Chip self-adaptive operation method and device under low-temperature condition

Abstract

The invention relates to the technical field of Internet of Things chips, and discloses a chip self-adaptive operation method and device under a low-temperature condition. The method comprises the following steps: in the running process of a first chip, acquiring current environment temperature data and a current running state of the first chip in real time; when the current environment temperature data is smaller than a preset low-temperature threshold value, it is judged that the first chip enters a low-temperature mode; in the low-temperature mode, determining a first operation state of the first chip according to the current environment temperature data of the first chip and the temperature operation state associated information of the first chip; adjusting the first chip from the current running state to a first running state; and based on the temperature change trend, circularly adjusting the first chip from the first operation state to the second operation state until the operation of the first chip is completed. According to the invention, the normal operation of the chip can be ensured, and the operation efficiency is improved, so that the low-temperature environment is effectively adapted, and the self-adaptive operation efficiency of the chip under the low-temperature condition is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of Internet of Things chips, and in particular to a chip adaptive operation method and device under low temperature conditions. Background Art

[0002] In a low-temperature environment, the chip will often experience increased thermal and mechanical stress due to temperature reasons, thus affecting the life of the chip. In addition, a low-temperature environment can cause the chip to not work, seal failure, reduced work efficiency, and other factors. Therefore, how to ensure that the chip can operate normally under low-temperature conditions is the current research focus.

[0003] At present, the traditional way of operating chips under low temperature conditions is to add a temperature control device to the chip to adjust the temperature environment of the chip in real time to ensure that the chip can always work in a normal temperature environment, thereby ensuring the normal operation of the chip in different operating environments. However, this method increases the chip size from an empirical perspective and requires adaptive adjustment of all circuit boards that use the chip, making the chip use range of this method smaller. In addition, this method cannot directly solve the problem of the chip being affected by temperature, resulting in poor chip adaptive operation efficiency under low temperature conditions. Summary of the invention

[0004] The present invention provides a chip adaptive operation method and device under low temperature conditions, which can improve the operation efficiency while ensuring the normal operation of the chip, thereby effectively adapting to the low temperature environment and improving the chip adaptive operation efficiency under low temperature conditions.

[0005] In order to solve the above technical problems, the present invention provides a chip adaptive operation method under low temperature conditions, comprising:

[0006] During the operation of the first chip, current ambient temperature data and current operation status of the first chip are acquired in real time;

[0007] When the current ambient temperature data is less than a preset low temperature threshold, determining that the first chip enters a low temperature mode;

[0008] In the low temperature mode, the first operating state of the first chip is determined according to the current ambient temperature data of the first chip and the temperature operating state association information of the first chip; wherein the temperature operating state association information of the first chip is obtained according to a preset historical database;

[0009] The first chip is adjusted from the current operating state to the first operating state.

[0010] Further, determining the first operating state of the first chip according to the current ambient temperature data of the first chip and the temperature operating state association information of the first chip is specifically:

[0011] Querying a preset history database for several pieces of history operation information of the first chip to form history operation data of the first chip;

[0012] identifying a current resistivity of the first chip based on the current operating state;

[0013] identifying temperature operation state associated information of the first chip at a current resistivity in the historical operation data;

[0014] Based on the historical operation data and the current ambient temperature data, identifying a temperature adjustment range of the first chip;

[0015] Based on the temperature adjustment range and the temperature operation state association information, a first operation state of the first chip is determined.

[0016] Further, the identifying of the temperature operation state associated information of the first chip at the current resistivity in the historical operation data is specifically:

[0017] Acquire chip resistivity, chip operation status and chip temperature data of each of the historical operation information in the historical operation data;

[0018] Selecting a plurality of target historical operation information whose chip resistivity is the current resistivity from each of the historical operation information;

[0019] Based on the chip operating status and chip temperature data in each of the target historical operating information, the temperature operating status associated information of the first chip at the current resistivity is identified.

[0020] Further, the identifying the temperature adjustment range of the first chip based on the historical operation data and the current ambient temperature data is specifically:

[0021] Acquire a normal operating temperature data range of the first chip; wherein the normal operating temperature data range includes a plurality of normal operating temperature data;

[0022] The differences between the current ambient temperature data and each normal operating temperature data in the normal operating temperature data range are calculated respectively to obtain the temperature adjustment range of the first chip.

[0023] Further, the determining the first operating state of the first chip based on the temperature adjustment range and the temperature operating state association information is specifically:

[0024] Based on the temperature adjustment range, determining in the temperature operation state association information a plurality of first chip operation states corresponding to each normal operating temperature data in the temperature adjustment range;

[0025] Querying the chip operation power consumption corresponding to each of the first chip operation states in a preset historical database;

[0026] A first chip operating state in which the chip operating power consumption is minimum is determined as a first operating state of the first chip.

[0027] Further, after adjusting the first chip from the current operating state to the first operating state, the method further includes:

[0028] Based on the temperature change trend, cyclically adjusting the first chip from the first operating state to the second operating state until the first chip completes operation;

[0029] The step of adjusting the first chip from the first operating state to the second operating state is specifically:

[0030] Collecting the current temperature change information and current ambient temperature data of the first chip in real time;

[0031] Performing distribution sorting processing on the current temperature change information to obtain temperature change distribution information of the first chip;

[0032] Performing gradient division on the temperature change distribution information to obtain a temperature change gradient of the first chip;

[0033] Based on the current ambient temperature data, identifying information on the influence of the current ambient temperature data on the change of the temperature change gradient;

[0034] Based on the change impact information and the temperature change gradient, identifying a temperature change trend of the first chip;

[0035] According to the temperature change trend, a second operating state of the first chip is determined, and the first chip is adjusted from the first operating state to the second operating state.

