Defective chip product integration management system and method

Abstract

The invention discloses an integrated management system and method for defective products with chips, and the system comprises a server, a code scanning unit, a defective product integration unit, a printing unit, and a QC unit. The signal output end of the code scanning unit is connected with the signal input end of the server, and the signal output end of the server is connected with the signal input ends of the defective product integration unit, the printing unit and the QC unit. The defective products are integrated through the integration unit, so that a worker can automatically trace all defective product information of a current lot or a customer batch number and display a list, all defective products of the batch or the customer batch number and corresponding rack position information can be inquired, and the work efficiency is improved. The situation that defective product rack position information is manually searched one by one through a system is avoided, and manpower is saved.

Description

Technical Field

[0001] The present invention relates to the field of chip processing technology, and in particular to a defective chip integrated management system and method. Background Art

[0002] When IC chips are packaged and tested, each process may produce some defective products (abnormal functions or appearance). From packaging, testing to packaging and warehousing, there will be dozens of processes, and some auxiliary processes will be involved. Most of the processes will produce defective products. These defective products will be deducted at the current work station and put on the defective product shelf. If the customer requires the defective products produced by all processes of the current batch to be put into the warehouse together, the material clerk needs to search and find the materials one by one through the system, which will take a lot of time and have certain disadvantages, as follows:

[0003] 1. The defective products generated in each process will be deducted and removed at the station and transferred to the defective product station for shelf placement;

[0004] 2. Before each process's defective products are put into storage, they must be searched one by one through the system, and then the materials are found on the corresponding shelves. Searching one by one is too cumbersome and inefficient, and will consume a lot of manpower.

[0005] 3. During packaging, defective products in each process need to be labeled, which consumes a lot of label paper and takes up a lot of employees' time;

[0006] 4. Defective products from each process are packaged and stored separately. Defective products from each process will take up a large amount of packaging materials, resulting in waste of packaging materials and manpower.

[0007] 5. If the defective products are not removed from the current batch, they may be missed in shipment.

[0008] Therefore, we propose a chip defective product integrated management system and method. Summary of the invention

[0009] The purpose of the present invention is to provide a chip defective product integrated management system and method, which solves the problems raised in the background technology.

[0010] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a defective chip product integration management system, including a server, a code scanning unit, a defective product integration unit, a printing unit and a QC unit;

[0011] The signal output end of the code scanning unit is connected to the signal input end of the server, and the signal output end of the server is connected to the signal input ends of the defective product integration unit, the printing unit and the QC unit respectively;

[0012] The server is used to process data, and simultaneously receive and transmit data;

[0013] The barcode scanning unit is used to scan the barcode and then feed back the identification information to the server;

[0014] The defective product integration unit is used to classify and integrate the defective product information, and feed back the integrated defective product information to the server;

[0015] The printing unit is used to print a list of defective products;

[0016] The QC unit is used to inspect defective products.

[0017] As a preferred embodiment of the present invention, the scanning unit includes a first scanning module, a second scanning module and a third scanning module. The first scanning module is used to perform a first scan on defective products before integration, the second scanning module is used to scan and print labels before physical merging, and the third scanning module is used to scan and put defective products into storage after inspection. The first scanning module, the second scanning module and the third scanning module are all scanning guns.

[0018] As a preferred embodiment of the present invention, the defective product integration unit includes an information identification module, an information differentiation module and an information sorting module. The information identification module is used to identify the scanned defective product information, the information differentiation module is used to differentiate different information of defective products, and the information sorting module is used to sort the differentiated defective product information into the same category.

[0019] As a preferred implementation manner of the present invention, the server includes a database, and the database is used to store various data information.

[0020] As a preferred embodiment of the present invention, the printing unit is a label printer.

[0021] The present invention also relates to a chip defective product integrated management method, comprising the following method steps:

[0022] Step 1: The defective lot or customer batch number that needs to be put into storage is scanned and identified by a barcode scanner and fed back to the server, and the defective product integration unit integrates and classifies the defective product information;

[0023] Step 2: Through the computer terminal, all defective product information of the current lot or customer batch number can be traced back and a list will be displayed. The list information includes defective product type, rack position, customer batch number, PTN lot, Device, customer workstation, PTN workstation, total number, defective product Bin, and total number of defective products.

