A pedestal temperature control system, control method, and semiconductor processing apparatus

Abstract

The application discloses a pedestal temperature control system, a control method and a semiconductor processing device. The control method comprises the following steps: delivering first cooling liquid with a first process temperature to a cooling channel through a first cooling circulation loop to regulate the temperature of a wafer, adjusting the temperature of second cooling liquid to a second process temperature, and making the second cooling liquid flow in a second self-circulation loop without passing through the cooling channel; delivering second cooling liquid with a second process temperature to the cooling channel through a second cooling circulation loop to regulate the temperature of the wafer, adjusting the temperature of the first cooling liquid to a third process temperature, and making the first cooling liquid flow in a first self-circulation loop without passing through the cooling channel. The first cooling liquid with different temperatures and the second cooling liquid with different temperatures are alternately delivered to the cooling channel, so that the temperature of the wafer is cascadedly changed among at least three different temperatures, thereby meeting the temperature change requirement of the wafer.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and in particular to a base temperature control system, control method, and semiconductor processing equipment. Background Technology

[0002] In semiconductor fabrication processes (including etching and deposition processes), a substrate is typically supported and fixed by a pedestal and an electrostatic chuck placed above it to prevent movement or misalignment during the process. The pedestal usually contains a heater and cooling channels to regulate the substrate temperature (including heating and cooling) to meet the temperature requirements of each process. The principle of cooling the substrate is as follows: an external chiller introduces refrigerant into the cooling channels of the electrostatic chuck, controlling the chuck's temperature through heat exchange. The chuck then conducts heat to the substrate through physical contact and helium gas, thereby achieving temperature control.

[0003] To address the substrate temperature variation requirements, the industry typically sets up two cooling channels, one for high temperature and one for low temperature, and uses a switching device to change the temperature of the coolant flowing into the substrate. This method is relatively simple and can directly switch the substrate temperature of the electrostatic chuck to a preset temperature, but it is limited to only two preset temperature settings.

[0004] However, with the continuous improvement of etching depth and efficiency, the existing substrate temperature control method is gradually unable to meet the needs of process advancement. For example, for different etching depths, it is necessary to change the substrate temperature in a timely manner to match the binding and desorption rates of the etched material and reaction by-products with the substrate at different depths, so as to achieve precise control of key etching parameters such as dimensions at different depths. For another example, for films to be etched made of different materials, the optimal process temperature is different at different etching stages because the materials themselves are not as sensitive to temperature.

[0005] To address these complex temperature variations, the mainstream temperature control method involves using a separate mixing tank to premix the liquids from the high and low temperature refrigerant channels to the target temperature before flowing into the electrostatic chuck's base. While this method theoretically allows for stepless temperature changes within the refrigerator's extreme temperature range, the equipment is expensive, the mixing control is highly complex, and the time required to reach the target temperature is relatively long, resulting in increased ineffective process time and impacting substrate fabrication efficiency. Therefore, it is necessary to adjust the substrate temperature control method. Summary of the Invention

[0006] The purpose of this invention is to provide a substrate temperature control system, control method, and semiconductor processing equipment, which can alternately deliver a first coolant with different temperatures and a second coolant with different temperatures to the cooling channel, so that the temperature of the substrate can be cascaded between at least three different temperatures, thereby meeting the temperature variation requirements of the substrate in the process.

[0007] To achieve the above objectives, the present invention is implemented through the following technical solution:

[0008] A control method for a base temperature control system, the base temperature control system comprising a base disposed within a reaction chamber and a cooling channel disposed within the base, the cooling channel being used to control the temperature of a substrate supported on the base; the base temperature control system comprising: a first refrigeration device and a first cooling circulation loop for supplying a first coolant to the cooling channel and circulating the first coolant; a second refrigeration device and a second cooling circulation loop for supplying a second coolant to the cooling channel and circulating the second coolant; the base temperature control system further comprising a controller for executing the control method, the control method comprising:

[0009] Step S1: Obtain the process temperature required to process the substrate, and the process temperature includes a first process temperature, a second process temperature and a third process temperature;

[0010] Step S2: The first coolant with the first process temperature is delivered to the cooling channel through the first cooling circulation loop so that the first coolant with the first process temperature regulates the temperature of the substrate; at the same time, the temperature of the second coolant is adjusted to the second process temperature and the second coolant flows in the corresponding second self-circulation loop.

[0011] Step S3: The second coolant with the second process temperature is delivered to the cooling channel through the second cooling circulation loop, so that the second coolant with the second process temperature regulates the temperature of the substrate; at the same time, the temperature of the first coolant is adjusted to the third process temperature, and the first coolant flows in the corresponding first self-circulation loop;

[0012] The first process temperature, the second process temperature, and the third process temperature are all different from each other; neither the first self-circulating loop nor the second self-circulating loop is connected to the cooling channel.

[0013] Optionally, the control method further includes:

[0014] Step S4: The first coolant with the third process temperature is delivered to the cooling channel through the first cooling circulation loop to regulate the temperature of the substrate.

[0015] Optionally, the process temperature further includes a fourth process temperature, a fifth process temperature, ..., an Nth process temperature, where N is an integer and N≥4; the control method further includes:

[0016] Step S5: The first coolant with the i-th process temperature is transported to the cooling channel through the first cooling circulation loop to regulate the temperature of the substrate; at the same time, it is determined whether the preset conditions are met. If not, the temperature of the second coolant is adjusted to the (i+1)-th process temperature, and the second coolant is made to flow in the second self-circulation loop.

