Method for preparing adhesive for infrared detector and adhesive method

Abstract

The present application relates to the technical field of infrared detector adhesive technology, and provides a preparation method and a bonding method of an adhesive for an infrared detector, the preparation method comprising: mixing epoxy resin glue, a first organic solvent and a second organic solvent according to a mass ratio of 6:3:1; wherein the first organic solvent is mixed with base glue to obtain a first adhesive, and the second organic solvent is mixed with the first adhesive to obtain a target adhesive; wherein the viscosity coefficient of the first organic solvent is less than the viscosity coefficient of the epoxy resin glue, and the organic mass fraction of the second organic solvent is 75%. The adhesive prepared based on the above preparation method has strong bonding strength and can withstand the impact of cold and hot alternating stress; by using the adhesive, the number of air bubbles can be reduced, the bonding surface of the chip module of the infrared detector can be improved, and the shear strength of the bonding surface of the thermal dead weight block of the test Dewar can be improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of infrared detector adhesive glue, and particularly relates to a preparation method of adhesive glue for an infrared detector and an adhesive method. BACKGROUND

[0002] A refrigeration type infrared detector can improve detection sensitivity and resolution accuracy by keeping a detection element at a lower temperature through a refrigeration mechanism. Therefore, the refrigeration type infrared detector is often used in the military field and often faces complex and severe use environments, such as high vibration, high impact and repeated cold and hot stress, which greatly tests the reliability of the refrigeration type infrared detector.

[0003] In the assembly manufacturing process of the refrigeration type infrared detector, an adhesive process is a crucial link, and preparing suitable adhesive glue is an indispensable part of the adhesive process. The epoxy low-temperature glue is a kind of adhesive glue with good low-temperature resistance and excellent mechanical properties, which can play a role in bonding the chip module of the refrigeration type infrared detector. However, since the chip module of the refrigeration type infrared detector is often subjected to alternating cold and hot stress, stress concentration will occur at the bonding surface of the chip module. The epoxy low-temperature glue is prone to failure due to insufficient shear strength in this case, which cannot effectively fix the chip module, resulting in a significant reduction in the reliability of the refrigeration type infrared detector.

[0004] In view of the problem in the prior art that the adhesive glue fails due to insufficient bonding strength, resulting in reduced reliability of the refrigeration type infrared detector, no effective solution has been proposed so far. SUMMARY

[0005] The preparation method of adhesive glue for an infrared detector and the adhesive method provided by the embodiments of the present application at least solve the problem in the prior art that the adhesive glue fails due to insufficient bonding strength, resulting in reduced reliability of the refrigeration type infrared detector.

[0006] The preparation method of adhesive glue for an infrared detector provided by the embodiments of the present application comprises the following steps: using an epoxy resin glue as a base glue; mixing a first organic solvent with the base glue to obtain a first adhesive glue, wherein the viscosity coefficient of the first organic solvent is less than the viscosity coefficient of the epoxy resin glue; and mixing a second organic solvent with the first adhesive glue to obtain a target adhesive glue, wherein the organic mass fraction of the second organic solvent is 75%; and the mass ratio of the epoxy resin glue, the first organic solvent and the second organic solvent is 6:3:1. Mixing the first organic solvent with the base glue can make the obtained first adhesive glue have good wettability in a vacuum curing environment; and mixing the second organic solvent with the first adhesive glue can make the obtained target adhesive glue have high shear strength.

[0007] The preparation method of the adhesive for the infrared detector provided by the embodiment of the present application mixes the first organic solvent with the base adhesive, and comprises the following steps: adding the first organic solvent into the base adhesive; and stirring and mixing the first organic solvent and the base adhesive by using a centrifugal mixer and removing the bubbles; wherein the stirring temperature is set to be 26 DEG C, the stirring speed is set to be 400 r / min, and the stirring time is set to be 5-10 min. By fully stirring and removing the bubbles, the sealing performance and the thermal stability of the obtained first adhesive are improved, so that the bonding strength of the target adhesive is improved correspondingly.

