Temperature detection method, heating power control method and semiconductor device

Abstract

The invention provides a temperature detection method, a heating power control method and semiconductor equipment. The temperature detection method comprises the following steps: acquiring a current temperature measurement value and a current rotation position of a reference support fork, and determining a current light path included angle according to the current rotation position and the number of support forks; calculating a temperature correction coefficient according to the current light path included angle, the current temperature measurement value and the current rotation position; and calculating a current temperature measurement average value according to the N historical temperature measurement values and the current temperature measurement value, calculating a current temperature measurement correction value according to the temperature correction coefficient and the current temperature measurement average value, and taking the current temperature measurement correction value as a current temperature detection value output by the temperature measurement device. According to the method, in the temperature measurement data processing process, the light path included angle and the rotation position are introduced, compared with an existing data average processing mode, the temperature measurement data stability is improved, accurate control over the real-time temperature can be achieved, meanwhile, temperature overshoot is effectively restrained, and therefore the temperature control stability of the heat treatment cavity is improved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and in particular to a temperature detection method, a heating power control method and a semiconductor device. Background Art

[0002] Thermal treatment chambers are widely used in the field of microelectronic equipment, and they have very high requirements for temperature control stability. In practical applications, thermal treatment chambers mainly include process chambers for epitaxial growth equipment and process chambers for thermal annealing equipment; among them, epitaxial growth equipment is one of the key equipment in the chip preparation process, and this equipment is very sensitive to temperature control stability and pressure control stability. Temperature control stability has a significant impact on the growth rate, doping stability and crystal defects of epitaxial films. Therefore, it is of great significance to improve the temperature control stability of thermal treatment chambers.

[0003] For the heat treatment chamber, the main components that affect its temperature control stability include: tray, support part (including the rotating shaft and multiple support forks connected to the rotating shaft), transparent quartz chamber wall and thermometer, etc. Among them, the temperature measurement stability of the thermometer directly determines the temperature control stability, and the rotating shaft has the greatest impact on the temperature measurement stability. In process engineering, the thermometer is generally fixed below the support part. When the tray rotates with the rotating shaft, the support forks arranged at intervals at the bottom of the tray will periodically block the temperature signal emitted by the tray, causing the temperature value periodically collected by the thermometer to fluctuate greatly, thereby causing the temperature control system to significantly adjust the heating control, which in turn causes the temperature in the heat treatment chamber to fluctuate greatly.

[0004] In order to improve the temperature control stability of the heat treatment chamber, the existing method mainly averages the detection data of the thermometer. However, if the amount of data collected by the thermometer is insufficient or inappropriate, the temperature fluctuation introduced by the support fork cannot be eliminated, which is manifested as large temperature fluctuation of the thermometer. In addition, although the averaging process can suppress temperature fluctuations, it will cause the current temperature value of the thermometer to have serious lag, which further reduces the temperature measurement stability and further reduces the temperature control stability of the heat treatment chamber. Therefore, how to improve the temperature control stability of the heat treatment chamber is an urgent problem to be solved. Summary of the invention

[0005] In view of this, the purpose of the present invention is to provide a temperature detection method, a heating power control method and a semiconductor device to alleviate the above-mentioned problems. In the process of temperature measurement data processing, the optical path angle and the rotation position are introduced. Compared with the existing data averaging processing method, the stability of the temperature measurement data is improved, and precise control of real-time temperature can be achieved. At the same time, temperature overshoot is effectively suppressed, thereby improving the temperature control stability of the heat treatment chamber.

[0006] In a first aspect, an embodiment of the present invention provides a temperature detection method for detecting the temperature of a heat treatment chamber in a semiconductor device, wherein the heat treatment chamber comprises a support portion, a temperature measuring device and a position detection device, wherein the support portion comprises a rotating shaft and a plurality of support forks connected to the rotating shaft, the support portion is used to support a temperature-measured component through a plurality of support forks, the temperature measuring device is located below the support portion, and the position detection device is disposed on the rotating shaft; the temperature detection method comprises: obtaining a current temperature measurement value of the temperature-measured component detected by the temperature measuring device at the current moment and a current rotation position of a reference support fork detected by the position detection device; wherein the reference support fork is used to characterize a support fork on one side of a reference line, and the reference line is used to characterize a temperature-measured component; wherein the temperature-measured component is located at a position on the rotating shaft; and wherein the temperature-measured component is located at a position on the rotating shaft. The method comprises the following steps: a first step is to characterize the connection between the temperature measuring light spot and the axis of the rotating shaft; a second step is to determine the current light path angle corresponding to the current moment according to the current rotation position and the number of support forks; the current light path angle is used to characterize the angle between the reference support fork and the reference line; a temperature correction coefficient is calculated according to the current light path angle, the current temperature measurement value and the current rotation position; N historical temperature measurement values ​​detected by the temperature measuring device before the current moment are obtained, and a current temperature measurement average value is calculated according to the N historical temperature measurement values ​​and the current temperature measurement value; a current temperature measurement correction value is calculated according to the temperature correction coefficient and the current temperature measurement average value, and the current temperature measurement correction value is used as the current temperature detection value output by the temperature measuring device.

[0007] Preferably, the step of calculating the temperature correction coefficient based on the current optical path angle, the current temperature measurement value and the current rotation position includes: determining the first correction coefficient group corresponding to the current optical path angle based on the current optical path angle, the current temperature measurement value and a preset correspondence; wherein the first correction coefficient group includes multiple first correction coefficients; the preset correspondence is used to characterize the correspondence between the optical path angle, the temperature measurement value and the first correction coefficient group; and calculating the temperature correction coefficient based on the first correction coefficient group and the current rotation position.

[0008] Preferably, the method also includes: acquiring multiple detection point parameters within a preset period; wherein the preset period is used to characterize the time interval from the reference line coinciding with the current support fork to the reference line coinciding with the next support fork during the rotation of the rotating shaft; each detection point parameter includes a temperature reference value detected by a temperature measuring device and an optical path angle reference value corresponding to the temperature reference value; generating a preset curve based on multiple detection point parameters; wherein the preset curve is used to characterize the correspondence between the temperature reference value and the optical path angle reference value within a preset period; dividing the preset curve into multiple intervals, and performing data fitting on the detection point parameters of each interval to obtain a first correction coefficient group corresponding to each interval; wherein each interval corresponds to a temperature reference value range and an optical path angle reference value range, respectively; generating a preset correspondence based on the first correction coefficient groups of multiple intervals and the temperature reference value range and the optical path angle reference value range of each interval.

[0009] Preferably, before the step of calculating the temperature correction coefficient based on the first correction coefficient group and the current rotation position, the method also includes: obtaining a division range corresponding to the current rotation position, and compressing the division range to a preset range to obtain a second correction coefficient group; wherein the second correction coefficient group includes multiple second correction coefficients; converting the current rotation position according to the multiple second correction coefficients, and calculating the temperature correction coefficient based on the first correction coefficient group and the current rotation position after the conversion.

[0010] Preferably, the step of determining the current optical path angle corresponding to the current moment according to the current rotation position and the number of support forks includes: the calculation formula of the current optical path angle is as follows:

[0011]

[0012] Wherein, Angle represents the current optical path angle, R0 represents the number of support forks, and R0≥3, pos represents the current rotation position, C0 represents a preset constant, and Fix represents a rounding operation.

[0013] In a second aspect, an embodiment of the present invention provides a heating power control method, which is applied to a heater in a semiconductor device, and the heater is used to heat a heat treatment chamber of the semiconductor device, the method comprising: obtaining process parameters corresponding to the heat treatment chamber in the current process step; wherein the process parameters include: a set temperature and a target temperature change rate Vt; obtaining a temperature value Ti of the heat treatment chamber in the current temperature control cycle; judging whether the current temperature control cycle meets the preset temperature control requirements based on the set temperature and the temperature value Ti; if not, calculating the current initial power Pxfi based on the starting heating power Pst and the target temperature change rate Vt of the heater; wherein the current initial power Pxfi is used to characterize the heating power of the heater to control the operation of the heater in the current temperature control cycle; and judging whether the current temperature control cycle meets the preset temperature control requirements based on the target temperature change rate Vt and the historical temperature change rate Vt. j Calculate the current target temperature change rate Vit corresponding to the current temperature control cycle; where the historical temperature change rate V j Including multiple temperature change rates corresponding to the temperature control cycle before the current temperature control cycle from the beginning of the current process step, j = 1, 2, ... i-1, i represents the current temperature control cycle; obtain the historical temperature control power, and according to the historical temperature control power, the current target temperature change rate Vit and the previous temperature change rate V corresponding to the previous temperature control cycle of the current temperature control cycle i-1 Calculate the current corrected power P i '; Among them, the historical temperature control power includes: the temperature control power P corresponding to the temperature control cycle before the current temperature control cycle" i-1 The temperature control power P corresponding to the two temperature control cycles before the current temperature control cycle" i-2 ; Based on the current corrected power P i', the current target temperature change rate Vit and the target temperature change rate Vt correct the current initial power Pxfi to obtain the corrected current temperature control power P i "; Control the heater according to the current temperature control power P i "run.

[0014] Preferably, the step of calculating the current initial power Pxfi according to the starting heating power Pst and the target temperature change rate Vt of the heater includes: calculating the corresponding components of the starting heating power Pst and the corresponding components of the target temperature change rate Vt respectively based on linear proportion; determining multiple corresponding calculation coefficients in a preset relationship database according to the corresponding components of the starting heating power Pst and the corresponding components of the target temperature change rate Vt; wherein the preset relationship database is a database for characterizing the correspondence between the target temperature change rate Vt, the starting heating power Pst and the initial power Pxf; and calculating the current initial power Pxfi according to multiple calculation coefficients, the starting heating power Pst and the target temperature change rate Vt.

[0015] Preferably, after the step of calculating the current initial power Pxfi according to the starting heating power Pst and the target temperature change rate Vt of the heater, the method further includes: if the current temperature control cycle is the first temperature control cycle of the current process step, the current initial power Pxfi is sent to the heater so that the heater operates according to the current initial power Pxfi.