[0036] Further, based on the current ambient temperature data, identifying the influence information of the current ambient temperature data on the change of the temperature change gradient is specifically:

[0037] In each of the historical operation information of the first chip, each of the first historical operation information corresponding to the first operation state;

[0038] Acquire the ambient temperature data corresponding to each of the first historical operation information;

[0039] Determine first historical operation information whose ambient temperature data is the current ambient temperature data as second historical operation information;

[0040] Identify the temperature data change information of each second historical operation information, and distribute and arrange the temperature data change information according to the time series to obtain the distribution information affecting the temperature change;

[0041] Calculating gradient influence information between the temperature change distribution information and the influencing temperature change distribution information based on the temperature change distribution information and the influencing temperature change distribution information;

[0042] The gradient influence information is determined as the influence information of the change of the current ambient temperature data on the temperature change gradient.

[0043] Further, the identifying the temperature change trend of the first chip based on the change impact information and the temperature change gradient is specifically:

[0044] Based on the temperature change gradient, predicting first temperature distribution information of the first chip;

[0045] Based on the change impact information, distribution adjustment processing is performed on the first temperature distribution information to obtain a temperature change trend of the first chip.

[0046] Further, determining the second operating state of the first chip according to the temperature change trend is specifically:

[0047] Based on the temperature change trend, identifying the chip adjustment time required for the first chip to change from current temperature data to the normal operating temperature data range;

[0048] Acquire a preset temperature adjustment time threshold of the first chip and a first operation time of the first chip in the first operation state;

[0049] Calculating a remaining temperature adjustment time of the first chip based on the preset temperature adjustment time threshold and the first operating time;

[0050] When the remaining temperature adjustment time is less than the chip adjustment time, respectively calculating the predicted chip adjustment time required from the current temperature data to the normal operating temperature data range under each of the first chip operating states;

[0051] Determine a first chip operation state in which the predicted chip adjustment time is less than the remaining temperature adjustment time as a second chip operation state;

[0052] The chip operation power consumptions corresponding to the second chip operation states are compared, and the second chip operation state with the smallest chip operation power consumption is determined as the second operation state of the first chip.

[0053] The present invention provides a chip adaptive operation method under low temperature conditions, by acquiring the historical operation information of the chip, so as to identify the correlation information between the chip temperature and the operation state of the chip under the current resistivity, and then identify the first operation state of the chip under the target temperature difference information through the correlation information, so as to adjust the operation state of the chip so that the chip offsets the influence of the ambient temperature on the chip operation by self-heating, and then adjusts the operation state of the chip by real-time detection of the temperature change information of the chip and the new ambient temperature data of the current environment, so as to ensure that the chip can be in the temperature data range of normal operation in real time by adaptively adjusting the chip operation state. The present invention not only avoids the problem of adding hardware to affect the adaptability of the chip, but also can ensure that the chip is in the temperature data range of normal operation in real time by adaptively adjusting the operation state, while offsetting the temperature influence of the low temperature environment where the chip is located, thereby improving the chip adaptive operation efficiency under low temperature conditions.

[0054] Accordingly, the present invention provides a chip adaptive operation device under low temperature conditions, comprising: a data acquisition module, a mode judgment module, a motion state determination module and a first adjustment module;

[0055] The data acquisition module is used to acquire the current ambient temperature data and the current operating state of the first chip in real time during the operation of the first chip;

[0056] The mode judgment module is used to determine that the first chip enters the low temperature mode when the current ambient temperature data is less than a preset low temperature threshold;

[0057] The motion state determination module is used to determine the first operating state of the first chip in the low temperature mode according to the current ambient temperature data of the first chip and the temperature operating state association information of the first chip; wherein the temperature operating state association information of the first chip is obtained according to a preset historical database;

[0058] The first adjustment module is used to adjust the first chip from the current operating state to the first operating state.

[0059] The present invention provides a chip adaptive operation device under low temperature conditions. Based on the organic combination between modules, the historical operation information of the chip is obtained to identify the correlation information between the chip temperature and the operation state of the chip under the current resistivity, and then the first operation state of the chip under the target temperature difference information is identified through the correlation information, so that the chip can offset the influence of the ambient temperature on the chip operation by self-heating by adjusting the operation state of the chip, and then the chip's temperature change information and the new ambient temperature data of the current environment are detected in real time to adjust the operation state of the chip, so as to ensure that the chip can be in the temperature data range of normal operation in real time by adaptively adjusting the chip's operation state. The present invention not only avoids the problem of adding hardware to affect the chip adaptability, but also can ensure that the chip is in the temperature data range of normal operation in real time by adaptively adjusting the operation state, while offsetting the temperature influence of the low temperature environment in which the chip is located, thereby improving the chip's adaptive operation efficiency under low temperature conditions. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] Figure 1 A schematic flow chart of an embodiment of a chip adaptive operation method under low temperature conditions provided by the present invention;

[0061] Figure 2 A schematic flow chart of another embodiment of the chip adaptive operation method under low temperature conditions provided by the present invention;

[0062] Figure 3 A schematic flow chart of another embodiment of the chip adaptive operation method under low temperature conditions provided by the present invention;

[0063] Figure 4 A schematic flow chart of another embodiment of the chip adaptive operation method under low temperature conditions provided by the present invention;

[0064] Figure 5 A schematic structural diagram of an embodiment of a chip adaptive operation device under low temperature conditions provided by the present invention;

[0065] Figure 6 A schematic diagram of the structure of an embodiment of a motion state determination module provided by the present invention;

[0066] Figure 7 A schematic structural diagram of another embodiment of the chip adaptive operation device under low temperature conditions provided by the present invention;

[0067] Figure 8 A schematic structural diagram of an embodiment of the second adjustment module provided by the present invention. DETAILED DESCRIPTION

[0068] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0069] The flowcharts shown in the accompanying drawings are only examples and do not necessarily include all the contents and operations / steps, nor must they be executed in the order described. For example, some operations / steps may also be decomposed, combined or partially merged, so the actual execution order may change according to actual conditions.

