LED lamp bead and preparation method thereof, display screen

Abstract

The application discloses an LED lamp bead and a preparation method and a display screen thereof, and relates to the field of semiconductor photoelectric devices. The LED lamp bead comprises a rectangular substrate, a front face pattern area, a first light emitting unit and a first encapsulation glue layer arranged on the front face of the substrate, and a back face pattern area arranged on the back face of the substrate. The front face pattern area comprises a first electric connection area, a second electric connection area, a third electric connection area, a fourth electric connection area, a first die bonding area, a second die bonding area and a third die bonding area; the first electric connection area, the first die bonding area, the fourth electric connection area, the second die bonding area and the second electric connection area are arranged along a first diagonal line in sequence; the third electric connection area, the third die bonding area and the fourth electric connection area are arranged along a second diagonal line in sequence; the back face pattern area comprises a first pin area, a second pin area, a third pin area and a fourth pin area; and the first encapsulation glue layer wraps the front face pattern area and the light emitting chip. The application can improve the yield of products and can be applied to various driving modes.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor optoelectronic devices, in particular to an LED lamp bead, a preparation method thereof and a display screen. BACKGROUND

[0002] The existing MIP LED device adopts a flat BT substrate as a support, the substrate is divided into a front surface circuit, a back surface circuit and a base material, the front surface circuit is used for binding a light emitting chip and realizing electrical interconnection, the back surface circuit is used for welding with an LED display screen module PCB, and the front surface and the back surface circuit realize connection conduction through a through hole. When preparing, the LED chip is fixed on the front surface circuit, and then a lamp bead capable of emitting RGB three primary color lights is formed after molding and cutting. The existing lamp bead chip layout is a RGB vertical column arrangement layout, which is easy to cause silver glue or insulating glue to be thrown, which may cause short circuit or the glue to be thrown to a soldering position to cause poor welding and the like. On the other hand, with the rapid changes in the display screen market technology, virtual pixel driving modes, diamond arrangement driving modes and the like have appeared, and the conventional lamp bead can only be driven by a single chip in a single lamp bead or three chips together in structure, and if virtual driving is performed, the display pixel will be greatly reduced, which is difficult to meet the use requirements. SUMMARY

[0003] The technical problem to be solved by the present application is to provide an LED lamp bead and a preparation method thereof, which have a high yield and can be suitable for various driving modes to meet the use requirements in various occasions.

[0004] The technical problem to be solved by the present application is to provide an LED lamp bead and a preparation method thereof, which have a high yield and can be suitable for various driving modes to meet the use requirements in various occasions.

[0005] In order to solve the above problems, the present application discloses an LED lamp bead, which comprises:

[0006] a rectangular substrate;

[0007] a front surface pattern area arranged on the front surface of the rectangular substrate, the front surface pattern area comprising a die bonding area and an electrical connection area; the electrical connection area comprises a first electrical connection area, a second electrical connection area, a third electrical connection area and a fourth electrical connection area, and the die bonding area comprises a first die bonding area, a second die bonding area and a third die bonding area; the first electrical connection area, the first die bonding area, the fourth electrical connection area, the second die bonding area and the second electrical connection area are arranged in sequence along a first diagonal line of the rectangular substrate; the third electrical connection area, the third die bonding area and the fourth electrical connection area are arranged in sequence along a second diagonal line of the rectangular substrate;

[0008] The back surface pattern area includes a first pin area, a second pin area, a third pin area and a fourth pin area, which are respectively arranged corresponding to the first electrical connection area, the second electrical connection area, the third electrical connection area and the fourth electrical connection area;

[0009] The first light emitting unit includes a blue light LED chip, a red light LED chip and a green light LED chip, and is fixed to the die bonding area and forms electrical connection with the electrical connection area; and

[0010] The first encapsulation glue layer is arranged on the front surface of the rectangular substrate and wraps the front surface pattern area and the first light emitting unit.

[0011] As an improvement of the above technical solution, the second light emitting unit and the second encapsulation glue layer are further included; the second encapsulation glue layer is arranged between the first encapsulation glue layer and the rectangular substrate, and wraps the second light emitting unit;

[0012] The die bonding area further includes a fourth die bonding area for fixing the second light emitting unit, the electrical connection area further includes a fifth electrical connection area for forming electrical connection with the second light emitting unit, and the back surface pattern area further includes a fifth pin area arranged corresponding to the fifth electrical connection area.

