Chip transfer method and display panel

Abstract

The present disclosure belongs to the field of display technology, and specifically relates to a chip transfer method and a display panel. The chip transfer method includes: providing N different types of magnetic chip transfer bodies and a drive substrate, forming a transfer layer on the drive substrate, the transfer layer including N different types of alignment grooves, the different types of alignment grooves being used to correspond to and match different types of chip transfer bodies, the alignment grooves and the chip transfer bodies corresponding to each other in a one-to-one relationship, and at least half of the chip transfer body being embedded in the alignment groove. The present disclosure places the chip transfer body at the edge of the drive substrate or the transfer layer, and applies a first magnetic field to the chip transfer body to drive the chip transfer body to move to the alignment groove corresponding thereto, thereby avoiding the complex process of precisely aligning the chip transfer body with the alignment groove point-to-point, reducing the difficulty of transferring the chip transfer body, and improving the transfer yield and efficiency of the chip transfer body.

Description

Technical Field

[0001] The present disclosure belongs to the field of display technology, and particularly relates to a chip transfer method and a display panel. Background Art

[0002] At present, in the field of display technology, it is necessary to grow a type of light-emitting chip on a growth substrate, and then align the growth substrate with the light-emitting chip and the driving substrate to realize the transfer of a type of light-emitting chip. When the growth substrate is used to transfer the light-emitting chip, the transfer of the light-emitting chip is subject to the production of the light-emitting chip, and the production transfer needs to be carried out continuously, resulting in low transfer efficiency. And during the transfer process, the light-emitting chip and the alignment groove on the driving substrate for accommodating the light-emitting chip need to be precisely positioned point to point, which has the problems of high difficulty in alignment, low transfer efficiency, and low transfer yield. In addition, when transferring multiple types of light-emitting chips, different types of light-emitting chips grown on different growth substrates need to be transferred in batches, so the driving substrate needs to be precisely positioned with different growth substrates multiple times, which will further reduce the transfer efficiency of the light-emitting chip. Summary of the Invention

[0003] The purpose of the present application is to provide a chip transfer method and a display panel, which can control the transfer of a chip transfer body through a magnetic field to increase the transfer rate of the chip transfer body.

[0004] The present disclosure provides a chip transfer method, the chip transfer method comprising:

[0005] Providing N different types of magnetic chip transfer bodies, wherein N is a positive integer greater than or equal to 2;

[0006] A drive substrate is provided, and a transfer layer is formed on the drive substrate. The transfer layer includes N different types of alignment grooves arranged in a horizontal direction. The different types of alignment grooves have different cross-sectional areas and are used to correspond to different types of chip transfer bodies. The alignment grooves and the chip transfer bodies correspond to each other in a one-to-one manner, and at least half of the chip transfer body is embedded in the alignment grooves.

[0007] Placing the chip transfer body at the edge of the driving substrate or at the edge of the transfer layer, and applying a first magnetic field to the chip transfer body to drive the chip transfer body to move to the corresponding alignment groove;

[0008] After the chip transfer body moves to the corresponding alignment groove, the chip transfer body is processed so as to be bound to the driving substrate.

[0009] In an exemplary embodiment of the present disclosure, different types of chip transfer bodies have different masses, wherein the mass of the chip transfer body is positively correlated with the cross-sectional area of ​​the corresponding alignment groove.

[0010] In an exemplary embodiment of the present disclosure, each of the alignment grooves is filled with a transfer liquid, and the density of the transfer liquid is less than the density of each type of the chip transfer body, wherein when the chip transfer body moves to the corresponding alignment groove, at least half of the height of the chip transfer body sinks into the transfer liquid.

[0011] In an exemplary embodiment of the present disclosure, the chip transfer body includes a light-emitting chip and a protective layer, wherein the light-emitting chip is wrapped in the protective layer; wherein,

[0012] After all the chip transfer bodies move to the corresponding alignment grooves, and before each chip transfer body is processed to be bonded to the driving substrate, the chip transfer method further includes: removing the transfer liquid in each alignment groove;

[0013] The step of processing the chip transfer bodies to bind them to the driving substrate includes: removing the protective layer wrapping the light-emitting chip in each chip transfer body, and then binding the light-emitting chip to the driving substrate.

[0014] In an exemplary embodiment of the present disclosure, the chip transfer body is a sphere, different types of chip transfer bodies have different spherical diameters, and the mass of the chip transfer body is positively correlated with the spherical diameter. The chip transfer method includes:

[0015] Different types of chip transfer bodies are placed simultaneously on the edge of the driving substrate or on the edge of the transfer layer, and a first magnetic field is applied to all the chip transfer bodies at the same time to drive each chip transfer body to roll until a corresponding matching chip transfer body is embedded in each alignment groove.

[0016] In an exemplary embodiment of the present disclosure, the chip transfer body is a sphere, and the sphere diameters of different types of chip transfer bodies are the same; wherein the chip transfer method includes:

[0017] First, all n-type chip transfer bodies are placed on the edge of the driving substrate or on the edge of the transfer layer, and a first magnetic field is applied to each of the n-type chip transfer bodies to drive the n-type chip transfer bodies to roll one by one to the corresponding matching alignment groove;

[0018] Then, all the n+1th type chip transfer bodies are placed on the edge of the driving substrate or on the edge of the transfer layer, and a first magnetic field is applied to each of the n+1th type chip transfer bodies to drive the n+1th type chip transfer bodies to roll one by one to the corresponding matching alignment groove;

[0019] The mass of the nth type of chip transfer body is less than the mass of the n+1th type of chip transfer body, and 1≤n<N, where n is a positive integer.

[0020] In an exemplary embodiment of the present disclosure, the chip transfer body is a sphere, and different types of chip transfer bodies have different spherical diameters. The transfer layer is a flat layer that entirely covers the drive substrate, and the chip transfer method includes:

[0021] First, all n-type chip transfer bodies are placed at the edge of the transfer layer, and a first magnetic field is applied to each of the n-type chip transfer bodies to drive the n-type chip transfer bodies to roll one by one to the corresponding alignment groove;

[0022] Then, all the n+1th type chip transfer bodies are placed at the edge of the transfer layer, and a first magnetic field is applied to each of the n+1th type chip transfer bodies to drive the n+1th type chip transfer bodies to roll one by one to the corresponding matching alignment groove;

[0023] The mass of the nth type of chip transfer body is less than the mass of the n+1th type of chip transfer body, and 1≤n<N, where n is a positive integer.

[0024] In an exemplary embodiment of the present disclosure, the chip transfer body is a sphere, and different types of chip transfer bodies have different spherical diameters;

[0025] The transfer layer includes N different types of transfer structures that are spaced apart in the horizontal direction, each type of transfer structure corresponding to a type of alignment groove, and the outer side surface of each transfer structure is inclined inward from bottom to top;

[0026] The cross-sectional area of ​​the alignment groove is positively correlated with the spherical diameter of the chip transfer body matched therewith, and the inclination angle of the outer side surface of the transfer structure is positively correlated with the cross-sectional area of ​​the alignment groove formed therewith.

[0027] In an exemplary embodiment of the present disclosure, in different types of transfer structures: the horizontal widths of the orthographic projections of the outer side surfaces on the driving substrate are equal, and the vertical heights of the outer side surfaces are unequal; and / or

[0028] The inclination angle of the outer side surface of the transfer structure is less than or equal to 60°; and / or

[0029] The chip transfer method includes: placing different types of chip transfer bodies on the edge of the driving substrate at the same time, and applying a first magnetic field to all the chip transfer bodies at the same time to drive each chip transfer body to roll until a corresponding matching chip transfer body is embedded in each alignment groove.

[0030] In an exemplary embodiment of the present disclosure, the chip transfer body includes a light-emitting chip and a protective layer, wherein the light-emitting chip is wrapped in the protective layer;

[0031] The alignment groove includes a first groove and a second groove arranged in a vertical direction and connected to each other, the second groove is located on a side of the first groove close to the driving substrate, the first groove is used to accommodate a chip transfer body corresponding to it, the orthographic projection of the end surface of the second groove away from the first groove on the driving substrate is located within the orthographic projection of the first groove on the driving substrate, and is used to accommodate the light-emitting chip with the protective layer removed; wherein,

[0032] The inner wall of the second groove is a vertical wall perpendicular to the driving substrate; or

[0033] The inner wall of the second groove is an inclined surface inclined relative to the vertical direction, and the inclined surface extends from bottom to top in a direction away from the center of the second groove.

