Chip rotating mechanism, chip mounter, and chip mounting method

Abstract

The application discloses a patch rotating mechanism, a patching machine and a patching method, and belongs to the technical field of semiconductor patching. The patching machine comprises a workbench and a patching assembly. The patching assembly comprises a suction accessory, a rotating assembly and a gas path structure. The suction accessory is connected with the gas path structure and communicates with an external gas device. The rotating assembly is connected to one side of the workbench and is used for driving the suction accessory to rotate. The patching assembly further comprises a first connecting piece and a second connecting piece. The first connecting piece is used for connecting with the suction accessory. The second connecting piece is used for connecting with a lifting mechanism. When the lifting mechanism drives the substrate adsorbed by the suction accessory to abut against a substrate, the second connecting piece can slide relative to the first connecting piece. According to the sliding effect of the first connecting piece and the second connecting piece, the suction accessory can exert a relatively constant pressure on the substrate after contacting the substrate, so that the height difference of different substrate thicknesses is offset, and the problem that the patching machine is not convenient to use due to the influence of the semiconductor substrate thickness is solved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of semiconductor patching, more particularly, to a patching rotating mechanism, a patching machine and a patching method. BACKGROUND

[0002] Semiconductor patching is a technology that pastes a semiconductor substrate on a substrate and protects and fixes it through packaging; this technology is mainly used in the manufacturing process of integrated circuits to ensure that the substrate can work stably and be connected with other electronic components.

[0003] In related technologies, when a semiconductor substrate is patched, the substrate is adsorbed by a suction nozzle, and then the semiconductor is adjusted in angle by rotating the suction nozzle; in order to prevent the suction nozzle from twisting and winding the air pipe when rotating, for example, the patent with the publication number CN118352279A provides a patching rotating mechanism, a patching device and a patching machine, which connects the air pipe to the suction nozzle through the patching rotating mechanism, avoids the influence of the rotation of the suction nozzle mounting rod on the air pipe, avoids the deformation of the air pipe acting on the suction nozzle mounting rod, avoids the influence of the air pipe on the movement of the suction nozzle mounting rod, thereby improving the precision and stability of the movement of the suction nozzle mounting rod and the service life of the air pipe.

[0004] Although the above-mentioned prior art solution can realize the effect that the rotation of the suction nozzle does not affect the air pipe by connecting the air pipe and the suction nozzle through the patching rotating mechanism, in order to ensure that the suction nozzle can adsorb and patch the substrate, the suction and patching process needs to control the suction start-stop action of the air pipe according to the moving distance of the air nozzle, and for substrates of different thicknesses, the moving distance of the suction nozzle will also change, so that the control program of the patching machine needs to be re-adjusted according to the thickness of the substrate before each patching, and therefore the patching machine is not convenient to use due to the influence of the thickness of the semiconductor substrate.

[0005] In view of this, we propose a patching rotating mechanism, a patching machine and a patching method. SUMMARY

[0006] The purpose of the present application is to provide a patching rotating mechanism, a patching machine and a patching method, which solve the technical problem that the patching machine is not convenient to use due to the influence of the thickness of the semiconductor substrate, and achieve the technical effect that the patching machine can adapt to substrates of different thicknesses without adjusting the control program.

[0007] One aspect of the present application provides a patching rotating mechanism, comprising:

[0008] a workbench for mounting and supporting various components, which can be configured on one side of the substrate fixing mechanism in the working state;

[0009] A patch assembly is connected to one side of the workbench, and the patch assembly comprises a suction accessory, the suction accessory is communicated with an external gas device through a gas path structure, and the suction accessory can adsorb and release a substrate under cooperation of the external gas device.

[0010] A rotating assembly is connected to one side of the workbench, and the rotating assembly is used to drive the suction accessory to rotate.

[0011] The patch assembly further comprises:

[0012] A first connecting piece is used to connect with the suction accessory.

[0013] A second connecting piece is used to connect with a lifting mechanism, and the second connecting piece is connected with the first connecting piece; and when the lifting mechanism drives the substrate adsorbed by the suction accessory to abut against a substrate, the first connecting piece can slide relative to the second connecting piece.

[0014] Preferably, a cavity is arranged in the inner side of the first connecting piece, and the cavity is communicated with the gas path structure.

[0015] The patch assembly further comprises a first sealing structure arranged on the outer side of the first connecting piece, and the inner side of the first sealing structure is slidingly arranged on the outer side of the second connecting piece.

[0016] The outer side of the first sealing structure is connected with the first connecting piece, and the first sealing structure can seal one end of the cavity.

