Electronic package and fabrication method thereof

Abstract

The invention relates to an electronic package and a method of fabricating the same, including disposing a support structure having a support on a carrier structure to contact or approach an electronic component, and disposing a barrier structure on the support to expose the electronic component through an opening of the barrier structure. Furthermore, a heat conducting layer is formed on the electronic component exposed out of the opening of the blocking structure, so that the heat conducting layer on the electronic component is blocked or surrounded by the blocking structure, and the heat conducting layer is prevented from overflowing.

Description

Technical Field

[0001] The present invention relates to a packaging structure, in particular to an electronic packaging component with a barrier structure and a manufacturing method thereof. Background Art

[0002] As the demand for electronic products in terms of functions and processing speed increases, semiconductor chips, as the core components of electronic products, need to have higher density electronic components and electronic circuits. Therefore, semiconductor chips will generate more heat energy during operation.

[0003] In order to quickly dissipate the heat energy generated by the semiconductor chip to the outside, the industry usually configures a heat sink or heat spreader in the semiconductor package to combine the heat sink with the non-active surface of the semiconductor chip through a thermal interface material (TIM) layer, and expose the top sheet of the heat sink to the packaging colloid or directly to the atmosphere, so as to dissipate the heat generated by the semiconductor chip through the thermal interface material (TIM) layer and the heat sink.

[0004] like Figure 1 As shown, in the manufacturing method of the conventional semiconductor package 1, a semiconductor chip 11 is firstly disposed on a package substrate 10 with its active surface 11a by flip chip bonding (i.e., through conductive bumps 111 and bottom glue 112), and then a heat sink 13 is bonded to the inactive surface 11b of the semiconductor chip 11 with its top sheet 131 through a thermal interface material (TIM) layer 12, and the supporting legs 132 of the heat sink 13 are disposed on the package substrate 10 through an adhesive layer 14. Next, a package molding operation is performed so that a packaging gel (not shown) covers the semiconductor chip 11 and the heat sink 13, and the top sheet 131 of the heat sink 13 is exposed to the outside of the packaging gel.

[0005] When the semiconductor package 1 is in operation, heat energy generated by the semiconductor chip 11 is conducted to the top plate 131 of the heat sink 13 through the inactive surface 11 b of the semiconductor chip 11 and the thermal interface material (TIM) layer 12 to be dissipated to the outside of the semiconductor package 1 .

[0006] However, in the conventional semiconductor package 1, the thermal interface material (TIM) layer 12 becomes liquid and fluid after being melted at high temperature during the reflow operation. Therefore, the thermal interface material (TIM) layer 12 cannot be fixed on the non-active surface 11b of the semiconductor chip 11 and has an overflow problem. As a result, the thermal interface material (TIM) layer 12 overflows in the overflow direction 15 (e.g., from top to bottom) to the side surface of the semiconductor chip 11, the bottom glue 112, and the components (not shown) on the package substrate 10, causing adverse effects (e.g., electrical short circuit).

[0007] Furthermore, if a colloid (such as an insulating colloid) is used to directly surround the liquid or fluid TIM layer 12, a problem of being unable to vent will occur, resulting in bubbles or gas (such as air) in the TIM layer 12 surrounded by the colloid (such as an insulating colloid) being unable to be discharged to the outside.

[0008] Therefore, how to overcome the above-mentioned problems of the prior art has become a difficult problem that needs to be overcome urgently in the industry. Summary of the invention

[0009] In view of the various deficiencies of the above-mentioned prior art, the present invention provides an electronic package, comprising: a supporting structure; an electronic component, disposed on the supporting structure; a supporting structure having a supporting body, disposed on the supporting structure, and the supporting body of the supporting structure contacts or is close to the electronic component; a barrier structure having an opening, disposed on the supporting body of the supporting structure, and the opening of the barrier structure exposes the electronic component; and a heat-conducting layer, formed on the electronic component exposed by the opening of the barrier structure, so as to block or surround the heat-conducting layer on the electronic component through the barrier structure.

[0010] The present invention also provides a method for manufacturing an electronic package, comprising: disposing an electronic component on a supporting structure; disposing a supporting structure having a supporting body on the supporting structure, and the supporting body of the supporting structure contacts or is close to the electronic component; disposing a barrier structure having an opening on the supporting body of the supporting structure, and the opening of the barrier structure exposes the electronic component; and disposing a heat-conducting layer on the electronic component exposed by the opening of the barrier structure, so as to block or surround the heat-conducting layer on the electronic component through the barrier structure.