[0016] Preferably, before the step of judging whether the current temperature control cycle meets the preset temperature control requirements according to the set temperature and the temperature value Ti, the method further includes: obtaining multiple historical temperature detection values ​​of the heat treatment chamber, and determining the temperature mode corresponding to the heat treatment chamber according to the multiple historical temperature detection values ​​and the temperature value Ti of the current temperature control cycle; wherein the temperature mode includes: a heating mode, a cooling mode and a constant temperature mode; the historical temperature detection values ​​are used to characterize the temperature values ​​of the heat treatment chamber within a preset time period before the current temperature control cycle; based on the temperature mode, the set temperature and the temperature value Ti, judging whether the current temperature control cycle meets the preset temperature control requirements.

[0017] Preferably, the set temperature includes a target temperature and a transfer temperature; wherein the transfer temperature is used to characterize a temperature value between the target temperature and the temperature value Ti in the current process step; based on the temperature mode, the set temperature and the temperature value Ti, the step of judging whether the current temperature control cycle meets the preset temperature control requirements includes: when the temperature mode is a heating mode, if the temperature value Ti is not less than the transfer temperature, judging that the current temperature control cycle meets the preset temperature control requirements.

[0018] Preferably, based on the temperature mode, set temperature and temperature value Ti, the step of judging whether the current temperature control cycle meets the preset temperature control requirements includes: when the temperature mode is the cooling mode, if the temperature value Ti is not greater than the transfer temperature, judging that the current temperature control cycle meets the preset temperature control requirements.

[0019] Preferably, based on the temperature mode, the set temperature and the temperature value Ti, the step of judging whether the current temperature control cycle meets the preset temperature control requirements includes: if the temperature mode is the constant temperature mode, obtaining the running time of the current process step; if the running time does not reach the preset time, continuing to control the heat treatment chamber according to the current process step until the running time reaches the preset time.

[0020] Preferably, based on the current corrected power P i ', the current target temperature change rate Vit and the target temperature change rate Vt correct the current initial power Pxfi to obtain the corrected current temperature control power P i " steps, including: current temperature control power P i The calculation formula of ” is as follows:

[0021]

[0022] Among them, P i " indicates the current temperature control power, P i ' represents the current corrected power, Vit represents the current target temperature change rate, Vt represents the target temperature change rate, and Pxfi represents the current initial power.

[0023] Preferably, according to the target temperature change rate Vt and the historical temperature change rate V j The step of calculating the current target temperature change rate Vit corresponding to the current temperature control cycle includes: the calculation formula of the current target temperature change rate Vit is as follows:

[0024] Vit=t1*Vt-sum(V j )

[0025] Among them, Vit represents the current target temperature change rate, Vt represents the target temperature change rate, V j represents the historical temperature change rate, j=1, 2, ...i-1, i represents the current temperature control cycle, and t1 represents the time constant.

[0026] Preferably, according to the historical temperature control power, the current target temperature change rate Vit and the temperature change rate V corresponding to the temperature control cycle before the current temperature control cycle i-1 Calculate the current corrected power P i ' steps, including: current correction power P i The calculation formula of ' is as follows:

[0027]

[0028] Among them, P i ' represents the current corrected power, P i-1 " indicates the temperature control power corresponding to the temperature control cycle before the current temperature control cycle, P i-2 " indicates the temperature control power corresponding to the first two temperature control cycles of the current temperature control cycle, V i-1 Indicates the previous temperature change rate, and Vit indicates the current target temperature change rate.

[0029] Preferably, the step of obtaining the temperature value Ti of the heat treatment chamber in the current temperature control cycle comprises: adopting the method as described in the first aspect to obtain the temperature value Ti of the heat treatment chamber in the current temperature control cycle.

[0030] In a third aspect, an embodiment of the present invention provides a semiconductor device, comprising a controller, and a heater, a temperature measuring device and a position detection device arranged in a heat treatment chamber and connected to the controller for communication; wherein the heat treatment chamber also has a support portion, the support portion comprising a rotating shaft and N support forks connected to the rotating shaft, the support portion being used to support the temperature-measured component through the N support forks, the temperature measuring device being located below the support portion, and the position detection device being arranged on the rotating shaft; the controller being used to implement the steps of the methods of the first and second aspects above.

[0031] In a fourth aspect, an embodiment of the present invention provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the steps of the methods of the first and second aspects described above are executed.

[0032] The embodiments of the present invention bring the following beneficial effects:

[0033] Embodiments of the present invention provide a temperature detection method, a heating power control method and a semiconductor device. On the one hand, in the process of temperature measurement data processing, the optical path angle and the rotation position are introduced, which improves the stability of the temperature measurement data compared with the existing data averaging processing method, and can realize accurate control of real-time temperature, while effectively suppressing temperature overshoot, thereby improving the temperature measurement stability of the heat treatment chamber; on the other hand, in the heating power control, the heating power control is coupled with the real-time temperature change rate, so that the stability of the heating power and the actual temperature change rate are more closely matched with the target temperature change rate; at the same time, the automatic connection design of the heating power control is also realized, which effectively avoids the problems of unstable power and unstable temperature when switching between process steps, thereby improving the stability of the heating power control, and thus improving the temperature control stability of the heat treatment chamber.

[0034] Other features and advantages of the present invention will be described in the following description, and partly become apparent from the description, or understood by practicing the present invention. The purpose and other advantages of the present invention are realized and obtained by the structures particularly pointed out in the description and the drawings.

[0035] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, preferred embodiments are given below and described in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] In order to more clearly illustrate the specific implementation methods of the present invention or the technical solutions in the prior art, the drawings required for use in the specific implementation methods or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are some implementation methods of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0037] Figure 1 A schematic diagram of average temperature corresponding to an inappropriate amount of data or insufficient amount of data provided in an embodiment of the present invention;

[0038] Figure 2 A schematic diagram of a temperature-power curve corresponding to a fixed starting power provided by an embodiment of the present invention;

[0039] Figure 3 A flow chart of a temperature detection method provided by an embodiment of the present invention;

[0040] Figure 4 A top view of a support portion provided by an embodiment of the present invention;

[0041] Figure 5 A front view of a support portion provided by an embodiment of the present invention;

[0042] Figure 6 A schematic diagram of a temperature measurement optical path provided by an embodiment of the present invention;

[0043] Figure 7 A schematic diagram of a thermometer reading provided by an embodiment of the present invention;

[0044] Figure 8 A schematic diagram of the relationship between an optical path angle and a support fork provided in an embodiment of the present invention;

[0045] Fig. 9 A schematic diagram of a rotation position provided by an embodiment of the present invention;

[0046] Fig.10 A schematic diagram of the change of an optical path angle over time provided by an embodiment of the present invention;

[0047] Fig.11 Schematic diagram of the change of the optical path angle with the rotation position provided by an embodiment of the present invention;

[0048] Fig.12 Schematic diagram of the change curve of the temperature reference value with the optical path angle reference value provided by an embodiment of the present invention;

[0049] Fig.13 Flowchart of another temperature detection method provided by an embodiment of the present invention;

[0050] Fig.14 Flowchart of a heating power control method provided by an embodiment of the present invention;

[0051] Fig.15 Flowchart of another heating power control method provided by an embodiment of the present invention;

[0052] Fig.16 Schematic diagram of the structure of a semiconductor device provided by an embodiment of the present invention. Detailed implementation manners

[0053] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Apparently, the described embodiments are some but not all of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0054] In order to improve the temperature control stability of the heat treatment chamber, the existing methods mainly perform temperature control through two parts: temperature measurement data processing and heating power control. Among them, the processes of the two parts are as follows:

[0055] (1) Temperature measurement data processing: Simple averaging processing, that is, averaging the real-time temperature measurement data T of the thermometer i with the previous n output temperature data and using it as the current temperature output. The specific process includes: ① Obtaining the readings of the thermometer; the first reading T1, the second reading T2, the third reading T3, and the mth reading T m ; ② Performing temperature filtering calculation and using the calculation result as the output temperature; for example, for the first reading T1, its output temperature T1' = T1; for the second reading T2, the output temperature T2' = 1 / 2 * (T1' + T2); for the third reading T3, the output temperature T3' = 1 / 3 * (T1' + T2' + T3). And so on, for the mth reading T m , if m < n, the output temperature if m > n, the output temperature where T i' is the output temperature corresponding to the i-th thermometer reading, and the corresponding input temperature is T i ; ③ Output temperature T m ' is transmitted to the temperature control system so that the temperature control system controls the system temperature through heating power.

[0056] However, in the above averaging process, if the amount of data collected by the thermometer is insufficient or inappropriate, the temperature fluctuation introduced by the support fork cannot be eliminated, such as Figure 1 The amount of data shown is not appropriate or the amount of data is not enough to correspond to the average temperature, which is manifested as large fluctuations in the temperature measurement of the thermometer. In addition, although the introduction of a large amount of suitable data for averaging can suppress temperature fluctuations, this also causes the current temperature value of the thermometer to have serious lag (that is, the currently calculated temperature value is actually the temperature value before the current moment). In addition, for the variable temperature stage, the lag in temperature measurement data will cause serious overshoot of temperature control, thereby reducing the temperature control stability of the heat treatment chamber.

[0057] (2) Heating power control: In the existing method, no matter what the actual temperature is, the control starts from the specified starting power, and the subsequent power adjustment is performed through a fixed set of PID (Proportion Integral Differential) algorithms. Figure 2 As shown in the figure, all of them are controlled from a fixed starting power, which will lead to unstable temperature control connection. That is, when the process steps are switched, the fixed starting power causes a sudden drop in power, which causes the temperature to drop accordingly. The temperature that should have risen drops instead, resulting in unstable temperature connection. In turn, not only can the required heating rate not be achieved in a short period of time, but a negative temperature change rate occurs, making the temperature change rate fail to reach the set target. Therefore, the unstable control of the heating power will further aggravate the large fluctuation of temperature control and reduce the temperature control stability of the heat treatment chamber.

