A semiconductor chip packaging structure and packaging process thereof

Abstract

The present invention discloses a semiconductor chip packaging structure and packaging process in the field of chip production technology. A robot is equipped with multiple vacuum adsorption machines, and cooperates with a first positioning mechanism for fine-tuning the position of the vacuum adsorption machines, so that the robot can move between a welding device and a wafer disk once, and can absorb wafers corresponding to the number of mounting slots on the base at one time. After the mounting slots on the base are filled and the base on the welding device is replaced, the robot moves between the welding device and the wafer disk to replenish the wafers on the vacuum adsorption machine, so that the equipment operation is more consistent, the unnecessary displacement of the robot is reduced, the working efficiency of the welding device can be effectively utilized, and the working efficiency of the equipment can be effectively improved.

Description

Technical Field

[0001] The present invention relates to the technical field of chip production, and in particular to a packaging structure of a semiconductor chip and a packaging process thereof. Background Art

[0002] The packaging of semiconductor chips is done by using a vacuum adsorption machine to suck the wafer from the wafer tray. The vacuum adsorption machine then places the wafer with high positioning accuracy on the predetermined welding position on the base. The wafer and the base are then welded together using a welding device. Finally, after processes such as plastic wrapping and segmentation, the packaged chip is obtained.

[0003] The traditional welding process requires a robotic arm to control a vacuum adsorption machine to complete the actions of wafer suction, wafer placement, and wafer welding between the wafer tray and the welding device. During this process, in order to ensure the positioning accuracy of the wafer, the vacuum adsorption machine can only complete the welding of one wafer at a time. This means that a large amount of work travel of the equipment is wasted on the repeated transportation between the wafer tray and the welding device, which reduces the equipment's working efficiency. Summary of the Invention

[0004] The purpose of the present invention is to provide a packaging structure and packaging process of a semiconductor chip to solve the problem that the traditional welding process proposed in the above background technology requires a vacuum adsorption machine to be controlled by a robotic arm to complete the actions of wafer suction-wafer placement-wafer welding between the wafer disk and the welding device. During this process, in order to ensure the positioning accuracy of the wafer, the vacuum adsorption machine can only complete the welding of one wafer at a time, which causes a large amount of work stroke of the equipment to be wasted in the repeated transportation between the wafer disk and the welding device, thereby reducing the working efficiency of the equipment.

[0005] To achieve the above-mentioned objectives, the present invention provides the following technical solutions: a packaging structure for a semiconductor chip and a packaging process thereof, comprising a supporting mechanism, a welding device, a manipulator, a wafer disk and a base, wherein the welding device and the manipulator are both arranged at the upper end of the supporting mechanism, the base is fixedly clamped on the welding device, the upper end of the base is provided with mounting slots arranged in an array, a plurality of wafers are placed on the upper end of the wafer disk, and a mounting plate is further included, the mounting plate is fixedly connected to the manipulator, a driving mechanism is provided on the mounting plate, the driving mechanism is provided with vacuum adsorption machines distributed in a circular array with the same number as the mounting slots, the mounting plate is provided with a first positioning mechanism, the driving mechanism is used to control the multiple vacuum adsorption machines to circulate to the first positioning mechanism, and the first positioning mechanism is used to fine-tune the position of the vacuum adsorption machine.

[0006] As a further solution of the present invention, the driving mechanism includes a driving motor, which is fixedly connected to the upper end of the mounting plate, and an output shaft is provided at the lower end of the mounting plate, wherein the output shaft vertically penetrates the mounting plate and is transmission-connected to the driving motor, and the side wall of the output shaft is fixedly connected to a first sleeve, and the side wall of the first sleeve is fixedly connected to a driving telescopic rod distributed in a circumferential array with the same number as the vacuum adsorption machine along the radial direction of the first sleeve, and the driving telescopic rod has a built-in driving unit for controlling the extension and retraction of the driving telescopic rod, the side wall of the output shaft is fixedly connected to a second sleeve above the first sleeve, and the side wall of the second sleeve is fixedly connected to a first elastic telescopic rod distributed in a circumferential array with the same number as the vacuum adsorption machine along the radial direction of the second sleeve; the first elastic telescopic rods are respectively located at the angular bisector position of two adjacent driving telescopic rods, and the ends of the first elastic telescopic rods are all rotatably connected to horizontally arranged transmission wheels, and multiple transmission wheels are commonly transmission-connected to a transmission belt, one of the transmission wheels is externally connected to a driving device, and the ends of the driving telescopic rods are all fixedly connected to a tensioning mechanism, and the tensioning mechanism engages the transmission belt; the vacuum adsorption machine is fixedly connected to the lower end of the transmission belt.

