LiSOP chip packaging structure

Abstract

The invention relates to a LiSOP chip packaging structure, and relates to the technical field of chip packaging, the LiSOP chip packaging structure comprises an LGA chip packaging structure, a first substrate, a first plastic package body and a pin, the LGA chip packaging structure is arranged on the first substrate, one end of the pin is arranged on the first substrate, and the other end of the pin is arranged on the second substrate. The LGA chip packaging structure is electrically connected with one end, arranged on the first substrate, of the pin through a first guide wire, and the first plastic packaging body is used for wrapping parts of the LGA chip packaging structure, the first substrate and the pin, so that the free end of the pin extends out of the side surface of the first plastic packaging body. The LGA chip packaging structure is packaged through the SOP packaging structure, so that the LGA chip packaging structure can bear certain deformation of the circuit board, and the anti-vibration effect of the circuit board is improved.

Description

Technical Field

[0001] The present application relates to the field of chip packaging technology, and in particular to a LiSOP chip packaging structure. Background Art

[0002] LGA packaging is an electronic component packaging technology that is based on the design principle of Land Grid Array (LGA) connector and is used to connect integrated circuit chips to printed circuit boards (PCBs).

[0003] The LGA packaging structure and the circuit board are electrically and mechanically connected to each other through array-state electrode contacts made on the bottom surface. However, in some environments with relatively large vibrations, the vibrations may cause the circuit board to deform to a certain extent. The deformation of the circuit board may cause some electrode contacts to be disconnected from the circuit board, causing the circuit board to malfunction and resulting in poor vibration resistance of the circuit board. Summary of the invention

[0004] In order to improve the problem that a certain deformation of the circuit board causes some electrode contacts to be disconnected from the circuit board, resulting in poor anti-vibration effect of the circuit board, the present application provides a LiSOP chip packaging structure.

[0005] A LiSOP chip packaging structure provided in this application adopts the following technical solution: A LiSOP chip packaging structure comprises an LGA chip packaging structure, a first substrate, a first plastic packaging body and a pin, wherein the LGA chip packaging structure is arranged on the first substrate, one end of the pin is arranged on the first substrate, the LGA chip packaging structure is electrically connected to one end of the pin arranged on the first substrate through a first guide wire, and the first plastic packaging body is used to wrap the LGA chip packaging structure, the first substrate and part of the pin so that the free end of the pin extends out from the side of the first plastic packaging body.

[0006] By adopting the above technical solution, the LGA chip packaging structure is electrically connected to the pins through the first guide wire, and then the LGA chip packaging structure is plastic-sealed again by the first plastic packaging body to form a LiSOP chip packaging structure. The LiSOP chip packaging structure with the LGA chip packaging structure is installed on the circuit board through the pins, so that the LGA chip packaging structure can withstand a certain deformation of the circuit board and improve the anti-vibration effect of the circuit board.

[0007] In a specific possible implementation manner, the pin is fixedly connected to the first substrate, a soldering pad is provided on the pin, and the first guide wire is connected to the soldering pad.

[0008] By adopting the above technical solution, the first guide wire is electrically connected to the pin through the pad, and the pin is fixedly connected to the first substrate, which can improve the connection reliability between the guide wire and the first guide wire and improve the stability of the pin.

[0009] In a specific possible implementation scheme, the first substrate includes a supporting portion and connecting portions on both sides, the connecting portions are connected to the pins, and an installation space for installing the LGA chip packaging structure is enclosed between the connecting portions and the supporting portions, so that the LGA chip packaging structure can be located in the middle position of the first plastic package body.

[0010] By adopting the above technical solution, the LGA chip packaging structure is installed in the installation control, so that the LGA chip packaging structure is located in the middle position of the first plastic package body, which better protects the LGA chip packaging structure from physical and chemical damage and helps to conduct heat more evenly.

[0011] In a specific possible implementation scheme, the LGA chip packaging structure includes a second substrate, a chip body and a second plastic packaging body. The chip body is arranged on the second substrate and is electrically and mechanically connected to the circuit on the second substrate through a connector. The first guide wire is electrically connected to the circuit on the second substrate. The second plastic packaging body is used to wrap the chip body and the connector on the second substrate.

