Magnetic suspension blower semiconductor temperature control radial displacement monitoring device and use method
By using semiconductor temperature control modules and ceramic heat dissipation structures in magnetic levitation equipment, the radial sensors are cooled and cooled down, which solves the problem of severe heat generation and poor cooling effect in the prior art, and achieves efficient temperature control and stable Displacement monitoring.
Patent Information
- Application Number
- CN202411651226.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-19
- Publication Date
- 2025-02-14
AI Technical Summary
Existing radial sensors generate severe heat when approaching radial magnetic bearings and cannot effectively cool it, resulting in poor temperature control effect and unable to achieve effective cooling and cooling of the sensor.
The semiconductor temperature control module of the magnetic levitation blower is adopted to cool the radial sensor and sensor bracket through the semiconductor temperature control module, and heat release is accelerated by using ceramic heat sink plates and heat sinks.
The radial sensor is achieved individual temperature control, the cooling effect is improved, and the ceramic bracket and heat dissipation plate improve the high temperature and wear resistance, ensuring long-term stable monitoring of the radial displacement of the rotor.
Smart Images
Figure CN119435447A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of rotor displacement monitoring for magnetic suspension equipment, and in particular to a semiconductor temperature-controlled radial displacement monitoring device for a magnetic suspension blower and a use method thereof. Background Art
[0002] Most radial sensor components use an annular bracket structure, and displacement sensors are evenly installed on the circumference of the bracket. The output wires of the displacement sensor are transferred through the PCB board, and the PCB board is installed in the axial groove. The PCB board and the output wires are sealed and protected by pouring glue into the axial groove. Radial sensors are mostly used to detect the radial offset of the rotor, and the rotor offset is corrected through the controller. The existing radial sensors are close to the radial magnetic bearings, and they generate a lot of heat. The displacement sensor has high requirements for high temperature resistance, and the current radial sensor components are mostly cooled by air cooling, which has poor temperature control effect and cannot achieve effective cooling of the sensor. Summary of the invention
[0003] Technical purpose: In view of the above-mentioned deficiencies in the existing radial sensor cooling, the present invention discloses a magnetic suspension blower semiconductor temperature control radial displacement monitoring device and a method of use.
[0004] Technical solution: To achieve the above technical objectives, the present invention adopts the following technical solution: A semiconductor temperature-controlled radial displacement monitoring device for a magnetic suspension blower comprises a sensor bracket, a radial sensor and a semiconductor temperature control module which are arranged concentrically with a rotor. A radial hole for installing the radial sensor is arranged on the sensor bracket. The cold end of the semiconductor temperature control module corresponds to the circumferential position of the radial sensor. The radial sensor and the sensor bracket are cooled by the semiconductor temperature control module.
[0005] Preferably, the present invention provides a first mounting groove for installing the radial sensor into the corresponding radial hole and a second mounting groove for installing the semiconductor temperature control module on the sensor bracket, the first mounting groove and the second mounting groove are respectively opened on the surfaces on both sides of the sensor bracket, and a temperature sensor electrically connected to the control end of the semiconductor temperature control module is provided at one of the radial sensors.
[0006] Preferably, the semiconductor temperature control module of the present invention includes N-type semiconductor modules and P-type semiconductor modules distributed in a ring shape in the second mounting groove. The number of the N-type semiconductor modules is two groups, which are arranged in the inner circle and outer circle of the P-type semiconductor module. The N-type semiconductor modules and the P-type semiconductor modules are connected by copper sheets, one group of N-type semiconductor modules is connected to the positive pole of the power supply through the positive pole connecting line, and the other group of N-type semiconductor modules is connected to the negative pole of the power supply through the negative pole connecting line. When current passes through, corresponding cold ends and hot ends are formed, and a heat dissipation pressure plate for heat transfer is provided at the hot end.
[0007] Preferably, the heat dissipation plate and the sensor bracket of the present invention are both made of ceramic material.
[0008] Preferably, in the present invention, a heat sink for assisting heat dissipation is arranged on the plate surface of the heat dissipation pressure plate.
[0009] Preferably, in the present invention, a PCB board is arranged in the first installation groove, the PCB board is electrically connected to the temperature sensor and the radial sensor, and the output wires of the sensor are switched through the PCB board.
[0010] Preferably, in the present invention, epoxy resin is poured into the first mounting groove to fix and protect the PCB board and the sensor output wires.
[0011] The present invention discloses a method for using the semiconductor temperature-controlled radial displacement monitoring device for a magnetic levitation blower. After the displacement sensor bracket is installed and fixed, the radial displacement of the rotor is detected by a radial sensor, the temperature sensor detects the temperature of the radial sensor, the semiconductor temperature control module controls the cooling of the radial sensor by controlling the current passed, the cold end cools and absorbs heat of the radial sensor, and releases the heat through a heat dissipation pressure plate and a heat sink at the hot end.
