High-luminous-efficiency LED light-emitting semiconductor and preparation method thereof

Abstract

The invention belongs to the technical field of LEDs (light-emitting diodes), solves the problem of poor luminous efficiency of the LEDs in the prior art, and provides a high-luminous-efficiency LED light-emitting semiconductor and a preparation method thereof, and the high-luminous-efficiency LED light-emitting semiconductor comprises an excitation chip and fluorescent powder. The fluorescent powder comprises first fluorescent powder, second fluorescent powder and third fluorescent powder, the peak wavelength of the first fluorescent powder is located in a first wavelength interval, the peak wavelength of the second fluorescent powder is located in a second wavelength interval, and the peak wavelength of the third fluorescent powder is located in a third wavelength interval; the first wavelength interval ranges from 540 nm to 550 nm, the second wavelength interval ranges from 625 nm to 635 nm, and the third wavelength interval ranges from 615 nm to 620 nm; the dominant wavelength of the LED excitation chip is located in a fourth wavelength interval, and the fourth wavelength interval is 440-470 nm. According to the invention, through the cooperation of the chip and the fluorescent powder, the obtained LED light-emitting semiconductor has higher luminous efficiency and stability.

Description

Technical Field

[0001] The invention relates to the field of LEDs, and in particular to a high-light-efficiency LED light-emitting semiconductor and a preparation method thereof. Background Art

[0002] With the rapid development of semiconductor lighting technology, LED (Light Emitting Diode) has been widely used in general lighting, backlight display and other fields due to its advantages such as high efficiency, energy saving and long life. However, traditional LED light-emitting devices still have certain technical bottlenecks in terms of luminous efficiency and color rendering. Especially under high color rendering requirements (such as display backlight and high color rendering index lamps), their luminous efficiency is usually low and cannot meet the demand for high-quality light sources. This is mainly because traditional LED devices rely only on a single type of phosphor or mixed phosphors and cannot accurately control the output ratio of light of different wavelengths, resulting in a decrease in overall luminous efficiency and difficulty in obtaining ideal luminous effects.

[0003] Specifically, the prior art generally uses a blue light chip to excite a single or simply mixed phosphor system to obtain white light. However, due to the unreasonable ratio of light in different bands, it is difficult to balance the color rendering and luminous efficiency of LED devices. In particular, the effective output of the red light band is relatively weak, which makes the luminous quality of LEDs in high color rendering index applications unsatisfactory. In addition, the existing phosphor materials may experience temperature quenching effects under high temperature working conditions, that is, the fluorescence efficiency decreases significantly at high temperatures, thereby further reducing the stability and reliability of LED devices. Therefore, how to improve the luminous efficiency and color rendering of LEDs and improve their stability under high temperature conditions has become an important issue in the current technical field. Summary of the invention

[0004] In view of this, an embodiment of the present invention provides a high-light-efficiency LED light-emitting semiconductor and a method for preparing the same, so as to solve the problems of poor light efficiency and stability in the implementation of the prior art full-spectrum white light LED.

[0005] In a first aspect, an embodiment of the present invention provides a high-light-efficiency LED light-emitting semiconductor, including: an LED excitation chip; Phosphor; The phosphor includes a first phosphor, a second phosphor and a third phosphor, wherein the peak wavelength of the first phosphor is within a first wavelength range, the peak wavelength of the second phosphor is within a second wavelength range, and the peak wavelength of the third phosphor is within a third wavelength range; the first wavelength range is 545-556 nm, the second wavelength range is 630-634 nm, and the third wavelength range is 615-617 nm; The main wavelength of the LED excitation chip is in a fourth wavelength range, and the fourth wavelength range is 440-470 nm.

[0006] Preferably, according to claim 1, the high-efficiency LED light-emitting semiconductor is characterized in that the particle size of the first phosphor is between 23.0 and 26.0 µm, the particle size of the second phosphor is between 22.0 and 28.0 µm, and the particle size of the third phosphor is between 18.0 and 20.0 µm.

[0007] Preferably, the chemical formula of the first phosphor is Y3(Al,Ga)5O 12 :Ce, the chemical formula of the second phosphor is K2SiF6:Mn 4+ , the third phosphor is a nitride; compared with room temperature, the temperature quenching rate of the third phosphor at 100° C. is 93%; the internal quantum efficiency of the third phosphor is 0.97±0.02, and the external quantum efficiency of the third phosphor is 0.85±0.02.

[0008] Preferably, it also includes LED packaging glue, the mass percentage of the first phosphor is 17.42%, the mass percentage of the second phosphor is 0.62%, the mass percentage of the third phosphor is 21.42%, and the mass percentage of the LED packaging glue is 60.54%.

[0009] In a second aspect, an embodiment of the present invention further provides a method for preparing a high-light-efficiency LED light-emitting semiconductor, which is used for the high-light-efficiency LED light-emitting semiconductor described in the first aspect of claim 1, and the preparation method comprises: The first phosphor, the second phosphor and the third phosphor weighed in a first preset ratio are placed in a stirring container and mixed evenly to obtain a phosphor mixture; According to a second preset ratio, the phosphor mixture is added to the LED packaging glue, and stirring is continued to obtain a mixed colloid; In response to the first spectroscopic test result of the mixed colloid satisfying the first preset condition, the mixed colloid is uniformly coated on the surface of the LED excitation chip according to preset spin coating parameters to form a fluorescent coating; In response to the second spectroscopic test result of the fluorescent coating satisfying the second preset condition, curing the LED excitation chip with the fluorescent coating according to the preset curing condition to obtain an initial light-emitting semiconductor; If the third light splitting test result of the initial light emitting semiconductor does not meet the preset finished product light splitting condition, one or more of the first preset ratio, the second preset ratio, the preset spin coating parameters and the preset curing conditions are adjusted according to the first light splitting test result, the second light splitting test result and the third light splitting test result; If the third light-splitting test result of the initial light-emitting semiconductor meets the preset finished product light-splitting condition, the initial light-emitting semiconductor is used as the target light-emitting semiconductor.

[0010] Preferably, the method for preparing a high-light-efficiency LED light-emitting semiconductor is characterized in that the phosphor mixture is added to the LED packaging glue according to the second preset ratio, and the mixture is continuously stirred to obtain a mixed colloid, comprising: According to a second preset ratio, the phosphor mixture and the LED encapsulation adhesive are initially stirred at a first preset stirring speed for a first preset time; Continuously stirring at a second preset stirring speed and maintaining for a second preset time to obtain an initial mixed colloid, wherein the second preset speed is greater than the first preset speed; Extracting samples from different positions of the initial mixed colloid to obtain a first preset number of mixed colloid samples; Performing a spectrophotometric test on each of the mixed colloid samples to obtain a corresponding first spectrophotometric test result, wherein the first spectrophotometric test result includes: luminous flux, color coordinate value, and color temperature; According to each of the first spectrophotometric test results, the differences in the color coordinate values, the luminous flux and the color temperature values ​​between the two mixed colloid samples are obtained to obtain a difference value set, wherein the difference value set includes a color coordinate difference value set, a luminous flux difference value set and a color temperature difference value set; If the difference value set satisfies a first preset mixing condition, then according to each of the first spectrophotometric test results, the standard deviations of the color coordinate value, the luminous flux and the color temperature value are respectively obtained, wherein the first preset mixing condition includes that each color coordinate difference value in the color coordinate difference value set is less than or equal to a preset color coordinate threshold value, each color luminous flux difference value in the luminous flux difference value is less than or equal to a preset luminous flux threshold value, and each color temperature difference value in the color temperature difference value set is less than or equal to a preset color temperature threshold value; If the difference value sets do not satisfy the first preset mixing condition, or the standard deviation of the color coordinate value, the luminous flux, or the color temperature value does not satisfy the second preset mixing condition, the second preset speed and / or the second preset time are adjusted, and the process returns to the step of continuously stirring at the second preset stirring speed and maintaining the stirring for the second preset time to obtain an initial mixed colloid, wherein the second preset mixing condition includes that the standard deviation of the color coordinates is less than or equal to the preset color coordinate standard deviation, the standard deviation of the color temperature value is less than or equal to the preset color temperature standard deviation, and the standard deviation of the luminous flux is less than or equal to the preset luminous flux standard deviation; If the standard deviations of the color coordinate values, the luminous flux, and the color temperature values ​​satisfy the second preset mixing condition, a mixed colloid satisfying the first preset condition is obtained through the initial mixed colloid.

[0011] Preferably, in response to the first spectroscopic test result of the mixed colloid satisfying the first preset condition, the mixed colloid is uniformly coated on the surface of the LED excitation chip according to preset spin coating parameters to form a fluorescent coating, including: Obtaining the viscosity of the mixed colloid and the target thickness of the fluorescent coating; According to the viscosity and the target thickness, obtaining corresponding preset spin coating parameters, wherein the preset spin coating parameters include a spin coating speed control curve, the spin coating speed control curve includes a plurality of stages, and different stages have different durations and / or spin coating speeds; Add a preset amount of mixed colloid to the center of the LED excitation chip; According to the spin coating speed control curve, controlling the LED excitation chip to rotate so that the mixed colloid diffuses on the surface of the LED excitation chip to form an initial fluorescent coating; Performing spectroscopic detection on different positions on the initial fluorescent coating to obtain a second preset number of second spectroscopic test results; Judging whether the fluorescent coating is uniform according to the difference between the second spectroscopic test results; If it is not uniform, adjusting the duration of the specified phase of the spin coating speed control curve and / or the spin coating speed according to the degree of difference; If it is uniform, a fluorescent coating satisfying the second preset condition is obtained through the initial fluorescent coating.

[0012] Preferably, the spin coating speed control curve includes an initial stage, a main spin coating stage and an accelerated spin coating stage in sequence, and obtaining preset spin coating parameters according to the viscosity and the target thickness includes: Measuring the mixed colloid to obtain colloid parameters, wherein the colloid parameters include density and particle concentration of the mixed colloid; According to the viscosity of the mixed colloid, the preset drop amount and the surface area of ​​the LED excitation chip, a first rotation speed and a first duration in the initial stage are obtained, wherein the first rotation speed is positively correlated with the viscosity of the coating colloid and negatively correlated with the surface area; the first duration is positively correlated with the surface area and positively correlated with the preset drop amount; According to the viscosity, density and particle concentration of the mixed colloid, a second rotation speed and a second duration of the main spin coating stage are obtained, wherein the second rotation speed is positively correlated with the viscosity and density, and negatively correlated with the particle concentration; the second duration is positively correlated with the target thickness, and negatively correlated with the density; According to the viscosity, density and particle concentration of the mixed colloid, a third rotation speed and a third duration of the accelerated spin coating stage are obtained, wherein the third rotation speed is positively correlated with the viscosity and density, and negatively correlated with the particle concentration; the third duration is positively correlated with the target thickness, and negatively correlated with the density.