[0008] The preparation method of the adhesive for the infrared detector provided by the embodiment of the present application mixes the second organic solvent with the first adhesive, and comprises the following steps: adding the second organic solvent into the first adhesive; and stirring and mixing the second organic solvent and the first adhesive by using a centrifugal mixer; wherein the stirring temperature is set to be 40-60 DEG C, the stirring speed is set to be 400 r / min, and the stirring time is set to be 3 min. The second organic solvent and the first adhesive are mixed uniformly.

[0009] The preparation method of the adhesive for the infrared detector provided by the embodiment of the present application, the epoxy resin adhesive is a heat sink epoxy resin adhesive, the viscosity coefficient of the epoxy resin adhesive is 14000-20000 cps; the first organic solvent is methanol or ethyl acetate, the viscosity coefficient of the first organic solvent is 7000 cps; and the second organic solvent is ethylene glycol or diethylene glycol. The heat sink epoxy resin adhesive belongs to a kind of epoxy resin adhesive, and has good high-temperature resistance.

[0010] The preparation method of the adhesive provided by the embodiment of the present application mixes the second organic solvent with the first adhesive to obtain the target adhesive, and comprises the following steps: mixing the mixture of the second organic solvent and the first adhesive with silver powder to obtain the target adhesive; wherein the mass ratio of the mixture to the silver powder is 9:1. The target adhesive mixed with the silver powder has stronger heat conduction capacity and can more effectively withstand the impact of cold and hot alternating stress.

[0011] The preparation method of the adhesive for the infrared detector provided by the embodiment of the present application mixes the mixture of the second organic solvent and the first adhesive with silver powder, and comprises the following steps: adding the silver powder into the mixture and standing for 30 min at 26 DEG C. By standing, the bubbles possibly generated in the process of adding the silver powder can naturally float to the surface and break, so that the air holes in the obtained target adhesive are reduced.

[0012] The chip module bonding method of the infrared detector provided by the embodiments of the present application is bonded based on any of the above target bonding glue, and comprises the following steps: processing a first array groove and a second array groove on two bonding surfaces of a target substrate respectively; performing cleaning and degassing treatment on the target substrate and a bonding component; applying target bonding glue in the first array groove until the target bonding glue covers the groove surface of the first array groove; applying the target bonding glue on the surface of the bonding component; placing the bonding component on the first array groove covered with the target bonding glue and pressing the bonding component with a tool to obtain a first bonding piece; performing solidification treatment on the first bonding piece to obtain a second bonding piece; applying the target bonding glue in the second array groove of the second bonding piece until the target bonding glue covers the groove surface of the second array groove; bonding a chip with the second array groove to obtain a third bonding piece; and performing solidification treatment on the third bonding piece to obtain a target bonding piece. The above infrared detector includes but is not limited to a refrigeration type infrared detector.

[0013] The chip module bonding method of the infrared detector provided by the embodiments of the present application, and the solidification treatment step comprises the following steps: baking at 0-40℃ for 40min; baking at 40-100℃ for 20min; solidifying at 120℃ for 1h; and waiting for natural cooling. Through the step of gradually heating, the thermal stress generated in the material of the first bonding piece and the third bonding piece due to too fast temperature change can be reduced.

[0014] The chip module bonding method of the infrared detector provided by the embodiments of the present application, and each groove in the first array groove and the second array groove is in a cylindrical shape, the diameter of the circular surface of the groove is 0.02mm, and the depth of the groove is 0.01mm. Determining the size of the groove is conducive to standardized production.

