A display module, a display device and a preparation method of the display module

By increasing the thickness of the bonding layer and adopting a multi-layer bonding adhesive design at the curved part of the curved screen display module, the problem of air bubbles at the curved screen display module is solved, thus improving the display quality and effect.

CN119445985BActive Publication Date: 2025-12-26WUHAN TIANMA MICROELECTRONICS CO LTD SHANGHAI BRANCH
View PDF 3 Cites 0 Cited by

Patent Information

Application Number
CN202411579926.0
Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
Filing Date
2024-11-06
Publication Date
2025-12-26
Estimated Expiration
2044-11-06

AI Technical Summary

Technical Problem

During the fabrication of curved screen display modules, air bubbles are easily generated at the curved edges of the display module, affecting the display effect and quality.

Method used

The thickness of the bonding layer is increased at the curved part of the display module, making it greater than the thickness of the flat part. Multi-layer bonding adhesive and gradient structure design are used to enhance the filling and absorption capacity of the bonding layer.

Benefits of technology

It effectively reduces the formation of bubbles, improves the quality of the display module, and ensures display performance.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN119445985B_ABST
    Figure CN119445985B_ABST
Patent Text Reader

Abstract

The application relates to a display module, a display device and a preparation method of the display module. The display module comprises a display panel, a bonding layer arranged on the light-emitting side of the display panel, and a cover plate arranged on the side of the bonding layer away from the display panel, wherein the cover plate comprises a planar part and a curved part, and the curved part is curved towards the display panel; and the thickness of the bonding layer corresponding to the curved part is greater than the thickness of the bonding layer corresponding to the planar part. Based on the above scheme, the application can effectively improve the air bubbles caused by the existence of the curved part.
Need to check novelty before this filing date? Find Prior Art

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of display panels, in particular to a display module, a display device and a preparation method of the display module. BACKGROUND

[0002] In order to achieve better display effect or haptic effect and other purposes, the existing display device sets the edge of the display module as a curved structure, which is generally called a curved screen.

[0003] Taking a conventional rectangular display device as an example, in the prior art, the curved screen is generally divided into a double-curved screen and a four-curved screen. The double-curved screen is a display device with curved structures on the left and right edges of the display module, and the four-curved screen is a display device with curved structures on all four edges. Among them, the left and right sides are the two edges adjacent to the edge where the binding area is located.

[0004] Although the above-mentioned curved screen has certain advantages in use, it is found that in the process of preparing the display module of this type of curved screen, because the edge of the display module is curved, the cover plate of the display module extrudes the bonding layer at the curved position, which is easy to produce bubbles, affecting the display effect of the display module, and the display module may have quality problems. SUMMARY

[0005] In order to solve the above technical problems, the present application provides a display module, a display device and a preparation method of the display module.

[0006] In a first aspect, the present application provides a display module, comprising:

[0007] a display panel;

[0008] a bonding layer arranged on the light-emitting side of the display panel;

[0009] a cover plate arranged on the side of the bonding layer away from the display panel, the cover plate comprising a planar portion and a curved portion, the curved portion being curved towards the display panel;

[0010] wherein the thickness of the bonding layer corresponding to the curved portion is greater than the thickness of the bonding layer corresponding to the planar portion.

[0011] In a second aspect, based on the same inventive concept, the present application further provides a display device comprising the display module of the first aspect.

[0012] In a third aspect, based on the same inventive concept, the present application further provides a preparation method of a display module, the method being used for preparing the display module of the first aspect; the method comprising:

[0013] providing the display panel and the cover plate;

[0014] The light-emitting side of the display panel is attached to the cover plate by using the attachment layer.

[0015] The cover plate comprises a planar portion and a curved portion, and the curved portion is curved towards the display panel; the thickness of the attachment layer corresponding to the curved portion is greater than the thickness of the attachment layer corresponding to the planar portion.