[0070] Some embodiments of the present invention are described in detail below in conjunction with the accompanying drawings. In the absence of conflict, the following embodiments and features in the embodiments can be combined with each other.

[0071] Example 1

[0072] See also Figure 1 , is a flow chart of an embodiment of a chip adaptive operation method under low temperature conditions provided by the present invention, the method includes steps 101 to 104, each step is specifically as follows:

[0073] Step 101: During the operation of the first chip, the current ambient temperature data and the current operation state of the first chip are obtained in real time.

[0074] In the first embodiment of the present invention, the current ambient temperature data of the environment in which the first chip is located can be obtained in real time through the temperature detection device. The current ambient temperature data is used to determine whether the first chip is running under low temperature conditions at this time.

[0075] Step 102: When the current ambient temperature data is less than a preset low temperature threshold, it is determined that the first chip enters a low temperature mode.

[0076] In the first embodiment of the present invention, a low temperature threshold is preset, and the low temperature threshold is the lowest temperature at which the first chip can operate normally. If the ambient temperature is lower than the set low temperature threshold, it is judged that the operating efficiency of the first chip will be reduced. Therefore, when obtaining the current ambient temperature data of the first chip during operation, it is compared with the preset low temperature threshold. If the current ambient temperature data is lower than the preset low temperature threshold, it is judged that the first chip is in a low temperature environment, and the operating mode of the first chip needs to be converted to the low temperature mode, and the operating state of the first chip is adjusted to adapt to the low temperature condition.

[0077] Step 103: In the low temperature mode, determine the first operating state of the first chip according to the current ambient temperature data of the first chip and the temperature operating state association information of the first chip; wherein the temperature operating state association information of the first chip is obtained according to a preset historical database.

[0078] Further, in the first embodiment of the present invention, see Figure 2 , is a flow chart of another embodiment of the chip adaptive operation method under low temperature conditions provided by the present invention, step 103 includes steps 201 to 205, and each step is specifically as follows:

[0079] Step 201: querying a preset historical database for several pieces of historical operation information of the first chip to form historical operation data of the first chip.

[0080] Furthermore, in the first embodiment of the present invention, when it is determined that the first chip enters the low temperature mode, several pieces of historical operation information of the first chip are queried in a preset historical database to form historical operation data of the first chip. The historical operation information includes: historical operation status of the first chip, ambient temperature data of the first chip, temperature change information of the first chip, and operation power consumption of the first chip.

[0081] Step 202: Identify the current resistivity of the first chip based on the current operating state.

[0082] Furthermore, in the first embodiment of the present invention, by collecting the current operating state of the first chip, the current resistivity of the first chip can be identified. Then, based on the current resistivity, the correlation information between the chip temperature and the operating state of the first chip under the current resistivity can be screened in the historical operating data of the first chip.

[0083] Step 203: Identify temperature operating state association information of the first chip at the current resistivity in the historical operating data.

[0084] Further, in the first embodiment of the present invention, the temperature operating state association information of the first chip at the current resistivity is identified in the historical operating data, specifically:

[0085] Acquire chip resistivity, chip operation status and chip temperature data of each of the historical operation information in the historical operation data;

[0086] Selecting a plurality of target historical operation information whose chip resistivity is the current resistivity from each of the historical operation information;

[0087] Based on the chip operating status and chip temperature data in each of the target historical operating information, the temperature operating status associated information of the first chip at the current resistivity is identified.

[0088] In the first embodiment of the present invention, the temperature operation state association information is the temperature change distribution information of the first chip when the first chip is in different operation states. The specific method for obtaining the temperature operation state association information is: identifying the chip operation state of each historical operation information, the chip temperature data corresponding to each historical operation information, and the chip resistivity corresponding to each historical operation information in the historical operation data of the first chip; in each historical operation information, screening the target historical operation information whose chip resistivity is the current resistivity; based on the chip temperature data in each target historical operation information and the chip operation state in each target historical operation information, the association information between the chip temperature and the operation state of the first chip under the current resistivity can be identified.

[0089] The present invention identifies the correlation information between the operating status of each chip and the chip temperature data by screening the target historical operating information of the current resistivity, thereby improving the comprehensiveness and accuracy of identifying the correlation information.

[0090] Step 204: Identify a temperature adjustment range of the first chip based on the historical operation data and the current ambient temperature data.

[0091] Further, in the first embodiment of the present invention, based on the historical operation data and the current ambient temperature data, the temperature adjustment range of the first chip is identified, specifically:

[0092] Acquire a normal operating temperature data range of the first chip; wherein the normal operating temperature data range includes a plurality of normal operating temperature data;

[0093] The differences between the current ambient temperature data and each normal operating temperature data in the normal operating temperature data range are calculated respectively to obtain the temperature adjustment range of the first chip.

