Display panel, manufacturing method thereof and display device

Abstract

The invention discloses a display panel and a manufacturing method thereof and a display device.The display panel comprises a substrate, a pixel definition layer, a light-emitting unit and a first partition structure, the light-emitting unit further comprises an anode auxiliary electrode, the anode auxiliary electrode is arranged between an anode and a light-emitting functional layer, and the first partition structure is arranged between the anode and the light-emitting functional layer; the first partition structure is arranged on the pixel definition layer, the first partition structure comprises a conductive part and a partition part, the partition part is arranged on the conductive part, and the radial width of the partition part is larger than that of the conductive part; and the first partition structure is used for partitioning the anode auxiliary electrodes and / or the light-emitting functional layers of the two adjacent light-emitting units when the anode auxiliary electrodes and the light-emitting functional layers are deposited on the whole surface. By adding the anode auxiliary electrode between the anode and the light-emitting functional layer, a film layer interface between the anode and the light-emitting functional layer is improved, the light-emitting efficiency of the light-emitting unit is improved, and the service life of the light-emitting unit is prolonged.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display panel and a manufacturing method thereof, and a display device. Background Art

[0002] OLED (Organic Light Emitting Diode) display devices are widely used in various fields due to their light weight, wide viewing angle, fast response, low temperature resistance, high luminous efficiency, and the ability to produce curved flexible displays. As mass production technology becomes increasingly mature, OLED display panels are gradually becoming mainstream real-world panels.

[0003] However, due to process reasons, when etching the anode of the OLED light-emitting unit, the protective layer may not be removed cleanly, resulting in residues. The above problem will increase the contact resistance between the anode and the organic material in the light-emitting functional layer, thereby causing the light-emitting unit to drive higher voltage or rapidly reduce its lifespan. Summary of the invention

[0004] The purpose of the present application is to provide a display panel, a manufacturing method thereof and a display device, which improves the film interface between the anode and the light-emitting functional layer by adding an anode auxiliary electrode between the anode and the light-emitting functional layer, thereby improving the luminous efficiency and life of the light-emitting unit.

[0005] The present application discloses a display panel, which includes a base substrate, a pixel definition layer, a light-emitting unit and a first partition structure, wherein the pixel definition layer is arranged on the base substrate and is provided with a plurality of opening areas, and the light-emitting unit is arranged on the base substrate and is located in the opening area; the light-emitting unit includes an anode, a light-emitting functional layer and a cathode, wherein the anode is arranged on the base substrate, the light-emitting functional layer is arranged on the anode, and the cathode is arranged on the light-emitting functional layer; the light-emitting unit also includes an anode auxiliary electrode, wherein the anode auxiliary electrode is arranged between the anode and the light-emitting functional layer, and the anode auxiliary electrode is formed of one or more of metal, metal alloy or metal oxide; the first partition structure is arranged on the pixel definition layer, wherein the first partition structure includes a conductive part and a partition part, wherein the partition part is arranged on the conductive part, and the radial width of the partition part is greater than the radial width of the conductive part; the first partition structure is used to partition the anode auxiliary electrode and / or the light-emitting functional layer of two adjacent light-emitting units when the anode auxiliary electrode and the light-emitting functional layer are deposited on the entire surface.

[0006] Optionally, the first partition structure is used to isolate the anode auxiliary electrode and the light-emitting functional layer of two adjacent light-emitting units when the anode auxiliary electrode and the light-emitting functional layer are deposited on the entire surface; the anode auxiliary electrode and the light-emitting functional layer are not connected to the conductive part respectively; the cathode is connected to the conductive part of the adjacent first partition structure.

[0007] Optionally, the display panel also includes a second partition structure, which is arranged under the first partition structure; the second partition structure is used to isolate the anode auxiliary electrode of two adjacent light-emitting units when the anode auxiliary electrode is deposited on the entire surface; the first partition structure is used to isolate the light-emitting functional layer of two adjacent light-emitting units when the light-emitting functional layer is deposited on the entire surface; the conductive part of the first partition structure is also used to connect the cathodes of two adjacent light-emitting units.

[0008] Optionally, the display panel also includes a partition layer, which is arranged under the pixel definition layer and located on the anode, directly contacting the anode; under the orthographic projection of the base substrate, the boundary of the partition layer is within the projection range of the pixel definition layer and has a preset distance from the projection boundary of the pixel definition layer, and the pixel definition layer and the partition layer form a second partition structure; the partition layer is also used to protect the anode during the patterning process of the anode.

[0009] Optionally, the isolation layer is formed of metal or metal alloy material, and the isolation layer and the anode are formed of different materials; the preset distance is greater than or equal to 5000 angstroms and less than or equal to 50000 angstroms, and the thickness of the isolation layer is greater than or equal to 100 angstroms to 10000 angstroms.

[0010] Optionally, the anode includes a first transparent electrode layer, a first reflective electrode layer and a second transparent electrode layer, the first reflective electrode layer is arranged between the first transparent electrode layer and the second transparent electrode layer; the first reflective electrode layer is formed of a reflective metal material; wherein the anode auxiliary electrode includes a first auxiliary electrode layer, the first auxiliary electrode layer is arranged on the second transparent electrode layer and is in direct contact with the second transparent electrode layer; wherein the thickness of the first auxiliary electrode layer is between 10 angstroms and 300 angstroms; the second partition structure is used to separate the first auxiliary electrode layers of two adjacent light-emitting units; wherein, under the orthographic projection of the base substrate, the projection of the anode auxiliary electrode is within the projection range of the anode.

[0011] Optionally, the anode includes a first electrode layer, which is formed of one or more of metal, metal alloy or metal oxide; the anode auxiliary electrode includes a second reflective electrode layer and a second auxiliary electrode layer, the second reflective electrode layer is formed of silver material or silver alloy material, and the second reflective electrode layer is arranged on the anode and directly contacts the anode; the second auxiliary electrode layer is formed of metal oxide; the second auxiliary electrode layer is arranged on the second reflective electrode layer and directly contacts the second reflective electrode layer; the second partition structure is used to separate the second reflective electrode layers of two adjacent light-emitting units; wherein the thickness of the second reflective electrode layer is between 1000 angstroms and 5000 angstroms; wherein the second auxiliary electrode layer forms a metal oxide film layer on the surface of the first reflective electrode layer away from the substrate by plasma treatment to serve as the second auxiliary electrode layer.