[0017] Preferably, the patch assembly further comprises:

[0018] A communication hole is arranged on the outer side of the first connecting piece, and the communication hole extends to the cavity.

[0019] A second sealing structure is arranged on the outer side of the connecting piece, and the second sealing structure can block the communication hole in a first state, and the second sealing structure can make the cavity communicated with the outside through the communication hole in a second state.

[0020] Preferably, the second sealing structure comprises a sealing body, and the sealing body is embedded in the communication hole in the first state.

[0021] The sealing body is driven to move along the communication hole to switch to the second state, so that the cavity is communicated with the outside of the first connecting piece.

[0022] Preferably, one side of the sealing body facing the cavity is provided with a pressure receiving surface, and the pressure receiving surface extends into the cavity in the first state.

[0023] The second sealing structure further comprises a moving element movably arranged in the cavity, the moving element being shaped to fit the cavity;

[0024] The moving element is provided with a pressing surface corresponding to the pressure receiving surface of the sealing body, and when the moving element moves in the cavity, the pressing surface abuts and presses the pressure receiving surface of the sealing body.

[0025] Preferably, the sealing body is connected to one side of the first connecting element by a first elastic element.

[0026] The moving element is arranged in the cavity by a second elastic element.

[0027] Preferably, the patch assembly further comprises a pressing structure arranged in the cavity.

[0028] The pressing structure comprises:

[0029] A pressing plate connected to the bottom end of the second connecting element.

[0030] A driving element arranged on one side of the pressing plate facing the inner wall of the cavity.

[0031] A guide element arranged in the cavity and connected to the first connecting element, the guide element comprising a guide surface corresponding to the driving element; when the first connecting element rotates, the guide surface can drive the driving element from a first relative position to a second relative position.

[0032] Preferably, the rotating assembly comprises a power element, and the second connecting element is drivingly connected to one side of the power element.

[0033] Another aspect of the present application provides a patching machine comprising the patch rotating mechanism described above, and further comprising:

[0034] A workbench providing a carrier for patching work.

[0035] A substrate fixing mechanism arranged on one side of the workbench for fixing a substrate to be patched.

[0036] A transverse moving mechanism arranged at the top end of the workbench for driving the patch rotating mechanism to move along the transverse direction of the workbench.

[0037] A longitudinal moving mechanism arranged at the top end of the workbench for driving the patch rotating mechanism to move along the longitudinal direction of the workbench.

[0038] A third aspect of the present application discloses a patching method of the patching machine described above, comprising:

[0039] The transverse moving mechanism and / or the longitudinal moving mechanism drives the patch rotating mechanism to move to the suction accessory to align with the substrate to be attached on the workbench;

[0040] The suction accessory is driven by the lifting mechanism to move longitudinally until it contacts the top end of the substrate to suck the substrate;

[0041] The suction accessory is driven by the driving assembly to adjust the angle of the substrate to adapt to the attachment position of the substrate;

[0042] The transverse moving mechanism and / or the longitudinal moving mechanism drives the patch rotating mechanism to move to the suction accessory to align with the substrate to be attached on the workbench;

[0043] The suction accessory is driven by the lifting mechanism to move longitudinally until it contacts the top end of the substrate to suck the substrate;

[0044] The suction accessory continues to be driven by the lifting mechanism until the substrate is pressed at the corresponding attachment position of the substrate, and at this time, the first connecting piece moves relative to the second connecting piece.

[0045] One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

[0046] (1) The patch assembly is adopted in the present application, and through the sliding effect of the first connecting piece and the second connecting piece, the suction accessory can exert a relatively constant pressure on the substrate after contacting the substrate, which offsets the height difference of different substrate thicknesses, solves the problem that the patching machine is not convenient to use due to the influence of the thickness of the semiconductor substrate, and further realizes the technical effect that the patching machine control program does not need to be debugged to adapt to the attachment of substrates of different thicknesses.

[0047] (2) The first sealing structure is arranged on the top of the first connecting piece, which can keep the inside of the first connecting piece sealed while moving and rotating, which is conducive to the stability of the function of the equipment to suck the substrate, and ensures the stability of the equipment during use.

[0048] (3) The second sealing structure is arranged in the first connecting piece, which can realize the function of automatic deflation through the movement of the first connecting piece, so that the suction accessory releases the fixation of the substrate, improves the practicability of the equipment, and improves the use effect of the equipment.

