Package comprising at least two contact for microtechnology, method for processing a package and tool for performing said method

Abstract

The invention relates to a package (10) comprising at least two contacts (11) for microtechnology, the contacts (11) each having a contact surface (12), the contacts (11) being connected to at least one support structure (13), and the contacts (11) being spaced apart from one another and being arranged such that the contact surfaces (12) are arranged in a plane and oriented in the same direction, wherein the support structure (13) is produced from a connecting material which can be separated and / or destroyed by means of a laser. The invention further relates to a method for processing a package (10) and to a tool for carrying out said method.

Description

Technical Field

[0001] The invention relates to a package comprising at least two contacts for microtechnology, a method for processing a package comprising at least two contacts for microtechnology and a tool for carrying out the method. Background Art

[0002] Due to the small structures in microtechnology, the handling and production of electronic components is particularly complex and must be carried out with high precision. In particular, the placement of the contacts must be carried out precisely, because otherwise parts of the electronic component may short-circuit due to incorrectly placed contacts or may not be contacted sufficiently and may not function as expected. Correction is usually not possible, which would render the electronic component unusable. If the placement is not carried out precisely, a large number of defective parts will result. However, precise placement is time-consuming.

[0003] There is therefore a great need for an accelerated but at the same time precise method for providing and placing contacts, by which time and process complexity can be saved without having to tolerate losses in the quality of the electronic components. Summary of the invention

[0004] The invention therefore has the object of providing contacts in such a way that a simultaneous but nevertheless precise placement of the contacts is achieved and time is saved in the process. In this case, the method can still be carried out with the customary high precision.

[0005] This object is achieved in a surprisingly simple but effective manner by a package comprising at least two contacts according to claim 1 and a method for placing these contacts according to claim 13 .

[0006] According to the invention, a package is proposed comprising at least two contacts for microtechnology, wherein the contacts each have a contact surface, wherein the contacts are connected to at least one supporting structure, and wherein the contacts are spaced apart from one another and are arranged such that the contact surfaces are arranged pointing in the same direction in a plane.

[0007] The package is characterized in that the support structure is made of a connecting material that can be separated and / or destroyed by means of a laser. The present invention is based on the following basic idea: In electronic devices in microtechnology, contacts are usually arranged at predefined locations on the electronic device with predefined spacings between each other. The positions of these predefined locations are generated in advance from the design of the electronic device. In the scope of the present invention, it is recognized that the predefined locations have a fixed spacing between each other in order to achieve compatibility with as many electronic devices as possible. The predefined locations are arranged in a plane and oriented in a manner pointing in one direction. This means that if at least two contacts are arranged at a fixed spacing between each other before being installed on the electronic device, and the spacing corresponds to the spacing of the predefined locations on the electronic device, then the precise orientation of one contact is sufficient to orient at least one other contact equally accurately and correctly. This therefore saves time because multiple contacts can be accurately oriented at the same time.

[0008] The precise spacing according to the invention is ensured here by a supporting structure which stabilizes the contacts at a fixed spacing from one another and enables a joint movement of the contacts with one another.

[0009] However, after installation, the support structure needs to be removed, because otherwise an undesirable short circuit that damages the function of the electronic device will be generated between at least two contacts. Because the structures in microtechnology are very small, the separation and / or destruction of the support structure must be carried out very accurately. The laser beam is characterized by its coherent light and its high intensity, which makes it feasible to bring energy input point by point and in a targeted manner with high precision. Due to the small structure in microtechnology, the support structure that can be separated and / or destroyed by means of laser is separated and / or destroyed in a targeted manner and point by point without damaging other areas of the package, especially the contacts and / or other areas of the electronic device. The contacts in microelectric (Mikroelektrik) are used to establish a conductive connection, such as a conductive connection with another electronic device or an electrical conductor. For this purpose, the contacts must be placed on the electronic device at a predefined position, and the predefined position is usually arranged at a predefined spacing from each other. The predefined position is connected to the internal circuit of the electronic device that causes its functionality. In addition to or in place of electrical connections, some contacts can establish a mechanical connection with another electronic device. Typically, the contacts are designed so that a simple insertion of the contacts of another electronic device is feasible. Other designs of the contacts are also conceivable.