[0007] As a further solution of the present invention, the tensioning mechanism includes a connecting block, the lower end of the connecting block is fixedly connected to a connecting plate, and the lower end of the connecting plate is rotatably connected to the side close to and away from the output shaft with tensioning wheels, and the tensioning wheels are respectively located on the inner and outer side walls of the transmission belt.

[0008] As a further solution of the present invention, the first positioning mechanism includes a slide groove vertically penetrating the mounting plate along the radial direction of the output shaft, the slide groove is slidably connected to a built-in driven positioning device, the lower end of the positioning device is transmission-connected to a positioning plate near the output shaft, the positioning device can control the vertical displacement of the positioning plate and can adjust the horizontal position of the positioning plate with high precision, and the lower end of the positioning plate is vertically fixedly connected to two positioning pins; the upper end of the vacuum adsorption machine is fixedly connected to a positioning block, the upper end of the positioning block is vertically provided with two pin holes away from the output shaft, the two pin holes can be engaged with two positioning pins, the upper end of the positioning block is connected to a shifting mechanism, the shifting mechanism is connected to the lower end of the transmission belt, and the shifting mechanism can cause the vacuum adsorption machine to be displaced in the horizontal direction relative to the transmission belt;

[0009] The shifting mechanism includes a connecting rod, the upper end of the connecting rod is fixedly connected to the lower end of the transmission belt, the lower end of the connecting rod is vertically fixedly connected to a connecting shell, the lower end of the connecting shell is provided with a through hole, a first connecting column is vertically arranged in the through hole, the side wall of the first connecting column is fixedly connected to a limiting ring, the limiting ring is fitted with the inner wall of the bottom of the connecting shell, the first connecting column is fixedly connected to four second elastic telescopic rods distributed in a circular array, the second elastic telescopic rod is fixedly connected to the inner side wall of the connecting shell, the lower end of the first connecting column is fixedly connected to a torsion plate, the lower end of the torsion plate is elastically rotatably connected to the second connecting column, and the lower end of the second connecting column is fixedly connected to the upper end of the positioning block.

[0010] As a further solution of the present invention, it also includes a second positioning mechanism, which includes a third sleeve. The third sleeve is fixedly connected to the side wall of the output shaft and is located at the lower end of the second sleeve. The side wall of the third sleeve is located below the six first elastic telescopic rods and is fixedly connected to a Y-shaped block. The opening direction of the Y-shaped block is away from the output shaft, and the positioning block is chamfered on the side close to the output shaft. The deepest end of the opening of the Y-shaped block can engage with the chamfered end of the positioning block.

[0011] A semiconductor chip packaging process, the process is as follows:

[0012] S1, the robot drives the mounting plate to move above the wafer plate, and cooperates with the first positioning mechanism to make all vacuum adsorption machines pick up a wafer;

[0013] S2. The robot then drives the mounting plate to move above the welding device and cooperates with the first positioning mechanism to place the wafers sucked by the vacuum adsorption machine into the respective mounting slots on the base for welding;

[0014] S3. Finally, the robot drives the mounting plate to move above the wafer disc and replaces the welded base in the welding device.

[0015] Compared with the prior art, the present invention has the following beneficial effects:

[0016] 1. The present invention uses a manipulator equipped with multiple vacuum adsorption machines, and cooperates with a first positioning mechanism for fine-tuning the position of the vacuum adsorption machine, so that the manipulator can absorb the wafers corresponding to the number of mounting slots on the base at one time by moving between the welding device and the wafer disk once. After the mounting slots on the base are filled and the base on the welding device is replaced, the manipulator moves between the welding device and the wafer disk to replenish the wafers on the vacuum adsorption machine, making the equipment more consistent, reducing unnecessary displacement of the manipulator, and effectively utilizing the working efficiency of the welding device, thereby effectively improving the working efficiency of the equipment.

[0017] 2. The present invention changes the movement mode and movement path of the vacuum adsorption machine by converging or dispersing multiple vacuum adsorption machines toward the output shaft, and then adapts to the working mode above the wafer or base respectively, so that the equipment can effectively improve the working efficiency while ensuring normal operation.