[0013] Preferably, in response to the second spectroscopic test result of the fluorescent coating satisfying the second preset condition, the LED excitation chip with the fluorescent coating is cured according to the preset curing condition to obtain an initial light-emitting semiconductor, including: Obtaining preset curing conditions corresponding to the type of the LED packaging glue, wherein the preset curing conditions include curing temperature and curing time; According to the colloid parameters of the mixed colloid, the preset curing conditions are adjusted to obtain the target curing conditions. According to the target curing conditions, curing the LED excitation chip with the fluorescent coating to obtain an initial light-emitting semiconductor; Performing a spectroscopic test on the initial light-emitting semiconductor to obtain a third spectroscopic test result, wherein the third spectroscopic test result includes a luminous flux, a color coordinate value, and a color temperature; A weighted operation is performed on the difference between each parameter in the third spectral test result and the corresponding target spectral parameter threshold to obtain the spectral deviation degree of the initial light-emitting semiconductor, wherein the target spectral parameter threshold includes a luminous flux threshold, a color coordinate threshold and a color temperature threshold; the weight value of the luminous flux is greater than or equal to the weight value of the color coordinate value, and the weight value of the color coordinate value is greater than the weight value of the color temperature; If the light splitting deviation degree is less than or equal to the preset deviation threshold, the third light splitting test result meets the preset finished product light splitting condition; Otherwise, the third spectrophotometric test result does not meet the preset finished product spectrophotometric condition.

[0014] Preferably, if the third light splitting test result of the initial light emitting semiconductor does not meet the preset finished product light splitting condition, one or more of the first preset ratio, the second preset ratio, the preset spin coating parameters and the preset curing conditions are adjusted according to the first light splitting test result, the second light splitting test result and the third light splitting test result, including: Respectively obtaining the deviation degree of the first light splitting test result, the second light splitting test result and the third light splitting test result from the target light splitting parameter threshold, recorded as a first deviation degree, a second deviation degree and a third deviation degree; According to the preset deviation threshold, obtaining the allowable deviation thresholds of the first spectrophotometric test result, the second spectrophotometric test result, and the third spectrophotometric test result, wherein the allowable deviation thresholds of the first spectrophotometric test result, the second spectrophotometric test result, and the third spectrophotometric test result are increased in sequence; Determining a main deviation stage according to the first deviation degree, the second deviation degree, the third deviation degree and the corresponding allowable deviation threshold, wherein the main deviation stage includes one of a mixing stage, a spin coating stage and a curing stage; According to the main deviation stage, determining the parameters to be adjusted, wherein the parameters to be adjusted in the mixing stage include a first preset ratio and a second preset ratio, the parameters to be adjusted in the spin coating stage include preset spin coating parameters, and the parameters to be adjusted in the curing stage include preset curing conditions; Determining an adjustment amount of the parameter to be adjusted according to the first light splitting test result, the second light splitting test result, the third light splitting test result and the target light splitting parameter threshold; The parameter to be adjusted is adjusted according to the adjustment amount.

[0015] In summary, the beneficial effects of the present invention are as follows: The high-efficiency LED light-emitting semiconductor and its preparation method provided in the embodiment of the present invention adopts a blue LED excitation chip with a main wavelength of 440-470 nm, which effectively excites three phosphors of different wavelengths, so that the emission light of each phosphor can be output to the maximum, reducing the luminous loss. At the same time, the wavelength ranges of different phosphors are reasonably selected, so that the blue light and red light components are fully proportioned, the overall luminous efficiency is improved, and the defect of large light loss in traditional mixed phosphors is overcome; The combination of three phosphors makes the ratio of light of different wavelengths more balanced, especially the increase of red and green light, which effectively improves the color rendering of LED light sources and is suitable for application scenarios with high color rendering requirements. In addition, the specific wavelengths of green light (540-550 nm) and red light (625-635 nm, 615-620 nm) complement each other, improving the continuity of the spectrum, making the color temperature and color rendering index more stable, and enhancing the light color quality.

[0016] In summary, this solution significantly improves the luminous efficiency, color rendering and stability of LED light-emitting semiconductors through a precisely designed three-band phosphor system and packaging structure, solving the problems of poor luminous efficiency, low color rendering and insufficient temperature stability of traditional LED light-emitting devices, and has high practical value. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the embodiment of the present invention will be briefly introduced below. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work, and these are all within the protection scope of the present invention.

[0018] Figure 1Graph showing the excitation and emission spectra of the first phosphor according to an embodiment of the present invention.

[0019] Figure 2 This is a test diagram of thermal stability of the first phosphor according to an embodiment of the present invention.

[0020] Figure 3 Graph showing the excitation and emission spectra of the second phosphor according to an embodiment of the present invention.

[0021] Figure 4 Graph showing the excitation and emission spectra of the third phosphor according to an embodiment of the present invention.

[0022] Figure 5a This is a spectroscopic test data table of a high-efficiency LED light-emitting semiconductor in an embodiment of the present invention.

[0023] Figure 5b This is a spectroscopic test data table of a conventional LED light-emitting semiconductor in an embodiment of the present invention.

[0024] Figure 6 Schematic diagram of the preparation method in the embodiment of the present invention. DETAILED DESCRIPTION

[0025] The features and exemplary embodiments of various aspects of the present invention will be described in detail below. In order to make the purpose, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and Examples. It should be understood that the specific embodiments described herein are only configured to explain the present invention and are not configured to limit the present invention. For those skilled in the art, the present invention can be implemented without the need for some of these specific details. The following description of the embodiments is only to provide a better understanding of the present invention by illustrating examples of the present invention.

[0026] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the statement "include..." do not exclude the presence of other identical elements in the process, method, article or device including the elements.

[0027] Example 1

[0028] In a first aspect, an embodiment of the present invention provides a high-light-efficiency LED light-emitting semiconductor, comprising: LED excitation chip; Phosphor; The phosphor comprises a first phosphor, a second phosphor and a third phosphor, wherein the peak wavelength of the first phosphor is within a first wavelength range, the peak wavelength of the second phosphor is within a second wavelength range, and the peak wavelength of the third phosphor is within a third wavelength range; the first wavelength range is 540-550 nm, the second wavelength range is 625-635 nm, and the third wavelength range is 615-620 nm; The main wavelength of the LED excitation chip is in a fourth wavelength range, and the fourth wavelength range is 440-470 nm.

[0029] Specifically, the light-emitting semiconductor includes an LED excitation chip, the main wavelength of which is within the blue light band of 440-470 nm. Selecting a blue light chip within the 440-470 nm band helps to efficiently excite the phosphors, and the blue light chip has a good spectral match with the three phosphors, thereby improving the excitation efficiency of the phosphors. At the same time, the blue light within this wavelength range can excite the phosphors to produce white light with high color rendering, making the light color emitted by the LED more uniform and natural. In addition, the blue light LED chip has more advantages in light efficiency and power, generates less heat, and has high efficiency, which helps to improve the overall luminous efficiency.

[0030] The light-emitting semiconductor uses three different phosphors, namely the first phosphor, the second phosphor and the third phosphor. The peak wavelength of each phosphor is within a specific wavelength range to achieve a combination of different light colors, as follows: The peak wavelength of the first phosphor is at 540-550 nm, which belongs to the green band; The peak wavelength of the second phosphor is at 625-635 nm, which belongs to the red band; The peak wavelength of the third phosphor is at 615-620 nm, which belongs to the deeper band of red light; See also Figure 1-4 , through the combination of three phosphors, it covers a wide spectrum range from blue light (440-470 nm) to green light (540-550 nm) and red light (625-635 nm and 615-620 nm). In particular, the reasonable ratio of red and green light makes the LED's luminous spectrum more continuous and the color rendering index higher, making it more suitable for applications with high color rendering requirements, such as high-quality lighting and display backlight sources.

[0031] The proper supplement of green and red light makes the white light emitted by the LED close to natural light, avoiding the cold light sensation caused by the uneven mixing of a single blue light chip and phosphor, helping to create a softer and more comfortable light environment and reduce visual fatigue.

[0032] By adjusting the ratio of the three phosphors, light color adjustment can be further achieved to adapt to the light color requirements in different application scenarios, such as warm white light or cool white light, making it widely applicable in commercial lighting, home lighting and other fields.

[0033] Through precise wavelength control, the luminous intensity of phosphors in different bands is optimized, so that the green and red components occupy a suitable proportion in the spectrum, thereby making the luminous quality of the LED higher. The ratio adjustment of green light and red light makes up for the problem of insufficient red light output in traditional LEDs, making the overall luminescence of the LED more balanced and the color rendering higher. In the above-mentioned specific wavelength range, the blue light excitation effect is better, the phosphor conversion efficiency is higher, and the light loss is reduced. This matching wavelength selection ensures the efficient luminous performance of the LED and makes the most of the blue light energy. The selection of wavelength range not only takes into account the luminous efficiency, but also the stability of the phosphor at different temperatures. Precise wavelength control effectively reduces the light decay of the phosphor, especially in high temperature environments, which helps to improve the long-term stability of LED devices.

[0034] By coating three types of phosphors with precise wavelength ranges on the blue light LED excitation chip, the technical bottleneck of insufficient luminous efficiency and color rendering of traditional LEDs was overcome, and an LED light-emitting semiconductor with high color rendering, high luminous efficiency and high temperature stability was achieved.

[0035] Preferably, the first wavelength range is 545-556 nm, the second wavelength range is 630-634 nm, and the third wavelength range is 615-617 nm.

[0036] Specifically, in this embodiment, the peak emission wavelength range of each phosphor is preferably further refined, and the first wavelength range is 545-556 nm. This wavelength range is within the green light band, and is further optimized to 545-556 nm compared to the broad 540-550 nm range. The green light component in this wavelength range is closer to the green light band of natural light, which is the range in which the human eye is most sensitive to green, and helps to enhance the color rendering and visual comfort of the LED light source. Selecting a green light wavelength of 545-556 nm can better compensate for the band gap between blue light and red light, making the spectrum more uniform. Green light emits relatively pure green light in this range, which improves the overall color rendering index (CRI), makes the green component in white light fuller, and helps to enhance the visual experience.