[0058] Therefore, although the existing method can achieve temperature control of the heat treatment chamber, it has the problem of poor temperature measurement stability and poor heating power control stability, which leads to large fluctuations in temperature control.

[0059] Based on this, the embodiments of the present invention provide a temperature detection method, a heating power control method and a semiconductor device. On the one hand, in the process of temperature measurement data processing, the optical path angle and the rotation position are introduced. Compared with the existing data averaging processing method, the stability of the temperature measurement data is improved, and the real-time temperature can be accurately controlled. At the same time, the temperature overshoot is effectively suppressed, thereby improving the temperature measurement stability of the heat treatment chamber; on the other hand, in the heating power control, the heating power control is coupled with the real-time temperature change rate, so that the stability of the heating power and the actual temperature change rate are more closely matched with the target temperature change rate; at the same time, the automatic connection design of the heating power control is also realized, which effectively avoids the problems of unstable power and unstable temperature when switching between process steps, thereby improving the stability of the heating power control, and thus improving the temperature control stability of the heat treatment chamber.

[0060] To facilitate understanding of this embodiment, a thermal semiconductor device provided by an embodiment of the present invention is first introduced in detail below. The semiconductor device includes a controller, and a heater, a temperature measuring device and a position detection device arranged in a heat treatment chamber and connected to the controller for communication; the heat treatment chamber also has a support portion, the support portion includes a rotating shaft and N support forks connected to the rotating shaft, the support portion is used to support the temperature-measured part through the N support forks, the temperature measuring device is located below the support portion, and the position detection device is arranged on the rotating shaft. It should be noted that in the embodiment of the present invention, the temperature measuring device is preferably a thermometer, and the position detection device is preferably a position sensor.

[0061] Among them, the above-mentioned controller can be a host computer or a slave computer of a semiconductor device, and the host computer or the slave computer can be an electronic device such as a computer or a PLC (Programmable Logic Controller), which is used to implement the steps of the temperature detection method and the heating power control method in the following embodiments to improve the temperature measurement stability, improve the heating control stability, and thus improve the temperature control stability of the heat treatment chamber.

[0062] Embodiment 1

[0063] Based on the above semiconductor device, an embodiment of the present invention provides a temperature detection method for detecting the temperature of a heat treatment chamber in a semiconductor device. Figure 3 As shown, the temperature detection method includes the following steps:

[0064] Step S302, obtaining the current temperature value of the temperature-measured component detected by the temperature measuring device and the current rotation position of the reference support fork detected by the position detection device at the current moment;

[0065] In practical applications, for the support part of the heat treatment chamber, such as Figure 4 and Figure 5As shown, it includes a rotating shaft 41 and a plurality of supporting forks 42, and the plurality of supporting forks 42 are all connected to the rotating shaft 41; wherein, the supporting forks 42 may also be referred to as supporting members, and there are at least three of them, which are used to carry or support a tray (i.e., a temperature-measured member) of a material (or wafer), so that during the rotation of the rotating shaft 41 around its midline or axis, the plurality of supporting forks 42 rotate along with it, and at the same time, a heater such as a heating lamp in the heat treatment chamber heats the tray and the wafer.

[0066] In addition, if Figure 6 As shown, the temperature measuring device such as the thermometer 61 is located below the support portion, and the temperature measuring optical path obliquely reaches the center of the temperature-measured component 62. When the rotating shaft 41 drives the temperature-measured component 62 to rotate, the support fork 42 alternately passes through the temperature measuring optical path and repeats. Since the position of the thermometer 61 is fixed, its temperature measuring optical path will be alternately blocked by the support fork 42. Figure 7 As shown, the reading (ie, temperature) of the thermometer 61 will show large periodic fluctuations, which will cause large temperature fluctuations in the heat treatment chamber if no treatment is performed.

[0067] Based on this, the embodiment of the present invention introduces the optical path angle and the rotation position to process the reading of the thermometer, so as to suppress the influence of the support fork interference on the temperature fluctuation. At the current moment, the current temperature value of the temperature-measured component is detected by the temperature measuring device, i.e., the thermometer, and the current rotation position of the reference support fork is detected by the position detection device, such as Figure 8 As shown, the reference support fork is used to characterize the support fork on one side of the reference line, where the reference line is used to characterize the line between the temperature measuring spot and the axis of the rotating shaft 41, that is, the dotted line in the figure; wherein the temperature measuring spot is a point on the object to be measured where the temperature measuring light path reaches, such as a point near the center point of the tray where the temperature measuring light path reaches.

[0068] For the sake of convenience, the embodiment of the present invention refers to the support fork on the left side of the reference line as the reference support fork, so the reference support fork can also be called the left fork. For example, in the case of three support forks, when the support fork on the right side of the reference line (referred to as the right fork) turns past the temperature measurement spot and enters the next 120° interval, in the new temperature measurement interval, the right fork of the previous interval will become the left fork of the current interval and serve as the reference support fork of the current interval. Therefore, the reference support fork of each interval is adaptively adjusted according to the reference line.

[0069] In addition, for each moment the reference support fork's rotational position pos is determined as Fig. 9As shown, the rotation position pos is equivalent to dividing 360° into M parts, such as 10,000 parts, 15,000 parts, etc., which can be set according to actual conditions. When pos=0, it means that the rotation axis has not rotated. At this time, the reference support fork and the reference line are coincident or parallel by default; when pos=1, it means that the rotation axis has rotated 360 / M degrees, that is, the reference support fork has also rotated 360 / M degrees; when pos=n, it means that the rotation axis has rotated 360*n / M degrees. Similarly, the reference support fork has also rotated 360*n / M degrees. Therefore, the rotation position of the reference support fork can be detected by the position detection device set on the rotation axis.

[0070] Step S304, determining the current optical path angle corresponding to the current moment according to the current rotation position and the number of support forks;

[0071] Among them, the current optical path angle is used to characterize the angle between the reference support fork and the reference line; Figure 8 As shown in the figure, the optical path angle Angle always represents the angle between the reference line and the left support fork (such as the left fork). For example, in the case of three support forks, the range of the optical path angle Angle is 0-120°. When the right support fork passes the temperature measurement spot and enters the next 120° interval, in the new temperature measurement interval, the right fork of the previous interval becomes the left fork of the current interval, and the optical path angle Angle changes from 120° to 0°.

[0072] In addition, if Fig.10 As shown, the optical path angle Angle changes periodically with time, and the fluctuation period of the thermometer reading is directly related to the number of support forks. Therefore, the relationship between the optical path angle Angle and the rotation position pos can be obtained as follows: Fig.11 As shown, for each moment, the corresponding optical path angle can be determined according to the collected rotation position and the number of support forks.

[0073] For the current optical path angle, the calculation formula is as follows:

[0074]

[0075] Wherein, Angle represents the current optical path angle, R0 represents the number of support forks, and R0≥3, pos represents the current rotation position, C0 represents a preset constant, and Fix represents a rounding operation. It should be noted that the optical path angles at other moments can be calculated according to formula (1), and the embodiments of the present invention will not be described in detail here.

[0076] Therefore, by introducing the coupling of the optical path angle and the rotation position instead of averaging a large amount of data, the processing efficiency of the temperature measurement data can be improved. For example, the data processing cycle can be reduced to less than 0.5s, thereby achieving precise control of real-time temperature.

[0077] Step S306, calculating a temperature correction coefficient according to the current optical path angle, the current temperature measurement value, and the current rotation position;

[0078] Specifically, according to the current optical path angle, the current temperature measurement value and the preset correspondence, the first correction coefficient group corresponding to the current optical path angle is determined; wherein the first correction coefficient group includes multiple first correction coefficients; the preset correspondence is used to characterize the correspondence between the optical path angle, the temperature measurement value and the first correction coefficient group; the temperature correction coefficient is calculated according to the first correction coefficient group and the current rotation position.

[0079] Among them, the preset corresponding relationship can be understood as the mapping relationship between the optical path angle, the temperature measurement value and the first correction coefficient group, where the optical path angle corresponds to multiple optical path angle intervals or optical path angle ranges, and the temperature measurement value corresponds to multiple temperature intervals, and each optical path angle interval and temperature measurement interval respectively corresponds to a first correction coefficient group, so that for the current optical path angle and the current temperature measurement value, the target optical path angle interval to which the current optical path angle belongs and the target temperature measurement interval to which the current temperature measurement value belongs can be quickly determined, and the first correction coefficient group corresponding to the current optical path angle can be quickly determined in the preset corresponding relationship according to the target optical path angle interval and the target temperature measurement interval, so as to process the current temperature measurement value according to the corresponding first correction coefficient group, so that the processing of the temperature measurement value collected by the temperature measuring device at each moment is adaptively adjusted according to its corresponding optical path angle, thereby improving the accuracy of temperature measurement data processing and improving temperature measurement stability.

[0080] Step S308, obtaining N historical temperature measurement values ​​detected by the temperature measurement device before the current moment, and calculating the current temperature measurement average value based on the N historical temperature measurement values ​​and the current temperature measurement value;

[0081] In order to solve the problem of signal fluctuation in a very short time, the embodiment of the present invention also performs an average processing on the readings of the temperature measuring device. Specifically, the calculation formula of the current temperature measurement average value is as follows:

[0082]

[0083] in, represents the current average temperature measurement value, Ti represents the current reading value, i.e., the current temperature measurement value, T-(i-1)~T-(iN) represents the N historical temperature measurement values ​​collected before the current moment, i.e., the temperature measurement values ​​read by N temperature measuring devices without data processing, not the output value of the temperature measuring device; the value of N here should not be too large or too small. If it is too large, it will cause data processing lag, and if it is too small, it will not be able to eliminate the signal fluctuation problem that causes temperature fluctuation. For example, for the cleaning of three support forks, the N value is preferably 5 to 50. Therefore, by using formula (2) to average the current temperature measurement value of the temperature measuring device, the signal fluctuation problem in a very short time can be solved, further improving the temperature measurement stability.