[0012] The present application also discloses a method for manufacturing a display panel, comprising the steps of: Providing a substrate; Depositing and patterning an anode on a substrate; Depositing and patterning to form a pixel definition layer, and forming a plurality of opening areas; Depositing a conductive part material and a partition part material on the pixel definition layer in sequence, and forming a first partition structure after a patterning process; Depositing an anode auxiliary electrode material and a light-emitting functional layer material on the entire surface in sequence, and forming an anode auxiliary electrode and a light-emitting functional layer in the opening area by using the first partition structure; forming a cathode to form a plurality of light-emitting units in the plurality of opening regions; A display panel is formed.

[0013] Optionally, the step of depositing and patterning an anode on a substrate includes: Depositing an entire anode material layer and an entire barrier layer material layer in sequence on the substrate; After etching the partition layer material layer at the non-opening area position to form a patterned partition layer, the anode material layer is etched using the partition layer to form a patterned anode, and a partition groove is formed at the etching position; The step of depositing and patterning a pixel definition layer and forming a plurality of opening areas comprises: Depositing a whole surface of pixel definition layer material on the partition layer and filling the partition grooves; Patterning a pixel definition layer and forming a plurality of opening areas, wherein a radial width of the pixel definition layer is greater than a width of the partition groove; Using the pixel definition layer as a protective layer, etching the partition layer, so that the pixel definition layer and the partition layer form a second partition structure; Wherein, under the orthographic projection of the base substrate, the boundary of the isolation layer is within the projection range of the pixel definition layer and has a preset distance from the projection boundary of the pixel definition layer; The step of sequentially depositing the anode auxiliary electrode material and the light-emitting functional layer material on the entire surface, and using the first partition structure to form the anode auxiliary electrode and the light-emitting functional layer in the opening area includes: Depositing an anode auxiliary electrode material on the entire surface, and forming an anode auxiliary electrode in the opening area using the second partition structure; The light-emitting functional layer material is deposited on the entire surface, and the light-emitting functional layer is formed in the opening area by using the first partition structure.

[0014] The present application also discloses a display device, comprising a driving circuit and the above-mentioned display panel, wherein the driving circuit is used to drive the display panel to display.

[0015] The present application adds an anode auxiliary electrode to the anode and the light-emitting functional layer. During the deposition process, the anode auxiliary electrode has a good contact interface with the anode. Even if there is a problem of residue on the anode, since the anode auxiliary electrode also has conductive properties and is in full contact with the anode, there will be no problem of increased contact resistance. The advantage of the anode auxiliary electrode is that the anode auxiliary electrode can be isolated by a first partition structure without the need for etching, so that the anode auxiliary electrode of each light-emitting unit is independently set, thereby avoiding a series of problems such as etching residue and etching oxidation caused by etching to the anode auxiliary electrode. Importantly, the first partition structure is used to allow the anode auxiliary electrode and the subsequent light-emitting functional layer to be processed in the same environment. After the anode auxiliary electrode is formed, no etching process is required, and the light-emitting functional layer is directly deposited, avoiding the influence of the intermediate process on the film interface between the anode auxiliary electrode and the light-emitting functional layer, thereby improving the luminous efficiency and service life of the light-emitting unit. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The included drawings are used to provide a further understanding of the embodiments of the present application, which constitute a part of the specification, are used to illustrate the implementation methods of the present application, and together with the text description, explain the principles of the present application. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. In the drawings: Figure 1 is a schematic diagram of a display panel according to a first embodiment of the present application; Figure 2 is a schematic diagram of steps of a method for manufacturing a display panel according to a first embodiment of the present application; Figure 3is a schematic diagram of a display panel according to a second embodiment of the present application; Figure 4 It is a schematic diagram of the first partition structure and the second partition structure of the present application; Figure 5 is a schematic diagram of a light emitting unit according to a first embodiment of the present application; Figure 6 is a schematic diagram of an anode of a second embodiment of the present application; Figure 7 is a schematic diagram of another display panel according to the second embodiment of the present application; Figure 8 is a schematic diagram of steps of a method for manufacturing a display panel according to a second embodiment of the present application; Fig. 9 is a schematic diagram of manufacturing a display panel according to a second embodiment of the present application; Fig.10 is a schematic diagram of a display device of the present application.

[0017] Among them, 100, display panel; 101, opening area; 102, non-opening area; 110, substrate; 120, pixel definition layer; 121, partition groove; 122, first partition structure; 1221, conductive part; 1222, partition part; 130, light-emitting unit; 131, anode; 1311, first transparent electrode layer; 1312, first reflective electrode layer; 1313, second transparent electrode layer; 1314, first electrode layer; 132, light-emitting functional layer; 1321, hole injection layer; 1322, hole transport layer; 1323, electron blocking layer; 1324, light emitting layer; 1325, hole blocking layer; 1326, electron transport layer; 1327, electron injection layer; 133, cathode; 134, anode auxiliary electrode; 1341, first auxiliary electrode layer; 1342, second reflective electrode layer; 1343, second auxiliary electrode layer; 140, partition layer; 141, second partition structure; 150, pixel driving layer; 200, display device; 210, driving circuit. DETAILED DESCRIPTION

[0018] It should be understood that the terms used herein, the specific structures and functional details disclosed are only for describing specific embodiments and are representative, but the present application can be implemented in many alternative forms and should not be construed as being limited to only the embodiments described herein.

[0019] In the description of the present application, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating relative importance or implicitly indicating the number of technical features indicated. Therefore, unless otherwise specified, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; "multiple" means two or more. In addition, the terms "upper", "lower", "left", "right", "vertical", "horizontal", etc. indicating orientation or positional relationships are described based on the orientation or relative positional relationships shown in the accompanying drawings, and are only for the convenience of describing the simplified description of the present application, rather than indicating that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to the specific circumstances.

[0020] The present application is described in detail below with reference to the accompanying drawings and optional embodiments.