[0017] Step S6: The second coolant with the i+1th process temperature is transported to the cooling channel through the second cooling circulation loop to regulate the temperature of the substrate; at the same time, it is determined whether the preset condition is met. If not, the temperature of the first coolant is adjusted to the i+2th process temperature, and the first coolant is made to flow in the first self-circulation loop.

[0018] Steps S5 to S6 are executed repeatedly until the preset condition is met; and the preset condition is that the temperature of the substrate is adjusted to the Nth process temperature; i is an integer, 3≤i≤N-1.

[0019] Based on the same inventive concept, the present invention also provides a base temperature control system for executing the control method described above; the base temperature control system includes:

[0020] A cooling channel, located inside the base, is used to regulate the temperature of the substrate supported on the base.

[0021] A first refrigeration device is used to transport and circulate a first coolant; and the cooling channel is connected to the first refrigeration device through a first inlet pipe and a first outlet pipe to form a first cooling circulation loop.

[0022] The second refrigeration device is used to transport and circulate the second coolant; and the cooling channel is connected to the second refrigeration device through the second inlet pipe and the second outlet pipe to form a second cooling circulation loop; the second cooling circulation loop is not simultaneously connected to the first cooling circulation loop.

[0023] The first self-circulating loop shares the first refrigeration device with the first cooling loop; and the first self-circulating loop is not connected to the cooling channel.

[0024] The second self-circulating loop shares the second refrigeration device with the second cooling loop; and the second self-circulating loop is not connected to the cooling channel.

[0025] Optionally, the base temperature control system further includes:

[0026] The first branch pipe is connected to the first liquid inlet pipe and the first liquid outlet pipe respectively; and the first branch pipe, the first refrigeration device, and the first liquid inlet pipe and the first liquid outlet pipe located between them form the first self-circulating loop.

[0027] The second branch pipe is connected to the second inlet pipe and the second outlet pipe respectively; and the second branch pipe, the second refrigeration device, and the second inlet pipe and the second outlet pipe located between them form the second self-circulating loop.

[0028] Optionally, the first self-circulating loop and the first cooling loop are not simultaneously activated;

[0029] The second self-circulating loop and the second cooling loop are not simultaneously connected.

[0030] Optionally, the base temperature control system further includes: a first control valve that enables only one of the first cooling circulation loop and the second cooling circulation loop to be activated.

[0031] Optionally, the base temperature control system further includes a second control valve that enables only one of the first cooling circulation loop and the first self-circulating loop to be activated.

[0032] Optionally, the base temperature control system further includes a third control valve for activating only one of the second cooling circulation loop and the second self-circulation loop.

[0033] Optionally, when the first cooling circulation loop is activated, the first coolant regulates the temperature of the substrate; when the first self-circulation loop is activated, the first coolant flows in the first self-circulation loop and the temperature of the first coolant is adjustable.

[0034] When the second cooling circulation loop is activated, the second coolant regulates the temperature of the substrate; when the second self-circulation loop is activated, the second coolant flows in the second self-circulation loop and the temperature of the second coolant is adjustable.

[0035] Optionally, the temperature adjustment range of both the first coolant and the second coolant is -100℃ to 100℃.

[0036] Optionally, the temperature adjustment range of the first coolant is -100℃ to 30℃; the temperature adjustment range of the second coolant is 20℃ to 100℃.

[0037] Optionally, the first refrigeration device and the second refrigeration device are located in the same refrigeration unit.

[0038] Based on the same inventive concept, the present invention also provides a semiconductor processing device, including: a reaction chamber; and a base temperature control system as described above.

[0039] Based on the same inventive concept, the present invention also provides a computer-readable storage medium storing a computer-readable program for guiding the operation of the base temperature control system described above. The base temperature control system includes a controller for reading the program stored in the computer-readable storage medium to execute the following control method, the control method including:

[0040] Step S1: Obtain the process temperature required to process the substrate, and the process temperature includes a first process temperature, a second process temperature and a third process temperature;

[0041] Step S2: The first coolant with the first process temperature is delivered to the cooling channel through the first cooling circulation loop so that the first coolant with the first process temperature regulates the temperature of the substrate; at the same time, the temperature of the second coolant is adjusted to the second process temperature and the second coolant flows in the corresponding second self-circulation loop.

[0042] Step S3: The second coolant with the second process temperature is delivered to the cooling channel through the second cooling circulation loop, so that the second coolant with the second process temperature regulates the temperature of the substrate; at the same time, the temperature of the first coolant is adjusted to the third process temperature, and the first coolant flows in the corresponding first self-circulation loop;

[0043] The first process temperature, the second process temperature, and the third process temperature are all different from each other; neither the first self-circulating loop nor the second self-circulating loop is connected to the cooling channel.

[0044] Optionally, the control method further includes: step S4, delivering a first coolant having the third process temperature to the cooling channel through the first cooling circulation loop to regulate the temperature of the substrate.

[0045] Optionally, the process temperature further includes a fourth process temperature, a fifth process temperature, ..., an Nth process temperature, where N is an integer and N≥4. The control method further includes:

[0046] Step S5: The first coolant with the i-th process temperature is transported to the cooling channel through the first cooling circulation loop to regulate the temperature of the substrate; at the same time, it is determined whether the preset conditions are met. If not, the temperature of the second coolant is adjusted to the (i+1)-th process temperature, and the second coolant is made to flow in the second self-circulation loop.

[0047] Step S6: The second coolant with the i+1th process temperature is transported to the cooling channel through the second cooling circulation loop to regulate the temperature of the substrate; at the same time, it is determined whether the preset condition is met. If not, the temperature of the first coolant is adjusted to the i+2th process temperature, and the first coolant is made to flow in the first self-circulation loop.

