Transducer with piezoelectric element and method for manufacturing same

By forming a continuous piezoelectric element area on the surface of the flexible substrate of the ultrasonic transducer and forming a plurality of vibrating parts using a high rigidity support member, the problem of complicated manufacturing processes in the prior art is solved, and the synchronization of multiple vibrating parts is achieved. Vibration and efficient ultrasonic output.

CN119450320APending Publication Date: 2025-02-14ALPS ALPINE CO LTD
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Patent Information

Application Number
CN202411003165.4
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Priority Date
2023-08-01
Filing Date
2024-07-25
Publication Date
2025-02-14

AI Technical Summary

Technical Problem

In the manufacturing process, existing ultrasonic transducers need to be individually fixedly installed piezoelectric components and wiring, resulting in cumbersome manufacturing processes.

Method used

Using a converter design with a flexible substrate and a continuous piezoelectric element area, multiple vibrating parts are formed by forming a continuous region of the piezoelectric element on the surface of the flexible substrate and overlapping with the flexible substrate with a high rigidity support member to form multiple vibrating parts to achieve multiple Synchronous vibration of each vibrating part.

Benefits of technology

There is no need to individually arrange piezoelectric elements and wiring for each vibrating unit, which simplifies the manufacturing process and reduces costs, realizes synchronous vibration of multiple vibrating units, and improves ultrasonic output.

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Abstract

The present invention addresses the problem of providing an inverter having a piezoelectric element and a method for manufacturing the same, wherein a plurality of piezoelectric element-based vibration parts can be configured with a simple structure. [Solution] A piezoelectric sheet (2) has a piezoelectric element formed on the surface of a flexible substrate. In the support member (3), a plurality of holes (35) having the same inner diameter are formed in a support plate (30) such as a metal plate. The piezoelectric sheet (2) overlaps the first surface (31) of the support plate (30) and is fixed by adhesion. Among the element regions of the piezoelectric sheet (2), a region facing the hole (35) serves as a vibrating portion (v), and a region other than the hole (35) serves as a restraining portion (s) in which the piezoelectric sheet (2) is fixed without moving. The plurality of vibrating parts (v) have the same resonance frequency, and ultrasonic waves and the like can be synchronously generated from the vibrating parts (v).
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Description

Technical Field

[0001] The present invention relates to a transducer using a piezoelectric element that can be used as a speaker, a sensor, or the like. Background Art

[0002] Patent document 1 describes an invention related to an ultrasonic transducer. The ultrasonic transducer has an elastic plate that is able to vibrate in the direction of the plate thickness. The elastic plate is formed of stainless steel, Ni-Fe alloy, aluminum alloy, titanium alloy, carbon fiber reinforced plastic or ceramic. On the first surface of the elastic plate, a plurality of piezoelectric elements are fixedly mounted in a parallel state in the direction of the plate surface. The piezoelectric element has a piezoelectric body composed of PZT, and a pair of upper surface electrode layers and lower surface electrode layers arranged on both sides of the thickness direction of the piezoelectric body. In addition, it also has: a sealing component having a plurality of cylindrical portions that surround each of the plurality of piezoelectric elements when viewed from above, and a flexible wiring board that serves as a voltage supply path to the plurality of piezoelectric elements.

[0003] The elastic plate has a plurality of vibration regions in which the piezoelectric elements are respectively mounted, a plurality of low-rigidity regions surrounding the vibration regions, and a constraint region surrounding the plurality of low-rigidity regions. A slit is formed in the elastic plate in a boundary region located radially outward of the constraint region. By arranging the piezoelectric elements in the plurality of vibration regions surrounded by the low-rigidity regions, the plurality of vibration regions can be arranged close to each other.

[0004] Prior art literature:

[0005] Patent Literature:

[0006] Patent Document 1: International Publication WO2020 / 202351 Summary of the invention

[0007] Problems to be solved by the invention:

[0008] Although the ultrasonic transducer described in Patent Document 1 arranges multiple vibration areas closely on the first surface of the elastic plate, it is necessary to fix the piezoelectric elements individually in each vibration area, and further, it is necessary to set a flexible wiring board on the surface of the elastic plate and wire the flexible wiring board individually for each piezoelectric element, so the manufacturing process is very complicated.

[0009] The present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a transducer using piezoelectric elements and a method for manufacturing the transducer using piezoelectric elements, which can form a plurality of vibration parts using piezoelectric elements without individually providing the plurality of piezoelectric elements.