[0012] In a specific possible implementation manner, the chip body is connected to the second substrate by a face-up method; The connecting member includes a second conductive wire, and the chip body is electrically connected to the second substrate via the second conductive wire.

[0013] By adopting the above technical solution, the chip body is connected to the second substrate by the upright method. The structure is simple, the production cost of the upright chip is relatively low, it is suitable for large-scale production, the heat dissipation capacity is good, and it can effectively reduce the chip temperature and improve the service life and reliability.

[0014] In a specific possible implementation manner, the chip body is connected to the second substrate by a flip-chip method; The connecting member includes a solder ball, and the chip body is electrically and mechanically connected to the second substrate through the solder ball.

[0015] By adopting the above technical solution, the chip body is mounted on the second substrate by a flip-chip method. The flip-chip body shortens the signal transmission path, reduces the capacitance and inductance effects, and improves the data transmission rate and system performance.

[0016] In a specific implementation manner, a first insulating heat-conducting plate bonded to the chip body is disposed in the second plastic package body, a heat-conducting rod is connected to the first insulating heat-conducting plate, and an end of the heat-conducting rod extends to the outer wall of the second plastic package body.

[0017] By adopting the above technical solution, the heat generated by the chip body is transferred to the first insulating heat-conducting plate, and then transferred to the surface of the second plastic package body through the heat-conducting rod, which facilitates the heat dissipation of the LGA chip packaging structure.

[0018] In a specific implementation manner, a plug hole for inserting the heat conducting rod is provided on the first insulating heat conducting plate, and the heat conducting rod is inserted into the plug hole and connected to the first insulating heat conducting plate via a heat conducting adhesive.

[0019] By adopting the above technical solution, before the LGA chip packaging structure is plastic-sealed, the first insulating heat-conducting plate is first installed on the chip body, and then the second guide wire is installed, and then thermal conductive glue is coated on the heat-conducting rod, and the heat-conducting rod is inserted into the socket on the first insulating heat-conducting plate to complete the installation of the heat-conducting rod. By splicing the heat-conducting rod and the first insulating heat-conducting plate, the influence of the heat-conducting rod on the installation of the second guide wire can be effectively avoided, which facilitates the LGA plastic sealing of the chip body.

[0020] In a specific possible implementation scheme, a second insulating heat conductive plate is provided on the outer side of the second plastic packaging body, and the second insulating heat conductive plate is connected to the second substrate and the heat conductive rod to form heat transfer. A heat dissipation rod connected to the second insulating heat conductive plate is provided in the first plastic packaging body, and a connecting hole for inserting the heat dissipation rod is opened on the second insulating heat conductive plate, and the end of the heat dissipation rod extends to the outer side wall of the first plastic packaging body.

[0021] By adopting the above technical solution, the heat conducting rod conducts heat to the second insulating heat conducting plate, and at the same time, the heat on the second substrate is conducted to the second insulating heat conducting plate, and then the heat is transferred to the surface of the first plastic package body through the heat dissipation rod, which is beneficial to the heat dissipation of the LGA packaging structure and the LiSOP chip packaging structure; the heat dissipation rod is inserted into the connecting hole to complete the installation of the heat dissipation rod and the second insulating heat dissipation plate, effectively avoiding the influence of the heat dissipation rod on the installation of the first guide wire, and facilitating the plastic sealing process of the LiSOP chip packaging structure.

[0022] In a specific possible implementation manner, the second insulating heat-conducting plate and the second plastic package body are bonded by a heat-conducting adhesive layer, and the heat-conducting adhesive layer is connected to the heat-conducting rod so that heat can be transferred between the second insulating heat-conducting plate and the heat-conducting rod.

[0023] By adopting the above technical solution, the heat conducting rod is connected to the second insulating heat conducting plate by using a heat conducting adhesive layer, thereby improving the stability of heat conduction between the heat conducting rod and the second insulating heat conducting plate.