[0094] In the first embodiment of the present invention, based on the current ambient temperature data of the first chip, the temperature adjustment range of the chip can be identified. Specifically, the temperature data range of the normal operation of the first chip is first obtained, and the difference between the current ambient temperature data and each temperature data in the temperature data range is calculated, so as to obtain the temperature adjustment range of the first chip. The temperature adjustment range of the first chip is the temperature change range of the first chip from the current temperature data to the temperature data range of the normal operation of the first chip.

[0095] The present invention identifies the temperature adjustment range of the first chip by taking the temperature data range of normal operation as a reference, thereby improving the comprehensiveness of the target temperature difference information of the identification chip.

[0096] Step 205: Determine a first operating state of the first chip based on the temperature adjustment range and the temperature operating state association information.

[0097] Further, in the first embodiment of the present invention, based on the temperature adjustment range and the temperature operation state association information, the first operation state of the first chip is determined, specifically:

[0098] Based on the temperature adjustment range, determining in the temperature operation state association information a plurality of first chip operation states corresponding to each normal operating temperature data in the temperature adjustment range;

[0099] Querying the chip operation power consumption corresponding to each of the first chip operation states in a preset historical database;

[0100] A first chip operating state in which the chip operating power consumption is minimum is determined as a first operating state of the first chip.

[0101] In the first embodiment of the present invention, based on the temperature adjustment range and the temperature operating state association information, the first operating state of the first chip can be identified, specifically: based on the temperature adjustment range, in the temperature operating state association information, the chip operating state range corresponding to the temperature adjustment range is identified; based on each chip operating state in the chip operating state range of the first chip, it is determined as the first chip operating state; the chip operating power consumption corresponding to each first chip operating state is queried, and the first chip operating state corresponding to the minimum chip operating power consumption is selected, and it is determined as the first operating state of the chip.

[0102] The present invention screens chip operating states that can be adjusted to the temperature adjustment range and have low chip operating power consumption. This not only ensures that the chip can generate heat by itself to offset the impact of low temperature, but also reduces the chip's operating power consumption, thereby improving the resource optimization effect of the chip during the self-heating process.

[0103] Step 104: Adjust the first chip from the current operating state to the first operating state.

[0104] In the first embodiment of the present invention, after determining a first operating state that can be adjusted to the temperature adjustment range of the first chip and has low power consumption, the operating state of the first chip is adjusted to switch from the current operating state to the first operating state, thereby realizing adaptive operation of the first chip under low temperature conditions.

[0105] See also Figure 3, is a flow chart of another embodiment of the chip adaptive operation method under low temperature conditions provided by the present invention. In the first embodiment of the present invention, after adjusting the first chip from the current operation state to the first operation state, step 105 is further included, specifically:

[0106] Step 105: Based on the temperature change trend, cyclically adjust the first chip from the first operating state to the second operating state until the operation of the first chip is completed.

[0107] In the first embodiment of the present invention, after the operation state of the first chip is adjusted to the first operation state, based on the temperature change trend of the first chip, the second operation state of the first chip is re-identified, and the second operation state replaces the first operation state. The second operation state at this time is essentially the new chip operation state of the first chip. The operation state of the first chip is iteratively adjusted by the change of the ambient temperature data after the chip operation state is changed, until the first chip completes the operation, and the iterative operation is stopped. The present invention iteratively changes the chip operation state of the first chip to adapt to the iterative ambient temperature data, thereby ensuring the chip adaptive operation efficiency of the first chip.

[0108] Further, in the first embodiment of the present invention, see Figure 4 , is a flow chart of another embodiment of the chip adaptive operation method under low temperature conditions provided by the present invention, step 105 includes steps 301 to 306, and each step is specifically as follows:

[0109] Step 301: Collect the current temperature change information and current ambient temperature data of the first chip in real time.

[0110] In the first embodiment of the present invention, after the first chip is converted into the first operating state, the temperature change information of the first chip is collected by using a temperature detection device, wherein the temperature change information of the first chip is the temperature data of the chip temperature of the first chip between unit time intervals.

[0111] Step 302: performing distribution sorting processing on the current temperature change information to obtain temperature change distribution information of the first chip.

[0112] In the first embodiment of the present invention, the temperature change information of the first chip is sorted and distributed to obtain the temperature change distribution information of the first chip. Specifically, the temperature data between each unit time interval in the temperature change information is processed using a curve fitting algorithm to generate the temperature change distribution information of the first chip.

[0113] Step 303: performing gradient division on the temperature change distribution information to obtain the temperature change gradient of the first chip.

[0114] In the first embodiment of the present invention, the temperature change gradient of the first chip can be identified based on the temperature change distribution information of the first chip. Specifically, a temperature change curve corresponding to the temperature change distribution information of the first chip is obtained, and the temperature change gradient of the first chip can be obtained after gradient division of the temperature change curve. Among them, the temperature deviation value between each gradient in the temperature change gradient of the first chip is a pre-set deviation value.

[0115] Step 304: Based on the current ambient temperature data, identifying information on the impact of the current ambient temperature data on the change of the temperature change gradient.