[0084] Step S310, calculating a current temperature measurement correction value according to the temperature correction coefficient and the current temperature measurement average value, and using the current temperature measurement correction value as the current temperature detection value output by the temperature measurement device.

[0085] Specifically, the calculation formula of the current temperature detection value is as follows:

[0086]

[0087] Among them, T i Indicates the current temperature detection value. It represents the current average temperature measurement value, and kk represents the temperature correction coefficient.

[0088] Therefore, the above-mentioned temperature detection method introduces the optical path angle and the rotation position during the temperature measurement data processing process. Compared with the existing data averaging processing method, the stability of the temperature measurement data is improved, and accurate control of the real-time temperature can be achieved. At the same time, since the temperature overshoot is largely caused by the averaging of a large amount of data in the existing scheme, which causes the temperature data update to lag, the embodiment of the present invention effectively suppresses the temperature overshoot during the temperature change process by processing the temperature measurement data in real time, thereby improving the temperature measurement stability of the heat treatment chamber, and further improving the temperature control stability of the heat treatment chamber.

[0089] In one embodiment, the method also includes: obtaining multiple detection point parameters within a preset period; wherein the preset period is used to characterize the time interval from the reference line coinciding with the current support fork to the reference line coinciding with the next support fork during the rotation of the rotating shaft; each detection point parameter includes a temperature reference value detected by a temperature measuring device and an optical path angle reference value corresponding to the temperature reference value; generating a preset curve based on multiple detection point parameters; wherein the preset curve is used to characterize the correspondence between the temperature reference value and the optical path angle reference value within a preset period; dividing the preset curve into multiple intervals, and performing data fitting on the detection point parameters of each interval to obtain a first correction coefficient group corresponding to each interval; wherein each interval corresponds to a temperature reference value range and an optical path angle reference value range, respectively; generating a preset correspondence based on the first correction coefficient groups of multiple intervals and the temperature reference value range and the optical path angle reference value range of each interval.

[0090] Specifically, during the process, Fig.10As shown, since the optical path angle changes with the time period, and the period nodes are at the same time point; since the optical path angle corresponds to the rotation position, the reference support fork periodically blocks the temperature measurement optical path, so the period of the optical path angle is consistent with the temperature fluctuation period of the thermometer. For the convenience of explanation, the temperature fluctuation period is characterized by a preset period here. Since the reference support fork periodically blocks the temperature measurement optical path during the rotation of the rotating shaft, such as in the case of 3 support forks, the range of the optical path angle Angle in each temperature measurement interval is 0~120°, that is, the temperature detected by the temperature measurement device has the same change curve in each temperature measurement interval, so the time interval of any temperature measurement interval can be selected as the temperature fluctuation period, that is, during the rotation of the rotating shaft, the time interval from the reference line coinciding with the current support fork to the reference line coinciding with the next support fork is taken as a temperature fluctuation period.

[0091] In order to generate the preset corresponding relationship, the embodiment of the present invention is determined through experiments. Specifically, the following process is included:

[0092] (A1) Acquire multiple detection point parameters within a preset cycle; that is, for each moment in a temperature fluctuation cycle, respectively acquire a temperature reference value through a temperature measuring device and detect a rotational position reference value of a reference support fork through a position detection device, and calculate the optical path angle reference value corresponding to each temperature reference value based on the rotational position reference value and formula (1), and use the temperature reference value and the corresponding optical path angle reference value at each moment as the detection point parameters at that moment, thereby obtaining multiple detection point parameters within the preset cycle.

[0093] (A2) generating a preset curve according to the above-mentioned multiple detection point parameters; wherein the preset curve is used to characterize the corresponding relationship between the temperature reference value and the optical path angle reference value within a preset period; for example, within a preset period, the temperature reference value changes with the optical path angle reference value as shown in the curve Fig.12 As shown, when the reference value of the optical path angle is 0 or 120°, the reference line coincides with the current support fork (i.e., the current reference support fork) and the next support fork (i.e., the next reference support fork), respectively, which will block the temperature measurement optical path, resulting in a smaller temperature measurement reference value detected by the temperature measuring device.

[0094] (A3) dividing the preset curve into a plurality of intervals, and performing data fitting on the detection point parameters of each interval to obtain a first correction coefficient group corresponding to each interval;

[0095] Specifically, in order to facilitate analysis, the preset curve is divided into multiple intervals, such as Fig.12As shown, the preset curve is divided into 5 stages, namely 5 intervals, namely: ① acceleration rising area; ② deceleration rising area; ③ slow rising area; ④ acceleration descending area; ⑤ deceleration descending area; wherein each interval corresponds to a temperature reference value range and an optical path angle reference value range; since the detection point parameters in each interval are known, therefore, for each interval, the corresponding temperature reference value range and optical path angle reference value range can be determined.

[0096] In addition, for each interval, the detection point parameters are selected respectively, and data fitting is performed on the selected detection point parameters. For example, data fitting is performed on the detection point data of each interval through the matlab polyfit function, and multiple coefficients corresponding to the curve of the interval can be obtained, that is, the first correction coefficient group. Here, the first correction coefficient group preferably includes four first correction coefficients a1, a2, a3 and a4, which can be set according to actual conditions.

[0097] (A4) Generate a preset corresponding relationship according to the first correction coefficient group of the plurality of intervals and the temperature reference value range and the optical path angle reference value range of each interval.

[0098] After calculating the first correction coefficient group for each interval, the temperature reference value range, the optical path angle reference value range and the first correction coefficient group for each interval are stored, and a corresponding relationship, that is, a preset corresponding relationship, is set, so that in subsequent applications, the first correction coefficient group corresponding to the optical path angle at each moment can be quickly determined according to the temperature value and the optical path angle at that moment, thereby improving the determination rate of the temperature correction coefficient corresponding to that moment, and further improving the accuracy and efficiency of temperature measurement data processing.

[0099] Preferably, when generating the preset corresponding relationship, the rotation position reference value range of each interval can also be determined according to the temperature reference value range and the optical path angle reference value range of each interval, and the preset corresponding relationship is generated according to the rotation position reference value range of the interval and the first correction coefficient group. At this time, the preset corresponding relationship can be represented in the form of a database. For example, for the case of three supporting forks, the preset corresponding relationship is shown in the following table:

[0100] Table 1

[0101] POS a1 a2 a3 a4 P1：2867～3100 / 2.8604E-01 1.0569E-02 9.5656E-01 P2：3100～3770 / -1.0422E-01 1.4221E-01 9.4543E-01 P3：3770～5250 1.5974E-02 -6.1118E-02 8.0087E-02 9.6402E-01 P4：5250～5850 -1.3433E-01 4.1252E-01 -3.5238E-01 1.0528E+00 P5：5850～6200 / 3.7485E-01 -1.5049E+00 2.4670E+00

[0102] It should be noted that each interval corresponds to a first correction coefficient group (a1~a4). When the rotation position is within the corresponding rotation position reference value range, the first correction coefficient group corresponding to the moment can be quickly determined according to the above preset corresponding relationship, thereby improving the determination rate of the temperature correction coefficient corresponding to the moment, and further improving the accuracy and efficiency of temperature measurement data processing.

[0103] In one embodiment, before the step of calculating the temperature correction coefficient based on the first correction coefficient group and the current rotation position, the method also includes: obtaining a division range corresponding to the current rotation position, and compressing the division range to a preset range to obtain a second correction coefficient group; wherein the second correction coefficient group includes multiple second correction coefficients; converting the current rotation position according to the multiple second correction coefficients, and calculating the temperature correction coefficient based on the first correction coefficient group and the current rotation position after the conversion.

[0104] Specifically, in order to obtain a suitable coefficient in subsequent data processing, after the current rotation position is detected and before the temperature correction coefficient is determined, the embodiment of the present invention also performs a conversion process on the current rotation position. During the conversion process, the division range corresponding to the current rotation position is first compressed to a preset range to obtain a second correction coefficient group; wherein the second correction coefficient group includes a plurality of second correction coefficients, preferably two here, namely aa1 and aa2.

[0105] For example, the second correction coefficient group can be obtained by compressing the data range of the current rotation position pos from 0 to M (i.e., the divided range) to 0 to M2 (i.e., the preset range) and performing a linear transformation; wherein M2 should not be too large or too small, and is generally preferably 0.5 to 5. For example, for the case of three support forks, if M2 = 2, it can be calculated that aa1 = 6.0006E-4, aa2 = -1.7204. It should be noted that the second correction coefficients aa1 and aa2 are both empirical constants, which can be pre-stored in the controller to quickly convert the current rotation position pos, thereby obtaining appropriate coefficients in subsequent data processing.

[0106] After determining the above-mentioned multiple second correction coefficients, the current rotation position is converted according to the multiple second correction coefficients according to the following formula:

[0107] pos2=aa1*pos+aa2 (4)

[0108] Among them, pos2 represents the current rotation position conversion value, that is, the current rotation position after conversion processing, pos represents the current rotation position, and aa1 and aa2 both represent the second correction coefficient.

[0109] At this time, the temperature correction coefficient is calculated according to the following formula based on the first correction coefficient group and the current rotation position after the conversion process:

[0110] kk=a1*pos2 3 +a2*pos2 2 +a3*pos2+a4 (5)

[0111] Here, kk represents a temperature correction coefficient, pos2 represents a current rotation position conversion value, that is, a current rotation position after conversion, and a1 to a4 represent a plurality of first correction coefficients of a first correction coefficient group.

[0112] It should be noted that, for the cases where the first correction coefficient and / or the second correction coefficient are other numbers, reference can be made to the above-mentioned cases of four first correction coefficients and / or two second correction coefficients, and the embodiments of the present invention will not be described in detail here.