[0024] In summary, the present application includes at least one of the following beneficial technical effects: 1. The LGA chip packaging structure is electrically connected to the pins through the first guide wire, and then the LGA chip packaging structure is plastic-sealed again through the first plastic sealing body to form a LiSOP chip packaging structure, and the LiSOP chip packaging structure with the LGA chip packaging structure is installed on the circuit board through the pins, so that the LGA chip packaging structure can withstand a certain deformation of the circuit board and improve the anti-vibration effect of the circuit board; 2. The first guide wire is electrically connected to the pin through a pad provided on the first substrate, which can improve the connection reliability between the guide wire and the first guide wire and improve the stability of the pin; 3. The heat conducting rod conducts the heat to the second insulating heat conducting plate, and at the same time, the heat on the second substrate is conducted to the second insulating heat conducting plate, and then the heat is transferred to the surface of the first plastic package through the heat dissipation rod, which is beneficial to the heat dissipation of the LiSOP chip packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a structural schematic diagram of a LiSOP chip packaging structure of Example 1 of the present application.

[0026] Figure 2 is along Figure 1 Section view along line AA.

[0027] Figure 3 It is a structural schematic diagram of a LiSOP chip packaging structure of Example 2 of the present application.

[0028] Figure 4 is along Figure 3 Cross-sectional view along line BB.

[0029] Figure 5 It is a structural schematic diagram of a LiSOP chip packaging structure of Example 3 of the present application.

[0030] Figure 6 is along Figure 5 Sectional view along the CC line.

[0031] Figure 7 is along Figure 5 Sectional view along line DD.

[0032] Figure 8 yes Figure 6 Enlarged view of middle part E.

[0033] Explanation of the accompanying drawings: 1. LGA chip packaging structure; 11. second substrate; 12. chip body; 13. second plastic package body; 14. connector; 141. second guide wire; 142. solder ball; 21. first substrate; 211. support portion; 212. connecting portion; 213. installation space; 22. first plastic package body; 23. pin; 24. first guide wire; 31. first insulating heat conductive plate; 32. socket; 33. heat conductive rod; 34. second insulating heat conductive plate; 35. thermal conductive adhesive layer; 36. heat sink; 37. connecting hole. DETAILED DESCRIPTION

[0034] The following is combined with Figure 1-8 This application is described in further detail.

[0035] The embodiments of the present application disclose a LiSOP chip packaging structure.

[0036] Example 1 Reference Figure 1 , Figure 2 The LiSOP chip packaging structure includes an LGA chip packaging structure 1, a first substrate 21, a first plastic package body 22 and a pin 23. The material of the first substrate 21 is a ceramic material. The LGA chip packaging structure 1 is bonded to the first substrate 21 by epoxy glue. The number of pins 23 in this embodiment is eight, which are symmetrically distributed on both sides of the first plastic package body 22. One end of the pin 23 is mechanically connected to the first substrate 21. A pad is provided on the pin 23. The LGA chip packaging structure 1 is welded to the pad on the pin 23 by a first guide wire 24 to achieve electrical connection between the LGA chip packaging structure 1 and the pin 23. The first plastic package body 22 is used to wrap the LGA chip packaging structure 1, the first substrate 21 and part of the pin 23, so that the free end of the pin 23 extends from the side of the first plastic package body 22, and the free end of the pin 23 is welded to the contact on the circuit board to achieve the installation of the pin 23 and the circuit board.

[0037] The LGA chip packaging structure 1 is electrically connected to the pin 23 through the first guide wire 24, and then the LGA chip packaging structure 1 is plastic-sealed again through the first plastic package 22. The traditional SOP packaging structure uses the chip as the packaging object and is encapsulated in the plastic package. In this solution, the chip is encapsulated by the LGA packaging method to form the LGA chip packaging structure 1, and then the LGA chip packaging structure 1 is encapsulated in the plastic package as the object using the SOP packaging method to form the LiSOP chip packaging structure. The LiSOP chip packaging structure with the LGA chip packaging structure 1 is installed on the circuit board through the pin 23, so that the LGA chip packaging structure 1 can withstand certain circuit board deformation and improve the anti-vibration effect of the circuit board.