[0021] Figure 1 is a schematic diagram of a display panel of the first embodiment of the present application, see Figure 1 As shown, the present application discloses a display panel 100, the display panel 100 includes a base substrate 110, a pixel definition layer 120, a light-emitting unit 130 and a first partition structure 122, the pixel definition layer 120 is arranged on the base substrate 110, and is provided with a plurality of opening areas 101, the light-emitting unit 130 is arranged on the base substrate 110, and is located in the opening area 101; the light-emitting unit 130 includes an anode 131, a light-emitting functional layer 132 and a cathode 133, the anode 131 is arranged on the base substrate 110, the light-emitting functional layer 132 is arranged on the anode 131, and the cathode 133 is arranged on the light-emitting functional layer 132; the light-emitting unit 130 also includes an anode auxiliary electrode 134 The anode auxiliary electrode 134 is arranged between the anode 131 and the light-emitting functional layer 132, and the anode auxiliary electrode 134 is formed of one or more of metal, metal alloy or metal oxide; the first partition structure 122 is arranged on the pixel definition layer 120, and the first partition structure 122 includes a conductive part 1221 and a partition part 1222, and the partition part 1222 is arranged on the conductive part 1221, and the radial width of the partition part 1222 is greater than the radial width of the conductive part 1221; the first partition structure 122 is used to isolate the anode auxiliary electrode 134 and / or the light-emitting functional layer 132 of two adjacent light-emitting units 130 when the anode auxiliary electrode 134 and the light-emitting functional layer 132 are deposited on the entire surface.

[0022] The present application adds an anode auxiliary electrode 134 on the anode 131 and the light-emitting functional layer 132. During the deposition process, the anode auxiliary electrode 134 has a good contact interface with the anode 131. Even if there is a problem of residue on the anode 131, since the anode auxiliary electrode 134 also has conductive properties and is in full contact with the anode 131, there will be no problem of increased contact resistance. The advantage of the anode auxiliary electrode 134 is that the anode auxiliary electrode 134 can be isolated by the first partition structure 122 without etching, so that the anode auxiliary electrode 134 of each light-emitting unit 130 is independently set, thereby avoiding a series of problems such as etching residue, etching oxidation, etc. caused by etching on the anode auxiliary electrode 134. Importantly, the first partition structure 122 is utilized to allow the anode auxiliary electrode 134 and the subsequent light-emitting functional layer 132 to be processed in the same environment. After the anode auxiliary electrode 134 is formed, no etching process is required, and the light-emitting functional layer 132 can be directly deposited, thereby avoiding the influence of the intermediate process on the film interface between the anode auxiliary electrode 134 and the light-emitting functional layer 132, thereby improving the luminous efficiency and service life of the light-emitting unit 130.

[0023] Specifically, the first partition structure 122 is used to separate the anode auxiliary electrode 134 and the light-emitting functional layer 132 of two adjacent light-emitting units 130 when the anode auxiliary electrode 134 and the light-emitting functional layer 132 are deposited on the entire surface; the anode auxiliary electrode 134 and the light-emitting functional layer 132 are not connected to the conductive part 1221 respectively; the cathode 133 is connected to the conductive part 1221 of the adjacent first partition structure 122.

[0024] It is worth mentioning that the first partition structure 122 in this embodiment is a key structure used in the maskless evaporation technology, which is usually called a conductive partition structure and is usually used to partition the light-emitting functional layer 132 and the cathode 133. The conductive partition structure can also be called a hanging structure, etc. Among them, it is mainly formed by a narrower conductive part 1221 arranged at the bottom and a wider partition part 1222 arranged at the top, so that in the process of evaporating the material, the first partition structure 122 is used as a metal mask to form a patterned anode auxiliary electrode 134, a light-emitting functional layer 132, etc. in the required area, such as the opening area 101.

[0025] Considering that the conductive part 1221 located at the bottom of the first partition structure 122 has the ability to conduct electricity, it is generally formed of a metal material. Therefore, when the anode auxiliary electrode 134 is partitioned, the anode auxiliary electrode 134 cannot be overlapped with the conductive part 1221. Of course, since the conductive part 1221 is also used to connect the cathodes 133 of two adjacent light-emitting units 130, thereby connecting the cathodes 133 of multiple light-emitting units 130 to form a mesh electrode, thereby reducing the resistance, it is also necessary to consider not connecting the light-emitting functional layer 132 with the conductive part 1221.

[0026] In one embodiment, the evaporation angle can be controlled so that a certain distance exists between the anode auxiliary electrode 134 and the light-emitting functional layer 132 and the conductive part 1221 , respectively, so that the anode auxiliary electrode 134 and the light-emitting functional layer 132 are not connected to the conductive part 1221 .

[0027] Figure 2 is a schematic diagram of the steps of the method for manufacturing a display panel according to the first embodiment of the present application, see Figure 2 As shown, the present application corresponds to the above-mentioned display panel and further discloses a method for manufacturing the display panel, the manufacturing method comprising: S10: providing a substrate; S20: depositing and patterning an anode on a substrate; S30: depositing and patterning to form a pixel definition layer, and forming a plurality of opening areas; S40: depositing a conductive part material and a partition part material on the pixel definition layer in sequence, and forming a first partition structure after a patterning process; S50: sequentially depositing an anode auxiliary electrode material and a light-emitting functional layer material on the entire surface, and using the first partition structure to form an anode auxiliary electrode and a light-emitting functional layer in the opening area; S60: forming a cathode to form a plurality of light-emitting units in the plurality of opening regions; S70: forming a display panel.

[0028] In this embodiment, although an anode auxiliary electrode 134 is added, in the manufacturing process, the anode auxiliary electrode 134 only needs to be evaporated in sequence with the light-emitting functional layer 132. In combination with the maskless evaporation technology of the display panel 100, the patterning process of the anode auxiliary electrode 134 is realized by means of the conductive partition structure of the evaporated light-emitting functional layer 132. By realizing the formation of the anode auxiliary electrode 134 without adding additional processes, the anode auxiliary electrode 134 is used to improve the film interface between the anode 131 and the light-emitting functional layer 132. It is important that the process is carried out in the same environment as the subsequent light-emitting functional layer 132. After the anode auxiliary electrode 134 is formed, no etching process is required, and the light-emitting functional layer 132 is directly deposited, thereby avoiding the influence of the intermediate process on the film interface between the anode auxiliary electrode 134 and the light-emitting functional layer 132.

