A low dielectric epoxy resin for copper clad laminate and its processing technology
By modifying hollow glass microbeads and specific combinations of low-dielectric fillers and curing agents, the dielectric constant of the epoxy resin is reduced, and the problems of high dielectric constant and high brittleness in the prior art are solved, thereby achieving high toughness and low dielectric copper clad material.
CN119432011BActive Publication Date: 2025-08-12JIANG SU YAO HONG ELECTRONICS CO LTD
2 Cites 0 Cited by
Patent Information
- Application Number
- CN202411562518.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-05
- Publication Date
- 2025-08-12
- Estimated Expiration
- 2044-11-05
AI Technical Summary
Technical Problem
The existing epoxy resin-based copper clad plate has a high dielectric constant and high brittleness, which limits its application in 5G communication.
Method used
Using a combination of low dielectric fillers and low dielectric curing agents, the dielectric constant and toughness are reduced and toughened by modifying the use of hollow glass microbeads and specific proportions of diamine modifiers, 4,4'-diaminodiphenyl ethers, and 4,4'-oxybisphthalic anhydrides.
Benefits of technology
It effectively reduces the dielectric constant of the epoxy resin, improves its toughness and processability, enhances compatibility with the curing agent, and improves curing efficiency.
✦ Generated by Eureka AI based on patent content.
Abstract
The invention relates to the field of copper clad laminates and specifically discloses a low-dielectric epoxy resin for copper clad laminates and a processing technology thereof. The low-dielectric epoxy resin for copper clad laminates comprises a component A and a component B. Component A comprises the following raw materials, calculated in parts by mass: 100-150 parts of acetone, 250-300 parts of bisphenol A epoxy resin, and 50-100 parts of low-dielectric fillers; component B comprises the following raw materials, calculated in parts by mass: 150-250 parts of a low-dielectric curing agent, 20-30 parts of a curing agent, and 10-20 parts of a curing accelerator. The preparation of the low-dielectric curing agent comprises the following steps: taking a diamine modifier, 4,4'-diaminodiphenyl ether, 4,4'-oxydiphthalic anhydride, and meta-cresol, stirring under nitrogen protection, adding isoquinoline, stirring, cooling, adding meta-cresol, discharging the material while hot into ethanol, washing, filtering, extracting to remove the meta-cresol, and vacuum drying to obtain the low-dielectric curing agent.
Need to check novelty before this filing date? Find Prior Art