[0049] (4) The rotating assembly is arranged on one side of the patch assembly, which can drive the patch assembly to rotate, so that the suction accessory drives the substrate to rotate, adjusts the angle of the substrate during patching, increases the practicability of the equipment, and improves the use effect of the equipment. BRIEF DESCRIPTION OF DRAWINGS

[0050] Figure 1 The overall structure diagram of the patch rotating mechanism disclosed in the embodiments of the present application;

[0051] Figure 2 Structure diagram of the workbench in the patch rotating mechanism disclosed by the embodiment of the present application;

[0052] Figure 3 Structure diagram of the patch assembly in the patch rotating mechanism disclosed by the embodiment of the present application;

[0053] Figure 4 Assembly structure diagram of the pressing structure and the second sealing structure in the patch rotating mechanism disclosed by the embodiment of the present application;

[0054] Figure 5 Structure diagram of the adsorption groove in the patch rotating mechanism disclosed by the embodiment of the present application;

[0055] Figure 6 Structure diagram of the moving part in the patch rotating mechanism disclosed by the embodiment of the present application;

[0056] Figure 7 Structure diagram of the internal structure at the communication hole in the patch rotating mechanism disclosed by the embodiment of the present application;

[0057] Figure 8 Structure diagram of the rotating assembly in the patch rotating mechanism disclosed by the embodiment of the present application;

[0058] Figure 9 Structure diagram of the first transmission assembly in the patch rotating mechanism disclosed by the embodiment of the present application;

[0059] Figure 10 Assembly structure diagram of the replacement assembly and the second transmission assembly in the patch rotating mechanism disclosed by the embodiment of the present application;

[0060] Figure 11 Cooperation diagram of the driving part and the guide part in the patch rotating mechanism disclosed by the embodiment of the present application.

[0061] Explanation of the reference numerals in the figure:

[0062] 100, workbench;

[0063] 200, patch assembly; 210, adsorption part; 211, adsorption groove; 220, first connecting part; 230, second connecting part; 221, cavity; 240, gas path structure; 250, first sealing structure; 251, sealing ring; 252, sealing sleeve; 260, pressing structure; 261, pressing plate; 262, driving part; 263, guide part; 2631, guide surface; 270, second sealing structure; 271, moving part; 2711, extrusion surface; 272, second elastic part; 2721, connecting ring; 273, sealing body; 274, first elastic part; 275, protective shell; 280, communication hole;

[0064] 300, rotating assembly; 310, power member; 320, first transmission rod; 330, first one-way mechanism; 340, sliding ring; 350, driving rod;

[0065] 400, first transmission assembly; 410, connecting plate; 420, lifting plate; 430, support frame;

[0066] 500, replacement assembly; 510, rotating table; 520, placing opening; 530, notch;

[0067] 600, second transmission assembly; 610, second transmission rod; 620, second one-way mechanism; 630, transmission column;

[0068] 700, lifting mechanism. DETAILED DESCRIPTION

[0069] The application will be further described in detail below with reference to the accompanying drawings.

[0070] Reference Figure 1 , Figure 2 and Figure 3 The patch rotating mechanism disclosed in the embodiments comprises a workbench 100, a patch assembly 200 is arranged on the outer side of the workbench 100, and the patch assembly 200 is used for adsorbing a base material and attaching the base material to a substrate, the patch assembly 200 comprises a suction member 210, a first connecting member 220 and a second connecting member 230 are arranged on the top of the suction member 210; the first connecting member 220 slides on the second connecting member 230, the patch assembly 200 further comprises a gas path structure 240, the gas path structure 240, the second connecting member 230 and the first connecting member 220 and the middle part of the suction member 210 can form a communicating gas path channel, and the suction member 210 can be provided with suction force when the other side of the gas path structure 240 communicates with an external gas device, the inner side of the workbench 100 is provided with a rotating assembly 300, the rotating assembly 300 is used for driving the suction member 210 to rotate the base material to an angle position adapted to a to-be-attached position on the substrate, the top of the patch assembly 200 is provided with a first transmission assembly 400, and the first transmission assembly 400 is connected with the patch assembly 200 to drive the patch assembly 200 to lift and realize the adsorption of the base material by the suction member 210 and the patch work after the adsorption.

[0071] In the above technical solution, when the base material is adsorbed, the patch assembly 200 is driven to descend by the first transmission assembly 400, the suction member 210 adsorbs the base material, then the patch assembly 200 is driven to ascend by the first transmission assembly 400, then the patch assembly 200 is driven to rotate by the rotating assembly 300, so that the base material is rotated to an angle position adapted to the to-be-attached position, and the subsequent patch work is facilitated.