[0010] Means used to solve the problem:

[0011] The present invention relates to a transducer having a flexible substrate and a piezoelectric element formed on the surface of the flexible substrate, characterized in that:

[0012] On the surface of the flexible substrate, an element region is formed in which the piezoelectric element is continuous in the surface direction.

[0013] A support member having a higher rigidity than the flexible substrate and having a plurality of holes is provided, the flexible substrate is overlapped on the support member, and the plurality of holes are opposite to the element region.

[0014] The flexible substrate is in a free state inside the plurality of holes, and is fixed to the supporting member in regions outside the holes.

[0015] In the transducer having the piezoelectric element of the present invention, it is preferable that the plurality of holes overlapping the element region have the same inner diameter.

[0016] The transformer having a piezoelectric element of the present invention may be one in which the supporting member is overlapped on each of the two surfaces of the flexible substrate, and in a state in which the centers of the holes of the two supporting members are aligned, the area of ​​the supporting member where the holes are not formed is fixed to each surface of the flexible substrate.

[0017] The transducer having the piezoelectric element of the present invention can be configured such that the support member overlapping the element region is bent.

[0018] In addition, the present invention relates to a method for manufacturing a transducer, the transducer having a flexible substrate and a piezoelectric element formed on a surface of the flexible substrate, the method comprising the following steps:

[0019] A step of forming an element region where the piezoelectric element is continuous in a surface direction on the surface of the flexible substrate;

[0020] a step of forming a supporting member using a material having higher rigidity than the flexible substrate, the supporting member having a plurality of holes formed therein; and

[0021] The flexible substrate is overlapped on the supporting member so that the plurality of holes are opposite to the element region, the flexible substrate is made free inside the plurality of holes, and the flexible substrate is fixed to the supporting member in the region other than the holes.

[0022] The manufacturing method of the transformer with piezoelectric element of the present invention is as follows:

[0023] In the step of forming the device region,

[0024] On the surface of the flexible substrate, a lower surface electrode layer, a piezoelectric material layer and an upper surface electrode layer are stacked in sequence.

[0025] The manufacturing method of the transformer with piezoelectric element of the present invention is as follows:

[0026] In the step of forming the device region,

[0027] A piezoelectric element is formed by laminating a lower surface electrode layer on the lower surface of a piezoelectric material layer formed of a polymer piezoelectric material and laminating an upper surface electrode layer on the upper surface.

[0028] The piezoelectric element is fixed to the surface of the flexible substrate.

[0029] The manufacturing method of the transformer having the piezoelectric element of the present invention can be configured as follows:

[0030] Before or after the step of overlapping the flexible substrate and the supporting member,

[0031] The method includes the step of bending the supporting member.

[0032] Effect of the invention:

[0033] In the converter of the present invention, a component region in which the piezoelectric element is continuous in the surface direction is formed on the surface of the flexible substrate, a supporting component having a plurality of holes is overlapped on the surface of the flexible substrate, and a portion of the component region opposite to the plurality of holes functions as a vibrating portion. Since a plurality of substantially separated vibrating portions can be formed using one component region, it is not necessary to form a plurality of small piezoelectric elements. In addition, it is not necessary to individually connect wiring components to each vibrating portion. Therefore, a converter having a plurality of vibrating portions can be constructed at a low cost. BRIEF DESCRIPTION OF THE DRAWINGS

[0034] Figure 1 It is an exploded perspective view showing a first embodiment of a transducer having a piezoelectric element according to the present invention.

[0035] Figure 2 Yes means Figure 1 The illustrated diagram is a partial cross-sectional view of the assembled converter taken along line II-II.

[0036] Figure 3 This is a partial cross-sectional view showing a second embodiment of a transducer having a piezoelectric element according to the present invention.

[0037] Figure 4 Yes means Figure 2 An enlarged cross-sectional view showing the detailed structure of a piezoelectric sheet used in the transducer shown.

[0038] Figure 5 Yes means Figure 2An enlarged cross-sectional view of a modified example of the structure of a piezoelectric sheet used in the transducer shown.

[0039] Figure 6 It is an exploded perspective view showing a third embodiment of a transducer having a piezoelectric element according to the present invention.

[0040] Figure 7 It is a perspective view showing a state where the inverter according to the third embodiment is assembled.