[0013] As an improvement of the above technical solution, the second light emitting unit is a blue light LED chip, and the second encapsulation glue layer is a yellow fluorescent powder layer, so that the second light emitting unit emits white light.

[0014] As an improvement of the above technical solution, a bowl cup is further included, which is arranged around the second light emitting unit, and the second encapsulation glue layer is filled in the bowl cup;

[0015] The height of the bowl cup is greater than or equal to 250 microns.

[0016] As an improvement of the above technical solution, the rectangular substrate includes at least three first through holes and at least one second through hole, the first through holes are arranged in the corner area of the rectangular substrate, and the second through hole is arranged in the middle of the rectangular substrate.

[0017] The first electrical connection area, the second electrical connection area and the third electrical connection area form electrical connection with the first pin area, the second pin area and the third pin area respectively through the conductive medium arranged in the first through hole;

[0018] The fourth electrical connection area is electrically connected with the fourth pin area through the conductive medium arranged in the second through hole.

[0019] As an improvement of the above technical solution, the first die bonding area, the second die bonding area, the third die bonding area and the fourth electrical connection area are electrically connected through a connecting line.

[0020] An electrode of the first light emitting unit is electrically connected with the electric connection area, and the other electrode is electrically connected with the die bonding area.

[0021] As an improvement of the above technical solution, the rectangular substrate comprises at least four first through holes penetrating through the rectangular substrate, the first through holes are arranged at the corner regions of the rectangular substrate; the first electric connection area, the second electric connection area, the third electric connection area and the fifth electric connection area are respectively electrically connected with the first pin area, the second pin area, the third pin area and the fifth pin area through the conductive medium arranged in the first through hole; and / or

[0022] The fourth die bonding area is electrically connected with the fourth electric connection area through a connecting line; one electrode of the second light emitting unit is electrically connected with the fifth electric connection area, and the other electrode is electrically connected with the fourth die bonding area.

[0023] Correspondingly, the application also discloses a preparation method of the LED lamp bead.

[0024] S1, providing a rectangular substrate;

[0025] S2, forming a front surface pattern area on the front surface of the rectangular substrate and a back surface pattern area on the back surface; the front surface pattern area comprises a die bonding area and an electric connection area; the electric connection area comprises a first electric connection area, a second electric connection area, a third electric connection area and a fourth electric connection area, and the die bonding area comprises a first die bonding area, a second die bonding area and a third die bonding area; the first electric connection area, the first die bonding area, the fourth electric connection area, the second die bonding area and the second electric connection area are arranged in sequence along a first diagonal line of the rectangular substrate; the third electric connection area, the third die bonding area and the fourth electric connection area are arranged in sequence along a second diagonal line of the rectangular substrate; the back surface pattern area comprises a first pin area, a second pin area, a third pin area and a fourth pin area, which are respectively arranged corresponding to the first electric connection area, the second electric connection area, the third electric connection area and the fourth electric connection area;

[0026] S3, fixing the first light emitting unit on the die bonding area and forming an electric connection with the electric connection area;

[0027] S4, forming a first encapsulation adhesive layer on the front surface of the rectangular substrate.

[0028] Correspondingly, the application also discloses a display screen comprising the above LED lamp bead.

[0029] As an improvement of the above technical solution, it comprises a PCB board, LED lamp beads arranged in an array on the PCB board, and a protective adhesive layer covering the LED lamp beads.

[0030] The application has the following beneficial effects:

[0031] 1. In an embodiment of the present application, in the LED lamp bead, the first electrical connection area, the first die bonding area, the fourth electrical connection area, the second die bonding area and the second electrical connection area in the front pattern are arranged along the first diagonal line of the rectangular substrate in sequence; the third electrical connection area, the third die bonding area and the fourth electrical connection area are arranged along the second diagonal line of the rectangular substrate in sequence; that is, the first die bonding area, the second die bonding area and the third die bonding area are arranged close to the four corners of the rectangular substrate, and the distance between them is greatly increased compared with the traditional one-dimensional arrangement. Therefore, based on this arrangement, even if there is glue throwing during the later fixing of the blue light LED chip, the red light LED chip and the green light LED chip, it is not easy to cause short circuit or poor welding, which effectively improves the manufacturing yield. In addition, based on this arrangement, each LED chip is arranged close to the four corners of the rectangular substrate, which also lays a good foundation for subsequent driving in multiple ways.