[0037] The second wavelength range is 630-634 nm, which is the upper end of the red light band. The red light component is fuller in the range of 630-634 nm. Compared with the broad 625-635 nm, this range more accurately locates the appropriate red light band, which helps to enhance the color rendering. Choosing to emit light in the red light band of 630-634 nm can improve the color rendering index of the LED light source, especially the color rendering of red objects. Compared with other red light bands, the red light output in this wavelength range is purer, avoiding the energy waste of long-wavelength red light. At the same time, the red light efficiency in this range is higher, which can improve the color rendering index without affecting the overall light effect, making the LED light source more realistic and natural in color performance, especially suitable for lighting scenes with high color rendering requirements.

[0038] The third wavelength range is 615-617 nm, which is in the low wavelength range of red light and is slightly darker red than standard red light. Selecting this narrower range (615-617 nm) can enhance the richness of the spectrum, making the LED white light warmer and fuller in tone. Adding deep red light from 615-617 nm can fill the luminous gap between the green and red bands, further smooth the spectrum, and improve the color transition of the light source. This deep red light component makes the LED's luminous color softer, especially suitable for applications that require warm white light. At the same time, it can reduce the visual stimulation of cold white light while maintaining a high color rendering index, making the light color softer.

[0039] Further optimized wavelength ranges (545-556 nm, 630-634 nm, 615-617 nm) can make the LED spectrum distribution more uniform, effectively improving color rendering and visual comfort. In these narrower wavelength ranges, the phosphor has higher luminous efficiency and purer light color, which ultimately significantly improves the luminous efficiency, color rendering and stability of LED light-emitting semiconductors, making them very suitable for applications with high color rendering and high-quality lighting.

[0040] Preferably, the particle size of the first phosphor is between 23.0 and 26.0 μm, the particle size of the second phosphor is between 22 and 28 μm, and the particle size of the third phosphor is between 18 and 20 μm.

[0041] Specifically, the particle size range of the first phosphor is selected to be 23.0~26.0 µm, which is more suitable for the optical properties of the green phosphor. A larger particle size can effectively reduce light scattering, making the luminous intensity of the green phosphor more concentrated, thereby improving its luminous efficiency. Green light plays an important role in color rendering, so precise control of the particle size can improve the brightness and purity of green light and ensure the consistency of the luminous effect. At the same time, the particle size range of 23.0~26.0 µm can also reduce the mutual occlusion between phosphor particles, maximize the luminous area, and improve the light output efficiency of the LED. A larger particle size can also enhance thermal stability, allowing the green phosphor to maintain good luminous performance at high temperatures.

[0042] The second phosphor particle size is selected in the range of 22.0~28.0 µm, which is a slightly wider particle size range suitable for the luminescent characteristics of red phosphors. The luminous efficiency of red light is greatly affected by the particle size of the phosphor, so controlling it within this range can take into account both luminous efficiency and particle stability. Red light is particularly important for color rendering, so a particle size of 22~28 µm can make the red light more uniform and stable, thereby improving the color rendering index of the LED. In addition, the wider particle size range adapts to the special needs of red light emission, can effectively improve its stability at high temperatures, and reduce temperature quenching, thereby ensuring the stability of the luminous efficiency and color performance of the LED in long-term operation.

[0043] The particle size range of the third phosphor is set at 18.0~20.0 µm, which belongs to the smaller particle size range. The third phosphor is responsible for emitting deep red light. Phosphors in this band are more sensitive to particle size, and smaller particle sizes help to obtain higher luminous efficiency. Smaller particle sizes can increase the luminous surface area of ​​deep red light, enhance luminous efficiency, and make the output of deep red light more concentrated, thereby filling the spectral gap between red and green light and improving the spectral continuity of the light source. In addition, small particle sizes also help to reduce the light scattering effect, making the deep red light emission purer, and helping to improve the overall color rendering and color stability of white light LEDs, especially in warm white light regulation.

[0044] The optimal control of particle size ensures that different phosphors are efficiently excited while their respective luminescence effects are purer and more stable, avoiding light loss and scattering problems caused by too large or too small particle size. This precise particle size control also enhances the temperature stability of the LED, allowing it to maintain efficient luminescence and good color rendering in high-temperature working environments, making it suitable for high-quality LED lighting applications.

[0045] Preferably, the chemical formula of the first phosphor is Y3(Al,Ga)5O 12 :Ce; Specifically, in this embodiment, the chemical formula of the first phosphor is preferably Y3(Al,Ga)5O12 :Ce, the lanthanide element cerium (Ce 3+ ) doped aluminum gallium garnet (YAG) phosphor. Ce 3+ Ce ions are doped into the YAG matrix as activators, and can emit green to yellow light when excited by blue light. 3+ The 4f-5d transition of Ce ions in this matrix exhibits high luminescence efficiency and wide luminescence bandwidth, which is suitable for LED applications. 3+ The doped YAG phosphor has a high quantum efficiency, especially when excited by a blue LED chip, it can efficiently convert blue light into green or yellow-green light, effectively improving the light efficiency of the LED. 12 :Ce has higher luminous efficiency and better optical properties. By replacing part of aluminum (Al) with gallium (Ga), the emission wavelength of YAG phosphor can be adjusted. The addition of Ga will reduce the lattice energy, thereby shifting the emission spectrum to a longer wavelength, and shifting the color of the light emitted from the original yellow-green light to a purer green. The YAG matrix material has high thermal stability and can maintain stable luminous performance under high temperature conditions. Especially in high-power LEDs, the thermal stability of the first phosphor enables it to reduce the temperature quenching effect and maintain high luminous efficiency during long-term operation. This is particularly critical to ensure stable luminescence of LEDs under high temperature or high power conditions. By adjusting the ratio of aluminum (Al) and gallium (Ga), the emission wavelength of the phosphor can be adjusted. The appropriate amount of gallium replacing aluminum can slightly redshift the emission spectrum, so that the green light has a certain yellow component. Such hue adjustment makes the white light generated by the LED warmer and more natural. This feature makes the first phosphor highly adaptable to different LED white light hue requirements. As the chemical composition of the first phosphor, it has high luminous efficiency, excellent thermal stability and flexibility in adjusting the emission spectrum. This material can be efficiently converted into green light under the excitation of a blue light chip and can adapt to high temperature environments. It is suitable for LED lighting applications with high color rendering and high power requirements, greatly improving the overall luminous efficiency and color performance of LED light sources.

[0046] See also Figure 1-2 , are the excitation and emission spectra of the first phosphor. The excitation spectrum shows that the optimal excitation wavelength range of the first phosphor is mainly concentrated between 440 nm and 470 nm. This means that it is suitable for excitation with a blue light LED (this band is common in blue light LEDs). The emission spectrum shows that its emission peak is located near 545 nm, which is in the yellow-green light region. This allows the phosphor to emit yellow-green light under blue light excitation. The relationship between temperature and relative intensity shows that with increasing temperature, the luminous intensity of the first phosphor decreases slightly, but maintains a relatively high stability overall.

[0047] from Figure 2 It can be seen that the relative luminous intensity retention rate of the first phosphor at 100°C and room temperature is 97.4%, showing its excellent thermal stability and suitable for use in higher temperature environments, and suitable for applications such as high color rendering lighting and liquid crystal backlight sources. The thermal quenching performance shows that the phosphor can maintain its luminous performance in a wide temperature range and is suitable for use in lighting equipment that requires high reliability and long-term stability. In one embodiment, the room temperature condition is 25°C.

[0048] Preferably, the chemical formula of the second phosphor is K2SiF6:Mn 4+ .

[0049] Specifically, the second phosphor is based on a potassium fluorosilicate (K2SiF6) matrix doped with tetravalent manganese ions (Mn4+) to form a luminescent material. K2SiF6 is a compound of potassium, silicon and fluorine elements, and is commonly used in optical applications such as phosphors and laser materials. It is an inorganic compound with good chemical stability and high thermal stability, and is suitable for use in high temperature or harsh environments. The structure of K2SiF6 is usually composed of SiF6 2- ions and K+ ions, this structure provides a stable base that can carry different doping ions. Tetravalent manganese ions have special optical properties, which can absorb light of specific wavelengths and emit light of different wavelengths. In this material, Mn4+ is usually responsible for luminescence under ultraviolet or blue light excitation, emitting red or orange spectra.

[0050] The luminous efficiency of the doped material is relatively high, especially when the excitation wavelength is blue light or ultraviolet light, it can produce strong red light, which plays an important role in color adjustment and light efficiency optimization of LED light sources. K2SiF6 is a stable matrix that can provide good chemical stability and ensure performance stability in long-term use, especially in high temperature environments. The luminescent properties of Mn4+ enable this phosphor to play a key role in adjusting the color temperature of the light source and improving color performance, especially in applications that require red or orange spectral output. The choice of the second phosphor is mainly based on its stable chemical properties and excellent luminescent properties, which can provide the necessary color output and efficient light conversion effect for LED light-emitting semiconductors. Preferably, the third phosphor is a nitride; compared with the condition of 25°C, the temperature quenching rate of the third phosphor at 100°C is 93%; the internal quantum efficiency of the nitride is 0.97±0.02, and the external quantum efficiency of the nitride is 0.85±0.02.

[0051] Specifically, nitride phosphors usually refer to luminescent materials with nitrogen as the main component, which have extremely high optical properties and thermal stability. Common nitride phosphors include aluminum nitride (AlN), silicon nitride (Si3N4), gallium nitride (GaN), etc. Nitride materials usually have a wide range of excitation and luminescence wavelengths, which can adjust the color of the light source and are particularly suitable for high-efficiency LED lighting. Compared with other types of phosphors, nitrides can maintain good performance stability under temperature changes, which makes them an ideal choice for high-temperature environments. Temperature quenching refers to the phenomenon that the luminous efficiency of a material decreases at higher temperatures. As the temperature increases, the light conversion efficiency of fluorescent materials tends to decrease because high temperatures may cause energy loss or thermal excitation effects of excited state molecules. A temperature quenching rate of 93% means that when the temperature increases from 25°C to 100°C, the luminous intensity of the nitride phosphor is only 7% of the original. Generally, materials with low low-temperature quenching rates can maintain high luminous efficiency at higher temperatures, which is critical for high-efficiency LED lighting applications. Although the luminous efficiency of the material will drop significantly at high temperatures, it still shows a certain stability, indicating that it is suitable for use in high temperature environments, especially LED chips usually generate heat, so it is very important to have a phosphor with strong temperature adaptability. The internal quantum efficiency refers to the proportion of the material that successfully converts into luminescence after absorbing photons. An ideal luminescent material should have an internal quantum efficiency as close to 100% as possible. In this case, the internal quantum efficiency of nitride is 0.97±0.02, which means that about 97% of the absorbed light energy of the nitride material is converted into luminescent energy. A higher internal quantum efficiency means that the phosphor can effectively convert light energy into luminescence, reduce energy loss, and improve the overall luminous efficiency. The external quantum efficiency refers to the proportion of the number of photons actually radiated from the luminescent material to the total number of photons absorbed. It is an important indicator for measuring the luminous efficiency of a material. The external quantum efficiency of nitride is 0.85±0.02, which means that about 85% of the internal luminescence is effectively released to the outside. A higher external quantum efficiency indicates that the material can effectively release most of the luminescence, reduce the reflection or absorption loss of light, and further improve the total light output efficiency of the LED. The characteristics of this nitride as a third phosphor enable it to exhibit excellent luminescence performance and high energy conversion efficiency in LED lighting applications. Its high internal and external quantum efficiency ensures the brightness and efficiency of LED products, and its relatively high temperature quenching rate also shows that it can maintain good performance under high temperature conditions, making it suitable for use in high-temperature working environments of LED chips. Although temperature changes may affect its luminescence efficiency, due to its high internal and external quantum efficiencies, this nitride is still a very suitable choice, capable of providing good brightness and color performance for LEDs, especially in applications that require efficient and stable light sources.