[0048] Steps S5 to S6 are executed repeatedly until the preset condition is met; and the preset condition is that the temperature of the substrate is adjusted to the Nth process temperature; i is an integer, 3≤i≤N-1.

[0049] Compared with the prior art, the present invention has at least one of the following advantages:

[0050] This invention provides a substrate temperature control system, a control method, and a semiconductor processing apparatus. The controller in the substrate temperature control system executes the control method, which includes: delivering a first coolant with a first process temperature to a cooling channel via a first cooling circulation loop to regulate the substrate temperature; simultaneously circulating the first coolant while adjusting the temperature of a second coolant to a second process temperature, and allowing the second coolant to flow in a second self-circulating loop that does not pass through the cooling channel; delivering the second coolant with the second process temperature to the cooling channel via a second cooling circulation loop to regulate the substrate temperature; simultaneously circulating the second coolant while adjusting the temperature of the first coolant to a third process temperature, and allowing the first coolant to flow in the first self-circulating loop that does not pass through the cooling channel. This invention allows the first and second cooling circulation loops to be alternately activated, alternately delivering first coolant and second coolant with different temperatures to the cooling channel, thereby enabling the substrate temperature to be cascaded between at least three different temperatures, thus meeting the temperature variation requirements of the substrate in the process.

[0051] In this invention, when the first cooling circulation loop is activated and the first coolant is delivered to the cooling channel, the second coolant can flow in the second self-circulating loop, i.e., the second refrigeration device is in standby mode; when the second cooling circulation loop is activated and the second coolant is delivered to the cooling channel, the first coolant can flow in the first self-circulating loop, i.e., the first refrigeration device is in standby mode. This invention can utilize the time when the first refrigeration device is in standby mode to pre-adjust the temperature of the first coolant and the time when the second refrigeration device is in standby mode to pre-adjust the temperature of the second coolant. Based on this cascaded temperature change method, the standby time of one of the refrigeration devices is used to change the next preset target temperature. Compared with the prior art method of substrate temperature control based on premixed liquid, this invention greatly shortens the substrate processing time.

[0052] In this invention, the first self-circulating loop consists of a first refrigeration device and a pipeline connected to the first refrigeration device but not connected to the cooling channel, so that adjusting the temperature of the first coolant flowing in the first self-circulating loop will not affect the temperature control of the substrate by the second coolant.

[0053] In this invention, the second self-circulating loop is composed of a second refrigeration device and a pipeline connected to the second refrigeration device but not connected to the cooling channel, so that adjusting the temperature of the second coolant flowing in the second self-circulating loop will not affect the temperature control of the substrate by the first coolant.

[0054] This invention utilizes low-cost and simple-configuration hardware devices to achieve arbitrary preset temperature requirements under different process steps. The software sends instructions to the cooling device one process step in advance to raise or lower the standby channel temperature to the target temperature. Then, by switching the first cooling cycle loop and the second cooling cycle loop, the substrate temperature can be cascaded between at least three different temperatures. Compared with the existing technology of substrate temperature control based on premixed liquid, it does not require complex piping design and cooling device design. Attached Figure Description

[0055] Figure 1 This is a schematic diagram of a base temperature control system provided in an embodiment of the present invention;

[0056] Figure 2 This is a flowchart of a control method for a base temperature control system provided in an embodiment of the present invention;

[0057] Figure 3 This is a schematic diagram of the structure of a semiconductor processing device provided in an embodiment of the present invention. Detailed Implementation

[0058] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, provides a further detailed explanation of the base temperature control system, control method, and semiconductor processing device proposed in this invention. The advantages and features of this invention will become clearer from the following description. It should be noted that the drawings are in a very simplified form and use non-precise proportions, used only to facilitate and clearly illustrate the embodiments of this invention. Please refer to the drawings to make the objectives, features, and advantages of this invention more apparent and understandable. It should be understood that the structures, proportions, sizes, etc., depicted in the accompanying drawings are only for illustrative purposes to aid those skilled in the art and are not intended to limit the implementation conditions of this invention. Therefore, they have no substantial technical significance. Any modifications to the structure, changes in proportions, or adjustments to the size, without affecting the effects and objectives achieved by this invention, should still fall within the scope of the technical content disclosed in this invention.

[0059] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0060] Combined with appendix Figure 1 As shown, this embodiment provides a base temperature control system, including: a base 101 for supporting a substrate 100; a cooling channel 110 disposed within the base 101 for temperature regulation of the substrate 100; a first refrigeration device 120 for supplying and circulating a first coolant; the cooling channel 110 is connected to the first refrigeration device 120 via a first inlet pipe 121 and a first outlet pipe 122 to form a first cooling circulation loop; a second refrigeration device 130 for supplying and circulating a second coolant; the cooling channel 110 is connected to the second refrigeration device 130 via a second inlet pipe 131 and a second outlet pipe 132 to form a second cooling circulation loop; a first self-circulating loop sharing the first refrigeration device 120 with the first cooling circulation loop; the first self-circulating loop does not pass through the cooling channel 110; and a second self-circulating loop sharing the second refrigeration device 130 with the second cooling circulation loop; the second self-circulating loop does not pass through the cooling channel 110.

[0061] It is understood that the base temperature control system further includes: a first branch pipe 140, which is connected to the first liquid inlet pipe 121 and the first liquid outlet pipe 122 respectively; and the first branch pipe 140, the first refrigeration device 120, and the first liquid inlet pipe 121 and the first liquid outlet pipe 122 located between the first branch pipe 140 and the first refrigeration device 120 form the first self-circulation loop; and a second branch pipe 150, which is connected to the second liquid inlet pipe 131 and the second liquid outlet pipe 132 respectively; and the second branch pipe 150, the second refrigeration device 130, and the second liquid inlet pipe 131 and the second liquid outlet pipe 132 located between the second branch pipe 150 and the second refrigeration device 130 form the second self-circulation loop.