[0011] In the aforementioned electronic package and its manufacturing method, the support structure may also have at least one support leg, and the support leg of the support structure extends downward from the edge of the support body to be combined with the bearing structure. The support structure may be a heat dissipation structure, and the support body of the support structure is composed of heat dissipation material.

[0012] In the aforementioned electronic package and method for manufacturing the same, the barrier structure may also have an exhaust channel, and the exhaust channel is arranged outside the distribution area of ​​the electronic components. The exhaust channel of the barrier structure has an exhaust port and an outlet at both ends, and the exhaust port of the exhaust channel is connected to the opening and the outlet respectively. The exhaust channel of the barrier structure includes at least one bend, and the width of the exhaust channel of the barrier structure is at least 1 cm.

[0013] In the aforementioned electronic package and its manufacturing method, the heat conducting layer may be liquid metal, so as to block or surround the liquid metal on the electronic component through the opening of the barrier structure.

[0014] In the aforementioned electronic package and its manufacturing method, the electronic package may also include a barrier. There is a gap between the electronic component and the support of the support structure, and the barrier is formed in the gap between the electronic component and the support of the support structure to block the heat-conducting layer. The barrier surrounds the side of the electronic component, and the barrier and the barrier structure jointly block the heat-conducting layer on the electronic component.

[0015] In the aforementioned electronic package and its manufacturing method, the electronic package may also include a heat sink disposed on the barrier structure and the heat conductive layer, and the heat conductive layer is located between the electronic component and the heat sink.

[0016] As can be seen from the above, in the electronic package and the manufacturing method thereof of the present invention, a barrier structure with an opening is mainly arranged on a support body of a support structure, and a heat-conducting layer (such as liquid metal) is formed on the electronic components exposed by the openings of the barrier structure, so as to effectively block or surround the heat-conducting layer on the electronic components through the barrier structure to prevent overflow.

[0017] At the same time, the exhaust channel of the barrier structure of the present invention can surround the distribution area of ​​the heat-conducting layer (such as liquid metal), and the exhaust channel has an exhaust function to effectively exhaust bubbles or gases (such as air) at the opening of the barrier structure or the heat-conducting layer.

[0018] Furthermore, the barrier body and the barrier structure of the present invention can jointly block the heat-conducting layer on the electronic component, so as to prevent the heat-conducting layer from overflowing to the component on the supporting structure and avoid causing adverse effects (such as electrical short circuit).

[0019] In addition, the heat sink of the present invention can be arranged on (pressed on) the barrier structure and the thermal conductive layer to facilitate the rapid dissipation of heat generated by the electronic components through the heat sink, and can also effectively discharge bubbles or gases (such as air) at the opening of the barrier structure or the thermal conductive layer through the exhaust channel. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 It is a cross-sectional schematic diagram of a conventional semiconductor package.

[0021] Figures 2 to 6 is a cross-sectional schematic diagram of a method for manufacturing an electronic package of the present invention, wherein: Figure 4A and Figure 5A They are Figure 4 and Figure 5 Schematic top view of .

[0022] Main component symbols

[0023] 1 Semiconductor Package

[0024] 10 Package substrate

[0025] 11. Semiconductor Chip

[0026] 11a,21a Action surface

[0027] 11b, 21b Non-active surface

[0028] 111,211 Conductive bumps

[0029] 112,212 Primer

[0030] 12 Thermal Interface Material (TIM) Layer

[0031] 13,28 Heat sink

[0032] 131 Top sheet

[0033] 132,252 Support feet

[0034] 14,24 Adhesive layer

[0035] 15 Overflow direction

[0036] 2 Electronic packaging

[0037] 20 Load-bearing structure

[0038] 20a First side

[0039] 20b Second side

[0040] 21 Electronic components

[0041] 21c Side

[0042] 22 Barrier

[0043] 23 Components

[0044] 25 Support structure

[0045] 251 Support

[0046] 26 Barrier structure

[0047] 261 Opening

[0048] 262 Exhaust channel

[0049] 263 Exhaust port

[0050] 264 Exit

[0051] 27 Thermal Conductive Layer

[0052] A: Crystal placement area

[0053] B Outer area

[0054] C Clearance

[0055] D Bend

[0056] E Exhaust direction

[0057] WWidth. DETAILED DESCRIPTION

[0058] The following describes the implementation of the present invention through specific embodiments. Those skilled in the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification.

