Method, device, equipment and medium for simulating air vents in 3D printing mold

Abstract

The application discloses a kind of 3D printing mould in vent hole simulation method, device, equipment and medium.The method comprises: determining the three-dimensional digital model of target mould, generates the printing path information of target mould based on three-dimensional digital model and printing process parameter;Determine the material parameter of target mould and the equipment process parameter of 3D printing equipment, determine the simulation printing result of target mould based on printing path information, material parameter and equipment process parameter;Simulation printing result is to describe the temperature distribution situation in different positions of target mould in actual printing process of simulation target mould;Based on printing path information and simulation printing result, generate the pore distribution nephogram of target mould;Pore distribution nephogram is used to describe the vent hole distribution state of different positions of target mould in actual printing process.The technical scheme of the present application solves the problem of large printing cost, realizes the accurate determination of the vent hole permeability of mould interior.

Description

Technical Field

[0001] This invention relates to the field of additive manufacturing technology, and in particular to a method, apparatus, equipment and medium for simulating vents in 3D printed molds. Background Technology

[0002] 3D printing, also known as additive manufacturing, is a technology that manufactures solid parts by adding materials layer by layer based on three-dimensional CAD model data.

[0003] In the mold manufacturing industry, 3D printing is used to print molds to solve the problem of air trapping. 3D printed molds require the selection of suitable permeable steel to ensure mold quality; that is, choosing appropriate materials and printing process parameters is crucial for mold quality. However, the selected materials and printing process parameters require multiple rounds of printing verification and optimization, resulting in significant time, printing, and experimental costs. Furthermore, the internal pore distribution of the printed permeable steel mold cannot be observed, making it impossible to determine its air permeability. Summary of the Invention

[0004] This invention provides a method, apparatus, equipment, and medium for simulating vents in 3D printed molds, in order to solve the problem of high printing costs and achieve accurate determination of the air permeability of vents inside the mold.

[0005] According to one aspect of the present invention, a method for simulating vents in a 3D printed mold is provided, the method comprising:

[0006] A three-dimensional digital model of the target mold is determined, and printing path information of the target mold is generated based on the three-dimensional digital model and printing process parameters; the printing process parameters are used to describe the scanning parameters of the 3D printing equipment during the simulated 3D printing process.

[0007] The material parameters of the target mold and the equipment process parameters of the 3D printing equipment are determined. Based on the printing path information, the material parameters, and the equipment process parameters, the simulated printing result of the target mold is determined. The simulated printing result describes the temperature distribution at different positions of the target mold during the simulated actual printing process.

[0008] Based on the printing path information and the simulated printing results, a pore distribution cloud map of the target mold is generated; the pore distribution cloud map is used to describe the distribution state of the vent holes at different positions of the target mold during the simulated actual printing process.

[0009] According to another aspect of the present invention, a device for simulating vent holes in a 3D printed mold is provided, the device comprising:

[0010] The information determination module is used to determine the three-dimensional digital model of the target mold, and generate the printing path information of the target mold based on the three-dimensional digital model and printing process parameters; the printing process parameters are used to describe the scanning parameters of the 3D printing equipment during the simulated 3D printing process.

[0011] The simulation printing result determination module is used to determine the material parameters of the target mold and the equipment process parameters of the 3D printing equipment, and to determine the simulation printing result of the target mold based on the printing path information, the material parameters, and the equipment process parameters; the simulation printing result describes the temperature distribution at different positions of the target mold during the simulated actual printing process.

[0012] The distribution map determination module is used to generate a pore distribution cloud map of the target mold based on the printing path information and the simulated printing results; the pore distribution cloud map is used to describe the distribution state of the vent holes at different positions of the target mold during the simulated actual printing process.

[0013] According to another aspect of the present invention, an electronic device is provided, the electronic device comprising:

[0014] At least one processor; and

[0015] A memory communicatively connected to the at least one processor; wherein,

[0016] The memory stores a computer program that can be executed by the at least one processor, which enables the at least one processor to perform the simulation method for venting holes in a 3D printed mold according to any embodiment of the present invention.

