Wavelength conversion device and projection system

Abstract

The invention discloses a wavelength conversion device, which is characterized in that the wavelength conversion device comprises a bearing substrate, the bearing substrate comprises a metal substrate, a middle layer and a substrate, and the metal substrate is connected with the substrate through the middle layer; and the wavelength conversion layer is arranged on one side, far away from the metal substrate, of the substrate. According to the wavelength conversion device provided by the invention, the bearing substrate comprises the metal substrate, the middle layer and the substrate, the metal substrate and the substrate are connected through the middle layer, and the middle layer has certain elasticity, so that the condition that the device is damaged due to deformation of the metal substrate in the prior art can be solved; the deformation of the metal substrate is relieved through the elastic middle layer; the used middle layer is the bonding layer with good heat dissipation, and the bearing substrate with the novel structure can use a thinner metal substrate, so that the weight of the bearing substrate is reduced to a great extent, and the energy consumption is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of wavelength conversion, and more particularly to a wavelength conversion device and a projection system. Background Art

[0002] Recently, projection devices based on solid-state light sources such as light emitting diodes (LEDs) and laser diodes have gradually gained a foothold in the market. Generally speaking, the excitation light of these solid-state light sources will be converted by the wavelength conversion material on the wavelength conversion module in the projection device to produce converted light of different colors.

[0003] In the prior art, the structure of the projection system generally includes a laser module, a dichroic mirror, a light conversion component and a wavelength conversion device. The current wavelength conversion device includes an aluminum substrate, a wavelength conversion layer and a diffuse reflection layer. The diffuse reflection layer is arranged on the surface of the substrate, and the wavelength conversion layer is arranged on the surface of the diffuse reflection layer away from the substrate. With the increase in brightness demand, the power of the laser as the excitation light also increases. On the one hand, the brightness is improved by improving the heat dissipation structure of the wavelength conversion device, and on the other hand, the heat dissipation is improved by increasing the diameter of the wavelength conversion device. Generally, the thickness of the aluminum substrate used as a wavelength conversion device is between 0.7-1.5mm. As the diameter increases, the thickness must be designed to be thinner considering the motor load. However, under long-term high temperature or high temperature rotation conditions, the aluminum substrate is easily deformed, causing the wavelength conversion layer to crack and fall off or reduce its life.

[0004] In summary, there is an urgent need to provide a wavelength conversion device and a projection system with a new design or a new structure to solve the technical problems existing in the prior art. Summary of the invention

[0005] Based on this, it is necessary to provide a wavelength conversion device and a projection system to solve the above technical problems.

[0006] A technical solution of the present invention is: A wavelength conversion device, characterized in that it comprises: A carrier substrate, the carrier substrate comprising a metal substrate, an intermediate layer and a substrate, the metal substrate and the substrate being connected via the intermediate layer; The wavelength conversion layer is arranged on a side of the substrate away from the metal base plate.

[0007] In one embodiment, a reflective layer is disposed on a side of the substrate away from the metal base plate, and the reflective layer is located between the wavelength conversion layer and the substrate.

[0008] In one embodiment, the substrate is made of a metal sheet or a ceramic sheet.

[0009] In one embodiment, a motor is further included, and the motor is fixedly connected to the carrier substrate to rotate the wavelength conversion device.

[0010] In one embodiment, a heat insulating component is disposed between the carrier substrate and the motor, so that heat transfer between the carrier substrate and the motor is reduced.

[0011] In one embodiment, the thermal insulation component isolates the carrier substrate from direct contact with the motor, and the thermal conductivity of the thermal insulation component is lower than the thermal conductivity of the carrier substrate.

[0012] In one embodiment, a plurality of regions are disposed on the surface of the carrier substrate, and at least one of the regions includes a non-wavelength conversion region and a wavelength conversion region, and the wavelength conversion layer is disposed in the wavelength conversion region.

[0013] In one embodiment, the middle layer includes thermally conductive particles and a binder, and the middle layer is elastic.

[0014] In one embodiment, the binder accounts for 5 to 90 parts by weight, and the thermally conductive particles account for 10 to 95 parts by weight.

[0015] In one embodiment, the thermally conductive particles are metal particles, polymer particles, and compounds, or a combination of two or more thereof.

[0016] In one embodiment, the thickness of the metal substrate is no more than 1.5 mm.

[0017] A projection system, characterized in that the projection system comprises the wavelength conversion device described in any one of the above claims.