[0016] Compared with the prior art, the technical scheme provided by the present application has the following advantages:

[0017] The present application provides a display module, a display device and a preparation method of the display module. The display module comprises: a display panel; an attachment layer arranged on the light-emitting side of the display panel; and a cover plate arranged on the side of the attachment layer away from the display panel, wherein the cover plate comprises a planar portion and a curved portion, and the curved portion is curved towards the display panel; and the thickness of the attachment layer corresponding to the curved portion is greater than the thickness of the attachment layer corresponding to the planar portion. In the above scheme, compared with the position corresponding to the planar portion, the thickness of the attachment layer at the position corresponding to the curved portion is actually increased. On the one hand, because the thickness of the attachment layer at the position corresponding to the curved portion is greater, even if the cover plate causes extrusion to the attachment layer, the attachment layer cannot be too thin to fill the position corresponding to the curved portion, and the probability of generating bubbles is smaller. On the other hand, because the thickness of the attachment layer at the position corresponding to the curved portion is greater, the ability to absorb bubbles is stronger, and even if some bubbles are generated, the bubbles can be effectively absorbed into the interior of the attachment layer and diffused into the intermolecular gap of the attachment layer, and cannot present the form of bubbles. In summary, based on the above scheme, the present application can effectively improve the problem of bubbles existing in the curved portion of the display module and the display device with a curved structure, and improve the quality of the display module and the display device. BRIEF DESCRIPTION OF DRAWINGS

[0018] The accompanying drawings, which are incorporated into and form part of the specification, illustrate embodiments consistent with the present application and, together with the specification, serve to explain the principles of the application.

[0019] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the accompanying drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, for those skilled in the art, other drawings can also be obtained without creative labor based on these drawings.

[0020] Figure 1 A display module structure schematic diagram of related schemes;

[0021] Figure 2 A display module structure schematic diagram provided by the embodiments of the present application;

[0022] Figure 3Fig. 4 (a) is another display module structure schematic diagram provided by an embodiment of the present application;

[0023] Fig. 4 (a) is another display module structure schematic diagram provided by an embodiment of the present application;

[0024] Fig. 4 (a) is another display module structure schematic diagram provided by an embodiment of the present application;

[0025] Figure 5 Fig. 4 (a) is another display module structure schematic diagram provided by an embodiment of the present application;

[0026] Figure 6 Fig. 4 (a) is another display module structure schematic diagram provided by an embodiment of the present application;

[0027] Figure 7 Fig. 4 (a) is another display module structure schematic diagram provided by an embodiment of the present application;

[0028] Figure 8 Fig. 4 (a) is another display module structure schematic diagram provided by an embodiment of the present application;

[0029] Figure 9 Fig. 4 (a) is another display module structure schematic diagram provided by an embodiment of the present application;

[0030] Figure 10 Fig. 4 (a) is another display module structure schematic diagram provided by an embodiment of the present application;

[0031] Figure 11 Fig. 4 (a) is another display module structure schematic diagram provided by an embodiment of the present application;

[0032] Reference signs:

[0033] 100, display panel; 200, adhesion layer; 300, cover plate; 301, curved part; 302, flat part; 000, bubble; 303, corner; 3011, second transition area; 3012, first transition area; 204, first adhesion glue layer; 205, second adhesion glue layer; S1, first area; S2, second area. DETAILED DESCRIPTION

[0034] In order to more clearly understand the above-mentioned purposes, features and advantages of the present application, the solutions of the present application will be further described below. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0035] In the following description, many specific details are set forth in order to provide a thorough understanding of the present application, but the present application can also be implemented in other ways different from those described herein; obviously, the embodiments in the description are only some of the embodiments of the present application, not all the embodiments.

[0036] It is apparent that various modifications and changes can be made to the present application without departing from the spirit thereof, and the scope of equivalents thereof. Accordingly, the present application is intended to cover all modifications and changes as falling within the scope of the claims (technical solutions claimed in the application), and equivalents thereof. It should be noted that the embodiments provided by the present application can be combined with each other without contradiction, if possible.

[0037] Figure 1 A schematic diagram of a display module structure of a related scheme is shown in a cross-sectional view.

