A fixture device for bonding a microstrip spacer ring assembly and its usage method

Abstract

The present invention discloses a fixture device for bonding a microstrip spacer ring assembly and a using method thereof, including a frame unit; a clamping unit, wherein the clamping unit is arranged on the side of the frame unit, and the clamping unit includes a placement cylinder for placing a microstrip substrate. The placement cylinder is arranged on the top of the frame unit, and a middle pressing plate for magnetically attracting a permanent magnet is arranged on the top of the placement cylinder. A fixing member is arranged between the middle pressing plate and the placement cylinder. By alternately pushing and heat-shrinking through the corresponding heat-conducting blocks of the first side plate and the second side plate, the outer side of the top surface of the permanent magnet is completely heat-shrunk and coated, so that the fixing member relatively completely coats and fixes the microstrip substrate with the outer side cleaned and the permanent magnet, thereby reducing the relative movement between the two adhesions, enabling the fixing member to act as a curing restriction, enabling the glue to be formed during the relative coating of the fixing member on the microstrip substrate and the permanent magnet, reducing the time-consuming of the clamping and installation process, and reducing product quality problems caused by the deviation of the bonding position.

Description

Technical Field

[0001] The present invention relates to the technical field of microstrip isolation rings, and particularly to a fixture device for bonding microstrip isolation ring components and a method for using the same. Background Art

[0002] The microstrip isolation ring component is a key electronic component in the microwave industry. It is designed by utilizing the microwave gyromagnetic characteristics and non-reciprocal characteristics of ferrite materials and is used for inter-stage decoupling, impedance matching, duplexing, and circulation in microwave systems, and is widely applied in the field of microwave communication.

[0003] Chinese Patent CN202311048080.3 discloses a microstrip isolator circulator component with a shielding card, which relates to the technical field of isolator circulators. The component of the present invention includes a lower shielding card, a thin-film circuit substrate is arranged at the top end of the lower shielding card, a microstrip thin-film circuit is arranged on the thin-film circuit substrate, and the microstrip thin-film circuit is formed by cascading a double-Y junction circulator circuit and a double-Y junction isolator circuit. Two dielectric sheets are arranged at the top end of the thin-film circuit substrate, permanent magnets are respectively arranged at the top ends of the two dielectric sheets, and an upper shielding card is fixedly connected to the top ends of the two permanent magnets. The above invention is a microstrip isolator circulator component with a shielding card. By cascading the double-Y junction circulator circuit and the double-Y junction isolator circuit and adjusting the matching between the two junctions by adding matching blocks to achieve excellent isolation; and then by bonding the shielding card above the magnetic field and tightly combining the upper and lower shielding cards of the product to form an effective ground connection and magnetic circuit, the problems of mutual influence between products and cavity resonance are solved.

[0004] The following problems exist in the above patent and the prior art:

[0005] In the bonding process of traditional shielded microstrip isolation ring components, it is usually carried out manually. The disadvantages of manual bonding are as follows:

[0006] First, when bonding, one or more polytetrafluoroethylene dielectric blocks need to be placed to fix the position of the permanent magnet to prevent the permanent magnet from attracting each other with the magnetic circuit and between the permanent magnets. This process often requires repeated rework to adjust the position of the permanent magnet, resulting in low efficiency.

[0007] Second, due to inconsistent bonding positions, the performance deviates, and unqualified products appear in the cured finished products, resulting in a reduction in the qualified rate.

[0008] Third, after bonding, it is necessary to continuously maintain the clamping state, and the single process takes a long time. If the clamping is released in advance, the bonding will not be cured thoroughly, and the components are likely to separate during subsequent processing or use. Summary of the Invention

[0009] The purpose of this section is to outline some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section, as well as in the abstract and title of the present application, to avoid obscuring the purpose of this section, the abstract, and the title. However, such simplifications or omissions shall not be used to limit the scope of the present invention.

[0010] To solve the above technical problems, the present invention provides the following technical solutions:

[0011] A fixture device for bonding a microstrip spacer ring assembly, comprising:

[0012] A frame unit;

[0013] A clamping unit, a clamping unit is provided on the side of the frame unit. The clamping unit includes a placement cylinder for placing a microstrip substrate. The placement cylinder is provided on the top of the frame unit. A middle pressing plate for magnetically attracting a permanent magnet is provided on the top of the placement cylinder. A fixing member is provided between the middle pressing plate and the placement cylinder. Upper and lower frame plates are symmetrically provided at the upper and lower parts of the fixing member. A scraping block for cleaning the connection surface between the microstrip substrate and the permanent magnet is provided on the side of the upper frame plate. A scraping blade is installed inside the scraping block. A circular sticking roller and a heat conducting block are provided on the side of the lower frame plate. A heating cavity is provided inside the heat conducting block.

[0014] As a preferred embodiment of the fixture device for bonding a microstrip spacer ring assembly of the present invention, wherein: the frame unit includes a bottom frame, the bottom frame is fixedly provided at the bottom of a plurality of placement cylinders. A fixing plate is fixedly connected to the middle of the bottom surface of the bottom frame. A separation driving source is fixedly connected to the side of the fixing plate. The output shaft of the separation driving source is fixedly connected to an inner bottom plate. A separation rod is fixedly connected to the top of the inner bottom plate. The separation rod movably passes through the bottom frame and is fixedly connected to a receiving plate inside the placement cylinder;

[0015] A bottom clamping driving source is fixedly connected to the bottom surface of the bottom frame. The output shaft of the bottom clamping driving source is fixedly connected to an outer bottom plate. A bottom clamping rod is fixedly connected to the top of the outer bottom plate. The bottom clamping rod movably passes through the bottom frame and is fixedly connected to the bottom surface of the lower frame plate.

[0016] As a preferred embodiment of the fixture device for bonding a microstrip spacer ring assembly of the present invention, wherein: a top frame is fixedly connected to the top of the bottom frame. An external pressing driving source is installed at the center of the top surface of the top frame. The output shaft of the external pressing driving source is fixedly connected to the top surface of an opening frame. An external pressing plate is fixedly connected to the bottom of the opening frame;

[0017] An internal pressing driving source is provided on the side of the external pressing driving source. The output shaft of the internal pressing driving source is fixedly connected to a common connecting plate. The common connecting plate is fixedly connected to the middle pressing plate through a middle pressing rod at its bottom;

[0018] A clamping driving source and a cutting driving source are sequentially arranged on the side of the internal pressure driving source. The output shaft of the clamping driving source is fixedly connected to a synchronous plate, and the synchronous plate is fixedly connected to an upper frame plate through a clamping rod at its bottom;

[0019] The output shaft of the cutting driving source is fixedly connected to a folding rod, and the cutting driving source is fixedly connected to a frame through the folding rod.