[0059] It should be noted that the structures, proportions, sizes, etc. illustrated in the drawings of this specification are only used to match the contents disclosed in the specification for the understanding and reading of those skilled in the art, and are not used to limit the limiting conditions for the implementation of the present invention, so they have no substantial technical significance. Any modification of the structure, change of the proportional relationship, or adjustment of the size, without affecting the effects and purposes that can be achieved by the present invention, should still fall within the scope of the technical contents disclosed by the present invention. At the same time, the terms such as "upper", "lower", "one", "first", and "second" quoted in this specification are only for the convenience of description, and are not used to limit the scope of the implementation of the present invention. The change or adjustment of their relative relationship should also be regarded as the scope of the implementation of the present invention without substantially changing the technical contents.

[0060] Figures 2 to 6 is a cross-sectional schematic diagram of a method for manufacturing an electronic package 2 of the present invention, wherein: Figure 4A and Figure 5A They are Figure 4 and Figure 5 Schematic top view of .

[0061] like Figure 2 As shown, a supporting structure 20 having a first side 20a (such as an upper side) and a second side 20b (such as a lower side) opposite to each other is provided, and at least one (or more) electronic components 21 are disposed on the first side 20a of the supporting structure 20. The term "at least one" used in the present invention means more than one (such as one, two or more than three), and "more than one" means more than two (such as two, three, five or more than ten).

[0062] In one embodiment, the carrier structure 20 may be a package substrate (substrate) having a core layer and a circuit portion or a circuit structure without a core layer (coreless). Alternatively, the carrier structure 20 may include at least one dielectric layer and a circuit layer combined with the dielectric layer, such as a fan-out type redistribution layer (RDL for short). For example, the first side 20a of the carrier structure 20 may be used as a die placement side for carrying the electronic component 21, and the second side 20b of the carrier structure 20 may be used as a ball planting side for sequentially placing solder balls (such as solder balls) and electronic devices (such as circuit boards).

[0063] It should be understood that the supporting structure 20 may also be other supporting units for supporting the electronic components 21 (such as chips), such as a lead frame, a wafer, a silicon interposer, or other boards with metal routing, but is not limited thereto.

[0064] In one embodiment, the electronic component 21 may be an active component, a passive component or a combination thereof. For example, the active component is a semiconductor chip, and the passive component is a resistor, a capacitor or an inductor.

[0065] In one embodiment, the electronic component 21 may be a semiconductor chip having a relative active surface 21a and an inactive surface 21b, and the active surface 21a of the electronic component 21 may have a plurality of electrode pads (not shown), so that the plurality of electrode pads are combined and electrically connected to the circuit layer of the supporting structure 20 in a flip chip manner through a plurality of conductive bumps 211 such as solder materials, and then a coating layer such as a primer 212 is filled and formed between the first side 20a of the supporting structure 20 and the active surface 21a of the electronic component 21 to cover the plurality of conductive bumps 211.

[0066] In other embodiments, the electronic component 21 may also be electrically connected to the circuit layer of the supporting structure 20 by bonding multiple welding wires (not shown); or, the electronic component 21 may directly contact the circuit layer of the supporting structure 20 .

[0067] It should be understood that there are many ways to electrically connect the electronic components 21 to the supporting structure 20 , and the required type and quantity of electronic components 21 can be placed on the supporting structure 20 , but it is not limited thereto.

[0068] In one embodiment, the first side 20a of the supporting structure 20 may be defined as a die-stack area A and a peripheral area B, so that the electronic component 21 is disposed on the die-stack area A of the first side 20a of the supporting structure 20, and at least one (or more) components 23 (such as active components / passive components) and an adhesive layer 24 are respectively disposed on the peripheral area B of the first side 20a of the supporting structure 20, so that the component 23 is electrically connected to the circuit layer of the supporting structure 20 (not shown).

[0069] Another example Figure 2 As shown, the barrier body 22 is formed around the electronic component 21 to surround the side 21c of the electronic component 21, and the barrier body 22 can be further formed around the base glue 212 to surround the side of the base glue 212, and the barrier body 22 can be further formed on a portion of the first side 20a of the supporting structure 20.