[0010] The package includes at least two contacts, which should be placed and installed at the same time. Preferably, the package includes at least 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95 or 100 contacts. These contacts have a contact surface for electrical connection and / or mechanical connection with the electronic device at a predefined position. Therefore, it is necessary that at least two contacts are arranged with the contact surface so that the contact surface is located in a plane, points in the same direction and is arranged in a predefined spacing. In this way, the contacts can be placed on two or more predefined positions of the electronic device arranged side by side at the same time. In order to ensure this orientation and spacing of the contacts to one another during the entire processing, the package has a support structure. That is, the task of the support structure is to fix the contacts to one another so that the contact surfaces remain arranged in one plane and point in the same direction, and to ensure the spacing. Suitable materials are known to those skilled in the art, which have the required separability and / or destructibility and the required stability. Suitable materials are especially metals and metal alloys. Suitable methods for separation and / or destruction by means of lasers are described elsewhere.

[0011] Preferably, the connecting material has a thermal conductivity of at least 10W / mK. In the scope of the present invention, it has been recognized that a variety of methods for applying contacts to electronic devices are used in microtechnology, and the methods require heat or are heat-induced in order to establish a connection between the electronic device and the contacts during installation. Applying heat to all contacts is consuming here. In the scope of the present invention, it is recognized that the supporting structure is basically suitable for transmitting heat from one contact to another. For this reason, the supporting structure is composed of a material with a thermal conductivity of at least 10W / mK. Then, heat can be transferred from one contact to all other contacts of the package, so that when one of the contacts is heated, all contacts can be fully heated. Thus, in addition to placing at the same time, it is also realized that all contacts of the package are placed on the electronic device at the same time. Here, the supporting structure also undertakes other tasks: the heat required for the connection process of the contacts when installing on the electronic device is transferred to all contacts of the package. In order to achieve this, the supporting structure is made of a connecting material with a thermal conductivity of at least 10W / mK. Due to the small structures in microtechnology, this is a sufficiently high thermal conductivity, wherein higher thermal conductivities are preferred.

[0012] The term "package" relates to a composite structure of at least two contacts fixed to each other and in order.

[0013] The term “contact” refers to a conductive component which is used to electrically and / or mechanically connect an electronic component to another electronic component or an electrical conductor.

[0014] The term “support structure” relates to a structure which fixes at least two contacts to one another in a suitable manner.

[0015] The term "connecting material" relates to the material from which the supporting structure is made.

[0016] The package according to the invention makes it possible to install a plurality of contacts simultaneously in a microelectronic component, since the contacts can be placed simultaneously and connected to the electronic component simultaneously, which results in a considerable saving in time and effort.

[0017] Advantageous developments of the invention which can be implemented individually or in combination are described in the dependent claims.

[0018] It is conceivable that the contacts consist of a contact material, wherein the connecting material has a lower ignition point and / or melting point than the contact material. As mentioned above, it is necessary to separate and / or destroy the support structure after the contacts are mounted on the electronic device in order to remove the short circuit between the two contacts caused by the support structure. This is achieved, for example, by burning and / or melting the support structure. In order not to impair the functionality of the contacts in this process, it is advantageous if the connecting material of the support structure has a lower ignition point and / or melting point than the contact material.

[0019] Alternatively, it is conceivable that the connecting material and the contact material are identical and therefore have identical properties in order to enable rapid and easy production of the package according to the invention in this way.

[0020] In a further development, it is conceivable that the contacts are designed to be flat and arranged parallel to one another. The flat design allows the contacts to be placed at a preferred distance from one another. Usually, predefined locations that predetermine the distance between the contacts are arranged side by side, and the contacts are then to be arranged parallel to one another at these locations. In this case, it is advantageous if the contacts are designed to be flat and arranged parallel to one another.

[0021] The term "flat" refers to a solution in which the extent of the contacts in one spatial direction, namely the height, is designed to be significantly smaller than in the other two spatial directions. Particularly preferably, the contacts are designed as extruded bodies, in particular as prisms, wherein the extrusion takes place in the direction of the height. The term "parallel" refers to an orientation of the flat contacts such that the side faces limiting the height are oriented parallel to one another.