[0041] Description of reference numerals:

[0042] 1. 101, 201 converter

[0043] 1. 102 piezoelectric sheet

[0044] 3.3A, 3B, 103 supporting parts

[0045] 10Flexible substrate

[0046] 20, 20A, 20B piezoelectric elements

[0047] 21 Lower surface electrode layer

[0048] 22 Upper surface electrode layer

[0049] 23 Piezoelectric material layer

[0050] 30 Support plate

[0051] 35 holes

[0052] DA element area

[0053] (s) Constraints

[0054] (v) Vibration part DETAILED DESCRIPTION

[0055] Figure 1 and Figure 2 1 shows a converter 1 according to a first embodiment of the present invention. The converter 1 is formed by stacking a piezoelectric sheet 2 and a support member 3. The piezoelectric sheet 2 has a flexible substrate 10. The flexible substrate 10 is an organic resin film such as a polyimide film that has elasticity and can be bent and deformed. Figure 4 As shown in the enlarged cross-sectional view of FIG. 1 , the flexible substrate 10 has a first surface 11 facing the Z1 direction and a second surface 12 facing the Z2 direction, and a piezoelectric element 20 is fixedly mounted on the first surface 11. Figure 1As shown, the flexible substrate 10 is a quadrilateral when viewed from above, and the piezoelectric element 20 fixedly mounted on the first surface 11 is also a quadrilateral. The piezoelectric element 20 is continuously formed in the surface direction in a large area on the first surface 11 of the flexible substrate 10. The area where the piezoelectric element 20 is continuously formed in the surface direction on the first surface 11 is the element area DA.

[0056] like Figure 4 As shown, the piezoelectric element 20 includes: a lower surface electrode layer 21 fixedly mounted on the first surface 11 of the flexible substrate 10, a piezoelectric material layer 23 stacked on the surface of the lower surface electrode layer 21, and an upper surface electrode layer 22 stacked on the surface of the piezoelectric material layer 23. In the manufacturing method of the piezoelectric element 20, a conductive metal layer such as a copper layer, a silver layer, or a gold layer is formed on the first surface 11 of the flexible substrate 10 by evaporation or sputtering, so as to manufacture the lower surface electrode layer 21. On the surface thereof, a ferroelectric ceramic such as barium titanate, barium zirconate, or lead zirconate titanate is sintered to form the piezoelectric material layer 23, and the upper surface electrode layer 22 is formed on the surface thereof by evaporation or sputtering. An electric field is applied to the piezoelectric material layer 23, and a polarization treatment is performed with the film thickness direction (Z direction) as the polarization direction. Alternatively, the piezoelectric material layer 23 may be formed of a polymer piezoelectric material such as polyvinylidene fluoride, a lower surface electrode layer 21 and an upper surface electrode layer 22 may be stacked on the film-like piezoelectric material layer 23 to form the piezoelectric element 20, and the piezoelectric element 20 may be bonded to the first surface 11 of the flexible substrate 10. In this case, an electric field is also applied to the piezoelectric material layer 23, and a polarization treatment is performed with the film thickness direction (Z direction) as the polarization direction.

[0057] like Figure 1 As shown, the flexible substrate 10 is formed with extensions 13 and 14. A lower surface terminal portion 24 is formed on the first surface of the extension portion 13, and an upper surface terminal portion 25 is formed on the first surface of the extension portion 14. The lower surface terminal portion 24 is a conductive metal layer, which is formed integrally and continuously with the lower surface electrode layer 21, or is formed separately from the lower surface electrode layer 21 and connected to the lower surface electrode layer 21. The upper surface electrode layer 25 is also a conductive metal layer, which is formed integrally and continuously with the upper surface electrode layer 22, or is formed separately from the upper surface electrode layer 22 and connected to the upper surface electrode layer 22.

[0058] Figure 1 and Figure 2The support member 3 shown has a support plate 30. The rigidity of the support plate 30 is higher than that of the flexible substrate 10, and the thickness of the support plate 30 is sufficiently larger than that of the flexible substrate 10. The support plate 30 is a metal plate such as a stainless steel plate, or a synthetic resin plate such as an epoxy plate. The support plate 30 has a first surface 31 facing the Z1 side, and a second surface 32 facing the opposite Z2 side. The piezoelectric sheet 2 is overlapped on the first surface 31. A plurality of holes 35 are formed in the support plate 30. The center line of each hole 35 is perpendicular to the first surface 31 and the second surface 32, and the hole 35 is formed through the support plate 30. The plurality of holes 35 are arranged at a certain pitch in the first direction (X direction) along the first surface 31, and are also arranged at a certain pitch in the second direction (Y direction) orthogonal to the first direction.