[0017] According to another aspect of the present invention, a computer-readable storage medium is provided, the computer-readable storage medium storing computer instructions for causing a processor to execute and implement the method for simulating vent holes in a 3D printed mold according to any embodiment of the present invention.

[0018] The technical solution of this invention involves determining a three-dimensional digital model of the target mold, and generating printing path information for the target mold based on the three-dimensional digital model and printing process parameters. The printing process parameters describe the scanning parameters of the 3D printing equipment during the simulated 3D printing process, i.e., simulating the actual printing process and printing path, thereby facilitating the determination of gaps generated by the printing path based on the printing path information. Furthermore, the material parameters of the target mold and the equipment process parameters of the 3D printing equipment are determined, and the simulated printing result of the target mold is determined based on the printing path information, material parameters, and equipment process parameters. The simulated printing result describes the temperature distribution at different locations on the target mold during the simulated actual printing process, i.e., accurately obtaining the temperature distribution of the printed mold due to differences in material and temperature during the printing process, thereby facilitating the determination of temperature-induced defects based on the temperature distribution. Based on the printing path information and simulated printing results, a pore distribution cloud map of the target mold is generated. The pore distribution cloud map is used to describe the distribution of vents at different positions of the target mold during the simulated actual printing process. That is, the voids generated by the printing path are coupled with the defects caused by temperature, and the pore distribution of the target mold is accurately obtained. This makes it easier to determine whether the parameters of the current printing mold meet the requirements based on the pore distribution, so as to accurately adjust the parameters of the printing mold, avoid repeated actual printing and waste of printing materials, solve the problem of high printing costs, and achieve accurate determination of the air permeability of the vents inside the mold.

[0019] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is a flowchart of a method for simulating air vents in a 3D printed mold according to an embodiment of the present invention;

[0022] Figure 2 This is a flowchart of another method for simulating vent holes in a 3D printed mold according to an embodiment of the present invention;

[0023] Figure 3 This is a schematic diagram of a device for simulating air vents in a 3D printed mold according to an embodiment of the present invention;

[0024] Figure 4 This is a schematic diagram of the structure of an electronic device that implements the method for simulating vent holes in a 3D printed mold according to an embodiment of the present invention. Detailed Implementation

[0025] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0026] It should be noted that the terms "target," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0027] Example 1

[0028] Figure 1 The flowchart illustrates a method for simulating vent holes in a 3D printed mold according to an embodiment of the present invention. This embodiment is applicable to simulating the process of 3D printing molds and the situation of simulating vent holes in 3D printed molds. The method can be executed by a device for simulating vent holes in 3D printed molds. The device for simulating vent holes in 3D printed molds can be implemented in hardware and / or software and can be configured in any electronic device with network communication capabilities.

[0029] like Figure 1 As shown, the method for simulating vents in a 3D printed mold according to the present invention may include the following process:

[0030] S110. Determine the three-dimensional digital model of the target mold, and generate the printing path information of the target mold based on the three-dimensional digital model and printing process parameters; the printing process parameters are used to describe the scanning parameters of the 3D printing equipment during the simulated 3D printing process.

[0031] Specifically, the 3D digital model can be a three-dimensional model simulating the target mold, used to represent the actual shape and size of the target mold. The process of printing the target mold based on printing process parameters is simulated, thereby forming the printing path information for generating the target mold. For example, printing process parameters may include scanning speed, scanning power, scanning spacing, and scanning layer thickness; the printing path information can be the printing path formed based on the scanning speed, scanning power, scanning spacing, and scanning layer thickness.

[0032] Optionally, the printing path information of the target mold is generated based on the three-dimensional digital model and printing process parameters, including: slicing the three-dimensional digital model along the height direction to generate a preset number of target printing layers; simulating the printing scanning process of the target printing layers based on the printing process parameters to generate printing path information for each target printing layer.

