Control box and system-on-module circuit board for unmanned vehicle

Abstract

The invention relates to a control box and a system-on-module circuit board for an unmanned vehicle. Specifically, the SOM circuit board includes a main body having a first face surface, an opposing second face surface, a first side surface, an opposing second side surface, a first end surface, and an opposing second end surface. The first side surface and the second side surface have a maximum length in the longitudinal direction that is greater than a maximum length of the first end surface and the second end surface in the lateral direction. The SOM circuit board also includes a plurality of computing members, each of the plurality of computing members mounted on one of the first face surface or the second face surface. The SOM circuit board also includes an input / output connector mounted on the second face surface. The SOM circuit board also includes a plurality of mounting holes extending in a lateral direction through the first and second face surfaces and between the first and second face surfaces.

Description

Technical Field

[0001] The present disclosure generally relates to an improved control box and system-on-module circuit board for use with an unmanned vehicle. Background Art

[0002] Unmanned aerial vehicles (UAVs) are aerial vehicles without onboard pilots. Typically, UAVs are remotely controlled by pilots, controlled by onboard control systems, or controlled by a combination of remote pilots and onboard control systems. Most unmanned aerial vehicles include control systems to control vehicle operations. Typically, control systems for UAVs include one or more vehicle control systems, which include onboard navigation systems, such as inertial navigation systems and satellite navigation systems. Unmanned aerial vehicles can use inertial navigation sensors (such as accelerometers and gyroscopes) for flight positioning and manipulation and satellite-based navigation for general positioning and pathfinding. Most control systems also include one or more mission control systems for performing one or more mission control functions, such as capturing images or conveying payloads. Typically, independent hardware components onboard the UAV are provided for each vehicle control system and each mission control system. Summary of the invention

[0003] Aspects and advantages of the invention will be set forth in part in the following description, or may be obvious from the description, or may be learned through practice of the invention.

[0004] According to one embodiment, a system on module ("SOM") circuit board is provided, which defines a lateral direction, a longitudinal direction, and a transverse direction. The SOM circuit board includes a main body, the main body having a first face surface, an opposite second face surface, a first side surface, an opposite second side surface, a first end surface, and an opposite second end surface. The first side surface and the second side surface have a maximum length along the longitudinal direction, which is greater than the maximum length of the first end surface and the second end surface along the lateral direction. The SOM circuit board also includes a plurality of computing components, each of which is mounted on one of the first face surface or the second face surface. The SOM circuit board also includes an input / output connector mounted on the second face surface. The SOM circuit board also includes a plurality of mounting holes, which extend through the first face surface and the second face surface in the transverse direction and between the first face surface and the second face surface. The plurality of mounting holes include a first array of mounting holes spaced apart in the longitudinal direction near the first side surface, a second array of mounting holes spaced apart in the longitudinal direction near the second side surface, and a third mounting hole arranged between the first array and the second array in the lateral direction.

[0005] According to another embodiment, a system on module ("SOM") circuit board is provided, which defines a lateral direction, a longitudinal direction, and a transverse direction. The SOM circuit board includes a main body, the main body having a first face surface, an opposite second face surface, a first side surface, an opposite second side surface, a first end surface, and an opposite second end surface. The first side surface and the second side surface have a maximum length along the longitudinal direction, which is greater than the maximum length of the first end surface and the second end surface along the lateral direction. The SOM circuit board also includes a plurality of computing components, each of which is mounted on one of the first face surface or the second face surface. The SOM circuit board also includes one or more input / output connectors mounted on the second face surface near the first side surface, wherein the input / output connectors of the SOM circuit board are only arranged near the first side surface relative to the second side surface. The SOM circuit board also includes a plurality of mounting holes, which extend through the first face surface and the second face surface in the transverse direction and between the first face surface and the second face surface.

[0006] According to another embodiment, a control box is provided that defines a lateral direction, a longitudinal direction, and a transverse direction. The control box includes a housing that defines an interior, a circuit board disposed within the interior, and an input / output connector extending from the housing. The control box also includes a heat sink that is removably connected to the housing so that the circuit board is positioned between the housing and the heat sink. The circuit board contacts the heat sink.

[0007] According to another embodiment, a control box is provided that defines a lateral direction, a longitudinal direction, and a transverse direction. The control box includes a housing that defines an interior, the housing including a cover and a rigid member, and the rigid member is removably connected to the housing. The control box also includes a circuit board disposed within the interior, wherein the circuit board includes a plurality of computing components and a thermal interface material disposed on one or more of the computing components. The control box also includes an input / output connector extending from the housing. The control box also includes a heat sink that is removably connected to the rigid member so that the circuit board is positioned between the rigid member and the heat sink. The thermal interface material is in contact with the heat sink.

[0008] According to another embodiment, a control box is provided, which defines a lateral direction, a longitudinal direction, and a transverse direction. The control box includes a housing defining an interior, the housing including a cover and a rigid member, the rigid member is removably connected to contact the cover, and the rigid member includes an outer frame and at least one crossbeam. The control box also includes a heat sink, which is removably connected to contact the rigid member. The control box also includes a first circuit board disposed in the interior and a second circuit board disposed in the interior, the first circuit board is positioned between the rigid member and the heat sink, and the second circuit board is positioned between the cover and the rigid member. The cover, the rigid member, and the heat sink are stacked in the transverse direction.

[0009] According to another embodiment, a control box is provided, which defines a lateral direction, a longitudinal direction, and a transverse direction. The control box includes a housing defining an interior, the housing including a cover and a rigid member, the rigid member is removably connected to contact the cover, and the rigid member includes an outer frame, at least one beam, and a plurality of fingers. The control box also includes a heat sink, which is removably connected to contact the rigid member. The control box also includes a first circuit board disposed in the interior and a second circuit board disposed in the interior, the first circuit board is positioned between the rigid member and the heat sink and contacts the rigid member and the heat sink, and the second circuit board is positioned between the cover and the rigid member. The cover, the rigid member, and the heat sink are stacked in the transverse direction.