[0062] Specifically, in this embodiment, the first cooling circulation loop is composed of the first refrigeration device 120, the first liquid inlet pipe 121, the cooling channel 110, and the first liquid outlet pipe 122; wherein, the first end of the first liquid inlet pipe 121 is connected to the coolant outlet of the first refrigeration device 120, the second end of the first liquid inlet pipe 121 is connected to the first end of the cooling channel 110, the second end of the cooling channel 110 is connected to the first end of the first liquid outlet pipe 122, and the second end of the first liquid outlet pipe 122 is connected to the coolant inlet of the first refrigeration device 120; and when the first coolant flows in the first cooling circulation loop, the first coolant flows through the cooling channel 110, so that the first coolant can control the temperature of the substrate 100. More specifically, the first self-circulating loop can be composed of the first refrigeration device 120 and pipes (e.g., the first branch pipe 140 and the first inlet pipe 121 and the first outlet pipe 122 located between the first branch pipe 140 and the first refrigeration device 120) that are connected to the coolant outlet and coolant inlet of the first refrigeration device 120 but not connected to the cooling channel 110, so that the first coolant can still flow in the first self-circulating loop, and the first coolant will not flow through the cooling channel 110 when flowing in the first self-circulating loop. Furthermore, the flow of the first coolant in the first self-circulating loop indicates that the first refrigeration device 120 is in a standby state, but the present invention is not limited thereto.

[0063] Similarly, the second cooling circulation loop is composed of the second refrigeration device 130, the second liquid inlet pipe 131, the cooling channel 110, and the second liquid outlet pipe 132; wherein, the first end of the second liquid inlet pipe 131 is connected to the coolant outlet of the second refrigeration device 130, the second end of the second liquid inlet pipe 131 is connected to the first end of the cooling channel 110, the second end of the cooling channel 110 is connected to the first end of the second liquid outlet pipe 132, and the second end of the second liquid outlet pipe 132 is connected to the coolant inlet of the second refrigeration device 130; and when the second coolant flows in the second cooling circulation loop, the second coolant flows through the cooling channel 110, so that the second coolant can control the temperature of the substrate 100. More specifically, the second self-circulating loop can be constructed by the second refrigeration device 130 and a pipe (e.g., the second branch pipe 150 and the second inlet pipe 131 and the second outlet pipe 132 located between the second branch pipe 150 and the second refrigeration device 130) that is connected to the coolant outlet and coolant inlet of the second refrigeration device 130 but not connected to the cooling channel 110, so that the second coolant can still flow in the second self-circulating loop, and the second coolant will not flow through the cooling channel 110 when flowing in the second self-circulating loop. Furthermore, the flow of the second coolant in the second self-circulating loop indicates that the second refrigeration device 130 is in a standby state, but the present invention is not limited thereto.

[0064] In some other embodiments, the cooling channel 110 includes a first cooling channel and a second cooling channel, which are not connected to each other. The first cooling channel, together with the first refrigeration device 120, the first liquid inlet pipe 121 and the first liquid outlet pipe 122, constitutes the first cooling circulation loop; the second cooling channel, together with the second refrigeration device 130, the second liquid inlet pipe 131 and the first liquid outlet pipe 132, constitutes the second cooling circulation loop.

[0065] Please continue to refer to this. Figure 1 The second cooling circulation loop is not simultaneously connected with the first cooling circulation loop; the first self-circulation loop is not simultaneously connected with the first cooling circulation loop; the second self-circulation loop is not simultaneously connected with the second cooling circulation loop.

[0066] It is understood that when the first cooling circulation loop is activated, the first coolant flows in the first cooling circulation loop and regulates the temperature of the substrate; when the first self-circulation loop is activated, the first coolant flows in the first self-circulation loop and the temperature of the first coolant is adjustable; when the second cooling circulation loop is activated, the second coolant flows in the second cooling circulation loop and regulates the temperature of the substrate; when the second self-circulation loop is activated, the second coolant flows in the second self-circulation loop and the temperature of the second coolant is adjustable.

[0067] Specifically, in this embodiment, when the first cooling circulation loop is active, the first self-circulation loop is not active, and the second cooling circulation loop is also not active. Simultaneously, the second self-circulation loop is active. At this time, the first coolant flows through the cooling channel 110 to regulate the temperature of the substrate 100, while the second coolant flows in the second self-circulation loop to regulate its temperature. Regulating the temperature of the second coolant does not affect the first coolant's regulation of the substrate 100's temperature. Similarly, when the second cooling circulation loop is active, the second self-circulation loop is not active, and the first cooling circulation loop is also not active. Simultaneously, the first self-circulation loop is active. At this time, the second coolant flows through the cooling channel 110 to regulate the temperature of the substrate 100, while the first coolant flows in the first self-circulation loop to regulate its temperature. Regulating the temperature of the first coolant also does not affect the second coolant's regulation of the substrate 100's temperature. Optionally, the temperature adjustment range of the first coolant is -100℃ to 30℃; the temperature adjustment range of the second coolant is 20℃ to 100℃, to meet the temperature adjustment requirements of the substrate 100 in the process. In some embodiments, the temperature adjustment ranges of both the first coolant and the second coolant are -100℃ to 100℃, but the present invention is not limited thereto.

[0068] Specifically, the base temperature control system further includes: a first control valve (not shown in the figure) that enables only one of the first cooling circulation loop and the second cooling circulation loop to be open; a second control valve (not shown in the figure) that enables only one of the first cooling circulation loop and the first self-circulation loop to be open; and a third control valve (not shown in the figure) that enables only one of the second cooling circulation loop and the second self-circulation loop to be open.