[0015] The method for testing the adhesion of the thermal ballast of the Dewar provided by the embodiment of the present application is based on the target adhesive glue described above, and comprises the following steps: processing a first array groove and a second array groove on two adhesive surfaces of a target substrate respectively, and processing a third array groove on an adhesive surface of the thermal ballast; performing cleaning and degassing treatment on the target substrate and the adhesive component; applying the target adhesive glue into the first array groove until the target adhesive glue covers the groove surface of the first array groove; applying the target adhesive glue on the surface of the adhesive component; placing the adhesive component on the first array groove covered with the target adhesive glue, and pressing the adhesive component by using a tool to obtain a first adhesive piece; performing solidification treatment on the first adhesive piece to obtain a second adhesive piece; applying the target adhesive glue into the second array groove of the second adhesive piece until the target adhesive glue covers the groove surface of the second array groove; applying the target adhesive glue into the third array groove of the thermal ballast until the target adhesive glue covers the groove surface of the third array groove; based on the second array groove covered with the target adhesive glue and the third array groove covered with the target adhesive glue, the thermal ballast is adhered to the target substrate to obtain a fourth adhesive piece; and performing solidification treatment on the fourth adhesive piece to obtain the target adhesive piece. The thermal ballast is an important component of the Dewar, and can simulate the thermal load of the actual infrared detector in the working state.

[0016] The preparation method and the adhesion method for the adhesive glue for the infrared detector provided by the embodiment of the present application solve the problem that the adhesive glue in the related art fails due to insufficient adhesion strength, and reduces the reliability of the refrigeration type infrared detector. The adhesive glue prepared based on the preparation method has strong adhesion strength, and can withstand the impact of cold and hot alternating stress. The use of the adhesive glue and the array groove can save the amount of adhesive glue and reduce bubbles, significantly improve the adhesion surface of the chip module of the infrared detector and the shear strength of the adhesion surface of the thermal ballast of the Dewar, and meet the use requirements of the infrared detector in a complex application environment and the use requirements of the Dewar in a harsh experimental environment. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description. Obviously, the drawings in the following description are only some embodiments of the present application, and those skilled in the art can also obtain other embodiments from these drawings without creative labor.

[0018] Figure 1 is a step flow chart of the preparation method of the adhesive glue for the infrared detector in the embodiment of the present application.

[0019] Figure 2 is an experimental result schematic diagram in the embodiment of the present application.

[0020] Figure 3 is a step flow chart of a bonding method of a chip module of an infrared detector in an embodiment of the present application.

[0021] Figure 4 is a structural schematic diagram of a first array groove in an embodiment of the present application.

[0022] Figure 5 is a structural schematic diagram of a second array groove in an embodiment of the present application.

[0023] Figure 6 is a step flow chart of a bonding method of a thermal deadweight of a test Dewar in an embodiment of the present application. DETAILED DESCRIPTION

[0024] Embodiments of the present application will be described in more detail by referring to the attached drawings. Although certain embodiments of the present application are shown in the drawings, it is understood that the present application can be implemented in various forms and should not be interpreted as being limited to the embodiments set forth herein, but rather these embodiments are provided to make the present application more thorough and complete. It is understood that the drawings and embodiments of the present application are for exemplary purposes only and are not intended to limit the scope of protection of the present application.

[0025] In the assembly manufacturing process of a refrigeration-type infrared detector, the bonding process is a crucial link, and preparing a suitable bonding glue is an indispensable part of the bonding process. Epoxy cryogenic glue is a bonding glue with good low-temperature resistance and excellent mechanical properties, which can play a role in bonding the chip module of the refrigeration-type infrared detector. However, since the chip module of the refrigeration-type infrared detector is often subjected to the action of alternating cold and hot stress, stress concentration will occur at the bonding surface of the chip module. The epoxy cryogenic glue is prone to failure under such conditions, cannot effectively fix the chip module, and greatly reduces the reliability of the refrigeration-type infrared detector.

[0026] Therefore, embodiments of the present application provide a preparation method of a bonding glue for an infrared detector and a bonding method.

[0027] Please refer to Figure 1 The preparation method of a bonding glue for an infrared detector provided by the embodiments of the present application comprises the following steps:

[0028] In step S101, an epoxy resin glue is used as a base glue.