[0113] Embodiment 2

[0114] Based on the above temperature detection method, an embodiment of the present invention provides another temperature detection method for detecting the temperature of a heat treatment chamber in a semiconductor device. The method focuses on the process of processing the temperature value collected by the temperature measuring device at any time. Fig.13 As shown, the temperature detection method includes the following steps:

[0115] Step S1302, obtaining a temperature value Tr of the temperature-measured component detected by a temperature measuring device and a rotation position pos of a reference support fork detected by a position detecting device;

[0116] Step S1304, converting the rotation position pos to obtain the converted rotation position, i.e., pos2=aa1*pos+aa2;

[0117] Step S1306, calculate the temperature correction coefficient kk=a1*pos2 3 +a2*pos2 2 +a3*pos2+a4;

[0118] Step S1308, averaging the N historical temperature values ​​before pos and the temperature value Tr corresponding to pos to obtain the average temperature value Tr2 corresponding to pos;

[0119] Step S1310, calculate the temperature output value Tr3 = Tr2 / kk, wherein the temperature output value Tr3 is the temperature detection value corresponding to the pos output by the temperature measuring device.

[0120] It should be noted that the specific process of the above steps and the process of determining the multiple first correction coefficients and the second correction coefficients can refer to the aforementioned embodiment, and the embodiment of the present invention will not be described in detail here.

[0121] Therefore, the above-mentioned temperature detection method is a real-time temperature processing method. By coupling the optical path angle and the rotation position instead of averaging a large amount of data, the processing efficiency of the temperature measurement data can be improved, such as achieving a data processing cycle of less than 0.5s, thereby achieving real-time temperature precision control; at the same time, since a large reason for temperature overshoot is the temperature data update lag caused by the averaging of a large amount of data in the existing solution, the temperature detection method provided in the embodiment of the present invention can also effectively suppress temperature overshoot during the temperature change process, thereby improving the temperature measurement stability of the heat treatment chamber, and then improving the temperature control stability of the heat treatment chamber.

[0122] Embodiment 3

[0123] In order to solve the problem that the existing method performs control from a fixed starting power, resulting in unstable temperature control connection, an embodiment of the present invention provides a heating power control method, which is applied to a heater in a semiconductor device, and the heater is used to heat a heat treatment chamber of the semiconductor device.

[0124] like Fig.14 As shown, the method comprises the following steps:

[0125] Step S1402, obtaining process parameters corresponding to the current process step of the heat treatment chamber; wherein the process parameters include: a set temperature and a target temperature change rate Vt;

[0126] Specifically, before executing a process step, the semiconductor device first obtains a process recipe that is pre-stored or sent by the factory host. In the process recipe, the process parameters of the heat treatment chamber in each process step are pre-set. The process parameters of the current process step include but are not limited to the set temperature and the target temperature change rate Vt; the process parameters of each process step may be the same or different, and can be set according to the actual situation.

[0127] Step S1404, obtaining the temperature value Ti of the heat treatment chamber in the current temperature control cycle;

[0128] In practical applications, for each process step, the heating power control of the heater is a continuous process, rather than adjusting the heating power only once. Therefore, the embodiment of the present invention refers to one heating power adjustment of the heater as a temperature control cycle, so that in each process step, the heating power of the heater is adjusted through multiple cyclic temperature control cycles to improve the problem of unstable temperature control connection, thereby ensuring the temperature control stability of the heat treatment chamber.

[0129] Among them, for each temperature control cycle, the controller obtains the temperature value collected by the temperature measuring device in the heat treatment chamber. In order to facilitate the explanation of the temperature values ​​at different times, Ti is used here to represent the temperature value of the heat treatment chamber in the current temperature control cycle, i represents the current temperature control cycle, and so on. Ti-1 represents the temperature value of the heat treatment chamber in the previous temperature control cycle, and T1 represents the temperature value of the heat treatment chamber in the first temperature control cycle, that is, the temperature value of the heat treatment chamber when the heating power starts to be controlled.

[0130] It should be noted that the temperature value Ti of the above-mentioned heat treatment chamber in the current temperature control cycle can be obtained by an existing temperature detection method, such as detection by a thermometer, and averaging to obtain the temperature value Ti; it can also be obtained by the temperature detection method in the aforementioned embodiment, that is, the temperature detection method in the aforementioned embodiment is used to perform data processing on the temperature value collected by the temperature measuring device, and the temperature detection value finally output by the temperature measuring device is used as the temperature value Ti of the heat treatment chamber in the current temperature control cycle. The specific temperature value Ti of the heat treatment chamber in the current temperature control cycle can be set according to actual conditions, and the embodiment of the present invention does not limit this.

[0131] Step S1406, judging whether the current temperature control cycle meets the preset temperature control requirement according to the set temperature and the temperature value Ti;

[0132] After obtaining the above-mentioned set temperature and the temperature value Ti of the heat treatment chamber in the current temperature control cycle, it is also necessary to determine whether the current temperature control cycle meets the preset temperature control requirements. If the current temperature control cycle meets the preset temperature control requirements, it is determined to end the current process step, and the heat treatment chamber needs to be controlled to enter the next process step. At this time, there is no need to adjust the heating power of the heater; on the contrary, if the current temperature control cycle does not meet the preset temperature control requirements, it is necessary to continue to adjust the heating power of the heater, that is, to adjust the temperature of the heat treatment chamber, until the current temperature control cycle meets the preset temperature control requirements, and the heat treatment chamber is controlled to enter the next process step, thereby not only ensuring the temperature control stability of the heat treatment chamber, but also ensuring the process effect.

[0133] Step S1408: if not, calculate the current initial power Pxfi according to the starting heating power Pst and the target temperature change rate Vt of the heater;

[0134] If the current temperature control cycle does not meet the preset temperature control requirements, the controller needs to adjust the heating power of the heater. At this time, the controller first calculates the current initial power Pxfi based on the starting heating power Pst of the heater and the target temperature change rate Vt, where the starting heating power Pst is the current power of the heater, that is, Pst = P_i, where P_i represents the current frequency of the heater in the current temperature control cycle.

[0135] Among them, the current initial power Pxfi is used to characterize the heating power of the heater in the current temperature control cycle. Therefore, when calculating the current initial power Pxfi of the heater, the present invention associates the current initial power Pxfi with the current power P_i of the heater. Compared with the existing method of starting control from a fixed starting frequency, the problem of unstable temperature control connection is avoided, thereby improving the stability of temperature control.

[0136] Step S1410: According to the target temperature change rate Vt and the historical temperature change rate Vt j Calculate and obtain the current target temperature change rate Vit corresponding to the current temperature control cycle;

[0137] Among them, the historical temperature change rate V j Including multiple temperature change rates corresponding to the previous temperature control cycle from the beginning of the current process step to the current temperature control cycle, j = 1, 2, ... i-1, i represents the current temperature control cycle; the calculation formula of the current target temperature change rate Vit is as follows:

[0138] Vit=t1*Vt-sum(V j ) (6)

[0139] Among them, Vit represents the current target temperature change rate, Vt represents the target temperature change rate, V j represents the historical temperature change rate, j=1, 2, ...i-1, i represents the current temperature control cycle, sum represents the sum calculation, and t1 represents the time constant, which can be pre-stored in the controller.

[0140] Step S1412, obtaining the historical temperature control power, and calculating the temperature control power according to the historical temperature control power, the current target temperature change rate Vit, and the previous temperature change rate V corresponding to the previous temperature control cycle of the current temperature control cycle. i-1 Calculate the current corrected power P i ';

[0141] Among them, the historical temperature control power includes: the temperature control power P corresponding to the temperature control cycle before the current temperature control cycle i ” -1 The temperature control power P corresponding to the two temperature control cycles before the current temperature control cycle i ” -2 ; The temperature change rate and temperature control power of each temperature control cycle before the current temperature control cycle can be stored in the controller for application in subsequent temperature control cycles. Here, the temperature control power P corresponding to the previous temperature control cycle is i ” -1 Refers to the power that the controller finally sent to the heater in the previous temperature control cycle, that is, the actual heating power of the heater in the previous temperature control cycle; similarly, the temperature control power P corresponding to the previous two temperature control cycles i ” -2It refers to the power that the controller finally sends to the heater in the previous two temperature control cycles (i.e. the temperature control cycle before the current temperature control cycle), that is, the actual heating power of the heater in the previous two temperature control cycles.

[0142] Specifically, the current corrected power P i The calculation formula of ' is as follows:

[0143]

[0144] Among them, P i ' represents the current corrected power, P i-1 " indicates the temperature control power corresponding to the temperature control cycle before the current temperature control cycle, P i-2 " indicates the temperature control power corresponding to the first two temperature control cycles of the current temperature control cycle, V i-1 represents the previous temperature change rate, and Vit represents the current target temperature change rate. It should be noted that if the current temperature control period i-2 < 1, then P i-2 "=P1"; if i-1<1, then P i-1 "=P1"; and, if the previous temperature change rate V i-1 is less than the target temperature change rate Vt, it means that V i-1 Reasonable.

[0145] Therefore, according to the above formula (7), the historical temperature control power (such as P i-1 ” and P i-2 ”) and the current target temperature change rate of the current temperature control cycle, and calculate the current corrected power P i ', so as to correct the power P according to the current i 'The current initial power Pxfi is corrected. Since the current initial power Pxfi is the current power of the heater, the automatic connection design of the heating power control is realized, which effectively avoids the problem of unstable heating power and temperature caused by the existing fixed starting power, and improves the stability of heating power control and the temperature control stability of the heat treatment chamber.

[0146] Step S1414: based on the current corrected power P i ', the current target temperature change rate Vit and the target temperature change rate Vt correct the current initial power Pxfi to obtain the corrected current temperature control power P i ”;

[0147] Among them, the current temperature control power P i The calculation formula of ” is as follows:

[0148]

[0149] Among them, P i " indicates the current temperature control power, P i' represents the current corrected power, Vit represents the current target temperature change rate, Vt represents the target temperature change rate, and Pxfi represents the current initial power.