[0020] As a preferred embodiment of the fixture device for bonding microstrip spacer ring components of the present invention, wherein: the middle pressing plate is movably arranged inside the outer pressing plate;

[0021] Two rollers are rotatably installed on the side of the top frame. The two rollers are symmetric about the midline of the top frame, and a fixing member is wound on the surface of the rollers;

[0022] A receiving bin is arranged on the top surface of the bottom frame corresponding to the outside of the placing cylinder.

[0023] As a preferred embodiment of the fixture device for bonding microstrip spacer ring components of the present invention, wherein: the frame is composed of two first side plates and two second side plates, and the adjacent first side plates are fixedly connected through the second side plates;

[0024] Two third guide rails are arranged on the inner sides of the first side plates and the second side plates. The first side plates and the second side plates are both fixedly connected to a cutting frame through the third guide rails, and a cutting knife is arranged at the bottom of the cutting frame;

[0025] The inner side of the first side plate is fixedly connected to a first guide rail, and the inner side of the second side plate is fixedly connected to a second guide rail.

[0026] As a preferred embodiment of the fixture device for bonding microstrip spacer ring components of the present invention, wherein: the first guide rail is composed of a bottom straight section one, a middle inclined section one, a top straight section one and a top inclined section connected from bottom to top;

[0027] The second guide rail is composed of a bottom straight section two, a middle inclined section two, a middle straight section, a top inner inclined section, a top outer inclined section and a top straight section two connected from bottom to top;

[0028] The third guide rail is composed of a bottom straight section three, a middle inclined section three and a top straight section three connected from bottom to top.

[0029] As a preferred embodiment of the fixture device for bonding microstrip spacer ring components of the present invention, wherein: the distances from the bottom straight section one, the middle inclined section one, the top straight section one and the top inclined section to the placing cylinder decrease in sequence;

[0030] The distances from the bottom straight section two, the middle inclined section two, the middle straight section, the top inner inclined section to the placing cylinder decrease in sequence, and the distances from the top outer inclined section and the top straight section two to the placing cylinder increase in sequence;

[0031] The distances from the bottom straight section three, the middle inclined section three, and the top straight section three to the placement cylinder decrease in sequence.

[0032] As a preferred embodiment of the fixture device for bonding the microstrip spacer ring assembly of the present invention, wherein: a first vertical plate is installed at the top of the upper frame plate, a scraping rod is movably installed inside the first vertical plate, a first rolling member is arranged on the outer side of the scraping rod, a scraping block is fixedly connected to the inner side of the scraping rod, and a first supporting member is arranged between the first rolling member and the first vertical plate;

[0033] An open port is formed on the side of the scraping block opposite to the scraping rod, and a scraper is arranged at the bottom of the open port.

[0034] As a preferred embodiment of the fixture device for bonding the microstrip spacer ring assembly of the present invention, wherein: a second vertical plate is connected to the bottom of the lower frame plate, a fitting rod is movably installed inside the second vertical plate, a second rolling member is installed on the outer side of the fitting rod, a fitting member is fixedly connected to the inner side of the fitting rod, and a second supporting member is arranged between the second rolling member and the second vertical plate;

[0035] A circular fitting roller is rotatably installed on the inner side of the top of the fitting member, a heat conducting block is fixedly connected to the bottom of the fitting member, and a heating cavity is arranged at the bottom of the heat conducting block.

[0036] Another object of the present invention is to provide a method for using a fixture for bonding a microstrip spacer ring assembly in view of the deficiencies of the prior art, which includes the following steps:

[0037] Step 1, initial feeding: Pull the fixing member from the roll and cover it on the top of the placement cylinder, clamp it by the upper frame plate and the lower frame plate, then press down the outer pressing plate and the middle pressing plate to make the fixing member contact the receiving plate, and then reset the outer pressing plate and the middle pressing plate;

[0038] Step 2, clamping and installation: Place the microstrip substrate on the surface of the fixing member above the receiving plate, then make the middle pressing plate adsorb the permanent magnet, and apply glue to the bottom surface of the permanent magnet, and then control the middle pressing plate and the receiving plate to close to install the permanent magnet on the surface of the microstrip substrate;

[0039] Step 3, active cleaning: Move the upper frame plate and the lower frame plate upward. During the upward movement of the upper frame plate, the scraper cleans the glue overflowing between the microstrip substrate and the permanent magnet;

[0040] Step 4, positioning and limiting: Move the lower frame plate upward to make the circular fitting roller roll the fixing member onto the surfaces of the microstrip substrate and the permanent magnet, and then make the heat conducting block heat-shrink the fixing member onto the surfaces of the microstrip substrate and the permanent magnet for position limitation.

[0041] The beneficial effects of the present invention:

[0042] 1. Start with an external pressure driving source and an internal pressure driving source, causing the external pressing plate and the middle pressing plate at the bottom to move downward together into the interior of the placement cylinder. The middle part of the fixing member clamped by the upper frame plate and the lower frame plate at the top of the placement cylinder is pushed by the external pressing plate and the middle pressing plate into the interior of the placement cylinder to contact the receiving plate. This facilitates the subsequent placement of the microstrip substrate into the placement cylinder where the fixing member is laid, thereby reducing the production wear of the microstrip substrate relative to the placement cylinder.

[0043] 2. Through the downward pressing of the external pressing plate and the middle pressing plate, the middle part of the fixing member can fully adapt to the space formed by the inner side of the placement cylinder and the top of the receiving plate for placing the microstrip substrate. The fixing member fills into the interior of the enclosed space, and the interior of the enclosed space is filled elastically relative to the fixing member made of a flexible material. After the microstrip substrate is placed into the space formed by the receiving plate and the placement cylinder, the side of the microstrip substrate is elastically wrapped and restricted by the fixing member that is press-fitted and filled in the interior of the enclosed space, thereby reducing the subsequent shaking during the installation after the microstrip substrate is placed and making the installation of the microstrip substrate and the permanent magnet more accurate.

