Thermal optimization of OSFP optical transceiver module

Abstract

The invention relates to thermal optimization of an OSFP optical transceiver module. Heat dissipation and electrical shielding techniques and apparatus are disclosed to enable OSFP modules to operate at higher bandwidth. Techniques compatible with OSFP are discussed, including the use of water cooling, the addition of hot conduits, the use of intercoolers, air fins and air fins, the optimization of cooling fins, the use of steam chambers.

Description

Description of the case

[0001] This application is a divisional application of Chinese invention patent application 202110393883.7, with a filing date of April 13, 2021. Technical Field

[0002] The present disclosure relates to thermal optimization of OSFP optical transceiver modules.

[0003] This application claims the benefit of the filing date of U.S. Provisional Patent Application No. 63 / 047,410, filed on July 2, 2020, the disclosure of which is incorporated herein by reference. Background Art

[0004] Octal Small Form Factor Pluggable (OSFP) is a module and interconnect system with a pluggable form factor with eight high-speed electrical channels. OSFP was originally designed to support 400 Gbps (8 channels × 50G per channel) optical data links. Compared to other form factors such as QSFP, OSFP is slightly wider and deeper, but each 1U front panel still supports 36 ports, which allows a theoretical 400G bit rate through OSFP modules. OSFP has several advantages, including that it is backward compatible with the QSFP format through a simple adapter. OSFP is becoming more and more common in supporting optical technologies in data centers and other data delivery applications.

[0005] Current OSFP modules consume approximately 10-15 watts to achieve a 400G bit rate. However, as OSFP module throughput requirements increase, wattage requirements also increase. This in turn increases the thermal load and electromagnetic interference of the OSFP. In the current standard OSFP form factor, these effects can cause problems operating OSFP modules at higher bit rates or throughputs due to thermal and electrical effects.

[0006] Furthermore, since the OSFP module specification defines a specific mechanical form factor and electrical parameters that conform to the standard, the above issues cannot be solved by changing the mechanical form factor of the module. A solution is needed that enables OSFP modules to operate at higher bit rates while remaining compliant with the OSFP module specification. Summary of the invention

[0007] The present disclosure provides methods, systems, and apparatus for thermal and electrical optimization of OSFP optical transceiver modules.

[0008] One aspect of the present disclosure provides a component that includes an eight-channel small form factor pluggable (OSFP) module, the module including: a data connector; a first heat sink having a top surface and an opposing bottom surface facing the OSFP module; a first plurality of hollow channels formed between the OSFP module and the bottom surface; a second heat sink having a surface covering the top surface of the first heat sink and thermally connected to the top surface; and a plurality of fins extending away from the surface of the second heat sink.

[0009] Additional aspects of the present disclosure provide an assembly including an eight-channel small form factor pluggable (OSFP) module, the module including: a data connector; a first heat sink having a top surface and an opposite bottom surface facing the OSFP module; a first plurality of hollow channels formed between the OSFP module and the bottom surface; a second heat sink having a surface covering the top surface of the first heat sink and thermally connected to the top surface; and a plurality of fins extending away from the surface of the second heat sink. A first space may exist between at least a first pair of two adjacent fins of the plurality of fins that are different from the second pair of adjacent fins, thereby optimizing the thermal performance characteristics of the module. The second heat sink may contact the top surface. The housing may be configured to receive the OSFP module therein and be located between the second heat sink and the surface. The housing may include an opening through which the OSFP module and the second heat sink are thermally interconnected. At least a portion of the module may be composed of a diamond composite material. In some examples, the diamond composite material may be a silver diamond material. The diamond composite material may be aluminum diamond. At least a portion of the module may be made of a metal composite material.

[0010] Additional aspects of the present disclosure provide a system comprising: an outer housing having an opening; an assembly disposed within the outer housing, wherein a second plurality of fins are configured to receive airflow from the opening. The assembly may include an eight-channel small form factor pluggable (OSFP) module, the module comprising: a data connector; a first heat sink having a top surface and an opposing bottom surface facing the OSFP module; a first plurality of hollow channels formed between the OSFP module and the bottom surface; a second heat sink having a surface covering the top surface of the first heat sink and thermally connected to the top surface; and a second plurality of fins extending away from the surface of the second heat sink.

[0011] Additional aspects of the present disclosure provide a system comprising: an Octal Small Formfactor Pluggable (OSFP) compatible module; an air duct having a first end and a second end, the first end of the air duct forming a closed connection with the rear side of the module; a blower having a first end and an exhaust port, the first end of the blower forming a closed connection with the second end of the air duct; and an air path formed from the front side of the module through at least the air duct to the exhaust end of the blower. The module may include a front side and a rear side opposite the front side; a substantially continuous top surface extending from a portion of the front side to a portion of the rear side; and a data connector formed on the front side. The air duct may be formed of a metal composite material. The relative size of the air duct may be based on the air pressure or air velocity at the rear side of the module. The geometry of the air duct may be arranged to prevent vortices from forming within the system. The frequency of the blower may be based on the geometry of the module. The frequency of the blower may be based on the air pressure or air velocity at the rear side of the module. The air path may be optimized for module heat dissipation.

[0012] Additional aspects of the present disclosure provide an assembly including an eight-channel small form factor pluggable (OSFP) compatible module, the module including a front side and a rear side opposite the front side; a substantially continuous top surface extending from a portion of the front side to a portion of the rear side; a data connector disposed on the front side, a plurality of pin-shaped fins formed in an array on the top surface, each pin-shaped fin being substantially nonlinear in shape and enclosing an area formed by a closed loop on the top surface, wherein the plurality of pin-shaped fins minimize a pressure gradient between the front side and the rear side of the module. Each pin-shaped fin may be formed in a diamond shape. The front side may include a substantially open air channel above the data connector. The plurality of pin-shaped fins may form rows offset from each other. The plurality of pin-shaped fins may cover at least 30% of the surface area of ​​the top surface. Each pin-shaped fin may form an air fin that provides a path for fluid to move on the top surface. The air fin may be configured to align with a spring-loaded chamfer formed in a housing for the module. The plurality of pin-shaped fins may be configured to attenuate electromagnetic interference. The plurality of pin-fins may be configured to attenuate radiation emitted from a front side of the module. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] The drawings are not drawn to scale. The same reference numerals and names in different drawings refer to the same elements. For clarity, not every component is labeled in every drawing. In the drawings:

[0014] Figure 1A is an exploded perspective view of an example OSFP module according to aspects of the present disclosure.

[0015] Figure 1B-1Cyes Figure 1A Different perspective views of the assembled OSFP module;

[0016] Figure 1D A front view of an example OSFP module with a finned heat sink is shown.