[0018] Beneficial effects of the present invention: (1) The wavelength conversion device provided by the present application, wherein the carrier substrate comprises a metal substrate, an intermediate layer and a substrate, the metal substrate and the substrate are connected via the intermediate layer, and the intermediate layer has a certain elasticity, so that the situation in the prior art where the device is damaged due to the deformation of the metal substrate can be solved, and the deformation of the metal substrate is alleviated by the elastic intermediate layer; (2) The intermediate layer used in the present application is an adhesive layer with good heat dissipation. The carrier substrate of this new structure can use a thinner metal substrate, which greatly reduces the weight of the carrier substrate and reduces energy consumption; (3) Furthermore, in order to improve the heat dissipation effect of the carrier substrate, the present application re-matches the material of the intermediate layer, and dopes the intermediate layer (binder) with thermal conductive particles with excellent heat dissipation, such as doping metal particles in silica gel, which greatly improves the heat dissipation effect of the carrier substrate; (4) Since the carrier substrate has the function of heat dissipation, when the carrier substrate is connected to the motor, the motor temperature will be too high, or even the motor will be damaged. Therefore, the present application provides a heat insulation component between the motor and the carrier substrate, which can effectively isolate the carrier substrate from conducting heat to the motor, thereby providing good protection for the motor. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 This is a schematic diagram of the structure of a wavelength conversion device of the present invention; Figure 2 A schematic diagram of the cross-sectional structure of a wavelength conversion device of the present invention; Figure 3 A schematic diagram of the cross-sectional structure of a wavelength conversion device of the present invention; Figure 4 It is another schematic diagram of the cross-sectional structure of a wavelength conversion device of the present invention; Figure 5 It is another schematic diagram of the cross-sectional structure of a wavelength conversion device of the present invention; Figure 6 It is a schematic structural diagram of a wavelength conversion device with a heat insulation component according to the present invention; Figure 7 A schematic diagram of the cross-sectional structure of a wavelength conversion device of the present invention; Figure 8 It is another schematic diagram of the cross-sectional structure of a wavelength conversion device of the present invention; Fig. 9 It is a schematic diagram of the cross-sectional structure of the static wavelength conversion device of the present invention; Fig.10 It is another schematic diagram of the cross-sectional structure of the static wavelength conversion device of the present invention; Fig.11 The figure is a simplified optical path diagram of a projection system of the present invention. DETAILED DESCRIPTION

[0020] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present invention are given in the drawings. However, the present invention can be implemented in many different forms and is not limited to the embodiments described below. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thoroughly understood.

[0021] It should be noted that when an element is referred to as being "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0022] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present invention. The terms used herein in the specification of the present invention are only for the purpose of describing specific embodiments and are not intended to limit the present invention. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0023] A wavelength conversion device, wherein the wavelength conversion device can be used in a projection system and can also be used in a light source system. As long as the light emission needs wavelength conversion, the wavelength conversion device designed in the present application can be used; the wavelength conversion device mentioned in the present application can be a static wavelength conversion device or a dynamic wavelength conversion wheel; the wavelength conversion device includes: A carrier substrate, the carrier substrate comprises a first surface and a second surface arranged oppositely, the carrier substrate comprises a metal substrate, an intermediate layer and a substrate, the metal substrate and the substrate are connected through the intermediate layer; wherein the first surface of the carrier substrate is a surface of the substrate away from the metal substrate, and the second surface of the carrier substrate is a surface of the metal substrate away from the substrate; the metal substrate may be an aluminum substrate or a substrate of other metal materials; the substrate may be an aluminum nitride sheet (ceramic sheet) or a metal sheet; the intermediate layer plays a bonding role, connecting the metal substrate and the substrate, and the intermediate layer needs to have a certain elasticity, so that when the metal substrate is subjected to high temperature deformation, a certain tension is released through the intermediate layer to ensure that the substrate does not deform; A wavelength conversion layer, wherein the wavelength conversion layer is arranged on a side of the substrate away from the metal substrate, the wavelength conversion layer is composed of a fluorescent material, and the fluorescent material can be formed on the surface of the substrate by coating, deposition, etc. The wavelength conversion layer will emit a stimulated light after being irradiated by a laser, and then the stimulated light is emitted directly or after being synthesized with other light.