[0038] Reference Figure 1 , Figure 2The LGA chip packaging structure 1 includes a second substrate 11, a chip body 12 and a second plastic package 13. The chip body 12 can be a single chip or multiple chips stacked together. The second substrate 11 is an inorganic substrate, including a ceramic substrate and a glass substrate. The second substrate 11 is embedded with circuits and pads of an interconnection structure. The chip body 12 is arranged on the second substrate 11, and is electrically and mechanically connected to the circuit on the second substrate 11 through a connector 14. The first wire guide 24 is welded to the pad in the circuit on the second substrate 11, so that the chip body 12 is connected to the first wire guide 24 electrode. The second plastic package 13 is used to wrap the chip body 12 and the connector 14 on the second substrate 11.

[0039] Reference Figure 1 , Figure 2 , the connector 14 in this embodiment includes a second wire 141, and the chip body 12 in this embodiment is mounted on the second substrate 11 by a positive mounting method, the end of the chip body 12 is bonded to the second substrate 11 by epoxy adhesive, and the other end of the chip body 12 is connected to the pad on the second substrate 11 by the second wire 141, so as to realize the electrical connection between the chip body 12 and the first wire 24. The chip body 12 is connected to the second substrate 11 by a positive mounting method, the structure is simple, the production cost of the positive mounting chip is relatively low, it is suitable for large-scale production, the heat dissipation capacity is good, the chip temperature can be effectively reduced, and the service life and reliability are improved.

[0040] Reference Figure 1 , Figure 2 The first substrate 21 includes a supporting portion 211 and connecting portions 212 on both sides of the supporting portion 211. The two connecting portions 212 are inclined to the supporting portion 211, so that a trapezoidal installation space 213 is formed between the two connecting portions 212 and the supporting portion 211. The LGA chip packaging structure 1 is invertedly installed in the installation space 213. The installation space 213 can ensure that the pin 23 is located in the middle of the first plastic packaging body 22 while ensuring that the LGA chip packaging structure 1 is also located in the middle of the first plastic packaging body 22, thereby better protecting the LGA chip packaging structure 1 from physical and chemical damage and helping to conduct heat more evenly.

[0041] The implementation principle of Example 1 is as follows: the LGA chip packaging structure 1 is electrically connected to the pin 23 through the first guide wire 24, and then the LGA chip packaging structure 1 is plastic-sealed again through the first plastic sealing body 22 to form a LiSOP chip packaging structure, and the LiSOP chip packaging structure with the LGA chip packaging structure 1 is installed on the circuit board through the pin 23. Since the pin 23 has a certain flexibility, the LGA chip packaging structure 1 can withstand a certain deformation of the circuit board, thereby improving the anti-vibration effect of the circuit board.

[0042] Example 2 Reference Figure 3 , Figure 4 The difference between this embodiment and embodiment 1 is that the connector 14 in this embodiment includes a solder ball 142, and the chip body 12 is mounted on the second substrate 11 by a flip-chip method. The tin-silver alloy layer is melted and reflowed by reflow soldering to form a smooth solder ball 142. After the reflow soldering is completed, the chip with bumps is aligned and mounted on the bottom of the chip body 12 or the second substrate 11, and then bonded by reflow soldering or hot pressing bonding process, and the bottom filler is dripped around the chip body 12. The bottom filler will fill the gap between the chip body 12 and the second substrate 11 through capillary action, thereby enhancing the connection strength between the chip body 12 and the second substrate 11, and then the assembly is placed in a curing furnace to cure the bottom filler, completing the entire chip body 12 flip-chip packaging process.

[0043] The implementation principle of Example 2 is as follows: the chip body 12 is mounted on the second substrate 11 by a flip-chip method. The flip-chip body 12 shortens the signal transmission path, reduces the capacitance and inductance effects, and improves the data transmission rate and system performance.