[0032] 2. In an embodiment of the present application, the LED lamp bead further comprises a fourth die bonding area and a fifth electrical connection area on the rectangular substrate, and a second light emitting unit is fixed in the fourth die bonding area, which can emit white light and can be used as a light supplement to improve the display brightness of the display screen and enrich the application scenarios.

[0033] 3. In an embodiment of the present application, the LED lamp bead comprises five pin areas on the back surface of the rectangular substrate, which can improve the product thrust during the subsequent welding process, prevent the lamp from being knocked, and further improve the heat dissipation performance of the packaging unit. BRIEF DESCRIPTION OF DRAWINGS

[0034] Figure 1 is a front structure schematic diagram of the LED lamp bead in an embodiment of the present application;

[0035] Figure 2 is a back structure schematic diagram of the LED lamp bead in an embodiment of the present application;

[0036] Figure 3 is a cross-sectional structure schematic diagram of the LED lamp bead in an embodiment of the present application (cut along the first diagonal line);

[0037] Figure 4 is a driving mode principle schematic diagram of the display screen in an embodiment of the present application;

[0038] Figure 5 is a driving mode principle schematic diagram of the display screen in another embodiment of the present application;

[0039] In the figure, 1 is a rectangular substrate, 11 is a die bonding area, 111 is a first die bonding area, 112 is a second die bonding area, 113 is a third die bonding area, 114 is a fourth die bonding area, 12 is an electrical connection area, 121 is a first electrical connection area, 122 is a second electrical connection area, 123 is a third electrical connection area, 124 is a fourth electrical connection area, 125 is a fifth electrical connection area, 13 is a pin area, 131 is a first pin area, 132 is a second pin area, 133 is a third pin area, 134 is a fourth pin area, 135 is a fifth pin area, 14 is a through hole, 141 is a first through hole, 142 is a second through hole, 15 is a first diagonal line, 16 is a second diagonal line, 17 is a connecting line; 2 is a first light emitting unit, 21 is a blue LED chip, 22 is a red LED chip, 23 is a green LED chip, 3 is a first encapsulation adhesive layer, 4 is a second light emitting unit, 5 is a second encapsulation adhesive layer, 6 is a bowl cup, and 7 is a bonding wire. DETAILED DESCRIPTION

[0040] In order to make the purpose, technical scheme and advantages of the present application more clear, the present application is described in further detail below.

[0041] Reference Figures 1-3 In an embodiment of the present application, an LED lamp bead is provided, which comprises a rectangular substrate 1, a front face pattern area, a first light emitting unit 2 and a first encapsulation adhesive layer 3 arranged on the front face of the rectangular substrate 1, and a back face pattern area arranged on the back face of the rectangular substrate 1.

[0042] The rectangular substrate 1 is an insulating substrate, which can be a PCB board or a BT board, but is not limited thereto. The rectangular substrate 1 can be a square, a rectangle or a rectangle with chamfered corners, but is not limited thereto.

[0043] The front face pattern area comprises a die bonding area 11 and an electrical connection area 12, the die bonding area 11 is used for fixing the first light emitting unit 2 (i.e. various LED chips), and the electrical connection area 12 is used for forming electrical connection with the first light emitting unit 2. Specifically, each LED chip can be provided with two electrical connection areas 12 to respectively electrically connect the positive and negative electrodes of the LED chip, but is not limited thereto. Preferably, in an embodiment, one electrode of the LED chip is electrically connected with the die bonding area 11, and the other electrode is electrically connected with the electrical connection area 12. Based on the above arrangement, the area of the die bonding area 11 can be expanded, and the heat dissipation performance is improved.

[0044] Specifically, the plurality of die bonding areas 11 are insulated or electrically connected with each other, preferably, the plurality of die bonding areas 11 are electrically connected, based on this arrangement, one can make the plurality of LED chips have a common positive or negative electrode, simplify the structure of the front pattern area and the back pattern area, and two can improve the heat dissipation area and optimize the reliability of the LED lamp bead. Specifically, the plurality of electrically connected areas 12 are insulated or electrically connected with each other to achieve separate driving of the plurality of LED chips, thereby displaying different colors. Specifically, the electrically connected areas 12 and the die bonding areas 11 are insulated from each other to prevent short circuit of the LED chips. Among them, the LED chips can be electrically connected with the die bonding areas 11 / electrically connected areas 12 through bonding wires 7 or conductive bumps, but not limited thereto.