[0150] Therefore, when the heating power is used for control in the process step, the real-time temperature change rate of each temperature control cycle is associated with the power issued, such as the current temperature control power P i " is associated with the current target temperature change rate Vit, achieving the stability of the heating power and improving the degree of matching between the actual temperature change rate and the target temperature change rate. In addition, when the heating power is used for process step switching control, the power sent down is connected with the current power, such as the current temperature control power P i " is associated with the current initial power Pxfi, which effectively avoids the defect of fixed starting power in the existing method and realizes smooth transition of temperature and power, thereby improving the stability of heating power control and temperature control stability of the heat treatment chamber.

[0151] Step S1416, control the heater according to the current temperature control power P i "run.

[0152] Therefore, in the above-mentioned heating power control method, the heating power control is coupled with the real-time temperature change rate in the heating power control, so as to achieve the stability of the heating power and a closer match between the actual temperature change rate and the target temperature change rate; at the same time, the automatic connection design of the heating power control is also realized, which effectively avoids the problems of unstable power and unstable temperature when switching between process steps, thereby improving the stability of the heating power control, and thus improving the temperature control stability of the heat treatment chamber.

[0153] In one embodiment, the step of calculating the current initial power Pxfi based on the starting heating power Pst and the target temperature change rate Vt of the heater includes: first, calculating the corresponding components of the starting heating power Pst and the corresponding components of the target temperature change rate Vt based on linear proportion; then, determining the corresponding multiple calculation coefficients in a preset relationship database according to the corresponding components of the starting heating power Pst and the corresponding components of the target temperature change rate Vt; and calculating the current initial power Pxfi based on the multiple calculation coefficients, the starting heating power Pst and the target temperature change rate Vt.

[0154] The preset relationship database is used to characterize the corresponding relationship between the target temperature change rate Vt, the starting heating power Pst and the initial power Pxf, and the database is shown in Table 2 below:

[0155] Table 2

[0156]

[0157] Therefore, according to the corresponding components of the starting heating power Pst and the corresponding components of the target temperature change rate Vt, the corresponding multiple calculation coefficients can be determined in the above-mentioned preset relationship database, so as to calculate the current initial transmitted power Pxfi according to the multiple calculation coefficients, the starting heating power Pst and the target temperature change rate Vt.

[0158] For ease of understanding, an example is given here. If the starting heating power Pst of the current temperature control cycle is located in the ath row of the above-mentioned preset relationship database, that is, the corresponding component △P of the starting heating power Pst satisfies △P*a≤Pst<△P*(a+1); the target temperature change rate Vt is located in the bth data in the above-mentioned preset relationship database, that is, the corresponding component △V of the target temperature change rate Vt satisfies △V*b≤Vt<△V*(b+1); the current initial power Pxfi can be calculated, that is, Pxfi=P2a_b*(Pst-a*△P) / △P+P2c_b*(-Pst+(a+1)*△P) / △P+e*P2a_d*(Vt-b*△V) / △V+e*P2c_d*(-Vt+(b+1)*△V) / △V. Among them, c=a+1, d=b+1, and e is an empirical constant that can be determined based on experiments.

[0159] Therefore, a, b, c and d are determined in the above preset relational database according to the corresponding components of the starting heating power Pst and the corresponding components of the target temperature change rate Vt, and the specific values ​​of the coefficients P2a_b, P2c_b, P2a_d and P2c_d are determined in the above preset relational database, so as to calculate the current initial power Pxfi. It should be noted that the initial data of the above preset relational database can be generated by P2a_b=a*△P+e*b*△V.

[0160] In one embodiment, after calculating the current initial power Pxfi based on the starting heating power Pst and the target temperature change rate Vt of the heater, the method further includes: if the current temperature control cycle is the first temperature control cycle of the current process step, sending the current initial power Pxfi to the heater so that the heater operates according to the current initial power Pxfi.

[0161] Specifically, if the current temperature control cycle i is the initial temperature control cycle of the current process step, that is, i=1, then after calculating the initial power Pxf1, the controller directly sends the initial power Pxf1 to the heater, so that the heater heats according to the initial power Pxf1. On the contrary, if the current temperature control cycle i is the i-th temperature control cycle of the current process step, and i>1, at this time, after calculating the current initial power Pxfi, the current initial power Pxfi needs to be corrected to achieve the coupling of the power and the real-time temperature change rate, which not only improves the stability of the heating power, but also improves the matching degree between the temperature change rate and the target temperature change rate.

[0162] In one embodiment, before the step of judging whether the current temperature control cycle meets the preset temperature control requirements according to the set temperature and the temperature value Ti, the method further includes: obtaining multiple historical temperature detection values ​​of the heat treatment chamber, and determining the temperature mode corresponding to the heat treatment chamber according to the multiple historical temperature detection values ​​and the temperature value Ti of the current temperature control cycle; wherein the temperature mode includes: a heating mode, a cooling mode and a constant temperature mode; the historical temperature detection values ​​are used to characterize the temperature values ​​of the heat treatment chamber within a preset time period before the current temperature control cycle; based on the temperature mode, the set temperature and the temperature value Ti, judging whether the current temperature control cycle meets the preset temperature control requirements.

[0163] Specifically, in the process, the relationship between the temperature value Ti and the set temperature is different in different temperature change stages, that is, the temperature change mode is different; however, in different temperature change modes, the specific process of judging whether the current temperature control cycle meets the preset temperature control requirements based on the set temperature and the temperature value Ti is also different. Therefore, before judging whether the current temperature control cycle meets the preset temperature control requirements, it is necessary to determine the temperature change mode in the heat treatment chamber.

[0164] In order to determine the temperature change pattern, an embodiment of the present invention determines the temperature pattern corresponding to the heat treatment chamber according to multiple historical temperature detection values ​​and the temperature value Ti of the current temperature control cycle; wherein the above-mentioned historical temperature detection values ​​are the temperature values ​​of the heat treatment chamber collected by the temperature measuring device within a preset time period before the current temperature control cycle. The number of historical temperature detection values ​​here should not be too many, and it is preferred to use multiple (such as 3 to 5) historical temperature detection values ​​within the preset time period before the current temperature control cycle, so as to determine the temperature change trend in the heat treatment chamber, that is, the corresponding temperature pattern, according to the historical temperature detection values ​​and the temperature value Ti.

[0165] Specifically, the process of determining the temperature mode is as follows: ① If multiple historical temperature detection values ​​and temperature value Ti show a trend of gradually increasing over time, the temperature mode corresponding to the heat treatment chamber is determined to be a heating mode; ② If multiple historical temperature detection values ​​and temperature value Ti show a trend of gradually decreasing over time, the temperature mode corresponding to the heat treatment chamber is determined to be a cooling mode; ③ If multiple historical temperature detection values ​​and temperature value Ti show a trend of remaining the same or a change value less than a preset difference threshold over time, the temperature mode corresponding to the heat treatment chamber is determined to be a constant temperature mode. Therefore, based on different temperature modes and set temperatures and temperature values ​​Ti, it is possible to determine whether the current temperature control cycle meets the preset temperature control requirements.

[0166] In one embodiment, the set temperature includes a target temperature Tt and a transfer temperature Te; wherein the transfer temperature Te is used to characterize a temperature value between the target temperature Tt and the temperature value Ti in the current process step; that is, the transfer temperature Te is a temperature value used when the process step includes a temperature change, and the value is generally between the target temperature Tt and a certain production temperature in the process, and is used to terminate the process step in advance to further suppress temperature overshoot. Therefore, in order to facilitate the judgment of whether the current temperature control cycle meets the preset temperature control requirements, the transfer temperature Te in the embodiment of the present invention is a temperature value between the target temperature Tt and the temperature value Ti. It should be noted that the transfer temperature Te corresponding to each process step may be the same or different, and can be set according to actual conditions.

[0167] The process of judging whether the current temperature control cycle meets the preset temperature control requirements according to the temperature mode, transfer temperature Te and temperature value Ti is as follows:

[0168] ① When the temperature mode is the heating mode, if the temperature value Ti is not less than the transfer temperature, that is, Ti≥Te, it is determined that the current temperature control cycle meets the preset temperature control requirements. Since the transfer temperature Te in the heating mode is less than the target temperature Tt, at this time, although the temperature value Ti may not reach the target temperature Tt, it has reached the set transfer temperature Te, and it is determined that the current temperature control cycle meets the preset temperature control requirements, thereby terminating the current process step in advance to further suppress temperature overshoot; on the contrary, if the temperature value Ti is less than the transfer temperature, that is, Ti<Te, it is determined that the current temperature control cycle does not meet the preset temperature control requirements, and the current process step continues to be executed, and the heating power of the heater continues to be adjusted until the current temperature control cycle meets the preset temperature control requirements.

[0169] ② When the temperature mode is the cooling mode, if the temperature value Ti is not greater than the transfer temperature, that is, Ti≤Te, it is determined that the current temperature control cycle meets the preset temperature control requirements. Since the transfer temperature Te>target temperature Tt in the cooling mode, at this time, although the temperature value Ti may not be reduced to the target temperature Tt, it has been reduced to the set transfer temperature Te, and it is determined that the current temperature control cycle meets the preset temperature control requirements, thereby terminating the current process step in advance to further suppress temperature overshoot; on the contrary, if the temperature value Ti is greater than the transfer temperature, that is, Ti>Te, it is determined that the current temperature control cycle does not meet the preset temperature control requirements, and the current process step continues to be executed, and the heating power of the heater continues to be adjusted until the current temperature control cycle meets the preset temperature control requirements.

[0170] It should be noted that, for the judgment process of the above-mentioned heating mode or cooling mode, if the transfer temperature Te is set unreasonably and is not between the target temperature Tt and the temperature value Ti, if the transfer temperature Te is greater than the target temperature Tt, then for the heating mode, if the temperature value Ti is not less than the target temperature Tt, that is, Ti≥Tt, then it is determined that the current temperature control cycle meets the preset temperature control requirements; or, if the transfer temperature Te is less than the target temperature Tt, then for the cooling mode, if the temperature value Ti is not greater than the target temperature Tt, that is, Ti≤Tt, then it is determined that the current temperature control cycle meets the preset temperature control requirements, that is, at this time, whether the current temperature control cycle meets the preset temperature control requirements is determined according to the temperature mode, target temperature Tt and temperature value Ti, thereby ensuring the judgment accuracy and thus improving the control accuracy of the heating power.