[0038] As shown in Figure 1 , the display module can include a display panel 100, a bonding layer 200, and a cover plate 300. The cover plate 300 is arranged on the side of the bonding layer 200 away from the display panel 100, and includes a planar portion 302 and a curved portion 301. The display panel 100 represents a basic structure capable of achieving a display effect, and is formed into a display module after further packaging. The cover plate 300 is a light-transmitting structure arranged on the light-emitting side of the display panel 100, and is generally glass, which can protect the display panel 100. The bonding layer 200 is arranged between the cover plate 300 and the display panel 100, and can fix the cover plate 300 and the display panel 100 to each other. The above description of the display panel 100, the cover plate 300, and the bonding layer 200 is only a brief description of the above structures, and the purpose is only to clarify that the above structures belong to which structure in the existing display module. Other functions of each structure are not directly related to the improvement points of the present application, and are not listed here.

[0039] Before packaging the display panel 100, the display panel 100 is generally a planar structure, and the cover plate 300 includes a planar portion 302 and a curved portion 301. During the packaging process of the display panel 100, the cover plate 300 is fixed to the display panel 100 by a specific packaging device and pressure is applied to the cover plate 300, and the curved portion 301 of the cover plate 300 further applies pressure to the display panel 100, so that the display panel 100 is forced to bend at the position corresponding to the curved portion 301, and finally the packaging of the display panel 100 is completed. The bonding layer 200 is prepared on the light-emitting side of the display panel 100 before the cover plate 300 is fixed to the display panel 100, of course, it can also be prepared on the side of the cover plate 300 facing the display panel 100. During the packaging process, the planar portion 302 is relatively flat in overall structure, so the overall stress is uniform, and the possibility of air bubbles 000 is small; while in the curved portion 301, due to uneven stress, and the display panel 100 also needs to be pressed into a curved shape, so the extrusion of the bonding layer 200 may cause the bonding layer 200 to be unable to fill the position where the curved portion 301 is located, resulting in air bubbles 000, which affects the quality of the display panel 100.

[0040] To solve the above technical problems, the display module, the display device and the preparation method of the display module are provided.

[0041] Figure 2 A display module structure schematic diagram provided by the embodiment of the application comprises:

[0042] The display panel 100.

[0043] The bonding layer 200 is arranged on the light-out side of the display panel 100.

[0044] The cover plate 300 is arranged on the side, away from the display panel 100, of the bonding layer 200. The cover plate 300 comprises a planar part 302 and a curved part 301. The curved part 301 is curved towards the display panel 100.

[0045] The thickness of the bonding layer 200 corresponding to the curved part 301 is greater than the thickness of the bonding layer 200 corresponding to the planar part 302.

[0046] As shown in Figure 2 , Figure 2 A display module structure schematic diagram before packaging (before the cover plate 300 is fixed to the display panel 100) is shown in the figure, which is a cross-sectional view. The meaning of the bonding layer 200 corresponding to the curved part 301 is that, after packaging, the corresponding position of the bonding layer 200 is in contact with the curved part 301 of the cover plate 300. The meaning of the bonding layer 200 corresponding to the planar part 302 is that, after packaging, the corresponding position of the bonding layer 200 is in contact with the planar part 302 of the cover plate 300. The thickness of the bonding layer 200 corresponding to the curved part 301 is shown as H1 in the figure, and the thickness of the bonding layer 200 corresponding to the planar part 302 is shown as H2. In the embodiment of the application, the thickness of the bonding layer 200 at the position corresponding to the curved part 301 is thickened. Even if pressure is applied to the bonding layer 200 during packaging, the thickness of the bonding layer 200 at this position is thick, which can better fill this position and reduce the probability of generating bubbles. On the other hand, because the thickness of the bonding layer 200 at this position is thick, even if a certain bubble is generated, the bubble can be absorbed by the bonding layer 200, so that the bubble diffuses into the bonding layer 200 and cannot maintain the shape of the bubble. Figure 3 Another display module structure schematic diagram provided by the embodiment of the application is shown in the figure, which is a cross-sectional view. As shown in Figure 3 , Figure 3 A display module structure schematic diagram after packaging (after the cover plate 300 is fixed to the display panel 100) is shown in the figure, which is a cross-sectional view. Compared with Figure 1 , the display module provided by the embodiment of the application does not generate bubbles after packaging. Therefore, the embodiment of the application can improve the problem of bubbles in the display module with a curved structure based on the above-mentioned scheme, and improve the quality of the display module.