[0034] In an exemplary embodiment of the present disclosure, the chip transfer body includes a light-emitting chip and a protective layer, wherein the light-emitting chip is wrapped in the protective layer; and the step of processing the chip transfer body to be bonded to the driving substrate includes:

[0035] Determining the positional relationship between the binding end surface of the light-emitting chip in the chip transfer body and the driving substrate;

[0036] When it is determined that the binding end surface of the light-emitting chip in the chip transfer body is in a non-corresponding matching relationship with the driving substrate, a second magnetic field is applied to the chip transfer body to drive the chip transfer body to rotate so that the binding end surface of the light-emitting chip in the chip transfer body is in a matching relationship with the driving substrate;

[0037] After determining that the binding end surface of the light-emitting chip in the chip transfer body is in a corresponding matching relationship with the driving substrate, removing the protective layer so that the light-emitting chip falls onto the driving substrate so that the binding end surface is in contact with the driving substrate;

[0038] The condition for the binding end surface of the light-emitting chip in the chip transfer body to be in a matching relationship with the driving substrate is that the binding end surface of the light-emitting chip in the chip transfer body is close to the driving substrate and parallel to the driving substrate.

[0039] The present disclosure provides a display panel, the display panel comprising at least:

[0040] Driver substrate;

[0041] A transfer layer is provided on the driving substrate, wherein the transfer layer includes N different types of alignment grooves arranged in a horizontal direction, and the cross-sectional areas of the alignment grooves of different types are different;

[0042] At least N different types of magnetic chip transfer bodies, each corresponding to the alignment groove, are provided. The chip transfer bodies are transferred to the corresponding alignment groove by the chip transfer method described above and are bound to the drive substrate.

[0043] This application has the following beneficial effects:

[0044] The present disclosure forms a variety of different types of alignment grooves on the driving substrate, and one type of alignment groove corresponds one-to-one to one type of chip transfer body. After the chip transfer body is placed on the edge of the driving substrate or the transfer layer, a first magnetic field is applied to the chip transfer body to move the chip transfer body to the corresponding matching alignment groove. The present disclosure utilizes the one-to-one correspondence between the chip transfer body and the alignment groove to improve the accuracy of the chip transfer body transfer. In addition, the present disclosure utilizes the first magnetic field to drive various types of chip transfer bodies to the corresponding matching alignment groove, avoiding the complex process of requiring point-to-point precise alignment between the chip transfer body and the alignment groove, reducing the difficulty of transferring the chip transfer body, and improving the transfer yield and transfer efficiency of the chip transfer body.

[0045] Other features and advantages of the present application will become apparent from the following detailed description, or may be learned in part by practice of the present application.

[0046] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] The accompanying drawings are incorporated into and constitute a part of the specification, illustrate embodiments consistent with the present disclosure, and together with the specification, serve to explain the principles of the present disclosure. Obviously, the drawings described below are only some embodiments of the present disclosure, and it is clear that those skilled in the art can derive other drawings based on these drawings without inventive effort.

[0048] Figure 1 Schematic diagram of the chip transfer method in the embodiment of the present disclosure.

[0049] Figure 2Schematic diagram of the cross-sectional structure of the chip transfer body in the embodiment of the present disclosure.

[0050] Figure 3 Schematic diagram of a top view of the display panel in an embodiment of the present disclosure.

[0051] Figure 3a for Figure 3 Flowchart for the production of the driving layer and transfer layer.

[0052] Figure 3b In the embodiment of the present disclosure, the chip transfer body is placed Figure 3 Schematic diagram of the structure on the transfer layer in .

[0053] Figure 3c The figure is a schematic cross-sectional structural diagram of adjusting the binding end face of the light-emitting chip to be in a corresponding matching relationship with the driving substrate in the embodiment of the present disclosure.

[0054] Figure 3d To remove Figure 3c Schematic diagram of the cross-sectional structure of the protective layer in the chip transfer body.

[0055] Figure 4 FIG. 4 is another schematic cross-sectional structure diagram of a display panel in an embodiment of the present disclosure.

[0056] Figure 4a for Figure 4 Flowchart for the production of the driving layer and transfer layer.

[0057] Figure 4b In the embodiment of the present disclosure, the chip transfer body is placed Figure 4 Schematic diagram of the structure on the transfer layer in .

[0058] Figure 4c This is another cross-sectional structural diagram of adjusting the binding end face of the light-emitting chip to be in a corresponding matching relationship with the driving substrate in the embodiment of the present disclosure.

[0059] Figure 4d To remove Figure 4c Schematic diagram of the cross-sectional structure of the protective layer in the chip transfer body.

[0060] Figure 4e Schematic diagram of a cross-sectional structure of the alignment groove in the embodiment of the present disclosure.

[0061] Figure 4f To remove Figure 4e Schematic diagram of the cross-sectional structure of the protective layer in the chip transfer body.

[0062] Figure 4g Schematic diagram of another cross-sectional structure of the alignment groove in the embodiment of the present disclosure.

[0063] Figure 5Schematic diagram of the cross-sectional structure of three different types of chip transfer bodies in the embodiments of the present disclosure.

[0064] Figure 6 Schematic diagram of the cross-sectional structure of the height of the transfer liquid discharged when the same chip transfer body is transferred to two different alignment grooves in the embodiment of the present disclosure.

[0065] Figure 7 Schematic diagram of the cross-sectional structure of a chip transfer body with a ball diameter of D1 transferred to three different types of alignment grooves in an embodiment of the present disclosure.

[0066] Figure 8 Schematic diagram of the cross-sectional structure of a chip transfer body with a ball diameter of D2 transferred to three different types of alignment grooves in an embodiment of the present disclosure.

[0067] Figure 9 Schematic diagram of the cross-sectional structure of a chip transfer body with a ball diameter of D3 transferred to three different types of alignment grooves in an embodiment of the present disclosure.

[0068] Figure 10 This is a schematic top view of the structure when each alignment groove is filled with transfer liquid in the embodiment of the present disclosure.

[0069] Figure 10a for Figure 10 Schematic diagram of the cross-sectional structure at AA'.

[0070] Figure 10b for Figure 10 Schematic diagram of the cross-sectional structure when corresponding matching chip transfer bodies are embedded in different types of alignment grooves.

[0071] Figure 10c For the general Figure 10b Schematic diagram of the cross-sectional structure in which the binding end face of the light-emitting chip is adjusted to be in a corresponding matching relationship with the driving substrate.

[0072] Figure 10d For the general Figure 10c Schematic diagram of the cross-sectional structure after the transfer liquid is removed.

[0073] Figure 10e To remove Figure 10d Schematic diagram of the cross-sectional structure after the protective layer.

[0074] Figure 11 Schematic diagram of the cross-sectional structure of three different types of transfer structures in the embodiments of the present disclosure.

[0075] Description of reference numerals:

[0076] 1. Display panel;

[0077] 11. driving substrate; 111. substrate; 112. driving layer;

[0078] 12. Transfer layer; 121. Alignment groove; 1211. First groove; 1212. Second groove; 122. Transfer structure; 122a. Transfer material;

[0079] 13. Chip transfer body; 131. Light-emitting chip; 1311. Main body; 1312. Connecting electrode; 132. Protective layer;

[0080] 14. Transfer fluid;

[0081] X, horizontal direction. DETAILED DESCRIPTION

[0082] Example embodiments will now be described more fully with reference to the accompanying drawings. However, example embodiments can be implemented in many forms and should not be construed as limited to the examples set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete and will fully convey the concepts of the example embodiments to those skilled in the art.

[0083] In addition, the described features, structures or characteristics may be combined in any suitable manner in one or more embodiments. In the following description, many specific details are provided to provide a full understanding of the embodiments of the present disclosure. However, those skilled in the art will appreciate that the technical solutions of the present disclosure can be practiced without one or more of the specific details, or other methods, components, devices, steps, etc. can be adopted. In other cases, well-known methods, devices, implementations or operations are not shown or described in detail to avoid blurring various aspects of the present disclosure.

[0084] The present disclosure is further described below in conjunction with the accompanying drawings and specific embodiments. It should be noted that the technical features involved in the various embodiments of the present disclosure described below can be combined with each other as long as they do not conflict with each other. The embodiments described below with reference to the accompanying drawings are exemplary and are intended to explain the present disclosure, and should not be construed as limiting the present disclosure.

[0085] Combine Figures 1 to 3b As shown, the present disclosure provides a chip transfer method, which includes:

[0086] S1. Provide N different types of magnetic chip transfer bodies 13, where N is a positive integer greater than or equal to 2.

