A packaging structure for a dual-temperature zone integrated beam splitter

Abstract

This invention discloses a packaging structure for a dual-temperature zone integrated beam splitter, including an A-band component, a B-band component, a cold platform cavity, a beam splitter, a cold screen, a window, an A-type cooler, a B-type cooler, and a Dewar cavity. The cold platform cavity is thermally insulated and mounted within the Dewar cavity. The A-band mounting surface, B-band mounting surface, and beam splitter mount mounting surface within the cold platform cavity are perpendicular to each other. The A-band component and B-band component are cooled by separate coolers. The beam splitter forms a 45° angle with both the A-band and B-band mounting surfaces. This invention features high integration, a compact structure, and light weight. It enables dual-temperature zone temperature control and is suitable for applications where a beam splitter and multi-band detectors are integrated simultaneously on the same cold platform for cryogenic applications.

Description

Technical Field

[0001] This invention relates to the field of optical detection and imaging technology, specifically to a packaging structure for a dual-temperature zone integrated beam splitter, which is suitable for integrating a beam splitter and a multi-band detector on the same cold platform to achieve low-temperature applications. Background Technology

[0002] In the fields of optical detection and imaging technology, particularly in Earth remote sensing, astronomical observation, medical imaging, and scientific research, it is often necessary to utilize electromagnetic radiation of different bands to obtain full-spectrum information of targets. Traditional multi-band detector systems typically employ independent packaging, meaning each band's detector and its related components are individually packaged in a separate structure. While this design is simple and straightforward, it results in large size, high cost, and complex thermal management. Furthermore, during the integration and packaging of multi-band detectors, different bands may have varying requirements for cooling capacity and temperature. For example, infrared detectors in the mid-to-shortwave band generally require cooling temperatures above 80K, while long-wave and very long-wave bands often require cooling temperatures below 60K. Therefore, in cryogenic applications, achieving zoned temperature control and effectively managing the system's thermal load while minimizing heat leakage is a critical technology. Traditional packaging structures often struggle to simultaneously meet these requirements, necessitating a novel packaging structure to achieve temperature-zoned detector integration and cryogenic applications. Summary of the Invention

[0003] The purpose of this invention is to provide a packaging structure for a dual-temperature zone integrated beam splitter, which solves the problems of large size, high cost and complex thermal management in the prior art, and provides a new way to prepare novel integrated dual-temperature zone Dewar or cold box components.

[0004] To achieve the above objectives, the technical solution of the present invention is as follows:

[0005] A dual-temperature zone integrated beam splitter packaging structure has a cold platform cavity that is thermally insulated and installed in a Dewar cavity; the cold platform cavity is provided with an A-band component mounting surface, a B-band component mounting surface, a beam splitter frame mounting surface, and a cold screen mounting surface;

[0006] An A-band component is installed on the A-band component mounting surface, a B-band component is installed on the B-band component mounting surface, a beam splitter frame is installed on the beam splitter frame mounting surface, and the beam splitter is mounted on the beam splitter frame; a cold screen is bonded and installed on the cold screen mounting surface.

[0007] It also sets up an A-band chiller connected to an A-band module and a B-band chiller connected to a B-band module;

[0008] The cold screen mounting surface is parallel to the A-band component mounting surface; the A-band component mounting surface and the B-band component mounting surface are perpendicular to each other; the angle between the beam splitter and the A-band and B-band mounting surfaces is 45°±1°.

[0009] A window is set at the location of the cold screen corresponding to the Dewar cavity;

[0010] The operating temperature of A-band components is lower than that of B-band components.

[0011] The A-band assembly includes an A-band substrate, an A-band detector, an A-band filter holder, and an A-band filter;

[0012] The A-band detector is located on the front side of the A-band substrate, and the A-band filter is located on the front side of the A-band detector; the A-band filter holder is located on the front side of the A-band substrate, and the A-band filter is located on the A-band filter holder; the A-band detector is a single chip or an array of multiple chips.

[0013] An A-band cold chain is also provided. The A-band refrigerator is connected to the A-band components through the A-band cold chain. One end of the A-band cold chain is connected to the back of the A-band substrate, and the other end is connected to the A-band refrigerator.

[0014] A hollow frame-type A-band thermal insulation support is also provided along the edge of the A-band substrate, and the A-band components are mounted on the A-band mounting surface through the A-band thermal insulation support.