[0116] Further, in the first embodiment of the present invention, based on the current ambient temperature data, identifying the influence information of the current ambient temperature data on the change of the temperature change gradient is specifically:

[0117] In each of the historical operation information of the first chip, each of the first historical operation information corresponding to the first operation state;

[0118] Acquire the ambient temperature data corresponding to each of the first historical operation information;

[0119] Determine first historical operation information whose ambient temperature data is the current ambient temperature data as second historical operation information;

[0120] Identify the temperature data change information of each second historical operation information, and distribute and arrange the temperature data change information according to the time series to obtain the distribution information affecting the temperature change;

[0121] Calculating gradient influence information between the temperature change distribution information and the influencing temperature change distribution information based on the temperature change distribution information and the influencing temperature change distribution information;

[0122] The gradient influence information is determined as the influence information of the change of the current ambient temperature data on the temperature change gradient.

[0123] In the first embodiment of the present invention, based on the current ambient temperature data, the change influence information of the current ambient temperature data on the temperature change gradient of the first chip can be identified. Specifically: in each historical operation information of the first chip, query each first historical operation information corresponding to the first operation state of the first chip; in each first historical operation information, filter the second historical operation information whose ambient temperature data is the current ambient temperature data; identify the temperature data change information in the second historical operation information, and distribute and arrange the temperature data change information according to the time series to obtain the temperature change distribution information corresponding to the current ambient temperature data. Among them, the gradient influence information is the influence degree of the current ambient temperature data of the first chip on different temperature change gradients under different temperature change gradients. Among them, the change amount of each ambient temperature data corresponds to the temperature change amount of multiple chips, and the calculated change amount of each ambient temperature data corresponds to the average value of the temperature change amount of multiple chips, so as to obtain the target temperature change amount corresponding to the change amount of each ambient temperature data. Then, based on the change distribution information of the ambient temperature data, the distribution information of the target temperature change amount is constructed, and the gradient influence information of the temperature change distribution information corresponding to the change distribution information of the ambient temperature data is calculated by a curve fitting algorithm based on discrete points.

[0124] Step 305: Based on the change impact information and the temperature change gradient, identify the temperature change trend of the first chip.

[0125] Further, in the first embodiment of the present invention, based on the change impact information and the temperature change gradient, the temperature change trend of the first chip is identified, specifically:

[0126] Based on the temperature change gradient, predicting first temperature distribution information of the first chip;

[0127] Based on the change impact information, distribution adjustment processing is performed on the first temperature distribution information to obtain a temperature change trend of the first chip.

[0128] In the first embodiment of the present invention, by identifying the current temperature data of the first chip and based on the temperature change gradient of the first chip, the first temperature distribution information of the first chip can be predicted; based on the gradient influence information, the first temperature distribution information of the first chip is subjected to distribution adjustment processing, and the temperature change trend of the first chip can be obtained.

[0129] The present invention improves the accuracy of the temperature change trend of the chip by identifying the influence of the current ambient temperature data on the temperature change gradient of the first chip and determining the influence degree of the current ambient temperature data on different temperature change gradients by identifying the change influence information.

[0130] Step 306: Determine a second operating state of the first chip according to the temperature change trend, and adjust the first chip from the first operating state to the second operating state.

[0131] Further, in the first embodiment of the present invention, the second operating state of the first chip is determined according to the temperature change trend, specifically:

[0132] Based on the temperature change trend, identifying the chip adjustment time required for the first chip to change from current temperature data to the normal operating temperature data range;

[0133] Acquire a preset temperature adjustment time threshold of the first chip and a first operation time of the first chip in the first operation state;

[0134] Calculating a remaining temperature adjustment time of the first chip based on the preset temperature adjustment time threshold and the first operating time;

[0135] When the remaining temperature adjustment time is less than the chip adjustment time, respectively calculating the predicted chip adjustment time required from the current temperature data to the normal operating temperature data range under each of the first chip operating states;

[0136] Determine a first chip operation state in which the predicted chip adjustment time is less than the remaining temperature adjustment time as a second chip operation state;

[0137] The chip operation power consumptions corresponding to the second chip operation states are compared, and the second chip operation state with the smallest chip operation power consumption is determined as the second operation state of the first chip.

[0138] In the first embodiment of the present invention, based on the temperature change trend of the first chip, the second operating state of the first chip can be iteratively identified, and then the operating state of the first chip can be adjusted. Specifically, based on the temperature change trend of the first chip, the chip adjustment time from the current temperature data of the first chip to the temperature data range of normal operation of the chip is identified. The preset temperature adjustment time threshold of the first chip and the first operating time of the first chip in the first operating state are collected, and the first operating time is subtracted from the preset temperature adjustment time threshold to obtain the remaining temperature adjustment time of the first chip.

[0139] In the first embodiment of the present invention, the operating speed of the chip will slow down under low temperature conditions. If the chip adjustment time is too long, the actual temperature data of the chip will differ greatly from the temperature data detected after the chip adjustment is completed. Therefore, it is necessary to speed up the temperature adjustment process of the chip. Therefore, after obtaining the chip adjustment time and the remaining temperature adjustment time of the first chip, the two are compared. When the remaining temperature adjustment time is less than the chip adjustment time, the temperature of the first chip is adjusted.

[0140] In the first embodiment of the present invention, when it is determined to adjust the temperature of the first chip, the temperature change distribution information of each chip operating state in the operating state range at the current ambient temperature data is identified based on each historical operating information of the first chip. Based on the current temperature data of the first chip, the predicted chip adjustment time from the current temperature data of the first chip to the temperature data range of the normal operation of the chip is calculated for each chip operating state; and based on the chip operating power consumption corresponding to each chip operating state, the chip operating state corresponding to the lowest chip operating power consumption is selected from each initial chip operating state corresponding to the predicted chip adjustment time that is less than the remaining temperature adjustment time, and it is determined as the second operating state of the first chip.