[0171] ③ If the temperature mode is the constant temperature mode, obtain the running time of the current process step; if the running time does not reach the preset time, continue to control the heat treatment chamber according to the current process step until the running time reaches the preset time.

[0172] Specifically, for the constant temperature mode, it is impossible to determine whether the current process step is completed based on the set temperature and the temperature value Ti. At this time, the end of the process step is generally controlled by the process duration. Therefore, the controller obtains the running time of the current process step from the start of the operation to the current temperature control cycle, and determines whether the current temperature control cycle meets the preset temperature control requirements based on the running time and the preset time; that is, when the running time reaches the preset time, it is determined that the current temperature control cycle meets the preset temperature control requirements, the current process step is terminated, and the next process step is executed according to the process recipe; conversely, when the running time is not less than the preset time, it is determined that the current temperature control cycle does not meet the preset temperature control requirements, and the heat treatment chamber continues to be controlled according to the current process step until the running time reaches the preset time.

[0173] In summary, for different temperature modes, different judgment methods are used to determine whether the current temperature control cycle meets the preset temperature control requirements, and when the temperature control requirements are not met, the heating power is adjusted, thereby ensuring the accuracy of heating power control.

[0174] Embodiment 4

[0175] On the basis of the above-mentioned heating power control method, an embodiment of the present invention also provides another heating power control method, which is applied to a heater in a semiconductor device, the heater is used to heat a heat treatment chamber of the semiconductor device, the heat treatment chamber also includes a support part, a temperature measuring device and a position detection device; the support part includes a rotating shaft and N support forks connected to the rotating shaft, the support part is used to support the temperature-measured part through the N support forks, the temperature measuring device is located below the support part, the position detection device is arranged on the rotating shaft, and the temperature measuring device adopts the temperature detection method in the above-mentioned embodiment to detect the temperature value of the heat treatment chamber in each temperature control cycle.

[0176] like Fig.15 As shown, the method comprises the following steps:

[0177] Step S1502, obtaining the target temperature Tt, the target temperature change rate Vt and the transfer temperature Te, and setting i=1; that is, obtaining the process parameters corresponding to the current process step of the heat treatment chamber, where the process parameters include the target temperature Tt, the target temperature change rate Vt and the transfer temperature Te; and, i represents the temperature control cycle, where i=1 means that the heating power of the heater is controlled starting from the current process step, that is, the first temperature control cycle of the current process step;

[0178] Step S1504, obtaining the current thermometer reading T_i, the current power P_i of the heater and the current rotation position pos_i of the reference support fork;

[0179] Step S1506, based on pos_i, T_i is corrected to obtain the current temperature value Ti; the specific correction process can refer to the above-mentioned temperature detection method embodiment, and the embodiment of the present invention will not be described in detail here;

[0180] Step S1508, judging whether the current temperature control cycle meets the temperature control requirements according to Tt, Te and Ti; if yes, executing step S1516, otherwise, executing step S1510;

[0181] Step S1510, calculate the current initial power Pxfi according to the formula Pxf=f(Pst, Vt); wherein Pst=current power P_i, if i=1, then Pxf1 is directly sent to the heater so that the heater operates according to Pxf1; if i>1, execute step S1512;

[0182] Step S1512, calculate the current target temperature change rate Vit and the current corrected power P i ', and according to the current correction power P i ', the current target temperature change rate Vit and the target temperature change rate Vt correct the current initial power Pxfi to obtain the corrected current temperature control power P i ”;

[0183] Step S1514, control the heater according to the current temperature control power P i " Run. And, after the current temperature control cycle ends, set i=i+1 and return to step S1504 until the temperature control cycle meets the preset temperature control requirements.

[0184] Step S1516, ending the current process step.

[0185] In summary, the heating power control method provided in the embodiment of the present invention, on the one hand, introduces the optical path angle and the rotation position to process the temperature measurement data. Compared with the existing data averaging processing method, the stability of the temperature measurement data is improved, and the precise control of the real-time temperature can be realized. At the same time, the temperature overshoot is effectively suppressed, thereby improving the temperature measurement stability of the heat treatment chamber; on the other hand, in the heating power control, when the heating power is used for control within the process step, the real-time temperature change rate of each temperature control cycle is associated with the issued power and controlled, thereby achieving the stability of the heating power and improving the degree of matching between the actual temperature change rate and the target temperature change rate; when the heating power is used for process step switching control, the issued power is connected with the current power, which effectively avoids the defects of the fixed starting power in the existing method and realizes the smooth transition of temperature and power, thereby improving the heating power control stability and the temperature control stability of the heat treatment chamber.

[0186] An embodiment of the present invention further provides a semiconductor device, including a processor and a memory, wherein the memory stores machine executable instructions that can be executed by the processor, and the processor executes the machine executable instructions to implement the above-mentioned temperature detection method and heating power control method.

[0187] See also Fig.16 As shown, the semiconductor device includes a processor 100 and a memory 101 . The memory 101 stores machine executable instructions that can be executed by the processor 100 . The processor 100 executes the machine executable instructions to implement the above-mentioned temperature detection method and heating power control method.

[0188] Further, Fig.16 The semiconductor device shown further includes a bus 102 and a communication interface 103 , and the processor 100 , the communication interface 103 , and the memory 101 are connected via the bus 102 .

[0189] Among them, the memory 101 may include a high-speed random access memory (RAM), and may also include a non-volatile memory (non-volatile memory), such as at least one disk storage. The communication connection between the system network element and at least one other network element is realized through at least one communication interface 103 (which can be wired or wireless), and the Internet, wide area network, local area network, metropolitan area network, etc. can be used. The bus 102 can be an ISA (Industrial Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus or an EISA (Enhanced Industry Standard Architecture) bus, etc. The above-mentioned bus can be divided into an address bus, a data bus, a control bus, etc. For ease of representation, Fig.16 Only one bidirectional arrow is used in the diagram, but this does not mean that there is only one bus or only one type of bus.

[0190] The processor 100 may be an integrated circuit chip with signal processing capabilities. In the implementation process, each step of the above method can be completed by the hardware integrated logic circuit or software instructions in the processor 100. The above processor 100 can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), etc.; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA) or other programmable logic devices, discrete gates or transistor logic devices, discrete hardware components. The methods, steps and logic block diagrams disclosed in the embodiments of the present invention can be implemented or executed. The general-purpose processor can be a microprocessor or the processor can also be any conventional processor, etc. The steps of the method disclosed in conjunction with the embodiments of the present invention can be directly embodied as a hardware decoding processor for execution, or a combination of hardware and software modules in the decoding processor for execution. The software module may be located in a storage medium mature in the art, such as a random access memory, a flash memory, a read-only memory, a programmable read-only memory, or an electrically erasable programmable memory, a register, etc. The storage medium is located in the memory 101, and the processor 100 reads the information in the memory 101 and completes the steps of the method of the above embodiment in combination with its hardware.

[0191] This embodiment also provides a machine-readable storage medium, which stores machine-executable instructions. When the machine-executable instructions are called and executed by a processor, the machine-executable instructions prompt the processor to implement the above-mentioned temperature detection method and heating power control method.

[0192] The temperature detection method, heating power control method and computer program product of semiconductor device provided in the embodiments of the present invention include a computer-readable storage medium storing program code. The instructions included in the program code can be used to execute the methods described in the previous method embodiments. The specific implementation can be found in the method embodiments, which will not be repeated here.

[0193] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working process of the system and device described above can refer to the corresponding process in the aforementioned method embodiment, and will not be repeated here.

[0194] In addition, in the description of the embodiments of the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0195] If the functions are implemented in the form of software functional units and sold or used as independent products, they can be stored in a non-volatile computer-readable storage medium that is executable by a processor. Based on this understanding, the technical solution of the present invention, or the part that contributes to the prior art, or the part of the technical solution, can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for enabling a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the methods described in each embodiment of the present invention. The aforementioned storage medium includes: various media that can store program codes, such as a USB flash drive, a mobile hard disk, a read-only memory (ROM), a random access memory (RAM), a magnetic disk or an optical disk.

[0196] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicating the orientation or positional relationship, are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present invention. In addition, the terms "first", "second", and "third" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance.

[0197] Finally, it should be noted that the above-described embodiments are only specific implementations of the present invention, which are used to illustrate the technical solutions of the present invention, rather than to limit them. The protection scope of the present invention is not limited thereto. Although the present invention is described in detail with reference to the above-described embodiments, ordinary technicians in the field should understand that any technician familiar with the technical field can still modify the technical solutions recorded in the above-described embodiments within the technical scope disclosed by the present invention, or can easily think of changes, or make equivalent replacements for some of the technical features therein; and these modifications, changes or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. A temperature detection method for detecting the temperature of a heat treatment chamber in a semiconductor device, wherein the heat treatment chamber comprises a support portion, a temperature measuring device and a position detection device, wherein the support portion comprises a rotating shaft and a plurality of support forks connected to the rotating shaft, the support portion is used to support a temperature-measured component through the plurality of support forks, the temperature measuring device is located below the support portion, and the position detection device is arranged on the rotating shaft; characterized in that: The temperature detection method comprises: Obtaining the current temperature measurement value of the temperature-measured component detected by the temperature measuring device and the current rotation position of the reference support fork detected by the position detection device at the current moment; wherein the reference support fork is used to represent the support fork on one side of the reference line, and the reference line is used to represent the line between the temperature measurement spot and the axis of the rotating shaft; Determine the current optical path angle corresponding to the current moment according to the current rotation position and the number of the support forks; wherein the current optical path angle is used to characterize the angle between the reference support fork and the reference line; Calculate a temperature correction coefficient according to the current optical path angle, the current temperature measurement value, and the current rotation position; Obtaining N historical temperature measurement values ​​detected by the temperature measuring device before the current moment, and calculating a current temperature measurement average value based on the N historical temperature measurement values ​​and the current temperature measurement value; A current temperature measurement correction value is calculated according to the temperature correction coefficient and the current temperature measurement average value, and the current temperature measurement correction value is used as the current temperature detection value output by the temperature measurement device.