[0029] In step S102, a first organic solvent is mixed with the base glue to obtain a first bonding glue, wherein the viscosity coefficient of the first organic solvent is less than the viscosity coefficient of the epoxy resin glue.

[0030] In step S103, the second organic solvent is mixed with the first adhesive to obtain a target adhesive, wherein the organic mass fraction of the second organic solvent is 75%.

[0031] The mass ratio of the epoxy resin adhesive, the first organic solvent and the second organic solvent is 6:3:1.

[0032] The epoxy resin adhesive is an adhesive prepared mainly from epoxy resin and generally includes two parts of epoxy resin and curing agent. The above epoxy resin adhesive as a base adhesive is a kind of existing adhesive that can be directly applied to the field of infrared detectors, but cannot solve the technical problems solved by the embodiments of the present application.

[0033] Mixing the first organic solvent with the base adhesive can make the obtained first adhesive have good wettability in a vacuum curing environment, and the target adhesive obtained by mixing the first adhesive with the second organic solvent has corresponding wettability. When the target adhesive contacts the bonding object, the target adhesive can spread well on the bonding surface of the bonding object, which is conducive to forming a uniform liquid film on the bonding surface of the bonding object.

[0034] Mixing the second organic solvent with the first adhesive can make the obtained target adhesive have a high shear strength. The shear strength, also known as the shear resistance, is the ability of a material to resist damage when subjected to a pair of external forces with equal size and opposite direction and acting lines close to each other, that is, shear force. In the plane of the pair of forces, shear deformation occurs. The shear strength is used to measure the limit ability of the material to resist being cut under such conditions, and the unit is pascal (Pa) or megapascal (MPa).

[0035] The viscosity coefficient, which can be simply referred to as viscosity, is a physical quantity describing the internal resistance of a fluid (liquid or gas) when flowing. The larger the viscosity coefficient, the worse the fluidity of the fluid, that is, the greater the internal friction between the fluids. Cps is the abbreviation of centipoise, which can also be written as cP, and is a relatively small unit of the viscosity coefficient. 1 centipoise is equal to 1 millipascal second (mPas), that is, 1 cps = 1 mPas.

[0036] The organic mass fraction refers to the proportion of the mass of the organic component in a certain substance to the total mass of the substance, which is usually expressed in percentage.

[0037] The preparation method of the adhesive for infrared detectors provided by the embodiments of the present application can prepare an adhesive with strong bonding strength. The bonding surface using the adhesive can significantly improve the shear strength, thereby effectively resisting the impact of cold and hot alternating stress.

[0038] It can be understood that the target adhesive prepared based on the preparation method described above is an epoxy low-temperature adhesive, which has the advantages of epoxy low-temperature adhesive and can better withstand the impact of cold and hot alternating stress.

[0039] Exemplarily, in the preparation method provided by the embodiments of the present application, the epoxy resin adhesive used is a heat sink epoxy resin adhesive with a viscosity coefficient of 14000-20000 cps; the first organic solvent used is methanol or ethyl acetate with a viscosity coefficient of 7000 cps; and the second organic solvent used is ethylene glycol or diethylene glycol.

[0040] The heat sink epoxy resin adhesive belongs to a kind of epoxy resin adhesive and has good high-temperature resistance.

[0041] Methanol is also known as hydroxymethane, wood alcohol or wood spirit. Ethyl acetate is also known as acetic acid ethyl ester. Ethylene glycol is also known as glycol or 1,2-ethylene glycol. Diethylene glycol is also known as diethylene glycol.

[0042] Exemplarily, the heat sink epoxy resin adhesive is EP21TDCht-lo adhesive or one of the Scotch-Weld series of low-temperature adhesives, such as 2216NS, DP420.

[0043] Optionally, in step S102, mixing the first organic solvent with the base adhesive comprises:

[0044] The first organic solvent is added to the base adhesive.

[0045] The first organic solvent and the base adhesive are mixed and deaerated by a centrifugal mixer.