[0024] In one embodiment, the Shore hardness of the intermediate layer is in the range of 30A to 70A. At this time, the intermediate layer has a certain elasticity. When the metal substrate (such as an aluminum substrate) is deformed by heat, the intermediate layer (such as silicone) can release the deformation force brought by the metal substrate, so as not to affect the substrate and then the wavelength conversion layer. The intermediate layer is composed of a high-temperature resistant adhesive. The reason for selecting a high-temperature resistant material is that when the wavelength conversion device is irradiated by laser, a large amount of heat will be generated. If the intermediate layer cannot withstand high temperatures, the wavelength conversion device will be directly damaged.

[0025] Furthermore, the intermediate layer must not only be resistant to high temperatures, but also have good thermal conductivity. However, the intermediate layer mainly serves as a bonding layer. Generally, the intermediate layer uses silicone. The thermal conductivity of ordinary organic silicone is about 0.2W / m·K, while the thermal conductivity of thermally conductive silicone is usually between 0.8 and 5.0W / m·K. Therefore, in this application, according to the design specifications and requirements of the wavelength conversion device, the material of the intermediate layer is developed. The intermediate layer includes a binder and thermally conductive particles. The binder can be resin glue, silicone, etc. The thermally conductive particles can be metal particles, polymer particles, and compounds, etc. The binder accounts for 5 to 90 parts, and the thermally conductive particles account for 10 to 95 parts. The thermally conductive particles are preferably metal particles, such as copper powder, aluminum powder, etc., and when the metal particles account for 40 to 80 parts, the thermal conductivity of the intermediate layer is the best and the bonding force to the metal substrate and the substrate is better. Of course, the intermediate layer can also include a variety of thermally conductive particles, that is, metal particles, polymer particles, and compounds. One or more combinations.

[0026] In one embodiment, a reflective layer is provided on the side of the substrate away from the metal substrate, and the reflective layer is located between the wavelength conversion layer and the substrate. The reflective layer can be a mirror reflection structure or a diffuse reflection structure, and the reflective layer is formed on the surface of the substrate by deposition, sputtering, etc. The main function of the reflective layer is to reflect the converted light and the excitation light to ensure the utilization rate of the light as much as possible.

[0027] In one embodiment, the material of the substrate is a metal sheet or a ceramic sheet. The substrate material can be selected according to the specific application scenario, and can be metal or ceramic, so that the substrate and the metal substrate form a "sandwich" stacked structure through the intermediate layer. Such a structure can reduce or avoid the adverse effects caused by the thermal deformation of the metal substrate. At the same time, under the same thickness and area, this structure will be lighter, which can reduce the energy consumption of the device and be more conducive to the operation of the device. In one embodiment, the thickness of the metal substrate is not more than 1.5mm, because a metal substrate with a larger thickness may deform when heated and will not affect the performance of the device. Therefore, when the metal substrate is relatively thin, the practical stacked structure can better play its advantages. Of course, it does not mean that the thicker metal substrate cannot use the stacked structure. The thick metal substrate can also adopt the stacked structure.

[0028] In one embodiment, when the wavelength conversion device is dynamic, the wavelength conversion device further comprises a motor, and the motor is fixedly connected to the carrier substrate, so that the wavelength conversion device rotates. In one embodiment, the carrier substrate surface is provided with a plurality of regions, and at least one of the regions includes a non-wavelength conversion region and a wavelength conversion region, and the wavelength conversion layer is provided in the wavelength conversion region. Different wavelength conversion materials may be provided in different wavelength conversion regions, so that as the wavelength conversion device rotates, the laser will irradiate the wavelength conversion materials in different wavelength conversion regions. Of course, the wavelength conversion materials provided in different wavelength conversion regions may also be the same.

[0029] In one embodiment, a heat insulation component is provided between the carrier substrate and the motor to reduce heat transfer between the carrier substrate and the motor. Due to laser irradiation, the carrier substrate has to bear a lot of heat, and the carrier substrate itself must have good thermal conductivity, which will cause the temperature of the motor in contact with it to be too high. Therefore, in order to protect the motor from being damaged, a heat insulation component needs to be provided in the area where the carrier substrate contacts the motor. The heat insulation component isolates the carrier substrate from direct contact with the motor, and the heat conduction efficiency of the heat insulation component is lower than that of the carrier substrate, and the thermal conductivity of the heat insulation component is <10W / mK.

[0030] A projection system, characterized in that the projection system comprises the wavelength conversion device described in any one of the above embodiments.