[0059] The holes 35 are cylindrical holes with a constant inner diameter from the first surface 31 of the support plate 30 to the second surface 32, and the inner diameter (inner diameter) of all the holes 35 is the same. In addition, the holes 35 may also be tapered in shape with the inner diameter gradually increasing from the first surface 31 to which the piezoelectric sheet 2 is fixed to the second surface 32 on the opposite side. In this case, the opening diameters of all the holes 35 presented on the first surface 31 are the same.

[0060] like Figure 2 As shown, the piezoelectric sheet 2 is bonded and fixed on the first surface 31 of the support plate 30 constituting the support member 3 to form the transformer 1. The element area DA of the piezoelectric sheet 2 is continuous in a predetermined area along the sheet surface, and the support plate 30 and the piezoelectric sheet 2 are bonded and fixed in such a manner that a plurality of holes 35 are opposed to the element area DA.

[0061] In the region where the hole 35 is not formed in the support member 3, the element region DA of the piezoelectric sheet 2 is bonded and fixed to the first surface 31 of the support plate 30. In the support member 3, the element region DA in the region opposite to the hole 35 is not fixed to the first surface 31 and is in a free state. That is, inside the hole 35, the flexible substrate 10 and the piezoelectric element 20 are in a free state. In the element region DA of the piezoelectric sheet 2, the portion opposite to the region where the hole 35 is not formed functions as a vibration portion (v), and the region where the hole 35 is not formed becomes a constraint portion (s) formed by fixing the piezoelectric sheet 2 to the first surface 31 of the support plate 30. When focusing on a group of multiple vibration portions (v), all the vibration portions (v) are circular and have the same diameter. In the constraint portion (s), the element region DA is fixed to the first surface 31 of the support plate 30 and is constrained on the entire surface of the region between adjacent holes 35, and the movement of the flexible substrate 10 and the piezoelectric element 20 is restricted.

[0062] Next, the operation of the above-mentioned converter 1 will be described.

[0063] If an AC voltage is applied between the lower surface terminal portion 24 and the upper surface terminal portion 25 of the piezoelectric sheet 2, the voltage between the lower surface electrode layer 21 and the upper surface electrode layer 22 acts on the piezoelectric material layer 23 in the thickness direction in the element area DA. Since the thickness direction of the piezoelectric material layer 23 is the polarization direction, the piezoelectric material layer 23 to which the voltage is applied is deformed. In the vibration portion (v), the piezoelectric sheet 2 is in a free state inside the hole 35, so due to the difference in volume change between the deformed piezoelectric element 20 and the flexible substrate 10, as shown in FIG. Figure 2 As shown by the middle dotted line, the piezoelectric sheet 2 is deformed and vibrates. In the restraining portion (s), the element area DA is fixed to the first surface 31 of the support plate 30, so the piezoelectric sheet 2 does not bend in the thickness direction.

[0064] If the converter 1 is used as a piezoelectric speaker, pressure waves caused by the flexural vibration of the piezoelectric sheet 2 are generated from the multiple vibration parts (v). In each vibration part (v), the piezoelectric sheet 2 located inside the hole 35 has a predetermined resonance frequency based on its mass and elastic modulus, so by applying an AC voltage of a specific frequency band including the above-mentioned resonance frequency to the piezoelectric sheet 2, the piezoelectric sheet 2 can be vibrated with high sensitivity. The output of the pressure wave of only one vibration part (v) is low, but since multiple vibration parts (v) having the same diameter and the same resonance frequency vibrate synchronously, the converter 1 as a whole can generate pressure waves with a larger output.

[0065] The converter 1 is used, for example, as a parametric speaker constituting a high-directivity sound system. The speaker applies FM modulation or AM modulation to 40kHz ultrasonic waves, for example, to reproduce the sound in the audible range in a space where two ultrasonic waves intersect, or to present audible sound through the nonlinear characteristics of ultrasonic waves when propagating in the air. The converter 1 of the embodiment can emit mutually synchronized ultrasonic waves from a plurality of vibration parts (v), thereby increasing the output of ultrasonic waves and reproducing audible sound with a higher output.