[0141] The present invention reduces the influence of low temperature on the chip by controlling the temperature adjustment time, and improves the adjustment efficiency of the chip in adaptively adjusting the operating state.

[0142] The first embodiment of the present invention can be applied to the application environment of the Internet of Things chip and the integrated circuit chip running at low temperature. The method can be applied to the terminal, the server, and the system including the terminal and the server, and is implemented through the interaction between the terminal and the server. Among them, the terminal can be but not limited to various personal computers, laptops, smart phones, tablet computers, etc. The present invention is based on the changes in the temperature and operating state of the chip. By changing the operating state of the chip to generate heat, the operating efficiency can be improved while ensuring the normal operation of the chip, thereby effectively adapting to the low temperature environment and improving the chip's adaptive operating efficiency under low temperature conditions.

[0143] In summary, the first embodiment of the present invention provides a chip adaptive operation method under low temperature conditions, by acquiring the historical operation information of the chip, thereby identifying the correlation information between the chip temperature and the operation state of the chip under the current resistivity, and then identifying the first operation state of the chip under the target temperature difference information through the correlation information, so as to adjust the operation state of the chip so that the chip offsets the degree of influence of the ambient temperature on the chip operation by self-heating, and then adjusts the operation state of the chip by real-time detection of the temperature change information of the chip and the new ambient temperature data of the current environment, so as to ensure that the chip can be in the temperature data range of normal operation in real time by adaptively adjusting the chip operation state. The present invention not only avoids the problem of adding hardware to affect the adaptability of the chip, but also can ensure that the chip is in the temperature data range of normal operation in real time by adaptively adjusting the operation state, while offsetting the temperature influence of the low temperature environment in which the chip is located, thereby improving the chip adaptive operation efficiency under low temperature conditions.

[0144] Example 2

[0145] See also Figure 5 , is a schematic structural diagram of an embodiment of a chip adaptive operation device under low temperature conditions provided by the present invention, the device includes a data acquisition module 401, a mode judgment module 402, a motion state determination module 403 and a first adjustment module 404;

[0146] The data acquisition module 401 is used to acquire the current ambient temperature data and the current operating state of the first chip in real time during the operation of the first chip;

[0147] The mode determination module 402 is used to determine that the first chip enters a low temperature mode when the current ambient temperature data is less than a preset low temperature threshold;

[0148] The motion state determination module 403 is used to determine the first operating state of the first chip in the low temperature mode according to the current ambient temperature data of the first chip and the temperature operating state association information of the first chip; wherein the temperature operating state association information of the first chip is obtained according to a preset historical database;

[0149] The first adjustment module 404 is used to adjust the first chip from the current operating state to the first operating state.

[0150] Further, in the second embodiment of the present invention, see Figure 6 , is a schematic diagram of the structure of an embodiment of the motion state determination module provided by the present invention, the motion state determination module 403 includes: a query unit 501, a resistivity identification unit 502, an associated information identification unit 503, an adjustment range identification unit 504 and an operation state determination unit 505;

[0151] The query unit 501 is used to query a preset history database for several pieces of history operation information of the first chip to form history operation data of the first chip;

[0152] The resistivity identification unit 502 is used to identify the current resistivity of the first chip based on the current operating state;

[0153] The associated information identification unit 503 is used to identify the temperature operating state associated information of the first chip at the current resistivity in the historical operating data;

[0154] The adjustment range identification unit 504 is used to identify the temperature adjustment range of the first chip based on the historical operation data and the current ambient temperature data;

[0155] The operating state determining unit 505 is configured to determine a first operating state of the first chip based on the temperature adjustment range and the temperature operating state association information.

[0156] Further, in the second embodiment of the present invention, the associated information identification unit 503 includes: acquiring chip resistivity, chip operation status and chip temperature data of each of the historical operation information in the historical operation data;

[0157] Selecting a plurality of target historical operation information whose chip resistivity is the current resistivity from each of the historical operation information;

[0158] Based on the chip operating status and chip temperature data in each of the target historical operating information, the temperature operating status associated information of the first chip at the current resistivity is identified.

[0159] Further, in the second embodiment of the present invention, the adjustment range identification unit 504 includes:

[0160] Acquire a normal operating temperature data range of the first chip; wherein the normal operating temperature data range includes a plurality of normal operating temperature data;

[0161] The differences between the current ambient temperature data and each normal operating temperature data in the normal operating temperature data range are calculated respectively to obtain the temperature adjustment range of the first chip.

[0162] Further, in the second embodiment of the present invention, the operation status determination unit 505 includes:

[0163] Based on the temperature adjustment range, determining in the temperature operation state association information a plurality of first chip operation states corresponding to each normal operating temperature data in the temperature adjustment range;

[0164] Querying the chip operation power consumption corresponding to each of the first chip operation states in a preset historical database;

[0165] A first chip operating state in which the chip operating power consumption is minimum is determined as a first operating state of the first chip.

[0166] See also Figure 7 , is a schematic diagram of the structure of another embodiment of the chip adaptive operation device under low temperature conditions provided by the present invention. In the second embodiment of the present invention, the chip adaptive operation device under low temperature conditions further includes a second adjustment module 405, specifically:

[0167] The second adjustment module 405 is used to cyclically adjust the first chip from the first operating state to the second operating state based on the temperature change trend until the operation of the first chip is completed.