[0087] S2. Provide a driving substrate 11 and form a transfer layer 12 on the driving substrate 11. The transfer layer 12 includes N different types of alignment grooves 121 arranged in the horizontal direction X. The different types of alignment grooves 121 have different cross-sectional areas and are used to correspond to different types of chip transfer bodies 13. The corresponding matching relationship between the alignment grooves 121 and the chip transfer bodies 13 is: the chip transfer bodies 13 and the alignment grooves 121 correspond one-to-one, and at least half of the chip transfer bodies 13 are embedded in the alignment grooves 121.

[0088] S3. Place the chip transfer body 13 on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and apply a first magnetic field to the chip transfer body 13 to drive the chip transfer body 13 to move to the corresponding alignment groove 121.

[0089] S4 , after the chip transfer body 13 moves to the corresponding alignment groove 121 , the chip transfer body 13 is processed to be bound to the driving substrate 11 .

[0090] It should be noted that if Figure 2 As shown, the chip transfer body 13 in the embodiment of the present disclosure may include a light-emitting chip 131 and a protective layer 132, with the light-emitting chip 131 encapsulated within the protective layer 132. The light-emitting chip 131 may include a main body 1311 and a connecting electrode 1312. The connecting electrode 1312 is magnetically conductive, and the movement of the light-emitting chip 131 can be controlled by applying a magnetic field to the chip transfer body 13. Furthermore, the connecting electrode 1312 is also electrically conductive, allowing current to be drawn through the connecting electrode 1312, thereby causing the light-emitting chip 131 to emit light.

[0091] Specifically, the chip transfer body 13 can be formed by placing different types of light-emitting chips 131 to be transferred in a specific liquid, mixing them to form a suspension, and then using microfluidics to solidify or gel the liquid surrounding the light-emitting chips 131 to form a protective layer 132 surrounding the light-emitting chips 131. The solidified chip transfer body 13 can be a sphere, but is not limited to this. The chip transfer body 13 can also have other shapes besides a sphere, depending on the actual situation.

[0092] The specific liquid forming the protective layer 132 can be a liquid with EUV (photolithography) curing or a microfluidic liquid. For example, the specific liquid forming the protective layer 132 in the embodiment of the present disclosure can be formed by gelling or curing sodium alginate and calcium ions. However, this is not limiting. The use of other specific liquids other than sodium alginate and calcium ions that do not corrode and cause chip failure to form the protective layer 132 is also included in the embodiments of the present disclosure.

[0093] After the light-emitting chip 131 is placed in a specific liquid, the temperature can be lowered to below the liquid's solidification temperature by physical means to solidify the liquid. The liquid solidifies at a temperature that does not damage the chip. The disclosed embodiment provides a protective layer 132 to protect the light-emitting chip 131, reducing or preventing damage to the light-emitting chip 131 during transfer, thereby reducing the probability of repairing the light-emitting chip 131.

[0094] like Figure 3 As shown in FIG4 , in the embodiment of the present disclosure, the driving substrate 11 may include a substrate 111 and a driving layer 112 .

[0095] Specifically, such as Figure 3a As shown in FIG4 a , a layer of metal material may be coated on the substrate 111 to form a driving layer 112 .

[0096] Furthermore, a layer of transfer material 122a can be coated on the side of the driving layer 112 facing away from the substrate 111 to form a transfer layer 12. The transfer layer 12 is exposed and developed to form N different types of alignment grooves 121 arranged in the horizontal direction X.

[0097] It should be noted that the horizontal direction X refers to the extending direction of the transfer layer 12 .

[0098] The driving layer 112 may include a plurality of driving electrodes, each corresponding to the alignment grooves 121. The orthographic projections of the driving electrodes on the transfer layer 12 are located within the alignment grooves 121. The portions of the driving electrodes connected to the connecting electrodes 1312 may be exposed within the alignment grooves 121. The light-emitting chip 131 obtains voltage from the driving electrodes via the connecting electrodes 1312 to emit light.

[0099] In the disclosed embodiment, the arrangement of different types of alignment grooves 121 on the transfer layer 12 can be: alignment grooves 121 of the same type are arranged alternately in the column direction, while alignment grooves 121 of different types are arranged alternately in the row direction. However, this is not limiting. Different types of alignment grooves 121 can be arranged regularly or irregularly on the transfer layer 12 according to actual circumstances. One type of alignment groove 121 can only correspond to one type of chip transfer body 13 to be transferred, and one alignment groove 121 can only correspond to one chip transfer body 13.

[0100] In the present disclosure, the transfer material 122a forming the transfer layer 12 can include a light-shielding material such as black resin, thereby providing the transfer layer 12 with light-shielding properties. When the light-emitting chips 131 are operating, the transfer layer 12 can block light from one light-emitting chip 131 to another light-emitting chip 131, thereby improving or preventing light mixing between adjacent light-emitting chips 131.

[0101] like Figures 3b to 4b As shown, after forming the transfer layer 12 and placing the chip transfer body 13 on the edge of the drive substrate 11 or on the edge of the transfer layer 12, a first magnetic field is applied to the chip transfer body 13. The first magnetic field can be a magnetic field in the horizontal direction X. All chip transfer bodies 13 placed on the edge of the drive substrate 11 or on the edge of the transfer layer 12 are magnetic and can move under the action of the first magnetic field until the chip transfer body 13 is embedded in the corresponding matching alignment groove 121.

[0102] It should be noted that after the chip transfer body 13 is transferred to the corresponding matching alignment groove 121, at least half of the height of the chip transfer body 13 is embedded in the corresponding matching alignment groove 121. Due to the restriction of the groove sidewalls of the alignment groove 121, the chip transfer body 13 embedded in the corresponding matching alignment groove 121 can no longer be separated from the alignment groove 121 under the action of the first magnetic field and continue to move on the transfer layer 12. In other words, after the chip transfer body 13 is transferred to the corresponding matching alignment groove 121, the chip transfer body 13 continues to stay in the alignment groove 121 under the action of the first magnetic field. Correspondingly, under the action of the first magnetic field, the chip transfer body 13 not embedded in the corresponding matching alignment groove 121 will continue to move on the transfer layer 12.

[0103] The chip transfer method in the embodiment of the present disclosure can completely separate the production and transfer of the light-emitting chip 131, thereby realizing large-scale parallel assembly. In addition, during the transfer process, the protective layer 132 can protect the light-emitting chip 131 to reduce or avoid the damage to the light-emitting chip 131 caused by collision and the occurrence of bad spots, thereby reducing the probability of repairing the light-emitting chip 131. The present disclosure sets different types of alignment grooves 121 corresponding to different types of chip transfer bodies 13. One type of alignment groove 121 can only match one type of chip transfer body 13. At the same time, the first magnetic field is used to drive the chip transfer body 13 into the corresponding matching alignment groove 121, thereby avoiding the complex process of the traditional chip transfer process of precisely aligning the light-emitting chip 131 with the alignment groove 121 to achieve the transfer of the light-emitting chip 131. This reduces the difficulty of transferring the light-emitting chip 131 and improves the transfer yield of the light-emitting chip 131 and the transfer efficiency of the light-emitting chip 131.

[0104] To improve the transfer efficiency of the light-emitting chips 131, the present disclosure can place a greater number of chip transfer bodies 13 on the transfer layer 12 than the number of corresponding alignment grooves 121, thereby shortening the time required to insert the corresponding chip transfer bodies 13 into the various types of alignment grooves 121. After all alignment grooves 121 on the transfer layer 12 have been inserted with corresponding chip transfer bodies 13, some chip transfer bodies 13 may fail to insert into the corresponding alignment grooves 121. In this case, a first magnetic field can be applied again to the chip transfer bodies 13 to remove the chip transfer bodies 13 that are not inserted into the corresponding alignment grooves 121 from the transfer layer 12. However, the present disclosure is not limited to this. The number of chip transfer bodies 13 placed on the transfer layer 12 can also be equal to the number of corresponding alignment grooves 121, and the specific amount can be determined based on actual conditions.

[0105] like Figures 3c to 4c As shown, in the embodiment of the present disclosure, the step of processing the chip transfer body 13 in step S3 to bind it to the driving substrate 11 may include: determining the positional relationship between the binding end face of the light-emitting chip 131 in the chip transfer body 13 and the driving substrate 11. When it is determined that the binding end face of the light-emitting chip 131 in the chip transfer body 13 and the driving substrate 11 are in a non-corresponding matching relationship, applying a second magnetic field to the chip transfer body 13 to drive the chip transfer body 13 to rotate so that the binding end face of the light-emitting chip 131 in the chip transfer body 13 and the driving substrate 11 are in a matching relationship. After determining that the binding end face of the light-emitting chip 131 in the chip transfer body 13 and the driving substrate 11 are in a corresponding matching relationship, removing the protective layer 132 so that the light-emitting chip 131 falls onto the driving substrate 11 so that the binding end face is in contact with the driving substrate 11.