[0010] These and other features, aspects and advantages of the present invention will become better understood with reference to the following description and appended claims.The accompanying drawings, which are incorporated in and form a part of this specification, illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention.

[0011] Technical Solution 1. A system on module ("SOM") circuit board, which defines a lateral direction, a longitudinal direction and a transverse direction, the SOM circuit board comprising: a main body having a first face surface, an opposite second face surface, a first side surface, an opposite second side surface, a first end surface, and an opposite second end surface, the first side surface and the second side surface having a maximum length along the longitudinal direction that is greater than a maximum length of the first end surface and the second end surface along the lateral direction; a plurality of computing members, each of the plurality of computing members being mounted on one of the first face surface or the second face surface; an input / output connector mounted on a surface of the second side; and and a plurality of mounting holes extending through and between the first and second side surfaces in the lateral direction, the plurality of mounting holes comprising a first array of mounting holes spaced apart in the longitudinal direction near the first side surface, a second array of mounting holes spaced apart in the longitudinal direction near the second side surface, and a third mounting hole disposed between the first and second arrays in the lateral direction.

[0012] Technical Solution 2. A SOM circuit board according to Technical Solution 1, wherein the third mounting hole is substantially centrally positioned between the first side surface and the second side surface and between the first end surface and the second end surface.

[0013] Technical Solution 3. A SOM circuit board according to Technical Solution 1, wherein the first array and the second array each include at least three mounting holes.

[0014] Technical Solution 4. The SOM circuit board according to Technical Solution 1 also includes a metal coating plated on the portion of the body that defines the multiple mounting holes.

[0015] Technical Solution 5. A SOM circuit board according to Technical Solution 4, wherein the metal coating is a copper coating.

[0016] Technical Solution 6. A SOM circuit board according to Technical Solution 4, wherein the metal coating is a first metal coating and further includes a second metal coating plated on the body.

[0017] Technical Solution 7. A SOM circuit board according to Technical Solution 6, wherein the second metal coating is a gold coating.

[0018] Technical Solution 8. The SOM circuit board according to Technical Solution 1 further includes a plurality of passages, each of the plurality of passages extending through the body along the lateral direction and formed of a metal material.

[0019] Technical Solution 9. The SOM circuit board according to Technical Solution 1 also includes a thermal interface material arranged on one or more of the computing components.

[0020] Technical Solution 10. The SOM circuit board according to Technical Solution 1, wherein the multiple computing components include a first processing system, a second processing system, and multiple memory blocks.

[0021] Technical Solution 11. A SOM circuit board according to Technical Solution 10, wherein the first processing system is a random access memory ("RAM")-based processing system and the second processing system is a flash memory-based processing system.

[0022] Technical Solution 12. A SOM circuit board according to Technical Solution 1, wherein the input / output connector is arranged near the first side surface.

[0023] Technical Solution 13. A system on module ("SOM") circuit board, which defines a lateral direction, a longitudinal direction and a transverse direction, the SOM circuit board comprising: a main body having a first face surface, an opposite second face surface, a first side surface, an opposite second side surface, a first end surface, and an opposite second end surface, the first side surface and the second side surface having a maximum length along the longitudinal direction that is greater than a maximum length of the first end surface and the second end surface along the lateral direction; a plurality of computing members, each of the plurality of computing members being mounted on one of the first face surface or the second face surface; one or more input / output connectors mounted on the second side surface near the first side surface, wherein the input / output connectors of the SOM circuit board are only arranged near the first side surface relative to the second side surface; and a plurality of mounting holes extending through the first side surface and the second side surface and between the first side surface and the second side surface in the lateral direction.

[0024] Technical Solution 14. A SOM circuit board according to Technical Solution 13, wherein the plurality of mounting holes include a first array of mounting holes spaced apart along the longitudinal direction near the first side surface, a second array of mounting holes spaced apart along the longitudinal direction near the second side surface, and a third mounting hole arranged between the first array and the second array along the lateral direction.

[0025] Technical Solution 15. A SOM circuit board according to Technical Solution 14, wherein the third mounting hole is substantially centrally positioned between the first side surface and the second side surface and between the first end surface and the second end surface.

[0026] Technical Solution 16. A SOM circuit board according to Technical Solution 13, wherein the first array and the second array each include at least three mounting holes.

[0027] Technical Solution 17. The SOM circuit board according to Technical Solution 13 also includes a metal coating plated on the portion of the body that defines the multiple mounting holes.

[0028] Technical Solution 18. A SOM circuit board according to Technical Solution 17, wherein the metal coating is a first metal coating and further includes a second metal coating plated on the body.

[0029] Technical Solution 19. The SOM circuit board according to Technical Solution 13 also includes a plurality of passages, each of the plurality of passages extending through the body along the lateral direction and formed of a metal material.

[0030] Technical Solution 20. The SOM circuit board according to Technical Solution 13 also includes a thermal interface material arranged on one or more of the computing components. BRIEF DESCRIPTION OF THE DRAWINGS

[0031] A complete and adequate disclosure of the present invention (including the best mode thereof) for one of ordinary skill in the art is set forth in the specification with reference to the accompanying drawings, in which: Figure 1 is a block diagram depicting an example of an unmanned aerial vehicle (UAV) according to an embodiment of the present disclosure; Figure 2is a block diagram depicting an example of a typical control system for a UAV including a backplane and card architecture; Figure 3 is a block diagram depicting an example of a UAV with an onboard control system according to an embodiment of the present disclosure; Figure 4 is a block diagram depicting a first circuit board of a control module including a control box for an onboard control system according to an embodiment of the present disclosure; Figure 5 is a perspective view of a control box according to an embodiment of the present disclosure; Figure 6 is a perspective view showing internal components of a control box according to an embodiment of the present disclosure; Figure 7 is an exploded perspective view of a control box according to an embodiment of the present disclosure; Figure 8 is a perspective view of a control box according to other embodiments of the present disclosure; Fig. 9 is a perspective view showing internal components of a control box according to other embodiments of the present disclosure; Fig.10 is an exploded perspective view of a control box according to other embodiments of the present disclosure; Fig.11 is a perspective view of a control box according to a further embodiment of the present disclosure; Fig.12 is an exploded perspective view of a control box according to a further embodiment of the present disclosure; Fig.13 is a perspective view of a control box according to yet a further embodiment of the present disclosure; Fig.14 is an exploded perspective view of a control box according to yet a further embodiment of the present disclosure; Fig.15 is a cross-sectional view of a control box according to an embodiment of the present disclosure; Fig.16 is a cross-sectional view of a control box according to other embodiments of the present disclosure; Fig.17 is a perspective top view of a system-on-module circuit board according to an embodiment of the present disclosure; and Fig.18 is a perspective bottom view of a system-on-module circuit board according to an embodiment of the present disclosure. DETAILED DESCRIPTION