[0018] 3. The present invention completes the one-time positioning of multiple vacuum adsorption machines through an independent positioning device in conjunction with multiple vacuum adsorption machines, and integrates the positioning device with each vacuum adsorption machine through pin connection, so that the positioning device controls the vacuum adsorption machine to complete high-precision displacement, thereby effectively improving the stability and processing accuracy of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0020] Figure 2 for Figure 1 A schematic diagram of the structure at center A;

[0021] Figure 3 It is a structural diagram of the driving mechanism and the vacuum adsorption machine;

[0022] Figure 4 for Figure 3 Schematic diagram of the structure without the mounting plate;

[0023] Figure 5 It is a structural diagram of a vacuum adsorption machine and its associated components;

[0024] Figure 6 for Figure 5 Schematic diagram of the front cross-section structure;

[0025] Figure 7 is a structural diagram of a positioning device;

[0026] Figure 8 It is a schematic diagram of the process flow of the present invention.

[0027] In the accompanying drawings, the components represented by the reference numerals are as follows:

[0028] Support mechanism 11, welding device 12, manipulator 13, wafer disk 14, base 15, mounting groove 16, wafer 17, mounting plate 18, vacuum adsorption machine 19, drive motor 21, output shaft 22, first sleeve 23, drive telescopic rod 24, second sleeve 25, first elastic telescopic rod 26, transmission wheel 27, transmission belt 28, connecting block 31, connecting plate 32, tensioning pulley 33, slide groove 41, positioning device 42, positioning plate 43, positioning pin 44, positioning block 45, connecting rod 46, connecting shell 47, through hole 48, first connecting column 49, limiting ring 410, second elastic telescopic rod 411, torsion plate 412, second connecting column 413, pin hole 414, third sleeve 51, Y-shaped block 52. DETAILED DESCRIPTION

[0029] See also Figure 1-8 The present invention provides a technical solution: a packaging structure of a semiconductor chip and a packaging process thereof, comprising a supporting mechanism 11, a welding device 12, a manipulator 13, a wafer disk 14 and a base 15, wherein the welding device 12 and the manipulator 13 are both arranged at the upper end of the supporting mechanism 11, the base 15 is fixedly clamped on the welding device 12, the upper end of the base 15 is provided with mounting grooves 16 arranged in an array, a plurality of wafers 17 are placed on the upper end of the wafer disk 14, and further comprising a mounting plate 18, the mounting plate 18 is fixedly connected to the manipulator 13, a driving mechanism is provided on the mounting plate 18, the driving mechanism is provided with vacuum adsorption machines 19 distributed in a circumferential array with the same number as the mounting grooves 16, the mounting plate 18 is provided with a first positioning mechanism, the driving mechanism is used to control the plurality of vacuum adsorption machines 19 to circulate to the first positioning mechanism, and the first positioning mechanism is used to fine-tune the position of the vacuum adsorption machine 19.

[0030] The driving mechanism controls a vacuum adsorption machine 19 to arrive at the first positioning mechanism, and then the manipulator 13 drives the vacuum adsorption machine 19 at the first positioning mechanism to reach above one of the wafers 17 on the wafer disk 14 by controlling the movement of the mounting plate 18. Then, the position of the vacuum adsorption machine 19 is fine-tuned by the first positioning mechanism, so that the vacuum adsorption machine 19 is aligned with the position of the wafer 17. The vacuum adsorption machine 19 moves downward and absorbs the wafer 17. Then, the driving mechanism controls the next vacuum adsorption machine 19 to arrive at the first positioning mechanism and absorb the wafer 17. This cycle repeats until all the vacuum adsorption machines 19 absorb one wafer 17. Then the manipulator 13 drives the mounting plate 18 to move to the welding mounting mechanism. The first positioning mechanism is used to place the wafers 17 sucked by the vacuum adsorption machine 19 in the respective mounting grooves 16 on the base 15. During this process, the vacuum adsorption machine 19 at the first positioning mechanism places the sucked wafer 17 in a mounting groove 16 on the base 15. Then the driving mechanism controls the next vacuum adsorption machine 19 to move to the first positioning mechanism. At the same time, the welding device 12 welds the mounting groove 16 where the wafer 17 has been placed, so that the wafer 17 and the mounting groove 16 are welded and fixed to each other. Then the welding device 12 controls the base 15 to move horizontally, thereby moving the next mounting groove 16 on the base 15 to the position of the mounting groove 16 where the previous wafer 17 has been placed to wait for the placement of the wafer 17.