[0017] Figure 2A is a top-down view of an OSFP module with example cooling holes and channels according to aspects of the present disclosure.

[0018] Figure 2B-2D is a top-down view of an example cooling pin-fin arrangement in an OSFP according to aspects of the present disclosure.

[0019] Figure 3A A cross-sectional view of an example OSFP module, housing, pin fins, and air flaps according to aspects of the present disclosure is shown.

[0020] Figure 3B A perspective view of an example OSFP module housing with air flaps according to aspects of the present disclosure is shown.

[0021] Figure 3C A cross-sectional side view of an example OSFP cooling system with optimized airflow according to aspects of the present disclosure is shown.

[0022] Figures 4A-4C is a side view of an example OSFP module having optimized heat flow through the configuration of the heat sink and the location of the ASIC relative to the laser according to aspects of the present disclosure.

[0023] Figures 5A-5D is a diagram of an example OSFP module having improved heat dissipation through water cooling techniques using closed loop water cooling according to aspects of the present disclosure.

[0024] Figures 6A-6C is a side view of an example OSFP module based on improved heat dissipation through the use of a flat heat pipe thermal path according to aspects of the present disclosure.

[0025] Figure 7 is a side view of an example OSFP module and improved heat dissipation through the use of a meandering heat pipe according to aspects of the present disclosure.

[0026] Figures 8A-8E are various views of an example OSFP module and improvements in heat dissipation through the use of an external bottom heat sink according to aspects of the present disclosure.

[0027] Fig. 9 are graphs illustrating various power and thermal aspects of an example OSFP module in different configurations.

[0028] Fig. 10A A side view of an example OSFP module 1000 is shown with reference to Figure 1A-8E One or more of the aspects discussed.

[0029] Fig. 10B An example air path is shown in a side view of an example OSFP module. Specific embodiments

[0030] The present disclosure generally relates to methods, systems, and apparatus for thermal and electrical optimization in an eight-channel small form factor pluggable (OSFP) optical transceiver module.

[0031] Figure 1A An exploded view of an OSFP module and improvements according to aspects of the present disclosure is shown. 110 shows a block or group of OSFP modules, such as modules 111-114. The blocks of OSFP modules are configured so that they are compatible with a cage such as cage 120. Cage 120 is a 1×4 cage, meaning that it can accommodate 4 OSFP modules arranged in a row. Cage 120 has four openings, and each opening can be configured to accommodate a single OSFP module. Other configurations of cages are also possible. In some examples, a 1×1 cage can accommodate a single OSFP module, while in other examples, any other M×N modules are possible. The OSFP module can include other components, such as optical devices, optical receivers, optical transceivers, lasers, and processors to enable data transmission. Modules 111-114 and cage 120 can be part of a larger enclosure or installed in a larger enclosure. For example, the larger enclosure can have electronic devices, fans, cooling or other systems to enable the OSFP module to operate. Cage 120 may have a top surface 121 , a bottom surface 122 , vertical walls separating OSFP modules, such as dividers 123 , and a rear side or portion of the dividers, a rear edge 124 .

[0032] Module 114 is, for example, an OSFP-compliant transceiver module that meets the parameters of the OSFP form factor and / or OSFP specification. Module 114 is also an OSFP transceiver module that has a connector on one side, connector 115, and a heat sink 117 on the top of the module. In some examples, heat sink 117 can be the top surface of module 114. An inlet can be formed above or near connector 115. Module 114 is intended to be mounted in a rack or cage, as described below with reference to Figures 1A-1D114. The connector 115 may be formed at or toward one end of the module 114. The module 114 may have a throughput over multiple lanes. For example, the throughput of the module 114 may be 400 Gbps or 50G per lane in 8 lanes. In other examples, higher throughputs of the module 114 may exist and may be correspondingly higher on the lanes.

[0033] Module 114 may also communicate with a computing device. The computing device may be any type of computing device, such as a server, a server cluster, a virtual machine, a laptop, a desktop, a mobile device, or a custom designed hardware device. The computing device may include a processor, a volatile memory, a non-volatile memory, a user interface, a display, (one or more) communication interfaces, and instructions.

[0034] Although in Figure 1A Although not shown in the figure, modules 111-114 may include a processor or an application specific integrated circuit (ASIC). The processor or ASIC of module 111 may be configured to enable signals to be transmitted through the module. Module 111 may be configured in various modes to enable high-speed signals, such as those described in the electrical specifications of IEEE802.3bs, IEEE802.3cd, or to enable low-speed signals, such as those using I2C or I3C protocols, which may be used by the host for configuration and control of module 111. The encoding or specific implementation of the signals may depend on the capabilities of the ASIC or processor within module 111. Similarly, although not shown in the figure, the ... Figure 1A As shown in FIG. 1 , module 111 may include a laser.

[0035] Connector 115 can support various types of communication interfaces. In some examples, connector 115 can be a duplex LC connector, which is a type of fiber optic connector developed by Lucent Technologies. In some examples, connector 115 can be a multi-fiber push-on (MPO) type optical connector. In other examples, connector 115 can be any known or compatible communication interface capable of transmitting data.

[0036] Radiator 130 is also Figure 1A130 is shown in FIG. The heat sink 130 may be made of a base segment such as a base 131 and various fins such as fins 132-134). The absolute size of the fins and the position of the fins relative to each other are constrained by the size of the holder 120 and the OSFP guidelines and limitations. In addition, the shape, relative positioning or position or absolute position of the fins are optimized to achieve better airflow, which in turn can keep the OSFP operable despite the generation of a greater amount of heat due to the higher wattage requirements associated with the increased throughput. The heat sink 130 can be mechanically attached to the holder 120 or contact with the modules 111-114 by using springs, screws, clips or other mechanisms to allow the heat sink to be easily attached to the holder 120 and form a secure connection. Although the heat sink 130 is shown as a unit, the heat sink 130 can be formed or manufactured in a variety of configurations or components.

[0037] Each module may have a plurality of openings or inlets that allow air to enter the interior volume of the module. For example, Figure 1A Inlet 119 of module 114 and inlet 116 of module 111 are shown, as well as surface 117 covering inlet 119. Air entering the inlet can cool the module and is discharged from the rear of the module, outlet 114-B. Surface 117 can also cool the heat generated within the module. Surface 117 can be coupled with the base 131 of the heat sink to create a thermal connection and allow heat to be further dissipated. In some examples, surface 117 can form part of a heat sink or vapor chamber. Thus, two air paths are formed for cooling the module.

