seat, and the bottom of the metal packaging cup protrudes from the bottom surface of the insulating seat, so that the bottom of the metal packaging cup serves as the negative electrode pin, such as Figure 6 As shown in c;

[0083] (3) Punch out the connecting part between the mother metal bracket and the protrusion so that the mother metal bracket is divided into three metal brackets (such as Figure 7 As shown) and each metal bracket is provided with a metal packaging cup body, at this time, each metal packaging cup body is relatively independent, and each metal packaging cup body and its corresponding wire bonding stage are separated, and the protrusion is connected to the three wire bonding stages; the two protrusions are bent to form common electrode pins on both sides of the insulating seat, as shown Figure 6 As shown in d1, d2 and d3, d1 is the front view after bending, d2 is the cross-sectional view after bending, and d3 is the back view after bending;

[0084] (4) Fixing the RGB LED chip to the inner bottom surface of the metal packaging cup, and connecting the electrodes of the RGB LED chip to the bonding area of ​​the wire bonding station through bonding wires;

[0085] (5) The metal packaging cup is encapsulated with encapsulating glue, and the interior of the metal packaging cup is filled with encapsulating glue. After curing, an encapsulating colloid is formed to obtain a TOP RGB LED lamp bead structure based on an indicator light type.

[0086] Specifically, in the lead frame process, this technical solution forms a concave truncated cone-shaped metal packaging cup by stamping a metal substrate (such as a copper strip) and then stamping and stretching the metal substrate according to the unit. At the same time, the unnecessary parts are stamped out. Then, a nickel-silver electroplating process is performed to electroplate the metal substrate from yellow to silver-white, which facilitates the subsequent lamp bead packaging and wire bonding while improving the brightness of the lamp bead. Finally, the lead frame required for the lamp bead is formed by injection molding and bending. In the lamp bead packaging process, the RGB LED chip of this solution preferably uses a vertical single-electrode RGB chip, which is fixed to the inner bottom surface of the metal packaging cup (i.e., the die bonding area) using silver glue. The RGB LED chip and the wire bonding area of ​​the wire bonding station are then connected by bonding wires to form an electrical connection. Finally, glue is dispensed and encapsulated using a highly transparent, high-viscosity package. Preferably, the package surface is spherical to improve the brightness of the lamp bead. In the lamp bead structure of this technical solution, the bottom of the metal packaging cup protrudes from the bottom surface of the insulating seat, so that the bottom of the metal packaging cup serves as the negative electrode pin, which facilitates direct heat dissipation of the lamp bead structure and improves the service life of the lamp bead structure. At the same time, the lamp bead structure of this technical solution is designed with five pins, preferably a symmetrical structure, which facilitates the consistent stability of the lamp bead patch. It is also a dual common pole design. If a common pole circuit is broken later, the backup common pole circuit can be started in time.

[0087] It is worth noting that this technical solution merges RGB lamp beads into one lamp bead, which is beneficial to the indicator light display effect and layout, and improves the display clarity. At the same time, the indicator light type TOP RGB LED lamp bead structure prepared by this technical solution is a lamp bead with high heat dissipation, high brightness and high air tightness. It can be used not only in indicator lights, but also in display screens and other fields, with a wider range of application scenarios.

[0088] Specifically, the stamping process, stretching process, electroplating process, injection molding process, bending process, crystal bonding process and packaging process in the preparation method of this technical solution are all existing technologies, so the above processes will not be further elaborated.

[0089] The technical principles of the present invention have been described above with reference to specific embodiments. These descriptions are intended solely to illustrate the principles of the present invention and are not to be construed in any way as limiting the scope of protection of the present invention. Based on the explanations herein, those skilled in the art will readily conceive of other specific embodiments of the present invention without inventive effort, and such embodiments will fall within the scope of protection of the present invention.