[0032] Reference will now be made in detail to embodiments of the present invention, one or more examples of which are shown in the accompanying drawings. Each example is provided by way of illustration of the present invention, rather than limitation of the present invention. In fact, it will be apparent to those skilled in the art that various modifications and adaptations may be made in the present invention without departing from the scope or spirit of the present invention. For example, a feature shown or described as part of one embodiment may be used together with another embodiment to produce yet another embodiment. Therefore, it is intended that the present invention covers such modifications and adaptations as fall within the scope of the appended claims and their equivalents.

[0033] Figure 1 1 is a schematic diagram of an exemplary unmanned aerial vehicle (UAV) UAV 10. UAV 10 is a vehicle capable of flying without an onboard pilot. For example and without limitation, UAV 10 may be a fixed-wing aircraft, a tilt-rotor aircraft, a helicopter, a multi-rotor unmanned aerial vehicle such as a quadcopter, a blimp, a dirigible, or other aircraft.

[0034] The UAV 10 includes a plurality of vehicle devices, including at least one propulsion and movement (PM) device 14. The PM device 14 generates controlled forces and / or maintains or changes the position, orientation or location of the UAV 10. The PM device 14 may be a thrust device or a control surface. A thrust device is a device that provides propulsion or thrust to the UAV 10. For example and without limitation, the thrust device may be a motor-driven propeller, a jet engine or other source of propulsion. A control surface is a controllable surface or other device that provides forces caused by the deflection of air flow passing over the control surface. For example and without limitation, the control surface may be an elevator, a rudder, an aileron, a spoiler, a flap, a slat, an air brake or a trim device. Various actuators, servomotors and other devices may be used to manipulate the control surface. The PM device 14 may also be a mechanism configured to change the pitch angle of a propeller or rotor blade or a mechanism configured to change the tilt angle of a rotor blade.

[0035] The UAV 10 may be controlled by the systems described herein, including but not limited to an onboard control system including a control box 100, a ground control station ( Figure 1 1 ) and at least one PM device 14. The UAV 10 may be controlled by, for example and without limitation, real-time commands received by the UAV 10 from a ground control station, a pre-programmed set of instructions received by the UAV 10 from a ground control station, a set of instructions and / or procedures stored in an onboard control system, or a combination of these.

[0036] Real-time commands may control at least one PM device 14. For example and without limitation, real-time commands include instructions that, when executed by an onboard control system, cause a throttle adjustment, a flap adjustment, an aileron adjustment, a rudder adjustment, or other control surface or thrust device adjustment.

[0037] In some embodiments, the real-time commands may also control additional vehicle devices of the UAV 10, such as one or more secondary devices 12. The secondary device 12 is an electrical or electronic device that is configured to perform one or more secondary functions to guide the propulsion or movement of the UAV. The secondary device may be related to the propulsion or movement of the UAV, but typically provides one or more vehicle or mission functions that are independent of direct control or motion control of vehicle propulsion. For example, the secondary device may include a mission-related device, such as a camera or other sensor, which is used for object detection and tracking. Other examples of the secondary device 12 may include sensors (such as lidar / sonar / radar sensors, GPS sensors), communication devices, navigation devices, and various payload delivery systems. For example and without limitation, the real-time command includes an instruction that, when executed by an onboard control system, causes a camera to capture an image, a communication system to transmit data, or a processing component to program or configure one or more processing elements.

[0038] UAV 10 is depicted by way of example, and not limitation. Although much of the disclosure is described with respect to an unmanned aerial vehicle, it will be appreciated that embodiments of the disclosed technology may be used in conjunction with any unmanned vehicle (UV), such as an unmanned marine vehicle and an unmanned ground vehicle. For example, the disclosed control system may be used in conjunction with an unmanned ship, an unmanned submarine, an unmanned car, an unmanned truck, or any other unmanned vehicle capable of moving.

[0039] Figure 2 is a block diagram depicting an example of a typical control system 50 for a UAV. In this example, the control system is formed using a base plate 60 having a plurality of card slots 71, 72, 73, 74, 75. Each card slot is configured to receive a card that meets a predetermined set of mechanical and electrical standards. Each card includes one or more circuit boards, typically including one or more integrated circuits, which are configured to perform a specific vehicle or mission control function. The card slots provide structural support for the card, as well as electrical connections between the card and the underlying bus. The specific example depicted has a CPU card 61 installed in a first card slot 71, a coprocessor card 62 installed in a second card slot 72, and add-on cards 63, 64, 65 installed in the card slots 73, 74, 75, respectively. By way of example, the CPU card 61 may include a circuit board having a processor, PCI circuits, switching circuits, and an electrical connector, the electrical connector being configured to structurally and electrically connect the card 61 to the card slot 71. Similarly, the coprocessor card 62 may include a processor, PCI circuits, switching circuits, and a connector.

[0040] The add-in cards 63, 64, 65 may include any number and type of cards configured to perform one or more vehicle and / or mission functions. Examples of add-in cards include input / output (I / O) cards, network cards, driving and navigation function cards, sensor interface cards (e.g., cameras, radars, etc.), payload delivery system control cards, graphics processing unit (GPU) cards, and any other cards for specific types of vehicle and / or mission functions.