[0044] 3. After the permanent magnet and the microstrip substrate are adhesively contacted, the middle pressing plate and the receiving plate controlled by the separation driving source move upward synchronously, causing the bottom of the microstrip substrate to expose outside the placement cylinder and corresponding to the position of the top straight section three. Then, the upper frame plate and the lower frame plate move upward synchronously, causing the sides of the microstrip substrate and the permanent magnet to be blocked by the fixing member clamped by the upper frame plate and the lower frame plate. During the upward movement of the upper frame plate, it will drive the rolling member one to pass through the middle inclined section three along the bottom straight section three and reach the interior of the top straight section three, causing the top straight section three to push the rolling member one, the scraping rod, and the scraping block to move inward. As a result, the four scraping blocks that initially had gaps at the position of the bottom straight section three move inward and combine, so that the area enclosed by the four scraping blocks matches the area of the microstrip substrate. Thus, during the upward movement of the scraping block along with the upper frame plate, the open mouth of the scraping block contacts the microstrip substrate, and the glue squeezed out by the contact between the microstrip substrate and the permanent magnet is scraped by the scraper and collected into the interior of the storage bin, thereby reducing the quality problems caused by excessive overflow of the adhesive glue.

[0045] IV. By synchronously moving the upper frame plate and the lower frame plate upward, the clamping state of the fixing member is maintained. At this time, the fixing member is located between the receiving plate and the fitting member. When the rolling members II on the sides of the first side plate and the second side plate pass through the inside of the same-length first bottom straight section and second bottom straight section and the inside of the first middle inclined section and second middle inclined section respectively, they will enter the inside of the first top straight section and the middle straight section respectively, reducing the distances between the first top straight section and the middle straight section and the placing cylinder compared with the distances between the first bottom straight section and the first middle inclined section, the second bottom straight section and the second middle inclined section and the placing cylinder, thereby generating extrusion, causing the first top straight section and the middle straight section to push the rolling members II, the fitting rods and the fitting member to move inward, and causing the fitting members corresponding to the sides of the first side plate and the first guide rail where there is still a gap initially to be combined inward, so that the area enclosed by the fitting members matches the area of the microstrip substrate. Thus, as the lower frame plate continues to move upward, the rolling members II continue to move upward with the lower frame plate and continue to move along the first top straight section and the middle straight section. During this process, the round sticking roller rolls the fixing member to the sides of the microstrip substrate and the permanent magnet, and starts the resistance wire inside the heating cavity. The relatively flat fixing member after being rolled by the round sticking roller is swept by the heat conducting block that moves upward with the round sticking roller at the bottom of the round sticking roller, so that the heat conducting block outputs heat to the fixing member leveled by the round sticking roller, causing the fixing member to shrink thermally to the sides of the microstrip substrate and the permanent magnet. At this time, the center of the fixing member is clamped relatively by the microstrip substrate and the receiving plate, while the outside of the fixing member is clamped and lifted by the upper frame plate and the lower frame plate, so that the microstrip substrate and the permanent magnet are wrapped by the fixing member and are convenient to be taken integrally from the surface of the receiving plate, enabling the clamping unit to quickly wrap and fix the next group of microstrip substrates and permanent magnets.

[0046] V. When the rolling member II corresponding to the second side plate enters the inside of the top outer inclined section after passing through the middle straight section, at this time, the heating cavity at the bottom of the fitting member corresponding to the second side plate fits to the top of the permanent magnet corresponding to the second side plate, causing the heating cavity to heat and shrink the fixing member corresponding to the second side plate to the top surface of the permanent magnet, that is, outside the surface in contact with the middle pressing plate, so that the fixing member performs thermal shrinkage wrapping on the outside of the top surface of the permanent magnet.

[0047] VI. Through the alternating pushing and thermal shrinking of the heat conducting blocks corresponding to the first side plate and the second side plate, the outside of the top surface of the permanent magnet is fully thermally shrink-wrapped, so that the fixing member wraps the microstrip substrate and the permanent magnet with the outside cleaned relatively completely, thereby relatively fixing the microstrip substrate and the permanent magnet, reducing the relative movement between the two during adhesion, enabling the fixing member to act as a curing restriction, causing the glue to be formed during the wrapping of the fixing member relative to the microstrip substrate and the permanent magnet, reducing the time-consuming of the clamping and installation process, and the wrapping of the fixing member is also convenient for the subsequent storage and transportation of the microstrip substrate and the permanent magnet. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the following will briefly introduce the drawings required for the description of the embodiments. Among them:

[0049] Figure 1It is a schematic diagram of the overall structure of the present invention;

[0050] Figure 2 This is a schematic diagram of the top structure connection of the chassis of the present invention;

[0051] Figure 3 for Figure 2 A schematic diagram of the enlarged structure of part A;

[0052] Figure 4 It is a schematic diagram of the connection of the clamping unit structure of the present invention;

[0053] Figure 5 This is a schematic diagram of the internal structure connection of the framework of the present invention;

[0054] Figure 6 It is a schematic diagram of the structural connection of the first guide rail, the second guide rail and the third guide rail of the present invention;

[0055] Figure 7 It is a schematic diagram of the closed structure connection between the upper frame plate and the lower frame plate of the present invention;

[0056] Figure 8 This is a schematic diagram of the upper frame plate structure connection of the present invention;

[0057] Figure 9 This is a schematic diagram of the connection of the scraper block structure of the present invention;

[0058] Figure 10 This is a schematic diagram of the connection of the lower frame plate structure of the present invention;

[0059] Figure 11 This is a schematic diagram of the connection structure of the clamping fixture of the upper frame plate and the lower frame plate of the present invention;

[0060] Figure 12 It is a schematic diagram of the process of the present invention.

[0061] In the figure:

[0062] 1. Frame unit; 101. bottom frame; 1011. fixing plate; 1012. disengagement drive source; 10121. bottom inner plate; 10122. disengagement rod; 10123. receiving plate; 1013. bottom clamping drive source; 1014. bottom outer plate; 10141. bottom clamping rod; 1015. storage bin; 102. top frame; 103. winding roller; 104. external pressure drive source; 1041. opening frame; 1042. external pressure plate; 105. internal pressure drive source; 1051. common connecting plate; 1052. middle pressure rod; 1053. middle pressure plate; 106. top clamping drive source; 1061. synchronous plate; 1062. top clamping rod; 107. cutting drive source; 1071. folding rod; 1072. bending connecting rod;