[0033] Specifically, the 3D digital model is sliced ​​along the height direction according to the set scanning layer thickness to generate a preset number of target printing layers. Further, the scanning operation on the target printing layers is simulated based on scanning speed, scanning power, and scanning spacing, and G-code is generated during the scanning process using a G-code generator. Based on the G-code, printing path information for each target printing layer is generated.

[0034] The technical solution of this embodiment uses slicing operation to simulate and generate printing path information for the three-dimensional digital model, which realizes the accurate determination of the parameters of the scanning path during the printing process, and facilitates the subsequent determination of the generation of macroscopic gaps based on the printing path information.

[0035] S120. Determine the material parameters of the target mold and the equipment process parameters of the 3D printing equipment. Based on the printing path information, material parameters, and equipment process parameters, determine the simulated printing results of the target mold. The simulated printing results describe the temperature distribution at different positions of the target mold during the actual printing process.

[0036] Among them, material parameters are used to describe the parameter information of the materials selected for the mold, and equipment process parameters are used to describe the equipment information of the 3D printing equipment.

[0037] Specifically, based on the printing path information and constrained by material parameters and equipment process parameters, the generation of the target mold is simulated to produce a simulated printing result of the target mold. Because different material parameters and printing path information will cause different melting degrees at different locations of the target mold, different temperature distributions will be exhibited.

[0038] Optionally, the simulated printing result of the target mold is determined based on the printing path information, material parameters, and equipment process parameters. This includes: generating a finite element mesh model of the target mold based on a three-dimensional digital model; performing thermophysical analysis using the printing path information, material parameters, and equipment process parameters as constraints on the finite element mesh to generate the simulated printing result of the target mold. That is, thermophysical analysis can effectively reflect the thermophysical effects at different locations of the target mold. Different thermophysical effects reflect the degree of melting at the corresponding location, thereby determining whether voids or phase transitions exist at that location.

[0039] S130. Based on the printing path information and the simulated printing results, generate a pore distribution cloud map of the target mold; the pore distribution cloud map is used to describe the distribution of vent holes at different positions of the target mold during the simulated actual printing process.

[0040] Specifically, the printing path information and simulated printing results are fused and analyzed to integrate macroscopic and microscopic voids, thereby obtaining a distribution of voids that reflects the actual printing of the target mold, i.e., the distribution of vent holes.

[0041] Optionally, based on the printing path information and simulated printing results, a pore distribution cloud map of the target mold is generated, including steps A1-A4:

[0042] Step A1: Generate the printing gap distribution information of the target mold based on the printing path information.

[0043] Specifically, the printing path information corresponding to each target printing layer is superimposed according to the position of the target mold to generate the printing path information of the target mold, and the printing path information of the target mold is analyzed to determine the defects formed on the target mold due to the macroscopic printing process, that is, the printing gap distribution information.

[0044] Step A2: Determine the thermal change state of different positions of the target mold based on the temperature distribution at different positions in the simulated printing results.

[0045] The thermal change state can be understood as the temperature range and the preset qualified temperature at different locations. The preset qualified temperature is a range. If it is below a certain temperature value, the melting may be insufficient, and if it is above a certain temperature value, the melting may be excessive.

[0046] Specifically, the temperature distribution at different locations in the simulated printing results is compared with the preset qualified temperature to determine the thermal change state corresponding to different locations of the target mold.

[0047] Step A3: Generate temperature void analysis information of the target mold based on the thermal change state; the temperature void analysis information is the void information caused by temperature determined after thermophysical analysis.

[0048] Specifically, the thermal changes at different locations are overlaid and analyzed to determine the temperature gap analysis information for different regions of the target mold. This is because both excessively high and low temperatures can lead to defects. If there are large temperature variations within a continuous area, cracks may occur.

[0049] Optionally, temperature void analysis information of the target mold is generated based on the thermal change state, including: determining the melting state and phase transformation state of the material used to generate the target mold through the thermal change state; and determining the temperature void analysis information based on the melting state and / or phase transformation state.