[0106] It should be noted that the bonding end face of the light emitting chip 131 mentioned above refers to the side of the light emitting chip 131 that is in direct contact with the driving substrate 11. Specifically, the bonding end face of the light emitting chip 131 may be the end face where the connection electrode 1312 in the light emitting chip 131 is connected to the corresponding driving electrode in the driving layer 112.

[0107] The matching relationship between the bonding end surface of the light-emitting chip 131 and the driving substrate 11 is established when the bonding end surface of the light-emitting chip 131 in the chip transfer body 13 is close to and parallel to the driving substrate 11. This matching relationship facilitates the connection between the connection electrode 1312 and the driving substrate 11 after removing the protective layer 132.

[0108] In the disclosed embodiment, the second magnetic field can be in the horizontal direction X or in the vertical direction, depending on the actual situation. Driven by the second magnetic field, the light-emitting chip 131 in the chip transfer body 13 can be adjusted in angle until the binding end surface of the light-emitting chip 131 is in a corresponding matching relationship with the driving substrate 11.

[0109] It should be noted that when the chip transfer body 13 is located in the corresponding matching alignment groove 121, there may be a certain distance between the light emitting chip 131 in the chip transfer body 13 and the bottom of the alignment groove 121, such as Figures 3d to 4d As shown, after removing the protective layer 132, the light-emitting chip 131 falls to the bottom of the groove due to gravity and is bonded to the driving layer 112 at the bottom of the groove. During the falling process, the light-emitting chip 131 may shift in position, causing the connecting electrode 1312 to deviate from the driving electrode when the light-emitting chip 131 falls to the bottom of the groove, thereby preventing the light-emitting chip 131 from being bonded to the driving substrate 11.

[0110] To solve the above problem, the alignment groove 121 in the embodiment of the present disclosure may include a first groove 1211 and a second groove 1212. The first groove 1211 is connected to the second groove 1212, and the second groove 1212 is located on a side of the first groove 1211 close to the drive substrate 11. The first groove 1211 is used to accommodate the chip transfer body 13 corresponding to it.

[0111] Specifically, when the chip transfer body 13 is located in the corresponding alignment groove 121, the orthographic projection of the chip transfer body 13 on the drive substrate 11 may be located within the orthographic projection of the first groove 1211 on the drive substrate 11. However, the present invention is not limited thereto. When the chip transfer body 13 is located in the corresponding alignment groove 121, the orthographic projection of the chip transfer body 13 on the drive substrate 11 may also coincide with the orthographic projection of the first groove 1211 on the drive substrate 11. The specific configuration may be determined based on actual conditions.

[0112] The orthographic projection of the end surface of the second groove 1212, which is distal from the first groove 1211, on the driver substrate 11 is located within the orthographic projection of the first groove 1211 on the driver substrate 11. The second groove 1212 is used to accommodate the light-emitting chip 131 after the protective layer 132 has been removed. In other words, after the protective layer 132 is removed from the chip transfer body 13, the light-emitting chip 131 falls into the corresponding second groove 1212.

[0113] The orthographic projections of the driving electrodes on the driving layers 112 on the transfer layer 12 may be located within the corresponding second grooves 1212 .

[0114] like Figures 4e to 4fAs shown, in some embodiments of the present disclosure, the inner wall of the second groove 1212 can be a vertical wall perpendicular to the driver substrate 11. When the binding end surface of the light-emitting chip 131 is in a corresponding mating relationship with the driver substrate 11, the orthographic projection of the second groove 1212 on the driver substrate 11 can completely overlap with the orthographic projection of the light-emitting chip 131 in the corresponding chip transfer body 13 on the driver substrate 11. After removing the protective layer 132, the light-emitting chip 131 can be directly embedded in the second groove 1212, reducing or preventing the light-emitting chip 131 from deviating from the second groove 1212 during the drop process, thereby preventing the light-emitting chip 131 from being unable to bind to the driver substrate. In other words, by providing the second groove 1212, the problem of the light-emitting chip 131 deviating from the second groove 1212 during the drop process, which could result in the connection electrode 1312 in the light-emitting chip 131 being unable to connect with the corresponding drive electrode, can be reduced or prevented, thereby improving the transfer yield of the light-emitting chip 131.

[0115] like Figure 4g As shown, in other embodiments of the present disclosure, the inner wall of the second groove 1212 is an inclined surface arranged at an angle relative to the vertical direction, and the inclined surface extends from bottom to top in a direction away from the center of the second groove 1212. The vertical direction is a direction perpendicular to the drive substrate 11. "From bottom to top" refers to the direction in which the inner wall of the second groove 1212 moves away from the drive substrate 11, so that the cross-sectional area of ​​the second groove 1212 increases in the direction away from the drive substrate 11.

[0116] The orthographic projection of the end surface of the second groove 1212 away from the driving substrate 11 on the driving substrate 11 may coincide with the orthographic projection of the corresponding first groove 1211 on the driving substrate 11 .

[0117] When the binding end face of the light-emitting chip 131 is in a corresponding matching relationship with the driving substrate 11, the orthographic projection of the end face of the second groove 1212 close to the driving substrate 11 on the driving substrate 11 completely coincides with the orthographic projection of the light-emitting chip 131 in the corresponding matching chip transfer body 13 on the driving substrate 11.

[0118] After the protective layer 132 is removed, the light-emitting chip 131 slides along the inner wall of the second groove 1212 onto the driving substrate 11. While avoiding the problem of the light-emitting chip 131 deviating from the second groove 1212 during the falling process, it also reduces the angle of inclination of the light-emitting chip 131 during the falling process, which then causes the binding end face of the light-emitting chip 131 to be in a non-corresponding matching relationship with the driving substrate 11 after the light-emitting chip 131 falls onto the driving substrate 11, and makes it impossible for the light-emitting chip 131 to be bound to the driving substrate 11.

[0119] However, the present invention is not limited thereto. In the embodiment of the present disclosure, the cross-sectional area of ​​the alignment groove 121 may also be equal throughout its depth direction, which may be determined according to actual conditions.

[0120] It should be noted that in the disclosed embodiments, the mass and volume of the same type of chip transfer body 13 are the same, while the mass of different types of chip transfer bodies 13 varies. The mass of the chip transfer body 13 is positively correlated with the cross-sectional area of ​​the corresponding alignment groove 121. That is, the greater the mass of the chip transfer body 13, the larger the cross-sectional area of ​​the corresponding alignment groove 121.

[0121] In the embodiment of the present disclosure, the chip transfer method of the light-emitting chip 131 can be specifically referred to the following embodiment, wherein the chip transfer body 13 in the embodiment can have three different types (i.e., N=3), and the three types of chip transfer bodies 13 are all spheres, and the spherical diameters of the first type of chip transfer body 13, the second type of chip transfer body 13, and the three types of chip transfer bodies 13 are D1, D2, and D3, respectively.

[0122] Example 1

[0123] like Figure 5 As shown, different types of chip transfer bodies 13 are configured with different ball diameters, satisfying the following equation: D1 < D2 < D3. It should be noted that the mass of the chip transfer body 13 is positively correlated with the ball diameter. The larger the mass of the chip transfer body 13, the larger its ball diameter and the corresponding larger cross-sectional area of ​​the alignment groove 121.

[0124] Each alignment groove 121 on the transfer layer 12 is filled with a transfer liquid 14, and the density of the transfer liquid 14 is lower than that of each type of chip transfer body 13. When a chip transfer body 13 moves to its corresponding alignment groove 121, at least half of the height of the chip transfer body 13 is immersed in the transfer liquid 14 in the corresponding alignment groove 121.

[0125] After the transfer liquid 14 is injected into each receiving groove, different types of chip transfer bodies 13 are placed together on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and the first magnetic field is applied to all the chip transfer bodies 13 at the same time to drive each chip transfer body 13 to roll until a corresponding matching chip transfer body 13 is embedded in each alignment groove 121.