[0063] 2. Clamping unit; 201. Frame; 2011. First side plate; 2012. First guide rail; 20121. First bottom straight section; 20122. First middle inclined section; 20123. First top straight section; 20124. Top inclined section; 2013. Second side plate; 2014. Second guide rail; 20141. Second bottom straight section; 20142. Second middle inclined section; 20143. Middle straight section; 20144. Inner top inclined section; 20145. Outer top inclined section; 20146. Second top straight section; 2015. Third guide rail; 20151. Third bottom straight section; 20152. Third middle inclined section; 20153. Third top straight section; 2016. Cutting frame; 20161. Cutting knife; 202. Placing cylinder; 203. Upper frame plate; 2031. First vertical plate; 2032. Scraping rod; 2033. First rolling part; 2034. First support part; 2035. Scraping block; 20351. Storage bin; 20352. Open port; 20353. Scraping knife; 204. Lower frame plate; 2041. Second vertical plate; 2042. Fitting rod; 2043. Second rolling part; 2044. Second support part; 2045. Fitting part; 20451. Circular sticking roller; 20452. Heat conducting block; 20453. Heating cavity;

[0064] 3. Fixing part. Detailed implementation mode

[0065] To make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention are described clearly and completely. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the protection scope of the present invention. Embodiment 1

[0066] As Figure 1-11 shown, a fixture device for bonding a microstrip spacer ring assembly includes:

[0067] Frame unit 1;

[0068] The clamping unit 2 is provided on the side of the frame unit 1. The clamping unit 2 includes a placing cylinder 202 for placing the microstrip substrate. The placing cylinder 202 is arranged on the top of the frame unit 1. A middle pressing plate 1053 with a magnetic adsorption permanent magnet is provided on the top of the placing cylinder 202. A fixing member 3 is arranged between the middle pressing plate 1053 and the placing cylinder 202. The fixing member 3 is preferably a heat shrinkable film. Upper frame plates 203 and lower frame plates 204 are symmetrically arranged at the upper and lower parts of the fixing member 3. A scraping block 2035 for cleaning the connection surface between the microstrip substrate and the permanent magnet is arranged on the side of the upper frame plate 203. A scraping knife 20353 is installed inside the scraping block 2035. A circular sticking roller 20451 and a heat conducting block 20452 are arranged on the side of the lower frame plate 204. A heating cavity 20453 is arranged inside the heat conducting block 20452.

[0069] As Figure 1-3 shown, the frame unit 1 includes a bottom frame 101. The bottom frame 101 is fixedly arranged at the bottom of a plurality of placing cylinders 202. A fixing plate 1011 is fixedly connected to the middle of the bottom surface of the bottom frame 101. A separation driving source 1012 is fixedly connected to the side of the fixing plate 1011. The output shaft of the separation driving source 1012 is fixedly connected to an inner bottom plate 10121. A separation rod 10122 is fixedly connected to the top of the inner bottom plate 10121. The separation rod 10122 movably passes through the bottom frame 101 and is fixedly connected to a receiving plate 10123 inside the placing cylinder 202;

[0070] A bottom clamping driving source 1013 is fixedly connected to the bottom surface of the bottom frame 101. The output shaft of the bottom clamping driving source 1013 is fixedly connected to an outer bottom plate 1014. A bottom clamping rod 10141 is fixedly connected to the top of the outer bottom plate 1014. The bottom clamping rod 10141 movably passes through the bottom frame 101 and is fixedly connected to the bottom surface of the lower frame plate 204.

[0071] As Figure 1-3 shown, a top frame 102 is fixedly connected to the top of the bottom frame 101. An external pressure driving source 104 is installed at the center of the top surface of the top frame 102. The output shaft of the external pressure driving source 104 is fixedly connected to the top surface of an opening frame 1041. An external pressing plate 1042 is fixedly connected to the bottom of the opening frame 1041;

[0072] An internal pressure driving source 105 is arranged at the side of the external pressure driving source 104. The internal pressure driving source 105 is installed on the top surface of the top frame 102. The output shaft of the internal pressure driving source 105 is fixedly connected to a common connecting plate 1051. The common connecting plate 1051 is fixedly connected to the middle pressing plate 1053 through a middle pressure rod 1052 at its bottom;

[0073] On the side of the internal pressure driving source 105, a top clamping driving source 106 and a cutting driving source 107 are sequentially arranged. The top clamping driving source 106 and the cutting driving source 107 are both fixedly connected to the top surface of the top frame 102. The output shaft of the top clamping driving source 106 is fixedly connected to the synchronization plate 1061, and the synchronization plate 1061 is fixedly connected to the upper frame plate 203 through the top clamping rod 1062 at its bottom;

[0074] The output shaft of the cutting driving source 107 is fixedly connected to the folding rod 1071, and the cutting driving source 107 is fixedly connected to the frame 201 through the folding rod 1071. Adjacent frames 201 are fixedly connected through the bent connecting rod 1072.

[0075] The separation driving source 1012, the bottom clamping driving source 1013, the external pressure driving source 104, the internal pressure driving source 105, the top clamping driving source 106, and the cutting driving source 107 are all cylinders or electric telescopic cylinders, which are controlled by a unified PLC and powered by an external energy source.

[0076] As Figure 1-6 shown, the middle pressing plate 1053 is movably arranged inside the outer pressing plate 1042, and the combined area of the middle pressing plate 1053 and the outer pressing plate 1042 matches the internal area of the placing cylinder 202;

[0077] Two rollers 103 are rotatably installed on the side of the top frame 102. The two rollers 103 are symmetric about the midline of the top frame 102, and a fixing member 3 is wound around the surface of the roller 103;

[0078] A receiving bin 1015 is provided on the top surface of the bottom frame 101 corresponding to the outside of the placing cylinder 202.

[0079] As Figure 1-6 shown, the frame 201 is composed of two side plates one 2011 and two side plates two 2013. Adjacent side plates one 2011 are fixedly connected through side plates two 2013;

[0080] Two third guide rails 2015 are arranged on the inner sides of the side plates one 2011 and the side plates two 2013. The side plates one 2011 and the side plates two 2013 are both fixedly connected to the cutting frame 2016 through the third guide rails 2015, and a cutting knife 20161 is arranged at the bottom of the cutting frame 2016;

[0081] A first guide rail 2012 is fixedly connected to the inner side of the side plate one 2011, and a second guide rail 2014 is fixedly connected to the inner side of the side plate two 2013.

[0082] As Figure 1-6As shown, the first guide rail 2012 is formed by connecting a bottom straight section 1-20121, a middle inclined section 1-20122, a top straight section 1-20123, and a top inclined section 20124 from bottom to top;

[0083] The second guide rail 2014 is formed by connecting a bottom straight section 2-20141, a middle inclined section 2-20142, a middle straight section 20143, a top inner inclined section 20144, a top outer inclined section 20145, and a top straight section 2-20146 from bottom to top;

[0084] The third guide rail 2015 is formed by connecting a bottom straight section 3-20151, a middle inclined section 3-20152, and a top straight section 3-20153 from bottom to top.