[0046] The stirring temperature is set to 26°C, the stirring speed is set to 400 r / min, and the stirring time is set to 5-10 min.

[0047] It can be understood that the first organic solvent and the base adhesive can be fully mixed and deaerated by the centrifugal mixer, which is conducive to improving the sealing performance and thermal stability of the obtained first adhesive and the bonding strength of the target adhesive.

[0048] Optionally, in step S103, mixing the second organic solvent with the first adhesive comprises:

[0049] The second organic solvent is added to the first adhesive.

[0050] The second organic solvent and the first adhesive are mixed by a centrifugal mixer.

[0051] The stirring temperature is set to 40-60℃, the stirring speed is set to 400 r / min, and the stirring time is set to 3 min.

[0052] It can be understood that the second organic solvent and the first adhesive can be fully and uniformly stirred by the centrifugal mixer.

[0053] Preferably, in the step S103, the second organic solvent is mixed with the first adhesive to obtain the target adhesive, including:

[0054] The mixture of the second organic solvent and the first adhesive is mixed with the silver powder to obtain the target adhesive.

[0055] The mass ratio of the mixture to the silver powder is 9:1.

[0056] The target adhesive mixed with the silver powder has stronger heat conduction capacity and can more effectively withstand the impact of cold and hot alternating stress.

[0057] Specifically, the mixture of the second organic solvent and the first adhesive is mixed with the silver powder, including:

[0058] The silver powder is added to the above mixture and is placed at 26℃ for 30 min.

[0059] Through the placement, on the one hand, the bubbles that may be generated in the process of adding the silver powder can naturally float to the surface and break, thereby reducing the air holes in the obtained target adhesive; on the other hand, the silver powder can be more uniformly mixed with the above mixture.

[0060] Exemplarily, the above scheme is provided with experimental data to verify the technical effect, and the specific data are as follows:

[0061] In the experiment, Figure 2 , the old glue refers to the 2216NS resin glue of the Scotch-Weld series with a viscosity coefficient of 20000 cps.

[0062] The new glue refers to the target adhesive prepared by mixing the 2216NS resin glue as the base glue, ethyl acetate with a viscosity coefficient of 7000 cps as the first organic solvent, and ethylene glycol with an organic mass fraction of 75% as the second organic solvent according to a mass ratio of 6:3:1 by using the above preparation method provided by the embodiment of the present application.

[0063] Ten ceramic structural parts are used as samples in the experiment, and the numbers are 1-10.

[0064] Specifically, a ceramic structural part with two adhesive surfaces is used as a substrate, a used adhesive is used to bond the Kovar part on the first adhesive surface, and a new adhesive is used to bond the same Kovar part on the second adhesive surface. The shear strength of the first adhesive surface and the second adhesive surface is tested.

[0065] The first adhesive surface and the second adhesive surface are the same in size and shape. The same Kovar part refers to the Kovar part bonded on the second adhesive surface, which is the same in size and shape as the Kovar part bonded on the first adhesive surface. It can be understood that the same in size and shape means that the process error does not exceed the specified standard threshold.

[0066] In combination Figure 2 As shown in the experimental results, the shear strength of the second adhesive surface using the new adhesive is greater than that of the first adhesive surface using the used adhesive in 10 samples, which shows that the preparation method of the adhesive for the infrared detector provided by the embodiment of the present application can improve the bonding strength of the prepared adhesive, thereby better resisting the impact of cold and hot alternating stress.

[0067] Please refer to Figure 3 The adhesive method of the chip module of the infrared detector provided by the embodiment of the present application is based on the above target adhesive and includes the following steps:

[0068] Step S201, a first array groove and a second array groove are respectively processed on the two adhesive surfaces of the target substrate.

[0069] Step S202, the target substrate and the bonding part are cleaned and degassed.

[0070] Step S203, the target adhesive is applied in the first array groove until the target adhesive covers the groove surface of the first array groove; and the target adhesive is applied on the surface of the bonding part.