[0126] It should be noted that according to the formula Ffloat = G = mg = ρliquid gVdisplaced (G is gravity, m is the mass of the chip transfer body 13, ρliquid is the density of the transfer liquid 14, g is the acceleration due to gravity, and Vdisplaced is the volume of the displaced transfer liquid 14), when the mass of the chip transfer body 13 is constant, the buoyancy it experiences is constant. When the density of the transfer liquid 14 and the acceleration due to gravity are equal, the volume of the displaced liquid is equal. The larger the cross-sectional area of ​​the alignment groove 121, the smaller the height of the displaced transfer liquid 14 within the alignment groove 121.

[0127] like Figure 6 As shown, the same type of chip transfer body 13 is placed in two alignment grooves 121 with different cross-sectional areas. The height of the transfer liquid 14 discharged by the chip transfer body 13 in the alignment groove 121 with the larger cross-sectional area is Δh1, while the height of the transfer liquid 14 discharged by the chip transfer body 13 in the alignment groove 121 with the smaller cross-sectional area is Δh2, where Δh1 < Δh2. Therefore, the same type of chip transfer body 13 sinks less in the alignment groove 121 with the larger cross-sectional area.

[0128] Furthermore, in the disclosed embodiment, the maximum cross-sectional area of ​​the n+1th type of chip transfer body 13 is greater than the cross-sectional area of ​​the corresponding alignment groove 121 of the nth type of chip transfer body 13. Furthermore, when the nth type of chip transfer body 13 is transferred into the corresponding alignment groove 121 of the n+1th type of chip transfer body 13, the depth to which the light-emitting chip 131 is sunk into the alignment groove 121 is less than half its height. The mass of the nth type of chip transfer body 13 is less than the mass of the n+1th type of chip transfer body 13, and 1≤n<N, where n is a positive integer.

[0129] Specifically, when N=3, three types of alignment grooves 121 are formed on the transfer layer 12 , and the transfer liquid 14 is injected into each alignment groove 121 .

[0130] Among them, such as Figure 7 As shown, a chip transfer body 13 with a spherical diameter of D1 is placed on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and a first magnetic field is applied to the chip transfer body 13. When the chip transfer body 13 with a spherical diameter of D1 moves to the corresponding matching alignment groove 121, the depth of the chip transfer body 13 sunk into the alignment groove 121 is greater than or equal to half of its height; when the chip transfer body 13 with a spherical diameter of D1 moves to the other two types of non-corresponding matching alignment grooves 121, the depth of the chip transfer body 13 with a spherical diameter of D1 sunk into the alignment groove 121 is less than half of its height.

[0131] like Figure 8As shown, a chip transfer body 13 with a spherical diameter of D2 is placed on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and a first magnetic field is applied to the chip transfer body 13. When the chip transfer body 13 with a spherical diameter of D2 moves into the corresponding matching alignment groove 121, the depth of the chip transfer body 13 sunk into the alignment groove 121 is greater than or equal to half of its height; the maximum cross-sectional area of ​​the chip transfer body 13 with a spherical diameter of D2 is greater than the cross-sectional area of ​​the corresponding matching alignment groove 121 of the chip transfer body 13 with a spherical diameter of D1, so that the chip transfer body 13 with a spherical diameter of D2 cannot sink into the corresponding matching alignment groove 121 of the chip transfer body 13 with a spherical diameter of D1; when the chip transfer body 13 with a spherical diameter of D2 is transferred to the corresponding matching alignment groove 121 of the chip transfer body 13 with a spherical diameter of D3, the depth of the chip transfer body 13 with a spherical diameter of D2 sunk into the alignment groove 121 is less than half of its height.

[0132] like Figure 9 As shown, a chip transfer body 13 with a spherical diameter of D3 is placed on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and a first magnetic field is applied to the chip transfer body 13. When the chip transfer body 13 with a spherical diameter of D3 moves to the corresponding matching alignment groove 121, the depth of the chip transfer body 13 sunk into the alignment groove 121 is greater than or equal to half of its height; and the chip transfer body 13 with a spherical diameter of D3 cannot sink into the other two non-corresponding alignment grooves 121.

[0133] It can be seen from this that the different types of chip transfer bodies 13 in the embodiments of the present disclosure can only achieve at least half of their height being submerged in the transfer liquid 14 within the corresponding matching alignment grooves 121 .

[0134] Therefore, if Figure 10 as well as Figures 10a to 10e As shown, in the embodiment of the present disclosure, after forming the transfer layer 12 and filling each alignment groove 121 with the transfer liquid 14, different types of chip transfer bodies 13 can be placed on the driving substrate 11 or on the transfer layer 12 at the same time. Driven by the first magnetic field, the different types of chip transfer bodies 13 move on the transfer layer 12. When the chip transfer body 13 has not been transferred to the corresponding matching alignment groove 121, the chip transfer body 13 can continue to move under the action of the first magnetic field. When the chip transfer body 13 is transferred to the corresponding matching alignment groove 121, the first magnetic field can no longer drive the chip transfer body 13 to move on the transfer layer 12, and the chip transfer body 13 can then stay in the corresponding matching alignment groove 121.

[0135] When a corresponding matching chip transfer body 13 is embedded in each alignment groove 121, if there are still chip transfer bodies 13 on the transfer layer 12 or the driving substrate 11 that have not been transferred to the corresponding matching alignment groove 121, the first magnetic field is applied again to remove the chip transfer bodies 13 that have not been transferred to the corresponding matching alignment groove 121 from the transfer layer 12 or the driving substrate 11.

[0136] Next, the positional relationship between the binding end surface of the light emitting chip 131 and the driving substrate 11 can be determined. Figures 10b to 10c As shown, if the binding end face of the light-emitting chip 131 is in a non-corresponding matching relationship with the driving substrate 11, a second magnetic field can be applied to the chip transfer body 13 to drive the light-emitting chip 131 to rotate and make the binding end face of the light-emitting chip 131 in a corresponding matching relationship with the driving substrate 11.

[0137] like Figures 10c to 10e As shown, when the binding end surface of the light emitting chip 131 is in a corresponding matching relationship with the driving substrate 11, the transfer liquid 14 in each alignment groove 121 is removed. Then, the protective layer 132 wrapping the light emitting chip 131 is removed to enable the light emitting chip 131 to be bound to the driving substrate 11.

[0138] It should be noted that the transfer liquid 14 in the embodiment of the present disclosure can be a volatile solution, so that the transfer liquid 14 in the alignment groove 121 can be removed by heating, wherein the volatilization temperature of the transfer liquid 14 does not damage the light-emitting chip 131. However, the present invention is not limited to this, and the transfer liquid 14 in the alignment groove 121 can also be removed by other methods besides heating, which can be determined according to actual conditions.

[0139] In the embodiment of the present disclosure, different types of chip transfer bodies 13 can be placed on the driving substrate 11 or on the transfer layer 12 at the same time for transfer, which simplifies the chip transfer steps and improves the efficiency of chip transfer.

[0140] Example 2

[0141] Different types of chip transfer bodies 13 are spheres with the same diameter. The mass of the nth type of chip transfer body 13 is less than the mass of the n+1th type of chip transfer body 13, and 1 ≤ n < N, where n is a positive integer. In other words, D1 = D2 = D3, and the mass of the first type of chip transfer body 13 is less than the mass of the second type of chip transfer body 13, and the mass of the second type of chip transfer body 13 is less than the mass of the third type of chip transfer body 13.

[0142] It should be noted that, the greater the mass of the chip transfer body 13 , the larger the cross-sectional area of ​​the corresponding matching alignment groove 121 .

[0143] A transfer liquid 14 is injected into each alignment groove 121 on the transfer layer 12, filling each alignment groove 121. The density of the transfer liquid 14 is lower than that of the chip transfer body 13. When the chip transfer body 13 moves to the corresponding alignment groove 121, at least half of the height of the chip transfer body 13 is immersed in the transfer liquid 14 in the corresponding alignment groove 121.

[0144] After the transfer liquid 14 is injected into each containing tank, the chip transfer bodies 13 of different types are transferred in batches according to the order of the mass of the chip transfer bodies 13 from small to large.

[0145] Specifically, the steps after injecting the transfer liquid 14 into each receiving groove may include: first placing all n-th type chip transfer bodies 13 on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and applying a first magnetic field to each of the n-th type chip transfer bodies 13 to drive the n-th type chip transfer bodies 13 to roll one-to-one to the corresponding matching alignment groove 121. Then placing all n+1-th type chip transfer bodies 13 on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and applying a first magnetic field to each of the n+1-th type chip transfer bodies 13 to drive the n+1-th type chip transfer bodies 13 to roll one-to-one to the corresponding matching alignment groove 121, until all the alignment grooves 121 are embedded with corresponding matching chip transfer bodies 13.