[0024] Step 3: The printer prints out a list of defective products, and the materials are found on the shelf according to the list of defective products;

[0025] Step 4: Merge the ICs physically according to the requirements of different defective products, and scan the barcodes on the defective product list with a barcode scanner, print out defective product labels with a printer, and put them into the anti-static bag accompanying the work order;

[0026] Step 5: Pack the defective products at the packaging station and send them to the QC inspection station. After the QC inspection is OK, open the warehousing system, scan the barcode on the defective product list with a barcode scanner, and scan the defective product information into the system;

[0027] Step 6: After the defective product information enters the system, click on "Enter Warehouse" to complete the system entry. Then use the printer to print the entry list, bind the defective products and the entry list, and hand them over to the warehouse together.

[0028] Compared with the prior art, the present invention has the following beneficial effects:

[0029] The present invention integrates defective products by integrating the units, so that the staff can automatically trace back all the defective product information of the current lot or customer batch number, and display the list, so that all the defective products of this batch or this customer batch number and the corresponding shelf information can be queried, avoiding the manual search for the defective product shelf information one by one through the system, saving manpower;

[0030] Able to print out a list of all defective products, print labels by scanning the barcodes on the list, and classify and print out labels combined according to customer requirements, reducing label waste;

[0031] The same type of defective products from different workstations can be systematically merged, and then physically merged, reducing the waste of packaging materials. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Other features, objects and advantages of the present invention will become more apparent from the detailed description of non-limiting embodiments made with reference to the following drawings:

[0033] Figure 1 This is an operation diagram of an integrated management system for defective chips according to the present invention;

[0034] Figure 2 The present invention is a flowchart of a chip defective product integrated management method. DETAILED DESCRIPTION

[0035] In order to make the technical means, creative features, objectives and effects achieved by the present invention easy to understand, the present invention is further explained below in conjunction with specific implementation methods.

[0036] Example

[0037] A chip defective product integrated management system, comprising:

[0038] A server (100), a code scanning unit (200), a defective product integration unit (300), a printing unit (400) and a QC unit (500);

[0039] The signal output end of the code scanning unit (200) is connected to the signal input end of the server (100), and the signal output end of the server (100) is respectively connected to the signal input ends of the defective product integration unit (300), the printing unit (400) and the QC unit (500);

[0040] The server (100) is used to process data, and simultaneously receive and transmit data;

[0041] The server (100) comprises a database, and the database is used to store various data information;

[0042] The barcode scanning unit (200) is used to scan the barcode and then feed back the identification information to the server (100);

[0043] The code scanning unit (200) comprises a first code scanning module, a second code scanning module and a third code scanning module, wherein the first code scanning module is used to scan the defective products before integration for the first time, the second code scanning module is used to scan and print labels for the physical products before merging, and the third code scanning module is used to scan and store the defective products after inspection, and the first code scanning module, the second code scanning module and the third code scanning module are all code scanning guns;

[0044] The defective product integration unit (300) is used to classify and integrate the defective product information, and feed back the integrated defective product information to the server (100);

[0045] The defective product integration unit (300) comprises an information identification module (310), an information differentiation module (320) and an information sorting module (330), wherein the information identification module 310 is used to identify scanned defective product information, the information differentiation module 320 is used to differentiate different information of defective products, and the information sorting module 330 is used to sort the differentiated defective product information into the same category;

[0046] The printing unit (400) is used to print a list of defective products, and the printing unit (400) is a label printer;

[0047] The QC unit (500) is used to inspect defective products.

[0048] A method for integrated management of defective chips is as follows:

[0049] Step 1: The defective lot or customer batch number to be put into storage is scanned and identified by a barcode scanner and fed back to the server (100), and the defective product integration unit (300) integrates and classifies the defective product information;

[0050] Step 2: Through the computer terminal, all defective product information of the current lot or customer batch number can be traced back and a list will be displayed. The list information includes defective product type, rack position, customer batch number, PTN lot, Device, customer workstation, PTN workstation, total number, defective product Bin, and total number of defective products.