[0071] Step S204, the bonding part is placed on the first array groove covered with the target adhesive, and is pressed tightly with a tool to obtain a first bonding part.

[0072] Step S205, the first bonding part is solidified to obtain a second bonding part.

[0073] Step S206, the target adhesive is applied in the second array groove of the second bonding part until the target adhesive covers the groove surface of the second array groove.

[0074] Step S207, the chip is bonded with the second array groove to obtain a third bonding part.

[0075] Step S208, the third bonding part is solidified to obtain a target bonding part.

[0076] It can be understood that the infrared detector includes but is not limited to a refrigeration type infrared detector.

[0077] The chip module of the infrared detector includes but is not limited to the chip, the target substrate and the adhesive component, wherein the chip and the adhesive component are both required to be adhered to the target substrate.

[0078] The second array groove of the second adhesive member is the same array groove as the second array groove of the target substrate.

[0079] The adhesive component is a metal component, which is adhered to the target substrate as a cold platform, wherein the cold platform is also called a cold shield. The cold platform can provide a low-temperature environment and plays a role of structural support while providing a mechanical installation connection reference.

[0080] The adhesive method of the chip module of the infrared detector provided by the embodiment of the present application adopts the target adhesive glue, and therefore the adhesive method of the chip module includes all the technical effects of the target adhesive glue, which will not be described herein.

[0081] Optionally, the target substrate is a ceramic structural member, and the adhesive component is Kovar or Invar.

[0082] Kovar is a kind of iron-nickel-cobalt alloy, which is suitable for matching and sealing with glass or ceramic.

[0083] Invar is a kind of nickel-iron alloy, which can maintain a fixed length in a wide temperature range.

[0084] Optionally, the curing process is performed in steps S205 and S208, and the curing process includes:

[0085] Baking at 0-40℃ for 40 min.

[0086] Baking at 40-100℃ for 20 min.

[0087] Curing at 120℃ for 1 h.

[0088] Waiting for natural cooling.

[0089] Through the gradual heating, the thermal stress caused by the rapid temperature change in the materials of the first adhesive member and the third adhesive member can be reduced, and the molecules in the first adhesive member and the third adhesive member have enough time to rearrange and penetrate each other, thereby improving the adhesive strength.

[0090] For example, each groove in the first array groove and the second array groove is cylindrical, with a diameter of 0.02 mm and a depth of 0.01 mm.

[0091] Understandably, determining the dimensions of the grooves facilitates standardized production.

[0092] For example, please refer to Figure 4 The schematic diagram of the first array grooves shown shows that the grooves at the outer edge of the first array grooves form a circle, while the other grooves in the first array grooves are arranged radially around the center point to adapt to the shape of the adhesive component.

[0093] For example, please refer to Figure 5 The diagram shows the structure of the second array groove, which is rectangular in shape to fit the shape of the chip.

[0094] Understandably, technicians adjust the shape and arrangement of the first and second array grooves according to actual needs.

[0095] Please refer to Figure 6 The invention described herein provides a method for bonding a heat-bearing block for testing a Dewar, which is based on the aforementioned target adhesive and includes:

[0096] Step S301: Process the first array groove and the second array groove on the two bonding surfaces of the target substrate, respectively, and process the third array groove on the bonding surface of the heat-bearing block.

[0097] Step S302: Clean and degas the target substrate and bonding components.

[0098] Step S303: Apply the target adhesive to the first array groove until the target adhesive covers the groove surface of the first array groove; apply the target adhesive to the surface of the bonding component.

[0099] Step S304: Place the bonding component on the first array groove covered with the target adhesive and press it with a tooling to obtain the first bonding component.

[0100] Step S305: The first adhesive component is cured to obtain the second adhesive component.

[0101] Step S306: Apply the target adhesive to the second array groove of the second adhesive component until the target adhesive covers the groove surface of the second array groove; apply the target adhesive to the third array groove of the hot load block until the target adhesive covers the groove surface of the third array groove.