[0052] Preferably, the high-light-efficiency LED light-emitting semiconductor further includes LED packaging glue.

[0053] LED encapsulant (also called encapsulation material or colloid material) is a key material used to firmly connect LED chips to other components such as phosphors, substrates and housings. Encapsulant plays multiple roles in LED assemblies: The encapsulant is usually transparent or has certain optical properties that can protect the LED chip while ensuring the effective emission of light. The encapsulant has a certain thermal conductivity to help dissipate heat, prevent the LED chip from being damaged by overheating, and extend its service life. It can isolate the LED chip from external circuits or other components to avoid electrical short circuits. The encapsulant can provide additional physical protection to prevent the chip from being affected by external vibration or impact.

[0054] In high-efficiency LED light-emitting semiconductors, encapsulation glue is indispensable. It ensures effective coupling between the chip and the phosphor and can improve the overall luminous efficiency and stability.

[0055] In one embodiment, the LED encapsulation glue is AB glue. AB glue generally refers to a glue composed of two different components: component A and component B. This glue needs to be mixed in a certain proportion when used to achieve its best performance. AB glue is widely used in LED packaging, electronic equipment, automotive industry, building materials and other fields. The curing time of B glue can be adjusted according to demand to adapt to different production and operating conditions. Different curing agent ratios can provide different hardening speeds and strengths, which are suitable for rapid production or high-precision applications. In the manufacturing process of high-efficiency LED light-emitting semiconductors, LED encapsulation glue is not only a key structural material to ensure the effective combination of chips and phosphors, but also can provide necessary thermal management and mechanical protection. As a common packaging material, AB glue ensures the light efficiency, durability and stability of LEDs by virtue of its high adhesion, adjustable curing characteristics, transparency and thermal stability. At the same time, by designing the anti-collision angle, the impact of external impact on LED packaging can be effectively reduced, and the reliability of the overall product can be improved.

[0056] Preferably, the mass percentage of the first phosphor is 17.42%, the mass percentage of the second phosphor is 0.62%, the mass percentage of the third phosphor is 21.42%, and the mass percentage of the LED encapsulation adhesive is 60.54%.

[0057] Specifically, phosphors play a role in light conversion in LEDs, converting the light emitted by LED chips into visible light. Different types of phosphors can adjust the color temperature, brightness, and color performance of LEDs. The mass percentage of each phosphor determines their contribution and influence on the overall light output. The mass percentage of the second phosphor is 0.62%, which is a low ratio, usually indicating that the phosphor is used to adjust a smaller range of colors or brighten a specific spectral region. The role of the second phosphor is to provide red or orange light, so its proportion is low, ensuring that the red or orange components in the light source are not too strong, but enough to improve the quality and color balance of the light. The mass percentage of the third phosphor is 21.42%, which may be responsible for providing red or orange light to the LED. Such a configuration helps improve the color reproduction and color temperature of the LED to meet different application requirements. Nitride phosphors (such as aluminum nitride, gallium nitride, etc.) usually have high efficiency and excellent temperature stability, so their relatively high proportion can provide better light output stability. LED encapsulation adhesive accounts for 60.54%, which is the largest part of the entire LED package. Encapsulation adhesive plays a very important role in LED packaging, especially its high proportion (60.54%) indicates that this material occupies most of the volume in the package, ensuring the stability, efficiency, mechanical and thermal properties of the LED.

[0058] Choosing the right phosphor ratio helps ensure the color performance, brightness, and spectral output of the LED. The mass percentages of these phosphors (such as 17.42%, 0.62%, and 21.42%) indicate that they occupy a reasonable position in the overall package, ensuring light efficiency and color balance. For example, the first phosphor has a higher ratio because it is responsible for a larger range of light conversion, while the second and third phosphors refine color adjustments and improve spectral quality through lower ratios. The encapsulation glue accounts for as high as 60.54% because it not only fixes the chip and distributes light, but also is responsible for heat dissipation and protection. This ratio setting enables the LED to maintain good heat dissipation performance and long-term stability while being highly efficient.

[0059] The distribution of these mass percentages is to optimize the overall performance of the LED, ensuring that it can provide high light efficiency while also ensuring color accuracy, stability and light output efficiency. The larger proportion of encapsulant ensures mechanical protection, thermal management and electrical isolation of the LED, while the proportion of phosphor ensures the color performance and light efficiency of the LED. Overall, this ratio helps to prepare LED light-emitting semiconductors with high light efficiency, good stability and long service life.

[0060] In a specific embodiment, the weight of the first phosphor is 19.0000g, the weight of the second phosphor is 0.6805g, the weight of the third phosphor is 23.3506g, the weight of the LED encapsulation glue is 66.0000g, and the spectroscopic test report of the LED light-emitting semiconductor prepared by the above formula is as follows: Figure 5a As shown, Figure 5b The LED light-emitting semiconductor prepared from common phosphors on the market, as can be seen from the table, the LED light-emitting semiconductor prepared by this patent formula has excellent performance in terms of luminous flux, luminous efficiency and color rendering performance, especially in terms of luminous efficiency improvement and stability control. Therefore, this patent formula has obvious market competitiveness.

[0061] Example 2

[0062] Based on the solution of Example 1, Example 2 of the present invention provides a method for preparing a high-light-efficiency LED light-emitting semiconductor, which is used for the high-light-efficiency LED light-emitting semiconductor in Example 1. The preparation method includes: S1, placing a first phosphor, a second phosphor, and a third phosphor weighed in a first preset ratio in a stirring container and mixing them uniformly to obtain a phosphor mixture; In this step, different types of phosphors (first, second and third phosphors) need to be weighed in a predetermined ratio (i.e., "first preset ratio"). The first phosphor, the second phosphor and the third phosphor may have different optical properties, such as luminous wavelength, light effect, color temperature, etc., so the correct ratio is very important. The selection of this ratio is usually based on experimental data, theoretical calculations or predetermined requirements.

[0063] By placing these phosphors in a mixing container and mixing them evenly, a stable and uniform phosphor mixture is obtained. Even mixing can ensure that the optical properties of the phosphors will not fluctuate greatly due to uneven proportions, thereby avoiding affecting the final light effect and color temperature of the LED.

[0064] S2, adding the phosphor mixture into the LED packaging glue according to the second preset ratio, and continuing to stir to obtain a mixed colloid; The key to this stage is to add the phosphor mixture obtained in the first step into the LED encapsulation glue according to the second preset ratio. The encapsulation glue is a substance used to fix the phosphor on the surface of the LED chip. It usually has a certain viscosity and optical transparency to ensure that the phosphor can be evenly distributed and does not affect the luminous effect of the LED.

[0065] By continuing to stir, the phosphor and encapsulation glue will be mixed into a colloid and evenly distributed. The stirring speed and time need to be moderate, which can ensure that the phosphor is evenly distributed without causing the colloid to stratify or precipitate. At this time, the viscosity of the mixed colloid is also very important, which directly affects the coating uniformity of the subsequent spin coating process.

[0066] S3, in response to the first spectroscopic test result of the mixed colloid satisfying the first preset condition, the mixed colloid is evenly coated on the surface of the LED excitation chip according to preset spin coating parameters to form a fluorescent coating; The main purpose of this stage is to coat the mixed colloid on the surface of the LED excitation chip to form a uniform fluorescent coating. Spin coating is a commonly used coating method, especially suitable for coating thin films. First, through the first spectrophotometric test, the optical properties of the mixed colloid can be evaluated to check whether it meets the preset optical requirements, such as luminous flux, color temperature and spectral peak. If the test results of the mixed colloid meet the requirements, spin coating can be started.

[0067] The spin coating process controls the spin coating speed and time to make the colloid evenly diffuse onto the surface of the LED chip and evenly coat it during the spinning process, ultimately forming the desired fluorescent coating. This coating can not only improve the light efficiency of the LED, but also adjust the light color and color temperature of the LED.

[0068] S4, in response to the second spectroscopic test result of the fluorescent coating satisfying the second preset condition, curing the LED excitation chip with the fluorescent coating according to the preset curing condition to obtain an initial light-emitting semiconductor; The purpose of this step is to fix the fluorescent coating on the surface of the LED chip. The curing process uses a certain temperature and time to firmly bond the chemical bonds between the encapsulation glue and the fluorescent powder to form a stable coating. The cured fluorescent coating has high durability and stability and is not easy to fall off.

[0069] Before curing, a second spectral test is performed to ensure that the optical properties of the fluorescent coating meet the requirements, especially the regulation of the spectral peak position and color temperature. If the second spectral test results meet the preset conditions, the curing process can continue. The curing conditions (such as temperature, time, etc.) need to be adjusted according to the specific encapsulation glue characteristics to ensure the coating quality.

[0070] S5. If the third light splitting test result of the initial light emitting semiconductor does not meet the preset finished product light splitting condition, one or more of the first preset ratio, the second preset ratio, the preset spin coating parameters and the preset curing conditions are adjusted according to the first light splitting test result, the second light splitting test result and the third light splitting test result; In this step, if the final initial light-emitting semiconductor fails to meet the preset optical requirements in the third spectral test, it is necessary to adjust the relevant process parameters based on the comprehensive analysis of the first, second and third spectral test results. These parameters include the ratio of phosphors (first preset ratio and second preset ratio), spin coating process parameters (such as rotation speed, time, etc.) and curing conditions (temperature, time, etc.). The goal of these adjustments is to improve the optical performance of the final product by optimizing the process, especially key parameters such as luminous flux, color temperature and spectral peak.