2. The method according to claim 1, characterized in that The step of calculating the temperature correction coefficient according to the current optical path angle, the current temperature measurement value and the current rotation position comprises: Determine a first correction coefficient group corresponding to the current optical path angle according to the current optical path angle, the current temperature measurement value and a preset corresponding relationship; wherein the first correction coefficient group includes a plurality of first correction coefficients; and the preset corresponding relationship is used to characterize the corresponding relationship between the optical path angle, the temperature measurement value and the first correction coefficient group; The temperature correction coefficient is calculated according to the first correction coefficient group and the current rotation position.

3. The method according to claim 2, characterized in that The method further comprises: Acquire multiple detection point parameters within a preset period; wherein the preset period is used to characterize the time interval from the reference line coinciding with the current support fork to the reference line coinciding with the next support fork during the rotation of the rotating shaft; each detection point parameter includes a temperature reference value detected by the temperature measuring device and an optical path angle reference value corresponding to the temperature reference value; Generate a preset curve according to the plurality of detection point parameters; wherein the preset curve is used to characterize the corresponding relationship between the temperature reference value and the optical path angle reference value within the preset period; The preset curve is divided into a plurality of intervals, and data fitting is performed on the detection point parameters of each interval to obtain a first correction coefficient group corresponding to each interval; wherein each interval corresponds to a temperature reference value range and an optical path angle reference value range; The preset corresponding relationship is generated according to the first correction coefficient groups of the plurality of intervals and the temperature reference value range and the optical path angle reference value range of each interval.

4. The method according to claim 2, characterized in that: Before the step of calculating the temperature correction coefficient according to the first correction coefficient group and the current rotation position, the method further includes: Acquire a division range corresponding to the current rotation position, and compress the division range to a preset range to obtain a second correction coefficient group; wherein the second correction coefficient group includes a plurality of second correction coefficients; The current rotational position is converted according to the plurality of second correction coefficients, and the temperature correction coefficient is calculated according to the first correction coefficient group and the current rotational position after the conversion.

5. The method according to claim 1, characterized in that The step of determining the current optical path angle corresponding to the current moment according to the current rotation position and the number of the support forks comprises: The calculation formula of the current optical path angle is as follows: Wherein, Angle represents the current optical path angle, R0 represents the number of the supporting forks, and R0≥3, pos represents the current rotation position, C0 represents a preset constant, and Fix represents a rounding operation.

6. A heating power control method, characterized in that: A heater used in a semiconductor device, the heater being used to heat a heat treatment chamber of the semiconductor device, the method comprising: Obtaining process parameters corresponding to the current process step of the heat treatment chamber; wherein the process parameters include: a set temperature and a target temperature change rate Vt; Obtaining a temperature value Ti of the heat treatment chamber in a current temperature control cycle; According to the set temperature and the temperature value Ti, judging whether the current temperature control cycle meets the preset temperature control requirement; If not, the current initial power Pxfi is calculated according to the starting heating power Pst of the heater and the target temperature change rate Vt; wherein the current initial power Pxfi is used to characterize the heating power of the heater controlled by the current temperature control cycle; According to the target temperature change rate Vt and the historical temperature change rate V j The current target temperature change rate Vit corresponding to the current temperature control cycle is calculated; wherein the historical temperature change rate V j including a plurality of temperature change rates corresponding to a temperature control cycle from the beginning of the current process step to the previous temperature control cycle of the current temperature control cycle, j=1, 2, ...i-1, i represents the current temperature control cycle; Obtain the historical temperature control power, and calculate the temperature control power according to the historical temperature control power, the current target temperature change rate Vit, and the previous temperature change rate V corresponding to the previous temperature control cycle of the current temperature control cycle. i-1 Calculate the current corrected power P i '; Wherein, the historical temperature control power includes: the temperature control power P" corresponding to the temperature control cycle before the current temperature control cycle i-1 The temperature control power P″ corresponding to the two temperature control cycles before the current temperature control cycle i-2 ; Based on the current modified power P i ', the current target temperature change rate Vit and the target temperature change rate Vt correct the current initial power Pxfi to obtain the corrected current temperature control power P i ”; Control the heater according to the current temperature control power P i "run.

7. The method according to claim 6, characterized in that The step of calculating the current initial power Pxfi according to the starting heating power Pst of the heater and the target temperature change rate Vt comprises: Calculating the corresponding component of the starting heating power Pst and the corresponding component of the target temperature change rate Vt respectively based on a linear ratio; Determine a plurality of corresponding calculation coefficients in a preset relational database according to corresponding components of the starting heating power Pst and corresponding components of the target temperature change rate Vt; wherein the preset relational database is a database for characterizing the corresponding relationship between the target temperature change rate Vt, the starting heating power Pst and the initial power Pxf; The current initial transmitted power Pxfi is calculated based on the multiple calculation coefficients, the starting heating power Pst and the target temperature change rate Vt.

8. The method according to claim 6, characterized in that After the step of calculating the current initial power Pxfi according to the starting heating power Pst of the heater and the target temperature change rate Vt, the method further includes: If the current temperature control cycle is the first temperature control cycle of the current process step, the current initial power Pxfi is sent to the heater so that the heater operates according to the current initial power Pxfi.

9. The method according to claim 6, characterized in that Before the step of judging whether the current temperature control cycle meets the preset temperature control requirement according to the set temperature and the temperature value Ti, the method further includes: Acquire multiple historical temperature detection values ​​of the heat treatment chamber, and determine the temperature mode corresponding to the heat treatment chamber according to the multiple historical temperature detection values ​​and the temperature value Ti of the current temperature control cycle; wherein the temperature mode includes: a temperature rise mode, a temperature drop mode and a constant temperature mode; the historical temperature detection values ​​are used to characterize the temperature value of the heat treatment chamber within a preset time period before the current temperature control cycle; Based on the temperature mode, the set temperature and the temperature value Ti, it is determined whether the current temperature control cycle meets the preset temperature control requirement.

10. The method according to claim 9, characterized in that The set temperature includes a target temperature and a transition temperature; wherein the transition temperature is used to characterize a temperature value between the target temperature and the temperature value Ti in the current process step; The step of judging whether the current temperature control cycle meets the preset temperature control requirement based on the temperature mode, the set temperature and the temperature value Ti comprises: When the temperature mode is the heating mode, if the temperature value Ti is not less than the transfer temperature, it is determined that the current temperature control cycle meets the preset temperature control requirement.

11. The method according to claim 10, characterized in that The step of judging whether the current temperature control cycle meets the preset temperature control requirement based on the temperature mode, the set temperature and the temperature value Ti comprises: When the temperature mode is the cooling mode, if the temperature value Ti is not greater than the transition temperature, it is determined that the current temperature control cycle meets the preset temperature control requirement.

12. The method according to claim 9, characterized in that The step of judging whether the current temperature control cycle meets the preset temperature control requirement based on the temperature mode, the set temperature and the temperature value Ti comprises: If the temperature mode is the constant temperature mode, obtaining the running time of the current process step; If the operation time does not reach the preset time, the heat treatment chamber continues to be controlled according to the current process step until the operation time reaches the preset time.

13. The method according to claim 6, characterized in that The current modified power P i ', the current target temperature change rate Vit and the target temperature change rate Vt correct the current initial power Pxfi to obtain the corrected current temperature control power P i ” steps, including: The current temperature control power P i The calculation formula of ” is as follows: Among them, P i " represents the current temperature control power, P i ' represents the current corrected power, Vit represents the current target temperature change rate, Vt represents the target temperature change rate, and Pxfi represents the current initial power.

14. The method according to claim 6, characterized in that The target temperature change rate Vt and the historical temperature change rate Vt are used to determine the target temperature change rate Vt. j The step of calculating and obtaining the current target temperature change rate Vit corresponding to the current temperature control cycle includes: The calculation formula of the current target temperature change rate Vit is as follows: Vit=t1*Vt-sum(V j ) Wherein, Vit represents the current target temperature change rate, Vt represents the target temperature change rate, V j represents the historical temperature change rate, j=1, 2, ...i-1, i represents the current temperature control cycle, and t1 represents the time constant.

15. The method according to claim 6, characterized in that The temperature control power according to the historical temperature control power, the current target temperature change rate Vit and the temperature change rate V corresponding to the temperature control cycle before the current temperature control cycle i-1 Calculate the current corrected power P i ' steps, including: The current corrected power P i The calculation formula of ' is as follows: Among them, P i ' represents the current corrected power, P i-1 " represents the temperature control power corresponding to the temperature control cycle before the current temperature control cycle, P i-2 " represents the temperature control power corresponding to the first two temperature control cycles of the current temperature control cycle, V i-1 represents the previous temperature change rate, and Vit represents the current target temperature change rate.

16. The method according to claim 6, characterized in that The step of obtaining the temperature value Ti of the heat treatment chamber in the current temperature control cycle includes: The temperature value Ti of the heat treatment chamber in the current temperature control cycle is obtained by the method described in any one of claims 1 to 5.

17. A semiconductor device, characterized in that: The invention comprises a controller, and a heater, a temperature measuring device and a position detecting device arranged in a heat treatment chamber and connected to the controller in communication; wherein the heat treatment chamber further comprises a supporting part, the supporting part comprises a rotating shaft and N supporting forks connected to the rotating shaft, the supporting part is used to support the temperature-measured part through the N supporting forks, the temperature measuring device is located below the supporting part, and the position detecting device is arranged on the rotating shaft; The controller is used to implement the steps of the method described in any one of claims 1 to 16.

18. A computer-readable storage medium, characterized in that: The computer-readable storage medium stores a computer program, and when the computer program is executed by a processor, the steps of the method described in any one of claims 1 to 16 are executed.

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