[0031] The present invention uses a robot 13 equipped with multiple vacuum adsorption machines 19, and cooperates with a first positioning mechanism for fine-tuning the position of the vacuum adsorption machine 19, so that the robot 13 can absorb the number of wafers 17 corresponding to the mounting grooves 16 on the base 15 at one time by moving between the welding device 12 and the wafer disk 14 once, and after the mounting grooves 16 on the base 15 are filled and the base 15 on the welding device 12 is replaced, the robot 13 moves between the welding device 12 and the wafer disk 14 to replenish the wafers 17 on the vacuum adsorption machine 19, so that the equipment operation is more consistent, the unnecessary displacement of the robot 13 is reduced, the working efficiency of the welding device 12 can be effectively utilized, and the working efficiency of the equipment can be effectively improved.

[0032] As a further solution of the present invention, the driving mechanism includes a driving motor 21, which is fixedly connected to the upper end of the mounting plate 18, and an output shaft 22 is provided at the lower end of the mounting plate 18. The output shaft 22 vertically penetrates the mounting plate 18 and is transmission-connected to the driving motor 21. The side wall of the output shaft 22 is fixedly connected to a first sleeve 23, and the side wall of the first sleeve 23 is fixedly connected to a driving telescopic rod 24 distributed in a circumferential array with the same number as the vacuum adsorption machine 19 along the radial direction of the first sleeve 23. The driving telescopic rod 24 has a built-in driving unit for controlling the extension and retraction of the driving telescopic rod 24. The side wall of the output shaft 22 is located above the first sleeve 23 and is fixedly connected to the first sleeve 23. Second sleeve 25, the side wall of the second sleeve 25 is fixedly connected along the radial direction of the second sleeve 25 with the same number of first elastic telescopic rods 26 distributed in a circular array as the vacuum adsorption machine 19; the first elastic telescopic rods 26 are respectively located at the angular bisector positions of two adjacent driving telescopic rods 24, and the ends of the first elastic telescopic rods 26 are rotatably connected to horizontally arranged transmission wheels 27, and multiple transmission wheels 27 are jointly connected to a transmission belt 28, one of which is externally connected to a driving device, and the ends of the driving telescopic rods 24 are fixedly connected to a tensioning mechanism, and the tensioning mechanism engages the transmission belt 28; the vacuum adsorption machine 19 is fixedly connected to the lower end of the transmission belt 28.

[0033] When the vacuum adsorption machine 19 is ready to absorb the wafer 17 above the wafer disk 14, the driving device first controls each vacuum adsorption machine 19 to move to the end position of each first elastic telescopic rod 26 through the transmission belt 28, and then multiple driving telescopic rods 24 are synchronously contracted, and the tensioning mechanism drives the engagement point of the transmission belt 28 with the tensioning mechanism to move toward the output shaft 22, and then the transmission belt 28 will pull each transmission wheel 27 toward the output shaft 22 and compress the first elastic telescopic rod 26. At this time, each vacuum adsorption machine 19 is closed toward the output shaft 22, and finally the driving motor 21 controls the output shaft 22 to rotate, further driving each vacuum adsorption machine 19 to rotate around the output shaft 22, so that each vacuum adsorption machine 19 can quickly complete the position switching relative to the transmission belt 28 drive mode, so that after one vacuum adsorption machine 19 completes the adsorption of the wafer 17, the next vacuum adsorption machine 19 can quickly reach the first fixed position. The wafer 17 is adsorbed at the positioning mechanism; when the vacuum adsorption machine 19 is ready to place the wafer 17 in the mounting groove 16 on the upper direction of the base 15, multiple driving telescopic rods 24 are extended synchronously, and at the same time, the first elastic telescopic rod 26 is extended under the action of elastic force. At this time, the transmission belt 28 is a regular polygon, and then the driving device drives the transmission belt 28 to move, so that multiple vacuum adsorption machines 19 pass through the first positioning mechanism in turn along the trajectory of the transmission belt 28 to place the wafer 17. During this process, since there are welding guns, clamps and other structures on the welding device 12, the way the vacuum adsorption machine 19 moves along the trajectory of the transmission belt 28 can enable the vacuum adsorption machine 19 to effectively avoid the relevant components on the welding device 12. At the same time, in the process of the vacuum adsorption machine 19 reaching the first positioning mechanism along the trajectory of the transmission belt 28, time can be provided for the welding work of the welding device 12, so that the equipment will not reduce the working efficiency due to the decrease in the position change speed of the vacuum adsorption machine 19.