[0047] FIG. 4(a) is a schematic view of another display module structure according to an embodiment of the present application, and FIG. 4(b) is a schematic view of another display module structure according to an embodiment of the present application. In some embodiments, the flat portion 302 is rectangular, and the curved portion 301 is located at the corners 303 of two adjacent sides and at least one pair of opposite sides of the flat portion 302.

[0048] In the display module with a rectangular structure, the curved portion 301 can be arranged on the opposite sides of the flat portion 302 of the cover plate 300 which also has a rectangular structure, or the curved portion 301 is arranged on all four sides, and there is a possibility of generating bubbles at the positions where the curved portion 301 is arranged. Therefore, the embodiments of the present application can be improved according to different situations. After research, it is found that not only on the side where the curved portion 301 is located, but also at the corners 303 adjacent to the side where the curved portion 301 is located, there is a possibility of generating bubbles due to the same reason, so the embodiments of the present application are also improved.

[0049] FIG. 4(a) and FIG. 4(b) are both top views. As shown in FIG. 4(a), the curved portion 301 is arranged on the opposite sides of the cover plate 300, and correspondingly, the thicker bonding layer can be arranged at the positions of the curved portion 301 and the corners 303 of the opposite sides of the cover plate 300. As shown in FIG. 4(b), the curved portion 301 is arranged on all four sides of the cover plate 300, and correspondingly, the thicker bonding layer can be arranged at the positions of the curved portion 301 and the corners 303 of all four sides of the cover plate 300. In FIG. 4(a) and FIG. 4(b), the thickness of the thicker bonding layer can be H1, and the thickness of the thinner bonding layer can be H2. Based on the above scheme, the embodiments of the present application can effectively eliminate the bubbles generated due to the existence of the curved portion 301.

[0050] In some embodiments, the difference between the thickness of the bonding layer corresponding to the flat portion and the thickness of the bonding layer corresponding to the curved portion is in the range of 25 microns to 100 microns.

[0051] Specifically, it is found through research that the difference between the thickness of the bonding layer corresponding to the flat portion and the thickness of the bonding layer corresponding to the bending portion should not be too high or too low. The size of the difference actually reflects the volume difference of the bonding layer at this position. If the difference is too large, it actually means that the volume of the bonding layer at the position corresponding to the bending portion is too large, which may easily cause overflow on one hand, and on the other hand, may cause a strong step difference between the bending portion and the flat portion, resulting in an indentation of the display panel after encapsulation. If the difference is too small, the bonding layer may not be able to play a good filling role and may not be able to absorb all the air bubbles, and the display module still has the problem of air bubbles after encapsulation. Through actual testing, the difference range is in the interval of 25 microns to 100 microns, which can not only achieve the beneficial effect of better eliminating air bubbles, but also avoid the adverse consequences of overflow and indentation.

[0052] In some embodiments, the difference between the thickness of the bonding layer corresponding to the flat portion and the thickness of the bonding layer corresponding to the bending portion is positively correlated with the curvature of the bending portion.

[0053] Figure 5 Another display module structure diagram provided by the embodiment of the present application is a cross-sectional view. It has been explained in the previous embodiment that during the encapsulation of the display module, the display panel 100 is forced to bend. It is found through research that in this case, the curvature of the display panel 100 after encapsulation is smaller than the curvature of the cover plate 300 at the position corresponding to the bending portion, and the greater the curvature of the bending portion, the greater the difference between the curvature of the bending portion and the curvature of the display panel 100 at the position corresponding to the bending portion after encapsulation, and thus the greater the maximum distance H3 of the internal region formed between them.

[0054] Therefore, the embodiment of the present application can make the difference between the thickness of the bonding layer 200 corresponding to the flat portion 302 and the thickness of the bonding layer 200 corresponding to the bending portion 301 positively correlated with the curvature of the bending portion 301, that is, the greater the curvature of the bending portion 301, the greater the difference, and the larger volume of the bonding layer 200 is used to fill the internal region and absorb the air bubbles generated at this position to avoid the generation of air bubbles, thereby achieving the purpose of improving the quality of the display module.