[0085] As Figure 1-6 shown, the distances between the bottom straight section 1-20121, the middle inclined section 1-20122, the top straight section 1-20123, and the top inclined section 20124 and the placement cylinder 202 decrease in sequence;

[0086] The distances between the bottom straight section 2-20141, the middle inclined section 2-20142, the middle straight section 20143, and the top inner inclined section 20144 and the placement cylinder 202 decrease in sequence, and the distances between the top outer inclined section 20145 and the top straight section 2-20146 and the placement cylinder 202 increase in sequence;

[0087] The distances between the bottom straight section 3-20151, the middle inclined section 3-20152, and the top straight section 3-20153 and the placement cylinder 202 decrease in sequence.

[0088] It should be noted that the height positions of the bottom straight section 1-20121 and the middle inclined section 1-20122 correspond to those of the bottom straight section 2-20141 and the middle inclined section 2-20142, the height of the top straight section 1-20123 is the same as the total height obtained by adding the height of the middle straight section 20143, the height of the bottom half of the top inner inclined section 20144, the height of the top outer inclined section 20145, and the height of the top straight section 2-20146. Baffles are provided on the sides of the first guide rail 2012, the second guide rail 2014, and the third guide rail 2015, facilitating the movement of the first rolling element 2033 in the third guide rail 2015 and the movement of the second rolling element 2043 inside the first guide rail 2012 and the second guide rail 2014.

[0089] As Figure 5-11 shown, a first vertical plate 2031 is installed at the top of the upper frame plate 203. A scraping rod 2032 is movably installed inside the first vertical plate 2031. A first rolling element 2033 is provided on the outer side of the scraping rod 2032. A scraping block 2035 is fixedly connected to the inner side of the scraping rod 2032. A first support member 2034 is provided between the first rolling element 2033 and the first vertical plate 2031. The first rolling element 2033 is movably arranged inside the third guide rail 2015;

[0090] On the side of the scraping block 2035 opposite to the scraping rod 2032, an opening 20352 is provided. At the bottom of the opening 20352, a scraping blade 20353 is arranged, and a storage bin 20351 is arranged inside the scraping blade 20353.

[0091] As Figure 5-11 As shown, a second vertical plate 2041 is connected to the bottom of the lower frame plate 204. A fitting rod 2042 is movably installed inside the second vertical plate 2041. A second rolling member 2043 is installed on the outer side of the fitting rod 2042. A fitting member 2045 is fixedly connected to the inner side of the fitting rod 2042. A second support member 2044 is arranged between the second rolling member 2043 and the second vertical plate 2041. The corresponding second rolling members 2043 on the first side plate 2011 and the second side plate 2013 are respectively movably arranged inside the first guide rail 2012 and the second guide rail 2014;

[0092] Inside the inner side of the top of the fitting member 2045, a circular fitting roller 20451 is rotatably installed. A heat conducting block 20452 is fixedly connected to the bottom of the fitting member 2045. The material of the heat conducting block 20452 is made of a heat conducting material, such as copper. A heating cavity 20453 is arranged at the bottom of the heat conducting block 20452. A heating resistance wire is installed inside the heating cavity 20453, which is controlled by a unified PLC and supplied with energy by an external energy source. The first rolling member 2033 and the second rolling member 2043 are preferably rolling wheels or universal balls. The first support member 2034 and the second support member 2044 are preferably springs.

[0093] Operation process:

[0094] By passing the fixing member 3 on the roller 103 on one side of the top frame 102 through the bottom of the top frame 102 and winding it around the surface of the roller 103 on the other side of the top frame 102, fixing members 3 are arranged on the tops of the placing cylinders 202 on the top of the bottom frame 101. Then, the bottom clamp driving source 1013 and the top clamp driving source 106 are started, and the bottom clamp driving source 1013 and the top clamp driving source 106 respectively control the bottom clamp rod 10141 and the top clamp rod 1062 to move towards each other, so that multiple groups of upper frame plates 203 and lower frame plates 204 clamp the fixing member 3 on the top of the placing cylinder 202, thereby enabling the fixing member 3 to be clamped in multiple regions by the multiple groups of upper frame plates 203 and lower frame plates 204;

[0095] Then, start the external pressure driving source 104 and the internal pressure driving source 105, so that the external pressure plate 1042 and the middle pressure plate 1053 at their bottoms move downward together into the interior of the placement cylinder 202, and the middle part of the fixing member 3 clamped by the upper frame plate 203 and the lower frame plate 204 at the top of the placement cylinder 202 is pushed into the interior of the placement cylinder 202 by the external pressure plate 1042 and the middle pressure plate 1053 to contact the receiving plate 10123, thereby facilitating the subsequent placement of the microstrip substrate into the interior of the placement cylinder 202 for laying the fixing member 3, and reducing the production wear of the microstrip substrate relative to the placement cylinder 202;

[0096] The downward pressing of the external pressure plate 1042 and the middle pressure plate 1053 can make the middle part of the fixing member 3 fully adapt to the space formed by the inner side of the placement cylinder 202 and the top of the receiving plate 10123 for placing the microstrip substrate, and fill the interior of the enclosed space through the fixing member 3, so that the interior of the enclosed space is relatively elastically filled by the fixing member 3 made of flexible material. After the microstrip substrate is placed into the space enclosed by the receiving plate 10123 and the placement cylinder 202, the side part of the microstrip substrate is elastically wrapped and restricted by the fixing member 3 that is stamped and filled and fitted inside the enclosed space, thereby reducing the subsequent shaking during the installation after the microstrip substrate is placed, and making the installation of the microstrip substrate and the permanent magnet more accurate;

