Preparation method of micro-channel plate

Abstract

The invention relates to a preparation method of a micro-channel plate, and the method comprises the following steps: 1) processing a transparent material to obtain a micro-channel plate substrate blank; 2) carrying out ultrasonic cleaning on the micro-channel plate substrate blank; 3) performing femtosecond laser induction on the cleaned micro-channel plate substrate blank to modify a glass substrate to form a modified area array; 4) performing ultrasonic chemical etching on the micro-channel plate substrate blank, and corroding the modified area array to form a through hole array; and 5) forming a micro-channel plate glass substrate, and carrying out ultrasonic cleaning on the micro-channel plate glass substrate. The invention has the following beneficial effects: (1) the problem of high manpower and cycle cost caused by various processes such as glass tube drawing, monofilament drawing, multifilament drawing, leveling and the like in the traditional process is solved; and (2) due to the adoption of accurate control and micro-nano manufacturing technologies, the technical problem of high-performance and low-cost preparation of the micro-channel plate is solved, and the yield is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of microchannel plate preparation, and in particular to the technical field of a method for preparing a microchannel plate. Background Art

[0002] The microchannel plate is a large-array electron multiplier and a core component of image intensifiers, photomultiplier tubes, mass spectrometers, etc. It has very high spatial and temporal resolution and electronic gain.

[0003] Micropore array channels ranging from a few microns to more than ten microns are distributed on the microchannel plate substrate. Currently, many glass fibers are assembled into a bundle and fused together at high temperature. From the fused fiber bundle, a slice is cut on the fiber axis at an offset angle of about 10°. The fiber has a fiber core of a material that can be etched away to obtain a hole pattern (channel). Then, through chemical treatment, a thin semiconductor layer is produced on the channel wall. The semiconductor layer is optimized to have a higher secondary electron emission efficiency and a certain low level of conductivity. The entire process flow is summarized as drawing single wires, arranging multi-filament rods, drawing multi-filaments, arranging plates, pressing plates, cold processing, cleaning, etching, and cleaning. The method for preparing optical channel plates requires a lot of manpower, material resources, and time, and the manufactured microchannel plates have problems such as low quality, low yield, and high ion feedback. The present invention adopts new process technology to solve the problem of high-performance and low-cost preparation of microchannel plates.

[0004] The defects of microchannel plates prepared by existing technologies are as follows: (1) Before forming the blank, it needs to go through processes such as drawing glass tubes, drawing single wires, drawing multiple wires, and arranging, which consumes a lot of manpower and processing time and is not conducive to cost control; (2) The through-hole structure of the channel plate is formed by corrosion, and the surface shape, signal-to-noise ratio, and resolution of the through-hole structure are difficult to guarantee; (3) The types of microchannel plate substrate materials are limited, and must be glass materials that can be drawn into single wires. Crystal materials cannot be used to prepare microchannel plates; (4) A large amount of high-temperature hydrogen reduction treatment is required, which is the main source of ion feedback problems.

[0005] Compared with the invention patent: (1) CN 106076443 B, a method for preparing a microchannel array plate, a device for obtaining droplets using the same, and a method for generating droplets, two different types of optical fiber glasses, one of which is ordinary optical fiber glass that cannot be corroded in dilute nitric acid, and the other is glass that can be corroded in dilute nitric acid. This patent has high requirements on materials and is prepared by chemical corrosion. The melted glass material mixed with the solvent is not conducive to collection and treatment and is easy to cause environmental pollution. During the melting process, the aperture quality of the microchannel plate cannot be artificially controlled. It also depends on the forming quality of the drawn optical fiber glass rod and cannot be made thinner, resulting in a relatively large aperture, uneven thickness, burrs, and more damage. The process is complicated and is not conducive to low-cost batch controllable preparation requirements.

[0006] (2) CN 104992893 B A method for preparing a microchannel plate places more emphasis on the thin film coating technology after the microchannel plate is processed and formed. The microchannel plate aperture processing technology still uses traditional process technologies such as single-filament and multi-filament chemical corrosion. The microchannel substrate still has problems such as large aperture, uneven thickness, burrs, and more breakage. The process is complicated and is not conducive to low-cost batch controllable preparation requirements.