[0015] The A-band thermal insulation support is made of titanium alloy material with low thermal conductivity.

[0016] The B-band assembly includes a B-band substrate, a B-band detector, a B-band filter holder, and a B-band filter.

[0017] The B-band detector is located on the front side of the B-band substrate, and the B-band filter is located on the front side of the B-band detector; the B-band filter holder is located on the front side of the B-band substrate, and the B-band filter is located on the B-band filter holder.

[0018] A B-band detector is a single chip or an array of multiple chips.

[0019] A B-band cold chain is also provided. The B-band refrigerator is connected to the B-band components through the B-band cold chain. One end of the B-band cold chain is connected to the back of the B-band substrate, and the other end is connected to the B-band refrigerator.

[0020] The outer surface of the cold platform cavity is polished or coated with a high-reflectivity coating, and the inner surface is coated with a low-reflectivity coating; the outer surface of the cold screen facing the window is polished or coated with a high-reflectivity coating, and the inner surface facing the cold platform cavity is coated with a low-reflectivity coating.

[0021] The beam splitter frame, A-band filter frame, and B-band filter frame are treated with low reflectivity; the inner wall of the Dewar cavity is treated with high reflectivity.

[0022] The cold platform cavity is made of a material with a low coefficient of thermal expansion;

[0023] The window is made of zinc selenide.

[0024] The inner surface of the cold platform cavity is treated with black nickel for low reflectivity, while the outer surface is treated with high reflectivity gold plating; both the A-band and B-band filter frames are treated with black nickel for low reflectivity; the beam splitter frame is treated with black nickel for low reflectivity; the inner surface of the cold screen is treated with black nickel for low reflectivity, while the outer surface is treated with polished gold plating; the inner wall of the Dewar cavity is treated with polished gold plating.

[0025] The cold platform cavity is made of Invar alloy.

[0026] A window cap is also provided, and the window and the window cap are airtightly welded together to form a joint, which is then airtightly connected to the Dewar cavity.

[0027] The beneficial effects of this invention are:

[0028] 1. This invention integrates the beam splitter and multi-band detector onto a single cold platform, resulting in high integration, a compact structure, and light weight. 2. It achieves dual-zone temperature control. The A-band and B-band components are cooled by the A-band and B-band refrigerators respectively. Furthermore, the B-band refrigerator simultaneously cools the cold platform cavity. This not only reduces the temperature of the beam splitter but also provides pre-cooling for the A-band components, effectively reducing system heat leakage. 3. A cold chain connection is used between the refrigerators and each band component. The flexibility of the cold chain effectively reduces the impact of refrigerator vibration on registration accuracy. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of the present invention.

[0030] Figure 2 This is a schematic diagram of the cooling platform cavity structure in this invention.

[0031] Figure 3 This is a schematic diagram of the A-band component structure in this invention.

[0032] Figure 4 This is a schematic diagram of the B-band component structure in this invention.

[0033] In the diagram: 1- A-band component; 101- A-band substrate; 102- A-band detector; 103- A-band filter holder; 104- A-band cold chain; 105- A-band filter; 106- A-band thermal insulation support; 2- B-band component; 201- B-band substrate; 202- B-band detector; 203- B-band filter holder; 204- B-band cold chain; 205- B-band filter; 3-Cold platform cavity; 301-A-band component mounting surface; 302-B-band component mounting surface; 303-Beam splitter mount mounting surface; 304-Cold screen mounting surface; 4-Beam splitter; 5-Beam splitter mount; 6-Cold screen; 7-Window cap; 8-Window; 9-A-band refrigerator; 10-B-band refrigerator; 11-Dewar cavity. Detailed Implementation

[0034] To simplify the description of this embodiment, some components that are well-known to those skilled in the art but are not related to the main content of this invention may be omitted in the accompanying drawings or description. Additionally, for ease of description, some components in the drawings may be omitted, enlarged, or reduced, but these do not represent the actual product dimensions or the complete structure.

[0035] To enable those skilled in the art to better understand the technical solutions of this invention, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of this invention.

[0036] The present invention will be further described below with reference to the accompanying drawings. The drawings are for illustrative purposes only and should not be construed as limiting the scope of this patent.