[0097] After the fixing member 3 is pressed into the interior of the placement cylinder 202, first lift the middle pressure plate 1053 and the external pressure plate 1042 successively, so that air can enter between the external pressure plate 1042 and the fixing member 3, reducing the situation that the external pressure plate 1042 lifts and brings up the fixing member 3. Then, manually place the microstrip substrate to be bonded on the top of the receiving plate 10123, and correspondingly place the permanent magnet to be adhered on the bottom of the corresponding middle pressure plate 1053, so that the iron middle pressure plate 1053 adsorbs to the middle top of the permanent magnet, and there is still space at the edge of the permanent magnet. Apply glue to the bottom of the permanent magnet, and then start the cutting driving source 107, so that the cutting driving source 107 drives the frame 201 to move downward through the folding rod 1071. Then, through the synchronous downward movement of the frame 201 and the bent connecting rod 1072, during the downward movement of the cutting knife 20161 at the bottom of the frame 201, the fixing member 3 clamped by the upper frame plate 203 and the lower frame plate 204 between adjacent frames 201 is pressed and cut, so that the cutting knife 20161 cuts the fixing member 3 into pieces. Subsequently, the cutting frame 2016 continues to move downward and finally contacts the top surface of the receiving bin 1015, so that the cutting knife 20161 is inserted into the interior of the receiving bin 1015, thus reaching the final position. When the frame 201 moves to the final position, the four rolling members one 2033 on the side of the upper frame plate 203 all enter the interior of the bottom straight section three 20151, and the rolling members two 2043 on the sides of the side plate one 2011 and the side plate two 2013 respectively enter the interior of the bottom straight section one 20121 and the bottom straight section two 20141, thereby completing the installation preparation between the microstrip substrate and the permanent magnet;

[0098] At this time, the internal pressure driving source 105 controls the downward movement of the middle pressing plate 1053 at its bottom, so that the middle pressing plate 1053 drives the magnetically attracted permanent magnet at its bottom to move downward and contact the microstrip substrate inside the placement cylinder 202, thereby completing the bonding of the microstrip substrate and the permanent magnet. Furthermore, the bonding of the microstrip substrate and the permanent magnet is achieved through the cooperation of the middle pressing plate 1053 and the placement cylinder 202, making the bonding of the microstrip substrate and the permanent magnet more precise, thus reducing unnecessary adjustments;

[0099] It should be noted that, in order to ensure the sufficient separation of the permanent magnet and the middle pressing plate 1053 in the subsequent process, the middle pressing plate 1053 is preferably an electromagnet, so that when the middle pressing plate 1053 separates from the permanent magnet, it is separated by power-off.

[0100] After the permanent magnet and the microstrip substrate are adhesively contacted, the middle pressing plate 1053 and the receiving plate 10123 controlled by the separation driving source 1012 move upward synchronously, so that the bottom of the microstrip substrate is exposed outside the placement cylinder 202 and corresponds to the position of the top straight section three 20153. Then, the upper frame plate 203 and the lower frame plate 204 move upward synchronously, so that the sides of the microstrip substrate and the permanent magnet are blocked by the fixing member 3 clamped by the upper frame plate 203 and the lower frame plate 204. During the upward movement of the upper frame plate 203, the rolling member one 2033 is driven to move along the bottom straight section three 20151 through the middle inclined section three 20152 and reach the inside of the top straight section three 20153, so that the top straight section three 20153 pushes the rolling member one 2033, the scraping rod 2032 and the scraping block 2035 to move inward, thereby causing the four scraping blocks 2035 initially having gaps at the position of the bottom straight section three 20151 to move inward and combine. Thus, the area enclosed by the four scraping blocks 2035 matches the area of the microstrip substrate. Therefore, during the upward movement of the scraping block 2035 along with the upper frame plate 203, the opening 20352 of the scraping block 2035 contacts the microstrip substrate, and the glue squeezed out by the contact between the microstrip substrate and the permanent magnet is scraped by the scraping knife 20353 and collected inside the storage bin 20351, thereby reducing the quality problems caused by excessive overflow of the bonding glue;

[0101] During the upward movement of the upper frame plate 203, it moves upward synchronously with the lower frame plate 204 to maintain the clamping state of the fixing member 3. At this time, the fixing member 3 is located between the receiving plate 10123 and the fitting member 2045. When the rolling members 2043 on the sides of the first side plate 2011 and the second side plate 2013 pass through the inside of the same-length first bottom straight section 20121 and the second bottom straight section 20141, as well as the inside of the first middle inclined section 20122 and the second middle inclined section 20142, they will respectively enter the inside of the first top straight section 20123 and the middle straight section 20143, making the distances between the first top straight section 20123 and the middle straight section 20143 and the placing cylinder 202 relatively smaller than the distances between the first bottom straight section 20121 and the first middle inclined section 20122, the second bottom straight section 20141 and the second middle inclined section 20142 and the placing cylinder 202. As a result, extrusion occurs, causing the first top straight section 20123 and the middle straight section 20143 to push the rolling members 2043, the fitting rods 2042, and the fitting member 2045 to move inward, making the fitting members 2045 corresponding to the sides of the first side plate 2011 and the first guide rail 2012 that initially still had gaps combine inward, so that the area enclosed by the fitting members 2045 matches the area of the microstrip substrate. Thus, as the lower frame plate 204 continues to move upward, the rolling members 2043 continue to move upward with the lower frame plate 204 and continue to move along the first top straight section 20123 and the middle straight section 20143. During this process, the circular sticking roller 20451 rolls the fixing member 3 onto the sides of the microstrip substrate and the permanent magnet, and starts the resistance wire inside the heating cavity 20453, so that the relatively flat fixing member 3 after being rolled by the circular sticking roller 20451 is swept by the heat conducting block 20452 that moves upward with the circular sticking roller 20451 at the bottom of the circular sticking roller 20451. The heat conducting block 20452 outputs heat to the fixing member 3 leveled by the circular sticking roller 20451, causing the fixing member 3 to shrink thermally onto the sides of the microstrip substrate and the permanent magnet. At this time, the center of the fixing member 3 is relatively clamped by the microstrip substrate and the receiving plate 10123, while the outside of the fixing member 3 is clamped and lifted by the upper frame plate 203 and the lower frame plate 204. Thus, after the microstrip substrate and the permanent magnet are covered by the fixing member 3, they are convenient to be integrally taken from the surface of the receiving plate 10123, enabling the clamping unit 2 to quickly cover and fix the next group of microstrip substrates and permanent magnets;

[0102] Furthermore, when the rolling member 2043 corresponding to the second side plate 2013 passes through the middle straight section 20143 and enters the inside of the top outer inclined section 20145, at this time, the heating cavity 20453 at the bottom of the fitting member 2045 corresponding to the second side plate 2013 fits to the top of the permanent magnet corresponding to the second side plate 2013 side, causing the heating cavity 20453 to heat and shrink the fixing member 3 on the second side plate 2013 side onto the top surface of the permanent magnet, that is, outside the surface in contact with the middle pressing plate 1053, so that the fixing member 3 performs thermal shrinkage coating on the outside of the top surface of the permanent magnet;