[0041] picture Figure 2 A typical backplane architecture of the backplane architecture in includes a switch 66 that allows each card to communicate with a card in any other slot. There are many examples, including various standards, to define different types of backplane architectures. For example, although the switch 66 is shown as being separate from the card slots 71, 72, 73, 74, 75, some architectures may place a central switch in a specific slot of the backplane. In various cases, the node devices may communicate with each other via the switch. Although the five card slots are in Figure 2 , but the base plate may include any number of card slots.

[0042] Use like Figure 2 The onboard control system for UAV of the backplane architecture of the backplane architecture can effectively provide some functional control. In addition, this architecture can provide some configuration capabilities through hardware changes. However, the traditional backplane architecture may have multiple disadvantages in the embodiment for UAV. For example, the structural performance of the backplane connected to multiple cards by combined electrical and mechanical connections may not be well adapted to the high stress environment of some UAVs. For one or more cards in the backplane, mechanical and / or electrical failures may occur due to vibration, temperature or other factors. In addition, this architecture provides limited processing power and requires a lot of space and weight. Each card typically includes its own circuit board, including connectors, switching circuits, communication circuits, etc. Because each circuit board needs its own circuit for these common functions, the backplane architecture can provide relatively high weight and space requirements. In addition, the computing power and capacity of these types of systems are typically limited by multi-card approaches. Communication between cards and between various processing elements can lead to reduced computing power.

[0043] Figure 3is a block diagram depicting an unmanned aerial vehicle (UAV) 10 including a control system 80 according to an embodiment of the disclosed technology. The control system 80 includes a control box 100 that provides centralized control of vehicle and mission functions. The control box includes a housing 110 that defines an interior 112. A first circuit board 120 and a second circuit board 122 are disposed within the interior of the housing 110, and an input / output ("I / O") connector 126 extends through the housing 110 (such as, from the second circuit board 122), as described below. The control box 100 includes a heat sink 118 that is provided to dissipate heat from electrical components of the control box 100. In an exemplary embodiment, the heat sink 118 may form at least a portion of the housing 110, as described below. The control system 80 may include additional components, such as additional control units or other elements that perform vehicle or mission control processes.

[0044] In some embodiments, the first circuit board 120 includes a control module for controlling vehicle and mission management functions of the UAV 10, and the second circuit board 122 includes a carrier module for providing a communication interface between the control unit and various PM devices and secondary devices of the UAV.

[0045] In some examples, the first circuit board includes a plurality of heterogeneous processing systems, each having a reconfigurable processing architecture to provide management of various vehicle and mission functions. The plurality of heterogeneous processing systems with reconfigurable functionality is suitable for the diverse functions performed by unmanned aerial vehicles and the high level of certification typically required for these vehicles.

[0046] In an exemplary embodiment, the second circuit board 122 is a carrier module that provides an interface between the first circuit board 120 and the various PM devices 14 and secondary devices 12 of the UAV 10. For example, Figure 3 A group PM device is depicted, including a thrust device 30, a control surface 32 and a positioning system 34. In addition, Figure 3A group of secondary devices is depicted, including an image sensor 20, a radar sensor 22, a lidar sensor 24, a sonar sensor 26, a GPS sensor 28, a payload delivery system 36, and a communication system 38. The second circuit board 122 may include an I / O connector connected to the corresponding I / O connector of the first circuit board, and an I / O connector extending from the housing. In addition, the second circuit board may include a plurality of sensor connectors extending from the housing. The second circuit board may provide a communication or input / output (I / O) interface including associated electronic circuits, which is used to send and receive data. More particularly, the communication interface can be used to send and receive data between any of the various integrated circuits of the second circuit board and between the second circuit board and other circuit boards. For example, the project interface may include an I / O connector 126, an I / O connector 238, and / or an I / O connector 124. Similarly, a communication interface at any one of the interface circuits can be used to communicate with an external component, such as another air vehicle, a sensor, other vehicle devices, and / or ground control. The communication interface may be any combination of suitable wired or wireless communication interfaces.

[0047] In some examples, the control box 100 may include additional components. For example, a third circuit board such as a mezzanine card may be provided within the control box 100 in another embodiment. In some examples, the third circuit board may include one or more non-volatile memory arrays. For example, a solid state drive (SSD) may be provided as one or more integrated circuits on the mezzanine card. In addition, the control box 100 may include additional circuit boards forming a control module and additional circuit boards forming an additional carrier module.

[0048] Figure 4 is a block diagram illustrating a first circuit board 120 according to an exemplary embodiment of the disclosed technology. Figure 4 , the first circuit board 120 is configured as a control module (e.g., a control board) for an unmanned aerial vehicle (UAV). In an exemplary embodiment, the first circuit board 120 is a system on module (SOM) card 200. The first circuit board 120 includes a first processing system 230, a second processing system 232, a memory block 234, and an I / O connector 238.

[0049] The first processing system and the second processing system may include or be associated with any number of independent microprocessors, power supplies, storage devices, interfaces, and other standard components. The processing system may include or be coordinated with any number of software programs (e.g., vehicle and mission control processes) or instructions designed to perform various methods, process tasks, calculations, and control / display functions required to operate the aerospace vehicle 10. The memory block 234 may include any suitable form of memory, such as but not limited to SDRAM, which is configured to support the corresponding processing system. For example, the first memory block 234 may be configured to support the first processing system 230, and the second memory block 234 may be configured to support the second processing system 232. Any number and type of memory blocks 234 may be used. By way of example, four memory blocks each including an independent integrated circuit may be configured to support the first processing system 230, and two memory blocks may be configured to support the second processing system 232. The I / O connector 238 extends from the first surface of the first circuit board 122 to provide an operational communication link to the second circuit board 122.

[0050] The first processing system 230 and the second processing system 232 form a heterogeneous and reconfigurable computing architecture in an exemplary embodiment of the disclosed technology, suitable for the diverse and stable needs of the UAV 10. The first processing system 230 includes one or more processing units 302 forming a first processing platform and one or more programmable logic circuits 304 forming a second processing platform. By way of example, the one or more processing units 302 may include a central processing unit, and the programmable logic circuit 304 may include a volatile programmable logic array, such as a RAM-based field programmable gate array (FPGA). Any number and type of processing units may be used for the processing unit 302. Multiple processing units 302 and programmable logic circuits 304 may be provided within a first integrated circuit (generally referred to as a processing circuit in some embodiments).