[0022] Furthermore, it is conceivable that the contacts are designed to be identical. The identical design of the contacts enables easy and predictable handling. Different designs of the contacts enable the contacts to be specifically matched to the electronic component into which they are subsequently inserted. It is conceivable that in the package at least a first part of the contacts, i.e. a first number of contacts, is contained in a first design, and at least a second part of the contacts, i.e. a second number of contacts, is contained in a second design. In this case, for example, the first part of the contacts can include identically constructed contacts, while the second part of the contacts can include contacts that are also identical to one another but are constructed differently from the first design.

[0023] It is also conceivable that the contacts are oriented identically and / or differently. The contacts are arranged so that the contact surfaces are oriented in a plane and in a manner pointing in the same direction. However, this is achieved by twisting the contacts relative to each other around an axis perpendicular to the plane and / or moving parallel to the plane. If the contacts are oriented identically, the contacts can be converted to each other by a simple movement in the plane, without the need to rotate the individual contacts. In the case of different orientations, rotation in the plane is required in order to convert the contacts to each other. It is particularly preferred that the contacts are oriented differently from each other. Most preferably, the contacts are oriented 180° twisted relative to each other. It is also conceivable here that in a package having three or more contacts, the contacts of the first part are oriented identically, and the contacts of the second part are oriented identically, and the first part is oriented differently relative to the second part.

[0024] In a further development of the invention, it is conceivable that at least one contact comprises at least one recess. Preferably, at least 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 25, 30, 35, 40, 45, 50, 55, 60, 65, 70, 75, 80, 85, 90, 95 or 100 contacts of the package, in particular all contacts, comprise at least one recess. More preferably, at least one contact comprises 2, 3, 4, 5, 6, 7, 8, 9 or 10 recesses of identical or different design. The shape of the recess is essentially arbitrary, particularly preferably it is rectangular. A part of the support structure can be received in the recess, so that the contact is connected to the support structure in a simple but reliable manner and can be fixed by the support structure.

[0025] Furthermore, it is conceivable that the support structure comprises at least one tab. A tab is an elongated component which is preferably designed in a circular or rectangular manner. The tab is simple to produce but can be used effectively as a support structure. It is conceivable that the tab is at least partially arranged in at least one recess described elsewhere of one, two, more or all contacts. More preferably, it is conceivable that the tab is arranged laterally at the contacts.

[0026] It is also conceivable that the support structure comprises at least one block, wherein the block is arranged between two contacts. The block is a polyhedron, preferably a restricted polyhedron and / or a polyhedron constructed from a cube. Particularly preferably, the block is a cuboid. In this case, the first contact is arranged at least on a first side surface of the block, and the second contact is arranged on at least one second side surface of the block, wherein the second side surface is preferably opposite to the first side surface. The block is preferably applied to the contacts, in particular to the side surfaces of the contacts.

[0027] In a further development, it is conceivable that the package comprises at least three contacts and that the support structure is designed in a multi-piece manner with a first part, wherein the first part of the support structure is connected to two contacts. That is to say, the first part of the support structure is connected to only two of the three contacts. It is conceivable here that the first part is a block. Preferably, the first part is arranged between two adjacent contacts. However, it is conceivable as an alternative that the first part is connected to two non-adjacent contacts. This is particularly feasible if at least two of the three contacts are designed differently and / or oriented differently.

[0028] It is conceivable that the support structure is connected to the contacts in a materially bonded manner and / or is formed in one piece with the contacts. The materially bonded connection and / or the one-piece design ensures a firm hold between the support structure and the contacts, wherein the fixing of the contacts to one another and the heat transfer from the support structure to the contacts are optimally ensured.

[0029] The term “monolithically” relates to an object which is composed of one piece, is designed to be continuous and seamless, and which cannot be separated without loss.

[0030] In a modified form of the invention, it is conceivable that the package is constructed layer by layer. Here, preferably, in order to shape the contacts, a mask is first applied to a suitable structure and / or bottom layer by means of photolithography, and then the first contact is produced by means of ion plating. The photoresist forming the mask is removed by excess coating, and then another mask is produced by means of photolithography, and the support structure is formed by means of ion plating. The photoresist of the support structure-mask is removed by excess coating, and a mask for another contact is re-produced. These steps are repeated until the desired number of contacts in the package is achieved. By constructing layer by layer, the package can be manufactured quickly, simply and accurately.

[0031] In a further development of the invention, it is conceivable that the length, width and / or height of the package is at most 2500 μm. As mentioned above, the package is provided for use in microtechnology. These dimensions correspond to the dimensions as used in microtechnology.