[0038] Figure 1B An assembled OSFP module and improved views are shown according to aspects of the present disclosure. Figure 1B As shown, base 131 may be directly adjacent to and in contact with heat sink 130 to allow heat generated within the module to be dissipated and conducted away from the module. Fins 132-134 may transfer heat from OSFP modules 111-114 and allow for cooling.

[0039] The fins may extend longitudinally across the length of the cage 120 between an edge of the cage adjacent to the divider 123 and an opposite rear edge 124 of the cage, parallel to the top surface 121, perpendicular to the top surface 121, or longitudinally across or parallel to the bottom surface 122 of the cage 120. Figure 1A In the example shown, the fins 132-134 extend along most of the length of the cage. Any number of fins may be provided across the width of the cage 120. In the example shown, 36 fins extend across the width of the cage, but the number of fins may vary widely.

[0040] In some examples, the fins may have a length range up to the length of the cage 120, such as a height of 71.0 mm, 9.9 mm, and a thickness of 0.5 mm. In other examples, the height range may be between 9.9 mm and 24.0 mm, the length range may be between 6.5 mm and 71.0 mm, and the thickness range may be between 0.4 mm and 0.7 mm. The fin spacing range may be between 1.3 mm and 4.0 mm. However, in other examples, the fins may have a length less than 6.5 mm or greater than 71.0 mm.

[0041] The relationship between air velocity and air pressure drop is roughly quadratic. The power required to move the air is roughly a cubic function of the air velocity. The relationship between the fins, their length, thickness, and contact point with the heat sink 130 are optimized to maximize cooling while ensuring that the pressure drop from the front of the OSFP compliant module is not excessive.

[0042] Figure 1C Additional views of an assembled OSFP module and modifications are shown according to aspects of the present disclosure. Figure 1C 114-B. The outlets allow airflow to move from one end of the module to the other. The airflow through the module can also help cool the module and the heat sink and fins.

[0043] In some examples, reference Figures 1A-1C One or more components shown may be made in part or in whole of a diamond composite material, such as silver-diamond, aluminum-diamond, or copper-diamond. In some examples, the diamond composite material may consist of a surface layer of pure metal surrounding an inner layer or inner core made of diamond or a diamond-metal mixture. A surface layer with a higher conductivity will allow heat to be transferred faster, while an inner core made of diamond or a diamond composite material does not conduct heat in the same way. Through the selective use or engineering of materials, heat can be derived from areas in the module that are more likely to overheat, such as lasers or ASICs. For example, the thermal expansion coefficient of silver diamond is 6.5 ppm / K, while the thermal conductivity is 900 W / (mK). Low thermal expansion coefficients while maintaining high thermal conductivity allow the module to be cooled more efficiently while maintaining strict tolerances to maximize the size of fins and other cooling components. In some examples, the components may be made of any metal matrix composite material. A metal matrix composite material is a material in which at least one of these materials is a metal to allow higher thermal conductivity while maintaining the properties of another material.

[0044] Figure 1DA side view of a module 150 with a heat sink 160 and fins 160-171 is shown. The spacing of the fins shows varying gaps between the fins 160-171, which are designed to optimize airflow and cooling over components or areas of the module 150. For example, larger gaps between fin 165 and fin 166 and between fins 166 and 167 allow a larger volume of air to flow closer to the center of the module 150. The inlets 151-152 of the module 150 allow air to enter the interior volume of the module 150. The heat sink 160 can be in thermal contact with the module 150 through the base 160-C. As can be seen from the side view, there are two air paths, allowing for additional cooling while maintaining compliance with the OSFP specification.

[0045] Although Figures 1A-1D Several example arrangements of cooling fins are provided, but it should be understood that further arrangements are possible. For example, the number, spacing, shape, or combination of fins may be modified. Figure 1A -D, the outer housing can accommodate the holder 120. The openings of the outer housing can be optimized in terms of spacing, size, dimensions or geometry to optimize the physical parameters of the system, such as heat dissipation, pressure drop or average temperature drop. Since there is usually a fixed volume, airflow rate or mass flow rate through the openings of the outer housing and through the outer housing, the airflow can be divided inside the module 150 and on the heat sink 160. Since the total mass flow rate is usually fixed, the division between the outer housing and the inner housing can be determined by the openings of the outer housing.

[0046] Figures 2A-2D A top-down view of a portion of a module is shown. Figures 2A-2D Module components 210-240 are shown. Due to the length of a module such as module 111, there will be a pressure drop from one end of the module to the other, and airflow may also be restricted within the module. Components 210-240 are designed to reduce excessive pressure drop along the length of each component and allow less restriction of airflow. The module components may have top surfaces, such as surfaces 211, 221, 231, and 241.

[0047] Figure 2A2 is a member 210 having a surface 211. Holes, such as holes 212 and 213, may be formed on the surface 211. Holes 212 and 213 are circular. A plurality of ridges, including ridges 215 and ridges 216, are formed on the surface 211, which can minimize the volume occupied by the air when the air moves on the surface 211 of the member 210. In addition, the ridges help to guide the air in one direction or create an air "tunnel". Ridges 215 and ridges 216 can extend longitudinally along the length of the module, and the space between two adjacent ridges can form a "channel" that also extends along the length of the module. The ridges can be thermally conductive and act as a heat sink or form part of a heat transfer path away from the module 210. This helps to minimize the pressure difference between the two ends of the surface. Although not shown, additional holes can be formed along the length of the surface 211 to further allow additional inlet air to enter the internal volume of the member 210. These holes can be of any shape, or shaped based on the exact shape or size of the member 210 to maximize the airflow inside the member. In some examples, the length of the hole can be 2-5 mm and spaced 5-10 mm apart. In other examples, holes less than 2 mm and greater than 5 mm and with any spacing can be formed. In other examples, the hole can be made in a zigzag shape. The hole can be made into various patterns on the surface 211.

[0048] Figure 2B Shown is member 220. There are a plurality of pin fins on surface 221, such as pin fin 222, extending perpendicular to the length of surface 221. These pin fins minimize the air pressure drop from one end of member 310 to the other end of member 310. In addition, pin fin 222 can be shaped to further have an inlet or air flap that allows air to enter the interior volume of the member. The height of any one pin fin is fixed by the OSFP form factor, but the width and length of the pin fin can be optimized for minimum pressure drop in the airflow.

[0049] The spike fins can take on a variety of geometric shapes. In one example, Figure 2B As shown, the spike fin has an elongated and diamond-shaped body with rounded edges. The width 228 of the central portion of the spike fin 222 can be greater than the width 229 at the outermost and opposite ends of the spike fin 222. In other examples, the spike fin has a different shape, such as a circle, a square, a teardrop, a sinusoidal shape, or any kind or combination of shapes. The top surface 227 of the spike fin 223 can be planar, but in other examples, the top surface of the spike fin 222 can be non-planar and have a curved surface. In some examples, the top surface of the spike fin can be planar, while in other examples, the top surface of the spike fin can be wavy.