[0037] The present invention will now be further described in conjunction with the embodiments and accompanying drawings:

[0038] This invention relates to a packaging structure for a dual-temperature zone integrated beam splitter, such as... Figure 1 As shown, a cold platform cavity 3 is insulated and installed within the Dewar cavity 11; as Figure 2 As shown, the cold platform cavity 3 is provided with an A-band component mounting surface 301, a B-band component mounting surface 302, a beam splitter mount mounting surface 303, and a cold screen mounting surface 304.

[0039] A band A component 1 is installed on the A-band component mounting surface 301, a band B component 2 is installed on the B-band component mounting surface 302, a beam splitter frame 5 is installed on the beam splitter frame mounting surface 303, and a beam splitter 4 is installed on the beam splitter frame 5; a cold screen 6 is attached and installed on the cold screen mounting surface 304.

[0040] It also sets up an A-band chiller 9 connected to the A-band component 1, and a B-band chiller 10 connected to the B-band component 2.

[0041] The A-band component 1 includes an A-band substrate 101, an A-band detector 102, an A-band filter holder 103, and an A-band filter 105; such as Figure 3 As shown, the A-band detector 102 is disposed on the front side of the A-band substrate 101, and the A-band filter 105 is disposed on the front side of the A-band detector 102; the A-band filter holder 103 is disposed on the front side of the A-band substrate 101, and the A-band filter 105 is disposed on the A-band filter holder 103. The A-band detector 102 can be a single chip or an array of multiple chips.

[0042] Preferably, an A-band cold chain 104 is also provided. The A-band refrigerator 9 is connected to the A-band component 1 through the A-band cold chain 104. One end of the A-band cold chain 104 is connected to the back of the A-band substrate 101, and the other end is connected to the A-band refrigerator 9. By utilizing the flexibility of the A-band cold chain 104, the impact of vibration of the A-band refrigerator 9 on the registration accuracy can be effectively reduced.

[0043] Furthermore, a hollow frame-type A-band thermal insulation support 106 is provided along the edge of the A-band substrate 101, and the A-band component 1 is mounted on the A-band mounting surface 301 through the A-band thermal insulation support 106.

[0044] Among them, the A-band detector 102 is a long-wave infrared array detector, and the A-band detector 102 is mounted on the front side of the A-band substrate 101 using low-temperature epoxy adhesive.

[0045] The A-band filter holder 103 has a black nickel low-reflection treatment. The A-band filter 105 is first mounted on the A-band filter holder 103 using low-temperature epoxy adhesive, and then the entire assembly is mounted on the front side of the A-band substrate 101 using epoxy adhesive. The A-band filter 105 is located above the A-band detector 102. The A-band thermal insulation support 106 is made of titanium alloy with low thermal conductivity and is made into a hollow frame structure and mounted on the outer edge of the A-band substrate 101. The parallelism between the photosensitive surface of the A-band detector 102 chip and the mounting surface of the A-band thermal insulation support 106 is controlled to be less than 0.01 mm. Finally, the A-band assembly 1 is mounted on the A-band mounting surface 301 of the cold platform cavity 3 using screws through the A-band thermal insulation support 106. The photosensitive surface of the A-band detector 102 is controlled to be parallel to the A-band mounting surface 301, with an assembly deviation of less than ±0.2°.

[0046] like Figure 4 As shown, the B-band component 2 includes a B-band substrate 201, a B-band detector 202, a B-band filter holder 203, and a B-band filter 205.

[0047] A B-band detector 202 is disposed on the front side of a B-band substrate 201, and a B-band filter 205 is disposed on the front side of the B-band detector 202; a B-band filter holder 203 is disposed on the front side of the B-band substrate 201, and the B-band filter 205 is disposed on the B-band filter holder 203. The B-band detector 202 can be a single chip or an array of multiple chips.

[0048] Preferably, a B-band cold chain 204 is also provided. The B-band refrigerator 10 is connected to the B-band component 2 through the B-band cold chain 204. One end of the B-band cold chain 204 is connected to the back of the B-band substrate 201, and the other end is connected to the B-band refrigerator 10. Similarly, by utilizing the flexibility of the B-band cold chain 204, the impact of the vibration of the B-band refrigerator 10 on the registration accuracy can be effectively reduced.