[0072] The bottom of the suction accessory 210 can exert a relatively constant pressure on the substrate after contacting the substrate to offset the height difference of different substrate thicknesses, so as to facilitate the close contact between the substrate and the suction accessory 210 when the substrate is suctioned; meanwhile, it is also beneficial to the suction accessory 210 to exert a relatively constant contact pressure on the substrate when the substrate is attached, so that the substrate can be better attached to the substrate, solving the technical problem that the placement machine is not convenient to use due to the influence of the thickness of the semiconductor substrate, and achieving the technical effect of adapting to the attachment of substrates of different thicknesses without adjusting the control program of the placement machine.

[0073] With reference to Figure 1 , Figure 3 and Figure 4 , the inner side of the first connecting piece 220 is provided with a cavity 221, the cavity 221 is in communication with the gas path structure 240, and the placement assembly 200 further comprises a first sealing structure 250 for sealing the first connecting piece 220, the first sealing structure 250 can ensure the sealing of one side of the cavity 221 to ensure the normal suction function of the suction accessory 210; the bottom of the first sealing structure 250 is provided with a pressing structure 260 for controlling the operation of a second sealing structure 270; the outer side of the first connecting piece 220 is provided with a communication hole 280, and the second sealing structure 270 is arranged at the communication hole 280; wherein the second sealing structure 270 can seal the cavity 221 during suction and attachment to ensure the normal progress of the suction and attachment processes, and the second sealing structure 270 is defined as a first state in the description of the present application, and after the attachment is completed, the cavity 221 can be in communication with the outside of the first connecting piece 220 through the communication hole 280 to enable the gas to enter the cavity 221, and the second sealing structure 270 is defined as a second state in the description of the present application, so that the suction accessory 210 releases the suction of the substrate.

[0074] In the above technical solution, when the substrate is suctioned, the cavity 221 inside the first connecting piece 220 is in a sealed state under the action of the first sealing structure 250 and the second sealing structure 270, so that the suction accessory 210 can suction the substrate under the action of the external gas equipment; after the attachment is completed, the second sealing structure 270 can be driven to operate by the descent of the pressing structure 260, so that the gas in the working environment can enter the cavity 221 through the communication hole 280, so that the cavity 221 of the first connecting piece 220 automatically releases the sealed state, thereby releasing the suction of the substrate by the suction accessory 210, and avoiding that the suction accessory 210 suction the attached substrate again.

[0075] In a specific scheme, with reference to Figure 3 and Figure 4The first sealing structure 250 comprises a sealing ring 251, the inner side of the sealing ring 251 is slidingly arranged with the second connecting piece 230, the outer side of the sealing ring 251 is rotatably arranged with the top of the first connecting piece 220, the bottom of the sealing ring 251 is fixedly arranged with a sealing sleeve 252, and the sealing sleeve 252 is connected with the top end of the first connecting piece 220.

[0076] The first connecting piece 220 and the second connecting piece 230 are slidingly arranged through the sealing ring 251, so that the equipment is suitable for different thickness of the base material, and the sealing effect of the top of the first connecting piece 220 is improved through the sealing sleeve 252.

[0077] Referring to Figure 3 and Figure 4 , the pressing structure 260 comprises a pressing plate 261, the outer side of the pressing plate 261 is fixedly arranged with a driving piece 262, one side of the driving piece 262 is arranged with a guide piece 263, the bottom of the guide piece 263 is fixedly arranged with the inner side of the first connecting piece 220, wherein the guide piece 263 is correspondingly arranged with a guide surface 2631 with the driving piece 262, when the first connecting piece 220 rotates, the guide surface 2631 can drive the driving piece 262 from the first relative position of the first connecting piece 220 to the second relative position of the first connecting piece 220.

[0078] Referring to Figure 3 、 Figure 4 、 Figure 5 、 Figure 6 and Figure 7 , the second sealing structure 270 comprises a moving piece 271, the bottom of the moving piece 271 is fixedly connected with a second elastic piece 272, the bottom of the second elastic piece 272 is fixedly arranged with a connecting ring 2721, the bottom of the connecting ring 2721 is fixedly arranged with the inner side of the first connecting piece 220, the bottom of the moving piece 271 is arranged with a pressing surface 2711, the outer side of the pressing surface 2711 is arranged with a sealing body 273 corresponding to the communication hole 280, the sealing body 273 can seal the communication hole 280 to seal the inner cavity of the first connecting piece 220.

[0079] The outer side of the sealing body 273 is arranged with a first elastic piece 274, the bottom of the first elastic piece 274 is fixedly arranged with the outer side of the first connecting piece 220, and the outer side of the first connecting piece 220 is also fixedly arranged with a protective shell 275.