[0168] Further, in the second embodiment of the present invention, see Figure 8, is a structural diagram of an embodiment of the second adjustment module provided, the second adjustment module 405 includes: a collection unit 601, a distribution processing unit 602, a gradient division unit 603, an impact information identification unit 604, a trend identification unit 605 and an adjustment unit 606;

[0169] The acquisition unit 601 is used to acquire the current temperature change information and current ambient temperature data of the first chip in real time;

[0170] The distribution processing unit 602 is used to perform distribution sorting processing on the current temperature change information to obtain the temperature change distribution information of the first chip;

[0171] The gradient division unit 603 is used to perform gradient division on the temperature change distribution information to obtain the temperature change gradient of the first chip;

[0172] The impact information identification unit 604 is used to identify the impact information of the current ambient temperature data on the change of the temperature change gradient based on the current ambient temperature data;

[0173] The trend identification unit 605 is used to identify the temperature change trend of the first chip based on the change impact information and the temperature change gradient;

[0174] The adjustment unit 606 is configured to determine a second operating state of the first chip according to the temperature change trend, and adjust the first chip from the first operating state to the second operating state.

[0175] Furthermore, in the second embodiment of the present invention, the impact information identification unit 604 includes:

[0176] In each of the historical operation information of the first chip, each of the first historical operation information corresponding to the first operation state;

[0177] Acquire the ambient temperature data corresponding to each of the first historical operation information;

[0178] Determine first historical operation information whose ambient temperature data is the current ambient temperature data as second historical operation information;

[0179] Identify the temperature data change information of each second historical operation information, and distribute and arrange the temperature data change information according to the time series to obtain the distribution information affecting the temperature change;

[0180] Calculating gradient influence information between the temperature change distribution information and the influencing temperature change distribution information based on the temperature change distribution information and the influencing temperature change distribution information;

[0181] The gradient influence information is determined as the influence information of the change of the current ambient temperature data on the temperature change gradient.

[0182] Furthermore, in the second embodiment of the present invention, the trend identification unit 605 includes:

[0183] Based on the change impact information and the temperature change gradient, identifying the temperature change trend of the first chip is specifically:

[0184] Based on the temperature change gradient, predicting first temperature distribution information of the first chip;

[0185] Based on the change impact information, distribution adjustment processing is performed on the first temperature distribution information to obtain a temperature change trend of the first chip.

[0186] Furthermore, in the second embodiment of the present invention, the adjustment unit 606 includes:

[0187] According to the temperature change trend, the second operating state of the first chip is determined, specifically:

[0188] Based on the temperature change trend, identifying the chip adjustment time required for the first chip to change from current temperature data to the normal operating temperature data range;

[0189] Acquire a preset temperature adjustment time threshold of the first chip and a first operation time of the first chip in the first operation state;

[0190] Calculating a remaining temperature adjustment time of the first chip based on the preset temperature adjustment time threshold and the first operating time;

[0191] When the remaining temperature adjustment time is less than the chip adjustment time, respectively calculating the predicted chip adjustment time required from the current temperature data to the normal operating temperature data range under each of the first chip operating states;

[0192] Determine a first chip operation state in which the predicted chip adjustment time is less than the remaining temperature adjustment time as a second chip operation state;

[0193] The chip operation power consumptions corresponding to the second chip operation states are compared, and the second chip operation state with the smallest chip operation power consumption is determined as the second operation state of the first chip.

[0194] In summary, the second embodiment of the present invention provides a chip adaptive operation device under low temperature conditions, based on the organic combination of modules, by obtaining the historical operation information of the chip, so as to identify the correlation information between the chip temperature and the operation state of the chip under the current resistivity, and then identify the first operation state of the chip under the target temperature difference information through the correlation information, so as to adjust the operation state of the chip so that the chip offsets the degree of influence of the ambient temperature on the operation of the chip by self-heating, and then adjusts the operation state of the chip by real-time detection of the temperature change information of the chip and the new ambient temperature data of the current environment, so as to ensure that the chip can be in the temperature data range of normal operation in real time by adaptively adjusting the chip operation state. The present invention not only avoids the problem of adding hardware to affect the adaptability of the chip, but also can ensure that the chip is in the temperature data range of normal operation in real time by adaptively adjusting the operation state, while offsetting the temperature influence of the low temperature environment in which the chip is located, thereby improving the chip adaptive operation efficiency under low temperature conditions.

[0195] The specific embodiments described above further illustrate the purpose, technical solutions and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. It is particularly pointed out that for those skilled in the art, any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the scope of protection of the present invention.

Claims

1. A chip adaptive operation method under low temperature conditions, characterized in that: include: During the operation of the first chip, current ambient temperature data and current operation status of the first chip are acquired in real time; When the current ambient temperature data is less than a preset low temperature threshold, determining that the first chip enters a low temperature mode; In the low temperature mode, the first operating state of the first chip is determined according to the current ambient temperature data of the first chip and the temperature operating state association information of the first chip; wherein the temperature operating state association information of the first chip is obtained according to a preset historical database; The first chip is adjusted from the current operating state to the first operating state.

2. The chip adaptive operation method under low temperature conditions according to claim 1, characterized in that: The determining the first operating state of the first chip according to the current ambient temperature data of the first chip and the temperature operating state association information of the first chip is specifically: Querying a preset history database for several pieces of history operation information of the first chip to form history operation data of the first chip; identifying a current resistivity of the first chip based on the current operating state; identifying temperature operation state associated information of the first chip at a current resistivity in the historical operation data; Based on the historical operation data and the current ambient temperature data, identifying a temperature adjustment range of the first chip; Based on the temperature adjustment range and the temperature operation state association information, a first operation state of the first chip is determined.