[0055] Figure 6 Another display module structure diagram provided by the embodiment of the present application is a cross-sectional view. In some embodiments, the bending portion 301 includes a first transition zone 3012 and / or a second transition zone 3011.

[0056] The first transition zone 3012 is connected to the flat portion 302, and the second transition zone 3011 is away from the flat portion 302.

[0057] The thickness of the bonding layer 200 corresponding to the first transition area 3012 gradually increases in the direction away from the planar part 302. The thickness of the bonding layer 200 corresponding to the second transition area 3011 gradually decreases in the direction away from the planar part 302.

[0058] It is found through research that, when there is a certain thickness difference between the bonding layer 200 corresponding to the bending part 301 and the bonding layer 200 corresponding to the planar part 302, and no transition area is arranged between the two, a "step" effect will be generated. The "step" will not disappear after the end of the packaging process. After the end of the packaging, the "step" still exists, and under the action of light, the bonding layer 200 with different thicknesses produces different reflection effects, thereby causing the display module to have a mark, affecting the quality of the display module.

[0059] Therefore, the embodiment of the present application can arrange the first transition area 3012 and / or the second transition area 3011 in the bending part 301, as shown in Figure 6 for the sake of brevity, Figure 6 the embodiment in which both the first transition area 3012 and the second transition area 3011 are arranged is illustrated, and the single scenario is no longer illustrated. In the structure shown in Figure 6 , in fact, the thickness of the bonding layer 200 gradually increases or decreases, rather than forming an obvious step difference, so that the "step" effect will not be generated, and the bonding layer 200 can be smoothly transitioned as a whole after the end of the packaging, eliminating the mark.

[0060] In some embodiments, the bonding layer includes an OCR liquid optical clear resin.

[0061] Specifically, the OCR (Optical Clear Resin) liquid optical clear resin is a transparent material with strong adhesion, which can better adhere to the cover plate, eliminate bubbles, and repair the step difference.

[0062] Moreover, compared with the OCA (Optical Clear Adhesive) optical clear adhesive tape in the traditional scheme, the bonding layer can be prepared by printing and spraying, rather than only by front coating, which can more easily prepare the required shape and reduce the complexity of the process.

[0063] Figure 7 Another display module structure provided by the embodiment of the present application is a cross-sectional view. In some embodiments, the bonding layer 200 corresponding to the bending part 301 includes at least two layers of stacked bonding adhesive layers.

[0064] As shown in Figure 7 , Figure 7In the case of more bonding adhesive layers, it is also easier to make the bonding layer 200 corresponding to the bending part 301 form a pyramid-shaped bonding layer 200 with gradually decreasing width. Figure 7 In the specific embodiment shown in FIG. 6, the bonding layer 200 corresponding to the bending part 301 is formed by three layers of bonding adhesive layers, which are respectively shown as 201, 202 and 203. The layer 201 closest to the display panel 100 is of an overall structure, and thus the width is not shown. The widths of the other two layers 202 and 203 can be respectively W1 and W2, with W2 < W1. Compared with the relatively flat bonding layer 200 without width gradient, the bonding layer 200 naturally has a shape more consistent with the shape of the bending part 301, and can achieve a better filling effect, thereby improving the effect of eliminating bubbles.

[0065] In addition, since the number of layers of the bonding layer 200 can be multiple, it is also easier to make the thickness of the bonding layer 200 corresponding to the bending part 301 be stacked to be larger.

[0066] Furthermore, since the bonding layer 200 with the gradient structure is formed, an effect similar to the gradual change of the thickness of the film layer in the specific embodiment described above can also be achieved, which is beneficial to reducing the occurrence of the imprint.

[0067] Figure 8 Another display module structure provided by the embodiments of the present application is shown in FIG. 7, which is a cross-sectional view. In some embodiments, among the two adjacent bonding adhesive layers, the bonding adhesive layer far from the display panel 100 is located outside the vertical projection of the display panel 100, and the bonding adhesive layer close to the display panel 100 is located within the vertical projection of the display panel 100.