[0029] Specifically, in the above-mentioned process of forming the first partition structure 122, by continuously depositing the conductive part 1221 material and the partition part 1222 material on the entire surface, the partition part 1222 material in the opening area 101 and the area other than the first partition structure 122 is removed by using photolithography technology, and the partition part 1222 in the first partition structure 122 is retained. Secondly, the conductive part 1221 is wet-etched using the partition part 1222 as a protective layer, and the side etching of the conductive part 1221 caused by the wet etching process results in over-etching of the conductive part 1221 at the edge of the partition part 1222, resulting in the width of the conductive part 1221 being smaller than the partition part 1222, and forming a conductive partition structure with a wide upper portion and a narrow lower portion similar to an "overhang" shape.

[0030] In this embodiment, the anode auxiliary electrode 134 may include only one electrode layer, and the anode auxiliary electrode 134 includes a first auxiliary electrode layer 1341, and the first auxiliary electrode layer 1341 is arranged on the second transparent electrode layer 1313 and directly contacts the second transparent electrode layer 1313; the first auxiliary electrode layer 1341 of this embodiment can be selected as a metal oxide material with a high work function such as ITO, IZO, etc., or can be selected as a metal or metal alloy material with a high work function such as Pt, Ni, Au, etc. However, considering that the metal or metal alloy material has the characteristic of being opaque when the thickness is thick, it is necessary to limit the thickness of the metal or metal alloy material, that is, the thickness of the first auxiliary electrode layer 1341 should not exceed 30nm (300 angstroms). Of course, the thickness of the first auxiliary electrode layer 1341 cannot be too thin, and at least needs to be greater than or equal to 10 angstroms.

[0031] After the light-emitting functional layer 132 is partitioned, during the process of forming the cathode 133, the cathode 133 will also be partitioned due to the partitioning effect of the first partition structure 122. The cathode 133 of the light-emitting unit 130 generally needs to be set on the entire surface so that it has the same voltage, and the brightness of the light-emitting unit 130 can be controlled by adjusting the voltage of the anode 131. Therefore, in this solution, by controlling the evaporation angle, the cathode 133 extends from the opening area 101 to the non-opening area 102, so that the cathode 133 overlaps the conductive part 1221, and the conductive part 1221 forms a mesh-arranged entire surface cathode 133.

[0032] Figure 3 is a schematic diagram of a display panel according to a second embodiment of the present application, Figure 4 is a schematic diagram of the first partition structure and the second partition structure of the present application, see Figure 3 to Figure 4 As shown, based on the above embodiment, this embodiment further adds a second partition structure 141, which is arranged below the first partition structure 122. The second partition structure 141 is used to isolate the anode auxiliary electrode 134, and the first partition structure 122 is used to isolate the light-emitting functional layer 132.

[0033] Specifically, in the process of the light-emitting unit 130 of the display panel 100, the anode 131 is generally formed first, and the pixel definition layer 120 is formed on the anode 131. After the pixel definition layer 120 is patterned, the required pixel area, i.e., the opening area 101, is isolated. The opening area 101 is used to form the subsequent light-emitting functional layer 132 and the cathode 133. After the anode 131 is deposited, it needs to undergo a patterning process and a subsequent patterning process of the pixel definition layer 120 before the light-emitting functional layer 132 is formed. The patterning process generally adopts a photolithography method. After the part of the anode 131 that is not etched is protected by a photoresist, the unnecessary part of the anode 131 material is etched, and the photoresist on the anode 131 is removed after the etching is completed. In this process, on the one hand, there will be a situation where the above-mentioned photolithography machine is not removed cleanly, resulting in residual photolithography machine on the anode 131, which causes abnormality. On the other hand, since the etching process is generally completed in an atmospheric environment, the surface of the anode 131 is prone to oxidation during the etching process. In particular, during the oxidation process, areas where the surface of the anode 131 is uneven and has peaks or pinholes are more susceptible to oxidation, thereby increasing the contact resistance between the anode 131 and the light-emitting functional layer 132.

[0034] In the previous embodiment of the present application, although the first partition structure 122 used also has the function of isolating the anode auxiliary electrode 134, the residual problem caused by etching the anode 131 cannot be improved, and the contact interface between the anode auxiliary electrode 134 and the light-emitting functional layer 132 can only be improved by setting the anode auxiliary electrode 134. When there is a large residual problem on the anode 131, the film interface between the anode 131 and the anode auxiliary electrode 134 will also be poor, thereby affecting the light-emitting efficiency. In this embodiment, in addition to having the ability to isolate the anode auxiliary electrode 134, the second partition structure 141 can further protect the anode 131 from the above-mentioned residual problem during the etching process of the anode 131.

[0035] Specifically, the display panel 100 also includes a partition layer 140, which is arranged under the pixel definition layer 120 and is located on the anode 131, and is in direct contact with the anode 131; under the orthographic projection of the base substrate 110, the boundary of the partition layer 140 is within the projection range of the pixel definition layer 120, and has a preset distance from the projection boundary of the pixel definition layer 120, and the pixel definition layer 120 and the partition layer 140 form a second partition structure 141.

[0036] In this embodiment, a partitioning structure is formed by adding a partitioning layer 140 between the pixel definition layer 120 and the anode 131, so that the partitioning layer 140 is at the bottom and has a width smaller than the pixel definition layer 120, and the edge of the pixel definition layer 120 protrudes from the partitioning layer 140. The partitioning structure is respectively arranged around each opening area 101, and when the anode auxiliary electrode 134 is evaporated, the redundant anode auxiliary electrode 134 material on the pixel definition layer 120 is disconnected from the anode 131, so that the anode auxiliary electrode 134 is independently arranged.