[0050] Step A4: Generate a pore distribution cloud map based on the printing pore distribution information and temperature pore analysis information.

[0051] Specifically, the printing void distribution information is coupled with temperature void analysis information to generate a void coupling result; this void coupling result is then mapped onto a finite element mesh model to generate a void distribution cloud map of the target mold. The void coupling result describes the result of coupling the voids generated during the printing process with the voids generated by temperature.

[0052] This embodiment generates printing void distribution information for the target mold based on printing path information, ensuring the accuracy of void prediction on the target mold at a macroscopic level. Furthermore, it determines the thermal change state corresponding to different locations on the target mold based on the temperature distribution at different locations in the simulated printing results, and generates temperature void analysis information for the target mold based on this thermal change state. This temperature void analysis information is the void information caused by temperature, determined after thermophysical analysis, thus ensuring the accuracy of void prediction on the target mold caused by temperature changes at a microscopic level. Finally, based on the printing void distribution information and the temperature void analysis information, a pore distribution cloud map is generated, coupling the two void analyses to achieve accurate prediction of voids generated during the printing process of the target mold.

[0053] The technical solution of this invention involves determining a three-dimensional digital model of the target mold, and generating printing path information for the target mold based on the three-dimensional digital model and printing process parameters. The printing process parameters describe the scanning parameters of the 3D printing equipment during the simulated 3D printing process, i.e., simulating the actual printing process and printing path, thereby facilitating the determination of gaps generated by the printing path based on the printing path information. Furthermore, the material parameters of the target mold and the equipment process parameters of the 3D printing equipment are determined, and the simulated printing result of the target mold is determined based on the printing path information, material parameters, and equipment process parameters. The simulated printing result describes the temperature distribution at different locations on the target mold during the simulated actual printing process, i.e., accurately obtaining the temperature distribution of the printed mold due to differences in material and temperature during the printing process, thereby facilitating the determination of temperature-induced defects based on the temperature distribution. Based on the printing path information and simulated printing results, a pore distribution cloud map of the target mold is generated. The pore distribution cloud map is used to describe the distribution of vents at different positions of the target mold during the simulated actual printing process. That is, the voids generated by the printing path are coupled with the defects caused by temperature, and the pore distribution of the target mold is accurately obtained. This makes it easier to determine whether the parameters of the current printing mold meet the requirements based on the pore distribution, so as to accurately adjust the parameters of the printing mold, avoid repeated actual printing and waste of printing materials, solve the problem of high printing costs, and achieve accurate determination of the air permeability of the vents inside the mold.

[0054] Example 2

[0055] Figure 2 This is a flowchart of another method for simulating vent holes in a 3D printed mold, provided by an embodiment of the present invention. Based on the above embodiments, this embodiment takes a three-dimensional digital model as a CAD model and further describes in detail the method for simulating vent holes in a 3D printed mold.

[0056] Material parameters can include the material's density, melting temperature, energy absorption rate, specific heat at different temperatures, electrical conductivity at different temperatures, coefficient of thermal expansion at different temperatures, elasticity and Poisson's ratio at different temperatures, and tensile mechanical properties at room temperature and high temperature (RT and HT), etc.

[0057] The printing process parameters can be 3D printing process parameters corresponding to the material grade, such as spot diameter, scanning speed, scanning power, scanning spacing and scanning layer thickness.

[0058] The equipment process parameters can include the substrate size, preheating temperature, and substrate material properties of the printing equipment used.

[0059] In the simulation method for venting holes in 3D printed molds provided by this invention, the final result obtained after simulation analysis is a cloud map showing the distribution of pores within the target mold. The specific process is as follows:

[0060] S1. Mesh the CAD model to generate a finite element mesh model.

[0061] S2. Based on the CAD model and the set printing process parameters, such as scanning speed, scanning spacing, scanning power and layer thickness, slices are generated to produce printing path information G-Code, which is used to detect the analysis data of the printing path generated pores, that is, the printing pore distribution information.