[0034] The present invention changes the movement mode and movement path of the vacuum adsorption machine 19 by gathering or dispersing multiple vacuum adsorption machines 19 toward the output shaft 22, and then adapts to the working mode above the wafer 17 or the base 15 respectively, so that the equipment can effectively improve the working efficiency while ensuring normal operation.

[0035] As a further solution of the present invention, the tensioning mechanism includes a connecting block 31, the lower end of the connecting block 31 is fixedly connected to a connecting plate 32, and the lower end of the connecting plate 32 is rotatably connected to the side close to and away from the output shaft 22 with a tensioning wheel 33, and the tensioning wheel 33 is respectively located at the inner and outer side walls of the transmission belt 28.

[0036] As a further solution of the present invention, the first positioning mechanism includes a slide groove 41 that vertically penetrates the mounting plate 18 along the radial direction of the output shaft 22, and a built-in driven positioning device 42 is slidably connected in the slide groove 41, and the lower end of the positioning device 42 is transmission-connected to a positioning plate 43 near the output shaft 22. The positioning device 42 can control the vertical displacement of the positioning plate 43 and can adjust the horizontal position of the positioning plate 43 with high precision, and the lower end of the positioning plate 43 is vertically fixedly connected to two positioning pins 44; the upper end of the vacuum adsorption machine 19 is fixedly connected to a positioning block 45, and the upper end of the positioning block 45 is vertically provided with two pin holes 414 on the side away from the output shaft 22. The two pin holes 414 can be engaged with the two positioning pins 44. The upper end of the positioning block 45 is connected to a displacement mechanism, and the displacement mechanism is connected to the lower end of the transmission belt 28. The displacement mechanism can cause the vacuum adsorption machine 19 to be displaced horizontally relative to the transmission belt 28;

[0037] The shifting mechanism includes a connecting rod 46, the upper end of which is fixedly connected to the lower end of the transmission belt 28, and the lower end of the connecting rod 46 is vertically fixedly connected to a connecting shell 47. A through hole 48 is provided at the lower end of the connecting shell 47, and a first connecting column 49 is vertically arranged in the through hole 48. The side wall of the first connecting column 49 is fixedly connected to a limiting ring 410, and the limiting ring 410 is fitted with the inner wall of the bottom of the connecting shell 47. The first connecting column 49 is fixedly connected to four second elastic telescopic rods 411 distributed in a circular array, and the second elastic telescopic rods 411 are fixedly connected to the inner wall of the connecting shell 47. The lower end of the first connecting column 49 is fixedly connected to a torsion plate 412, and the lower end of the torsion plate 412 is elastically rotatably connected to the second connecting column 413, and the lower end of the second connecting column 413 is fixedly connected to the upper end of the positioning block 45.

[0038] The vacuum adsorption machine 19 is first moved to the positioning plate 43 by the driving device or driving motor 21, and the corresponding positioning block 45 reaches the bottom of the positioning plate 43, and then the positioning plate 43 is driven downward by the positioning device 42, so that the positioning pin 44 at the lower end of the positioning plate 43 is inserted into the pin hole 414 at the upper end of the positioning block 45. During the insertion process, the first connecting column 49 overcomes the elastic force of the second elastic telescopic rod 411 and performs horizontal displacement relative to the connecting shell 47, thereby completing the position correction of the vacuum adsorption machine 19 relative to the positioning plate 43, so that the positioning device 42 drives the vacuum adsorption machine 19 through the positioning plate 43 to complete high-precision displacement in the horizontal plane, so that the vacuum adsorption machine 19 can be accurately aligned with the mounting slot 16 or the wafer 17.

[0039] The present invention completes the one-time positioning of multiple vacuum adsorption machines 19 through an independent positioning device 42 in conjunction with multiple vacuum adsorption machines 19, and integrates the positioning device 42 with each vacuum adsorption machine 19 through pin connection, so that the positioning device 42 controls the vacuum adsorption machine 19 to complete high-precision displacement, thereby effectively improving the stability and processing accuracy of the equipment.