[0050] The pin fins may be located on any portion of the surface 221. Figure 2B In the example of FIG. 2 , the pin-fin 222 is located in the front half of the surface 221 adjacent the front edge 221-F of the member 220. The pin-fin may alternatively be located in the rear half of the surface 221 adjacent the rear edge of the member 220. In other examples, the pin-fin 222 may extend along the entire length L or a majority of the length L of the surface 221. Several of these additional examples are discussed further below.

[0051] The pin-fins can be arranged in many patterns. As shown, the rows of pins are staggered along the length L so that the second row of pin-fins 226 are located between each of the pin-fins in the first row 225. This pattern can continue along the length L of the surface 221. In other examples, the pin-fins can be arranged in a straight line or column. Similarly, the pin-fins can be arranged at any random point along the surface 221.

[0052] Figure 2C Shown is member 230. Similar to member 220, there are spike fins 232 and 233 on surface 231 of member 230. This example shows the spike fins extending along a majority of the length L of surface 231 and covering substantially the entire surface 231. In some examples, the spike fins may extend away from the surface, such as 2 mm away from the surface. In other examples, the spike fins may extend less than 2 mm or more than 2 mm away from the surface.

[0053] The pin fins may be formed in any geometric shape. In some examples, the pin fins may be formed in a fixed or variable height. The pin fins may take a variety of shapes, and the geometry of the pins may differ between pins or between rows. In other examples, a variety of geometries may be used for the pin fins to create various pathways for airflow above the surface 241. In some examples, the geometry of the pin fins may be selected based on the known throughput or thermal characteristics of the OFSP module. In other examples, the geometry of the pin fins and the arrangement of the pin fins may be selected based on the thermal characteristics of the module such as an ASIC or laser contained therein. In some examples, a plurality of pin fins and fins may be arranged to form a partial array on the surface of the component and arranged to correspond to the location of the heat source within the component to achieve the lowest pressure drop. For example, the pin fins may cover only the central quarter of the surface in a relatively dense pattern, while the rest of the surface may not contain pin fins or may contain relatively low density pin fins. In other examples, more complex geometries, such as Fibonacci spirals, may be arranged to optimize heat exchange, cooling, airflow, pressure, or other parameters. In some examples, the pin fins may be arrayed near the ASIC or laser within the module to allow additional cooling in that area and improve overall heat dissipation characteristics. The pin fins may further provide additional thermal connection to the cage in which the OSFP module is placed.

[0054] Figure 2D A member 240 is shown. Similar to member 220, there are spike fins 242 and 243 on surface 241 of member 240. Spike fins 242 and 243 have different sizes.

[0055] Although Figures 2A-2D Several example arrangements of the pin-shaped fins are provided, but it should be understood that other arrangements are possible. For example, the number, spacing, shape, or combination of the pin-shaped fins may be modified. In some examples, the external heat sink may be modified, such as in Figures 1A-1D An external heat sink is provided in the body to mechanically mate with or otherwise contact the pin-fin arrangement to allow for additional heat dissipation.

[0056] Figure 3A A cross-sectional view of the housing 350 of the OFSP module mounted within a holder 360 is shown. Airflow is directed "into" the page, or along Figure 3B The direction of arrows 365-368 shown. The housing 350 may have a surface 351 and have a plurality of pin-shaped fins thereon, such as pin-shaped fins 352. Pin-shaped fins 352 may further include or form air fins. The air fins may be created by the volume enclosed by the pin-shaped fin surface. The pin-shaped fins may be shaped so that the inner portion of the pin-shaped fins is hollow and forms an inner cavity. The inner cavity may provide space for air to enter and fill the volume of the inner cavity. The inner cavity may take a variety of shapes, and in one example may have a funnel-shaped shape that is visible when viewed from the top. In other examples, the outer surface of the pin-shaped fin may include a crack or opening in the surface to allow air to flow into the inner volume of the air fin. For example, a portion of the surface 241 enclosed by the pin-shaped fin 242 may be removed, thereby creating a path for air to move on the surface. This may further enhance the cooling from the inside of the housing 350 and maximize the airflow into the air fins.

[0057] Cage 360 ​​may be chamfered to include depressions within the surface of the cage, such as at chamfer 361 and chamfer 362. Chamfers 361 and 362 may be spring loaded so that they are flush with the inner surface of cage 360 ​​unless an external force is applied to them. When an external force is applied, chamfers 361-362 may be pressed toward cage 360 ​​in the same direction as the force is applied. The pin fins may be aligned within the depressions of the chamfers. For example, chamfer 362 is aligned with pin fin 352. Thus, when housing 350 or a module such as module 231 is inserted into the cage, mechanical stress and damage may be minimized by aligning the chamfers and pin fins. In addition, the pin fins may push chamfer 362, depress the spring of chamfer 362, and be tightly connected to chamfer 362. In this way, any micro-current or induced current within the system may be effectively grounded through the mechanical and electrical contact between pin fin 352 and chamfer 362.

[0058] Radiated emissions or RF energy may be emitted from the housing in the opposite direction of the airflow. Radiation may be generated during module operation, such as by an ASIC or laser within the module. In some examples, the pin-shaped fins may be utilized and optimized based on width and length to minimize the pressure drop in the length of the housing while still attenuating the radiation emission source. In other examples, the radiation is attenuated using pin-shaped fins that are arranged in rows offset from each other because each pin-shaped fin reflects or attenuates the radiation back. In some examples, radiation may be attenuated to a greater extent by using multiple rows of pin-shaped fins. Those skilled in the art will appreciate that various combinations and designs are possible for various use cases of the module 350.

[0059] Figure 3B Shown is a partial view of a module, module 360. Module 360 ​​may be similar to module 111 described above. Figure 3B The connection side of module 360 ​​with receiver 362 is shown. Receiver 362 can be any suitable receiver supported by the above-mentioned OSFP specification. The module can also include an inlet above the receiver designed to optimize airflow into module 360 ​​such as inlet 369. The specific shape and design of the inlet can be based on the geometry of module 360 ​​and the operating conditions of the electrical enclosure contained within module 360. Parallel arrows labeled 366 and 367 show the direction of airflow into module 360. For clarity, the inlet is shown in FIG. Figure 3B Additional arrows are not shown, but it should be understood that air flows into module 360 ​​at many locations of inlet 369.