[0031] See also Figure 1 as well as Figure 2 A wavelength conversion device, the wavelength conversion device includes a carrier substrate 10, a wavelength conversion area 20 and a non-wavelength conversion area 30, the carrier substrate 10 includes a first surface and a second surface arranged oppositely, the first surface of the carrier substrate 10 includes a plurality of partitions, wherein at least one partition is a wavelength conversion area 20, the wavelength conversion area 20 is provided with a wavelength conversion material to form a wavelength conversion layer 21, the wavelength conversion device is connected to a motor, and the wavelength conversion device can be driven to rotate by the motor.

[0032] See also Figure 3A wavelength conversion device, the carrier substrate 10 includes a metal substrate 11, an intermediate layer 12 and a substrate 13, the metal substrate 11 is connected to the substrate 13 through the intermediate layer 12, and the wavelength conversion layer 21 is arranged on the side of the substrate 13 away from the metal substrate 11; the metal substrate 11 can be an aluminum substrate, and the thickness of the aluminum substrate is generally not more than 1.2 mm. Of course, the metal substrate 11 can also be other materials. The intermediate layer generally selects silicone with bonding function, and the silicone needs to have certain high temperature resistance. The substrate 13 can be a general ceramic sheet, such as aluminum nitride, or other high temperature resistant materials. Similarly, the substrate can also be a metal substrate that is resistant to high temperature and not easy to deform.

[0033] See also Figure 4 In another structure, the wavelength conversion device further includes a reflection layer 50, wherein the reflection layer 50 may be a total reflection (mirror reflection) or a diffuse reflection layer, and the diffuse reflection layer may be realized by a physical structure or by a diffuse reflection material; the reflection layer 50 is disposed on a side of the substrate 13 away from the metal substrate 11, and is located between the wavelength conversion layer 21 and the substrate 13, so that the reflection layer 50 may reflect the laser and the stimulated light.

[0034] See also Figure 5 In another structure, the carrier substrate of the wavelength conversion device includes a metal substrate 11, an intermediate layer 14 and the substrate 13, wherein the intermediate layer 14 and the substrate 13 are Figure 3 The middle layer 12 in the structure is different, Figure 5 The intermediate layer 14 in the structure is doped with thermally conductive particles. The intermediate layer 14 formed by mixing the thermally conductive particles with a binder not only has viscosity and elasticity, but also has a good heat dissipation function. The thermally conductive particles can be metal particles, or organic thermally conductive particles or compounds. Metal particles are preferably used, such as gold, silver, copper, aluminum and other metals with good thermal conductivity. Of course, the thermally conductive particles doped in the intermediate layer 14 can be a mixture of metal ions and compounds, or a mixture with organic thermally conductive particles and the like. The proportion of the thermally conductive particles in the intermediate layer 14 is very important, which is not only related to the thermal conductivity of the intermediate layer, but also directly affects the adhesion effect of the intermediate layer. Therefore, the proportion of the thermally conductive particles is controlled to be between 30 and 80 parts. When the thermally conductive particles are preferably metal particles, and the proportion of the metal particles is 40 to 70 parts, the thermal conductivity and adhesion are the best.

[0035] See also Figure 6 , Figure 7 as well as Figure 8, another wavelength conversion device, the wavelength conversion device also includes a heat insulation component 40, the wavelength conversion device is connected to the motor, and the motor drives the wavelength conversion device to rotate. Since the wavelength conversion device needs to conduct a large amount of heat to the outside, when the supporting substrate 10 of the wavelength conversion device is connected to the motor, a heat insulation component 40 is arranged between the two. The thermal conductivity of the heat insulation component 40 is much smaller than that of the supporting substrate 10. Only in this way can better insulation be performed to prevent the motor from being damaged by high temperature. Figure 7 as well as Figure 8 In the figure, two different connection methods are given. Figure 7 In the embodiment, the heat insulation assembly 40 only isolates a portion of the carrier substrate 10 from the motor. Figure 8 The heat insulation component 40 directly and completely isolates the carrier substrate 10 from the motor to avoid heat conduction between the two, which is more conducive to protecting the safety of the motor and preventing it from being damaged by high temperature.