[0049] Among them, the B-band detector 202 is a mid-wave infrared external array detector, and the B-band detector 202 is mounted on the front side of the B-band substrate 201 using low-temperature epoxy adhesive.

[0050] The B-band filter holder 203 has a black nickel low-reflection treatment. The B-band filter 205 is first mounted on the B-band filter holder 203 using low-temperature epoxy adhesive, and then the entire assembly is mounted on the front side of the B-band substrate 201 using epoxy adhesive. The B-band filter 205 is located above the B-band detector 202. The B-band assembly 2 does not have thermal insulation support. After the above work is completed, the B-band assembly 2 is mounted on the B-band mounting surface 302 of the cold platform cavity 3 using fixing screws through the B-band substrate 201. The photosensitive surface of the B-band detector 202 is controlled to be parallel to the B-band mounting surface 302, with an assembly deviation of less than ±0.2°.

[0051] A-band detector 102 is a long-wave infrared array detector, and B-band detector 202 is a medium-wave infrared array detector. The operating temperature of A-band component 1 is lower than that of B-band component 2.

[0052] The Dewar cavity 11 is pre-welded airtightly to the A-band refrigerator 9 and the B-band refrigerator 10. The A-band component 1 and the B-band component 2 are thermally insulated and installed inside the Dewar cavity 11. The A-band cold chain 104 and the A-band refrigerator 9 are connected by screws, and the B-band cold chain 204 and the B-band refrigerator 10 are connected.

[0053] The cold platform cavity 3 is made of Invar alloy with a low coefficient of thermal expansion. The outer surface of the cold platform cavity 3 is polished or plated with a high-reflectivity coating, and the inner surface is plated with a low-reflectivity coating. The inner surface of the cold platform cavity 3 is treated with black nickel for low reflectivity, and the outer surface is treated with high-reflectivity gold plating.

[0054] The mounting surfaces 301 and 302 of the A-band component and the B-band component are perpendicular to each other, and the perpendicularity tolerance is less than 0.01 mm.

[0055] The cold screen mounting surface 304 is parallel to the A-band component mounting surface 301; the outer surface of the cold screen 6 facing the window 8 is polished or plated with a high reflectivity coating, and its inner surface facing the cold platform cavity 3 is plated with a low reflectivity coating; the inner surface of the cold screen 6 is treated with black nickel low reflectivity, and the outer surface is treated with polished gold plating.

[0056] The surface of the beam splitter frame 5 is treated with black nickel for low reflection. The beam splitter 4 is first installed on the beam splitter frame 5 using low-temperature epoxy adhesive, and then installed on the beam splitter frame mounting surface 303 with screws. The angle between the beam splitter 4 and the A-band mounting surface 301 and the B-band mounting surface 302 is 45°, and the assembly deviation is controlled within ±0.1°.

[0057] The photosensitive surface of the A-band detector 102 is parallel to the A-band mounting surface 301, and the photosensitive surface of the B-band detector 202 is parallel to the B-band mounting surface 302, with an allowable assembly deviation of less than ±1°.

[0058] A window 8 is set at the location of the cold screen 6 in the Dewar cavity 11; the window 8 is made of zinc selenide material.

[0059] Preferably, a window cap 7 is also provided, and the window 8 is airtightly welded to the window cap 7 to form a joint, which is then airtightly connected to the Dewar cavity 11 by laser welding.

[0060] The inner wall of the Dewar cavity 11 is treated with polished gold plating for high reflectivity.

[0061] The above description is merely a preferred embodiment of the present invention and is not intended to limit the scope of the invention. All equivalent changes and modifications made within the scope of the claims of this invention should be considered within the technical scope of this invention.