[0102] In step S307, the hot weight is bonded to the target substrate based on the second array of grooves covered with the target adhesive and the third array of grooves covered with the target adhesive, to obtain a fourth bonding piece.

[0103] In step S308, the fourth bonding piece is subjected to a curing process to obtain the target bonding piece.

[0104] The infrared detector includes but is not limited to a chip module, a Dewar, and a refrigerator. Generally, the chip module is integrated inside the Dewar, and the Dewar is coupled with the cold finger of the refrigerator through the refrigeration interface on the shell of the Dewar.

[0105] The test Dewar is a Dewar used for testing the performance of the refrigerator, such as testing the temperature characteristics, thermal response, thermal load, and thermal mass of the refrigerator. Compared with the Dewar, the test Dewar has more components, such as a hot weight, a test interface, and a calibration device. The hot weight is an important component of the test Dewar, which can simulate the thermal load of the actual infrared detector in the working state.

[0106] It can be understood that the bonding surface of the hot weight will bear a large alternating cold and hot stress, and the weight of the hot weight is greater than the weight of the chip in the above chip module, so the bonding surface of the hot weight needs to have a stronger bonding strength. Therefore, based on the bonding of the above target adhesive provided in the embodiments of the present application, a third array of grooves is processed on the bonding surface of the hot weight to enhance the bonding strength between the hot weight and the above target substrate.

[0107] The bonding method of the hot weight of the test Dewar provided in the embodiments of the present application adopts the above target adhesive, so the bonding method of the hot weight includes all the technical effects of the above target adhesive, and the corresponding technical effects will not be described here.

[0108] It can be understood that the bonding method of the hot weight of the test Dewar provided in the embodiments of the present application is similar to the bonding method of the chip module of the infrared detector provided in the embodiments of the present application, and the difference is that the chip used in the bonding method of the chip module of the infrared detector needs to be replaced by the hot weight. For the target substrate, the bonding component, the first array of grooves, and the second array of grooves used in the bonding method of the hot weight of the test Dewar, the skilled person can refer to the target substrate, the bonding component, the first array of grooves, and the second array of grooves used in the bonding method of the chip module of the infrared detector, or adjust them according to the actual situation, and they will not be described here.

[0109] Optionally, the hot weight is a red copper block.

[0110] The red copper block has good thermal conductivity and is suitable for being used as the hot weight of the test Dewar.

[0111] Optionally, the shape of the third array of grooves is consistent with the shape of the second array of grooves, for example, the shape of the third array of grooves and the shape of the second array of grooves are both rectangular. Of course, the skilled person can determine the shape of the third array of grooves according to the actual situation.

[0112] It should be noted that the term "comprising" and its conjugations used in the embodiments of the present application are open-ended, i.e., "including but not limited to". The term "based on" is "at least partially based on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The modification of "one", "multiple" in the embodiments of the present application is illustrative and not restrictive, and those skilled in the art should understand that unless the context clearly indicates otherwise, it should be understood as "one or more". The terms "first", "second", etc. are for description purposes only and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the technical features indicated.

[0113] The user information (including but not limited to user equipment information, user personal information, etc.) and data (including but not limited to data for analysis, stored data, displayed data, etc.) involved in the embodiments of the present application are all information and data authorized by the user or authorized by all parties, and the collection, use and processing of related data need to comply with relevant laws, regulations and standards of relevant countries and regions, and provide corresponding operation portal for user to choose authorization or refusal.

[0114] The steps described in the method embodiments provided by the embodiments of the present application can be executed in different order and / or in parallel. In addition, the method embodiments can include additional steps and / or omit the execution of the steps shown. The scope of protection of the present application is not limited in this respect.

[0115] The word "embodiment" in the specification means that the specific features, structures or characteristics described in connection with the embodiment can be included in at least one embodiment of the present application. The presence of this phrase in various places in the specification does not necessarily mean the same embodiment, nor does it mean independence or choice from other embodiments. Each embodiment in the specification is described in a relevant manner, and the same or similar parts between each embodiment refer to each other. In particular, for device, equipment, system embodiments, since they are basically similar to method embodiments, the description is relatively simple, and the relevant parts refer to the part of the method embodiment.