[0007] (3) US20220267200A1GLASS STRUCTURES AND FABRICATION METHODS USINGLASER INDUCED DEEP ETCHING, a method for manufacturing a functionalized device for amplifying or multiplying electrons, comprising manufacturing a glass channel array by a laser-induced deep etching process, comprising (1) applying laser pulses to a glass substrate to form an array of modified regions, the laser said glass substrate having a thickness of less than 5 mm, the modified regions extending between two surfaces of the glass substrate, and (2) subsequently performing an etching process to selectively remove the modified regions to form an array of through grooves, and subsequently, depositing one or more materials on the glass channel array to form a functionalized device. The patent has the following defects: ① The laser used in the patent is a chirped pulse amplification laser source, and the minimum aperture prepared is 5μm, which is far from the required 3μm aperture and has a limited aspect ratio; ② Ultrasonic chemical etching is not used to accelerate the flow of the solution at the etching position to perform highly uniform physical and chemical treatment on the inner wall of the channel. The through-hole structure or cavity formed by etching is easily saturated with the corrosive liquid, resulting in incomplete corrosion of the modified structure and failure to improve the quality factor of the inner wall; ③ No mixed corrosive agent is used, making it difficult to ensure the maximum corrosion capacity of the corrosive agent during long-term use; ④ No anti-chemical corrosion protective layer is added before laser-induced chemical etching, which easily causes damage to the surface material around the micropores, affecting the quality of the pores; ⑤ The ultra-thin glass substrate is easy to deform at high temperatures, and there is no relevant control plan; ⑤ Although layered plating is used for the key functional layers of the functionalized glass substrate, there is no implementation case for the plating. Summary of the invention

[0008] The present invention is to solve the above-mentioned problems and defects, and provides a method for preparing a microchannel plate. The technical problem to be solved by the present invention is to use femtosecond laser induced modification, ultrasonic chemical etching of glass through-hole structure, CO2 laser to improve the quality factor of the through-hole, atomic deposition of inner wall film layer, evaporation electrode, break through the aperture limitation, without any surface defects (debris, microcracks, thermal stress), clarify the design and composition of high detection efficiency functional membrane, high densification preparation process of composite film layer, high-quality preparation process of glass microchannel plate, high uniformity of inner wall of glass microchannel plate channel, high-resolution ultra-thin glass microchannel plate deformation control, reduce the manpower and equipment cost and processing cycle of microchannel plate, improve the processing quality and gain performance of microchannel plate, broaden the range of processable substrate materials, so as to be more suitable for practical use.

[0009] The present invention adopts the following technical solutions to achieve the purpose and solve the technical problems.

[0010] A method for preparing a microchannel plate, the method of the present invention comprises the following steps: Step 1) Slicing, rounding, chamfering, polishing, and cleaning the transparent material to obtain a microchannel plate substrate blank; Step 2) ultrasonically cleaning the microchannel plate substrate blank to remove impurities on the surface of the substrate blank; Step 3) subjecting the cleaned microchannel plate substrate blank to femtosecond laser-induced modification of the glass substrate to form a modified region array; Step 4) ultrasonically chemically etching the microchannel plate substrate blank to etch the modified area array to form a through-hole array; Step 5) After the microchannel plate substrate blank is subjected to laser-induced chemical etching in step 2) and step 3), a microchannel plate glass substrate is formed, and the microchannel plate glass substrate is ultrasonically cleaned.

[0011] Furthermore, the method of the present invention comprises step 6) after the microchannel plate substrate blank is ultrasonically cleaned and inspected to be qualified, nano-composite resistors and emission layers are atomically deposited on the inner wall of the through hole, and electrodes are evaporated on both end surfaces.

[0012] Furthermore, the transparent material in step 1) of the present invention is glass, quartz or sapphire.

[0013] Furthermore, the ultrasonic cleaning environment of step 2) of the present invention is: deionized pure water at a temperature of 40-50° C., and the ultrasonic intensity of the ultrasonic cleaning equipment is set to 2A-4A.

[0014] Furthermore, step 3) of the present invention is specifically as follows: uniformly coating both end faces of the microchannel plate substrate blank to be processed with a layer of anti-chemical corrosion protection layer, placing it on a femtosecond laser processing device, and setting laser parameters; the femtosecond laser pulse forms an inclined micro-angle incidence of about 8-20° with the end face of the microchannel plate substrate blank; selectively processing the blank according to the designed microchannel array structure pattern, including the shape of the through-hole incident end, the area after laser processing will form an area of ​​through-hole structure modification, and the sample is fixed on a fixture platform for a one-time through-area modification.