[0051] The second processing system 232 includes one or more processing units 322 forming a third processing platform and one or more programmable logic circuits 324 forming a fourth processing platform. By way of example, the one or more processing units 302 may include a co-processing unit and the programmable logic circuit 324 may include a flash-based FPGA. Any number and type of processing units may be used for the processing unit 324. The one or more processing units 324 and the programmable logic circuit 324 may be provided within a second integrated circuit (generally referred to as a processing circuit in some embodiments).

[0052] By providing different processing unit types and different programmable logic circuit types in each processing system, the first circuit board 120 provides a heterogeneous computing system that is uniquely suitable for the processing, stability and operating requirements of high-stress application UAVs. For example, a combination of RAM-based and flash-based FPGA technologies is used to influence the strength of both for UAV applications. The unique capabilities of heterogeneous processing units 302 and 322 and heterogeneous programmable logic circuits 304 and 324 support both hardware and software partitioned operating environments. Vehicle and mission management functions can be assigned to different partitions based on criticality and performance needs. This provides a control and monitoring architecture suitable for critical operations. For example, an on / off or red / green architecture for control of irreversible critical functions is provided. By way of further example, one or more of the field programmable gate arrays can be configured to provide a structural accelerator for onboard sensor processing.

[0053] Now refer to Figures 5 to 18 , generally provide further embodiments of an improved control box 100 and its components. As discussed, the control box 100 according to the present disclosure generally houses various electrical / computing components that control the operation of an unmanned aerial vehicle ("UAV"), and the control box 100 is therefore generally mounted on the UAV. The control box 100 according to the present disclosure is particularly advantageous due to its modular design, wherein various components of the control box 100 as discussed herein, such as heat sinks, covers, and / or rigid members, are each interchangeable using various different designs for each of these components. Certain features as discussed herein help facilitate this modularity. In addition, as discussed herein, various features of this control box 100, such as heat sinks, rigid members, and system-on-module ("SOM") circuit boards include advantageous heat transfer features for transferring heat from the SOM circuit boards and generally from the control box 100. Other advantageous features will be discussed herein.

[0054] A control box 100 according to the present disclosure can define a lateral direction 102, a longitudinal direction 104, and a transverse direction 106 as shown. Together, these directions 102, 104, 106 can define an orthogonal coordinate system for the control box 100.

[0055] The control box 100 may include a housing 110 defining an interior 112. In an exemplary embodiment, the housing 110 includes a cover 114 and one or more rigid members 116. In some embodiments, only a single rigid member 116 is used in the control box 100, but in alternative embodiments, more than one rigid member 116 may be used. In embodiments where the housing 110 includes the cover 114 and the rigid members 116, at least one such rigid member 116 is removably connected to contact the cover 114, and the rigid members 116 are stacked on each other and the housing 110 in the lateral direction 106. The control box 100 may also include a heat sink 118. The heat sink 118 is removably connected to the housing 110, such as in contact with one of the plurality of rigid members 116. The heat sink 118 may also be stacked on the rigid member 116 and the housing 110 in the lateral direction 106.

[0056] One or more circuit boards may be disposed within the interior 112. For example, a first circuit board 120 may be disposed in the interior 112. In an exemplary embodiment, the first circuit board 120 is a system on module (“SOM”) circuit board 200 as discussed herein. In an exemplary embodiment, this first circuit board 120 may be positioned between the housing 110 and a heat sink 118, such as between the rigidizer 116 and the heat sink 118. Furthermore, the first circuit board 120 may be in contact with the heat sink 120 such that heat from the first circuit board 120 is dissipated from the first circuit board 120 through the heat sink 120. Furthermore, the first circuit board 120 may be in contact with the rigidizer 116.

[0057] For example, the first circuit board 120 may include one or more computing components. Such computing components may include a first processing system 230, a second processing system 232, and / or one or more memory blocks 234, all of which are discussed in detail herein, such as in the context of the SOM circuit board 200. In addition, a thermal interface material 236 (discussed in detail below in the context of the SOM circuit board 200) may be disposed on one or more of such computing components. In an exemplary embodiment, the first circuit board 120 (such as the thermal interface material 236 disposed on one or more of the computing components) may contact the heat sink 118 and / or the rigid member 116.

[0058] In some embodiments, the thermal interface material 236 may be in contact with the heat sink 118. Specifically, the thermal interface material 236 disposed on one or more computing components (such as the first processing system 230, the second processing system 232, and / or one or more memory blocks 234, which are mounted on the first side surface 210 of the first circuit board 120, as discussed in detail below in the context of the SOM circuit board 200) may be in contact with the heat sink 118 (such as the base 130 thereof).

[0059] Additionally or alternatively, the rigid member 116 may include a plurality of fingers 140. The fingers 140 are generally flat inner surfaces of the rigid member 116 that contact other components for support and heat transfer purposes. The first circuit board 120 may contact such fingers 140. Specifically, a thermal interface material 236 disposed on one or more computing components (such as one or more memory blocks 234 mounted on the second side surface 212 of the circuit board 120, as discussed in detail below in the context of the SOM circuit board 200) may contact the fingers 140.

[0060] In an exemplary embodiment, the rigid member 116 includes an outer frame 142 and one or more beams 144. The rigid member 116 may also include fingers 140. When the first circuit board 120 contacts the rigid member 116, the first circuit board 120 may contact one or more of the outer frame 142 and / or beams 144, and may also contact the fingers 140, as discussed above.

[0061] In an exemplary embodiment, the heat sink 118 is formed of metal. The heat sink 118 may include a base 130. In an exemplary embodiment, the base may be in contact with the first circuit board 120 (such as a component thereof), as discussed above. In addition, in some exemplary embodiments, as Figures 5 to 7 As shown in , the heat sink 118 may include a plurality of fins 132 extending outwardly from the base 130. In these embodiments, the heat sink 118 may provide convective heat transfer from the control box 100 via the fins 132. In other embodiments, such as Figures 8 to 14 As shown in , fins 132 may not be provided, and heat sink 118 may provide conductive heat transfer from control box 100 via base 130 in contact with other components (e.g., in the present UAV to which control box 100 is mounted). In still other embodiments, heat sink 118 may also include single-use or reversible phase change materials, liquid cooling materials, and / or other suitable components for facilitating heat transfer.