[0036] See also Fig. 9 as well as Fig.10 , a static wavelength conversion device is provided, the wavelength conversion device comprises a carrier substrate and a wavelength conversion layer 22, the carrier substrate comprises a metal substrate 11, an intermediate layer 14 and a substrate 13, the wavelength conversion layer 22 is arranged on the side of the substrate 13 away from the metal substrate 11, the intermediate layer 14 comprises heat-conducting particles, which can well ensure the heat conduction and heat dissipation effect of the carrier substrate; of course, a reflective layer 51 can also be provided between the wavelength conversion layer 22 and the substrate 13, and similarly, the reflective layer 51 can be a specular reflection or a diffuse reflection. When the wavelength conversion device is a static device, at this time, there is no need for partitions on the surface of the carrier substrate, which is different from a dynamic wavelength conversion device.

[0037] Please read Fig.11 A projection system includes a wavelength conversion device 100, a laser light source 200, a first optical element 300, a second optical element 310, a light homogenizing element 400, and a beam splitter 500. The laser light source 200 emits an excitation light, which passes through the first optical element 300 and then irradiates the light homogenizing element 400. The excitation light irradiates the beam splitter 500 and the second optical element 310 and then irradiates the wavelength conversion device 100. At this time, the wavelength conversion device 100 forms stimulated light after passing through the excitation light, and the stimulated light is emitted after passing through the second optical element 310 and the beam splitter 500. The beam splitter 500 reflects or transmits the excitation light, and transmits or reflects the light converted by the light conversion component and the stimulated light. The wavelength conversion device 100 can be dynamic, and can also be static. Of course, Fig.10Only one optical path diagram is given in the figure, and a suitable optical path can be designed according to different wavelength conversion devices or requirements.

[0038] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific implementation methods of the present invention are described in detail above in conjunction with the accompanying drawings. In the above description, many specific details are set forth to facilitate a full understanding of the present invention. However, the present invention can be implemented in many other ways different from those described above, and those skilled in the art can make similar improvements without violating the connotation of the present invention, so the present invention is not limited to the specific embodiments disclosed above. In addition, the various technical features of the above-mentioned embodiments can be combined arbitrarily. In order to make the description concise, all possible combinations of the various technical features in the above-mentioned embodiments are not described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0039] The above-mentioned embodiments only express several implementation methods of the present invention, and the description thereof is relatively specific and detailed, but it cannot be understood as limiting the scope of the patent of the present invention. It should be pointed out that, for ordinary technicians in this field, several variations and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent of the present invention shall be subject to the attached claims.

Claims

1. A wavelength conversion device, characterized in that: include: A carrier substrate, the carrier substrate comprising a metal substrate, an intermediate layer and a substrate, the metal substrate and the substrate being connected via the intermediate layer; The wavelength conversion layer is arranged on a side of the substrate away from the metal base plate.

2. A wavelength conversion device according to claim 1, characterized in that: A reflective layer is provided on a side of the substrate away from the metal base plate, and the reflective layer is located between the wavelength conversion layer and the substrate.

3. A wavelength conversion device according to claim 1, characterized in that: The substrate is made of a metal sheet or a ceramic sheet.

4. The wavelength conversion device according to claim 1, characterized in that: A motor is also included, and the motor is fixedly connected to the carrier substrate so as to rotate the wavelength conversion device.

5. A wavelength conversion device according to claim 4, characterized in that: A heat insulation component is disposed between the carrier substrate and the motor, so that heat transfer between the carrier substrate and the motor is reduced.

6. A wavelength conversion device according to claim 5, characterized in that: The heat insulating component isolates the carrier substrate from directly contacting the motor, and the heat conduction efficiency of the heat insulating component is lower than the heat conduction efficiency of the carrier substrate.

7. The wavelength conversion device according to claim 4, characterized in that: The surface of the carrier substrate is provided with a plurality of regions, which at least include a non-wavelength conversion region and a wavelength conversion region, and the wavelength conversion layer is provided in the wavelength conversion region.

8. The wavelength conversion device according to claim 1, characterized in that: The middle layer includes heat-conducting particles and a binder, and the middle layer has elasticity.

9. A wavelength conversion device according to claim 8, characterized in that: The binder accounts for 5 to 90 parts by weight, and the thermally conductive particles account for 10 to 95 parts by weight.

10. The wavelength conversion device according to claim 8, characterized in that: The thermally conductive particles are metal particles, polymer particles and compounds, or a combination of two or more thereof.

11. A wavelength conversion device according to any one of claims 1 to 10, characterized in that: The thickness of the metal substrate is not greater than 1.5 mm.

12. A projection system, characterized in that: The projection system comprises the wavelength conversion device according to any one of claims 1 to 11.

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