[0116] The above embodiments only express several implementation manners of the present application, the description is more specific and detailed, but it cannot be understood as the limitation of the protection scope. It should be pointed out that for ordinary skilled in the art, without departing from the concept of the present application, several modifications and improvements can be made, which belong to the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the appended claims.

Claims

1. A method of bonding a chip module of an infrared detector, characterized by, The method comprises the following steps: an epoxy resin glue is used as a base glue; a first organic solvent is mixed with the base glue to obtain a first adhesive glue, wherein the viscosity coefficient of the first organic solvent is less than that of the epoxy resin glue; a second organic solvent is mixed with the first adhesive glue to obtain a target adhesive glue, wherein the organic mass fraction of the second organic solvent is 75%; wherein the mass ratio of the epoxy resin glue, the first organic solvent and the second organic solvent is 6:3:1, the target adhesive glue belongs to an epoxy low-temperature glue; the epoxy resin glue is a heat sink epoxy resin glue, the viscosity coefficient of the epoxy resin glue is 14000-20000cps; the first organic solvent is methanol or ethyl acetate, the viscosity coefficient of the first organic solvent is 7000cps; the second organic solvent is ethylene glycol or diethylene glycol; a first array groove and a second array groove are respectively processed on two sides of a target substrate; the target substrate and an adhesive component are cleaned and degassed; the target adhesive glue is applied in the first array groove until the target adhesive glue covers the groove surface of the first array groove; the target adhesive glue is applied on the surface of the adhesive component; the adhesive component is placed on the first array groove covered with the target adhesive glue and is compressed by a tool to obtain a first adhesive piece; the first adhesive piece is cured to obtain a second adhesive piece; the target adhesive glue is applied in the second array groove of the second adhesive piece until the target adhesive glue covers the groove surface of the second array groove; a chip is bonded with the second array groove to obtain a third adhesive piece; the third adhesive piece is cured to obtain a target adhesive piece; wherein each groove in the first array groove and the second array groove is cylindrical, the diameter of the circular surface of the groove is 0.02mm, and the depth of the groove is 0.01mm; the curing process comprises baking at 0-40℃ for 40min, baking at 40-100℃ for 20min, curing at 120℃ for 1h, and waiting for natural cooling.

2. The bonding method of a chip module of an infrared detector according to claim 1, wherein Mixing the first organic solvent with the base glue comprises: adding the first organic solvent to the base glue; stirring and mixing the first organic solvent and the base glue by a centrifugal mixer and removing air bubbles; wherein the stirring temperature is set to 26℃, the stirring speed is set to 400r / min, and the stirring time is set to 5-10min.

3. The method of claim 1, wherein the adhesive is applied to the surface of the infrared detector chip module in a pattern of a plurality of lines. Mixing the second organic solvent with the first adhesive glue comprises: adding the second organic solvent to the first adhesive glue; stirring and mixing the second organic solvent and the first adhesive glue by a centrifugal mixer; wherein the stirring temperature is set to 40-60℃, the stirring speed is set to 400r / min, and the stirring time is set to 3min.

4. The method of claim 1, wherein the adhesive is applied to the surface of the infrared detector chip module in a pattern of a plurality of lines. Mixing the second organic solvent with the first adhesive glue to obtain a target adhesive glue comprises: mixing the mixture of the second organic solvent and the first adhesive glue with silver powder to obtain the target adhesive glue; The mass ratio of the mixture to the silver powder is 9:

1.

5. The method of claim 4, wherein the adhesive is applied to the surface of the infrared detector chip module in a pattern of a plurality of lines. Mixing the mixture of the second organic solvent and the first adhesive glue with silver powder, comprising: Adding silver powder to the mixture and standing for 30 min at 26℃.

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