[0032] Unless otherwise stated, the definitions and / or explanations of the terms mentioned above are deemed to apply to all aspects described hereinafter in this specification.

[0033] According to the invention, a method for processing a package as described elsewhere is furthermore proposed, comprising the following steps:

[0034] a. Pick up the package;

[0035] b. heating at least one contact of the package and bonding the contact surfaces of all contacts of the package;

[0036] c. Separation and / or destruction of support structures by means of laser.

[0037] In the context of the present invention, it was recognized that it is time-saving to process contacts simultaneously, in particular to bond the contacts of a package simultaneously. This is achieved by processing a plurality of contacts simultaneously. The advantages can be achieved in particular in the following way: the predefined locations of the electronic device on which the contacts are arranged usually have a predefined spacing and a predefined orientation relative to each other. It is therefore possible to already set the contacts fixedly at this spacing by means of a support structure during manufacture. In this way, it is possible to pick up a plurality of contacts simultaneously, which contacts can then be precisely arranged at different predefined locations simultaneously, in that the first contact is precisely arranged. By means of the support structure according to the invention, it is possible to heat all contacts simultaneously, in that only one contact is heated. However, the support structure causes short circuits which impede the functionality of the electronic device. Therefore, the support structure must be destroyed in the last step.

[0038] The laser beam is characterized by its coherent light and its high intensity, which makes it possible to bring about the energy input point by point and in a targeted manner with high precision. Due to the small structures in microtechnology, the support structure can be separated and / or destroyed in a targeted manner with the aid of the laser without damaging other areas of the package, in particular the contacts, and / or other areas of the electronic component.

[0039] First, the package is picked up with the aid of a suitable tool. After picking up, it is possible to transport the package with the aid of the tool, in particular to the electronic device into which the package is to be placed. In a next step, which can be carried out before, during and / or after transporting the package to a predefined location, the package is heated in preparation for bonding. Here, the contact surfaces of the contacts are placed on the predefined location and / or applied there to the material that enables bonding. The support structure is then destroyed and / or separated.

[0040] Preferably, heating is also performed in step b by means of a laser. By means of a laser, the package can be heated in a targeted and point-by-point manner at at least one contact without damaging other areas of the package, in particular the contacts and / or other areas of the electronic device. In a preferred design, the laser beam is directed directly to at least one of the contacts during heating.

[0041] The term "bonding" relates to the creation of a permanent electrical and / or mechanical connection between a contact and a predefined location of an electronic component.

[0042] The term "separation" relates to a process in which a support structure is separated and / or split into two or more parts.

[0043] The term "destruction" relates to a process that damages the support structure so that it loses its functionality. The functionality of the support structure here is the fixing of the contacts to one another.

[0044] In a development of the method, it is conceivable that the support structure is separated and / or destroyed in step c by ablation using a laser. Ablation is a simple, rapid and precise method for separating and / or destroying support structures.

[0045] The term "ablation" in conjunction with laser refers to a process in which the support structure is removed by using a laser, wherein the energy of the laser is directed in a targeted, in particular pulsed, manner at the material, whereby the material is evaporated or removed in the form of particles. In this process, the connecting material of the support structure is briefly heated at the surface to such a high temperature that the electrons forming chemical bonds in the connecting material are excited to thermal vibrations, so that the electrons break the chemical bonds and leave the connecting material. This results in the material flaking off due to Coulomb explosion induction, which intensifies the detachment process.

[0046] It is also conceivable that bonding is carried out in step b by soldering, in particular by means of pre-applied solder bumps. It is preferably conceivable here that the solder bumps are applied to predefined locations of the electronic component and that when the package is placed on the predefined locations, the solder bumps are melted by the heat of the contacts applied to the package and also extending to the contact surface. Soldering is a simple but effective method for permanently connecting the contacts to the electronic component electrically and mechanically at predefined locations.