[0146] Specifically, when N=3, the first type of chip transfer body 13 is first placed on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and a first magnetic field is applied to each first type of chip transfer body 13 to drive the first type of chip transfer body 13 to roll one by one to the corresponding matching alignment groove 121.

[0147] After the first type of chip transfer body 13 is embedded in the alignment grooves 121 corresponding to the first type of chip transfer body 13, the second type of chip transfer body 13 is placed on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and a first magnetic field is applied to each second type of chip transfer body 13 to drive the second type of chip transfer body 13 to roll one by one to the alignment groove 121 corresponding to it.

[0148] After the second type of chip transfer body 13 is embedded in the alignment grooves 121 corresponding to the second type of chip transfer body 13, the third type of chip transfer body 13 is placed on the edge of the driving substrate 11 or on the edge of the transfer layer 12, and a first magnetic field is applied to each third type of chip transfer body 13 to drive the third type of chip transfer body 13 to roll one by one to the corresponding alignment groove 121 until the third type of chip transfer body 13 is embedded in the alignment grooves 121 corresponding to the third type of chip transfer body 13.

[0149] It should be noted that in the embodiment of the present disclosure, when a chip transfer body 13 of smaller mass (type n) is transferred to the corresponding alignment groove 121 of a chip transfer body 13 of larger mass (type n+1), the height to which the chip transfer body 13 of smaller mass sinks in the transfer liquid 14 is less than half of its height. Therefore, the present disclosure adopts a method of transferring the chip transfer bodies 13 in order of increasing mass, so that the smaller chip transfer bodies 13 can occupy the alignment groove 121 with a smaller cross-sectional area, thereby preventing the larger chip transfer body 13 from being transferred to the corresponding alignment groove 121 of the smaller chip transfer body 13.

[0150] When transferring each type of chip transfer body 13, if the chip transfer bodies 13 are embedded in the corresponding matching alignment grooves 121, and there are still excess chip transfer bodies 13 on the driving substrate 11 or the transfer layer 12, the excess chip transfer bodies 13 can be removed from the driving substrate 11 and the transfer layer 12 first, and then the chip transfer body 13 with a larger mass (that is, the n+1th type) can be transferred.

[0151] The embodiment of the present disclosure sets different types of chip transfer bodies 13 to the same size, and uses the protective layer 132 to protect the light-emitting chip 131, thereby reducing or avoiding damage to the light-emitting chip 131 and the occurrence of bad spots due to collisions, thereby reducing the probability of repairing the light-emitting chip 131. At the same time, it can also avoid the complex process of the traditional chip transfer process that requires point-to-point precise alignment between the light-emitting chip 131 and the alignment groove 121 to achieve the transfer of the light-emitting chip 131, thereby simplifying the process of forming the chip transfer body 13 and saving work time.

[0152] Example 3

[0153] The same type of chip transfer bodies 13 are configured to have the same spherical diameter, while different types of chip transfer bodies 13 are configured to have different spherical diameters.

[0154] It should be noted that the phrase "the transfer layer 12 entirely covers the drive substrate 11" means that the drive substrate 11 is entirely covered by the transfer layer 12, except for the areas corresponding to the alignment grooves 121. The phrase "the transfer layer 12 is a flat layer" means that the surface of the transfer layer 12 facing away from the drive substrate 11 is parallel to the drive substrate 11, and that the vertical distance from each point on the surface of the transfer layer 12 facing away from the drive substrate 11 is equal.

[0155] The steps after forming the transfer layer 12 may include: first placing all n-th type chip transfer bodies 13 at the edge of the transfer layer 12, and applying a first magnetic field to each of the n-th type chip transfer bodies 13 to drive the n-th type chip transfer bodies 13 to roll one-to-one to the corresponding alignment groove 121. Then placing all n+1-th type chip transfer bodies 13 at the edge of the transfer layer 12, and applying a first magnetic field to each of the n+1-th type chip transfer bodies 13 to drive the n+1-th type chip transfer bodies 13 to roll one-to-one to the corresponding alignment groove 121, until all alignment grooves 121 are embedded with corresponding chip transfer bodies 13.

[0156] The mass of the nth type of chip transfer body 13 is less than the mass of the n+1th type of chip transfer body 13, and 1≤n<N, where n is a positive integer. In the present disclosure, the maximum cross-sectional area of ​​the n+1th type of chip transfer body 13 is greater than the cross-sectional area of ​​the alignment groove 121 that the nth type of chip transfer body 13 matches. Therefore, the depth of the n+1th type of chip transfer body 13 within the alignment groove 121 that the nth type of chip transfer body 13 matches is less than half of its height.

[0157] Specifically, when N=3, and D1<D2<D3, the first type of chip transfer body 13 is first placed at the edge of the drive substrate 11 or at the edge of the transfer layer 12. The first type of chip transfer body 13 moves under the action of the first magnetic field until the first type of chip transfer body 13 is embedded in the corresponding alignment grooves 121. Then, the second type of chip transfer body 13 is placed at the edge of the drive substrate 11 or at the edge of the transfer layer 12. The second type of chip transfer body 13 moves under the action of the first magnetic field until the second type of chip transfer body 13 is embedded in the corresponding alignment grooves 121. Next, the third type of chip transfer body 13 is placed at the edge of the drive substrate 11 or at the edge of the transfer layer 12. The third type of chip transfer body 13 moves under the action of the first magnetic field until the third type of chip transfer body 13 is embedded in the corresponding alignment grooves 121.

[0158] It should be noted that when each type of chip transfer body 13 is transferred, if the chip transfer bodies 13 are embedded in the corresponding matching alignment grooves 121, and there are still excess chip transfer bodies 13 on the driving substrate 11 or the transfer layer 12, the excess chip transfer bodies 13 can be removed from the driving substrate 11 and the transfer layer 12 first, and then the chip transfer body 13 with a larger ball diameter (that is, the n+1th type) can be transferred.

[0159] The disclosed embodiment provides at least two types of alignment grooves 121 corresponding to different types of chip transfer bodies 13, and utilizes a first magnetic field to transfer the different types of chip transfer bodies 13 in batches, ordered by diameter, thereby avoiding complex alignment procedures, reducing the difficulty of transferring the light-emitting chips 131, and improving transfer efficiency. Furthermore, by utilizing the matching characteristics of a single type of alignment groove 121 with a single type of chip transfer body 13, the disclosed embodiment transfers chip transfer bodies 13 of varying sizes in batches, ensuring that the chip transfer bodies 13 are transferred into the corresponding alignment groove 121, thereby improving the accuracy of the transfer of the light-emitting chips 131.

[0160] Example 4

[0161] Chip transfer bodies 13 of the same type are configured with the same spherical diameter, while chip transfer bodies 13 of different types are configured with different spherical diameters. The cross-sectional area of ​​the alignment groove 121 is positively correlated with the spherical diameter of the corresponding chip transfer body 13. The larger the spherical diameter of the chip transfer body 13, the larger the cross-sectional area of ​​the corresponding alignment groove 121.

[0162] The transfer layer 12 includes N different types of transfer structures 122 arranged at intervals in the horizontal direction X. Each type of transfer structure 122 corresponds to a type of alignment groove 121. At this time, the groove sidewalls of each alignment groove 121 are respectively formed by the corresponding transfer structure 122.

[0163] The outer surface of the transfer structure 122 slopes inward from bottom to top. The height of the transfer structure 122 is positively correlated with the cross-sectional area of ​​the corresponding alignment groove 121, and the inclination angle of the outer surface of the transfer structure 122 is positively correlated with the cross-sectional area of ​​the corresponding alignment groove 121. In other words, the larger the spherical diameter of the chip transfer body 13, the larger the cross-sectional area of ​​the corresponding alignment groove 121, and the taller the transfer structure 122 forming the alignment groove 121, the larger the inclination angle of the outer surface of the transfer structure 122.

[0164] The term "from bottom to top" as used above refers to the direction from the end of the outer surface of the transfer structure 122 closest to the drive substrate 11 to the end of the outer surface of the transfer structure 122 farther from the drive substrate 11. The term "inwardly tilted" as used above refers to the outer surface of the transfer structure 122 tilting toward the center of the transfer structure 122. The tilt angle of the outer surface of the transfer structure 122 refers to the angle between the outer surface of the transfer structure 122 and the drive substrate 11.

[0165] In different types of transfer structures 122 , the horizontal widths of the outer side surfaces of the transfer structures 122 projected onto the drive substrate 11 may be equal, and the vertical heights of the outer side surfaces of the transfer structures 122 may be unequal, so that the outer side surfaces of different types of transfer structures 122 may form different inclination angles.