[0062] S3. Use the printing process parameters, material parameters, and equipment process parameters (substrate size, squeegee direction, preheating temperature) as all the simulation input data for additive manufacturing simulation.

[0063] S4. Based on the simulation input data, perform thermophysical analysis according to the finite element mesh model to simulate the temperature change process during printing, and obtain the temperature distribution cloud map of each layer and the whole, which is the simulated printing result of the target mold.

[0064] The complete melting of the powder is determined by observing temperature changes and distribution. If the temperature is below a first preset temperature, the powder is not completely melted, leading to poor fusion and incomplete fusion defects. If the temperature is above a second preset temperature, the thermal expansion of the molten pool formed by the scan differs from that of the surrounding area. This temperature change will cause a phase transition, which will generate residual stress. When the residual stress exceeds the material's strength limit, cracks will form, and may even cause macroscopic cracking and delamination. Uneven overall temperature distribution may also lead to crack formation.

[0065] S5. Based on the generated printing path information G-Code, detect the gaps produced by the printing path, generate printing gap distribution information, and visualize the gaps.

[0066] S6. Couple the results of the thermophysical analysis temperature distribution cloud map with the pores generated by the printing path and map them to the finite element mesh model to obtain the overall pore distribution cloud map of the target mold.

[0067] By coupling the temperature distribution and the void distribution generated by the printing path and mapping them onto the finite element mesh model, the temperature and printing status of each mesh element can be observed. The voids generated by the printing path are themselves independent of temperature. After coupling with the temperature distribution, smaller voids may disappear or become larger due to the heat radiation during the printing process, thus obtaining a more accurate overall void distribution of the target mold.

[0068] S7. Finally, by analyzing the pore distribution cloud map, it can be determined whether the current printing process parameters are appropriate and whether the simulated printing effect is suitable. This allows for quick adjustment of the printing process parameters and repeated simulation experiments, ensuring that the parameters are appropriate before putting the product into the actual part printing process, reducing the printing process and saving material and time costs.

[0069] The technical solution of this embodiment can quickly develop printing processes with different material permeability, accelerate production iteration, and achieve cost reduction and efficiency improvement.

[0070] Example 3

[0071] Figure 3 This is a schematic diagram of a device for simulating vent holes in a 3D printed mold, provided by an embodiment of the present invention. This embodiment can be applied to simulating the process of 3D printing molds and the situation of simulating vent holes in 3D printed molds. The device for simulating vent holes in 3D printed molds can be implemented in hardware and / or software and can be configured in any electronic device with network communication function.

[0072] like Figure 3 As shown, the device for simulating air vents in a 3D printed mold according to the present invention includes:

[0073] The information determination module 210 is used to determine the three-dimensional digital model of the target mold, and generate the printing path information of the target mold based on the three-dimensional digital model and printing process parameters; the printing process parameters are used to describe the scanning parameters of the 3D printing equipment during the simulated 3D printing process.

[0074] The simulation printing result determination module 220 is used to determine the material parameters of the target mold and the equipment process parameters of the 3D printing equipment, and to determine the simulation printing result of the target mold based on the printing path information, the material parameters, and the equipment process parameters; the simulation printing result describes the temperature distribution at different positions of the target mold during the simulated actual printing process.

[0075] The distribution map determination module 230 is used to generate a pore distribution cloud map of the target mold based on the printing path information and the simulated printing results; the pore distribution cloud map is used to describe the distribution state of the vent holes at different positions of the target mold during the simulated actual printing process.

[0076] Based on the above embodiments, optionally, the information determination module is used to slice the three-dimensional digital model along the height direction to generate a preset number of target printing layers; and to simulate the printing scanning process of the target printing layers based on the printing process parameters to generate the printing path information of each target printing layer.

[0077] Based on the above embodiments, optionally, the simulation printing result determination module is used to generate a finite element mesh model of the target mold based on the three-dimensional digital model; and to perform thermophysical analysis using the printing path information, the material parameters and the equipment process parameters as constraints of the finite element mesh to generate the simulation printing result of the target mold.