[0080] It can be understood that in the above description, the first elastic piece 274 is a connecting component made of a material with good resilience, such as magnesium alloy, copper alloy, etc., one end of which is connected to the outer side of the first connecting piece 220, and the other end of which is fixedly connected with the sealing body 273. The sealing body 273 is selected as a spherical body that can move in the communication hole 280.

[0081] In the above scheme, when the pressing structure 260 moves, it can drive the moving part 271 to descend, so that the pressing surface 2711 presses the corresponding sealing body 273, so that the sealing body 273 and the corresponding connecting hole 280 are separated, allowing gas to enter the cavity 221 to release the substrate adsorbed by the adsorbent 210; when resetting, since the pressing structure 260 releases the pressure on the moving part 271, the moving part 271 is reset under the elastic effect of the second elastic member 272, and the first elastic member 274 presses the corresponding sealing body 273, so that the sealing body 273 seals the corresponding connecting hole 280.

[0082] Understandably, the second elastic element 272 allows the movable element 271 to deform under pressure to accommodate its movement. When the pressing structure 260 no longer abuts against the top of the movable element 271, the movable element 271 can return to its original position under the action of the second elastic element 272. Therefore, in actual operation, the second elastic element 272 can be selected from elastic elements with deformation and recovery functions, such as silicone pads, pneumatic components, and others. Figure 6 The spring shown is an example.

[0083] The above technical solutions, in conjunction with the accompanying drawings, Figure 11 As shown, when the driving member 262 moves along the top of the moving member 271 to just contact the guide surface 2631, the relative position of the driving member 262 and the first connecting member 220 is defined as the first relative position; when the driving member 262 is located at the highest point of the guide surface 2631, the relative position of the driving member 262 and the first connecting member 220 is defined as the second relative position.

[0084] In the above technical solution, the position of the first connector 220 before the equipment adsorption is positioned as its initial position (i.e., Figure 11 (as shown in the position), when adsorption occurs, the first transmission component 400 drives the second connector 230 to descend, which can drive the pressing structure 260 to descend as a whole. When the adsorption component 210 contacts the substrate, the first transmission component 400 continues to operate, and the first connector 220 will move upward relative to the second connector 230. At this time, the pressing plate 261 is still a distance away from the second sealing structure 270.

[0085] Subsequently, the first transmission assembly 400 drives the second connecting member 230 and the first connecting member 220 to rise, and the rotation assembly 300 drives the first connecting member 220 to move in accordance with... Figure 11 Rotate in the direction of the arrow shown (in this rotation mode, the rotation direction of the power component 310 described later is positive). During this process, the driving component 262 does not contact the guide component 263, that is, there is no relative movement between the second connecting component 230 and the first connecting component 220. Only the angle of the substrate is adjusted so that the angle of the substrate matches the bonding position on the substrate, which facilitates the subsequent bonding work.

[0086] The first transmission assembly 400 drives the first connecting member 220 and the second connecting member 230 to descend again to perform the patching. When the patching is performed, the suction member 210 first drives the base material to move above the substrate until the base material is attached to the corresponding attachment position. Then, the first transmission assembly 400 drives the second connecting member 230 to continue to descend. At this time, the first connecting member 220 moves relative to the second connecting member 230 until the lower pressing plate 261 abuts against the second sealing structure 270, so that the second sealing structure 270 is unsealed to the communication hole 280 to unseal the suction of the suction member 210 to the base material.

[0087] The first transmission assembly 400 drives the first connecting member 220 and the second connecting member 230 to ascend to reset.

[0088] The rotating assembly 300 drives the first connecting member 220 to rotate (still in the direction shown by the arrow) so that the guide 263 is rotated to the driving member 262. With the continuous rotation of the first connecting member 220, the driving member 262 is moved from the first relative position to the second relative position, so that the second connecting member 230 and the first connecting member 220 are relatively moved, and the first connecting member 220 is moved to the initial position (i.e. the position shown in Figure 11 Figure 11 The rotating assembly 300 drives the first connecting member 220 to rotate (still in the direction shown by the arrow) so that the guide 263 is rotated to the driving member 262. With the continuous rotation of the first connecting member 220, the driving member 262 is moved from the first relative position to the second relative position, so that the second connecting member 230 and the first connecting member 220 are relatively moved, and the first connecting member 220 is moved to the initial position (i.e. the position shown in

[0089] Referring to Figure 1 and Figure 8 , the rotating assembly 300 includes a power member 310 fixedly arranged on one side of the workbench 100. One driving end of the power member 310 is fixedly provided with a first transmission rod 320. The first transmission rod 320 is in transmission connection with the first connecting member 220 through a first one-way mechanism 330 arranged thereon.