[0070] In one embodiment, the barrier 22 may be composed of an insulating material (such as an insulating colloid), the component 23 may be various types of components such as an active component or a passive component, and the adhesive layer 24 may be composed of a heat dissipation material (such as a heat dissipation colloid) or an insulating material (such as an insulating colloid), and the component 23 is located between the barrier 22 and the adhesive layer 24 without contacting each other.

[0071] like Figure 3 As shown, a support structure 25 is disposed on the peripheral area B of the first side 20a of the supporting structure 20, and the support structure 25 has a support body 251 and at least one (e.g., multiple) support legs 252. The support body 251 of the support structure 25 can contact or approach the side surface 21c of the electronic component 21, the support body 251 can also contact or combine with the barrier 22, and the support legs 252 of the support structure 25 can extend downward from the edge of the support body 251 to be combined with the supporting structure 20.

[0072] In one embodiment, the support legs 252 of the support structure 25 can be combined with the support structure 20 through the adhesive layer 24. For example, the adhesive layer 24 is first formed on the first side 20a of the support structure 20 by dispensing so that the adhesive layer 24 is located at the periphery of the component 23 (such as a passive component), and then the support legs 252 of the support structure 25 are bonded to the adhesive layer 24 to fix the support structure 25 on the support structure 20. Alternatively, the adhesive layer 24 is not formed on the support structure 20 in advance, and when the support structure 25 is placed on the support structure 20, the support legs 252 are combined with the support structure 20 through the adhesive layer 24.

[0073] In one embodiment, the support structure 25 may be a heat dissipation structure, and the support body 251 and the support legs 252 may be made of heat dissipation materials (such as metal materials), so as to improve the heat dissipation performance of the electronic package or electronic component 21 through the support body 251 and the support legs 252 of the support structure 25. However, in other embodiments, the support body 251 and the support legs 252 of the support structure 25 may also be made of insulating materials.

[0074] In one embodiment, there is a gap C between the electronic component 21 and the support body 251 of the support structure 25, and the barrier 22 may be sandwiched in the gap C between the electronic component 21 and the support body 251 of the support structure 25. In other embodiments, the barrier 22 may not be provided, and the support body 251 of the support structure 25 may directly contact and abut against the side surface 21c of the electronic component 21.

[0075] like Figure 4 and Figure 4A As shown, the barrier structure 26 is disposed on the support body 251 of the support structure 25. The barrier structure 26 may have an opening 261 and an exhaust channel 262 that are connected, and the opening 261 of the barrier structure 26 exposes the electronic component 21 (such as the non-active surface 21b). The exhaust channel 262 of the barrier structure 26 has an exhaust port 263 and an outlet 264 that are connected at both ends, and the exhaust port 263 of the exhaust channel 262 is connected to the opening 261 of the barrier structure 26.

[0076] In one embodiment, the shape of the barrier structure 26 may be approximately annular, O-shaped, square-shaped, U-shaped, etc., and the shape of the exhaust channel 262 of the barrier structure 26 may be approximately annular, C-shaped, O-shaped, square-shaped, etc.

[0077] In one embodiment, the width W of the exhaust channel 262 of the barrier structure 26 may be at least 1 cm (mm). The barrier structure 26 may be made of a heat dissipation material (such as a metal material) to improve the electronic package 2 (see Figure 5 ) or the heat dissipation performance of the electronic component 21. However, in other embodiments, the barrier structure 26 may also be composed of insulating materials.

[0078] In one embodiment, the exhaust channel 262 of the barrier structure 26 may include at least one (eg, multiple) bends D, and the bends D of the exhaust channel 262 may be, for example, right-angle bends, oblique bends, or rounded bends.

[0079] In one embodiment, the exhaust channel 262 of the barrier structure 26 may be disposed outside the distribution area of ​​the electronic component 21, that is, the exhaust channel 262 of the barrier structure 26 is not disposed within the distribution area of ​​the electronic component 21 (such as on the non-active surface 21b), for example, the barrier structure 26 is disposed on the peripheral area B.

[0080] like Figure 5 and Figure 5A As shown, a heat-conducting layer 27 is disposed on the electronic component 21 (such as the inactive surface 21b) exposed by the opening 261 of the barrier structure 26, so that the heat-conducting layer 27 on the electronic component 21 (such as the inactive surface 21b) is blocked or surrounded by the barrier structure 26. For example, in the subsequent process (see Figure 6 ), the heat sink 28 is disposed on (pressed onto) the barrier structure 26 and the heat-conducting layer 27, so that bubbles or gases (such as air) at the opening 261 of the barrier structure 26 or the heat-conducting layer 27 can be effectively discharged to the outside of the outlet 264 according to the exhaust direction E through the exhaust channel 262.