[0069] More specifically, the first control valve, the second control valve, and the third control valve can be the same valve, which is a six-way valve. The six ports of the six-way valve can be connected to the first and second ends of the cooling channel 110, the second end of the first inlet pipe 121, the first end of the first outlet pipe 122, the second end of the second inlet pipe 131, and the first end of the third outlet pipe 132, respectively. Furthermore, based on the internal piping layout and working principle of the six-way valve, if the cooling channel 110, the first inlet pipe 121, the first outlet pipe 122, the second inlet pipe 131, and the third outlet pipe 132 are connected using the six-way valve, then the first self-circulating loop and the second self-circulating loop can be formed without setting up the first branch pipe 140 and the second branch pipe 150. However, this invention is not limited to this.

[0070] Furthermore, in this embodiment, the base temperature control system further includes a controller electrically connected to the first refrigeration device 120 and the second refrigeration device 130. The controller is used to control the opening and closing of the first and second refrigeration devices and to regulate the temperatures of the first and second coolants. It is also used to control the on / off state of the first cooling circulation loop, the second cooling circulation loop, the first self-circulating loop, and the second self-circulating loop. More specifically, the controller is also electrically connected to the first control valve, the second control valve, and the third control valve to control their opening and closing, and to control their connection direction, thereby controlling the on / off state of the first cooling circulation loop, the second cooling circulation loop, the first self-circulating loop, and the second self-circulating loop. However, this invention is not limited thereto.

[0071] Specifically, in this embodiment, the first refrigeration device 120 and the second refrigeration device 130 are located in the same refrigeration unit to reduce the economic cost and space occupied by the base temperature control system. In some embodiments, the first refrigeration device and the second refrigeration device may also be located in two different refrigeration units, but the present invention is not limited thereto.

[0072] Based on the same inventive concept, combined with the appendix Figure 2As shown, this embodiment also provides a control method for a base temperature control system. The controller in the base temperature control system is further used to execute the control method, and the control method includes: step S1, obtaining the process temperature required for processing the substrate 100, wherein the process temperature includes a first process temperature, a second process temperature, and a third process temperature; step S2, conveying a first coolant having the first process temperature to the cooling channel 110 through the first cooling circulation loop, so that the first coolant having the first process temperature regulates the temperature of the substrate 100; simultaneously adjusting the temperature of the second coolant to the second process temperature. The temperature of the first coolant is adjusted to the third process temperature, and the second coolant flows in the corresponding second self-circulating loop; step S3: the second coolant with the second process temperature is transported to the cooling channel 110 through the second cooling circulation loop, so that the second coolant with the second process temperature regulates the temperature of the substrate 100; at the same time, the temperature of the first coolant is adjusted to the third process temperature, and the first coolant flows in the corresponding first self-circulating loop; wherein, the first process temperature, the second process temperature and the third process temperature are different from each other; neither the first self-circulating loop nor the second self-circulating loop is connected to the cooling channel 110.

[0073] Specifically, in this embodiment, when the process temperature required for processing the substrate 100 includes at least three different temperatures, the controller can be used to alternately activate the first cooling circulation loop and the second cooling circulation loop to alternately deliver the first coolant with different temperatures and the second coolant with different temperatures to the cooling channel 110, thereby allowing the temperature of the substrate 100 to be cascaded between at least three different temperatures, thus meeting the temperature variation requirements of the substrate 100 in the process. More specifically, when the first cooling circulation loop is activated and the first coolant is delivered to the cooling channel 110, the second coolant can flow in the second self-circulating loop, i.e., the second refrigeration device 130 is in standby mode. At this time, the temperature of the second coolant can be pre-adjusted to the temperature to be changed by the substrate 100 next by utilizing the time when the second refrigeration device 130 is in standby mode. Similarly, when the second cooling circulation loop is activated and the second coolant is delivered to the cooling channel 110, the first coolant can flow in the first self-circulating loop, i.e., the first refrigeration device 120 is in standby mode. At this time, the temperature of the first coolant can be pre-adjusted to the temperature to be changed by the substrate 100 next by utilizing the time when the first refrigeration device 120 is in standby mode. As can be seen, the control method provided in this embodiment utilizes the time when the first refrigeration device 120 is in standby mode to pre-adjust the temperature of the first coolant and the time when the second refrigeration device 130 is in standby mode to pre-adjust the temperature of the second coolant, which shortens the time when the substrate reaches the preset temperature during the process at a specific temperature. At the same time, the temperature of the substrate can be changed to any temperature within the temperature adjustment range of the first and second coolants to meet the cascade temperature control requirements of the substrate in the process.

[0074] Please continue to refer to this. Figure 2 The control method further includes: step S4, delivering a first coolant with the third process temperature to the cooling channel 110 through the first cooling circulation loop, so that the first coolant with the third process temperature regulates the temperature of the substrate 100.

[0075] Specifically, in this embodiment, before executing step S2, the controller can be used to turn on the first self-circulating loop and turn off the first cooling loop and the second cooling loop, so as to pre-adjust the temperature of the first coolant to the first process temperature; at this time, the second self-circulating loop may or may not be turned on, but the present invention is not limited thereto.

[0076] Specifically, in this embodiment, in step S2, the controller can be used to connect the first cooling circulation loop and the second self-circulation loop, and de-connect the first self-circulation loop and the second cooling circulation loop, so that the first coolant with the first process temperature can flow in the first cooling circulation loop to flow through the cooling channel 110 and adjust the temperature of the substrate 100 to the first process temperature; at the same time, the second coolant flows in the second self-circulation loop to adjust the temperature of the second coolant to the second process temperature during the standby time of the second refrigeration device 130, and the adjustment of the temperature of the second coolant will not affect the control of the temperature of the substrate 100 by the first coolant.