[0078] Based on the above embodiments, optionally, the distribution map determination module includes an information determination unit, a thermal change state determination unit, a void information determination unit, and a pore distribution cloud map determination unit; the information determination unit is used to generate printing void distribution information of the target mold based on the printing path information. The thermal change state determination unit is used to determine the thermal change state corresponding to different positions of the target mold according to the temperature distribution at different positions in the simulated printing results. The void information determination unit is used to generate temperature void analysis information of the target mold based on the thermal change state; the temperature void analysis information is the void information caused by temperature determined after thermophysical analysis. The pore distribution cloud map determination unit is used to generate a pore distribution cloud map based on the printing void distribution information and the temperature void analysis information.

[0079] Based on the above embodiments, optionally, the pore distribution cloud map determination unit is used to couple the printing pore distribution information with the temperature pore analysis information to generate a pore coupling result; the pore coupling result is used to describe the result of coupling the pores generated during the printing process and the pores generated by temperature; the pore coupling result is mapped to the finite element mesh model to generate a pore distribution cloud map of the target mold.

[0080] Based on the above embodiments, optionally, the void information determination unit is used to: determine the melting state and phase change state of the material that generates the target mold through the thermal change state; and determine the temperature void analysis information based on the melting state and / or phase change state.

[0081] Based on the above embodiments, optionally, the printing process parameters include scanning speed, scanning power, scanning spacing, and scanning layer thickness.

[0082] The 3D printing mold ventilation hole simulation device provided in the embodiments of the present invention can execute the 3D printing mold ventilation hole simulation method provided in any embodiment of the present invention, and has the corresponding functional modules and beneficial effects of the execution method.

[0083] Example 4

[0084] According to embodiments of this disclosure, this disclosure also provides an electronic device, a readable storage medium, and a computer program product.

[0085] Figure 4 A schematic diagram of an electronic device 10 that can be used to implement embodiments of the present invention is shown. The electronic device is intended to represent various forms of digital computers, such as laptop computers, desktop computers, workstations, personal digital assistants, servers, blade servers, mainframe computers, and other suitable computers. The electronic device can also represent various forms of mobile devices, such as personal digital processors, cellular phones, smartphones, wearable devices (e.g., helmets, glasses, watches, etc.), and other similar computing devices. The components shown herein, their connections and relationships, and their functions are merely illustrative and are not intended to limit the implementation of the invention described and / or claimed herein.

[0086] like Figure 4 As shown, the electronic device 10 includes at least one processor 11 and a memory, such as a read-only memory (ROM) 12 or a random access memory (RAM) 13, communicatively connected to the at least one processor 11. The memory stores computer programs executable by the at least one processor. The processor 11 can perform various appropriate actions and processes based on the computer program stored in the ROM 12 or loaded from storage unit 18 into the RAM 13. The RAM 13 may also store various programs and data required for the operation of the electronic device 10. The processor 11, ROM 12, and RAM 13 are interconnected via a bus 14. An input / output (I / O) interface 15 is also connected to the bus 14.

[0087] Multiple components in electronic device 10 are connected to I / O interface 15, including: input unit 16, such as keyboard, mouse, etc.; output unit 17, such as various types of displays, speakers, etc.; storage unit 18, such as disk, optical disk, etc.; and communication unit 19, such as network card, modem, wireless transceiver, etc. Communication unit 19 allows electronic device 10 to exchange information / data with other devices through computer networks such as the Internet and / or various telecommunications networks.

[0088] Processor 11 can be a variety of general-purpose and / or special-purpose processing components with processing and computing capabilities. Some examples of processor 11 include, but are not limited to, a central processing unit (CPU), a graphics processing unit (GPU), various special-purpose artificial intelligence (AI) computing chips, various processors running machine learning model algorithms, a digital signal processor (DSP), and any suitable processor, controller, microcontroller, etc. Processor 11 performs the various methods and processes described above, such as the method of simulating vents in a 3D printed mold.