[0012] Beneficial effects: The semiconductor temperature-controlled radial displacement monitoring device and use method of the magnetic levitation blower disclosed in the present invention can independently control the temperature of the radial sensor by using semiconductor refrigeration, thereby improving the cooling effect; at the same time, the bracket and the heat dissipation plate are both made of ceramic material, which has certain improvements in corrosion resistance, high temperature resistance, wear resistance, strength and hardness, and the bracket has small thermal deformation, which has certain improvements in detecting radial displacement. BRIEF DESCRIPTION OF THE DRAWINGS
[0013] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art are briefly introduced below.
[0014] Figure 1 This is the overall structural diagram of the monitoring device of the present invention; Figure 2 For the present invention Figure 1 Middle AA cross-section; Figure 3 For the present invention Figure 2 A partial enlarged view of the middle B area; Figure 4 This is a schematic diagram of the semiconductor temperature control module of the present invention being installed in the second installation groove; Among them, 1-sensor bracket, 2-radial sensor, 3-semiconductor temperature control module, 4-temperature sensor, 5-N-type semiconductor module, 6-P-type semiconductor module, 7-copper sheet, 8-heat dissipation pressure plate, 9-heat sink, 10-PCB board. DETAILED DESCRIPTION
[0015] Reference will now be made in detail to embodiments of the present disclosure, one or more examples of which are set forth herein below. Each embodiment and example is provided by way of explanation of the apparatus, composition and materials of the present disclosure, rather than limitation. On the contrary, the following description provides a convenient illustration of an exemplary embodiment for implementing the present disclosure. In fact, it will be clear to those skilled in the art that various modifications and variations may be made in the teachings of the present disclosure without departing from the scope or spirit of the present disclosure.
[0016] like Figure 1-Figure 4 As shown, the present invention discloses a semiconductor temperature control radial displacement monitoring device for a magnetic suspension blower, comprising a sensor bracket 1, a radial sensor 2 and a semiconductor temperature control module 3 which are arranged concentrically with a rotor. A radial hole for mounting the radial sensor 2 is arranged on the sensor bracket 1. The cold end of the semiconductor temperature control module 3 corresponds to the circumferential position of the radial sensor 2. The radial sensor 2 and the sensor bracket 1 are cooled by the semiconductor temperature control module 3.
[0017] To facilitate the assembly of the structure, the present invention provides a first mounting groove for installing the radial sensor 2 into the corresponding radial hole and a second mounting groove for installing the semiconductor temperature control module on the sensor bracket 1. The first mounting groove and the second mounting groove are respectively opened on the surfaces of both sides of the sensor bracket 1. A temperature sensor 4 electrically connected to the control end of the semiconductor temperature control module 3 is provided at one of the radial sensors 2. The temperature sensor 4 detects the temperature of the adjacent radial sensor 2 and uses this as the basis for temperature control of the semiconductor temperature control module 3. A PCB board 10 is provided in the first mounting groove. The PCB board 10 is electrically connected to the temperature sensor 4 and the radial sensor 2. The sensor output line is transferred through the PCB board 10, and then the PCB board and the sensor output line are fixed and protected by pouring epoxy resin.
[0018] like Figure 3 and Figure 4 As shown, the semiconductor temperature control module 3 of the present invention includes an N-type semiconductor module 5 and a P-type semiconductor module 6 distributed in a ring shape in the second mounting groove. The number of the N-type semiconductor modules 5 is two groups, which are respectively arranged in the inner circle and the outer circle of the P-type semiconductor module 6. The N-type semiconductor modules 5 and the P-type semiconductor modules 6 are connected through a copper sheet 7, one group of N-type semiconductor modules 5 is connected to the positive pole of the power supply through a positive pole connecting line, and the other group of N-type semiconductor modules 5 is connected to the negative pole of the power supply through a negative pole connecting line. When current passes through, corresponding cold ends and hot ends are formed, and a heat dissipation pressure plate 8 for heat transfer is arranged at the hot end. A heat sink 9 for auxiliary heat dissipation is arranged on the plate surface of the heat dissipation pressure plate 8, and the heat dissipation of the hot end is realized through the heat sink.
[0019] The heat dissipation plate 8 and the sensor bracket 1 of the present invention are both made of ceramic material. The bracket is changed from ordinary steel to ceramic, which has certain improvements in corrosion resistance, high temperature resistance, wear resistance, strength and hardness. At the same time, the ceramic bracket has small thermal deformation, which is conducive to ensuring the displacement monitoring accuracy of the displacement sensor.