[0081] In one embodiment, the barrier body 22 can surround the side 21c of the electronic component 21, and the barrier body 22 and the barrier structure 26 can jointly block the thermal conductive layer 27 on the electronic component 21, so as to prevent the thermal conductive layer 27 from overflowing to the side 21c of the electronic component 21 and the component 23 on the supporting structure 20 by the barrier body 22 and the barrier structure 26 to avoid causing adverse effects (such as electrical short circuit).

[0082] In one embodiment, the barrier 22 may be formed in the gap C between the electronic component 21 and the support body 251 of the support structure 25, so as to block / prevent the thermal conductive layer 27 from overflowing through the gap C to the side 21c of the electronic component 21 and the component 23 on the supporting structure 20 to avoid causing adverse effects (such as electrical short circuit).

[0083] In one embodiment, the blocking structure 26 (such as the opening 261) can block or surround the thermal conductive layer 27, so as to block / prevent the thermal conductive layer 27 from overflowing to the side 21c of the electronic component 21 and the component 23 on the supporting structure 20 by the blocking structure 26 (such as the opening 261) to avoid causing adverse effects (such as electrical short circuit).

[0084] In one embodiment, the exhaust channel 262 of the barrier structure 26 may surround the distribution area of ​​the heat conductive layer 27 (such as liquid metal), and the exhaust channel 262 of the barrier structure 26 has an exhaust function to effectively exhaust bubbles or gases (such as air) at the opening 261 of the barrier structure 26 or the heat conductive layer 27.

[0085] In one embodiment, the heat-conducting layer 27 may be a thermal interface material (TIM) layer made of liquid metal. For example, the heat-conducting layer 27 may be a liquid metal such as solder material and have a high thermal conductivity (e.g., 86 W / mK), so that the heat-conducting layer 27 cannot pass through the exhaust channel 262 of the barrier structure 26 due to surface tension, but the bubbles or gas at the opening 261 of the barrier structure 26 or the heat-conducting layer 27 can be discharged to the outside through the exhaust channel 262.

[0086] like Figure 6 As shown, a heat sink 28 is disposed on (pressed onto) the barrier structure 26 and the heat conductive layer 27 so that the heat generated by the electronic component 21 can be quickly dissipated through the heat sink 28, and bubbles or gases (such as air) at the opening 261 of the barrier structure 26 or the heat conductive layer 27 can be effectively discharged to the outside of the outlet 264 through the exhaust channel 262.

[0087] In one embodiment, the heat sink 28 may be a heat sink structure or a heat sink, and the heat sink 28 may be made of a heat sink material (such as a metal material). For example, the heat sink 28 may be a sheet-shaped heat sink, and the heat sink 28 may be pressed against a heat conductive layer 27 (such as liquid metal) so that the heat conductive layer 27 is between the electronic component 21 and the heat sink 28.

[0088] Then, a plurality of conductive elements such as copper pillars, metal bumps coated with insulating blocks, solder balls, solder balls with Cu core balls, or other conductive structures (not shown) may be arranged on the second side 20b of the supporting structure 20 to obtain the electronic package 2 of the present invention, and subsequently an electronic device such as a circuit board may be connected via the plurality of conductive elements (not shown).

[0089] The present invention further provides an electronic package 2, comprising: a supporting structure 20; an electronic component 21, disposed on the supporting structure 20; a supporting structure 25 having a supporting body 251, disposed on the supporting structure 20, and the supporting body 251 of the supporting structure 25 contacts or is close to the electronic component 21; a blocking structure 26 having an opening 261, disposed on the supporting body 251 of the supporting structure 25, and the opening 261 of the blocking structure 26 exposes the electronic component 21; and a heat-conducting layer 27, formed on the electronic component 21 exposed by the opening 261 of the blocking structure 26, so as to block or surround the heat-conducting layer 27 on the electronic component 21 by the blocking structure 26.