[0037] Specifically, the second partition structure 141 is used to partition the anode auxiliary electrode 134 of two adjacent light-emitting units 130 when the anode auxiliary electrode 134 is deposited on the entire surface; the first partition structure 122 is used to partition the light-emitting functional layer 132 of two adjacent light-emitting units 130 when the light-emitting functional layer 132 is deposited on the entire surface; the conductive portion 1221 of the first partition structure 122 is also used to connect the cathodes 133 of two adjacent light-emitting units 130. Among them, the second partition structure 141 is located below the first partition structure 122, and under the projection of the base substrate 110, the first partition structure 122 is closer to the position of the opening area 101 than the first partition structure 122, so that when the anode auxiliary electrode 134 is partitioned, the anode auxiliary electrode 134 is directly disconnected from the edge of the pixel definition layer 120. In addition, considering that when the first partition structure 122 is used alone, the patterning process of the anode 131 cannot be protected by the partition layer 140. When the second partition structure 141 is used alone, since the pixel definition layer 120 in the maskless evaporation technology is formed of inorganic materials, its thickness is difficult to support so that it has the ability to partition the light-emitting functional layer 132. Therefore, in this embodiment, by combining the advantages of the first partition structure 122 and the second partition structure 141, the disadvantages of the single implementation of the two are overcome, thereby improving the light-emitting efficiency and service life of the light-emitting unit 130 without adding additional complex processes.

[0038] The main function of the partition layer 140 is to protect the anode 131 during the patterning process of the anode 131. Specifically, in the process of forming the anode 131, it is necessary to form an independently set anode 131 in multiple opening areas 101. In this embodiment, the anode 131 and the partition layer 140 set on the anode 131 are etched at the same time, and the anode 131 is protected by the partition layer 140. That is, in the process of etching the anode 131, it is not necessary to use a photoresist to directly contact the anode 131, but to set it on the partition layer 140 to etch the partition layer 140 and the anode 131 at the same time, so that the partition groove 121 is formed in the non-opening area 102, so that multiple anodes 131 are independently set. It can be understood that the pixel definition layer 120 is used to insulate the location of the partition groove 121, and the pixel definition layer 120 partially overlaps with the anode 131 and the partition layer 140. The pixel definition layer 120 is set to define the opening area 101, that is, the area where the light-emitting unit 130 is set.

[0039] In this embodiment, the partition layer 140 is provided by covering the anode 131. In the process of etching the anode 131, the photoresist is provided on the partition layer 140, so that the anode 131 does not contact the photoresist, thereby avoiding the residual problem caused by the unclean film stripping of the photoresist material on the anode 131. Moreover, the partition layer 140 is etched again in the subsequent process of forming the partition structure, so that the anode 131 is exposed from the opening area 101, so that the anode 131 can directly contact the subsequent anode auxiliary electrode 134 in the opening area 101. In the process of forming the partition structure by providing the partition layer 140, the problem of residual photoresist in the etching process of the anode 131 is also improved. In addition, in the case of adding the partition layer 140 to form the partition structure, although the etching technology is used, the etching of the partition layer 140 and the etching of the partition structure do not need to add additional masks, and can be directly completed using the current process machine, which is suitable for the production of the current production line.

[0040] Each light-emitting unit 130 in the display panel 100 can generally be controlled individually. The specific method is to connect the anode 131 of the light-emitting unit 130 to a thin film transistor respectively, and drive it through the pixel driving circuit. When the pixel driving circuit assigns different voltages to the anode 131, the light-emitting unit 130 is controlled to have different light brightness. The pixel driving circuit of the display panel 100 is formed by thin film technology, which can also be called a pixel driving layer 150, which is generally arranged on the base substrate 110 and under the anode 131. The pixel driving layer 150 is generally formed of multiple metal layers and insulating layers to form thin film transistors, driving circuits, etc., so as to realize the control of the light-emitting unit 130.

[0041] Furthermore, since the anode 131 of the light-emitting unit 130 needs to be connected to the corresponding thin film transistor, generally speaking, the two are connected through a via, and the extension line of the anode 131 is connected to the thin film transistor through the via. In this embodiment, the position of the via can be set corresponding to the position of the above-mentioned isolation layer 140. That is, on the orthographic projection of the base substrate 110, the projection of the via between the anode 131 of the current light-emitting unit 130 and the thin film transistor and the projection of the isolation layer 140 overlap. Through the conductive effect of the isolation layer 140, the resistance at the via is reduced.

[0042] In the process of forming the partition structure, the material of the partition layer 140 can be a metal material or a metal alloy material, but it is different from the material used for the anode 131. The main consideration is that in the process of etching the partition layer 140 to form the pixel definition layer 120, a wet etching process is generally required. Since the wet etching process is isotropic, the partition layer 140 will be side-etched, so that the edge of the pixel definition layer 120 protrudes from the partition layer 140, thereby forming a partition structure. In the process of etching, if the anode 131 and the partition layer 140 are made of the same material, the corresponding anode 131 will also be etched, causing the anode 131 to be etched and damaged. When the anode 131 and the partition layer 140 are made of different materials, since the etching solution only etches the corresponding material, that is, during the etching process, the etching solution only reacts with the material of the partition layer 140, and does not react with the material of the anode 131, therefore, the anode 131 will not be affected.

[0043] In this embodiment, considering that the second partition structure 141 formed by the pixel definition layer 120 and the partition layer 140 has limited partitioning capability, its partitioning capability is mainly related to the preset distance and the thickness of the partition layer 140, and the preset distance and the thickness of the partition layer 140 cannot completely isolate the light-emitting functional layer 132. In this embodiment, the partition of the light-emitting functional layer 132 is mainly achieved by the first partition structure 122.

[0044] Figure 5 is a schematic diagram of a light emitting unit of the first embodiment of the present application, see Figure 5 As shown, the light-emitting functional layer 132 includes a hole injection layer 1321, a hole transport layer 1322, an electron blocking layer 1323, a light-emitting layer 1324, a hole blocking layer 1325, an electron transport layer 1326 and an electron injection layer 1327 from the anode 131 to the cathode 133. The electron injection layer 1327 is arranged on the cathode 133 side, and the hole injection layer 1321 is arranged on the anode 131 side. In this embodiment, the first partition structure 122 sequentially partitions the above-mentioned film layers.