[0015] Furthermore, the laser parameters of the present invention are: laser power 15-20W, wavelength 800-1200nm, frequency above 10kHz, scanning speed 0.3-0.5mm / s, pulse width <200fs, scanning times 1-2 times, single pulse energy 160μJ-200mJ.

[0016] Furthermore, the step 4) of the present invention is specifically: using a mixed chemical etchant, chemical etching is performed in a temperature-controlled ultrasonic bath heated to 80±3°C; the ultrasonic intensity is set at 2-4 A, and the etching time is 10-15 min. It is determined according to the material type and specification.

[0017] Furthermore, the mixed chemical etchant of the present invention is a mixture of HF-50% (concentration) and CH3COOH-90% (purity); the mass ratio of HF-50% to CH3COOH-90% is 5:7.

[0018] Furthermore, step 5) of the present invention is specifically as follows: immersing the microchannel plate glass substrate in an acetone solution to remove the chemical corrosion resistance coating, and then placing it in an ultrasonic cleaning device at room temperature and with an ultrasonic intensity set to be above 2A for ultrasonic cleaning, wherein a water-based cleaning agent is selected as the cleaning agent, and the medium is deionized pure water, and ultrasonic cleaning is performed for 15 minutes to remove the etching solution and impurities remaining in the through-holes of the microchannel plate.

[0019] Furthermore, step 6) of the present invention is specifically as follows: the microchannel plate glass substrate is moved to an atomic deposition chamber, and an atomic deposition technique (ALD) is used to deposit a nano-composite resistor layer and a nano-scale secondary emission layer on the inner wall of the channel, and a nano-composite resistor layer dielectric material doping mixture (such as W:Al2O3 or Mo:Al2O3 or ZnO:Al2O3 or W:ZrO2) and a nano-scale secondary emission layer material MgO or Al2O3 are prepared by a chemical vapor deposition method of a surface self-saturation reaction, and then placed in an electrode evaporation chamber, and the electrode material for plating is selected from nickel or lithium or silver or gold or an alloy material, and the vacuum chamber is maintained for 10 -5The vacuum degree is above Pa, and the layered evaporation method is adopted. The target temperature is controlled above the target gasification temperature, and the temperature of the microchannel plate substrate is controlled below 80℃ to prevent the microchannel plate blank from being affected by the thermal radiation of the target and causing deformation due to the increase in temperature; the immersion depth of electrode deposition: input end: ≤0.8d, output end: 2~3d, d is the diameter of the micropore.

[0020] The beneficial effects of the present invention are as follows: (1) It solves the problem of high labor and cycle costs caused by the numerous processes of drawing glass tubes, drawing single wires, drawing multiple wires, and arranging in the traditional process; (2) Low ion feedback; (3) High temperature deformation control of ultra-thin glass; (4) Due to the complete set of precise control, micro-nano manufacturing, atomic deposition, and ultrasonic chemical etching technologies, high performance (aperture resolution of up to 3 μm, electron gain exceeding 1×10 3 , working life greater than 11000h, high temperature process adaptability greater than 600℃, no surface defects in the hole), low cost (the cost is one-third of the traditional process, the cycle is one-half less, it is not limited by product shape, material, and scale, and is suitable for mass production) to overcome the technical difficulties in preparing microchannel plates and improve the yield rate.

[0021] The present invention is further explained below in conjunction with the accompanying drawings and specific embodiments. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] Figure 1 This is a schematic diagram of the results of comparative implementation case 1 of the present invention.

[0023] Figure 2 This is a microscopic morphology of microchannel defects in comparative implementation example 2 of the present invention.

[0024] Figure 3 This is a process principle diagram of the microchannel plate of the present invention.

[0025] Figure 4 This is a SEM comparison of the hole without chemical corrosion resistance layer (left) and the hole with chemical corrosion resistance layer (right) of the present invention.

[0026] Figure 5 This is a physical picture of the microchannel plate of the present invention.

[0027] Figure 6 This is a model diagram of the glass substrate of the microchannel plate of the present invention (cross-sectional view).

[0028] Figure 7 This is a model diagram of the glass substrate of the microchannel plate of the present invention (side view).