Claims

1. A TOP RGB LED lamp bead structure based on indicator light type, characterized in that: It comprises an insulating base (1), a metal bracket (2), an RGB LED chip (3), a wire bonding platform (4), a common electrode pin (5) and a packaging colloid (6), wherein the metal bracket (2) and the wire bonding platform (4) are respectively embedded in the interior of the insulating base (1); Three metal brackets (2) are provided, and each metal bracket (2) is provided with a downwardly concave metal packaging cup (21), the inner bottom surface of the metal packaging cup (21) being a crystal-fixing area, and the bottom of the metal packaging cup (21) protrudes from the bottom surface of the insulating seat (1) to form a negative electrode pin (211); The RGB LED chip (3) comprises a red LED chip (31), a green LED chip (32) and a blue LED chip (33); the red LED chip (31), the green LED chip (32) and the blue LED chip (33) are respectively bonded to the solid crystal areas of the three metal packaging cup bodies (21); and the bottom end of the red LED chip (31), the bottom end of the green LED chip (32) and the bottom end of the blue LED chip (33) are respectively electrically connected to the solid crystal areas of the three metal packaging cup bodies (21); A wire bonding station (4) is correspondingly provided on one side of each metal packaging cup body (21), and the red LED chip (31), the green LED chip (32), and the blue LED chip (33) are electrically connected to the corresponding wire bonding area of ​​the wire bonding station (4) via different bonding wires (7); The common-pole pin (5) is arranged outside the insulating seat (1), and the wire bonding station (4) and the common-pole pin (5) are electrically connected; The encapsulating colloid (6) is filled in the interior of the metal encapsulating cup (21), and the top of the encapsulating colloid (6) protrudes from the top surface of the insulating seat (1), or the top surface of the encapsulating colloid (6) is flush with the top surface of the insulating seat (1); The indicator light-type TOP RGB LED lamp bead structure comprises two common-pole pins (5), and the two common-pole pins (5) are respectively arranged on both sides of the insulating seat (1); Both sides of each wire bonding station (4) are respectively connected to the two common electrode pins (5).

2. The TOP RGB LED lamp bead structure based on the indicator light type according to claim 1 is characterized in that: The top of the packaging colloid (6) protrudes from the top surface of the insulating seat (1), and the top of the packaging colloid (6) is spherical.

3. The TOP RGB LED lamp bead structure based on the indicator light type according to claim 1 is characterized in that: The surfaces of the wire bonding platform (4), the common electrode pin (5) and the metal bracket (2) are respectively provided with a nickel layer and a silver layer from the inside to the outside.

4. The TOP RGB LED lamp bead structure based on the indicator light type according to claim 1 is characterized in that: The wire bonding area of ​​the wire bonding platform (4) is surrounded by a packaging colloid (6).

5. The TOP RGB LED lamp bead structure based on the indicator light type according to claim 1 is characterized in that: The metal packaging cup body (21) is in the shape of an inverted truncated cone.

6. The TOP RGB LED lamp bead structure based on the indicator light type according to claim 1 is characterized in that: The length of the indicator light-type TOP RGB LED lamp bead structure is 2.0~4.0mm, the width is 2.0~4.0mm, and the height is 1.0~1.6mm.

7. The TOP RGB LED lamp bead structure based on the indicator light type according to claim 1 is characterized in that: The RGBLED chip is a vertical single-electrode RGB chip; The insulating seat (1) is made of PPA; The metal bracket (2) 、 The wire bonding platform (4) and the common electrode pin (5) are made of copper.

8. A method for preparing a TOP RGB LED lamp bead structure based on an indicator light type, characterized in that: The method for preparing the indicator light type TOP RGB LED lamp bead structure according to any one of claims 1 to 7 comprises the following steps: (1) Stamping and stretching the metal substrate, and stamping out unnecessary parts to obtain a mother metal bracket including a wire bonding platform and a metal packaging cup body, wherein protrusions are provided on both sides of the mother metal bracket, and a gap is provided between the wire bonding platform and the metal packaging cup body; then electroplating is performed to form a nickel layer and a silver layer on the surface of the metal substrate in sequence; (2) Injection molding is performed on the top and bottom surfaces of the parent metal bracket to form an insulating seat, and the bottom of the metal packaging cup body protrudes from the bottom surface of the insulating seat, so that the bottom of the metal packaging cup body serves as the negative electrode pin; (3) Punch out the connecting portion between the mother metal bracket and the protrusion, so that the mother metal bracket is divided into three metal brackets, and each metal bracket is provided with a corresponding metal packaging cup body, and bend the two protrusions to form common-pole pins on both sides of the insulating seat; (4) Fix the RGB LED chip to the inner bottom surface of the metal packaging cup, and connect the RGB LED chip and the wire bonding area of ​​the wire bonding station through bonding wires; (5) The packaging glue is used for packaging, so that the interior of the metal packaging cup is filled with the packaging glue, and the packaging glue is formed after curing to obtain the TOP RGB LED lamp bead structure based on the indicator light type.

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