[0045] Figure 6 is a schematic diagram of the anode of the second embodiment of the present application, see Figure 6As shown, in this embodiment, the anode 131 includes a first transparent electrode layer 1311, a first reflective electrode layer 1312 and a second transparent electrode layer 1313, and the first reflective electrode layer 1312 is arranged between the first transparent electrode layer 1311 and the second transparent electrode layer 1313; the first reflective electrode layer 1312 is formed by a reflective metal material; wherein the anode auxiliary electrode 134 includes a first auxiliary electrode layer 1341, and the first auxiliary electrode layer 1341 is arranged on the second transparent electrode layer 1313 and is in direct contact with the second transparent electrode layer 1313; the second partition structure 141 is used to separate the first auxiliary electrode layer 1341 of two adjacent light-emitting units 130.

[0046] For the display panel 100 currently based on organic light-emitting materials, the anode 131 is generally arranged in a sandwich configuration, that is, the first reflective electrode layer 1312 is sandwiched between the first transparent electrode layer 1311 and the second transparent electrode layer 1313, so as to protect the first reflective electrode layer 1312. On the other hand, since the first transparent electrode layer 1311 is generally formed of metal oxides such as indium tin oxide (ITO), the indium tin oxide has a higher work function, so that the light-emitting unit 130 generates more holes on the anode 131 side, thereby improving the light-emitting efficiency of the light-emitting unit 130. In this embodiment, the anode 131 is a three-layer electrode layer of ITO, silver Ag, and ITO. The corresponding material of the partition layer 140 can be a metal oxide such as IZO (indium zinc oxide), a metal such as Al (aluminum), Mo (molybdenum), Cu (copper), or an alloy of the above metals with other metals.

[0047] The first auxiliary electrode layer 1341 of this embodiment can be selected from metal oxide materials such as ITO and IZO with high work function, or metal or metal alloy materials with high work function such as Pt, Ni, and Au. However, considering that metal or metal alloy materials have the characteristic of being opaque when thick, it is necessary to limit the thickness of the metal or metal alloy material, that is, the thickness of the first auxiliary electrode layer 1341 should not exceed 30nm (300 angstroms). Of course, the thickness of the first auxiliary electrode layer 1341 cannot be too thin, and at least needs to be greater than or equal to 10 angstroms. Among them, under the orthographic projection of the base substrate 110, the projection of the anode auxiliary electrode 134 is within the projection range of the anode 131.

[0048] Figure 7 is a schematic diagram of another display panel of the second embodiment of the present application, see Figure 7As shown, in another embodiment, the anode 131 is provided as an electrode layer due to the protection of the partition layer 140. Since the anode 131 with a three-layer structure is etched to form the partition groove 121, when the pixel definition layer 120 is used to insulate the anode 131, the metal of the three-layer sandwich is not easy to etch, and it is easy to cause the problem of over-etching or unclean etching. Therefore, the anode 131 is provided as a metal layer, and the anode 131 includes a first electrode layer 1314, and the first electrode layer 1314 is formed of one or more of metal, metal alloy or metal oxide.

[0049] The first electrode layer 1314 may be any one of the above three layers of ITO, Ag, and ITO. When the first electrode layer 1314 is a silver electrode layer, it may also be used as a reflective metal layer.

[0050] When the anode 131 is a single layer, the anode auxiliary electrode 134 includes a second reflective electrode layer 1342 and a second auxiliary electrode layer 1343, the second reflective electrode layer 1342 is formed of silver material or silver alloy material, the second reflective electrode layer 1342 is arranged on the anode 131 and is in direct contact with the anode 131; the second auxiliary electrode layer 1343 is formed of metal oxide; the second auxiliary electrode layer 1343 is arranged on the second reflective electrode layer 1342 and is in direct contact with the second reflective electrode layer 1342; the second partition structure 141 is used to separate the second reflective electrode layer 1342 and the second auxiliary electrode layer 1343 of two adjacent light-emitting units 130.

[0051] The second reflective electrode layer 1342 is disposed inside the anode auxiliary electrode 134, that is, the reflective metal layer of the anode 131 is formed in the same environment as the light-emitting functional layer 132 by using a maskless evaporation technology, that is, a partition structure, in a vacuum environment. The process of the reflective metal layer no longer requires an etching step, and in addition to the advantages mentioned above, the film quality of the reflective metal layer, i.e., the second reflective electrode layer 1342, can be improved.

[0052] Specifically, in order to ensure the reflection quality of the second reflective electrode layer 1342, the thickness of the second reflective electrode layer 1342 is greater than or equal to 1000 angstroms. Considering that the second reflective electrode layer 1342 generally needs to be formed of a reflective metal, such as one or both of a magnesium material and a silver material, and considering the isolation capability of the isolation structure, the thickness of the second reflective electrode layer 1342 needs to be less than or equal to 5000 angstroms. Considering the actual situation, a suitable thickness can be selected from 1500 angstroms to 3000 angstroms.

[0053] In one embodiment, the second auxiliary electrode layer 1343 can be formed of a transparent electrode layer, such as ITO or IZO material. At this time, the anode 131 and the anode auxiliary electrode 134 serve as the driving electrode on one side of the light-emitting unit 130, and the three-layer sandwich structure ITO / IZO, Ag / Mg, and ITO / IZO formed by the combination of the anode 131 and the anode auxiliary electrode 134 has a good driving ability for the light-emitting functional layer 132.

[0054] In another embodiment, the second auxiliary electrode layer 1343 may be formed of silver oxide or magnesium oxide. The material of the second auxiliary electrode layer 1343 mainly depends on the material of the second reflective electrode layer 1342 .

[0055] The second auxiliary electrode layer 1343 is formed by plasma treatment on the surface of the first reflective electrode layer 1312 away from the base substrate 110 to form a metal oxide film layer as the second auxiliary electrode layer 1343. When the second reflective electrode layer 1342 is a silver electrode, the second auxiliary electrode layer 1343 is a silver oxide electrode. When the second reflective electrode layer 1342 is a magnesium electrode, the second auxiliary electrode layer 1343 is a magnesium oxide electrode.