[0103] At this time, the first rolling member 2033 corresponding to the first side plate 2011 will continue to move inside the first top straight section 20123. When the second rolling member 2043 corresponding to the second side plate 2013 moves into the inside of the top outer inclined section 20145 as the lower frame plate 204 is lifted, the second rolling member 2043 corresponding to the second side plate 2013 drives the heat conducting block 20452 and the fitting member 2045 to retreat outward from the microstrip substrate under the spatial cooperation of the second supporting member 2044 and the space where the top outer inclined section 20145 expands relative to the top inner inclined section 20144. When the second rolling member 2043 corresponding to the second side plate 2013 moves to the second top straight section 20146, it completely withdraws from contact with the microstrip substrate;

[0104] At this time, the second rolling member 2043 corresponding to the first side plate 2011 moves into the inside of the top inclined section 20124. Under the continuous lifting of the lower frame plate 204, the fitting member 2045 corresponding to the first side plate 2011 is guided and extruded by the inner contraction space of the top inclined section 20124 for the second rolling member 2043, causing the fitting member 2045 to move towards the top center of the permanent magnet. At this time, the bottom surface of the heat conducting block 20452 contacts the top of the microstrip substrate. It should be noted that the height of the heat conducting block 20452 corresponding to the first side plate 2011 is higher than the height of the heat conducting block 20452 corresponding to the second guide rail 2014, so that the heat conducting block 20452 thermally shrinks the fixing member 3 on the side of the microstrip substrate corresponding to the first side plate 2011 to the top surface of the permanent magnet. Thus, through the alternating pushing and thermal shrinking of the heat conducting blocks 20452 corresponding to the first side plate 2011 and the second side plate 2013, the outer side of the top surface of the permanent magnet is completely thermally shrunk and coated, so that the fixing member 3 wraps and fixes the microstrip substrate and the permanent magnet with the outer side cleaned relatively completely, that is, all positions except the magnetic attraction position of the middle pressing plate 1053 relative to the permanent magnet are coated, so that the microstrip substrate and the permanent magnet are relatively fixed, thereby reducing the relative movement between their adhesions. At the same time, the wrapping and fixing of the fixing member 3 can also, after the wrapping is completed, continue to lift the upper frame plate 203 and the lower frame plate 204, enabling the worker to remove the wrapped microstrip substrate and permanent magnet through the gap between adjacent second bottom straight sections 20141, making the fixing member 3 act as a curing restriction, enabling the glue to be formed during the wrapping of the fixing member 3 relative to the microstrip substrate and the permanent magnet, reducing product quality problems caused by the offset of the bonding position, reducing the time-consuming of the clamping and installation process, and the wrapping of the fixing member 3 also facilitates the subsequent storage and transportation of the microstrip substrate and the permanent magnet. Embodiment 2

[0105] As Figure 12 shown, this embodiment provides a method for using a fixture for bonding a microstrip spacer ring assembly, which includes the following steps:

[0106] Step 1, Initial feeding: Pull the fixing part 3 from the winding roller 103 to cover the top of the placing cylinder 202, clamp it with the upper frame plate 203 and the lower frame plate 204, then press down the outer pressing plate 1042 and the middle pressing plate 1053 to make the fixing part 3 contact the receiving plate 10123, and then reset the outer pressing plate 1042 and the middle pressing plate 1053;

[0107] Step 2, Clamping and installation: Place the microstrip substrate on the surface of the fixing part 3 above the receiving plate 10123, then make the middle pressing plate 1053 adsorb the permanent magnet, and the bottom surface of the permanent magnet is smeared with glue, and then control the middle pressing plate 1053 and the receiving plate 10123 to close, so that the permanent magnet is installed on the surface of the microstrip substrate;

[0108] Step 3, Active cleaning: When the upper frame plate 203 and the lower frame plate 204 move upward, during the upward movement of the upper frame plate 203, the scraper 20353 cleans the glue overflowing between the microstrip substrate and the permanent magnet;

[0109] Step 4, Positioning and restriction: When the lower frame plate 204 moves upward, the circular sticking roller 20451 rolls the fixing part 3 onto the surfaces of the microstrip substrate and the permanent magnet, and then the heat-conducting block 20452 heat-shrinks the fixing part 3 onto the surfaces of the microstrip substrate and the permanent magnet for position restriction.

[0110] It should be noted that in this article, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variant thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of additional identical elements in the process, method, article or device including the said element.