[0089] In some embodiments, the method for simulating vents in a 3D-printed mold can be implemented as a computer program tangibly contained in a computer-readable storage medium, such as storage unit 18. In some embodiments, part or all of the computer program can be loaded and / or mounted on electronic device 10 via ROM 12 and / or communication unit 19. When the computer program is loaded into RAM 13 and executed by processor 11, one or more steps of the method for simulating vents in a 3D-printed mold described above can be performed. Alternatively, in other embodiments, processor 11 can be configured to perform the method for simulating vents in a 3D-printed mold by any other suitable means (e.g., by means of firmware).

[0090] Various embodiments of the systems and techniques described above herein can be implemented in digital electronic circuit systems, integrated circuit systems, field-programmable gate arrays (FPGAs), application-specific integrated circuits (ASICs), application-specific standard products (ASSPs), systems-on-a-chip (SoCs), complex programmable logic devices (CPLDs), computer hardware, firmware, software, and / or combinations thereof. These various embodiments may include implementations in one or more computer programs that can be executed and / or interpreted on a programmable system including at least one programmable processor, which may be a dedicated or general-purpose programmable processor, capable of receiving data and instructions from a storage system, at least one input device, and at least one output device, and transmitting data and instructions to the storage system, the at least one input device, and the at least one output device.

[0091] Computer programs used to implement the methods of the present invention may be written in any combination of one or more programming languages. These computer programs may be provided to a processor of a general-purpose computer, a special-purpose computer, or other programmable data processing device, such that when executed by the processor, the computer programs cause the functions / operations specified in the flowcharts and / or block diagrams to be performed. The computer programs may be executed entirely on a machine, partially on a machine, or as a standalone software package, partially on a machine and partially on a remote machine, or entirely on a remote machine or server.

[0092] In the context of this invention, a computer-readable storage medium can be a tangible medium that may contain or store a computer program for use by or in conjunction with an instruction execution system, apparatus, or device. A computer-readable storage medium may include, but is not limited to, electronic, magnetic, optical, electromagnetic, infrared, or semiconductor systems, apparatus, or devices, or any suitable combination thereof. Alternatively, a computer-readable storage medium may be a machine-readable signal medium. More specific examples of machine-readable storage media include electrical connections based on one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fibers, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.

[0093] To provide interaction with a user, the systems and techniques described herein can be implemented on an electronic device having: a display device (e.g., a CRT (cathode ray tube) or LCD (liquid crystal display) monitor) for displaying information to the user; and a keyboard and pointing device (e.g., a mouse or trackball) through which the user provides input to the electronic device. Other types of devices can also be used to provide interaction with the user; for example, feedback provided to the user can be any form of sensory feedback (e.g., visual feedback, auditory feedback, or tactile feedback); and input from the user can be received in any form (including sound input, voice input, or tactile input).

[0094] The systems and technologies described herein can be implemented in computing systems that include backend components (e.g., as data servers), or computing systems that include middleware components (e.g., application servers), or computing systems that include frontend components (e.g., user computers with graphical user interfaces or web browsers through which users can interact with implementations of the systems and technologies described herein), or any combination of such backend, middleware, or frontend components. The components of the system can be interconnected via digital data communication of any form or medium (e.g., communication networks). Examples of communication networks include local area networks (LANs), wide area networks (WANs), blockchain networks, and the Internet.

[0095] A computing system can include clients and servers. Clients and servers are generally located far apart and typically interact through communication networks. The client-server relationship is created by computer programs running on the respective computers and having a client-server relationship with each other. The server can be a cloud server, also known as a cloud computing server or cloud host, which is a hosting product within the cloud computing service system to address the shortcomings of traditional physical hosts and VPS services, such as high management difficulty and weak business scalability.