[0040] As a further solution of the present invention, it also includes a second positioning mechanism, which includes a third sleeve 51. The third sleeve 51 is fixedly connected to the side wall of the output shaft 22 and is located at the lower end of the second sleeve 25. The side wall of the third sleeve 51 is located below the six first elastic telescopic rods 26 and is fixedly connected to a Y-shaped block 52. The opening direction of the Y-shaped block 52 is away from the output shaft 22. The positioning block 45 is chamfered on the side close to the output shaft 22. The deepest end of the opening of the Y-shaped block 52 can engage with the chamfered end of the positioning block 45.

[0041] During the closing process of the vacuum adsorption machine 19, the vacuum adsorption machine 19 first reaches the end of the first elastic telescopic rod 26 through the movement of the transmission belt 28, and then during the closing process, the positioning block 45 at the upper end of the vacuum adsorption machine 19 will enter the opening of the Y-shaped block 52 and engage with the deepest part of the opening of the Y-shaped block 52, thereby adjusting the angle and position of the vacuum adsorption machine 19 and the positioning block 45, thereby ensuring that the positioning block 45 can engage with the positioning plate 43.

[0042] A semiconductor chip packaging process, the process is as follows:

[0043] S1, the robot 13 drives the mounting plate 18 to move above the wafer plate 14, and cooperates with the first positioning mechanism to make all the vacuum adsorption machines 19 pick up a wafer 17;

[0044] S2. Then the robot 13 drives the mounting plate 18 to move above the welding device 12, and cooperates with the first positioning mechanism to place the wafers 17 sucked by the vacuum adsorption machine 19 into the respective mounting grooves 16 on the base 15 and weld them;

[0045] S3 , finally the robot arm 13 drives the mounting plate 18 to move above the wafer disc 14 , and at the same time replaces the welded base 15 in the welding device 12 .

Claims

1. A semiconductor chip packaging structure and packaging process thereof, comprising a support mechanism (11), a welding device (12), a manipulator (13), a wafer plate (14) and a base (15), wherein the welding device (12) and the manipulator (13) are both arranged at the upper end of the support mechanism (11), the base (15) is fixedly clamped on the welding device (12), the upper end of the base (15) is provided with mounting grooves (16) arranged in an array, and a plurality of wafers (17) are placed at the upper end of the wafer plate (14), characterized in that: The invention comprises a mounting plate (18), wherein the mounting plate (18) is fixedly connected to the manipulator (13), a driving mechanism is provided on the mounting plate (18), and vacuum adsorption machines (19) are provided on the driving mechanism, the number of which is the same as that of the mounting slots (16) and distributed in a circumferential array, and the mounting plate (18) is provided with a first positioning mechanism, wherein the driving mechanism is used to control the plurality of vacuum adsorption machines (19) to circulate to the first positioning mechanism, and the first positioning mechanism is used to fine-tune the position of the vacuum adsorption machine (19); The driving mechanism comprises a driving motor (21), the driving motor (21) being fixedly connected to the upper end of the mounting plate (18), the lower end of the mounting plate (18) being provided with an output shaft (22), the output shaft (22) vertically passing through the mounting plate (18) and being transmission-connected to the driving motor (21), the side wall of the output shaft (22) being fixedly connected to a second sleeve (25), the side wall of the second sleeve (25) being fixedly connected along the radial direction of the second sleeve (25) with a number of first elastic telescopic rods (26) distributed in a circumferential array, the same number as the number of vacuum adsorption machines (19); the ends of the first elastic telescopic rods (26) are all rotationally connected to horizontally arranged transmission wheels (27), one of the transmission wheels (27) being externally connected to a driving device, the plurality of transmission wheels (27) being commonly transmission-connected to a transmission belt (28), and the vacuum adsorption machine (19) being fixedly connected to the lower end of the transmission belt (28); The first positioning mechanism comprises a slide groove (41) vertically penetrating the mounting plate (18) along the radial direction of the output shaft (22), a built-in driven positioning device (42) is slidably connected in the slide groove (41), a positioning plate (43) is transmission-connected to the lower end of the positioning device (42) near the side of the output shaft (22), the positioning device (42) can control the vertical displacement of the positioning plate (43) and can adjust the horizontal position of the positioning plate (43) with high precision, and the lower end of the positioning plate (43) is vertically fixedly connected to two Positioning pin (44); the upper end of the vacuum adsorption machine (19) is fixedly connected to a positioning block (45); the upper end of the positioning block (45) is vertically provided with two pin holes (414) on a side away from the output shaft (22); the two pin holes (414) can be engaged with the two positioning pins (44); the upper end of the positioning block (45) is connected to a displacement mechanism, the displacement mechanism is connected to the lower end of the transmission belt (28), and the displacement mechanism can cause the vacuum adsorption machine (19) to be displaced in the horizontal direction relative to the transmission belt (28); The shifting mechanism includes a connecting rod (46), the upper end of the connecting rod (46) is fixedly connected to the lower end of the transmission belt (28), the lower end of the connecting rod (46) is vertically fixedly connected to a connecting shell (47), a through hole (48) is provided at the lower end of the connecting shell (47), a first connecting column (49) is vertically arranged in the through hole (48), the side wall of the first connecting column (49) is fixedly connected to a limiting ring (410), and the limiting ring (410) is fixedly connected to the bottom of the connecting shell (47). The inner wall is fitted, the first connecting column (49) is fixedly connected to four second elastic telescopic rods (411) distributed in a circumferential array, the second elastic telescopic rods (411) are fixedly connected to the inner wall of the connecting shell (47), the lower end of the first connecting column (49) is fixedly connected to the torsion plate (412), the lower end of the torsion plate (412) is elastically rotatably connected to the second connecting column (413), and the lower end of the second connecting column (413) is fixedly connected to the upper end of the positioning block (45).