[0068] Specifically, after research, it is found that after making the thickness of the bonding layer 200 at the position corresponding to the bending part 301 larger, the bonding layer 200 may overflow to the outside of the display module during the packaging of the display module, i.e., there is a glue overflow. Moreover, the closer the position of the bonding layer 200 with larger thickness to the edge of the cover plate 300 or the display panel 100, the greater the possibility of glue overflow.

[0069] Therefore, the embodiments of the present application can make the position of the bonding layer 200 with larger thickness be inwardly recessed. As shown in FIG. 8, Figure 8 Figure 8 In the specific embodiment shown in FIG. 8, only two layers of bonding adhesive layers are shown, which are respectively 201 and 202. The vertical projection of 202 falls within the vertical projection of 201, i.e., the bonding layer 200 far from the display panel 100 is located outside the vertical projection of the display panel 100, and the bonding adhesive layer close to the display panel 100 is located within the vertical projection of the display panel 100. Since the bonding layer 200 for absorbing bubbles is far from the edge of the display panel 100, the possibility of glue overflow is lower during the packaging process, i.e., the purpose of reducing the possibility of glue overflow is achieved. ​

[0070] Figure 9 This is a cross-sectional view of another display module structure provided in an embodiment of this application. In some embodiments, the bonding layer 200 includes a first bonding adhesive layer 204, and the bent portion 301 further includes a second bonding adhesive layer 205 located on the side of the first bonding adhesive layer 204 opposite to the display panel 100.

[0071] like Figure 9 As shown, the bonding layer 200 is not only provided in the curved portion 301, but also in the flat portion 302. If the complete bonding layer 200 is prepared by only one layer of adhesive, the difference in thickness of the bonding layer 200 at different locations will increase the difficulty or complexity of the preparation process.

[0072] When the bonding layer 200 corresponding to the curved portion 301 uses at least two layers of laminated adhesive, the layer facing the display panel 100 can be prepared in the same process as the adhesive layer of the flat portion 302. In the second process, only the adhesive layer on the side away from the display panel 100 needs to be prepared, which not only reduces the difficulty of the process but also reduces the complexity of the preparation process. That is, in the first process, an adhesive layer covering the entire structure is prepared, and in the second process, a second adhesive layer is prepared only at the position corresponding to the curved portion 301, forming a bonding layer 200 with a greater thickness at the position corresponding to the curved portion 301.

[0073] In some embodiments, the first adhesive layer includes OCA optical adhesive and the second adhesive layer includes OCR liquid optical transparent adhesive.

[0074] Specifically, OCA can be prepared using a whole-surface method, which is less difficult to prepare, less complex in terms of process, less cumbersome in terms of preparation, and lower in preparation cost. Therefore, the first bonding adhesive layer can be made of OCA optical adhesive.

[0075] For the second adhesive layer, since it is only applied at the locations corresponding to the bends and not in the areas corresponding to the flat surfaces, if OCA is used, it may be necessary to prepare the entire surface and then remove the second adhesive layer from the flat areas, which is a cumbersome process. OCR, on the other hand, has higher fluidity and can be prepared by spraying and printing to produce the second adhesive layer, which can more accurately produce the shape of the second adhesive layer.

[0076] It should be noted that the above Figure 9In the embodiment, the bonding layer 200 corresponding to the bending part 301 is only exemplarily shown as being prepared by two adhesive layers. In the case that the number of adhesive layers of the bonding layer 200 corresponding to the bending part 301 is more, for example, the second bonding adhesive layer 205 is further provided with a third bonding adhesive layer, a fourth bonding adhesive layer, and the like away from the side of the display panel 100, the third bonding adhesive layer, the fourth bonding adhesive layer, and the like can also adopt the OCR.

[0077] By using the two different types of bonding layers in combination, the cost can be effectively reduced, the process complexity can be reduced, and the shape of the bonding layer of the bending part can be accurately prepared, achieving multiple purposes at once.