[0045] Among them, the back pattern area includes a pin area 13, which is arranged one by one with the die bonding area 11 and / or the electrically connected area 12, and forms an electrical connection. Specifically, the die bonding area 11 and / or the electrically connected area 12 can be electrically connected with the pin area 13 through a conductive medium in the through hole 14 arranged on the rectangular substrate 1, but not limited thereto. The pin area 13 is used to pass current to light up the LED lamp bead.

[0046] Among them, the die bonding area 11, the electrically connected area 12, and the pin area 13 are thin layers that can conduct electricity and are arranged on the surface of the rectangular substrate 1, for example, they can be copper foils formed by pressing, or conductive thin layers formed by screen printing, stamping, electroplating, etc., but not limited thereto. Preferably, in one embodiment, the die bonding area 11, the electrically connected area 12, and the pin area 13 are copper foils, which can form specific patterns through pressing and etching processes.

[0047] Specifically, in one embodiment, the die bonding area 11 includes a first die bonding area 111, a second die bonding area 112, and a third die bonding area 113 to fix the RGB three-color LED chips respectively. The electrically connected area 12 includes a first electrically connected area 121, a second electrically connected area 122, a third electrically connected area 123, and a fourth electrically connected area 124. The first electrically connected area 121, the first die bonding area 111, the fourth electrically connected area 124, the second die bonding area 112, and the second electrically connected area 122 are arranged along the first diagonal line 15 of the rectangular substrate 1 in sequence; the third electrically connected area 123, the third die bonding area 113, and the fourth electrically connected area 124 are arranged along the second diagonal line 16 of the rectangular substrate 1 in sequence; that is, the first die bonding area 111, the second die bonding area 112, and the third die bonding area 113 are arranged close to the four corners of the rectangular substrate 1, and the distance between them is greatly increased compared with the traditional one-word arrangement. Therefore, based on this arrangement, even if there is glue throwing when fixing the blue light LED chip 21, the red light LED chip 22, and the green light LED chip 23 later, it is not easy to cause short circuit or poor welding, which effectively improves the manufacturing yield. In addition, based on this arrangement, each LED chip is arranged close to the four corners of the rectangular substrate 1, which also lays a good foundation for subsequent driving in multiple ways.

[0048] Specifically, based on this embodiment, the first die bonding area 111, the second die bonding area 112, and the third die bonding area 113 can be electrically connected or electrically insulated with each other, but are not limited thereto. Preferably, in an embodiment, the first die bonding area 111, the second die bonding area 112, and the third die bonding area 113 are connected with the fourth electrical connection area 124 through the connecting line 17, which makes the plurality of LED chips achieve parallel connection through one electrical connection area 12, simplifies the pattern, and makes the heat generated by the LED chips quickly distributed to each position of the rectangular substrate 1 through the high-thermal-conductivity metal thin layer (the first die bonding area 111, the second die bonding area 112, the third die bonding area 113, and the fourth electrical connection area 124), prevents excessive concentration of thermal stress to cause cracks such as water vapor, damages the LED lamp bead, and further improves the reliability of the LED lamp bead.

[0049] Specifically, in an embodiment, the first light emitting unit 2 includes a blue light LED chip 21, a red light LED chip 22, and a green light LED chip 23, which can be fixed in any die bonding area 11 and form electrical connection with the adjacent electrical connection area 12. For example, in an embodiment, the red light LED chip 22 is fixed in the first die bonding area 111, the negative electrode of which is bonded with the first die bonding area 111 through conductive glue, and the positive electrode is connected with the first electrical connection area 121 through the soldering line. The blue light LED chip 21 is fixed in the second die bonding area 112 through the insulating glue, the negative electrode of which is electrically connected with the second die bonding area 112 through the bonding line 7, and the positive electrode is electrically connected with the second electrical connection area 122 through the bonding line 7. The green light LED chip 23 is fixed in the third die bonding area 113 through the insulating glue, the negative electrode of which is electrically connected with the third die bonding area 113 through the bonding line 7, and the positive electrode is electrically connected with the third electrical connection area 123 through the bonding line 7. At the same time, the first die bonding area 111, the second die bonding area 112, and the third die bonding area 113 are electrically connected with the fourth electrical connection area 124 to make the three LED chips have a common negative electrode.