[0077] In step S3, the controller can be used to connect the second cooling circulation loop and the first self-circulation loop, and de-connect the second self-circulation loop and the first cooling circulation loop, so that the second coolant with the second process temperature can flow in the second cooling circulation loop to flow through the cooling channel 110 and adjust the temperature of the substrate 100 to the second process temperature; at the same time, the first coolant flows in the first self-circulation loop to adjust the temperature of the first coolant to the third process temperature during the standby time of the first refrigeration device 120, and the adjustment of the temperature of the first coolant will not affect the control of the temperature of the substrate 100 by the second coolant.

[0078] In step S4, the controller can be used to connect the first cooling circulation loop and the second self-circulating loop, and deconnect the first self-circulating loop and the second cooling circulation loop, so that the first coolant with the third process temperature can flow in the first cooling circulation loop, flowing through the cooling channel 110 and adjusting the temperature of the substrate 100 to the third process temperature. More specifically, if the process temperature only includes the first process temperature, the second process temperature, and the third process temperature, then after the temperature of the substrate 100 is adjusted to the third process temperature, the controller can be used to put the first refrigeration device 120 in a shutdown state (i.e., the first refrigeration device is not working) or in a standby state, and to put the second refrigeration device 130 in a shutdown state (i.e., the second refrigeration device is not working) or in a standby state.

[0079] Please continue to refer to this. Figure 2The process temperature also includes a fourth process temperature, a fifth process temperature, ..., an Nth process temperature that are all different from each other, where N is an integer and N≥4; the fourth process temperature, the fifth process temperature, ..., the Nth process temperature are all different from the first process temperature, the second process temperature, and the third process temperature. The control method further includes: step S5, supplying a first coolant with a process temperature of the i-th process to the cooling channel through the first cooling circulation loop to regulate the temperature of the substrate; simultaneously determining whether a preset condition is met, if not, adjusting the temperature of the second coolant to the (i+1)-th process temperature, and allowing the second coolant to flow in the second self-circulating loop; step S6, supplying a second coolant with a process temperature of the (i+1)-th process to the cooling channel through the second cooling circulation loop to regulate the temperature of the substrate; simultaneously determining whether the preset condition is met, if not, adjusting the temperature of the first coolant to the (i+2)-th process temperature, and allowing the first coolant to flow in the first self-circulating loop; repeating steps S5 to S6 until the preset condition is met; and the preset condition is that the temperature of the substrate is adjusted to the N-th process temperature; i is an integer, 3≤i≤N-1.

[0080] Specifically, in this embodiment, in step S5, the controller can be used to connect the first cooling circulation loop and the second self-circulating loop, and de-connect the first self-circulating loop and the second cooling circulation loop, so that the first coolant with the i-th process temperature can flow in the first cooling circulation loop, flowing through the cooling channel 110 and adjusting the temperature of the substrate 100 to the i-th process temperature. Simultaneously, it is necessary to determine whether the preset condition is met. If the preset condition is not met, indicating that the substrate temperature has not been adjusted to the N-th process temperature, the temperature of the second coolant flowing in the second self-circulating loop can be adjusted to the (i+1)-th process temperature during the standby time of the second refrigeration device 130. If the preset condition is met, indicating that the substrate temperature has been adjusted to the N-th process temperature, the controller can be used to put the first refrigeration device 120 in a shutdown state or a standby state, and also put the second refrigeration device 130 in a shutdown state or a standby state.

[0081] In step S6, the controller can be used to connect the second cooling circulation loop and the first self-circulating loop, and de-connect the second self-circulating loop and the first cooling circulation loop, allowing the second coolant with the (i+1)th process temperature to flow in the second cooling circulation loop, passing through the cooling channel 110 and adjusting the temperature of the substrate 100 to the (i+1)th process temperature. Simultaneously, it is necessary to determine again whether the preset condition is met. If the preset condition is not met, indicating that the substrate temperature has not yet been adjusted to the Nth process temperature, the temperature of the first coolant flowing in the first self-circulating loop can be adjusted to the (i+2)th process temperature during the standby time of the first refrigeration device 120. If the preset condition is met, indicating that the substrate temperature has been adjusted to the Nth process temperature, the controller can be used to turn off or put the first refrigeration device 120 into a standby state, and also turn off or put the second refrigeration device 130 into a standby state. More specifically, when N≥4, steps S5 and S6 can be executed at least once until the preset condition is met. In some embodiments, the preset condition may also be that the temperature of the substrate is no longer regulated, but the present invention is not limited thereto.

[0082] Based on the same inventive concept, combined with the appendix Figure 3 As shown, this embodiment also provides a semiconductor processing apparatus, including: a reaction chamber 200; a base temperature control system as described above; and the controller in the base temperature control system is further used to execute the control method as described above.

[0083] Specifically, in this embodiment, the base 101 in the base temperature control system is disposed at the bottom of the reaction chamber 200; a spray head 210 is provided at the top of the reaction chamber 200, opposite to the base 101. The spray head 210 is connected to a gas supply device 220 located outside the reaction chamber 200, for introducing process gas from the gas supply device 220 into the reaction area located between the spray head 210 and the base 101. Simultaneously, the spray head 210 can also serve as the upper electrode of the reaction chamber 200, and the base 101 can also serve as the lower electrode of the reaction chamber 200. At least one radio frequency power supply is applied to the upper electrode or the lower electrode through a matching network to generate a radio frequency electric field between the upper electrode and the lower electrode, thereby ionizing the process gas in the reaction area into plasma for processing the substrate 100. An electrostatic chuck is provided above the base 101 to support the substrate 100. An electrostatic electrode 230 is provided inside the electrostatic chuck to generate electrostatic attraction to support and fix the substrate 100 during the process, but the present invention is not limited thereto.