[0078] Figure 10 A display device structure diagram is provided in the embodiment of the present application, and the display device includes the display module of any one of the display module embodiments.

[0079] The display device provided in the embodiment of the present application includes the display module in the above embodiments, and thus the same or at least similar technical effects as the display module embodiments can be achieved, which will not be described herein again.

[0080] The embodiment of the present application further provides a preparation method of a display module, and the method is used for preparing the display module of any one of the display module embodiments. The method includes the following steps.

[0081] The display panel and the cover plate are provided.

[0082] The light-emitting side of the display panel is bonded to the cover plate by using the bonding layer.

[0083] The cover plate includes a planar part and a bending part, and the bending part is bent towards the display panel. The thickness of the bonding layer corresponding to the bending part is greater than the thickness of the bonding layer corresponding to the planar part.

[0084] Specifically, although the bonding layer is exemplarily prepared on the display panel in the above display module embodiments, it can be understood that the function of the bonding layer in the embodiments of the present application is to fix the display panel and the cover plate, and the thickness of the bonding layer corresponding to the bending part can be greater than the thickness of the bonding layer corresponding to the planar part to achieve the effect of eliminating bubbles. Therefore, the bonding layer in the embodiments of the present application can be actually arranged on the display panel or the cover plate. As long as the thickness of the bonding layer corresponding to the bending part is greater than the thickness of the bonding layer corresponding to the planar part, the volume of the bonding layer corresponding to the bending part is actually increased, which can achieve better filling effect and the effect of absorbing bubbles, and finally achieve the purpose of eliminating bubbles.

[0085] In some embodiments, the light-emitting side of the display panel is bonded to the cover plate by using the bonding layer, including:

[0086] An adhesive layer is formed on the light-emitting side of the display panel. The edge of the adhesive layer is located within the area surrounded by the edge of the display panel. The adhesive layer includes a first region and a second region, with the thickness of the first region being greater than the thickness of the second region.

[0087] The cover plate is bonded to the adhesive layer. The cover plate includes a flat portion and a curved portion, with the curved portion bent towards the display panel. The flat portion corresponds to the second area, and the curved portion corresponds to the first area.

[0088] Figure 11 This is a schematic diagram of the structural changes during the packaging process of a display module, provided as an embodiment of this application. It is a cross-sectional view. Figure 11 As shown in (a), an adhesive layer 200 can be formed on a planar display panel 100. The adhesive layer 200 includes a first region S1 and a second region S2. The first region S1 corresponds to the curved portion 301. After encapsulation, in a direction perpendicular to the plane of the planar portion 302 of the cover plate 300, the vertical projection of the first region S1 falls within the vertical projection range of the curved portion 301 (including overlap). The second region S2 corresponds to the planar portion 302. After encapsulation, in a direction perpendicular to the plane of the planar portion 302 of the cover plate 300, the vertical projection of the second region S2 falls within the vertical projection range of the planar portion 302 (including overlap). Thus, the thickness of the adhesive layer 200 corresponding to the curved portion 301 is greater than the thickness of the adhesive layer 200 corresponding to the planar portion 302. The scheme for forming different thicknesses in the first region S1 and the second region S2 can refer to the corresponding part in the above-mentioned display module embodiment, and will not be repeated here. The thickness of the first region S1 can be H1, and the thickness of the second region S2 can be H2, where H1 > H2.

[0089] like Figure 11 As shown in (b), after forming a cover plate 300 including a first region S1 and a second region S2 on the display panel 100, the cover plate 300 can be bonded to the side of the bonding layer 200 away from the display panel 100 using a specific encapsulation device, and pressure is applied to the cover plate 300. Under the action of the encapsulation device, the cover plate 300 squeezes the bonding layer 200, thereby squeezing the display panel 100. The bonding layer 200 in the first region S1 fills the internal area between the cover plate 300 and the display panel 100 (i.e., the location corresponding to the curved portion 301) under pressure. Although the internal force is uneven due to the different curvatures of the cover plate 300 and the display panel 100, the bonding layer 200 at this location is thicker, i.e., has a larger volume, thus effectively filling the internal area between the cover plate 300 and the display panel 100. In addition, even if bubbles are generated, the thicker adhesive layer 200 can absorb the bubbles (i.e., air) into the interior of the adhesive layer 200, preventing them from forming bubbles and thus eliminating the bubbles.