[0047] Furthermore, it is conceivable that the picking up in step a is carried out by means of a gripper comprising at least two grippers, wherein the grippers grip the package on one side of the outermost contact located outside or on multiple sides of the contacts of the package, and wherein the heating in step b is carried out by means of heat transfer via the grippers to at least one of the contacts. Gripping by means of a gripper is a well-controllable method for picking up the package. The package can be gripped at the side of the outermost package located outside, respectively, because this is a method that can be performed particularly simply and quickly in terms of method technology. Alternatively, the package can be gripped at one of the contacts, thereby achieving particularly precise placement of the package, because it can be excluded that the already placed package or contact is moved or damaged by the grippers of the gripper. The heating of the contacts is carried out in the following manner: one or more of the grippers are heated, and the heat is output to one or more contacts via the grippers. This provides the following advantages: heating can be carried out during transportation to a predefined location, and if a laser is used for heating, damage to the support structure before bonding can be prevented. Preferably, the gripper is configured as a two-claw parallel gripper. It is conceivable that one or both gripping jaws are drivable, in order to achieve the gripping of the contacts or the packaging, for example, by form matching and / or force matching.

[0048] According to the invention, a tool for carrying out the method described elsewhere is also provided, wherein the tool comprises a gripper, wherein the gripper comprises at least two clamping jaws. The tool is characterized in that at least one of the clamping jaws comprises a heat transfer region. The heat transfer region allows heating of at least one contact point while the gripper holds the package. In this case, the laser beam is directed directly at the heat transfer region and the heat is transferred via the clamping jaws to the contacts of the contacting jaws. This has the advantage that damage to the support structure is prevented before bonding.

[0049] The term "gripper jaw" refers to that part of the gripper which, during gripping, comes into direct contact with the gripped object, here the contacts or the package. The gripper jaw can be replaceable and can also be provided with a special friction lining to increase the static friction. In particular, the gripper jaw can be designed as a gripper finger, which interacts with at least one further gripper finger to hold the package or the contact. At least one of the grippers is mounted so as to be movable about an axis. The gripper jaw preferably has a shape adapted to its function. Particularly preferably, the gripper jaw is designed to be flat and / or tapering.

[0050] The term “heat transfer region” relates to a surface or a subsection, in particular an exposed surface or an exposed subsection, on the clamping jaw, which can be heated by means of a laser and is suitable for transferring the heat introduced by the laser to a contact or a package consisting of a plurality of contacts. BRIEF DESCRIPTION OF THE DRAWINGS

[0051] Further details, features and advantages of the invention are derived from the following description of preferred embodiments in conjunction with the dependent claims. In this case, the individual features can be realized individually or in a plurality of combinations with one another. The invention is not limited to the embodiments. The embodiments are schematically shown in the drawings. The same reference numerals in the individual drawings represent the same or functionally identical elements or elements corresponding to one another with respect to their functions.

[0052] Shown in detail:

[0053] Figure 1 shows an isometric view of a first package according to the present invention;

[0054] FIG. 2 shows a top view and a front view of a second embodiment of a package according to the present invention;

[0055] Figure 3 showing an isometric view of a third embodiment of a package according to the present invention;

[0056] FIG4 shows a side view, a front view and a top view of a fourth embodiment of a package according to the present invention;

[0057] FIG5 shows the various steps of the method according to the present invention;

[0058] Figure 6 A first embodiment of a gripper according to the invention is shown during the execution of step b of the method according to the invention;

[0059] Figure 7 A second embodiment of the gripper according to the invention is shown;

[0060] Figure 8 shows a third embodiment of a gripper according to the invention; and

[0061] Fig. 9 A fourth embodiment of a gripper according to the invention is shown. DETAILED DESCRIPTION

[0062] Figure 1 1 shows an isometric view of a first embodiment of a package 10 according to the invention. The package 10 according to the invention comprises three flat, identically designed, identically oriented contacts 11 arranged parallel to one another. The contacts 11 each comprise a contact surface 12, which is Figure 1 The contact surfaces 12 of the contacts 11 are oriented in one plane and in the same direction. The contacts 11 are connected via a two-part support structure 13, wherein the two parts are formed as strips. The strips of the support structure 13 are respectively arranged in recesses 14, wherein each contact 11 has two recesses 14. The contacts 11 of the package 10 are fixed to each other in their spacing and orientation by the material connection of the support structure 13 in the recesses 14.

[0063] Figure 2A A top view of a second package 10 according to the present invention is shown. Figure 2B The package 10 also comprises three contacts 11, which are connected by a support structure 13 and thus fixed in their spacing and orientation. The contacts 11 each comprise a contact surface 12, which is Figure 2A and 2B The electronic device 20 is arranged at a predefined position 21 and connected thereto. Figure 2B As can be seen in FIG. 1 , the contact surfaces 12 are oriented in one plane and point in the same direction. The contacts 11 are designed identically, oriented identically and are flat and are arranged parallel to one another.