[0084] Specifically, in this embodiment, based on the substrate temperature control system, a first coolant with different temperatures and a second coolant with different temperatures can be alternately supplied to the cooling channel 110 located within the substrate 101. This allows the temperature of the substrate 100 to be cascaded between at least three different temperatures, thereby meeting the temperature variation requirements of the substrate 100 in the process. For different etching depths, the temperature of the substrate 100 can be changed in a timely manner to match the binding and desorption rates of the etchant and reaction byproducts with the substrate 100 at different etching depths. This enables precise control of key etching dimensions and other parameters at different depths, ensuring that the processed substrate 100 meets the fabrication requirements. More specifically, an ONON structure is formed on the processed substrate 100. The ONON structure includes sequentially stacked oxide and silicon nitride layers, but this invention is not limited thereto.

[0085] Based on the same inventive concept, this embodiment also provides a computer-readable storage medium containing a computer-readable program for guiding the operation of the base temperature control system as described above. The base temperature control system includes a controller for reading the program stored in the computer-readable storage medium to execute the control method as described above.

[0086] In summary, this embodiment provides a substrate temperature control system, a control method, and a semiconductor processing apparatus. The controller in the substrate temperature control system executes the control method, which includes: delivering a first coolant with a first process temperature to a cooling channel via a first cooling circulation loop to regulate the substrate temperature; simultaneously adjusting the temperature of a second coolant to a second process temperature and allowing the second coolant to flow in a second self-circulating loop that does not pass through the cooling channel; and delivering a second coolant with a second process temperature to the cooling channel via a second cooling circulation loop to regulate the substrate temperature; simultaneously adjusting the temperature of the first coolant to a third process temperature and allowing the first coolant to flow in the first self-circulating loop that does not pass through the cooling channel. In this embodiment, the first and second cooling circulation loops can be alternately activated to alternately deliver first coolants and second coolants with different temperatures to the cooling channel, thereby allowing the substrate temperature to be cascaded between at least three different temperatures, thus meeting the temperature variation requirements of the substrate in the process. This embodiment can pre-adjust the temperature of the first coolant by utilizing the standby time of the first refrigeration device and pre-adjust the temperature of the second coolant by utilizing the standby time of the second refrigeration device. Based on this cascaded temperature change method, the standby time of one of the refrigeration devices is used to change the next preset target temperature. Compared with the existing technology of substrate temperature control based on premixed liquid, this embodiment greatly shortens the processing time of the substrate.

[0087] Although the present invention has been described in detail through the preferred embodiments above, it should be understood that the above description should not be considered as a limitation of the present invention. Various modifications and substitutions to the present invention will be apparent to those skilled in the art after reading the above description. Therefore, the scope of protection of the present invention should be defined by the appended claims.

Claims

1. A control method for a base temperature control system, the base temperature control system comprising a base disposed within a reaction chamber and a cooling channel disposed within the base, the cooling channel being used for temperature control of a substrate supported on the base; the base temperature control system comprising: A first refrigeration device and a first cooling circulation loop are used to deliver a first coolant to the cooling channel and circulate the first coolant. A second refrigeration device and a second cooling circulation loop are used to deliver a second coolant to the cooling channel and circulate the second coolant; the base temperature control system further includes a controller, characterized in that the controller is used to execute the control method, the control method including: Step S1: Obtain the process temperature required to process the substrate, and the process temperature includes a first process temperature, a second process temperature and a third process temperature; Step S2: The first coolant with the first process temperature is delivered to the cooling channel through the first cooling circulation loop so that the first coolant with the first process temperature regulates the temperature of the substrate; at the same time, the temperature of the second coolant is adjusted to the second process temperature and the second coolant flows in the corresponding second self-circulation loop. Step S3: The second coolant with the second process temperature is delivered to the cooling channel through the second cooling circulation loop, so that the second coolant with the second process temperature regulates the temperature of the substrate; at the same time, the temperature of the first coolant is adjusted to the third process temperature, and the first coolant flows in the corresponding first self-circulation loop; The first process temperature, the second process temperature, and the third process temperature are all different from each other; neither the first self-circulating loop nor the second self-circulating loop is connected to the cooling channel.

2. The control method of the base temperature control system as described in claim 1, characterized in that, The control method further includes: Step S4: The first coolant with the third process temperature is delivered to the cooling channel through the first cooling circulation loop to regulate the temperature of the substrate.

3. The control method of the base temperature control system as described in claim 1, characterized in that, The process temperature also includes a fourth process temperature, a fifth process temperature, ..., an Nth process temperature, where N is an integer and N≥4; the control method further includes: Step S5: The first coolant with the i-th process temperature is transported to the cooling channel through the first cooling circulation loop to regulate the temperature of the substrate; at the same time, it is determined whether the preset conditions are met. If not, the temperature of the second coolant is adjusted to the (i+1)-th process temperature, and the second coolant is made to flow in the second self-circulation loop. Step S6: The second coolant with the i+1th process temperature is transported to the cooling channel through the second cooling circulation loop to regulate the temperature of the substrate; at the same time, it is determined whether the preset condition is met. If not, the temperature of the first coolant is adjusted to the i+2th process temperature, and the first coolant is made to flow in the first self-circulation loop. Steps S5 to S6 are executed repeatedly until the preset condition is met; and the preset condition is that the temperature of the substrate is adjusted to the Nth process temperature; i is an integer, 3≤i≤N-1.