[0062] The control box 100 may also include a second circuit board 122. The second circuit board 122 may be, for example, a carrier card type circuit board that generally includes communication-related components, such as components related to sonar, radar, GPS, radio equipment, etc. The second circuit board may be disposed within the interior 112. For example, in an exemplary embodiment, this second circuit board 122 may be positioned between the cover 114 and the rigid member 116. In addition, the second circuit board 122 may contact the rigid member 116.

[0063] In an exemplary embodiment, the second circuit board 122 is in operative communication with the first circuit board 120. For example, the second circuit board 122 may also include one or more input / output connectors 124 positioned on the second circuit board 122 to operatively contact a mating input / output connector of the first circuit board 120 (such as connector 238 in the SOM circuit board 200 embodiment).

[0064] In some embodiments, the second circuit board 122 may also include one or more sensor connectors 125. The sensor connector 125 may extend from the housing 110, such as Figures 5 to 10 104 or in another suitable direction. These sensor connectors 125 can be ports for connecting the second circuit board 122 to suitable external sensors or other secondary devices 12 (such as those discussed herein), which can be mounted on the UAV on which the control box 100 is mounted, for example.

[0065] The control box 100 may also include one or more input / output connectors 126 extending from the housing 110. In an exemplary embodiment, one or more of the connectors 126 are components of the second circuit board 122. The input / output connectors 126 may connect the control box 100 and its components to other components of the UAV on which the control box 100 is mounted, for example. In some embodiments, as Figures 5 to 10 As shown in , the input / output connector 126 extends from the housing 110 along the longitudinal direction 104, such as through the end panel 115 of the housing 110. In other embodiments, such as Figures 11 to 14 As shown in , the input / output connector 126 extends from the housing 110 in the lateral direction 106 , such as through the cover 114 .

[0066] In some embodiments, the control box 100 may further include a mezzanine card 128. The mezzanine card 128 may be disposed within the interior 112 and may be in operative communication with the second circuit board 122. The mezzanine card 128 may be disposed, for example, between the second circuit board 122 and the cover 114. In some embodiments, one or more of the input / output connectors 126 are components of the mezzanine card 128.

[0067] As shown, the components of the heat sink 118 and the housing 110 may include through holes. The various through holes may be advantageously aligned to facilitate modularization of the various components of the control box 100. For example, a plurality of through holes 150 may extend through the base 130 of the heat sink 118, such as along the lateral direction 106. The through holes 150 may be arranged in a pattern. In addition, a plurality of through holes may extend through the housing 110, such as along the lateral direction 106. The through holes may be arranged in a pattern. The through holes may, for example, include through holes 152 extending through the cover 114 in the lateral direction 106 and in a pattern, and through holes 154 extending through the rigid member 116 in the lateral direction 108 and in a pattern. In an exemplary embodiment, the patterns of the through holes (such as through holes 150, 152, and 154) in the base 130 and the housing 110 are the same. Accordingly, fasteners may be inserted through the through holes 150, 152, 154 to fasten the components of the control box 100 together. Note that this same pattern can be extended to a variety of different types of heat sinks 118 and housings 110 (and their covers 114 and stiffeners 116 ), such that different versions of this component can be interchanged with one another in a modular fashion.

[0068] When the heat sink 118 contacts the housing 110 (such as the rigid member 116 thereof), the components may fit together using a "tongue-and-groove" type feature. This feature advantageously orients the components relative to each other to ensure proper fit, and also advantageously acts as an electromagnetic interference ("EMI") filter. For example, Fig.15 and Fig.16 As shown in , the groove 160 can be defined in the base 130. In some embodiments, the groove 160 can be an external groove, such as Fig.16 Alternatively, the groove 160 may be an internal groove, such as Fig.15 As shown in . The mating tab 162 may extend from the housing 110 (such as, the rigid member 116 thereof). When the heat sink 118 is connected to the housing 110 (such as, to the rigid member 116 thereof), the tab 162 may extend into the groove 160 .

[0069] In embodiments where a cover 114 and a rigid member are used, such components may also fit together using a "tongue and groove" type feature. This feature advantageously orients the components relative to each other to ensure proper fit, and also advantageously acts as an electromagnetic interference ("EMI") filter. For example, as Fig.16 As shown in , a groove 164 can be defined in the rigid member 116. In some embodiments as shown, the groove 164 can be an external groove. Alternatively, the groove 164 can be an internal groove. A mating tab 166 can extend from the cover 114. Alternatively, as shown in Fig.15 As shown in FIG. 1 , a groove 164 can be defined in the cover 114 and a tab 166 can be defined in the rigid member 116. When the rigid member 116 is connected to the cover 114, the tab 162 can extend into the groove 164.

[0070] Now refer to Fig.17 and 18 , a control box 100 according to the present disclosure may include a system on module ("SOM") circuit board 200, which may be the first circuit board 120 as discussed above. The SOM circuit board 200 may define a lateral direction 202, a longitudinal direction 204, and a transverse direction 206 as shown. Such directions 202, 204, 206 may together define an orthogonal coordinate system for the SOM circuit board 200. When the SOM circuit board 200 is installed in the control box 100, the directions 202, 204, 206 may correspond to the corresponding directions 102, 104, 106.

[0071] The SOM circuit board 200 may have a main body 208 including a plurality of outer surfaces. For example, the main body 208 includes a first face surface 210 and a second opposite face surface 212, both of which extend substantially in a plane defined by the lateral direction 202 and the longitudinal direction 204. The main body 208 also includes a first end surface 214 and an opposite second end surface 216, both of which extend substantially in a plane defined by the lateral direction 202 and the transverse direction 206. The main body 208 also includes a first side surface 218 and an opposite second side surface 220, both of which extend substantially in a plane defined by the longitudinal direction 204 and the transverse direction 206.