[0029] Figure 8 Schematic diagram of the functional film layer on the inner wall of the microchannel plate of the present invention. DETAILED DESCRIPTION

[0030] A method for preparing a microchannel plate, the method of the present invention comprises the following steps: Step 1) Slicing, rounding, chamfering, polishing, and cleaning the transparent material to obtain a microchannel plate substrate blank; Step 2) ultrasonically cleaning the microchannel plate substrate blank to remove impurities on the surface of the substrate blank; Step 3) subjecting the cleaned microchannel plate substrate blank to femtosecond laser-induced modification of the glass substrate to form a modified region array; Step 4) ultrasonically chemically etching the microchannel plate substrate blank to etch the modified area array to form a through-hole array; Step 5) After the microchannel plate substrate blank is subjected to laser-induced chemical etching in step 2) and step 3), a microchannel plate glass substrate is formed, and the microchannel plate glass substrate is ultrasonically cleaned.

[0031] Furthermore, the method of the present invention comprises step 6) after the microchannel plate substrate blank is ultrasonically cleaned and inspected to be qualified, a nano-composite resistance layer and a secondary emission layer are atomically deposited on the inner wall of the through hole, and contact electrodes are evaporated on both end surfaces.

[0032] Furthermore, the transparent material in step 1) of the present invention is glass, quartz or sapphire.

[0033] Furthermore, the ultrasonic cleaning environment of step 2) of the present invention is: deionized pure water at a temperature of 40-50° C., and the ultrasonic intensity of the ultrasonic cleaning equipment is set to 2A-4A.

[0034] Furthermore, step 3) of the present invention is specifically as follows: uniformly coating both end faces of the microchannel plate substrate blank to be processed with a layer of anti-chemical corrosion protection layer, placing it on a femtosecond laser processing device, and setting laser parameters; the femtosecond laser pulse forms an inclined micro-angle incidence of about 8-20° with the end face of the microchannel plate substrate blank; selectively processing the blank according to the designed microchannel array structure pattern, including the shape of the through-hole incident end, the area after laser processing will form an area of ​​through-hole structure modification, and the sample is fixed on a fixture platform for a one-time through-area modification.

[0035] Furthermore, the laser parameters of the present invention are: laser power 15-20W, wavelength 800-1200nm, frequency above 10kHz, scanning speed 0.3-0.5mm / s, pulse width <200fs, scanning times 1-2 times, single pulse energy 160μJ-200mJ.

[0036] Furthermore, the chemical etchant in step 4) of the present invention is specifically a mixed HF acid chemical etchant.

[0037] Furthermore, before the ultrasonic cleaning in step 5) of the present invention, the anti-chemical corrosion coating needs to be removed by immersion in an acetone solution, and the ultrasonic cleaning agent is deionized pure water.

[0038] Furthermore, in step 6) of the present invention, the materials of the resistance layer and the secondary emission layer are nano-scale dielectric materials, the difference being that the resistance layer also needs to deposit ZnO, W, Mo and other materials for doping and regulating resistance performance, while the secondary emission layer is a pure dielectric material.

[0039] Comparative implementation case 1: When the single pulse energy is less than 160 μJ, i.e., low energy, it is impossible to effectively induce the formation of substrate through holes, and the induction may even fail to damage the substrate, resulting in a passivation layer on the surface.

[0040] Furthermore, the step 4) of the present invention is specifically: using a mixed chemical etchant, chemical etching is performed in a temperature-controlled ultrasonic bath heated to 80±3°C; the ultrasonic intensity is set at 2-4 A, and the etching time is 10-15 min. It is determined according to the material type and specification.

[0041] Using this preparation method, the processing efficiency can reach 2000~3000 holes / s, the maximum aspect ratio can reach 100:1, the minimum pore diameter can reach 3μm, the end face opening ratio can reach 90%, and the processing materials include sapphire, quartz, glass and other transparent materials.

[0042] Comparative implementation case 2: Using other chemical etchants, such as acetone, cannot effectively remove laser-induced impurities, and the quality of microchannel forming is poor.

[0043] Furthermore, the mixed chemical etchant of the present invention is a mixture of HF-50% (concentration) and CH3COOH-90% (purity); the mass ratio of HF-50% to CH3COOH-90% is 5:7.