[0090] In one embodiment, the support structure 25 may also have at least one support leg 252, and the support leg 252 of the support structure 25 extends downward from the edge of the support body 251 to be combined with the supporting structure 20. The support structure 25 may be a heat dissipation structure, and the support body 251 and the support leg 252 of the support structure 25 may be made of heat dissipation material.

[0091] In one embodiment, the barrier structure 26 may have an exhaust channel 262, and the exhaust channel 262 is disposed outside the distribution area of ​​the electronic components 21 and surrounds the distribution area of ​​the heat conductive layer 27. An exhaust port 263 and an outlet 264 are respectively disposed at both ends of the exhaust channel 262 of the barrier structure 26, and the exhaust port 263 of the exhaust channel 262 is connected to the opening 261. The exhaust channel 262 of the barrier structure 26 includes at least one (e.g., multiple) bends D, and the width W of the exhaust channel 262 of the barrier structure 26 is at least 1 cm.

[0092] In one embodiment, the heat conductive layer 27 may be liquid metal, so that the opening 261 of the barrier structure 26 blocks or surrounds the liquid metal on the electronic component 21 .

[0093] In one embodiment, the electronic package 2 may also include a barrier 22. A gap C is provided between the electronic component 21 and the support 251 of the support structure 25, and the barrier 22 is formed in the gap C between the electronic component 21 and the support 251 of the support structure 25 to block the heat-conducting layer 27. The barrier 22 surrounds the side surface 21c of the electronic component 21, and the barrier 22 and the barrier structure 26 jointly block the heat-conducting layer 27 on the electronic component 21.

[0094] In one embodiment, the electronic package 2 may also include a heat sink 28, which is disposed on (pressed onto) the barrier structure 26 and the thermal conductive layer 27, and the thermal conductive layer 27 is located between the electronic component 21 and the heat sink 28, so as to facilitate the discharge of bubbles or gases (such as air) at the opening 261 of the barrier structure 26 or the thermal conductive layer 27 through the exhaust channel 262.

[0095] In summary, the electronic package and method thereof of the present invention have at least the following features, advantages or technical effects.

[0096] 1. The present invention can arrange a barrier structure with an opening on a support body of a support structure, and form a heat-conducting layer (such as liquid metal) on the electronic component exposed by the opening of the barrier structure, so as to effectively block or surround the heat-conducting layer on the electronic component by the barrier structure to prevent overflow.

[0097] Second, the barrier structure (such as an opening) of the present invention can block or surround the thermal conductive layer, so as to block / prevent the thermal conductive layer from overflowing to the side of the electronic component and the components on the supporting structure to avoid causing adverse effects (such as electrical short circuit).

[0098] 3. The exhaust channel of the barrier structure of the present invention can surround the distribution area of ​​the heat-conducting layer (such as liquid metal), and the exhaust channel has an exhaust function to effectively exhaust bubbles or gases (such as air) at the opening of the barrier structure or the heat-conducting layer.

[0099] Fourth, the barrier of the present invention can be formed in the gap between the electronic component and the support of the support structure, so as to block / prevent the heat conductive layer from overflowing through the gap to the component on the supporting structure and avoid causing adverse effects (such as electrical short circuit).

[0100] 5. The barrier body and the barrier structure of the present invention can jointly block the heat-conducting layer on the electronic component, so as to prevent the heat-conducting layer from overflowing to the component on the supporting structure and avoid causing adverse effects (such as electrical short circuit).

[0101] 6. The support structure and / or barrier structure of the present invention may be composed of heat dissipation materials (such as metal materials) so as to enhance the heat dissipation performance of the electronic package or electronic component through the support structure and / or barrier structure.

[0102] 7. The heat sink of the present invention can be arranged on (pressed on) the barrier structure and the heat conductive layer, so as to quickly dissipate the heat generated by the electronic components through the heat sink, and can also effectively discharge bubbles or gases (such as air) at the opening of the barrier structure or the heat conductive layer through the exhaust channel.

[0103] The above embodiments are only used to illustrate the principles and effects of the present invention, and are not used to limit the present invention. Anyone skilled in the art may modify the above embodiments without violating the spirit and scope of the present invention. Therefore, the scope of protection of the present invention should be as set forth in the claims.

Claims

1. An electronic package, comprising: a load-bearing structure; an electronic component, disposed on the supporting structure; A supporting structure having a supporting body, which is disposed on the supporting structure, and the supporting body of the supporting structure contacts or is close to the electronic component; a barrier structure having an opening, disposed on the support body of the support structure, wherein the opening of the barrier structure exposes the electronic component; as well as A heat-conducting layer is disposed on the electronic component exposed by the opening of the barrier structure, so as to block or surround the heat-conducting layer on the electronic component through the barrier structure.