[0060] In some examples, an inlet, such as inlet 369, can be replaced by a steam chamber. A steam chamber is a chamber filled with a coolant. When the coolant is heated, it changes from a liquid phase to a gas phase. Once in a gaseous state, the coolant circulates via convection and moves freely in the chamber. The gaseous molecules condense on a cold surface, dissipate their heat load, and are then directed back to the coolant container. This process allows cooling to be performed using a fixed or known amount of coolant. The coolant container can extend along part or all of the length of module 360.

[0061] Figure 3C A side view of an OSFP module within cage 370 is shown. Figure 3C 371 with connector 372, air duct 373 and blower 374 is shown in FIG. Air entering module 371 is indicated by solid line 376. The airflow distributed to blower 374 between connector 372 and air duct 373 is indicated by solid line 377. The air leaving blower 374 is indicated by solid line 378. When air passes through the left side of the data connector of the adjacent module in retainer 370 through the OSFP module through the right side of retainer 370, the temperature of the air increases. When air moves out through retainer 370 and passes through membrane 373 from left to right and passes to the right side near blower 374, the temperature of the air can be reduced or kept similar. Module 371 can be similar to the above-mentioned modules, such as module 111. Air duct 373 can have a first end and a second end, and can enclose a fixed volume. Air duct 373 can be made of any suitable material such as plastic, polymer or metal. Air duct 373 is a duct that allows air to be derived from one end of module 371. Blower 374 can be attached to one end of air duct 373, and module 371 is attached to the other end. This attachment can create air path 375. Since the modules have independent pathways, the airflow within the module can be separated from the airflow of the tray or housing in which the modules are placed, and a high pressure pathway can be created for the module and separated from the airflow requirements of the tray or housing.

[0062] In addition, the connection between module 371, air duct 373 and blower 374 can be formed by rigid, flexible or semi-flexible membrane. The membrane and opening between the components can be selected according to the specific fluid dynamics generated by the geometry of the module, air pressure and system. For example, by selecting the size of the opening or connection between the module, air duct and blower, eddy current or other undesirable phenomena may be generated. This eddy current can destroy the smooth airflow required above the module 371. In addition, when designing 375 air paths, vibration loads, frequencies, resonant frequencies, temperatures and other parameters must be considered to ensure that the air path can best cool the OSFP module. In some examples, air duct 373 can be several centimeters long and form a certain angle relative to the module. The range of this angle can be between, for example, 5-35 degrees, but in other examples, this angle can be less than 5 degrees or greater than 35 degrees. The relative geometry of the air duct can be based on the physical or operating parameters of the module, such as the air pressure of any part of the module, the air flow through the module or the air temperature leaving the module.

[0063] Blower 374 can be any device capable of producing air jets. Blower will produce negative pressure, further increasing the airflow through module 371. This in turn will allow the module to be cooled more effectively. In some examples, blower 374 can operate at a frequency of 100-1000 revolutions per minute and move 5 cubic feet of air per minute. However, in other examples, the frequency can be less than 100 revolutions per minute or greater than 1000 revolutions per minute to move 5 cubic feet of air per minute. In other examples, the rotation per minute can be modified to move less than or more than 5 cubic feet per minute. Blower can be selected to optimize the cooling, airflow, pressure or temperature drop in the module. Blower can be selected according to its frequency, vibration characteristics, ability to produce pressure gradient or other similar parameters.

[0064] In some examples, reference Figures 3A-3C The described methods and devices can be used alone or in combination with each other.

[0065] Figure 4A A schematic cross-sectional view of an OSFP module, module 400 , is shown. Figure 4A ASIC 411, laser 412, printed circuit board 413 and the housing of the OSFP module, housing 414, thermal path 415 and heat sink 416 are shown. Figure 4A 4, the intended path or one path for heat dissipation is also shown with a dashed line. ASIC is an application specific integrated circuit. ASIC 411 is mounted on the bottom of the module. In some examples, laser 412 can be a laser that operates at 10 watts. Laser 412 typically has an upper operating temperature limit of approximately 70°C. However, ASIC 411 can operate at higher temperatures, and as Figure 4A During normal operation of the ASIC, the excess heat generated may interfere with the normal operation of the laser, especially if the ASIC is far from the heat sink 416. The indirect thermal path not only causes heat to tend to move toward the laser 412, but is also ineffective in directing heat away from the ASIC.

[0066] Figure 4B A cross-sectional view of an OSFP module 450 is shown. The dashed and solid lines also show the path for heat dissipation from the module 450. Similar to the module 400, the module 450 includes an ASIC 451, a laser 452, a printed circuit board 453, a housing for the OSFP module, a housing 454, a thermal path 455, and a heat sink 456. By moving the ASIC 451 above the printed circuit board 453 and moving the laser 452 below the printed circuit board, heat can be more easily dissipated from the hotter ASIC. In addition, the printed circuit board 453 can act as an insulator and prevent some of the heat generated by the ASIC 451 from reaching the laser 452.

[0067] Figure 4C A schematic cross-sectional view of an OSFP module 460 is shown. Figure 4A ASIC 461, laser 462, printed circuit board 463 and the housing of the OSFP module are shown, housing 464, thermal path 465 and heat sink 466. An additional finned air heat sink, heat sink 470, is also shown. Heat sink 470 is located below OSFP module 400 and contacts the module along a portion of the length of the module. This enables the OSFP module to be assembled in the holder without heat sink 470 interfering with the insertion of module 400. Heat sink 470 may also include heat pipes, such as heat pipe 471. Heat pipe 471 may be made of any conductive material such as a metal or a metal compound. In some examples, the heat pipe may be made of copper, gold composite, silver or other metal composite. The material of heat pipe 471 may be selected based on the thermal expansion coefficient of the heat dissipation material and the heat pipe. By adding heat sink 470, ASIC 461 may be cooled more efficiently and more heat may be dissipated via heat sink 466 compared to heat sink 466. In some examples, the surface area of ​​the heat sink 470 can be increased by using fractal geometry. In some examples, the heat dissipated by the heat sink 470 can be between 10-100 watts. Although the heat sink 470 is oriented in one direction, it should be understood that the heat sink can be oriented in different directions relative to the module 460. The airflow can also be oriented in different directions relative to the module 460 and the heat sink 470.

[0068] In some examples, the heat pipes can be replaced with a vapor chamber containing a coolant to provide additional cooling. The coolant can be selected to be a material with high thermal conductivity, a material with a phase change, or a material with a high specific heat.