[0071] S6. If the third spectroscopic test result of the initial light emitting semiconductor meets the preset finished product spectroscopic condition, the initial light emitting semiconductor is used as the target light emitting semiconductor.

[0072] When the third spectrophotometric test result meets the preset finished product optical conditions, it means that the optical properties of the LED light-emitting semiconductor have reached the expected target. At this point, the initial light-emitting semiconductor can be taken as the final target light-emitting semiconductor and enter the next production link, ready for packaging and shipment. This step marks the completion of the entire preparation process, and the final product has high light efficiency, stable optical performance and color temperature control.

[0073] Through this step-by-step testing and adjustment approach, each link in the preparation process can be optimized and improved to ensure that the performance of the final finished LED light-emitting semiconductor meets the expected standards. Each step not only relies on the results of the previous process adjustment, but also requires detailed analysis and feedback of the test data to achieve precise control of various key performance indicators. This step-by-step feedback and adjustment process has greatly improved the quality and consistency of the final product.

[0074] Preferably, the phosphor mixture is added to the LED packaging glue according to the second preset ratio, and the mixture is stirred to obtain a mixed colloid, including: S21, preliminarily stirring the phosphor mixture and the LED packaging adhesive at a first preset stirring speed according to a second preset ratio and continuing for a first preset time; In this step, the uniformly mixed phosphor mixture and LED encapsulation glue are first mixed according to the second preset ratio. The second preset ratio is usually optimized in the experiment, which ensures the best ratio of phosphor and encapsulation glue to obtain the required optical properties. Then, the first preset stirring speed is used for preliminary stirring. The first preset speed is relatively low to avoid excessive stirring of the colloid, which may cause colloid precipitation or foaming.

[0075] The duration of the initial stirring is set to the first preset time, which is usually obtained in the early stage of testing, to ensure that the phosphor and the encapsulation adhesive can be initially mixed evenly, but not completely mixed to the ideal state. The purpose is to provide a basis for subsequent fine mixing through initial stirring.

[0076] S22, continuously stirring at a second preset stirring speed and maintaining the stirring for a second preset time to obtain an initial mixed colloid, wherein the second preset speed is greater than the first preset speed; Based on the first step, a higher intensity stirring is then performed, using the second preset stirring speed. The second preset stirring speed is higher than the first preset speed, and the purpose is to enhance the uniformity of the mixing. The stirring intensity at this time helps to thoroughly mix the phosphor and the encapsulation glue, avoiding differences in coating thickness caused by uneven stirring.

[0077] The second preset stirring time is also set based on previous process experience. The length of time affects the uniformity of the mixed colloid. High-intensity stirring for a long time can ensure that the phosphor is evenly dispersed in the encapsulation glue to obtain a uniform initial mixed colloid.

[0078] S23, extracting samples from different positions of the initial mixed colloid to obtain a first preset number of mixed colloid samples; To ensure the homogeneity of the mixed colloid, samples need to be drawn at multiple locations. These samples should cover different areas that may exist in the initial mixed colloid. Since stirring may cause the mixed colloid to have different uniformity at different locations in the container, the diversity of samples drawn helps to fully evaluate the quality of the colloid.

[0079] According to experience and actual needs, the first preset number of mixed colloid samples is generally 3-5 samples to ensure that the data is representative and does not cause excessive testing.

[0080] S24, performing a spectroscopic test on each of the mixed colloid samples to obtain a corresponding first spectroscopic test result, wherein the first spectroscopic test result includes: luminous flux, color coordinate value, and color temperature; Spectrophotometry is a key step in evaluating the optical performance of the mixed colloid at this stage. Each mixed colloid sample needs to be tested for luminous flux, color coordinates, and color temperature. These optical parameters can reflect whether the mixture of phosphor and encapsulation glue meets the expected optical effect.

[0081] The luminous flux test measures the total amount of light emitted by the LED, which directly affects the lighting effect; the color coordinate value and color temperature test reflect the color characteristics of the light, which is crucial to meeting specific optical requirements.

[0082] S25. According to each of the first spectrophotometric test results, obtain the differences in color coordinate values, luminous flux and color temperature values ​​between the two mixed colloid samples to obtain a difference value set, wherein the difference value set includes a color coordinate difference value set, a luminous flux difference value set and a color temperature difference value set; In this stage, according to the first spectrophotometric test results, the pairwise differences between the mixed colloid samples are calculated, including the differences in color coordinate values, luminous flux and color temperature values, to form a color coordinate difference set, a luminous flux difference set and a color temperature difference set, respectively, to determine the uniformity of the mixed colloid. The size of the pairwise difference reflects the consistency of the sample in the test index. The smaller the difference, the better the mixing uniformity.

[0083] S26. If the difference value set satisfies a first preset mixing condition, then according to each of the first spectrophotometric test results, standard deviations of the color coordinate value, the luminous flux, and the color temperature value are respectively obtained, wherein the first preset mixing condition includes that each color coordinate difference value in the color coordinate difference value set is less than or equal to a preset color coordinate threshold value, each color luminous flux difference value in the luminous flux difference value is less than or equal to a preset luminous flux threshold value, and each color temperature difference value in the color temperature difference value set is less than or equal to a preset color temperature threshold value; The purpose of this step is to preliminarily screen the uniformity of the mixed colloid. If the difference between the two values ​​is less than the threshold, it means that the overall consistency of the colloid mixture is good, and the standard deviation can be used to further analyze the details.

[0084] Specifically, the first preset mixing condition includes: Each color coordinate difference value in the color coordinate difference value set is ≤ a preset color coordinate threshold value; Each luminous flux difference value in the luminous flux difference value set is ≤ a preset luminous flux threshold value; Each color temperature difference value in the color temperature difference value set is ≤ a preset color temperature threshold.

[0085] The setting of preset color coordinate threshold, luminous flux threshold and color temperature threshold needs to be based on actual production needs, product performance goals and statistical analysis of test data. The initial threshold can be set more strictly to ensure high uniformity of the mixed colloid. As production stabilizes, the threshold can be gradually optimized to improve production efficiency.

[0086] When the difference between all samples is less than or equal to the corresponding preset threshold, it means that the uniformity of the mixed colloid is good. At this time, it is necessary to further calculate the standard deviation of the color coordinate value, luminous flux and color temperature. If the standard deviation is small, it means that the optical performance consistency of the mixed colloid is good, and the subsequent steps can be continued.

[0087] The calculation of standard deviation is an important method to measure the volatility of test results. If the standard deviations of color coordinate values, luminous flux, and color temperature are all less than the preset thresholds, it indicates that the optical performance of the mixed colloid is stable and in line with expectations.

[0088] S27, if the difference value set does not satisfy the first preset mixing condition, or the standard deviation of the color coordinate value, the luminous flux or the color temperature value does not satisfy the second preset mixing condition, adjust the second preset speed and / or the second preset time, and return to the step of continuously stirring according to the second preset stirring speed and maintaining the stirring for the second preset time to obtain an initial mixed colloid, wherein the second preset mixing condition includes that the standard deviation of the color coordinate is less than or equal to the preset color coordinate standard deviation, the standard deviation of the color temperature value is less than or equal to the preset color temperature standard deviation, and the standard deviation of the luminous flux is less than or equal to the preset luminous flux standard deviation; Specifically, the standard deviation reflects the degree of dispersion of each indicator in the mixed sample. If the difference between some samples is too large (that is, the standard deviation exceeds the threshold), it also indicates that the mixture is uneven.

[0089] The logical "or" here is to comprehensively consider the absolute value and discreteness of the indicator. As long as one of the aspects is abnormal, the adjustment will be triggered to ensure the quality of the mixture. The pairwise difference less than the threshold is based on a single comparison judgment, focusing on the difference between each two data points. If the overall deviation range of the data points is large but the distribution is relatively uniform, all pairwise differences may be less than the threshold. The standard deviation is calculated based on the deviation of all data points from the mean, and it focuses on the overall distribution. Even if the pairwise difference is small, the standard deviation may still be large if the distribution of data points deviates far from the mean.

[0090] If the difference set does not satisfy the first preset mixing condition (i.e., some difference values ​​are greater than the corresponding threshold value), it indicates that there is an obvious problem with the mixing. Alternatively, even if the difference set satisfies the first preset mixing condition, but the calculated standard deviation does not satisfy the second preset mixing condition, it indicates that there is an implicit problem with the mixing. The second preset mixing condition includes that the standard deviation of the color coordinates is less than or equal to the preset color coordinate standard deviation, the standard deviation of the color temperature value is less than or equal to the preset color temperature standard deviation, and the standard deviation of the luminous flux is less than or equal to the preset luminous flux standard. In the above two cases, it is necessary to adjust the second preset speed and / or the second preset time, and re-stir the mixed colloid; By way of example and not limitation, if the initial stirring time is long enough, but the test results show uneven mixing (such as large differences in luminous flux, which may be related to insufficient local dispersion), the mixing efficiency can be improved by increasing the stirring speed. If the test results show that the overall uniformity is acceptable, but the standard deviation still exceeds the threshold, it means that the mixing requires more time, and the speed is close to the equipment limit or is not suitable for further increase. If the test results show serious unevenness (such as obvious deviations in both color coordinates and luminous flux), it may be necessary to adjust the speed and time in combination to significantly improve the mixing effect. After adjusting the stirring conditions, it is necessary to return for a second stirring and ensure that the new stirring conditions can better meet the requirements.

[0091] S28. If the standard deviations of the color coordinate values, the luminous flux, and the color temperature values ​​satisfy the second preset mixing condition, a mixed colloid satisfying the first preset condition is obtained by initially mixing the colloid.

[0092] When all test results meet the standard deviation requirements, that is, the fluctuations of the color coordinate values, luminous flux and color temperature are all within the control range, it can be confirmed that the initial mixed colloid has met the first preset condition. At this point, the mixed colloid can continue to be used in subsequent spin coating and curing steps to prepare high-efficiency LED light-emitting semiconductors.

[0093] Preferably, in response to the first spectroscopic test result of the mixed colloid satisfying the first preset condition, the mixed colloid is uniformly coated on the surface of the LED excitation chip according to preset spin coating parameters to form a fluorescent coating, including: S31, obtaining the viscosity of the mixed colloid and the target thickness of the fluorescent coating; At this stage, the viscosity of the mixed colloid needs to be measured. The viscosity of the mixed colloid is crucial to the spin coating process, because colloids with higher viscosity are difficult to coat evenly, while colloids with lower viscosity may result in too thin a coating and poor optical effect. By testing the viscosity, the fluidity and coating effect of the mixed colloid during spin coating can be predicted.