[0056] In this solution, after the second reflective electrode layer 1342 is vacuum-deposited, the surface of the second reflective electrode layer 1342 close to the cathode 133 can be oxidized by plasma treatment, thereby forming a thinner metal oxide layer on one side, and the metal oxide layer serves as the second auxiliary electrode layer 1343. Taking silver material as an example, the second reflective electrode is a silver electrode, and the second auxiliary electrode layer 1343 is silver oxide Ag2O. The work function of the silver oxide rises to 4.8eV to 5.1eV, which can better match the HOMO (5eV to 6eV) of the organic material in the light-emitting functional layer 132. In this way, the film interface performance between the anode 131 and the light-emitting functional layer 132 is improved while reducing the difficulty of the anode 131 process, thereby improving the efficiency and service life of the light-emitting unit 130.

[0057] The process sequence in this embodiment is basically the same as that in the previous embodiment, and the difference lies in the use of materials for the anode 131 and the anode auxiliary electrode 134. When the material of the second auxiliary electrode layer 1343 is an oxide of the material of the second reflective electrode layer 1342, the following steps are further included: after the process of the second reflective electrode layer 1342 in the anode auxiliary electrode 134 is completed, the surface of the second reflective electrode layer 1342 in the opening area 101 is subjected to plasma treatment, so that the surface of the second reflective electrode layer 1342 is oxidized to form a metal oxide as the second auxiliary electrode layer 1343.

[0058] Figure 8 is a schematic diagram of the steps of a method for manufacturing a display panel according to a second embodiment of the present application, Fig. 9is a schematic diagram of manufacturing a display panel according to the second embodiment of the present application, see Figure 8 and Fig. 9 As shown, the present application also discloses a method for manufacturing a display panel, comprising the steps of: S10: providing a substrate; S201: sequentially depositing a whole surface anode material layer and a whole surface barrier material layer on the substrate; S202: after etching the partition layer material layer at the non-opening area position to form a patterned partition layer, the anode material layer is etched using the partition layer to form a patterned anode, and a partition groove is formed at the etching position; S301: depositing a whole surface of a pixel definition layer material on the partition layer and filling the partition grooves; S302: patterning a pixel definition layer and forming a plurality of opening areas, wherein a radial width of the pixel definition layer is greater than a width of the partition groove; S303: etching the partition layer using the pixel definition layer as a protective layer, so that the pixel definition layer and the partition layer form a second partition structure; wherein, under the orthographic projection of the base substrate, the boundary of the partition layer is within the projection range of the pixel definition layer and has a preset distance from the projection boundary of the pixel definition layer; S40: depositing a conductive part material and a partition part material on the pixel definition layer in sequence, and forming a first partition structure after a patterning process; S501: depositing an anode auxiliary electrode material on the entire surface, and forming an anode auxiliary electrode in the opening area using the second partition structure; S502: Depositing a light-emitting functional layer material on the entire surface, and forming a light-emitting functional layer in the opening area using the first partition structure; S60: forming a cathode to form a plurality of light-emitting units in the plurality of opening regions; S70: forming a display panel.

[0059] In the present embodiment, by adding a partition layer 140 without the need for an additional photomask, on the one hand, the etching protection of the anode 131 is achieved, and a second partition structure 141 is formed to cooperate with the first partition structure 122 to respectively achieve the isolation of the anode auxiliary electrode 134 and the light-emitting functional layer 132, thereby improving the overall yield of the display panel 100 by optimizing the process.

[0060] When the light-emitting units 130 are of different colors, the above steps S501 to S60 can be repeated. Taking the red light-emitting unit 130 as an example, after completing the process of the first partition structure 122, the anode auxiliary electrode 134 is vacuum-deposited in the opening area 101 where the red light-emitting unit 130 is located, referred to as the red sub-pixel area, and the multiple film layers in the light-emitting functional layer 132 are vacuum-deposited in sequence, and finally the cathode 133 is deposited, thereby realizing the process of the red light-emitting unit 130. After completing the process of the red light-emitting unit 130, due to the maskless evaporation technology, the green sub-pixel and the blue sub-pixel areas will form red light-emitting units 130 respectively. Therefore, it is also necessary to remove the redundant materials in this area. The cathode 133, the light-emitting functional layer 132, and the anode auxiliary electrode 134 of the green sub-pixel and the blue sub-pixel can be removed by forming an etching protection layer, such as an inorganic encapsulation layer, at the position of the red sub-pixel through a patterned photolithography process. After completing the above process, repeat the process of forming a green light-emitting unit 130 in the green sub-pixel area, removing the green light-emitting unit 130 in other areas, and finally forming a blue light-emitting unit 130, then use the encapsulation layer to encapsulate the light-emitting unit 130, and finally form other film layers to form the display panel 100.

[0061] Fig.10 is a schematic diagram of the display device of the present application, see Fig.10 As shown, the present application further discloses a display device, wherein the display device 200 includes a driving circuit 210 and the display panel 100 in any of the above embodiments, wherein the driving circuit 210 is used to drive the display panel 100 to display.

[0062] It should be noted that the inventive concept of the present application can form a large number of embodiments, but the length of the application document is limited and it is impossible to list them one by one. Therefore, under the premise of no conflict, the embodiments or technical features described above can be arbitrarily combined to form new embodiments. After the embodiments or technical features are combined, the original technical effects will be enhanced.

[0063] The above content is a further detailed description of the present application in combination with specific optional implementation methods, and it cannot be determined that the specific implementation of the present application is limited to these descriptions. For ordinary technicians in the technical field to which the present application belongs, several simple deductions or substitutions can be made without departing from the concept of the present application, which should be deemed to fall within the scope of protection of the present application.

Claims

1. A display panel, comprising a base substrate, a pixel definition layer and a light-emitting unit, wherein the pixel definition layer is disposed on the base substrate and has a plurality of opening areas, and the light-emitting unit is disposed on the base substrate and is located in the opening areas; characterized in that: The light-emitting unit comprises an anode, a light-emitting functional layer and a cathode, wherein the anode is arranged on the substrate, the light-emitting functional layer is arranged on the anode, and the cathode is arranged on the light-emitting functional layer; The light-emitting unit further includes an anode auxiliary electrode, which is disposed on the anode and the light-emitting functional layer, and is formed of one or more of metal, metal alloy, or metal oxide; The display panel further includes a first partition structure, the first partition structure is arranged on the pixel definition layer, the first partition structure includes a conductive portion and a partition portion, the partition portion is arranged on the conductive portion, and the radial width of the partition portion is greater than the radial width of the conductive portion; The first partition structure is used to partition the anode auxiliary electrode and / or the light-emitting functional layer of two adjacent light-emitting units when the anode auxiliary electrode and the light-emitting functional layer are deposited on the entire surface.