[0069] Figure 5A A rack that can accommodate several OSFP modules is shown, a top-down view of rack 500. Rack 500 has a front side and a back side. Rack 500 is designed to accommodate and cool OSFP modules when inserted into the front side. Rack 500 can accommodate a holder, such as holder 120. Rack 500 has multiple heat exchangers corresponding to OSFP modules. For example, heat exchanger 501 corresponds to four OSFP modules. Heat exchanger 502 corresponds to a single OSFP module. The heat exchanger can contain a suitable liquid coolant that can absorb the heat generated by the OSFP. The liquid coolant will be directed to a network of pipes that direct the heat to the back of rack 500. At the back of rack 500, the heat taken away from the OSFP module by the coolant can be removed from the coolant by a liquid-to-air heat exchanger, such as intercooler 510. Intercooler 510 can be made of a material with high thermal conductivity and designed to have a large surface area to remove as much heat as possible from the intercooler. Additionally, to help maintain airflow through the rack 500 , fans may be included on the rear side of the rack 500 .

[0070] Figure 5B A top-down view of a rack that can accommodate multiple OSFP modules is shown. Rack 530 can be similar to rack 500. Rack 530 has multiple heat exchangers corresponding to the OSFP modules. For example, heat exchanger 531 corresponds to four OSFP modules. Heat exchanger 532 corresponds to a single OSFP module. The heat exchangers can contain a suitable liquid coolant that can absorb the heat generated by the OSFP. The liquid coolant will be directed to a piping network that will extend through the front of the rack and connect to an external coolant distribution unit (CDU), such as CDU 540. CDU 540 can be selected based on the size and thermal requirements of the OSFP system or rack. For example, in less than 1 m 2 CDU systems that provide more than 200 kW of cooling in a space of 100 kW may be selected for certain OSFP applications where significant amounts of heat may be generated.

[0071] Figure 5C and 5DA top-down view and a side view of an OSFP module 550 with direct water cooling are shown. Similar to the modules described above, module 550 has a front side and a back side that can receive connectors. The module also has a top surface, surface 551. The module may also include a cold plate, such as cold plate 560. The cold plate may be a container capable of holding a liquid. In other examples, cold plate 560 may be a network of pipes extending several times along the length of module 550 or a single pipe looped within module 550. In some examples, the cold plate may be collected around hot spots on module 550. The back side of module 550 may include an input for cooler water, input port 561, and an output for warm water, output port 562 returning from cold plate 560. Input port 561 may be in fluid communication with cold plate 560, which in turn may be in fluid communication with output port 562. Overall, this forms a closed loop that can be cooled externally before returning to the interior of module 550. The addition of input port 561 and output port 562 still allows the OSFP form factor to be retained and ensures compatibility with existing OSFP racks. Input port 561 and output port 562 can be made of a thermally conductive material with a low coefficient of thermal expansion and can be between approximately 1 mm and 5 cm. In addition, the ports can support any suitable flow and pressure depending on the cooling requirements.

[0072] Fig. 6A Shown is a schematic cross-sectional view of an OSFP module 600. Module 600 may be similar to module 400 and its components. Fig. 6A ASIC 611, laser 612, printed circuit board 613 and the housing of OSFP module are shown, housing 614, thermal path 615 and heat sink 616. ASIC is an application specific integrated circuit. ASIC 611 is mounted at the bottom of the module. In addition, OSFP module 600 can include flat heat pipes such as heat pipes 618 and 619 integrated toward the bottom of module 600. These flat heat pipes can be made of high conductivity materials. Keeping the heat pipes relatively flat can maintain the OSFP module specifications.

[0073] Figure 6B Shown is a schematic cross-sectional view of an OSFP module 650. Module 650 may be similar to module 400 and its components. Figure 6BASIC 611, laser 662, printed circuit board 663 and the housing of OSFP module, housing 664, thermal path 665 and heat sink 669 are shown. ASIC is an application specific integrated circuit. ASIC 661 is mounted at the bottom of the module. In addition, OSFP module 600 can include flat heat pipes, such as heat pipe 668, integrated toward the bottom of module 600. These flat heat pipes can be made of high conductivity materials. Keeping the heat pipes relatively flat will allow the OSFP module specifications to be maintained while still allowing improved cooling. In addition, fins can be added at the bottom of the module to provide additional cooling. In some examples, housing 664 can be recessed or otherwise modified to allow space for additional cooling fins to be incorporated without affecting the size of module 650 or preventing it from being integrated into the rack.

[0074] Figure 6C Is a reference Figure 6B Another side view of an OSFP module 650 of similar features is depicted.

[0075] Figure 7 Shown is a schematic cross-sectional view of an OSFP module 700. Module 700 may be similar to module 400 and its components. Figure 7 ASIC 711, laser 712, printed circuit board 713 and housing of OSFP module are shown, housing 714, thermal path 715 and fin 716. Fin 716 can also be a heat sink. ASIC is an application specific integrated circuit. ASIC 711 is mounted at the bottom of the module. In addition, OSFP module 700 can include flat heat pipes such as heat pipe 718 integrated toward the bottom of module 700. These flat heat pipes can be made of high conductivity materials. Keeping the heat pipes relatively flat will allow the OSFP module specifications to be maintained. In some examples, heat pipe 718 can be a steam chamber.

[0076] Figures 8A-8E Various views of an OSFP module 800 are shown.

[0077] Fig. 8AAn exploded view of an OSFP-compatible module 800 is shown. An internal cooling member 810 having a surface 811 and an inlet 812 is shown. A first intermediate member 820 includes a heat sink 821. The heat sink 821 can be a heat sink, a heat pipe, or a heat sink. The heat sink 821 can be a vapor chamber with an evaporator and a condenser. The heat sink 821 can be made of a material with a high thermal conductivity, or can be made of a material with a much higher thermal conductivity than other materials of the module 800. For example, the heat sink 821 can be made of a metal or a metal compound. The heat sink 821 can be in thermal contact with the cooling member 810. In some examples, the heat sink 821 and the cooling member 810 can be a continuous member. In these examples, additional thermal cooling can be achieved as the number of thermal interfaces is reduced. The heat sink 821 can be as thick as a portion of the intermediate member 820 and in thermal contact with a heat source. One side of the heat sink 821 can be in thermal contact with the cooling member 810, while the opposite side of the heat sink 821 can be in contact with the heat source. The second intermediate member 830 may include a front side with a data connector 831. In some examples, the data connector 831 may include a material layer with low thermal conductivity to prevent the heat source in contact with the heat sink 821 from transmitting or conducting heat to the bottom of the module 800. The intermediate member 830 may be configured to accommodate an electronic device that is a heat source, such as a laser or an ASIC. The bottom member 840 may include a heat sink 841. The heat sink 841 may be a heat sink or a heat conductive surface in thermal contact with a heat source, such as an electronic device, an ASIC, or a laser. In some examples, the heat sink 841 may extend beyond the bottom surface of the module 800 and into a larger system. In some examples, the heat sink 841 may form an external heat sink. In some examples, the heat sink 841 may be a vapor chamber. In some examples, the heat sink 841 may contact an external heat sink or cooling member. The heat sink 821, the heat sink 841, the thin vapor chamber, or the flat heat pipe may be incorporated into the top or bottom of the module 800 to improve heat dissipation. In some examples, the external contact surfaces of heat sink 821 and heat sink 841 may be vapor chambers or heat pipes that may be flush or slightly below flush with the outer surface of module 800 .