[0064] Figure 3 FIG. 1 shows an isometric view of a third embodiment of a package 10 according to the invention. The package 10 according to the invention comprises three flat, identically designed, identically oriented contacts 11 arranged parallel to one another. The contacts 11 each comprise a contact surface 12, which is Figure 3 The contact surfaces 12 of the contacts 11 are arranged in one plane and pointed in the same direction. The contacts 11 are connected by a support structure 13 which is constructed in multiple parts, wherein the parts are formed as blocks. Here, two blocks are arranged between two contacts 11. Two blocks are also arranged externally at the outermost contacts 11, on which a fourth contact 10 (not shown) can be arranged. The contacts 11 of the package 10 are fixed to each other in their spacing and their orientation by the material-fitting connection of the blocks of the support structure 13.

[0065] Figure 4Ashows a side view of a fourth embodiment of a package 10 according to the invention, Figure 4B The front view thereof is shown, and Figure 4C A top view thereof is shown. Figure 4A The side view in FIG. 1 is a cross-sectional view of the package 10, the cross-sectional view being taken along Figure 4C The package 10 also includes three contacts 11, which are fixed in their spacing and orientation by a supporting structure 13. The contacts 11 are designed flat and each include a contact surface 12, which is arranged at three predefined locations 21 of the electronic device 20. The contacts 11 are arranged in parallel, but are oriented differently, wherein the two outer contacts 11 are oriented identically and the inner contact 11 is oriented by twisting 180°. The supporting structure 13 is designed in three parts. It can be clearly seen here that between the contacts 11, in the lower part of the contacts 11, a part of the supporting structure 13, each designed as a block, is arranged, and the part is designed in a rectangular parallelepiped shape. The block-shaped supporting structure 13 is arranged at the first contact 11 with a first side surface and at the second contact 11 with a second side surface. A further part of the support structure 13 is arranged between the two outer contacts 11 of the package 10 and is connected as a block to one of the contacts 11 with a first side face and to the other contact 11 with a second side face opposite the first side face.

[0066] Figure 5A Step a of the method according to the invention is shown. Here, a package 10 comprising three contacts 11 which are connected to one another via a support structure 13 is picked up by a pick-up tool 31 . Figure 5A Furthermore, a second package 10 of identical design is shown, which, however, has not been picked up.

[0067] Figure 5B Step b of the method according to the invention is shown, in which the package 10 picked up in step a is heated by a heating tool 32. The pick-up tool 31 is not shown here. The heating tool 32 is a laser, which heats the package 10 by means of a laser beam 40. Furthermore, an electronic device 20 with a plurality of predefined locations 21 is shown. Here, the package 10 is already arranged on the predefined locations 21. It can also be seen that Figure 5B In this case, the contacts 11 of the heated package 10 are placed on the still free predefined locations 21 of the electronic component 20 and are welded by means of heat.

[0068] Figure 5CStep c of the method according to the invention is shown, in which the support structure 13 of the package 10 is separated by means of a cutting tool 33. This results in the separation of the contacts 11, which have no direct electrical connection to one another. The electronic component 20 can then be connected to other electronic components via the contacts 11. The cutting of the support structure 13 is carried out by means of a laser beam emitted by a laser 40.

[0069] Figure 6 A first embodiment of a gripper 50 according to the invention is shown during the execution of step b of the method according to the invention. The gripper 50 has already gripped a package 10 with two clamping jaws 51. Here, one clamping jaw 51 in each case rests on the outer side of an outer contact 11. The gripper 50 transports the package 10 to a still free predefined location 21 on an electronic device 20 on which another package 10 is already arranged. The laser beam 40 of the heating tool 32 designed as a laser is directed to the heat transfer region 52. As a result, the heat transfer region 52 is heated and the heat is transferred to the contact 11 via the clamping jaws 51, so that the contact is also heated, so that the heated contact 11 can be bonded to the predefined location 21.