[0050] Specifically, in one embodiment, the back graphic area includes a first pin area 131, a second pin area 132, a third pin area 133, and a fourth pin area 134, which are respectively arranged one-to-one with the first electrical connection area 121, the second electrical connection area 122, the third electrical connection area 123, and the fourth electrical connection area 124. Specifically, the first electrical connection area 121, the second electrical connection area 122, the third electrical connection area 123, and the fourth electrical connection area 124 can be electrically connected with the first pin area 131, the second pin area 132, the third pin area 133, and the fourth pin area 134 through a conductive medium arranged in the through hole 14 on the rectangular substrate 1, which can be arranged in the corresponding electrical connection area 12, but is not limited thereto. Preferably, in one embodiment, the rectangular substrate 1 includes at least one first through hole 141 and at least one second through hole 142 penetrating the rectangular substrate 1, the first through hole 141 is arranged at the corner area of the rectangular substrate 1, and the second through hole 142 is arranged at the middle part of the rectangular substrate 1; the first electrical connection area 121, the second electrical connection area 122, and the third electrical connection area 123 are respectively electrically connected with the first pin area 131, the second pin area 132, and the third pin area 133 through a conductive medium arranged in the first through hole 141; and the fourth electrical connection area 124 is electrically connected with the fourth pin area 134 through a conductive medium arranged in the second through hole 142. By arranging the first through hole 141 at the corner area of the rectangular substrate 1, on the one hand, a plurality of rectangular substrates 1 can share one first through hole 141, simplifying the preparation process and reducing the aperture of the first through hole 141, so that the volume of the LED lamp bead is smaller and the display precision is improved. On the other hand, the distance between the through hole 14 and the die bonding area 11 is increased, avoiding glue splashing to the area where the through hole 14 is located during die bonding, improving the yield and the reliability of the LED lamp bead.

[0051] Preferably, in one embodiment, the LED lamp bead further includes a second light emitting unit 4 and a second encapsulation glue layer 5; the second encapsulation glue layer 5 is arranged between the first encapsulation glue layer 3 and the rectangular substrate 1 and wraps the second light emitting unit 4; the die bonding area 11 further includes a fourth die bonding area 114 for fixing the second light emitting unit 4, the electrical connection area 12 further includes a fifth electrical connection area 125 for forming electrical connection with the second light emitting unit 4, and the back graphic area further includes a fifth pin area 135 arranged corresponding to the fifth electrical connection area 125. The second light emitting unit 4 cooperates with the second encapsulation glue layer 5 to emit white light, which can be used as supplementary light to improve the display brightness of the display screen and enrich the application scenarios. In addition, based on this embodiment, five pin areas can be formed on the back of the rectangular substrate 1, which can improve the product thrust in the subsequent soldering process, prevent the lamp from being knocked, and further improve the heat dissipation performance of the encapsulation unit. It should be noted that the LED encapsulation unit for the display screen needs to be soldered to the PCB board subsequently. In the traditional four-pin structure, the pin spacing is large, the thrust of the LED lamp bead is insufficient, and the lamp is easily knocked. The number of pin areas 13 is increased in the present application, which can improve the product thrust.

[0052] Specifically, in one embodiment, the second light emitting unit 4 can be a blue LED chip, and the second encapsulation glue layer 5 can be a yellow phosphor layer; in another embodiment, the second light emitting unit 4 is a violet LED chip, and the second encapsulation layer is a RGB three-wavelength phosphor, but is not limited thereto.

[0053] Specifically, based on this embodiment, a bowl cup 6 is further arranged around the second light emitting unit 4 to form the second encapsulation glue layer 5 by dispensing and curing. Specifically, the bowl cup 6 can be formed by a printing-etching process, but is not limited thereto. The height of the bowl cup 6 is ≥ 250 μm, and is preferably 280 μm to 500 μm.