[0044] Example 3 Reference Figure 5 , Figure 6 and Figure 7 The difference between this embodiment and the first embodiment is that, since the chip body 12 is encapsulated in the first plastic package body 22 and the second plastic package body 13 at the same time, it is difficult to dissipate heat from the chip body 12. Therefore, a first insulating heat-conducting plate 31 is installed on both sides of the chip body 12. The first insulating heat-conducting plate 31 is a heat-conducting silicone grease plate. The heat-conducting silicone grease plate is made of organic silicone as the main raw material and is added with heat-resistant and heat-conducting materials to form a heat-conducting organic silicone grease plate. The first insulating heat-conducting plate 31 is bonded to the chip body 12 by a heat-conducting adhesive. A plug hole 32 is provided on the first insulating heat-conducting plate 31, and a plug hole 32 is provided on the plug hole 32. A heat conducting rod 33 is inserted into the hole 32. The heat conducting rod 33 is made of alumina ceramic and has the characteristics of insulation and heat conduction. One end of the heat conducting rod 33 is inserted into the socket 32. In order to improve the connection strength between the heat conducting rod 33 and the first insulating heat conducting plate 31, after coating the heat conducting glue on the heat conducting rod 33, it is inserted into the socket 32 ​​to complete the installation of the heat conducting rod 33 and the first insulating heat conducting plate 31. The other end of the heat conducting rod 33 extends to the side wall of the second plastic package 13, and its end face is flush with the end face of the second plastic package 13, which helps to export the heat generated by the chip body 12 out of the LGA chip packaging structure 1.

[0045] Before the LGA chip packaging structure 1 is plastic-sealed, the first insulating heat-conducting plate 31 is first installed on the chip body 12, and then the second guide wire 141 is installed. Then, thermal conductive glue is coated on the heat-conducting rod 33, and the heat-conducting rod 33 is inserted into the socket 32 ​​on the first insulating heat-conducting plate 31 to complete the installation of the heat-conducting rod 33. By splicing the heat-conducting rod 33 with the first insulating heat-conducting plate 31, the influence of the heat-conducting rod 33 on the installation of the second guide wire 141 can be effectively avoided, so as to facilitate the LGA plastic sealing of the chip body 12.

[0046] Reference Figure 5 , Figure 6 and Figure 7 A second insulating heat conducting plate 34 is provided on the outer side of the second plastic package 13. The material of the second insulating heat conducting plate 34 is the same as that of the first insulating heat conducting plate 31. The second insulating heat conducting plate 34 is arranged on both sides of the second plastic package 13 and is bonded to the second plastic package 13 by a thermally conductive adhesive to form a thermally conductive adhesive layer 35 in contact with the thermally conductive rod 33. The thermally conductive rod 33 is connected to the second insulating heat conducting plate 34 by the thermally conductive adhesive layer 35, thereby improving the stability of heat conduction between the thermally conductive rod 33 and the second insulating heat conducting plate 34. The second insulating heat conductive plate 34 is in contact with the second substrate 11, so that the heat of the second substrate 11 is transferred to the second insulating heat conductive plate 34. A heat dissipation rod 36 connected to the second insulating heat conductive plate 34 is provided in the first plastic package 22. The end of the heat dissipation rod 36 extends to the surface of the first plastic package 22, so that the heat on the second insulating heat conductive plate 34 is transferred to the end face of the heat dissipation rod 36 for heat dissipation. A connecting hole 37 for inserting the heat dissipation rod 36 is provided on the second insulating heat conductive plate 34, and the end of the heat dissipation rod 36 extends to the outer wall of the first plastic package 22.

[0047] The heat conducting rod 33 conducts heat to the second insulating heat conducting plate 34, and at the same time, the heat on the second substrate 11 is conducted to the second insulating heat conducting plate 34, and then the heat is transferred to the surface of the first plastic package 22 through the heat dissipation rod 36, which is beneficial to the heat dissipation of the LiSOP chip packaging structure; the heat dissipation rod 36 is inserted into the connecting hole 37 to complete the installation of the heat dissipation rod 36 and the second insulating heat dissipation plate, effectively avoiding the influence of the heat dissipation rod 36 on the installation of the first guide wire 24, and facilitating the plastic sealing process of the LiSOP chip packaging structure.

[0048] The implementation principle of Example 3 is as follows: the heat generated by the chip body 12 is transferred to the second insulating heat conducting plate 34 via the first insulating heat conducting plate 31 and the heat conducting rod 33, and the heat on the second substrate 11 is also transferred to the second insulating heat conducting plate 34, and then transferred to the surface of the first plastic package 22 via the heat dissipation rod 36 for heat dissipation, thereby improving the heat dissipation effect of the LiSOP chip packaging structure.