4. A base temperature control system for executing the control method as described in any one of claims 1 to 3; characterized in that, The base temperature control system includes: A cooling channel, located inside the base, is used to regulate the temperature of the substrate supported on the base. A first refrigeration device is used to transport and circulate a first coolant; and the cooling channel is connected to the first refrigeration device through a first inlet pipe and a first outlet pipe to form a first cooling circulation loop. The second refrigeration device is used to transport and circulate the second coolant; and the cooling channel is connected to the second refrigeration device through the second inlet pipe and the second outlet pipe to form a second cooling circulation loop; the second cooling circulation loop is not simultaneously connected to the first cooling circulation loop. The first self-circulating loop shares the first refrigeration device with the first cooling loop; and the first self-circulating loop is not connected to the cooling channel. The second self-circulating loop shares the second refrigeration device with the second cooling loop; and the second self-circulating loop is not connected to the cooling channel.

5. The base temperature control system as described in claim 4, characterized in that, Also includes: The first branch pipe is connected to the first liquid inlet pipe and the first liquid outlet pipe respectively; and the first branch pipe, the first refrigeration device, and the first liquid inlet pipe and the first liquid outlet pipe located between them form the first self-circulating loop. The second branch pipe is connected to the second inlet pipe and the second outlet pipe respectively; and the second branch pipe, the second refrigeration device, and the second inlet pipe and the second outlet pipe located between them form the second self-circulating loop.

6. The base temperature control system as described in claim 5, characterized in that, The first self-circulating loop and the first cooling loop are not simultaneously connected; The second self-circulating loop and the second cooling loop are not simultaneously connected.

7. The base temperature control system as described in claim 5, characterized in that, Also includes: The first control valve enables only one of the first cooling circulation loop and the second cooling circulation loop to be open.

8. The base temperature control system as described in claim 5, characterized in that, Also includes: The second control valve enables only one of the first cooling circulation loop and the first self-circulation loop to be activated.

9. The base temperature control system as described in claim 5, characterized in that, Also includes: The third control valve is used to activate only one of the second cooling circulation loop and the second self-circulation loop.

10. The base temperature control system as described in claim 5, characterized in that, When the first cooling circulation loop is activated, the first coolant regulates the temperature of the substrate; when the first self-circulation loop is activated, the first coolant flows in the first self-circulation loop and the temperature of the first coolant is adjustable. When the second cooling circulation loop is activated, the second coolant regulates the temperature of the substrate; when the second self-circulation loop is activated, the second coolant flows in the second self-circulation loop and the temperature of the second coolant is adjustable.

11. The base temperature control system as described in claim 10, characterized in that, The temperature adjustment range of both the first coolant and the second coolant is -100℃ to 100℃.

12. The base temperature control system as described in claim 10, characterized in that, The temperature adjustment range of the first coolant is -100℃ to 30℃; the temperature adjustment range of the second coolant is 20℃ to 100℃.

13. The base temperature control system as described in claim 4, characterized in that, The first refrigeration device and the second refrigeration device are located in the same refrigeration unit.

14. A semiconductor processing apparatus, characterized in that, include: The reaction chamber; the base temperature control system as described in any one of claims 4 to 13.

15. A computer-readable storage medium storing a computer-readable program for guiding the operation of a base temperature control system as described in any one of claims 4 to 13, the base temperature control system comprising a controller configured to read the program stored in the computer-readable storage medium to execute a control method comprising: Step S1: Obtain the process temperature required to process the substrate, and the process temperature includes a first process temperature, a second process temperature and a third process temperature; Step S2: The first coolant with the first process temperature is delivered to the cooling channel through the first cooling circulation loop so that the first coolant with the first process temperature regulates the temperature of the substrate; at the same time, the temperature of the second coolant is adjusted to the second process temperature and the second coolant flows in the corresponding second self-circulation loop. Step S3: The second coolant with the second process temperature is delivered to the cooling channel through the second cooling circulation loop, so that the second coolant with the second process temperature regulates the temperature of the substrate; at the same time, the temperature of the first coolant is adjusted to the third process temperature, and the first coolant flows in the corresponding first self-circulation loop; The first process temperature, the second process temperature, and the third process temperature are all different from each other; neither the first self-circulating loop nor the second self-circulating loop is connected to the cooling channel.

16. The computer-readable storage medium storing a computer-readable program as described in claim 15, characterized in that, The control method further includes: step S4, delivering a first coolant with the third process temperature to the cooling channel through the first cooling circulation loop to regulate the temperature of the substrate.

17. The computer-readable storage medium storing a computer-readable program as described in claim 15, characterized in that, The process temperature also includes a fourth process temperature, a fifth process temperature, ..., an Nth process temperature, where N is an integer and N≥4. The control method further includes: Step S5: The first coolant with the i-th process temperature is transported to the cooling channel through the first cooling circulation loop to regulate the temperature of the substrate; at the same time, it is determined whether the preset conditions are met. If not, the temperature of the second coolant is adjusted to the (i+1)-th process temperature, and the second coolant is made to flow in the second self-circulation loop. Step S6: The second coolant with the i+1th process temperature is transported to the cooling channel through the second cooling circulation loop to regulate the temperature of the substrate; at the same time, it is determined whether the preset condition is met. If not, the temperature of the first coolant is adjusted to the i+2th process temperature, and the first coolant is made to flow in the first self-circulation loop. Steps S5 to S6 are executed repeatedly until the preset condition is met; and the preset condition is that the temperature of the substrate is adjusted to the Nth process temperature; i is an integer, 3≤i≤N-1.

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