[0051] Step 3: The printer prints out a list of defective products, and the materials are found on the shelf according to the list of defective products;

[0052] Step 4: Merge the ICs physically according to the requirements of different defective products, and scan the barcodes on the defective product list with a barcode scanner, print out defective product labels with a printer, and put them into the anti-static bag accompanying the work order;

[0053] Step 5: Pack the defective products at the packaging station and send them to the QC inspection station. After the QC inspection is OK, open the warehousing system, scan the barcode on the defective product list with a barcode scanner, and scan the defective product information into the system;

[0054] Step 6: After the defective product information enters the system, click on "Enter Warehouse" to complete the system entry. Then use the printer to print the entry list, bind the defective products and the entry list, and hand them over to the warehouse together.

[0055] In summary, the present invention integrates defective products by integrating the units, so that the staff can automatically trace back all the defective product information of the current lot or customer batch number, and display the list, so that all the defective products of this batch or this customer batch number and the corresponding shelf information can be queried, avoiding manual search for the defective product shelf information one by one through the system, saving manpower; it can print out a list of all defective products in the system, and print labels by scanning the barcode on the list, and print out the labels merged according to customer requirements by category, reducing label waste; it can realize the system merging of the same type of defective products in different workstations, and then physically merge them, reducing packaging material waste.

[0056] The above shows and describes the basic principles and main features of the present invention and the advantages of the present invention. It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic features of the present invention. Therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present invention is defined by the appended claims rather than the above description, and it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention.

[0057] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A chip defective product integrated management system, characterized in that: It comprises a server (100), a code scanning unit (200), a defective product integration unit (300), a printing unit (400) and a QC unit (500); The signal output end of the code scanning unit (200) is connected to the signal input end of the server (100), and the signal output end of the server (100) is respectively connected to the signal input ends of the defective product integration unit (300), the printing unit (400) and the QC unit (500); The server (100) is used to process data, and simultaneously receive and transmit data; The barcode scanning unit (200) is used to scan the barcode and then feed back the identification information to the server (100); The defective product integration unit (300) is used to classify and integrate the defective product information, and feed back the integrated defective product information to the server (100); The printing unit (400) is used to print a list of defective products; The QC unit (500) is used to inspect defective products.

2. The chip defective product integrated management system according to claim 1, characterized in that: The code scanning unit (200) comprises a first code scanning module, a second code scanning module and a third code scanning module, wherein the first code scanning module is used for scanning defective products before integration for the first time, the second code scanning module is used for scanning and printing labels before physical objects are merged, and the third code scanning module is used for scanning and warehousing defective products after inspection, and the first code scanning module, the second code scanning module and the third code scanning module are all code scanning guns.

3. The chip defective product integrated management system according to claim 1, characterized in that: The defective product integration unit (300) comprises an information identification module (310), an information differentiation module (320) and an information sorting module (330), wherein the information identification module 310 is used to identify scanned defective product information, the information differentiation module 320 is used to differentiate different information of defective products, and the information sorting module 330 is used to sort the differentiated defective product information into the same category.

4. The integrated management system for defective chips according to claim 1, characterized in that: The server (100) comprises a database, and the database is used to store various data information.

5. The integrated management system for defective chips according to claim 1, characterized in that: The printing unit (400) is a label printer.

6. A chip defective product integrated management method, applicable to the chip defective product integrated management system of claims 1-5, characterized in that: The method comprises the following steps: Step 1: The defective lot or customer batch number to be put into storage is scanned and identified by a barcode scanner and fed back to the server (100), and the defective product integration unit (300) integrates and classifies the defective product information; Step 2: Through the computer terminal, all defective product information of the current lot or customer batch number can be traced back and a list will be displayed. The list information includes defective product type, rack position, customer batch number, PTN lot, Device, customer workstation, PTN workstation, total number, defective product Bin, and total number of defective products. Step 3: The printer prints out a list of defective products, and the materials are found on the shelf according to the list of defective products; Step 4: Merge the ICs physically according to the requirements of different defective products, and scan the barcodes on the defective product list with a barcode scanner, print out defective product labels with a printer, and put them into the anti-static bag accompanying the work order; Step 5: Pack the defective products at the packaging station and send them to the QC inspection station. After the QC inspection is OK, open the warehousing system, scan the barcode on the defective product list with a barcode scanner, and scan the defective product information into the system; Step 6: After the defective product information enters the system, click on "Enter Warehouse" to complete the system entry. Then use the printer to print the entry list, bind the defective products and the entry list, and hand them over to the warehouse together.

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