[0070] Figure 7 A second embodiment of a gripper 50 according to the present invention is shown. The gripper 50 corresponds to Figure 6 5, wherein a heat transfer region 52 is formed at another jaw 51. The gripper 50 has gripped a package 10 having three contacts 11. The laser beam 40 of the heating tool 32 designed as a laser is directed toward the heat transfer region 52. As a result, the heat transfer region 52 is heated and the heat is transferred via the jaw 51 to the heat transfer region 52 at the other jaw 51. Figure 7 The other contacts are heated via the support structure 13, which transfers the heat from the Figure 7 The contact 11 shown on the right leads to other contacts.

[0071] Figure 8 A third embodiment of a gripper 50 according to the invention is shown. The third embodiment corresponds to Figure 7 , but with a narrower design of the jaws 51. As a result, the jaws 51 of the gripper 50 are at least partially introduced into the gap between the two contacts 11. The gripper 50 is thus able to grip the package 10 at the center contact 11. The laser beam 40 of the heating tool 32 designed as a laser is directed to the heat transfer region 52. As a result, the heat transfer region 52 is heated and the heat is transferred to the center contact 11 via the jaws 51.

[0072] Fig. 9 A third embodiment of a gripper 50 according to the invention is shown. The third embodiment corresponds to Figure 7 4 , wherein the two jaws 51 each comprise a heat transfer region 52 , towards which the laser beam 40 of the heating tool 32 can be directed, respectively.

Claims

1. A package (10) comprising at least two contacts (11) for microtechnology, wherein the contacts (11) each have a contact surface (12), wherein the contacts (11) are connected to at least one supporting structure (13), and wherein the contacts (11) are spaced apart from one another and are arranged such that the contact surfaces (12) are arranged in one plane and point in the same direction, It is characterized in that The support structure (13) is produced from a connecting material which is separable and / or destructible by means of a laser.

2. The package (10) according to claim 1, It is characterized in that The contact (11) consists of a contact material, wherein the connecting material has a lower ignition point and / or melting point than the contact material.

3. The package (10) according to claim 1 or 2, It is characterized in that The contacts (11) are flat in design and arranged parallel to one another.

4. The package (10) according to any one of the preceding claims, It is characterized in that The contacts (11) are designed identically and / or differently.

5. The package (10) according to claim 4, It is characterized in that The contacts (11) are oriented identically and / or differently.

6. The package (10) according to any one of the preceding claims, It is characterized in that The at least one contact (11) comprises at least one recess (14).

7. The package (10) according to any one of the preceding claims, It is characterized in that The support structure (13) comprises at least one tab.

8. The package (10) according to claim 7, It is characterized in that The web is arranged laterally on the contact point (11).

9. The package (10) according to any one of the preceding claims, It is characterized in that The support structure (13) comprises at least one block, wherein the block is arranged between the contacts (11).

10. The package (10) according to any one of the preceding claims, It is characterized in that The package (10) comprises at least three contacts (11), and the support structure (13) is designed in multiple parts, wherein a part of the support structure (13) is connected to two contacts (11).

11. The package (10) according to any one of the preceding claims, It is characterized in that The support structure (13) is connected to the contact (11) in a materially bonded manner and / or is formed in one piece with the contact.

12. The package (10) according to any one of the preceding claims, It is characterized in that The encapsulation (10) is structured layer by layer, in particular by means of ion plating.

13. The package (10) according to any one of the preceding claims, It is characterized in that The length, width and / or height of the package (10) is at most 2500 μm.

14. A method for processing a package (10) according to any one of the preceding claims, comprising the following steps: a. Picking up the package (10); b. heating at least one of the contacts (11) and bonding the contact surfaces of all the contacts (11) of the package (10); c. Separating and / or destroying the support structure (13) by means of laser. 15 . The method according to claim 14 , wherein in step c, the separation and / or destruction is performed by ablation by means of the laser. 16 . The method according to claim 14 , wherein the bonding in step b. is performed by soldering, in particular by means of pre-applied solder bumps.

17. A method according to any one of claims 14 to 16, wherein the picking up in step a is carried out by means of a gripper (50) comprising at least two jaws (51), wherein the jaws (51) respectively grip the package (10) at the outer side of the outermost contact (11) or at the side of the contacts (11) of the package (10), and wherein the heating in step b is carried out by means of heat transfer via the jaws (51) to at least one of the contacts (11).

18. A tool for performing the method according to any one of claims 14 to 17, wherein the tool comprises a gripper (50) comprising at least two jaws (51); It is characterized in that At least one of the jaws (51) comprises a heat transfer region (52).

Images