[0096] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0097] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. A method of simulating a gas permeable hole in a 3D printed mold, characterized by, The method comprises: determining a three-dimensional digital model of a target mold, generating printing path information of the target mold based on the three-dimensional digital model and printing process parameters; the printing process parameters are used to describe the scanning parameters of the 3D printing equipment in the simulation of the 3D printing process; determining the material parameters of the target mold and the equipment process parameters of the 3D printing equipment, determining the simulation printing result of the target mold based on the printing path information, the material parameters and the equipment process parameters; the simulation printing result is to describe the temperature distribution at different positions of the target mold in the simulation of the actual printing process of the target mold; based on the printing path information and the simulation printing result, generating the porosity distribution nephogram of the target mold; the porosity distribution nephogram is used to describe the distribution state of the air permeable hole of the target mold at different positions in the simulation of the actual printing process.

2. The method of claim 1, wherein, Based on the three-dimensional digital model and the printing process parameters, the printing path information of the target mold is generated, comprising: slicing the three-dimensional digital model along the height direction to generate a predetermined number of target printing layers; based on the printing process parameters, the printing scanning process of the target printing layer is simulated to generate the printing path information of each target printing layer.

3. The method of claim 1, wherein, Based on the printing path information, the material parameters and the equipment process parameters, the simulation printing result of the target mold is determined, comprising: generating a finite element grid model of the target mold based on the three-dimensional digital model; using the printing path information, the material parameters and the equipment process parameters as the constraints of the finite element grid, performing thermal physical analysis to generate the simulation printing result of the target mold.

4. The method of claim 3, wherein, Based on the printing path information and the simulation printing result, the porosity distribution nephogram of the target mold is generated, comprising: generating printing void distribution information of the target mold based on the printing path information; determining the thermal change state corresponding to different positions of the target mold according to the temperature distribution at different positions in the simulation printing result; generating temperature void analysis information of the target mold based on the thermal change state; the temperature void analysis information is the void information caused by temperature after thermal physical analysis; based on the printing void distribution information and the temperature void analysis information, generating the porosity distribution nephogram.

5. The method of claim 4, wherein, Based on the printing void distribution information and the temperature void analysis information, the porosity distribution nephogram is generated, comprising: coupling the printing void distribution information and the temperature void analysis information to generate a void coupling result; the void coupling result is used to describe the coupling result of the void generated in the printing process and the void generated by temperature; mapping the void coupling result into the finite element grid model to generate the porosity distribution nephogram of the target mold.

6. The method of claim 4, wherein, Based on the thermal change state, the temperature void analysis information of the target mold is generated, comprising: determining the melting state and phase change state of the material of the target mold through the thermal change state; determining the temperature void analysis information according to the melting state and / or phase change state.

7. The method of claim 1, wherein, The printing process parameters include a scanning speed, a scanning power, a scanning interval, and a scanning layer thickness.

8. A device for simulating a gas permeable hole in a 3D printed mold, characterized in that, The device comprises: An information determining module is configured to determine a three-dimensional digital model of a target mold, and generate printing path information of the target mold based on the three-dimensional digital model and printing process parameters; the printing process parameters are used to describe scanning parameters of a 3D printing device in a simulated 3D printing process; An analog printing result determining module is configured to determine material parameters of the target mold and device process parameters of the 3D printing device, and determine a simulated printing result of the target mold based on the printing path information, the material parameters, and the device process parameters; the simulated printing result is used to describe a temperature distribution of the target mold at different positions in a simulated actual printing process of the target mold; A distribution map determining module is configured to generate a pore distribution cloud map of the target mold based on the printing path information and the simulated printing result; the pore distribution cloud map is used to describe a distribution state of air permeable holes of the target mold at different positions in the actual printing process.

9. An electronic device, comprising: The electronic device comprises: at least one processor; and a memory connected with the at least one processor in communication; wherein the memory stores a computer program that can be executed by the at least one processor, and the computer program is executed by the at least one processor to enable the at least one processor to execute the 3D printing mold air permeable hole simulation method in any one of claims 1-7.

10. A computer-readable storage medium, characterized in that, The computer readable storage medium stores computer instructions, and the computer instructions are used to enable the processor to execute the 3D printing mold air permeable hole simulation method in any one of claims 1-7 when executed.

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