3. The chip adaptive operation method under low temperature conditions according to claim 2, characterized in that: The identifying the temperature operation state associated information of the first chip at the current resistivity in the historical operation data is specifically: Acquire chip resistivity, chip operation status and chip temperature data of each of the historical operation information in the historical operation data; Selecting a plurality of target historical operation information whose chip resistivity is the current resistivity from each of the historical operation information; Based on the chip operating status and chip temperature data in each of the target historical operating information, the temperature operating status associated information of the first chip at the current resistivity is identified.

4. The chip adaptive operation method under low temperature conditions according to claim 3, characterized in that: The identifying the temperature adjustment range of the first chip based on the historical operation data and the current ambient temperature data is specifically: Acquire a normal operating temperature data range of the first chip; wherein the normal operating temperature data range includes a plurality of normal operating temperature data; The differences between the current ambient temperature data and each normal operating temperature data in the normal operating temperature data range are calculated respectively to obtain the temperature adjustment range of the first chip.

5. The chip adaptive operation method under low temperature conditions according to claim 4, characterized in that: The determining the first operating state of the first chip based on the temperature adjustment range and the temperature operating state association information is specifically: Based on the temperature adjustment range, determining in the temperature operation state association information a plurality of first chip operation states corresponding to each normal operating temperature data in the temperature adjustment range; Querying the chip operation power consumption corresponding to each of the first chip operation states in a preset historical database; A first chip operating state in which the chip operating power consumption is minimum is determined as a first operating state of the first chip.

6. The chip adaptive operation method under low temperature conditions according to claim 5, characterized in that: After adjusting the first chip from the current operating state to the first operating state, the method further includes: Based on the temperature change trend, cyclically adjusting the first chip from the first operating state to the second operating state until the first chip completes operation; The step of adjusting the first chip from the first operating state to the second operating state is specifically: Collecting the current temperature change information and current ambient temperature data of the first chip in real time; Performing distribution sorting processing on the current temperature change information to obtain temperature change distribution information of the first chip; Performing gradient division on the temperature change distribution information to obtain a temperature change gradient of the first chip; Based on the current ambient temperature data, identifying information on the influence of the current ambient temperature data on the change of the temperature change gradient; Based on the change impact information and the temperature change gradient, identifying a temperature change trend of the first chip; According to the temperature change trend, a second operating state of the first chip is determined, and the first chip is adjusted from the first operating state to the second operating state.

7. The chip adaptive operation method under low temperature conditions according to claim 6, characterized in that: The identifying, based on the current ambient temperature data, the influence information of the current ambient temperature data on the change of the temperature change gradient is specifically: In each of the historical operation information of the first chip, each of the first historical operation information corresponding to the first operation state; Acquire the ambient temperature data corresponding to each of the first historical operation information; Determine first historical operation information whose ambient temperature data is the current ambient temperature data as second historical operation information; Identify the temperature data change information of each second historical operation information, and distribute and arrange the temperature data change information according to the time series to obtain the distribution information affecting the temperature change; Calculating gradient influence information between the temperature change distribution information and the influencing temperature change distribution information based on the temperature change distribution information and the influencing temperature change distribution information; The gradient influence information is determined as the influence information of the current ambient temperature data on the temperature change gradient.

8. The chip adaptive operation method under low temperature conditions according to claim 7, characterized in that: The identifying the temperature change trend of the first chip based on the change impact information and the temperature change gradient is specifically: Based on the temperature change gradient, predicting first temperature distribution information of the first chip; Based on the change impact information, distribution adjustment processing is performed on the first temperature distribution information to obtain a temperature change trend of the first chip.

9. The chip adaptive operation method under low temperature conditions according to claim 8, characterized in that: Determining the second operating state of the first chip according to the temperature change trend is specifically: Based on the temperature change trend, identifying the chip adjustment time required for the first chip to change from current temperature data to the normal operating temperature data range; Acquire a preset temperature adjustment time threshold of the first chip and a first operation time of the first chip in the first operation state; Calculating a remaining temperature adjustment time of the first chip based on the preset temperature adjustment time threshold and the first operating time; When the remaining temperature adjustment time is less than the chip adjustment time, respectively calculating the predicted chip adjustment time required from the current temperature data to the normal operating temperature data range under each of the first chip operating states; Determine a first chip operation state in which the predicted chip adjustment time is less than the remaining temperature adjustment time as a second chip operation state; The chip operation power consumptions corresponding to the second chip operation states are compared, and the second chip operation state with the smallest chip operation power consumption is determined as the second operation state of the first chip.

10. A chip adaptive operation device under low temperature conditions, characterized in that: include: A data acquisition module, a mode determination module, a motion state determination module and a first adjustment module; The data acquisition module is used to acquire the current ambient temperature data and the current operating state of the first chip in real time during the operation of the first chip; The mode judgment module is used to determine that the first chip enters the low temperature mode when the current ambient temperature data is less than a preset low temperature threshold; The motion state determination module is used to determine the first operating state of the first chip in the low temperature mode according to the current ambient temperature data of the first chip and the temperature operating state association information of the first chip; wherein the temperature operating state association information of the first chip is obtained according to a preset historical database; The first adjustment module is used to adjust the first chip from the current operating state to the first operating state.

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