[0072] In general, the SOM circuit board 200 and its main body 208 have an ultra-rectangular shape, as shown. Accordingly, the first end surface 214 and the second end surface 216 also each have a length 222, which is the maximum length along the lateral direction 202. The first side surface 218 and the second side surface 220 also each have a length 224, which is the maximum length along the longitudinal direction 204. As shown, in an exemplary embodiment, the maximum length 224 is greater than the maximum length 222.

[0073] The SOM circuit board 200 may also include a plurality of computing components. The respective computing components may be mounted on the main body 208, such as on the first face surface 210 or the second face surface 212. For example, the computing components may include a first processing system 230, a second processing system 232, and a plurality of memory blocks 234. Note that in an exemplary embodiment, the first processing system 230 and the second processing system 232 and the memory blocks 234 are integrated together in a cohesive computing system, wherein the two processing systems 230, 232 operate together. Accordingly, for example, the first processing system 230 may monitor and back up the second processing system 232, and the second processing system 232 may monitor and back up the first processing system 230.

[0074] For example, in some embodiments, the first processing system 230 may be a random access memory ("RAM") based processing system. Additionally or alternatively, in some embodiments, the second processing system 232 may be a flash memory based processing system. Additionally or alternatively, the memory block 234 may be a RAM memory block.

[0075] As shown, in an exemplary embodiment, the first processing system 230 and the second processing system 232 may be mounted on the first side surface 210 of the main body 208. However, alternatively, one or both of the first processing system 230 and the second processing system 232 may be mounted on the second side surface 212 of the main body 208. Furthermore, in some embodiments, at least one or more of the memory blocks 234 may be mounted on the first side surface 210. Additionally or alternatively, at least one or more of the memory blocks 234 may be mounted on the second side surface 212.

[0076] In some embodiments, a thermal interface material 236 may be disposed on one or more of the computing components. The thermal interface material 236 may facilitate heat transfer from the computing component to other components of the control box 100, as discussed herein. A suitable thermal interface material 236 may, for example, be a relatively compliant material, which may, for example, be curable. In an exemplary embodiment, this material 236 may be a thixotropic material. In an exemplary embodiment, this material 236 may have a thermal conductivity that is between 3.2 and 4 W / mK, such as between 3.4 and 3.8 W / mK, such as 3.6 W / mK. One suitable material is gap filler 3500S35, which is commercially available from Bergquist Corporation.

[0077] In an exemplary embodiment, the thermal interface material 236 may be disposed on the memory blocks 234, such as one or more of the memory blocks 234 mounted on the first side surface 210 and / or one or more of the memory blocks 234 mounted on the second side surface 212. Additionally or alternatively, the thermal interface material 236 may be disposed on the first processing system 230 and / or the second processing system 232.

[0078] One or more input / output connectors 238 may also be mounted on the main body 208. These connectors 238 may connect the SOM circuit board 200 to other circuit boards (as discussed herein, in the control box 100), thereby allowing communication between the SOM circuit board 200 and such other circuit boards. For example, the connector 238 may be mounted on the second face surface 212 as shown, or alternatively may be mounted on the first face surface 210. In some embodiments, the connector 238 may be disposed near the first side surface 218, and thus closer to the first side surface 218 than the second side surface 220 along the lateral direction 202. In some of these embodiments, no connector 238 may be disposed near the second side surface 220. In addition, the longitudinal axis of the connector 238 may be aligned along the longitudinal direction 204, as shown.

[0079] As further shown, a plurality of mounting holes 240 can extend through the main body 208. One or more of these mounting holes 240 can be used, for example, to connect the SOM circuit board 200 to other components in the control box 100. Each mounting hole 240 can extend through and between the first face surface 210 and the second face surface 212 in the lateral direction 206.

[0080] The location of the mounting holes 240 in the main body may be particularly advantageous. For example, a first array 242 of mounting holes 240 may be disposed proximate to the first side surface 218 and, in an exemplary embodiment, between the connector 238 and the first side surface 218 along the lateral direction 202. The mounting holes 240 of the first array 242 may be spaced apart from one another along the longitudinal direction 204. In an exemplary embodiment, the first array 242 may include three or more mounting holes, but in an alternative embodiment, two mounting holes may be used. A second array 244 of mounting holes 240 may be disposed proximate to the second side surface 220 and, in an exemplary embodiment, may be spaced apart from the second side surface 220 along the lateral direction 202 by the same distance as the first array 242 from the first side surface 218. The mounting holes 240 of the second array 244 may be spaced apart from one another along the longitudinal direction 204. In an exemplary embodiment, the second array 244 may include three or more mounting holes, but in an alternative embodiment, two mounting holes may be used. Both the first array and the second array may advantageously connect the SOM circuit board 200 to other components in the control box 100 and minimize any relative movement of the SOM circuit board 200 with respect to such components.

[0081] Additionally, one or more third mounting holes 246 may be disposed between the first array 242 and the second array 244 along the lateral direction 202. In an exemplary embodiment, the one or more third mounting holes 246 may be positioned substantially centrally between the first side surface 218 and the second side surface 220, such as along the lateral direction 202. The third mounting holes 246 may be equally spaced from the first array 242 and the second array 244 along the lateral direction 202. Additionally, in embodiments where only a single third mounting hole 246 is used, the third mounting hole 246 may be positioned substantially centrally between the first end surface 214 and the second end surface 216, such as along the longitudinal direction 204. The third mounting hole 246 may be particularly advantageous because such hole 246 reduces resonant frequency issues during use of the SOM circuit board 200 and provides improved rigidity to the SOM circuit board 200.

[0082] In some embodiments, a plurality of vias 250 may be provided in the SOM circuit board 200. Each via may extend through the body 208 in the lateral direction 206 and may protrude from the first side surface 210 and / or the second side surface 212. The vias 250 may be located near the first side surface 218 and / or the second side surface 220. In an exemplary embodiment, the vias 250 may be formed of a metallic material, such as gold or copper, and may be used as heat transfer conduits to transfer heat from within the main body 208 and generally transfer the heat from the main body 208 and the SOM circuit board 200.