[0090] Specifically, the top of the first transmission rod 320 is fixedly provided with a first gear. The outer side of the first gear is in meshing connection with a second gear. The inner side of the second gear is provided with the first one-way mechanism 330. The outer ring of the first one-way mechanism 330 is fixedly arranged on the inner side of the second gear.

[0091] The inner ring of the first one-way mechanism 330 is fixedly provided with a sliding ring 340. The inner side of the sliding ring 340 is slidably provided with a driving rod 350. The bottom of the driving rod 350 is fixedly provided with a tooth column. The outer side of the first connecting member 220 is fixedly provided with a plurality of tooth blocks. The plurality of tooth blocks are in meshing connection with the tooth column.

[0092] The power member 310 drives the first transmission rod 320 to rotate in the forward direction, thereby driving the first gear to rotate. The first gear drives the second gear to rotate. Under the one-way effect of the first one-way mechanism 330, the driving rod 350 is driven to rotate, thereby driving the tooth column to rotate. The tooth column is in meshing connection with the plurality of tooth blocks, thereby driving the first connecting member 220 to rotate.

[0093] ​With reference to Figure 1 and Figure 9 , the first transmission assembly 400 includes two connecting plates 410, which are fixedly connected together with a lifting plate 420, one side of the lifting plate 420 is fixedly arranged at the top of the second connecting piece 230, and the other side of the lifting plate 420 is fixedly arranged with a support frame 430 for supporting the tooth column, one side of the support frame 430 is slidingly arranged with the support frame 430.

[0094] By lifting the connecting plate 410, the lifting plate 420 can be lifted, thereby driving the support frame 430 and the patch assembly 200 to lift, ensuring the lifting effect of the equipment.

[0095] With reference to Figure 1 , Figure 5 and Figure 10 , the bottom of the patch assembly 200 is provided with a replacement assembly 500 for replacing the suction accessory 210, the replacement assembly 500 is linked with the power piece 310 through the second transmission assembly 600, the replacement assembly 500 includes two rotating tables 510, the inner side of the two rotating tables 510 is provided with a plurality of placement openings 520 matched with the suction accessory 210, one side of the two rotating tables 510 is provided with a notch 530 at the bottom of the patch assembly 200, the bottom of the first connecting piece 220 is provided with a suction groove 211, and the suction groove 211 is electromagnetically attracted and connected with the suction accessory 210.

[0096] When the suction accessory 210 needs to be replaced, first rotate the placement opening 520 without placing the new suction accessory 210 to the bottom of the patch assembly 200, so that the suction groove 211 releases the electromagnetic attraction to the suction accessory 210, the suction accessory 210 falls into the empty placement opening 520, and then rotate the rotating table 510 to make the suction groove 211 attract the new suction accessory 210, thereby completing the operation of replacing the suction accessory 210 of the equipment.

[0097] With reference to Figure 1 and Figure 10 , the second transmission assembly 600 includes a second transmission rod 610, the top of the second transmission rod 610 is fixedly arranged with the driving end of the power piece 310, the bottom of the second transmission rod 610 is fixedly arranged with a third gear, the outer side of the third gear is meshingly arranged with a fourth gear, the inside of the fourth gear is provided with a second one-way mechanism 620, the outer ring of the second one-way mechanism 620 is fixedly arranged with the inner side of the fourth gear, the inner ring of the second one-way mechanism 620 is fixedly arranged with a transmission column 630, and the outer side of the transmission column 630 is fixedly arranged with the two rotating tables 510.

[0098] In the above technical solution, the power piece 310 is reversely operated (with Figure 11When the driving force is removed, the second transmission rod 610 is driven to rotate in the direction opposite to the arrow direction, thereby driving the third gear and the fourth gear to rotate, and driving the transmission column 630 to rotate under the one-way effect of the second one-way mechanism 620, thereby driving the two rotating tables 510 to rotate, and completing the linkage effect of the rotating table 510 and the power element 310.

[0099] The patch rotating mechanism disclosed in the embodiments of the present application comprises a workbench, a substrate fixing mechanism arranged on one side of the workbench and used for fixing a substrate to be pasted, a transverse moving mechanism arranged at the top end of the workbench and used for driving the patch rotating mechanism to move along the transverse direction of the workbench, and a longitudinal moving mechanism arranged at the top end of the workbench and used for driving the patch rotating mechanism to move along the longitudinal direction of the workbench.