[0044] HF reacts with the substrate material to produce insoluble substances. This substance is suspended in the etching solution and adheres to the surface of the etching substrate, which can easily lead to the amplification of defects such as bad bumps, pits and scratches on the surface and edges, seriously affecting the surface quality of the etched product and the stability of the etching process rate. CH3COOH is acidic in an alkaline environment and acidic in a weak acid environment. The acidity will be weakened in a strong acid environment. Adding a certain amount of CH3COOH to HF can keep the HF corrosion rate stable, inhibit the unstable chemical reaction between a single HF and the substrate, help improve the etching efficiency and improve the etching quality, and further improve the chemical etching process of the substrate.

[0045] Furthermore, step 5) of the present invention is specifically as follows: immersing the microchannel plate glass substrate in an acetone solution to remove the chemical corrosion resistance coating, and then placing it in an ultrasonic cleaning device at room temperature and with an ultrasonic intensity set to be above 2A for ultrasonic cleaning, wherein a water-based cleaning agent is selected as the cleaning agent, and the medium is deionized pure water, and ultrasonic cleaning is performed for 15 minutes to remove the etching solution and impurities remaining in the through-holes of the microchannel plate.

[0046] Furthermore, step 6) of the present invention is specifically as follows: after the microchannel array of the microchannel plate is manufactured and inspected to be qualified, it is loaded into an atomic layer deposition chamber, and atomic deposition (ALD technology can overcome the problem of uneven growth of nano-thin films) can be used to functionalize a two-layer nano-composite resistor layer and an electron emission layer. The electron emission layer is a channel for generating secondary electrons internally, which is crucial to the electronic gain function of the microchannel plate.

[0047] Specifically: ①Vacuum baking pretreatment, vacuum degree 10 -5 Pa, the microchannel substrate is uniformly heated to 200°C in the deposition chamber at a rate not exceeding 10°C / min, and kept at 200°C for 10-20min to prevent the ultra-thin microchannel plate from drastic deformation due to high temperature; ②Deposit the functional film layer at 200℃. The nanocomposite resistor layer dielectric material W:Al2O3 and the secondary emission layer MgO component can be prepared by alternating pulses of WF6 (99.7%) and Si2H6 (99.997%) to obtain the W component of the nanocomposite layer; the Al2O3 component is made from trimethylaluminum (TMA, 97%) and deionized H2O; MgO is deposited from dicyclopentadiene-methylmagnesium (MgCp2, 99.96%) and H2O. The temperature of TMA and H2O is adjusted to 20℃, WF6 and Si2H6 are kept at room temperature, and MgCp2 is adjusted to above 80℃. The carrier gas is ultra-high purity 5N nitrogen with a constant flow of 300sccm. After deposition, annealing is performed in a nitrogen atmosphere. ③ Ensure sufficient precursor delivery to saturate the high surface area MCP substrate, resulting in uniform deposition on the front and back surfaces of the MCP and throughout the substrate pores. In order to achieve the required resistance range for a specific MCP geometry, the W:Al2O3 formulation needs to be optimized (precursor dosage time, purge time, and W:Al2O3 cycle ratio); ④ In order to make electrical contact, a vacuum thermal evaporator is used to evaporate the electrode metal or alloy material on the input and output surfaces of the MCP to deposit a 200nm electrode layer. The microchannel plate substrate is loaded in a rotating planetary fixture with the axis of the hole at 45° relative to the evaporation source. The bias angle of the MCP is taken into account with the deposition angle of the planet. The deposition of electrode material into the microchannel plate aperture is called end damage, which affects the performance of the microchannel plate substrate and controls the electrode deposition immersion depth: input end: ≤0.8d, output end: 2~3d, d is the microaperture diameter.

[0048] The above are only some specific embodiments of the present invention (since the present invention includes a numerical range, the embodiments cannot be exhaustive, and the protection scope recorded in the present invention includes the numerical range of the present invention and other technical key points). The specific content or common sense known in the scheme is not described in detail here (including but not limited to abbreviations, abbreviations, and units commonly used in the art). It should be pointed out that the above embodiments do not limit the present invention in any way. For those skilled in the art, all technical solutions obtained by equivalent substitution or equivalent transformation fall within the protection scope of the present invention. The scope of protection claimed in this application shall be based on the content of its claims, and the specific implementation methods and other records in the specification can be used to interpret the content of the claims.