[0094] In addition, the target phosphor coating thickness is also a key parameter that needs to be determined in this step. The target thickness is usually set based on the application requirements of the LED, the luminous efficiency of the phosphor, and the optical performance requirements. The appropriate phosphor coating thickness not only affects the luminous flux, but also affects parameters such as spectrum and color temperature, so it needs to be precisely controlled.

[0095] S32, acquiring corresponding preset spin coating parameters according to the viscosity and the target thickness, wherein the preset spin coating parameters include a spin coating speed control curve, the spin coating speed control curve includes a plurality of stages, and different stages have different durations and / or spin coating speeds; Choose the appropriate spin coating parameters based on the viscosity and target thickness. Spin coating speed is a key factor affecting coating uniformity and thickness. A higher speed can quickly and evenly distribute the colloid, but may result in a thinner coating. A lower speed helps to make the coating uniform and not too thin. By adjusting the speed curve, different speed and time settings can be achieved at different stages of the spin coating process, thereby accurately controlling the thickness and uniformity of the fluorescent coating.

[0096] The speed control curve in the preset spin coating parameters usually contains multiple stages. For example, the first stage may be a lower speed to evenly distribute the colloid on the chip surface, and the second stage may be a higher speed to further homogenize the coating and speed up the coating. The speed control and duration settings of these different stages are optimized based on experience and experimental results.

[0097] S33, dropping a preset amount of mixed colloid to the center of the LED excitation chip; At this stage, a preset amount of mixed colloid is precisely dripped into the center of the LED excitation chip. The amount of dripping is usually optimized to ensure that the amount of colloid is moderate and does not cause overflow or uneven coverage. The accuracy of this dripping process is critical to the uniformity of the subsequent coating. If the colloid is not dripped evenly, it may lead to inconsistent coating thickness and affect the optical performance.

[0098] S34, according to the spin coating speed control curve, controlling the LED excitation chip to rotate so that the mixed colloid diffuses on the surface of the LED excitation chip to form an initial fluorescent coating; After the colloid is added, the spin coating process is started and the speed is adjusted according to the preset spin coating speed control curve. During the rotation process, the colloid will diffuse outward under the action of centrifugal force and spread evenly on the surface of the LED chip. The key to this process is to control the change of speed and time to ensure that the coating is both uniform and reaches the predetermined thickness. The rotation rate and time are adjusted according to the target thickness and the viscosity of the colloid to ensure that the coating quality meets the expectations.

[0099] S35, performing spectroscopic detection on different positions on the initial fluorescent coating to obtain a second preset number of second spectroscopic test results; After spin coating, the initially formed fluorescent coating needs to be spectroscopically tested. The test is performed at different locations on the coating to ensure its uniformity. The number of tests is usually a second preset number, sufficient to cover different areas of the coating and obtain representative optical data. These data include parameters such as luminous flux, color temperature and color coordinates, which are used to evaluate the optical properties of the coating.

[0100] S36, judging whether the fluorescent coating is uniform according to the difference between the second spectroscopic test results; At this stage, the uniformity of the fluorescent coating can be judged by comparing the spectrophotometric test results. If the test results at different locations are very different, it means that the coating may be uneven; conversely, if the test results at each location are close, the coating uniformity is good. The difference can be judged based on the difference in parameters such as luminous flux, color temperature, color coordinates, or by calculating their standard deviation or difference.

[0101] S37, if it is not uniform, adjusting the duration of the specified stage of the spin coating speed control curve and / or the spin coating speed according to the degree of difference; If an uneven coating of phosphor is detected, it is necessary to go back and adjust the parameters of the spin coating process. Depending on the location and degree of the uneven coating, adjustments can be made to certain stages of the spin coating process. For example, a thick coating in some areas may be due to an initial rotation speed that was too high during the spin coating process, while a thin coating in some areas may be due to a rotation speed that was too low. Therefore, the duration or rotation speed of a specific stage in the spin coating speed control curve can be fine-tuned to improve the uniformity of the coating.

[0102] S38: If uniform, a fluorescent coating satisfying a second preset condition is obtained through the initial fluorescent coating.

[0103] When the fluorescent coating meets the uniformity requirements and meets the preset optical property standards (such as luminous flux, color temperature, color coordinates and other parameters), it means that the coating has met the second preset condition. At this point, the coating can be considered qualified, the preparation process of the fluorescent coating is completed, and the subsequent steps can continue (such as the curing stage, etc.).

[0104] Preferably, the spin coating speed control curve includes an initial stage, a main spin coating stage and an accelerated spin coating stage in sequence, and obtaining preset spin coating parameters according to the viscosity and the target thickness includes: S321, measuring the mixed colloid to obtain colloid parameters, wherein the colloid parameters include density and particle concentration of the mixed colloid; First, it is necessary to measure some basic parameters of the mixed colloid so that effective adjustments can be made in the subsequent spin coating process control. The density of the mixed colloid refers to the mass of the colloid per unit volume, and the particle concentration refers to the content of phosphor particles in the mixed colloid. These parameters directly affect the fluidity of the colloid and the diffusion speed during spin coating, thereby determining the thickness and uniformity of the final coating.

[0105] A denser colloid will be more difficult to spread and may result in a thicker coating, whereas a less dense colloid will be easier to spread and may result in a thinner coating.

[0106] A high particle concentration means that the content of phosphor in the colloid is high, the viscosity may be large, and the fluidity of the colloid is poor. A low particle concentration means that the viscosity is small, the fluidity is good, and it is easy to form a more uniform coating.

[0107] S322, according to the viscosity of the mixed colloid, the preset drop amount and the surface area of ​​the LED excitation chip, obtaining a first rotation speed and a first duration in the initial stage, wherein the first rotation speed is positively correlated with the viscosity of the coating colloid and negatively correlated with the surface area; the first duration is positively correlated with the surface area and positively correlated with the preset drop amount; In the initial stage, the goal is to evenly coat the colloid onto the surface of the LED excitation chip. In this stage, the settings of the rotation speed and duration are crucial.

[0108] First, the speed is positively correlated with the viscosity of the colloid. This is because a colloid with a higher viscosity requires a higher speed to ensure that the colloid spreads evenly. If the viscosity is lower, the speed can be appropriately reduced. The speed is negatively correlated with the surface area, that is, the larger the chip surface area, the lower the required speed. A larger surface area requires longer time and a lower speed to ensure that the colloid spreads evenly.

[0109] The duration of the first stage is positively correlated with the surface area of ​​the LED excitation chip. The larger the surface area, the longer the coating time. At the same time, the first duration is positively correlated with the preset drop amount. The larger the drop amount, the longer the coating time required. By adjusting the duration, ensure uniform coating.

[0110] S323, according to the viscosity, density and particle concentration of the mixed colloid, obtaining a second rotation speed and a second duration of the main spin coating stage, wherein the second rotation speed is positively correlated with the viscosity and density, and negatively correlated with the particle concentration; the second duration is positively correlated with the target thickness, and negatively correlated with the density; During the main spin coating stage, the goal is to further optimize the uniformity and thickness of the coating by spin coating.

[0111] The second speed is positively correlated with the viscosity and density of the colloid, because colloids with higher viscosity and density require higher speeds to be evenly distributed on the surface in a shorter time. It is negatively correlated with particle concentration, because colloids with high particle concentrations increase the resistance of the coating, and higher particle concentrations require lower speeds to avoid uneven or too thick coatings.

[0112] The second duration is positively correlated with the target thickness, as thicker coatings require longer times to allow the colloid to fully diffuse and cure. It is negatively correlated with density, as denser colloids require longer times to expand to the desired thickness.

[0113] S324. Obtain a third rotation speed and a third duration of the accelerated spin coating stage according to the viscosity, density and particle concentration of the mixed colloid, wherein the third rotation speed is positively correlated with the viscosity and density, and negatively correlated with the particle concentration; and the third duration is positively correlated with the target thickness, and negatively correlated with the density.

[0114] The purpose of the accelerated spin coating stage is to speed up the coating process to minimize the solvent evaporation time while maintaining coating uniformity and target thickness.

[0115] The third speed is positively correlated with the viscosity and density of the mixed colloid, because higher viscosity and density will make the colloid denser, and a higher speed is required to accelerate the formation of the coating. It is negatively correlated with the particle concentration, because when the particle concentration is high, the colloid is more viscous and a lower speed is required to avoid uneven distribution of the coating.

[0116] The third duration is positively correlated with the target thickness, as thicker coatings require more time to complete the accelerated spin coating process to ensure uniformity. It is negatively correlated with density, as denser colloidal coatings form faster and can therefore be completed in a shorter time.

[0117] Preferably, in response to the second spectroscopic test result of the fluorescent coating satisfying the second preset condition, the LED excitation chip with the fluorescent coating is cured according to the preset curing condition to obtain an initial light-emitting semiconductor, including: S41, obtaining preset curing conditions corresponding to the type of the LED packaging glue, wherein the preset curing conditions include curing temperature and curing time; During the curing process, curing conditions are crucial because different types of LED encapsulants have different chemical compositions and physical properties, and the requirements for curing temperature and time will also be different. The purpose of this step is to select the initial curing conditions that match the type of encapsulant used. The preset curing conditions usually include two main contents: Curing temperature is the temperature at which heat is applied to the colloid and the fluorescent coating. Too high a temperature may cause the colloid to be too fluid, resulting in an uneven coating; too low a temperature may not completely cure the colloid, affecting its performance.

[0118] The curing time refers to the time the colloid needs to be kept at a set temperature. A longer curing time helps the colloid to fully cure, but too long a time may cause excessive heat treatment, which will affect the luminous performance. This time is usually preset according to the characteristics of the material.

[0119] S42, adjusting the preset curing conditions according to the colloid parameters of the mixed colloid to obtain target curing conditions The adjustment of curing conditions is based on the actual situation of the mixed colloid. The physical parameters of the colloid (such as density, viscosity, particle concentration, etc.) will affect its behavior during the curing process, so the curing conditions need to be fine-tuned.

[0120] Adjustment of curing temperature: Depending on the viscosity and density of the colloid, the curing temperature may need to be slightly increased or decreased. For example, a higher viscosity colloid may require a higher curing temperature to ensure curing efficiency, while a low viscosity colloid may fully cure at a lower temperature.

[0121] Adjustment of curing time: If the particle concentration of the colloid is high, it may be necessary to extend the curing time to ensure that all the material is completely cured; conversely, a lower particle concentration may complete curing in a shorter time.

[0122] S43, curing the LED excitation chip with the fluorescent coating according to the target curing conditions to obtain an initial light-emitting semiconductor; This step is to apply the adjusted target curing conditions to the LED excitation chip. The LED excitation chip is placed in the curing equipment and treated according to the target curing conditions (including temperature and time) in order to thoroughly cure the fluorescent coating and ensure the stability of the coating and colloid as well as its optical properties.