[0054] Specifically, based on this embodiment, the rectangular substrate 1 includes four first through holes 141 penetrating the rectangular substrate 1, and the first through holes 141 are arranged at the corner regions of the rectangular substrate 1; the first electrical connection region 121, the second electrical connection region 122, the third electrical connection region 123, and the fifth electrical connection region 125 are electrically connected to the first pin region 131, the second pin region 132, the third pin region 133, and the fifth pin region 135, respectively, through a conductive medium arranged in the first through hole 141; the fourth die bonding region 114 is electrically connected to the fourth electrical connection region 124 through a connecting line 17; one electrode of the second light emitting unit 4 is electrically connected to the fifth electrical connection region 125, and the other electrode is electrically connected to the fourth die bonding region 114.

[0055] Correspondingly, the application further discloses a preparation method of the LED lamp bead, which includes the following steps:

[0056] S1, providing a rectangular substrate 1;

[0057] S2, forming a front surface pattern region on the front surface of the rectangular substrate 1 and forming a back surface pattern region on the back surface of the rectangular substrate 1;

[0058] The front surface pattern region or the back surface pattern region can be formed by screen printing, stamping, electroplating or the like, but is not limited thereto. Preferably, in one embodiment, a copper foil is first laminated on the surface of the rectangular substrate 1, and then etched to form the back surface circuit pattern.

[0059] Preferably, in one embodiment, when the LED lamp bead includes the second light emitting unit 4, this step further includes the steps of screen printing and exposure etching to form the bowl cup 6.

[0060] S3, fixing the first light emitting unit 2 to the die bonding region 11 and forming electrical connection with the electrical connection region 12;

[0061] Specifically, the first light emitting unit 2 can be fixed to the die bonding region 11 by insulating glue or conductive glue, but is not limited thereto.

[0062] Preferably, in one embodiment, when the LED bead includes a second light-emitting unit 4, this step further includes fixing the second light-emitting unit 4 to the fourth die-bonding region 114 and forming a first encapsulating adhesive layer 3.

[0063] S4. A first encapsulating adhesive layer 3 is formed on the front side of the rectangular substrate 1.

[0064] Accordingly, the present invention also discloses a display screen, which includes the aforementioned LED beads. Preferably, it further includes a PCB board and a protective adhesive layer, wherein a plurality of LED beads are arranged in an array on the PCB board, and the protective adhesive layer covers the LED beads. Furthermore, it should be noted that a predetermined distance is provided between the plurality of LED beads, and the protective adhesive layer covers the PCB board exposed by this distance.

[0065] The driving method of the LED beads based on this embodiment will be described below. See [link to documentation]. Figures 4-5 Taking a display screen that includes 6 groups of LED beads (one row per group, each group containing several LED beads) as an example, Figure 4 As shown, in driving mode one, the RGB (LED chips) in each LED bead are lit according to display requirements (red triangle), but the blue LED chips in the LED bead that emit white light are not lit. In driving mode two, the RGB (LED chips) in each LED bead are lit according to display requirements; simultaneously, all the blue LED chips in the LED bead that emit white light are lit, or a group of LED beads are lit at intervals, or one or more LED beads are lit at intervals, to improve the brightness of the display screen. For driving mode three, see [link to driving mode three]. Figure 5 Under good display conditions, the RGB (LED chips) in the first group of LED beads are lit normally. The RGB (LED chips) in the second and third groups of LED beads are driven by mutual borrowing (red triangle), but the blue LED chips in the LED beads that emit white light are not lit. This driving method can significantly reduce energy consumption, theoretically by 50%. In driving method four, while driving the RGB (LED chips) in the LED beads in driving method three, all the blue LED chips in the LED beads that emit white light can be lit, or a group of LED beads can be lit at a time, or one or more LED beads can be lit at a time, to improve the brightness of the display screen. In driving method five, only all or part of the blue LED chips in the LED beads that emit white light are lit. Based on this driving method, whiteboard writing (touchscreen) can be performed.

[0066] The above description is a preferred embodiment of the invention. It should be noted that, for those skilled in the art, several improvements and modifications can be made without departing from the principle of the invention, and these improvements and modifications are also considered to be within the scope of protection of the invention.