Claims

1. A packaging structure for a dual-temperature zone integrated beam splitter, comprising a cold platform cavity (3) thermally insulated and installed within a Dewar cavity (11); characterized in that: The cold platform cavity (3) is provided with an A-band component mounting surface (301), a B-band component mounting surface (302), a beam splitter mount mounting surface (303), and a cold screen mounting surface (304). An A-band component (1) is installed on the A-band component mounting surface (301), a B-band component (2) is installed on the B-band component mounting surface (302), a beam splitter frame (5) is installed on the beam splitter frame (303), and a beam splitter (4) is installed on the beam splitter frame (5); a cold screen (6) is attached to the cold screen mounting surface (304). An A-band chiller (9) is connected to the A-band component (1), and a B-band chiller (10) is connected to the B-band component (2); the B-band chiller (10) simultaneously cools the cold platform cavity (3); An A-band cold chain (104) is set up, and the A-band refrigerator (9) is connected to the A-band component (1) through the A-band cold chain (104); the A-band component (1) includes an A-band substrate (101), an A-band detector (102), an A-band filter holder (103), and an A-band filter (105). An A-band detector (102) is disposed on the front side of an A-band substrate (101), and an A-band filter (105) is disposed on the front side of the A-band detector (102); an A-band filter holder (103) is disposed on the front side of an A-band substrate (101), and an A-band filter (105) is disposed on the A-band filter holder (103); One end of the A-band cold chain (104) is connected to the back of the A-band substrate (101), and the other end is connected to the A-band refrigerator (9); a hollow frame structure A-band thermal insulation support (106) is also provided on the edge of the A-band substrate (101), and the A-band component (1) is set on the A-band mounting surface (301) through the A-band thermal insulation support (106); A B-band cold chain (204) is set up, and the B-band refrigerator (10) is connected to the B-band assembly (2) through the B-band cold chain (204); the B-band assembly (2) includes a B-band substrate (201), a B-band detector (202), a B-band filter holder (203), and a B-band filter (205). A B-band detector (202) is disposed on the front side of a B-band substrate (201), and a B-band filter (205) is disposed on the front side of the B-band detector (202); a B-band filter holder (203) is disposed on the front side of a B-band substrate (201), and a B-band filter (205) is disposed on the B-band filter holder (203); The cold screen mounting surface (304) is parallel to the A-band component mounting surface (301); the A-band component mounting surface (301) and the B-band component mounting surface (302) are perpendicular to each other; the angle between the beam splitter (4) and the A-band mounting surface (301) and the B-band mounting surface (302) is 45°±1°. A window (8) is set at the location of the cold screen (6) corresponding to the Dewar cavity (11); The operating temperature of the A-band component (1) is lower than that of the B-band component (2).

2. The packaging structure of the dual-temperature zone integrated beam splitter according to claim 1, characterized in that: The A-band detector (102) is a single chip or an array of multiple chips; the B-band detector (202) is a single chip or an array of multiple chips.

3. The packaging structure of the dual-temperature zone integrated beam splitter according to claim 2, characterized in that: The A-band thermal insulation support (106) is made of a titanium alloy material with low thermal conductivity.

4. The packaging structure of the dual-temperature zone integrated beam splitter according to claim 1, characterized in that: One end of the B-band cold chain (204) is connected to the back of the B-band substrate (201), and the other end is connected to the B-band refrigerator (10). The outer surface of the cold platform cavity (3) is polished or coated with a high reflectivity coating, and the inner surface is coated with a low reflectivity coating; the outer surface of the cold screen (6) facing the window (8) is polished or coated with a high reflectivity coating, and the inner surface facing the cold platform cavity (3) is coated with a low reflectivity coating. The beam splitter frame (5), the A-band filter frame (103), and the B-band filter frame (203) are treated with low reflectivity; the inner wall of the Dewar cavity (11) is treated with high reflectivity. The cold platform cavity (3) is made of a material with a low coefficient of thermal expansion; The window (8) is made of zinc selenide.

5. The packaging structure of the dual-temperature zone integrated beam splitter according to claim 4, characterized in that: The inner surface of the cold platform cavity (3) is treated with black nickel for low reflectivity, and the outer surface is treated with high reflectivity gold plating; the A-band filter holder (103) and the B-band filter holder (203) are both treated with black nickel for low reflectivity; the surface of the beam splitter frame (5) is treated with black nickel for low reflectivity; the inner surface of the cold screen (6) is treated with black nickel for low reflectivity, and the outer surface is treated with polished gold plating; the inner wall of the Dewar cavity (11) is treated with polished gold plating. The cold platform cavity (3) is made of Invar alloy.

6. The packaging structure of the dual-temperature zone integrated beam splitter according to claim 4, characterized in that: A window cap (7) is also provided. The window (8) and the window cap (7) are airtightly welded together to form a joint, which is then airtightly connected to the Dewar cavity (11).

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