2. The electronic package according to claim 1, wherein: The supporting structure also has at least one supporting foot, and the supporting foot of the supporting structure extends downward from the edge of the supporting body to be combined with the bearing structure.

3. The electronic package of claim 1, wherein: The support structure is a heat dissipation structure, and the support body of the support structure is composed of heat dissipation material.

4. The electronic package of claim 1, wherein: The barrier structure also has an exhaust channel, and the exhaust channel is arranged outside the distribution area of ​​the electronic component and surrounds the distribution area of ​​the heat-conducting layer.

5. The electronic package of claim 1, wherein: The barrier structure also has an exhaust channel. Two ends of the exhaust channel are respectively provided with an exhaust port and an outlet that are connected to each other, and the exhaust port of the exhaust channel is respectively connected to the opening and the outlet.

6. The electronic package of claim 1, wherein: The barrier structure also has an exhaust channel, which includes at least one bend and has a width of at least 1 cm.

7. The electronic package of claim 1, wherein: The heat-conducting layer is liquid metal, so as to block or surround the liquid metal on the electronic component through the opening of the barrier structure.

8. The electronic package of claim 1, wherein: The electronic package also includes a barrier, wherein a gap is provided between the electronic component and the support body of the support structure, and the barrier is formed in the gap between the electronic component and the support body of the support structure to block the heat-conducting layer.

9. The electronic package of claim 1, wherein: The electronic package also includes a barrier body surrounding the side surface of the electronic component, and the barrier body and the barrier structure jointly block the heat-conducting layer on the electronic component.

10. The electronic package of claim 1, wherein: The electronic package also includes a heat sink, which is arranged on the barrier structure and the heat-conducting layer, and the heat-conducting layer is between the electronic element and the heat sink.

11. A method for manufacturing an electronic package, comprising: Placing an electronic component on a supporting structure; Disposing a supporting structure having a supporting body on the carrying structure, wherein the supporting body of the supporting structure contacts or is close to the electronic component; Disposing a barrier structure having an opening on the support body of the support structure, wherein the opening of the barrier structure exposes the electronic component; as well as A heat-conducting layer is disposed on the electronic component exposed by the opening of the blocking structure, so as to block or surround the heat-conducting layer on the electronic component through the blocking structure.

12. The method for manufacturing an electronic package according to claim 11, wherein: The supporting structure also has at least one supporting foot, and the supporting foot of the supporting structure extends downward from the edge of the supporting body to be combined with the bearing structure.

13. The method for manufacturing an electronic package according to claim 11, wherein: The support structure is a heat dissipation structure, and the support body of the support structure is composed of heat dissipation material.

14. The method for manufacturing an electronic package according to claim 11, wherein: The barrier structure also has an exhaust channel, and the exhaust channel is arranged outside the distribution area of ​​the electronic component and surrounds the distribution area of ​​the heat-conducting layer.

15. The method for manufacturing an electronic package according to claim 11, wherein: The barrier structure also has an exhaust channel. Two ends of the exhaust channel are respectively provided with an exhaust port and an outlet that are connected to each other, and the exhaust port of the exhaust channel is respectively connected to the opening and the outlet.

16. The method for manufacturing an electronic package according to claim 11, wherein: The barrier structure also has an exhaust channel, which includes at least one bend and has a width of at least 1 cm.

17. The method for manufacturing an electronic package according to claim 11, wherein: The heat-conducting layer is liquid metal, so as to block or surround the liquid metal on the electronic component through the opening of the barrier structure.

18. The method for manufacturing an electronic package according to claim 11, wherein: The manufacturing method further comprises forming a barrier in the gap between the electronic component and the support body of the support structure to block the heat-conducting layer.

19. The method for manufacturing an electronic package according to claim 11, wherein: The manufacturing method also includes surrounding the side of the electronic component with a barrier, and the barrier and the barrier structure jointly block the heat-conducting layer on the electronic component.

20. The method for manufacturing an electronic package according to claim 11, wherein: The manufacturing method also includes arranging a heat dissipation component on the barrier structure and the heat conduction layer, and the heat conduction layer is located between the electronic component and the heat dissipation component.

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