[0100] The workbench, the substrate fixing mechanism, the transverse moving mechanism and the longitudinal moving mechanism in the above technical solution can all adopt the mechanisms in the prior art; the substrate fixing mechanism can be a clamp or the like capable of fixing the substrate, and the transverse moving mechanism and the longitudinal moving mechanism can be mechanisms such as linear guides capable of driving the patch rotating mechanism to move along the transverse direction and the longitudinal direction of the workbench; the moving directions of the transverse moving mechanism and the longitudinal moving mechanism are perpendicular to the plane in which the workbench is located.

[0101] The patch method involved in the above patch mechanism is as follows:

[0102] The transverse moving mechanism and / or the longitudinal moving mechanism drive the patch rotating mechanism to move along the workbench to the position where the suction accessory 210 is aligned with the substrate to be pasted;

[0103] The suction accessory 210 is driven by the lifting mechanism 700 to move along the longitudinal direction until it is in contact with the top end of the substrate to adsorb the substrate;

[0104] The suction accessory 210 is driven by the driving assembly to adjust the angle of the substrate to adapt to the pasting position of the substrate;

[0105] The transverse moving mechanism and / or the longitudinal moving mechanism drive the pasting rotating mechanism to move along the workbench to the position where the substrate adsorbed by the suction accessory 210 is aligned with the corresponding pasting position of the substrate;

[0106] The suction accessory 210 is driven by the lifting mechanism 700 to move along the longitudinal direction until the substrate is in contact with the corresponding pasting position of the substrate;

[0107] The suction accessory 210 continues to be driven by the lifting mechanism 700 to press the substrate on the corresponding pasting position of the substrate, and at this time, the first connecting element 220 moves relative to the second connecting element 230.

[0108] In summary, the patch rotating mechanism disclosed in the embodiments of the present application has the following effects when in use:

[0109] The adsorption base material: the lifting mechanism 700 drives the connecting plate 410 to descend, which can drive the lifting plate 420 to descend, thereby driving the support frame 430 and the patch assembly 200 to descend, so that the adsorption member 210 contacts the base material for adsorption;

[0110] After the adsorption member 210 contacts the base material, the first transmission assembly 400 continues to operate, so that the first connecting member 220 slides relative to the second connecting member 230, and the bottom of the adsorption member 210 can exert a relatively constant pressure on the base material after contacting the base material, which can offset the height difference of different base material thicknesses and facilitate the close contact of the base material with the adsorption member 210;

[0111] Subsequently, the lifting mechanism 700 drives the adsorption member 210 to rise.

[0112] When patching: the connecting plate 410 descends to drive the lifting plate 420 to descend, thereby driving the support frame 430 and the patch assembly 200 to descend, so that the adsorption member 210 performs patching. When the base material contacts the substrate, the first transmission assembly 400 continues to operate so that the first connecting member 220 slides relative to the second connecting member 230, which facilitates the adsorption member 210 to exert a relatively constant patching pressure on the base material, and the lower pressing plate 261 can press the moving part 271, so that the extrusion surface 2711 extrudes the sealing body 273, so that the sealing body 273 and the corresponding communication hole 280 generate a gap, so that the first connecting member 220 is filled with air, thereby releasing the adsorption of the adsorption member 210 on the base material.

[0113] When the first connecting member 220 is reset:

[0114] The first transmission assembly 400 drives the first connecting member 220 and the second connecting member 230 to rise and reset;

[0115] The rotating assembly 300 drives the first connecting member 220 to rotate, so that the guide member 263 rotates to the driving member 262, and with the continuous rotation of the first connecting member 220, the driving member 262 moves from the first relative position to the second relative position, so that the second connecting member 230 and the first connecting member 220 move relatively, and the first connecting member 220 moves to the initial position for the next adsorption.