2. The semiconductor chip packaging structure and packaging process according to claim 1, wherein: The driving mechanism further comprises a first sleeve (23), the first sleeve (23) being fixedly connected to the side wall of the output shaft (22) and being located at the upper end of the second sleeve (25), the side wall of the first sleeve (23) being fixedly connected along the radial direction of the first sleeve (23) with driving telescopic rods (24) whose number is the same as that of the vacuum adsorption machine (19) and distributed in a circumferential array, the driving telescopic rods (24) being built with driving units for controlling the telescopic movement of the driving telescopic rods (24), the driving telescopic rods (24) being respectively located at the angle bisector positions of two adjacent first elastic telescopic rods (26), the ends of the driving telescopic rods (24) being fixedly connected with tensioning mechanisms, the tensioning mechanisms being engaged with the transmission belt (28).

3. The semiconductor chip packaging structure and packaging process according to claim 2, characterized in that: The tensioning mechanism comprises a connecting block (31), the lower end of the connecting block (31) is fixedly connected to a connecting plate (32), and the lower end of the connecting plate (32) is rotatably connected to a tensioning wheel (33) on one side close to and away from the output shaft (22), and the tensioning wheel (33) is respectively located at the inner and outer side walls of the transmission belt (28).

4. The semiconductor chip packaging structure and packaging process according to claim 1, wherein: The invention also includes a second positioning mechanism, wherein the second positioning mechanism includes a third sleeve (51), the third sleeve (51) is fixedly connected to the side wall of the output shaft (22) and is located at the lower end of the second sleeve (25), the side wall of the third sleeve (51) is located below the six first elastic telescopic rods (26) and is fixedly connected to a Y-shaped block (52), the opening direction of the Y-shaped block (52) is away from the output shaft (22), the positioning block (45) is provided with a chamfer on the side close to the output shaft (22), and the deepest part of the opening of the Y-shaped block (52) can engage with one end of the positioning block (45) with the chamfer.

5. A semiconductor chip packaging process, applicable to the semiconductor chip packaging structure according to any one of claims 1 to 4, characterized in that: The process is as follows: S1, the robot (13) drives the mounting plate (18) to move above the wafer disk (14), and cooperates with the first positioning mechanism to make all the vacuum adsorption machines (19) absorb one wafer (17); S2, the robot (13) then drives the mounting plate (18) to move above the welding device (12), and cooperates with the first positioning mechanism to place the wafers (17) sucked by the vacuum adsorption machine (19) into the respective mounting grooves (16) on the base (15) and weld them; S3. Finally, the robot (13) drives the mounting plate (18) to move above the wafer disc (14), and at the same time replaces the welded base (15) in the welding device (12).

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