[0078] Figure 8B A top-down view of an assembled OSFP-compatible module 800 is shown, with a surface 811 , an inlet 812 , a heat sink 821 , and a heat sink 841 . Figure 8BAlso shown is a printed circuit board 832. The printed circuit board can interface with electronics inside and outside the module 800. In addition, the printed circuit board can be made of a material with low thermal conductivity. In some examples, the laser can be mounted in the upper portion of the module 800 and in thermal contact with the heat sink 821, while the ASIC is mounted in the lower portion, below the printed circuit board 832, and in thermal contact with the heat sink 841. The laser will be able to dissipate heat through the heat sink 821, while the ASIC dissipates heat through the heat sink 841. Therefore, the overall cooling through the module is increased in this way.

[0079] Figure 8C A bottom-up view of an assembled OSFP-compatible module 800 is shown, with a heat sink 841 and data connector 831 visible. In some examples, a cutout may be made in the module 800 to allow the heat sink 841 to contact an external heat sink. In other examples, the heat sink 841 may form part of the outer surface of the module 800, or be flush with the surface. In some examples, the heat sink 841 may contact an external cooler. In some examples, the external cooler or heat sink may be a liquid heat exchanger, a Peltier heat pump, or an additional heat pipe.

[0080] Fig.8D Module 800 is shown within a holder 860. Holder 860 can be mounted to printed circuit board 851. Holder 860 can include several openings, such as openings 861 and 862 to accommodate modules such as module 800. Printed circuit board 851 can be mounted within a larger enclosure. Printed circuit board 851 can interface with electronic devices within one or more modules. As previously discussed, holder 860 and printed circuit board 851 can be configured to allow a heat sink, which is in thermal contact with module 800 through heat sink 841. For example, the printed circuit board and holder can have cutouts that match an external heat sink. In some examples, holder 860 can be spring loaded to allow for easier compatibility with the mechanical match of the component. In other examples, holder 860 can be springless.

[0081] Fig. 8E A schematic cross-sectional view of the module 800, the external heat sink 852 and the printed circuit board 851 is shown. Figures 8A-8D In addition to the various components discussed, Fig. 8E Laser 890 and ASIC 891 are shown.

[0082] Fig. 9Thermal and electrical aspects of an example OSFP-compliant transceiver module at various operating temperatures are shown. The horizontal axis of graph 900, axis 905, indicates the throughput of the OSFP module. The vertical axis of graph 900, i.e., axis 910, indicates the thermal performance required for a certain throughput. Three data points are plotted, data points 921–923, corresponding to throughputs of 400 Gbps, 800 Gbps, and 1.6 Tbps, respectively. For example, it is expected that an 800G bit rate will require 19W of power, while a 1.6T bit rate will require 25W of power. The current OSFP form factor cannot support the latter bit rate because the OSFP module generates too much heat to operate properly. At higher temperatures, the air pressure drop inside the module may be too high to effectively cool the module under ambient and static conditions.

[0083] Fig. 10A A side view of an OSFP module 1000 is shown, which has the Figure 1A-8E One or more of the configurations discussed. FIG. 10 shows an outer housing 1010 that may have an inlet 1050. The module 1000 has a front side with an inlet 1040, a rear side with a rear side or air outlet, outlet 1080, and a top surface 1030 formed between the front and rear sides. The module 1000 may have an external heat sink 1020 attached to the top surface 1030. The module 1000 may also have an inner surface 1041, which, as explained previously, may contain holes in some examples to allow air to vent to an interior portion of the module 1000. The module 1000 may have a surface 1060. In some examples, the surface 1060 may be configured to allow an external bottom heat sink to contact the surface 1060. The housing 1010 may have a bottom portion, portion 1070. In some examples, portion 1070 may be cut to create an opening for the bottom heat sink.

[0084] Fig. 10B The air path in the side view of the OSFP module is shown with reference to the above Figure 1A-8EOne or more of the configuration air paths 1081-1085 discussed. Air path 1085 may enter through inlet 1050 of housing 1010 and flow over OSFP module 1000. Air path 1081 may enter through inlet 1050 of housing 1010 and flow through external heat sink 1020 thermally connected to top surface 1030 of module 1000. Air path 1082 may enter through inlet 1040, pass through the length of OSFP module 1000, and exit through air outlet 1080. As discussed above, air path 1082 may encounter spike fins, such as spike fin 222. Air path 1083 may pass through holes in the inner surface, such as hole 212, and pass through an interior portion of module 1000 before exiting through a rear end. Air path 1084 may extend parallel to a bottom portion of module 1000. Air path 1084 may intersect an external heat sink attached to the bottom of the module to provide additional cooling.

[0085] Although the present disclosure includes many specific implementation details, these should not be interpreted as limitations on the scope of the claimed protection, but rather as descriptions of specific features of specific embodiments. Certain features described in the context of separate embodiments in this specification may also be implemented in combination in a single embodiment. On the contrary, the various features described in the context of a single embodiment may also be implemented separately in multiple embodiments or in any suitable sub-combination. In addition, although features may be described above as working in certain combinations, and even initially claimed as such, in some cases, one or more features from the claimed combination may be deleted from the combination, and the claimed combination may be directed to a sub-combination or a variation of the sub-combination.

[0086] Similarly, while operations are described in the drawings in a particular order, this should not be understood as requiring that the operations be performed in the particular order or sequence shown, or that all illustrated operations be performed, to achieve desired results. In certain circumstances, multitasking and parallel processing may be advantageous.

[0087] References to "or" may be interpreted as inclusive, so any term described using "or" may mean any of the described terms singly, more than one, and all. Labels "first," "second," "third," etc. are not necessarily meant to indicate an order, and are generally used only to distinguish between similar or analogous items or elements.