Claims

1. An LED lamp bead, characterized in that, Comprise: a rectangular substrate; a front surface pattern area provided on the front surface of the rectangular substrate, the front surface pattern area comprising a die bonding area and an electrical connection area; the electrical connection area comprising a first electrical connection area, a second electrical connection area, a third electrical connection area, a fourth electrical connection area and a fifth electrical connection area, and the die bonding area comprising a first die bonding area, a second die bonding area, a third die bonding area and a fourth die bonding area; the first electrical connection area, the first die bonding area, the fourth electrical connection area, the second die bonding area and the second electrical connection area are arranged along a first diagonal line of the rectangular substrate in sequence; the third electrical connection area, the third die bonding area and the fourth electrical connection area are arranged along a second diagonal line of the rectangular substrate in sequence; a back surface pattern area comprising a first pin area, a second pin area, a third pin area, a fourth pin area and a fifth pin area, which are respectively provided corresponding to the first electrical connection area, the second electrical connection area, the third electrical connection area, the fourth electrical connection area and the fifth electrical connection area; a first light emitting unit comprising a blue light LED chip, a red light LED chip and a green light LED chip, which is fixed to the die bonding area; one electrode of the first light emitting unit is electrically connected to the electrical connection area, and the other electrode is electrically connected to the die bonding area; a second light emitting unit; which is fixed to the fourth die bonding area; one electrode of the second light emitting unit is electrically connected to the fifth electrical connection area, and the other electrode is electrically connected to the fourth die bonding area; a first encapsulation adhesive layer provided on the front surface of the rectangular substrate and wrapping the front surface pattern area and the first light emitting unit; and a second encapsulation adhesive layer; the second encapsulation adhesive layer is provided between the first encapsulation adhesive layer and the rectangular substrate, and wraps the second light emitting unit; wherein the rectangular substrate comprises at least four first through holes and at least one second through hole penetrating through the rectangular substrate, the first through holes are provided in the corner regions of the rectangular substrate, and the second through hole is provided in the middle of the rectangular substrate; the first electrical connection area, the second electrical connection area, the third electrical connection area and the fifth electrical connection area are respectively electrically connected to the first pin area, the second pin area, the third pin area and the fifth pin area through a conductive medium provided in the first through hole; the fourth electrical connection area is electrically connected to the fourth pin area through a conductive medium provided in the second through hole; the first die bonding area, the second die bonding area and the third die bonding area are electrically connected to the fourth electrical connection area through a connecting line; the fourth die bonding area is electrically connected to the fourth electrical connection area through a connecting line.

2. The LED lamp of claim 1, wherein, The second light emitting unit is a blue light LED chip, and the second encapsulation adhesive layer is a yellow fluorescent powder layer, so that the second light emitting unit emits white light.

3. The LED lamp bead of claim 1 or 2, wherein, Further comprising a bowl cup provided around the second light emitting unit, and the second encapsulation adhesive layer is filled in the bowl cup; The height of the bowl cup is ≥250μm.

4. A method for manufacturing an LED lamp bead, for manufacturing the LED lamp bead according to any one of claims 1-3, characterized in that, Comprise the following steps: S1, providing a rectangular substrate; S2, forming a front surface pattern area on the front surface of the rectangular substrate and a back surface pattern area on the back surface; the front surface pattern area comprises a die bonding area and an electrical connection area; the electrical connection area comprises a first electrical connection area, a second electrical connection area, a third electrical connection area and a fourth electrical connection area, and the die bonding area comprises a first die bonding area, a second die bonding area and a third die bonding area; the first electrical connection area, the first die bonding area, the fourth electrical connection area, the second die bonding area and the second electrical connection area are arranged along a first diagonal line of the rectangular substrate in sequence; the third electrical connection area, the third die bonding area and the fourth electrical connection area are arranged along a second diagonal line of the rectangular substrate in sequence; the back surface pattern area comprises a first pin area, a second pin area, a third pin area and a fourth pin area, which are respectively arranged corresponding to the first electrical connection area, the second electrical connection area, the third electrical connection area and the fourth electrical connection area; S3, fixing a first light emitting unit on the die bonding area and forming an electrical connection with the electrical connection area; S4, forming a first encapsulation layer on the front surface of the rectangular substrate.

5. A display screen, characterized by The LED lamp bead comprises the LED lamp bead according to any one of claims 1-3.

6. The display screen of claim 5, wherein, The LED lamp bead comprises: A PCB board, LED lamp beads arranged in an array on the PCB board, and a protective layer covering the LED lamp beads.

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