[0123] During this process, the temperature and time of the curing equipment need to be strictly controlled to ensure that the uniformity and performance of the coating meet the expected requirements.

[0124] S44, performing a spectroscopic test on the initial light-emitting semiconductor to obtain a third spectroscopic test result, wherein the third spectroscopic test result includes a luminous flux, a color coordinate value, and a color temperature; After the curing process is completed, the fluorescent coating of the LED excitation chip needs to undergo a final spectroscopic test to ensure that its luminous performance meets expectations. The third spectroscopic test mainly measures the following key parameters: Luminous flux: The light output capacity of an LED light-emitting semiconductor, that is, the total amount of light emitted per unit time. Low luminous flux may mean that the efficiency of the fluorescent coating or chip is low.

[0125] Color coordinate value: The color coordinate value reflects the color of the LED light-emitting semiconductor. This is usually expressed as a coordinate on a chromaticity diagram. The color coordinate value determines whether the color of the light meets the predetermined requirements.

[0126] Color temperature: Color temperature is a parameter that describes the color tone of a light source. A lower color temperature generally indicates a warmer light, while a higher color temperature indicates a cooler light. The deviation in color temperature will affect the application effect of the final light source.

[0127] S45, performing a weighted calculation on the luminous flux, the color coordinate value and the color temperature of the difference between each parameter in the third spectral test result and the corresponding target spectral parameter threshold, to obtain the spectral deviation degree of the initial light-emitting semiconductor, wherein the target spectral parameter threshold includes a luminous flux threshold, a color coordinate threshold and a color temperature threshold; the weight value of the luminous flux is greater than or equal to the weight value of the color coordinate value, and the weight value of the color coordinate value is greater than the weight value of the color temperature; This step will perform a weighted calculation of the differences in luminous flux, color coordinate values, and color temperature. The difference in each parameter will be weighted according to its impact on product quality, thereby obtaining the final degree of spectroscopic deviation.

[0128] Among them, the luminous flux has the largest weight, because the luminous flux directly determines the brightness of the LED and is the most direct factor affecting the use effect. A large deviation in the luminous flux may mean that the LED cannot achieve the expected brightness.

[0129] The color coordinate value is second, and the color coordinate value determines the color of the light source. A large deviation may affect the accuracy of the color, and thus affect the user experience, especially in application scenarios with high color requirements. Color temperature has the smallest weight. Although color temperature is also an important factor affecting color, in many applications, the deviation of color temperature usually has less impact on the final use than luminous flux and color coordinates.

[0130] S46: If the degree of the light splitting deviation is less than or equal to a preset deviation threshold, the third light splitting test result meets the preset finished product light splitting condition; If the calculated spectral deviation is less than or equal to the preset deviation threshold, it means that the optical performance of the initial light-emitting semiconductor has reached the expected requirements and meets the optical conditions of the finished product. If the conditions are met, it means that the initial light-emitting semiconductor can be put into use as a final product.

[0131] S47: Otherwise, the third spectrophotometric test result does not meet the preset finished product spectrophotometric condition.

[0132] If the degree of spectroscopic deviation exceeds the preset deviation threshold, it means that the performance of the initial light-emitting semiconductor is not up to standard and further adjustment and optimization may be required. At this time, you can return to the previous steps to adjust the parameters, such as adjusting the curing conditions, fluorescent coating or other process steps.

[0133] Preferably, if the third light splitting test result of the initial light emitting semiconductor does not meet the preset finished product light splitting condition, one or more of the first preset ratio, the second preset ratio, the preset spin coating parameters and the preset curing conditions are adjusted according to the first light splitting test result, the second light splitting test result and the third light splitting test result, including: S51, respectively obtaining the deviation degree between the first spectroscopic test result, the second spectroscopic test result, and the third spectroscopic test result and the target spectroscopic parameter threshold, recorded as a first deviation degree, a second deviation degree, and a third deviation degree; In this step, the difference between the test results of each stage (mixing stage, spin coating stage and curing stage) and the preset target spectroscopic parameter thresholds needs to be compared first. The test results of each stage (such as luminous flux, color coordinate value and color temperature) will calculate the degree of deviation based on the difference between the target parameters and the actual results. These deviations will be recorded as: First deviation degree: The difference between the first spectroscopic test result and the target spectroscopic parameter threshold, reflecting the performance of the mixing stage.

[0134] Second deviation degree: The difference between the second spectroscopic test result and the target spectroscopic parameter threshold, reflecting the performance of the spin coating stage.

[0135] Third degree of deviation: The difference between the third spectral test result and the target spectral parameter threshold, reflecting the performance of the curing stage.

[0136] Calculation of these deviations helps identify optical performance issues at each stage and provides data support for subsequent adjustments.

[0137] S52, obtaining the allowable deviation thresholds of the first spectrophotometric test result, the second spectrophotometric test result, and the third spectrophotometric test result according to the preset deviation threshold, wherein the allowable deviation thresholds of the first spectrophotometric test result, the second spectrophotometric test result, and the third spectrophotometric test result are increased in sequence; In order to handle the deviations at different stages, you can set a gradually increasing deviation threshold. The allowed deviation threshold at each stage increases in sequence, which means: Mixing stage: Larger deviations are allowed because the test at this time is mainly to preliminarily evaluate the phosphor ratio and uniformity of colloid mixing.

[0138] Spin coating stage: Smaller deviations are permitted, as the uniformity and optical properties of the coating are more important here.

[0139] Curing stage: The minimum deviation allowed is because the curing process determines the performance of the final light-emitting semiconductor and the error must be minimized.

[0140] By setting gradually tighter deviation thresholds, possible problems at each stage can be effectively screened out.

[0141] S53, determining a main deviation stage according to the first deviation degree, the second deviation degree, the third deviation degree and the corresponding allowable deviation threshold, wherein the main deviation stage includes one of a mixing stage, a spin coating stage and a curing stage; In this step, the degree of deviation in each stage is compared with the allowable deviation threshold. If the deviation of a stage exceeds the allowable deviation threshold of that stage, then that stage is considered to be the main deviation stage. This helps to determine which process the problem occurs in and provides direction for subsequent adjustments: If the first deviation exceeds the standard, it means that the problem may be in the mixing stage, and the main deviation stage is the mixing stage. If the second deviation exceeds the standard, it means that the problem may be in the spin coating stage, and the main deviation stage is the spin coating stage. If the third deviation exceeds the standard, it means that the problem may be in the curing stage, and the main deviation stage is the curing stage.

[0142] S55, determining the parameters to be adjusted according to the main deviation stage, wherein the parameters to be adjusted in the mixing stage include a first preset ratio and a second preset ratio, the parameters to be adjusted in the spin coating stage include preset spin coating parameters, and the parameters to be adjusted in the curing stage include preset curing conditions; Once the main deviation stage is identified, the next step is to find out the parameters that need to be adjusted during that stage: If the problem occurs at the mixing stage, the parameters to be adjusted are usually the first preset ratio (the ratio of phosphors) and the second preset ratio (the ratio of phosphors to encapsulation glue), which directly affect the optical properties of the mixed colloid.

[0143] If the problem occurs during the spin coating stage, the spin coating parameters need to be adjusted, such as spin coating speed, coating time, etc. These parameters will directly affect the uniformity and thickness of the coating.

[0144] If the problem occurs during the curing stage, it may be necessary to adjust the curing conditions, including the curing temperature and curing time. These parameters have a decisive influence on the optical properties of the final product.

[0145] S56, determining an adjustment amount of the parameter to be adjusted according to the first light splitting test result, the second light splitting test result, the third light splitting test result and the target light splitting parameter threshold; In this step, the difference between each test parameter and the target parameter can be calculated based on the previous spectrophotometric test results. Based on these differences, the specific amount of adjustment required for each parameter can be further calculated: If the light flux deviation is large, it is necessary to adjust the first preset ratio (affecting the light flux) or the second preset ratio (affecting the optical properties of the colloid).

[0146] Differences in color coordinates may mean that the phosphor ratio or the parameters of the spin coating process need to be adjusted.

[0147] Changes in color temperature may indicate that the temperature or time of the curing phase is not set correctly and needs to be adjusted.

[0148] By calculating the exact adjustments for each parameter, the settings for each process stage can be precisely optimized.

[0149] S57: Adjust the parameter to be adjusted according to the adjustment amount.

[0150] The last step is to adjust the corresponding parameters according to the determined adjustment amount. After each adjustment, the spectroscopic test should be repeated to ensure that the deviation is gradually reduced and finally reaches the preset spectroscopic parameter requirements. Through the above steps, the relevant parameters can be adjusted according to the spectroscopic test results and deviation thresholds at each stage (mixing, spin coating, curing). This gradual adjustment and feedback mechanism can ensure that the optical performance of the final product is stable within the target range, while improving the controllability and consistency of the process through precise parameter adjustment.

[0151] It should be clear that the present invention is not limited to the specific configuration and processing described above and shown in the figures. For the sake of simplicity, a detailed description of the known method is omitted here. In the above embodiments, several specific steps are described and shown as examples. However, the method process of the present invention is not limited to the specific steps described and shown, and those skilled in the art can make various changes, modifications and additions, or change the order between the steps after understanding the spirit of the present invention.

[0152] It should also be noted that the exemplary embodiments mentioned in the present invention describe some methods or systems based on a series of steps or devices. However, the present invention is not limited to the order of the above steps, that is, the steps can be performed in the order mentioned in the embodiments, or in a different order from the embodiments, or several steps can be performed simultaneously.

[0153] The above is only a specific implementation of the present invention. Those skilled in the art can clearly understand that for the convenience and simplicity of description, the specific working process of the system, module and unit described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here. It should be understood that the protection scope of the present invention is not limited to this. Any technician familiar with the technical field can easily think of various equivalent modifications or replacements within the technical scope disclosed by the present invention, and these modifications or replacements should be covered within the protection scope of the present invention.

Claims

1. A high-efficiency LED light-emitting semiconductor, characterized in that: include: LED excitation chip; Phosphor; The phosphor includes a first phosphor, a second phosphor and a third phosphor, wherein the peak wavelength of the first phosphor is within a first wavelength range, the peak wavelength of the second phosphor is within a second wavelength range, and the peak wavelength of the third phosphor is within a third wavelength range; the first wavelength range is 545-556 nm, the second wavelength range is 630-634 nm, and the third wavelength range is 615-617 nm; The main wavelength of the LED excitation chip is in a fourth wavelength range, and the fourth wavelength range is 440-470 nm.