[0088] Aspects of the technology may include an assembly comprising: An eight-channel small form factor pluggable (OSFP) module including a data connector and an inlet aperture configured to enable airflow between an interior portion and an exterior portion of the OSFP module; a first heat sink having a top surface and an opposing bottom surface facing the OSFP module; a first plurality of hollow channels formed between the OSFP module and the bottom surface; a second heat sink having a surface covering and thermally connected to the top surface of the first heat sink; and / or a plurality of fins extending away from a surface of the second heat sink; and / or wherein a first space between at least a first pair of two adjacent fins of the plurality of fins is different from a second space between a second pair of adjacent fins, thereby optimizing thermal performance characteristics of the module; and / or wherein the second heat sink contacts the top surface; and / or a housing for receiving the OSFP module therein and located between the second heat sink and the surface; and / or wherein the housing includes an opening through which the OSFP module and the second heat sink are thermally interconnected; and / or wherein at least part of the module comprises a diamond composite material; and / or wherein the diamond composite material is aluminum diamond; and / or wherein at least part of the module is made of a metal composite material; and / or Contains external or internal water cooling elements; and / or comprising a steam chamber; and / or Includes bottom heat sink.

[0089] Aspects of the disclosed technology may include any combination of the following features: ¶1. A component comprising: An eight-channel small form factor pluggable (OSFP) module including a data connector and an inlet aperture configured to enable airflow between an interior and an exterior of the OSFP module; a first heat sink having a top surface and an opposing bottom surface facing the OSFP module; a first plurality of hollow channels formed between the OSFP module and the bottom surface; a second heat sink having a surface covering the top surface of the first heat sink and thermally connected to the top surface; and A plurality of fins extend away from the second heat sink surface. ¶2. The assembly of ¶1, wherein a first space between at least a first pair of two adjacent fins of the plurality of fins is different than a second space between a second pair of adjacent fins, thereby optimizing thermal performance characteristics of the module. ¶3. An assembly according to ¶¶ 1–2, wherein a second heat sink contacts the top surface. ¶4. An assembly according to any of ¶1–3, further comprising a housing for receiving the OSFP module therein, the housing being located between the second heat sink and the surface. ¶5. An assembly according to ¶¶ 1–4, wherein the housing includes an opening through which the OSFP module and the second heat sink are thermally interconnected. ¶6. An assembly according to ¶¶ 1–4, wherein at least a portion of the module comprises a diamond composite material. ¶7. An assembly according to ¶¶ 1–6, wherein the diamond composite material is aluminum diamond. ¶8. An assembly according to ¶¶ 1–6, wherein at least a portion of the module is made of a metal composite material. ¶9. A system comprising: an outer housing having an opening; and The assembly according to ¶ 1 is disposed within the outer housing, wherein the plurality of fins are configured to receive airflow from an opening. ¶10. A system comprising: Octal Small Form Factor Pluggable (OSFP) module that includes: a front side and a rear side opposite to the front side; a substantially continuous top surface extending from a portion of the front side to a portion of the rear side; a data connector formed on the front side; an air duct having a first end and a second end, the first end of the air duct forming a closed connection with the rear side of the module; a blower having a first end and an exhaust port, the first end of the blower forming a closed connection with the second end of the air conduit; and An air path is formed from the front side of the module through at least the air duct to the exhaust end of the blower. ¶11. The system of ¶10, further comprising an air duct formed from the metal composite material. ¶12. A system according to ¶¶ 10–12, wherein the relative size of the air duct is based on the air pressure or air velocity at the rear side of the module. ¶13. A system according to ¶¶ 10–12 wherein the geometry of the air duct is arranged to prevent the formation of vortices within the system. ¶14. A system according to ¶¶ 10–13, wherein the frequency of the blower is based on the geometry of the module. ¶15. A system according to ¶¶ 10–13, wherein the frequency of the blower is based on the air pressure or air velocity at the rear side of the module. ¶16. A system according to ¶¶ 10–15, wherein the air path is optimized for heat dissipation from the module, and / or the system is connected or thermally coupled to a water source, and / or the module includes a steam chamber. 17. An octal small form factor pluggable (OSFP) module comprising: a front side and a rear side opposite to the front side; a substantially continuous top surface extending from a portion of the front side to a portion of the rear side; a data connector disposed on the front side; and A plurality of pin-shaped fins are formed in an array on the top surface, each pin-shaped fin being substantially non-linear in shape and enclosing an area formed by a closed loop on the top surface, wherein the plurality of pin-shaped fins minimize a pressure gradient between a front side and a rear side of the module. ¶18. The module of ¶17, wherein each of the pin-shaped fins is formed into a diamond shape. ¶19. A module according to ¶¶ 17–18, wherein the front side includes a substantially open air channel over the data connector. ¶20. A module according to ¶¶ 17–19, wherein the plurality of pin-shaped fins are arranged in rows, the rows being offset from one another. ¶21. A module according to ¶19, wherein the plurality of pin-shaped fins cover at least 30% of the surface area of ​​the top surface. ¶22. A module according to ¶¶ 17–19, wherein each of the pin-shaped fins forms an air foil that provides a path for fluid to move over the top surface. ¶23. A module according to ¶¶ 17–20, wherein the air flap is configured to align with a spring-loaded chamfer formed in a housing of the module. ¶24. A module according to ¶23, wherein the plurality of pin-fins are configured to attenuate electromagnetic interference. ¶25. A module according to ¶23, wherein the plurality of pin-fins are configured to attenuate radiation emitted from a front side of the module. ¶26. A module according to ¶17, wherein the module is connected or thermally coupled to a water source and / or a bottom heat sink and / or a steam chamber and / or an inlet and / or an orifice and / or a blower.

[0090] Various modifications to the embodiments described in this disclosure will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments without departing from the spirit or scope of the present disclosure. Therefore, the claims are not intended to be limited to the embodiments shown herein, but are to be consistent with the broadest scope consistent with the content, principles, and novel features disclosed herein.

Claims

1. A system comprising: An eight-channel small form factor pluggable (OSFP) module, the OSFP module comprising: a front side and a rear side opposite to the front side; a substantially continuous top surface extending from a portion of the front side to a portion of the rear side; a data connector formed on said front side; an air conduit having a first end and a second end, the first end of the air conduit forming a closed connection with the rear side of the OSFP module; a blower having a first end and an exhaust end, the first end of the blower forming a closed connection with the second end of the air conduit; and An air path is formed from the front side of the OSFP module through at least the air duct to an exhaust end of the blower.

2. The system according to claim 1, wherein: The air duct is formed from a metal composite material.

3. The system according to claim 1, wherein: The relative size of the air duct is based on the air pressure or air velocity at the back side of the OSFP module.

4. The system according to claim 1, wherein: The geometry of the air ducts is arranged to prevent the formation of vortices within the system.

5. The system according to claim 4, wherein: The frequency of the blower is based on the geometry of the OSFP module.

6. The system according to claim 1, wherein: The frequency of the blower is based on the air pressure or air velocity at the back side of the OSFP module.

7. The system according to claim 1, wherein: The air path is optimized for heat dissipation from the OSFP module.

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