[0020] The present invention discloses a method for using the semiconductor temperature-controlled radial displacement monitoring device for a magnetic levitation blower. After the displacement sensor bracket is installed and fixed, the radial displacement of the rotor is detected by a radial sensor, the temperature sensor detects the temperature of the radial sensor, the semiconductor temperature control module controls the cooling of the radial sensor by controlling the current passed, the cold end cools and absorbs heat of the radial sensor, and releases the heat through a heat dissipation pressure plate and a heat sink at the hot end.
[0021] When cooling the radial sensor, direct current is passed to the semiconductor temperature control module, and the current flows from the N-type semiconductor module to the P-type semiconductor module to absorb heat, forming a cold end to cool the radial sensor, and then the current flows from the P-type semiconductor module to another N-type semiconductor module to release heat, forming a hot end, and heat is released through the heat dissipation pressure plate and heat sink pressed on the hot end. Through the cooling method of the present invention, the radial sensor can be individually temperature controlled, so that it is not affected by the equipment, and long-term stable monitoring of the radial displacement of the rotating shaft can be achieved.
Claims
1. A semiconductor temperature control radial displacement monitoring device for a magnetic suspension blower, characterized in that: The invention comprises a sensor bracket (1), a radial sensor (2) and a semiconductor temperature control module (3) which are arranged concentrically with a rotor, wherein a radial hole for mounting the radial sensor (2) is arranged on the sensor bracket (1), a cold end of the semiconductor temperature control module (3) corresponds to a circumferential position of the radial sensor (2), and the radial sensor (2) and the sensor bracket (1) are cooled by the semiconductor temperature control module (3).
2. The magnetic suspension blower semiconductor temperature control radial displacement monitoring device according to claim 1 is characterized in that: A first mounting groove for mounting a radial sensor (2) into a corresponding radial hole and a second mounting groove for mounting a semiconductor temperature control module are provided on the sensor bracket (1); the first mounting groove and the second mounting groove are respectively provided on surfaces on both sides of the sensor bracket (1); and a temperature sensor (4) electrically connected to a control end of the semiconductor temperature control module (3) is provided at one of the radial sensors (2).
3. The magnetic suspension blower semiconductor temperature control radial displacement monitoring device according to claim 2 is characterized in that: The semiconductor temperature control module (3) comprises an N-type semiconductor module (5) and a P-type semiconductor module (6) which are distributed in a ring shape in the second installation groove. The number of the N-type semiconductor modules (5) is two groups, which are respectively arranged in the inner ring and the outer ring of the P-type semiconductor module (6). The N-type semiconductor modules (5) and the P-type semiconductor modules (6) are connected to each other through a copper sheet (7). One group of the N-type semiconductor modules (5) is connected to the positive pole of the power supply through a positive pole connecting line, and the other group of the N-type semiconductor modules (5) is connected to the negative pole of the power supply through a negative pole connecting line. When current passes through, corresponding cold ends and hot ends are formed. A heat dissipation pressure plate (8) for heat transfer is provided at the hot end.
4. The magnetic suspension blower semiconductor temperature control radial displacement monitoring device according to claim 3 is characterized in that: The heat dissipation pressure plate (8) and the sensor bracket (1) are both made of ceramic material.
5. The magnetic suspension blower semiconductor temperature control radial displacement monitoring device according to claim 3 or 4, characterized in that: A heat sink (9) for assisting heat dissipation is arranged on the plate surface of the heat dissipation pressure plate (8).
6. The magnetic suspension blower semiconductor temperature control radial displacement monitoring device according to claim 2 is characterized in that: A PCB board (10) is arranged in the first installation groove, the PCB board (10) is electrically connected to the temperature sensor (4) and the radial sensor (2), and the output wires of the sensors are switched via the PCB board (10).
7. The magnetic suspension blower semiconductor temperature control radial displacement monitoring device according to claim 6 is characterized in that: Epoxy resin is poured into the first mounting groove to fix and protect the PCB board and the sensor output wires.
8. The method for using the semiconductor temperature control radial displacement monitoring device for a magnetic suspension blower according to any one of claims 1 to 7, characterized in that: After the displacement sensor bracket is installed and fixed, the radial offset of the rotor is detected by the radial sensor, the temperature sensor detects the temperature of the radial sensor, and the semiconductor temperature control module controls the cooling of the radial sensor by controlling the current passed through. The cold end cools and absorbs heat from the radial sensor, and releases the heat through the heat dissipation pressure plate and heat sink at the hot end.