[0049] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A LiSOP chip packaging structure, characterized in that: The invention comprises an LGA chip packaging structure (1), a first substrate (21), a first plastic packaging body (22) and a pin (23); the LGA chip packaging structure (1) is arranged on the first substrate (21); one end of the pin (23) is arranged on the first substrate (21); the LGA chip packaging structure (1) is electrically connected to one end of the pin (23) arranged on the first substrate (21) via a first guide wire (24); and the first plastic packaging body (22) is used to partially wrap the LGA chip packaging structure (1), the first substrate (21) and the pin (23), so that the free end of the pin (23) protrudes from the side of the first plastic packaging body (22).

2. The LiSOP chip packaging structure according to claim 1, characterized in that: The pin (23) is fixedly connected to the first substrate (21), a soldering pad is provided on the pin (23), and the first guide wire (24) is connected to the soldering pad.

3. The LiSOP chip packaging structure according to claim 1, characterized in that: The first substrate (21) comprises a supporting portion (211) and connecting portions (212) on both sides, the connecting portions (212) being connected to the pins (23), and an installation space (213) for installing the LGA chip packaging structure (1) is formed between the connecting portion (212) and the supporting portion (211), so that the LGA chip packaging structure (1) can be located in the middle of the first plastic package (22).

4. The LiSOP chip packaging structure according to claim 1, characterized in that: The LGA chip packaging structure (1) comprises a second substrate (11), a chip body (12) and a second plastic packaging body (13); the chip body (12) is arranged on the second substrate (11) and is electrically and mechanically connected to a circuit on the second substrate (11) via a connector (14); the first guide wire (24) is electrically connected to a circuit on the second substrate (11); and the second plastic packaging body (13) is used to wrap the chip body (12) and the connector (14) on the second substrate (11).

5. The LiSOP chip packaging structure according to claim 4, characterized in that: The chip body (12) is connected to the second substrate (11) by a face-mounting method; The connecting member (14) comprises a second conductive wire (141), and the chip body (12) is electrically connected to the second substrate (11) via the second conductive wire (141).

6. The LiSOP chip packaging structure according to claim 4, characterized in that: The chip body (12) is connected to the second substrate (11) by a flip-chip method; The connecting member (14) comprises a solder ball (142), and the chip body (12) is electrically and mechanically connected to the second substrate (11) via the solder ball (142).

7. The LiSOP chip packaging structure according to claim 4, characterized in that: A first insulating heat-conducting plate (31) in contact with the chip body (12) is provided in the second plastic packaging body (13); a heat-conducting rod (33) is connected to the first insulating heat-conducting plate (31); and an end of the heat-conducting rod (33) extends to the outer wall of the second plastic packaging body (13).

8. The LiSOP chip packaging structure according to claim 7, characterized in that: The first insulating heat-conducting plate (31) is provided with a plug hole (32) for inserting the heat-conducting rod (33); the heat-conducting rod (33) is inserted into the plug hole (32) and connected to the first insulating heat-conducting plate (31) via heat-conducting glue.

9. The LiSOP chip packaging structure according to claim 7, characterized in that: A second insulating heat-conducting plate (34) is provided on the outer side of the second plastic-sealed body (13), and the second insulating heat-conducting plate (34) is connected to the second substrate (11) and the heat-conducting rod (33) to form heat transfer. A heat dissipating rod (36) connected to the second insulating heat-conducting plate (34) is provided in the first plastic-sealed body (22), and a connecting hole (37) for inserting the heat dissipating rod (36) is provided on the second insulating heat-conducting plate (34), and an end of the heat dissipating rod (36) extends to the outer side wall of the first plastic-sealed body (22).

10. The LiSOP chip packaging structure according to claim 9, characterized in that: The second insulating heat-conducting plate (34) and the second plastic package (13) are bonded together via a heat-conducting adhesive layer (35), and the heat-conducting adhesive layer (35) is connected to the heat-conducting rod (33), so that heat can be transferred between the second insulating heat-conducting plate (34) and the heat-conducting rod (33).

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