[0083] In some embodiments, one or more metal coatings may be plated on the main body 208, such as on the first side surface 210 and / or the second side surface 212 thereof. The metal coatings may serve as heat transfer conduits to transfer heat from the main body 208 and the SOM circuit board 200 in general.

[0084] For example, a first metal coating 252 may be plated on a portion of the body 208 (such as on the first side surface 210 and / or the second side surface 212 thereof) that defines the plurality of mounting holes 240 (including those mounting holes in the first array 242 and the second array 244, as well as the third mounting holes 246). This coating 252 may be plated discretely on this portion of the body 208 so that the various plating layers are not connected. In an exemplary embodiment, this first metal coating 252 is a copper coating, but in alternative embodiments, gold or other suitable metals may be used.

[0085] Additionally or alternatively, a second metal coating 254 may be plated on the body 208 (such as on the first side surface 210 and / or the second side surface 212 thereof). This coating 252 may be located adjacent to the first side surface 218 and the second side surface 220, and may extend to such surfaces 218, 220, such as completely along the length 224. In embodiments where both the first metal coating 252 and the second metal coating 254 are used, the second metal coating 254 may be plated over the first metal coating 252. In an exemplary embodiment, this second metal coating 254 is a gold coating, but in alternative embodiments, copper or other suitable metals may be used.

[0086] This written description uses examples to disclose the invention, including the best mode, and also to enable any person skilled in the art to practice the invention, including making and using any device or system and performing any included method. The patentable scope of the invention is defined by the claims, and may include other examples that occur to a person skilled in the art. If these other examples include structural elements that do not differ from the literal language of the claims, or if they include equivalent structural elements that do not differ substantially from the literal language of the claims, it is intended that these other examples be within the scope of the claims.

Claims

1. A system-on-module ("SOM") circuit board defining a lateral direction, a longitudinal direction, and a transverse direction, the SOM circuit board comprising: a main body having a first face surface, an opposite second face surface, a first side surface, an opposite second side surface, a first end surface, and an opposite second end surface, the first side surface and the second side surface having a maximum length along the longitudinal direction that is greater than a maximum length of the first end surface and the second end surface along the lateral direction; a plurality of computing components, each of the plurality of computing components being mounted on one of the first face surface or the second face surface; an input / output connector mounted on a surface of the second face, the input / output connector connected to an additional circuit board, wherein the input / output connector defines a longitudinal axis and a lateral axis, wherein a maximum length of the input / output connector is measured along the longitudinal axis, and wherein the longitudinal axis of the input / output connector is aligned along a longitudinal direction of the SOM circuit board; as well as a plurality of mounting holes extending through and between the first face surface and the second face surface in the lateral direction, the plurality of mounting holes comprising a first array of mounting holes spaced apart in the longitudinal direction proximate the first side surface, a second array of mounting holes spaced apart in the longitudinal direction proximate the second side surface, and a third mounting hole disposed between the first array and the second array in the lateral direction, wherein the third mounting hole is centrally positioned between the first side surface and the second side surface and centrally positioned between the first end surface and the second end surface; a plurality of passages, each of the plurality of passages extending through the body in the lateral direction and formed of a metallic material, and a metal coating discretely plated on portions of the first face surface and / or the second face surface defining the plurality of mounting holes, and The metal coating is a first metal coating, and the SOM circuit board further includes a second metal coating completely plated on the first surface and / or the second surface along the length.

2. The SOM circuit board according to claim 1, wherein: The first array and the second array each include at least three mounting holes.

3. The SOM circuit board according to claim 1, wherein: The first metal coating is a copper coating.

4. The SOM circuit board according to claim 1, wherein: The second metal coating is a gold coating.

5. The SOM circuit board of claim 1, further comprising a thermal interface material disposed on one or more of the computing components.

6. The SOM circuit board according to claim 1, wherein: The plurality of computing components include a first processing system, a second processing system, and a plurality of memory blocks.

7. The SOM circuit board according to claim 6, wherein: The first processing system is a random access memory ("RAM") based processing system and the second processing system is a flash memory based processing system.

8. The SOM circuit board according to claim 1, wherein: The input / output connector is disposed adjacent to the first side surface.

9. A system-on-module ("SOM") circuit board defining a lateral direction, a longitudinal direction, and a transverse direction, the SOM circuit board comprising: a main body having a first face surface, an opposite second face surface, a first side surface, an opposite second side surface, a first end surface, and an opposite second end surface, the first side surface and the second side surface having a maximum length along the longitudinal direction that is greater than a maximum length of the first end surface and the second end surface along the lateral direction; a plurality of computing components, each of the plurality of computing components being mounted on one of the first face surface or the second face surface; one or more input / output connectors mounted on the second side surface proximate the first side surface, wherein the input / output connectors of the SOM circuit board are disposed only proximate the first side surface relative to the second side surface, the one or more input / output connectors being connected to an additional circuit board, wherein the one or more input / output connectors each define a longitudinal axis and a lateral axis, wherein a maximum length of at least one of the one or more input / output connectors is measured on the longitudinal axis, and wherein the longitudinal axis of the one or more input / output connectors is aligned along a longitudinal direction of the SOM circuit board; a plurality of mounting holes extending through and between the first and second face surfaces in the lateral direction, wherein the plurality of mounting holes includes a first array of mounting holes spaced apart in the longitudinal direction proximate the first side surface, a second array of mounting holes spaced apart in the longitudinal direction proximate the second side surface, and a third mounting hole disposed between the first and second arrays in the lateral direction, wherein the third mounting hole is centrally positioned between the first and second side surfaces and centrally positioned between the first end surface and the second end surface; and a plurality of passages, each of the plurality of passages extending through the body in the lateral direction and formed of a metallic material; a metal coating discretely plated on portions of the first face surface and / or the second face surface defining the plurality of mounting holes, and The metal coating is a first metal coating, and the SOM circuit board further includes a second metal coating completely plated on the first surface and / or the second surface along the length.

10. The SOM circuit board according to claim 9, wherein: The first array and the second array each include at least three mounting holes.

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