[0166] In the embodiment of the present disclosure, the inclination angle of the outer side surface of the transfer structure 122 may be less than or equal to 60°.

[0167] When the transfer structure 122 is cross-sectioned along the height direction of the alignment groove 121 , the cross-sectional shape of the transfer structure 122 can be two triangles or trapezoids symmetrically arranged about the alignment groove 121 , and the outer side surface of the transfer structure 122 can be a plane or an arc surface.

[0168] After forming the transfer layer 12, different types of chip transfer bodies 13 are placed on the edge of the driving substrate 11 at the same time, and a first magnetic field is applied to all chip transfer bodies 13 at the same time to drive each chip transfer body 13 to roll until each alignment groove 121 is embedded with a corresponding matching chip transfer body 13.

[0169] It should be noted that, under the combined effect of the weight of the chip transfer body 13 and the height of the corresponding transfer structure 122 , various types of chip transfer bodies 13 can only move into the corresponding alignment groove 121 when driven by the first magnetic field.

[0170] Specifically, when N=3, and the ball diameters of the first, second, and third types of chip transfer bodies 13 satisfy the following: D1<D2<D3, three corresponding matching first, second, and third alignment grooves can be formed. The first, second, and third alignment grooves are formed by the first transfer structure, the second transfer structure, and the third transfer structure, respectively.

[0171] like Figure 11 As shown, the heights of the first transfer structure, the second transfer structure, and the third transfer structure are L1, L2, and L3, respectively, and satisfy: L1 < L2 < L3. The inclination angles of the outer sides of the first transfer structure, the second transfer structure, and the third transfer structure are θ1, θ2, and θ3, respectively, and satisfy: θ1 < θ2 < θ3.

[0172] After forming the transfer layer 12, the first-type chip transfer body 13 is placed at the edge of the drive substrate 11, and a first magnetic field is applied to the chip transfer body 13. Because the inclination angle θ1 of the outer side surface of the first transfer structure is relatively small, the first-type chip transfer body 13 with a smaller ball diameter can move normally along the outer side surface of the first transfer structure into the first alignment groove. However, the inclination angle θ2 of the outer side surface of the second transfer structure and the inclination angle θ3 of the outer side surface of the third transfer structure are relatively large. The first-type chip transfer body 13 with a smaller ball diameter experiences greater resistance when moving along the outer side walls of the second and third transfer structures. Therefore, the first-type chip transfer body 13 cannot move into the second or third alignment grooves.

[0173] It should be noted that the relationship between the heights of the three types of transfer structures 122 and the corresponding spherical diameters of the chip transfer bodies 13 is as follows: 4 / 3*D1>L1≥D1, 4 / 3*D2>L2≥D2, and 4 / 3*D3>L3≥D3. Therefore, after a first type of chip transfer body 13 is inserted into the first alignment groove, the remaining first type of chip transfer bodies 13 cannot be inserted into the first alignment groove to at least half their height. Under the action of the first magnetic field, the remaining first type of chip transfer bodies 13 can continue to roll on the drive substrate 11 and the other transfer structures 122.

[0174] In the disclosed embodiment, the cross-sectional area of ​​the first alignment groove is smaller than the maximum cross-sectional area of ​​the second type of chip transfer body 13, and the cross-sectional area of ​​the second alignment groove is smaller than the maximum cross-sectional area of ​​the third type of chip transfer body 13. Therefore, the second type of chip transfer body 13 cannot be inserted into the first alignment groove, and the third type of chip transfer body 13 cannot be inserted into the second alignment groove.

[0175] After forming the transfer layer 12, a second-type chip transfer body 13 is placed at the edge of the drive substrate 11, and a first magnetic field is applied to the chip transfer body 13. The second-type chip transfer body 13 cannot fit into the first alignment groove, and the outer side surface of the third transfer structure has a large inclination angle θ3, preventing the second-type chip transfer body 13, which has a smaller ball diameter, from moving into the third alignment groove. However, the outer side surface of the second transfer structure has a smaller inclination angle θ1, allowing the second-type chip transfer body 13, which has a smaller ball diameter, to move normally along the outer side surface of the second transfer structure into the second alignment groove.

[0176] Similarly, after forming the transfer layer 12, the third type of chip transfer body 13 is placed on the edge of the driving substrate 11, and a first magnetic field is applied to the chip transfer body 13. The third type of chip transfer body 13 can move normally along the outer side surface of the third transfer structure to the second alignment groove, but the third type of chip transfer body 13 cannot be embedded in the first alignment groove and the second alignment groove.

[0177] That is, the present embodiment provides different types of transfer structures 122 and utilizes the differences in height and inclination angles of the outer surfaces of the different types of transfer structures 122 to prevent chip transfer bodies 13 with smaller spherical diameters from being moved into the corresponding alignment grooves 121 of chip transfer bodies 13 with larger spherical diameters. By making the maximum cross-sectional area of ​​the larger chip transfer body 13 larger than the cross-sectional area of ​​the corresponding alignment grooves 121 of the smaller chip transfer body 13, the larger chip transfer body 13 is prevented from being inserted into the corresponding alignment grooves 121 of the smaller chip transfer body 13. Consequently, under the action of the first magnetic field, the various types of chip transfer bodies 13 can only be moved into the corresponding alignment grooves 121. This avoids the complex process of performing point-to-point precise alignment between the light-emitting chip 131 and the alignment groove 121 in the traditional chip transfer process to achieve transfer of the light-emitting chip 131, thereby reducing the difficulty of transferring the light-emitting chip 131. In addition, the embodiment of the present disclosure can simultaneously place different types of chip transfer bodies 13 on the driving substrate 11 or on the transfer layer 12 for transfer, which simplifies the chip transfer steps and thus improves the efficiency of chip transfer.

[0178] It should be noted that in the above-mentioned solutions of the third and fourth embodiments, after forming the transfer layer 12 and before placing the chip transfer body 13 at the edge of the transfer layer 12 or at the edge of the drive substrate 11, the step may include: filling each alignment groove 121 with a transfer liquid 14, wherein the density of the transfer liquid 14 is less than the density of each type of chip transfer body 13. When the chip transfer body 13 moves to the corresponding alignment groove 121, at least half of the height of the chip transfer body 13 is immersed in the transfer liquid 14.

[0179] When each alignment groove 121 in the fourth embodiment is filled with transfer liquid 14, dual protection can be achieved for the transfer of the chip transfer body 13 to the corresponding alignment groove 121. Specifically, the differences in the inclination angles of the outer side surfaces of different types of transfer structures 122 can be utilized to prevent chip transfer bodies 13 with smaller ball diameters from moving into the corresponding alignment groove 121 corresponding to chip transfer bodies 13 with larger ball diameters. Simultaneously, the differences in the sinking depths of chip transfer bodies 13 of the same type in the transfer liquid 14 within different alignment grooves 121 can be utilized to ensure that the chip transfer body 13 remains in the corresponding alignment groove 121 under the influence of the first magnetic field. This provides dual protection for the transfer of the chip transfer body 13 to the corresponding alignment groove 121, thereby improving the success rate of the transfer of the light-emitting chip 131.

[0180] The present disclosure also provides a display panel 1, comprising at least a drive substrate 11, a transfer layer 12, and at least N different types of magnetic chip transfer bodies 13. The transfer layer 12 is disposed on the drive substrate 11 and includes N different types of alignment grooves 121 arranged in a horizontal direction X, with the different types of alignment grooves 121 having different cross-sectional areas.

[0181] The chip transfer body 13 corresponds to the alignment groove 121 one-to-one. Moreover, when the chip transfer body 13 in the above-mentioned chip transfer method does not include the protective layer 132, the chip transfer body 13 in the display panel 1 can be transferred to the corresponding alignment groove 121 using any of the above-mentioned chip transfer methods and bonded to the drive substrate 11. When the chip transfer body 13 in the above-mentioned chip transfer method includes the protective layer 132, it is necessary to first remove the protective layer 132, and then transfer the chip transfer body 13 after removing the protective layer 132 to the corresponding alignment groove 121 using any of the above-mentioned chip transfer methods and bond it to the drive substrate 11.

[0182] Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the technical features being referred to. Thus, a feature identified as "first," "second," or "third" may explicitly or implicitly include one or more of such features. Throughout the present disclosure, "plurality" means two or more, unless otherwise specifically defined.