[0111] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A fixture device for bonding a microstrip spacer ring assembly, characterized in that: include: Frame unit (1); A clamping unit (2), wherein the side of the frame unit (1) is provided with the clamping unit (2), the clamping unit (2) comprises a placement tube (202) for placing a microstrip substrate, the placement tube (202) is arranged on the top of the frame unit (1), a middle pressure plate (1053) with a magnetic permanent magnet is arranged on the top of the placement tube (202), a fixing member (3) is arranged between the middle pressure plate (1053) and the placement tube (202), and the upper and lower parts of the fixing member (3) are An upper frame plate (203) and a lower frame plate (204) are symmetrically arranged, a scraping block (2035) for cleaning the connection surface between the microstrip substrate and the permanent magnet is arranged on the side of the upper frame plate (203), a scraper (20353) is installed on the inner side of the scraping block (2035), a round sticking roller (20451) and a heat conducting block (20452) are arranged on the side of the lower frame plate (204), and a heating chamber (20453) is arranged inside the heat conducting block (20452); The frame unit (1) comprises a bottom frame (101), the top of the bottom frame (101) is fixedly connected to a top frame (102), an external pressure driving source (104) is installed at the center of the top surface of the top frame (102), the output shaft of the external pressure driving source (104) is fixedly connected to the top surface of an open frame (1041), and the bottom of the open frame (1041) is fixedly connected to an external pressure plate (1042); An internal pressure driving source (105) is disposed on the side of the external pressure driving source (104); an output shaft of the internal pressure driving source (105) is fixedly connected to a common connecting plate (1051); and the common connecting plate (1051) is fixedly connected via a medium pressure rod (1052) and a medium pressure plate (1053) at the bottom thereof; A top clamping drive source (106) and a cutting drive source (107) are sequentially arranged on the side of the internal pressure drive source (105); an output shaft of the top clamping drive source (106) is fixedly connected to a synchronous plate (1061); and the synchronous plate (1061) is fixedly connected to an upper frame plate (203) via a top clamping rod (1062) at its bottom; The output shaft of the cutting drive source (107) is fixedly connected to the folding rod (1071), and the cutting drive source (107) is fixedly connected to the frame (201) via the folding rod (1071); The frame (201) is composed of two side panels one (2011) and two side panels two (2013), and adjacent side panels one (2011) are fixedly connected via the side panels two (2013); Two third guide rails (2015) are arranged on the inner sides of the side panel 1 (2011) and the side panel 2 (2013); the side panel 1 (2011) and the side panel 2 (2013) are fixedly connected to a cutting frame (2016) via the third guide rails (2015); and a cutting knife (20161) is arranged at the bottom of the cutting frame (2016); The inner side of the side panel 1 (2011) is fixedly connected to a first guide rail (2012), and the inner side of the side panel 2 (2013) is fixedly connected to a second guide rail (2014); The first guide rail (2012) is composed of a bottom straight section 1 (20121), a middle inclined section 1 (20122), a top straight section 1 (20123), and a top inclined section (20124) connected from bottom to top; The second guide rail (2014) is composed of a second bottom straight section (20141), a second middle inclined section (20142), a middle straight section (20143), a top inner inclined section (20144), a top outer inclined section (20145), and a second top straight section (20146) connected from bottom to top; The third guide rail (2015) is composed of a bottom straight section three (20151), a middle inclined section three (20152) and a top straight section three (20153) connected from bottom to top; The distances between the bottom straight section 1 (20121), the middle inclined section 1 (20122), the top straight section 1 (20123), and the top inclined section (20124) and the placement tube (202) decrease in sequence; The distances between the bottom straight section 2 (20141), the middle oblique section 2 (20142), the middle straight section (20143), the top inner oblique section (20144) and the placement tube (202) are successively reduced, and the distances between the top outer oblique section (20145) and the top straight section 2 (20146) and the placement tube (202) are successively increased; The distances between the bottom straight section three (20151), the middle oblique section three (20152) and the top straight section three (20153) and the placement tube (202) decrease in sequence; The bottom of the lower frame plate (204) is connected to a second vertical plate (2041); a fitting rod (2042) is movably installed inside the second vertical plate (2041); a second rolling member (2043) is installed on the outside of the fitting rod (2042); a fitting member (2045) is fixedly connected to the inside of the fitting rod (2042); and a second supporting member (2044) is provided between the second rolling member (2043) and the second vertical plate (2041); A circular laminating roller (20451) is rotatably mounted on the inner side of the top of the laminating member (2045), a heat conducting block (20452) is fixedly connected to the bottom of the laminating member (20455), and a heating chamber (20453) is provided at the bottom of the heat conducting block (20452).

2. The fixture device for bonding microstrip spacer ring components according to claim 1, characterized in that: The base frame (101) is fixedly arranged at the bottom of a plurality of placement cylinders (202); a fixing plate (1011) is fixedly connected to the middle end of the bottom surface of the base frame (101); a disengagement driving source (1012) is fixedly connected to the side of the fixing plate (1011); an output shaft of the disengagement driving source (1012) is fixedly connected to a bottom inner plate (10121); a disengagement rod (10122) is fixedly connected to the top of the bottom inner plate (10121); the disengagement rod (10122) movably passes through the base frame (101) and is fixedly connected to a receiving plate (10123) inside the placement cylinder (202); The bottom surface of the bottom frame (101) is fixedly connected to a bottom clamp driving source (1013); the output shaft of the bottom clamp driving source (1013) is fixedly connected to a bottom outer plate (1014); the top of the bottom outer plate (1014) is fixedly connected to a bottom clamp rod (10141); the bottom clamp rod (10141) movably passes through the bottom frame (101) and is fixedly connected to the bottom surface of the lower frame plate (204).

3. The fixture device for bonding microstrip spacer ring components according to claim 2, characterized in that: The middle pressure plate (1053) is movably arranged inside the outer pressure plate (1042); Two rolling rollers (103) are rotatably mounted on the side of the top frame (102), the two rolling rollers (103) are symmetrical about the center line of the top frame (102), and the surfaces of the rolling rollers (103) are wound with fixing members (3); A receiving chamber (1015) is provided on the outer side of the placement cylinder (202) corresponding to the top surface of the bottom frame (101).

4. The fixture device for bonding microstrip spacer ring components according to claim 3, characterized in that: A vertical plate 1 (2031) is installed on the top of the upper frame plate (203), a scraping rod (2032) is movably installed inside the vertical plate 1 (2031), a rolling member 1 (2033) is arranged on the outside of the scraping rod (2032), a scraping block (2035) is fixedly connected to the inside of the scraping rod (2032), and a supporting member 1 (2034) is arranged between the rolling member 1 (2033) and the vertical plate 1 (2031); An open opening (20352) is provided on a side of the scraping block (2035) opposite to the scraping rod (2032), and a scraper (20353) is provided at the bottom of the open opening (20352).

5. A method for using a clamp for bonding a microstrip spacer ring assembly, applied to a clamp device for bonding a microstrip spacer ring assembly as described in any one of claims 1 to 4, characterized in that: The following steps are involved: Step 1, initial loading: the fixing member (3) is pulled out from the winding roller (103) to cover the top of the placing cylinder (202), clamped by the upper frame plate (203) and the lower frame plate (204), and then the outer pressure plate (1042) and the middle pressure plate (1053) are pressed down to make the fixing member (3) contact with the receiving plate (10123), and then the outer pressure plate (1042) and the middle pressure plate (1053) are reset; Step 2: Clamping and installing: placing the microstrip substrate on the surface of the fixing member (3) above the receiving plate (10123), allowing the intermediate pressure plate (1053) to adsorb the permanent magnet, and applying glue to the bottom surface of the permanent magnet, and then controlling the intermediate pressure plate (1053) and the receiving plate (10123) to close, so that the permanent magnet is installed on the surface of the microstrip substrate; Step 3: Active cleaning: by moving the upper frame plate (203) and the lower frame plate (204) upward, the scraper (20353) cleans the glue overflowing between the microstrip substrate and the permanent magnet during the upward movement of the upper frame plate (203); Step 4: Positioning and limiting: by moving the lower frame plate (204) upward, the circular pasting roller (20451) rolls the fixing part (3) onto the surface of the microstrip substrate and the permanent magnet, and then the heat conductive block (20452) heat-shrunk the fixing part (3) onto the surface of the microstrip substrate and the permanent magnet to limit the position.

Images