2. The display panel according to claim 1, characterized in that: The first partition structure is used to partition the anode auxiliary electrode and the light-emitting functional layer of two adjacent light-emitting units when the anode auxiliary electrode and the light-emitting functional layer are deposited on the entire surface; The anode auxiliary electrode and the light-emitting functional layer are not connected to the conductive part respectively; The cathode is connected to the conductive portion of the adjacent first partition structure.

3. The display panel according to claim 1, characterized in that: The display panel further includes a second partition structure, wherein the second partition structure is disposed under the first partition structure; The second partition structure is used to partition the anode auxiliary electrodes of two adjacent light-emitting units when the anode auxiliary electrode is deposited on the entire surface; The first partition structure is used to partition the light-emitting functional layers of two adjacent light-emitting units when the light-emitting functional layer is deposited on the entire surface; The conductive portion of the first partition structure is also used to connect the cathodes of two adjacent light-emitting units.

4. The display panel according to claim 3, characterized in that: The display panel further comprises a partition layer, which is arranged under the pixel definition layer and located on the anode and directly in contact with the anode; Under the orthographic projection of the base substrate, the boundary of the partition layer is within the projection range of the pixel definition layer and has a preset distance from the projection boundary of the pixel definition layer, and the pixel definition layer and the partition layer form a second partition structure; The isolation layer is also used to protect the anode during the patterning process of the anode.

5. The display panel according to claim 4, characterized in that: The isolation layer is formed of metal or metal alloy material, and the isolation layer and the anode are formed of different materials; The preset distance is greater than or equal to 5000 angstroms and less than or equal to 50000 angstroms, and the thickness of the isolation layer is greater than or equal to 100 angstroms to 10000 angstroms.

6. The display panel according to claim 4, characterized in that: The anode comprises a first transparent electrode layer, a first reflective electrode layer and a second transparent electrode layer, wherein the first reflective electrode layer is arranged between the first transparent electrode layer and the second transparent electrode layer; The first reflective electrode layer is formed of a reflective metal material; Wherein, the anode auxiliary electrode comprises a first auxiliary electrode layer, and the first auxiliary electrode layer is arranged on the second transparent electrode layer and directly contacts the second transparent electrode layer; Wherein, the thickness of the first auxiliary electrode layer is between 10 angstroms and 300 angstroms; The second partition structure is used to separate the first auxiliary electrode layers of two adjacent light-emitting units; Wherein, under the orthographic projection of the base substrate, the projection of the anode auxiliary electrode is within the projection range of the anode.

7. The display panel according to claim 4, characterized in that: The anode includes a first electrode layer, and the first electrode layer is formed of one or more of metal, metal alloy or metal oxide; The anode auxiliary electrode comprises a second reflective electrode layer and a second auxiliary electrode layer, the second reflective electrode layer is formed of a silver material or a silver alloy material, and the second reflective electrode layer is arranged on the anode and directly contacts the anode; The second auxiliary electrode layer is formed of metal oxide; the second auxiliary electrode layer is disposed on the second reflective electrode layer and directly contacts the second reflective electrode layer; The second partition structure is used to separate the second reflective electrode layers of two adjacent light-emitting units; Wherein, the thickness of the second reflective electrode layer is between 1000 angstroms and 5000 angstroms; Wherein, the second auxiliary electrode layer is formed by plasma processing on the surface of the first reflective electrode layer away from the base substrate to form a metal oxide film layer as the second auxiliary electrode layer.

8. A method for manufacturing a display panel, characterized in that: Includes steps: Providing a substrate; Depositing and patterning an anode on a substrate; Depositing and patterning to form a pixel definition layer, and forming a plurality of opening areas; Depositing a conductive part material and a partition part material on the pixel definition layer in sequence, and forming a first partition structure after a patterning process; Depositing an anode auxiliary electrode material and a light-emitting functional layer material on the entire surface in sequence, and forming an anode auxiliary electrode and a light-emitting functional layer in the opening area by using the first partition structure; forming a cathode to form a plurality of light-emitting units in the plurality of opening regions; A display panel is formed.

9. The method for manufacturing a display panel according to claim 8, characterized in that: The step of depositing and patterning an anode on a substrate includes: Depositing an entire anode material layer and an entire barrier layer material layer in sequence on the substrate; After etching the partition layer material layer at the non-opening area position to form a patterned partition layer, the anode material layer is etched using the partition layer to form a patterned anode, and a partition groove is formed at the etching position; The step of depositing and patterning a pixel definition layer and forming a plurality of opening areas comprises: Depositing a whole surface of pixel definition layer material on the partition layer and filling the partition grooves; Patterning a pixel definition layer and forming a plurality of opening areas, wherein a radial width of the pixel definition layer is greater than a width of the partition groove; Using the pixel definition layer as a protective layer, etching the partition layer, so that the pixel definition layer and the partition layer form a second partition structure; Wherein, under the orthographic projection of the base substrate, the boundary of the isolation layer is within the projection range of the pixel definition layer and has a preset distance from the projection boundary of the pixel definition layer; The step of sequentially depositing the anode auxiliary electrode material and the light-emitting functional layer material on the entire surface, and using the first partition structure to form the anode auxiliary electrode and the light-emitting functional layer in the opening area includes: Depositing an anode auxiliary electrode material on the entire surface, and forming an anode auxiliary electrode in the opening area using the second partition structure; The light-emitting functional layer material is deposited on the entire surface, and the light-emitting functional layer is formed in the opening area by using the first partition structure.

10. A display device, characterized in that: It comprises a driving circuit and the display panel according to any one of claims 1 to 7, wherein the driving circuit is used to drive the display panel to display.

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