[0183] It should be noted that “upper”, “lower”, “left”, “right”, etc. are only used to distinguish for the convenience of description, and do not impose any directional restrictions on the embodiments of the present invention. For example, the “upper” may actually be “lower”, “left”, “right”, etc. In the present disclosure, unless otherwise clearly specified and limited, the terms “assembly”, “connection”, etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal connection of two elements or the interaction relationship between two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances.

[0184] In the description of this specification, the reference terms "some embodiments", "exemplarily", etc. mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present disclosure. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner. In addition, those skilled in the art can combine and combine different embodiments or examples described in this specification and features of different embodiments or examples without contradiction.

[0185] Although the embodiments of the present disclosure have been shown and described above, it is understood that the above embodiments are illustrative and cannot be understood as limiting the present disclosure. A person skilled in the art may change, modify, replace and modify the above embodiments within the scope of the present disclosure. Therefore, any changes or modifications made in accordance with the claims and description of the present disclosure shall fall within the scope of the patent of the present disclosure.

Claims

1. A chip transfer method, characterized in that: The chip transfer method comprises: Providing N different types of magnetic chip transfer bodies, wherein N is a positive integer greater than or equal to 2; the different types of chip transfer bodies have different masses, and the chip transfer bodies include a light-emitting chip and a protective layer, wherein the light-emitting chip is wrapped in the protective layer; A driving substrate is provided, and a transfer layer is formed on the driving substrate, wherein the transfer layer includes N different types of alignment grooves arranged in the horizontal direction, the cross-sectional areas of the different types of alignment grooves are different, and the alignment grooves are used to correspond to and match the different types of chip transfer bodies, and the corresponding matching relationship between the alignment grooves and the chip transfer bodies is: the chip transfer body corresponds to the alignment grooves one by one, and at least half of the chip transfer body is embedded in the alignment grooves; the mass of the chip transfer body is positively correlated with the cross-sectional area of ​​the alignment grooves corresponding to it; each alignment groove is filled with a transfer liquid, and the density of the transfer liquid is less than the density of each type of chip transfer body; the alignment groove includes a plurality of grooves arranged in the vertical direction. A first groove and a second groove are arranged in a vertical direction and connected, the second groove is located on a side of the first groove close to the driving substrate, the first groove is used to accommodate a chip transfer body corresponding thereto, the orthographic projection of the end surface of the second groove away from the first groove on the driving substrate is located within the orthographic projection of the first groove on the driving substrate, and is used to accommodate the light-emitting chip with the protective layer removed; wherein: the inner wall of the second groove is a vertical wall perpendicular to the driving substrate; or the inner wall of the second groove is an inclined surface arranged obliquely relative to the vertical direction, and the inclined surface extends from bottom to top in a direction away from the center of the second groove; Placing the chip transfer body at the edge of the driving substrate or at the edge of the transfer layer, and applying a first magnetic field to the chip transfer body to drive the chip transfer body to move to the corresponding alignment groove; After the chip transfer body moves to the corresponding alignment groove, the chip transfer body is processed so as to be bound to the driving substrate.

2. The chip transfer method according to claim 1, wherein: When the chip transfer body moves to the corresponding alignment groove, at least half of the height of the chip transfer body sinks into the transfer liquid.

3. The chip transfer method according to claim 2, wherein: After all the chip transfer bodies move to the corresponding alignment grooves, and before each chip transfer body is processed to be bonded to the driving substrate, the chip transfer method further includes: removing the transfer liquid in each alignment groove; The step of processing the chip transfer bodies to bind them to the driving substrate includes: removing the protective layer wrapping the light-emitting chip in each chip transfer body, and then binding the light-emitting chip to the driving substrate.

4. The chip transfer method according to claim 2, wherein: The chip transfer body is a sphere, different types of chip transfer bodies have different spherical diameters, and the mass of the chip transfer body is positively correlated with the spherical diameter. The chip transfer method includes: Different types of chip transfer bodies are placed simultaneously on the edge of the driving substrate or on the edge of the transfer layer, and a first magnetic field is applied to all the chip transfer bodies at the same time to drive each chip transfer body to roll until a corresponding matching chip transfer body is embedded in each alignment groove.

5. The chip transfer method according to claim 2, wherein: The chip transfer body is a sphere, and the sphere diameters of different types of chip transfer bodies are the same; wherein the chip transfer method includes: First, all n-type chip transfer bodies are placed on the edge of the driving substrate or on the edge of the transfer layer, and a first magnetic field is applied to each of the n-type chip transfer bodies to drive the n-type chip transfer bodies to roll one by one to the corresponding matching alignment groove; Then, all the n+1th type chip transfer bodies are placed on the edge of the driving substrate or on the edge of the transfer layer, and a first magnetic field is applied to each of the n+1th type chip transfer bodies to drive the n+1th type chip transfer bodies to roll one by one to the corresponding matching alignment groove; The mass of the nth type of chip transfer body is less than the mass of the n+1th type of chip transfer body, and 1≤n<N, where n is a positive integer.

6. The chip transfer method according to any one of claims 1 to 2, characterized in that: The chip transfer body is a sphere, and different types of chip transfer bodies have different spherical diameters. The transfer layer is a flat layer that covers the entire surface of the drive substrate, and the chip transfer method includes: First, all n-type chip transfer bodies are placed at the edge of the transfer layer, and a first magnetic field is applied to each of the n-type chip transfer bodies to drive the n-type chip transfer bodies to roll one by one to the corresponding alignment groove; Then, all the n+1th type chip transfer bodies are placed at the edge of the transfer layer, and a first magnetic field is applied to each of the n+1th type chip transfer bodies to drive the n+1th type chip transfer bodies to roll one by one to the corresponding matching alignment groove; The mass of the nth type of chip transfer body is less than the mass of the n+1th type of chip transfer body, and 1≤n<N, where n is a positive integer.

7. The chip transfer method according to any one of claims 1 to 2, characterized in that: The chip transfer body is a sphere, and different types of chip transfer bodies have different spherical diameters; The transfer layer includes N different types of transfer structures that are spaced apart in the horizontal direction, each type of transfer structure corresponding to a type of alignment groove, and the outer side surface of each transfer structure is inclined inward from bottom to top; The cross-sectional area of ​​the alignment groove is positively correlated with the spherical diameter of the chip transfer body matched therewith, and the inclination angle of the outer side surface of the transfer structure is positively correlated with the cross-sectional area of ​​the alignment groove formed therewith.

8. The chip transfer method according to claim 7, characterized in that: In different types of transfer structures: the horizontal widths of the orthographic projections of the outer side surfaces on the driving substrate are equal, and the vertical heights of the outer side surfaces are unequal; and / or The inclination angle of the outer side surface of the transfer structure is less than or equal to 60°; and / or The chip transfer method includes: placing different types of chip transfer bodies on the edge of the driving substrate at the same time, and applying a first magnetic field to all the chip transfer bodies at the same time to drive each chip transfer body to roll until a corresponding matching chip transfer body is embedded in each alignment groove.

9. The chip transfer method according to claim 1, wherein: The chip transfer body includes a light-emitting chip and a protective layer, wherein the light-emitting chip is wrapped in the protective layer; The step of processing the chip transfer body to be bonded to the drive substrate includes: Determining the positional relationship between the binding end surface of the light-emitting chip in the chip transfer body and the driving substrate; When it is determined that the binding end surface of the light-emitting chip in the chip transfer body is in a non-corresponding matching relationship with the driving substrate, a second magnetic field is applied to the chip transfer body to drive the chip transfer body to rotate so that the binding end surface of the light-emitting chip in the chip transfer body is in a matching relationship with the driving substrate; After determining that the binding end surface of the light-emitting chip in the chip transfer body is in a corresponding matching relationship with the driving substrate, removing the protective layer so that the light-emitting chip falls onto the driving substrate so that the binding end surface is in contact with the driving substrate; The condition for the binding end surface of the light-emitting chip in the chip transfer body to be in a matching relationship with the driving substrate is that the binding end surface of the light-emitting chip in the chip transfer body is close to the driving substrate and parallel to the driving substrate.

10. A display panel, characterized in that: The display panel at least includes: Driver substrate; A transfer layer is provided on the driving substrate, wherein the transfer layer includes N different types of alignment grooves arranged in a horizontal direction, and the cross-sectional areas of the alignment grooves of different types are different; At least N different types of magnetic chip transfer bodies, each corresponding to the alignment groove, are provided. The chip transfer bodies are transferred to the corresponding alignment groove by the chip transfer method as claimed in claim 1 and are bound to the drive substrate.

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