2. The high light-efficiency LED light-emitting semiconductor according to claim 1, characterized in that: The particle size of the first phosphor is between 23.0 and 26.0 μm, the particle size of the second phosphor is between 22.0 and 28.0 μm, and the particle size of the third phosphor is between 18.0 and 20.0 μm.

3. The high light-efficiency LED light-emitting semiconductor according to claim 2, characterized in that: The chemical formula of the first phosphor is Y3(Al,Ga)5O 12 :Ce, the chemical formula of the second phosphor is K2SiF6:Mn 4+ , the third phosphor is a nitride; compared with room temperature, the temperature quenching rate of the third phosphor at 100° C. is 93%; the internal quantum efficiency of the third phosphor is 0.97±0.02, and the external quantum efficiency of the third phosphor is 0.85±0.

02.

4. The high light-efficiency LED light-emitting semiconductor according to any one of claims 1 to 3, characterized in that: It also includes LED packaging glue, the mass percentage of the first phosphor is 17.42%, the mass percentage of the second phosphor is 0.62%, the mass percentage of the third phosphor is 21.42%, and the mass percentage of the LED packaging glue is 60.54%.

5. A method for preparing a high-light-efficiency LED light-emitting semiconductor, characterized in that: For the high-efficiency LED light-emitting semiconductor according to any one of claims 1 to 4, the preparation method comprises: The first phosphor, the second phosphor and the third phosphor weighed in a first preset ratio are placed in a stirring container and mixed evenly to obtain a phosphor mixture; According to a second preset ratio, the phosphor mixture is added to the LED packaging glue, and stirring is continued to obtain a mixed colloid; In response to the first spectroscopic test result of the mixed colloid satisfying the first preset condition, the mixed colloid is uniformly coated on the surface of the LED excitation chip according to preset spin coating parameters to form a fluorescent coating; In response to the second spectroscopic test result of the fluorescent coating satisfying the second preset condition, curing the LED excitation chip with the fluorescent coating according to the preset curing condition to obtain an initial light-emitting semiconductor; If the third light splitting test result of the initial light emitting semiconductor does not meet the preset finished product light splitting condition, one or more of the first preset ratio, the second preset ratio, the preset spin coating parameters and the preset curing conditions are adjusted according to the first light splitting test result, the second light splitting test result and the third light splitting test result; If the third light-splitting test result of the initial light-emitting semiconductor meets the preset finished product light-splitting condition, the initial light-emitting semiconductor is used as the target light-emitting semiconductor.

6. The method for preparing a high-light-efficiency LED light-emitting semiconductor according to claim 5, characterized in that: The method of adding the phosphor mixture to the LED packaging glue according to the second preset ratio and continuing to stir to obtain a mixed colloid comprises: According to a second preset ratio, the phosphor mixture and the LED encapsulation adhesive are initially stirred at a first preset stirring speed for a first preset time; Continuously stirring at a second preset stirring speed and maintaining for a second preset time to obtain an initial mixed colloid, wherein the second preset speed is greater than the first preset speed; Extracting samples from different positions of the initial mixed colloid to obtain a first preset number of mixed colloid samples; Performing a spectrophotometric test on each of the mixed colloid samples to obtain a corresponding first spectrophotometric test result, wherein the first spectrophotometric test result includes: luminous flux, color coordinate value, and color temperature; According to each of the first spectrophotometric test results, the differences in the color coordinate values, the luminous flux and the color temperature values ​​between the two mixed colloid samples are obtained to obtain a difference value set, wherein the difference value set includes a color coordinate difference value set, a luminous flux difference value set and a color temperature difference value set; If the difference value set satisfies a first preset mixing condition, then according to each of the first spectrophotometric test results, the standard deviations of the color coordinate value, the luminous flux and the color temperature value are respectively obtained, wherein the first preset mixing condition includes that each color coordinate difference value in the color coordinate difference value set is less than or equal to a preset color coordinate threshold value, each color luminous flux difference value in the luminous flux difference value is less than or equal to a preset luminous flux threshold value, and each color temperature difference value in the color temperature difference value set is less than or equal to a preset color temperature threshold value; If the difference value sets do not satisfy the first preset mixing condition, or the standard deviation of the color coordinate value, the luminous flux, or the color temperature value does not satisfy the second preset mixing condition, the second preset speed and / or the second preset time are adjusted, and the process returns to the step of continuously stirring at the second preset stirring speed and maintaining the stirring for the second preset time to obtain an initial mixed colloid, wherein the second preset mixing condition includes that the standard deviation of the color coordinates is less than or equal to the preset color coordinate standard deviation, the standard deviation of the color temperature value is less than or equal to the preset color temperature standard deviation, and the standard deviation of the luminous flux is less than or equal to the preset luminous flux standard deviation; If the standard deviations of the color coordinate values, the luminous flux, and the color temperature values ​​satisfy the second preset mixing condition, a mixed colloid satisfying the first preset condition is obtained through the initial mixed colloid.

7. The method for preparing a high-light-efficiency LED light-emitting semiconductor according to claim 5, characterized in that: In response to the first spectroscopic test result of the mixed colloid satisfying the first preset condition, the mixed colloid is uniformly coated on the surface of the LED excitation chip according to preset spin coating parameters to form a fluorescent coating, including: Obtaining the viscosity of the mixed colloid and the target thickness of the fluorescent coating; According to the viscosity and the target thickness, obtaining corresponding preset spin coating parameters, wherein the preset spin coating parameters include a spin coating speed control curve, the spin coating speed control curve includes a plurality of stages, and different stages have different durations and / or spin coating speeds; Add a preset amount of mixed colloid to the center of the LED excitation chip; According to the spin coating speed control curve, controlling the LED excitation chip to rotate so that the mixed colloid diffuses on the surface of the LED excitation chip to form an initial fluorescent coating; Performing spectroscopic detection on different positions on the initial fluorescent coating to obtain a second preset number of second spectroscopic test results; Judging whether the fluorescent coating is uniform according to the difference between the second spectroscopic test results; If it is not uniform, adjusting the duration of the specified phase of the spin coating speed control curve and / or the spin coating speed according to the degree of difference; If it is uniform, a fluorescent coating satisfying the second preset condition is obtained through the initial fluorescent coating.

8. The method for preparing a high-light-efficiency LED light-emitting semiconductor according to claim 7, characterized in that: The spin coating speed control curve includes an initial stage, a main spin coating stage and an accelerated spin coating stage in sequence. The preset spin coating parameters are obtained according to the viscosity and the target thickness, including: Measuring the mixed colloid to obtain colloid parameters, wherein the colloid parameters include density and particle concentration of the mixed colloid; According to the viscosity of the mixed colloid, the preset drop amount and the surface area of ​​the LED excitation chip, a first rotation speed and a first duration in the initial stage are obtained, wherein the first rotation speed is positively correlated with the viscosity of the coating colloid and negatively correlated with the surface area; the first duration is positively correlated with the surface area and positively correlated with the preset drop amount; According to the viscosity, density and particle concentration of the mixed colloid, a second rotation speed and a second duration of the main spin coating stage are obtained, wherein the second rotation speed is positively correlated with the viscosity and density, and negatively correlated with the particle concentration; the second duration is positively correlated with the target thickness, and negatively correlated with the density; According to the viscosity, density and particle concentration of the mixed colloid, a third rotation speed and a third duration of the accelerated spin coating stage are obtained, wherein the third rotation speed is positively correlated with the viscosity and density, and negatively correlated with the particle concentration; the third duration is positively correlated with the target thickness, and negatively correlated with the density.

9. The method for preparing a high-light-efficiency LED light-emitting semiconductor according to claim 8, characterized in that: In response to the second spectroscopic test result of the fluorescent coating satisfying the second preset condition, curing the LED excitation chip with the fluorescent coating according to the preset curing condition to obtain an initial light-emitting semiconductor, including: Obtaining preset curing conditions corresponding to the type of LED packaging glue, wherein the preset curing conditions include curing temperature and curing time; According to the colloid parameters of the mixed colloid, the preset curing conditions are adjusted to obtain the target curing conditions. According to the target curing conditions, curing the LED excitation chip with the fluorescent coating to obtain an initial light-emitting semiconductor; Performing a spectroscopic test on the initial light-emitting semiconductor to obtain a third spectroscopic test result, wherein the third spectroscopic test result includes a luminous flux, a color coordinate value, and a color temperature; A weighted operation is performed on the difference between each parameter in the third spectral test result and the corresponding target spectral parameter threshold to obtain the spectral deviation degree of the initial light-emitting semiconductor, wherein the target spectral parameter threshold includes a luminous flux threshold, a color coordinate threshold and a color temperature threshold; the weight value of the luminous flux is greater than or equal to the weight value of the color coordinate value, and the weight value of the color coordinate value is greater than the weight value of the color temperature; If the light splitting deviation degree is less than or equal to the preset deviation threshold, the third light splitting test result meets the preset finished product light splitting condition; Otherwise, the third spectrophotometric test result does not meet the preset finished product spectrophotometric condition.

10. The method for preparing a high-light-efficiency LED light-emitting semiconductor according to claim 9, characterized in that: If the third light splitting test result of the initial light emitting semiconductor does not meet the preset finished product light splitting condition, one or more of the first preset ratio, the second preset ratio, the preset spin coating parameters and the preset curing conditions are adjusted according to the first light splitting test result, the second light splitting test result and the third light splitting test result, including: Respectively obtaining the deviation degree between the first spectroscopic test result, the second spectroscopic test result, and the third spectroscopic test result and the target spectroscopic parameter threshold, recorded as a first deviation degree, a second deviation degree, and a third deviation degree; According to the preset deviation threshold, obtaining the allowable deviation thresholds of the first spectrophotometric test result, the second spectrophotometric test result, and the third spectrophotometric test result, wherein the allowable deviation thresholds of the first spectrophotometric test result, the second spectrophotometric test result, and the third spectrophotometric test result are increased in sequence; Determining a main deviation stage according to the first deviation degree, the second deviation degree, the third deviation degree and the corresponding allowable deviation threshold, wherein the main deviation stage includes one of a mixing stage, a spin coating stage and a curing stage; According to the main deviation stage, the parameters to be adjusted are determined, wherein the parameters to be adjusted in the mixing stage include a first preset ratio and a second preset ratio, the parameters to be adjusted in the spin coating stage include preset spin coating parameters, and the parameters to be adjusted in the curing stage include preset curing conditions; Determining an adjustment amount of the parameter to be adjusted according to the first light splitting test result, the second light splitting test result, the third light splitting test result and the target light splitting parameter threshold; The parameter to be adjusted is adjusted according to the adjustment amount.

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