Claims

1. A patch rotating mechanism, characterized by, The utility model relates to a kind of patch assembly and workbench, including: Workbench (100) for the installation and support of each component, the workbench (100) can be configured on the side of substrate fixation mechanism in working condition; Patch assembly (200) is connected to the side of the workbench (100), and the patch assembly (200) includes a suction accessory (210), the suction accessory (210) is communicated with external gas equipment by gas path structure (240), and the suction accessory (210) can be adsorbed and released under the cooperation of external gas equipment substrate; Rotary assembly (300) is connected to the side of the workbench (100), and the rotary assembly (300) is used to drive the suction accessory (210) to rotate; Wherein, the patch assembly (200) further includes: First connecting piece (220) for being connected with the suction accessory (210), the inside of the first connecting piece (220) is provided with cavity (221), and the cavity (221) is communicated with the gas path structure (240); Second connecting piece (230) for being connected with a lifting mechanism (700), and second connecting piece (230) is connected with the first connecting piece (220);And when lifting mechanism (700) drives the substrate adsorbed by suction accessory (210) to resist at substrate, the first connecting piece (220) can slide relative to the second connecting piece (230), so that suction accessory (210) can exert a relatively constant pressure on substrate after contacting substrate, to offset the height difference of different substrate thicknesses; First sealing structure (250) is arranged outside the first connecting piece (220), and the inside of the first sealing structure (250) is slidably arranged outside the second connecting piece (230);And the outside of the first sealing structure (250) is connected with the first connecting piece (220), and the first sealing structure (250) can seal one end of the cavity (221); Communication hole (280) is opened in the outside of the first connecting piece (220), and the communication hole (280) extends to the cavity (221); Second sealing structure (270) is arranged outside the first connecting piece (220), and the second sealing structure (270) can block the communication hole (280) in the first state, and the second sealing structure (270) can make the cavity (221) communicated with the outside through the communication hole (280) in the second state.

2. The patch rotation mechanism of claim 1, wherein, The second sealing structure (270) includes sealing body (273), and the sealing body (273) is embedded in the communication hole (280) in the first state; The sealing body (273) is driven to move along the communication hole (280) and switched to the second state, so that the cavity (221) is communicated with the outside of the first connecting piece (220).

3. The patch rotation mechanism of claim 2, wherein, The side of the sealing body (273) towards the cavity (221) is provided with pressure surface, and the pressure surface extends into the cavity (221) in the first state; The second sealing structure (270) further comprises a moving piece (271) movably arranged in the cavity (221), and the moving piece (271) is shaped to be matched with the cavity (221); One side of the moving piece (271) is provided with an extrusion surface (2711) corresponding to the pressure receiving surface, and when the moving piece (271) moves in the cavity (221), the extrusion surface (2711) is in contact with and extruded on the pressure receiving surface of the sealing body (273).

4. The patch rotation mechanism of claim 3, wherein, The sealing body (273) is connected to one side of the first connecting piece (220) through a first elastic piece (274); The moving piece (271) is arranged in the cavity (221) through a second elastic piece (272).

5. The patch rotation mechanism of claim 1, wherein, The patch assembly (200) further comprises a pressing structure (260) arranged in the cavity (221); The pressing structure (260) comprises: a pressing plate (261) connected to the bottom end of the second connecting piece (230); a driving piece (262) arranged on one side of the pressing plate (261) facing the inner wall of the cavity (221); a guide piece (263) arranged in the cavity (221) and connected with the first connecting piece (220), the guide piece (263) comprises a guide surface (2631) arranged corresponding to the driving piece (262); when the first connecting piece (220) rotates, the guide surface (2631) can drive the driving piece (262) from the first relative position of the first connecting piece (220) to the second relative position of the first connecting piece (220).

6. The patch rotation mechanism of claim 5, wherein, The rotating assembly (300) comprises a power piece (310), and the second connecting piece (230) is drivingly connected to one side of the power piece (310).

7. A chip mounter characterized by The patch rotating mechanism comprises: a workbench providing a carrier for patch work; a substrate fixing mechanism arranged on one side of the workbench for fixing a substrate to be patched; a transverse moving mechanism arranged at the top end of the workbench for driving the patch rotating mechanism to move along the transverse direction of the workbench; a longitudinal moving mechanism arranged at the top end of the workbench for driving the patch rotating mechanism to move along the longitudinal direction of the workbench.

8. The method of claim 7, wherein the patching of the patch machine is performed by a patching robot. The patch rotating mechanism is driven by the transverse moving mechanism and / or the longitudinal moving mechanism to move along the workbench to the alignment position of the suction accessory (210) corresponding to the substrate to be patched; the suction accessory (210) is driven by the lifting mechanism (700) to move along the longitudinal direction until it is in contact with the top end of the substrate to adsorb the substrate; the suction accessory (210) is driven by the driving assembly to adjust the angle of the substrate to adapt to the patching position of the substrate; the patch rotating mechanism is driven by the transverse moving mechanism and / or the longitudinal moving mechanism to move along the workbench to the alignment position of the suction accessory (210) corresponding to the substrate to be patched; the suction accessory (210) is driven by the lifting mechanism (700) to move along the longitudinal direction until the substrate is in contact with the corresponding patching position of the substrate; ​ The suction accessory (210) continues to be driven by the lifting mechanism (700) until the base material is pressed at the corresponding bonding position of the substrate, at which time the first connecting member (220) moves relative to the second connecting member (230).

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