Claims

1. A method for preparing a microchannel plate, characterized in that: The method comprises the following steps: Step 1) Slicing, rounding, chamfering, polishing, and cleaning the transparent material to obtain a microchannel plate substrate blank; Step 2) ultrasonically cleaning the microchannel plate substrate blank to remove impurities on the surface of the substrate blank; Step 3) subjecting the cleaned microchannel plate substrate blank to femtosecond laser-induced modification of the glass substrate to form a modified region array; Step 4) ultrasonically chemically etching the microchannel plate substrate blank to etch the modified area array to form a through-hole array; Step 5) After the microchannel plate substrate blank is subjected to laser-induced ultrasonic chemical etching in step 2) and step 3), a microchannel plate glass substrate is formed, and the microchannel plate glass substrate is ultrasonically cleaned.

2. The method for preparing a microchannel plate according to claim 1, characterized in that: The method comprises step 6) after the glass substrate of the microchannel plate is ultrasonically cleaned and inspected to be qualified, a nano-composite resistance layer and a nano-scale secondary emission layer are atomically deposited on the inner wall of the through hole, and electrodes are evaporated on both end surfaces.

3. The method for preparing a microchannel plate according to claim 1, characterized in that: The transparent material in step 1) is glass, quartz or sapphire.

4. The method for preparing a microchannel plate according to claim 1, characterized in that: The ultrasonic cleaning environment of step 2) is: deionized pure water at a temperature of 40-50° C., and the ultrasonic intensity of the ultrasonic cleaning equipment is set to 2A-4A.

5. The method for preparing a substrate for a microchannel plate according to claim 1, characterized in that: The step 3) is specifically as follows: uniformly coating both end faces of the microchannel plate substrate blank to be processed with a layer of anti-chemical corrosion protection layer, placing the blank on a femtosecond laser processing device, and setting laser parameters; the femtosecond laser pulse forms an inclined micro-angle incidence of about 8-20° with the end face of the microchannel plate substrate blank; selectively processing the blank according to the designed microchannel array structure pattern, including the shape of the through-hole incident end, and the area after laser processing will form an area of ​​through-hole structure modification, and the sample is fixed on a fixture platform for a one-time through-area modification.

6. The method for preparing a substrate for a microchannel plate according to claim 3, characterized in that: The laser parameters are: laser power 15-20W, wavelength 800-1200nm, frequency above 10kHz, scanning speed 0.3-0.5mm / s, pulse width <200fs, scanning times 1-2 times, single pulse energy 160μJ-200mJ.

7. The method for preparing a microchannel plate according to claim 5, characterized in that: The step 4) is specifically as follows: using a mixed chemical etchant, chemical etching is performed in a temperature-controlled ultrasonic bath heated to 80±3° C.; the ultrasonic intensity is set at 2A-4 A, and the etching time is 10-15 min.

8. The method for preparing a microchannel plate according to claim 7, characterized in that: The mixed chemical etchant is a mixture of HF-50% and CH3COOH-90%; the mass ratio of HF-50% to CH3COOH-90% is 5:

7.

9. The method for preparing a microchannel plate according to claim 1, characterized in that: The step 5) is specifically as follows: immersing the microchannel plate glass substrate in an acetone solution to remove the chemical corrosion resistance coating, and then placing it in an ultrasonic cleaning device at room temperature and with an ultrasonic intensity set to be above 2A for ultrasonic cleaning, using a water-based cleaning agent as the cleaning agent, using deionized pure water as the medium, and ultrasonic cleaning for 15 minutes to remove the etching solution and impurities remaining in the through-holes of the microchannel plate.

10. The method for preparing a microchannel plate according to claim 2, characterized in that: The step 6) is specifically as follows: moving the microchannel plate glass substrate to an atomic deposition chamber, using atomic deposition technology to deposit a nano-composite resistor layer and a nano-scale secondary emission layer on the inner wall of the channel; preparing a doped mixture of a nano-composite resistor layer dielectric material and a nano-scale secondary emission layer material by a chemical vapor deposition method of a surface self-saturation reaction; The dielectric material doping mixture of the nanocomposite resistor layer is W:Al2O3 or Mo:Al2O3 or ZnO:Al2O3 or W:ZrO2; The nanoscale secondary emission layer material is MgO or Al2O3; Then place the electrode deposition chamber, the electrode metal material is nickel, lithium, silver, gold or alloy material, and maintain the vacuum chamber for 10 -5 The vacuum degree is above Pa, and the layered evaporation method is adopted. The target temperature is controlled above the target gasification temperature, and the microchannel plate substrate temperature is controlled below 80°C; the electrode deposition immersion depth: input end: ≤0.8d, output end: 2~3d, d is the micropore diameter.

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