[0090] It has to be noted that, in the present document, relational terms are intended only to convey a possible relationship between elements or

[0091] The above description is merely that of a specific implementation to enable a person skilled in the art to understand or implement the application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments described herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A display module, characterized by The display module comprises: a display panel; a bonding layer arranged on the light-emitting side of the display panel; a cover plate arranged on the side of the bonding layer away from the display panel, the cover plate comprising a planar portion and a curved portion, the curved portion being curved towards the display panel; the bonding layer corresponding to the curved portion comprises at least two layers of laminated bonding adhesive layers, among the two adjacent bonding adhesive layers, the bonding adhesive layer away from the display panel is located in the vertical projection of the display panel of the bonding adhesive layer close to the display panel; wherein the thickness of the bonding layer corresponding to the curved portion is greater than the thickness of the bonding layer corresponding to the planar portion; the bonding layer comprises a first bonding adhesive layer, the curved portion further comprises a second bonding adhesive layer on the side of the first bonding adhesive layer away from the display panel, the first bonding adhesive layer comprises OCA optical adhesive, and the second bonding adhesive layer comprises OCR liquid optical transparent adhesive.

2. The display module of claim 1, wherein, The planar portion is rectangular, and the curved portion is located at the corners of the two adjacent sides and at least one pair of opposite sides of the planar portion.

3. The display module of claim 1, wherein, The difference between the thickness of the bonding layer corresponding to the planar portion and the thickness of the bonding layer corresponding to the curved portion ranges from 25 microns to 100 microns.

4. The display module of claim 1, wherein, The difference between the thickness of the bonding layer corresponding to the planar portion and the thickness of the bonding layer corresponding to the curved portion is positively correlated with the curvature of the curved portion.

5. The display module of claim 1, wherein, The curved portion comprises a first transition zone and / or a second transition zone; The first transition zone is connected to the planar portion, and the second transition zone is away from the planar portion; The thickness of the bonding layer corresponding to the first transition zone gradually increases in the direction away from the planar portion; the thickness of the bonding layer corresponding to the second transition zone gradually decreases in the direction away from the planar portion.

6. The display module of claim 5, wherein, The bonding layer comprises OCR liquid optical transparent adhesive.

7. A display device, characterized by comprising: The display module as claimed in any one of claims 1-6.

8. A method for manufacturing a display module, characterized by, The method for preparing the display module as claimed in any one of claims 1-6; the method comprises: providing the display panel and the cover plate; forming a bonding layer on the light-emitting side of the display panel; wherein the edge of the bonding layer is located within the edge surrounding range of the display panel, the bonding layer comprises a first area and a second area, and the thickness of the first area is greater than the thickness of the second area; bonding the cover plate and the bonding layer; wherein the cover plate comprises a planar portion and a curved portion, the curved portion is curved towards the display panel; the planar portion corresponds to the second area, and the curved portion corresponds to the first area; The cover plate comprises a planar portion and a curved portion, the curved portion is curved towards the display panel; the thickness of the bonding layer corresponding to the curved portion is greater than the thickness of the bonding layer corresponding to the planar portion; the bonding layer corresponding to the curved portion comprises at least two layers of laminated bonding adhesive layers, in the two adjacent bonding adhesive layers, the bonding adhesive layer far from the display panel is located in the vertical projection of the display panel, and the bonding adhesive layer close to the display panel is located in the vertical projection of the display panel; the bonding layer comprises a first bonding adhesive layer, the curved portion further comprises a second bonding adhesive layer located on the side of the first bonding adhesive layer away from the display panel, the first bonding adhesive layer comprises OCA optical adhesive, and the second bonding adhesive layer comprises OCR liquid optical transparent adhesive.

Citation Information

Patent Citations

  • Display device

    CN114495719A

  • Display module, display module preparation method and electronic equipment

    CN114613288A

  • Display module, manufacturing method thereof and display device

    CN115244600A