[0066] Figure 1 and Figure 2 The converter 1 of the first embodiment shown can use the Z1 side provided with the piezoelectric sheet 2 as the sounding direction (the direction of sending the pressure wave), or can use the Z2 side provided with the support member 3 as the sounding direction. When the Z2 side is used as the sounding direction, the directivity of the pressure wave can be further improved by setting the hole 35 as a cylindrical hole that is longer in the Z direction. In addition, when the Z2 side is used as the sounding direction, the shape of the hole 35 can also be set to a tapered shape in which the inner diameter gradually increases toward the Z2 direction.

[0067] exist Figure 5In the transformer 1A shown, a piezoelectric sheet 102 as a modified example is used. The piezoelectric sheet 102 is overlapped and fixed to the first surface 31 of the support plate 30 constituting the support member 3. The piezoelectric sheet 102 overlaps with the piezoelectric element 20A on the first surface 11 of the flexible substrate 10, and overlaps with the piezoelectric element 20B on the second surface 12. The piezoelectric element 20A and the piezoelectric element 20B are both structures in which a piezoelectric material layer 23 is sandwiched between a lower surface electrode layer 21 and an upper surface electrode layer 22. In the transformer 1A, the piezoelectric element 20A and the piezoelectric element 20B of the piezoelectric sheet 102 are applied with an AC voltage after phase inversion. When the piezoelectric element 20A is positively deformed, the piezoelectric element 20B is negatively deformed, and when the piezoelectric element 20A is negatively deformed, the piezoelectric element 20B is positively deformed. As a result, in the vibration part (v), the piezoelectric sheet 102 can be vibrated with high sensitivity.

[0068] exist Figure 3 In the converter 101 according to the second embodiment of the present invention shown in FIG. 1 , a support member 3A and a support member 3B are sandwiched between the support member 3A and the support member 3B. Figure 4 The piezoelectric sheet 2 shown or Figure 5 The inner diameter of the hole 35 formed in the support plate 30 of the support member 3A is the same as the inner diameter of the hole 35 formed in the support plate 30 of the support member 3B. Figure 3 As shown, each support member 3A, 3B is positioned so that the center of the hole 35 of the support member 3A coincides with the center of the hole 35 of the support member 3B in the Z direction. The element area DA of the piezoelectric sheet 2 is bonded and fixed to both the support member 3A and the support member 3B in the constraint portion (s). In the converter 101, since the element area DA can be fixed and constrained by the two support members 3A, 3B, the deformation of the piezoelectric material layer 23 in the constraint portion (s) in the thickness direction can be suppressed, and the vibration of the piezoelectric sheet 2 in the vibration portion (v) can be prevented from being affected by the above deformation.

[0069] Figure 6 and Figure 7The converter 201 of the third embodiment of the present invention is shown. In the converter 201, the support member 103 has a curved support plate 30, in which a plurality of holes 35 are formed. The support plate 30 is curved in such a manner that the first surface 31 can constitute a part of the cylindrical surface. That is, the support plate 30 is curved in two dimensions in such a manner that the radius from the virtual center line becomes constant, and the virtual center line is parallel to the first surface 31 and extends in the Y direction. The piezoelectric sheet 2 overlaps and is fixed to the first surface 31 which is the concave side of the support plate 30. The support plate 30 is formed by bending a metal plate in which a plurality of holes 35 are pre-formed using a stamping process. Alternatively, the support plate 30 can also be formed into a curved shape by a synthetic resin material. The piezoelectric sheet 2 is bonded to the concave side of the support plate 30 in a manner that imitates the concave surface. At this time, the piezoelectric sheet 2 and the support member 3 are positioned relative to each other so that the plurality of holes 35 are located within the element area DA of the piezoelectric sheet 2, and are bonded and fixed.

[0070] Figure 7 The transducer 201 of the third embodiment shown uses the concave side of the support member 3, i.e., the Z1 side, as the sound generation direction (the direction of sending the pressure wave). If the piezoelectric element 20 of the transducer 201 is operated, the pressure wave is emitted from the plurality of vibration parts (v), but since the plurality of vibration parts (v) are arranged along the concave curved surface, it is easy to concentrate the pressure wave at a predetermined position in the Z1 direction. When the piezoelectric sheet 2 coincides with a portion of the cylindrical surface, the pressure wave is concentrated near the center line of curvature of the cylindrical surface. If the transducer 201 is used as a parametric speaker, the listening sensitivity at the listening position can be improved.

[0071] As the structure of the converter 201 of the third embodiment, the piezoelectric sheet 2 may be stacked on the second surface 32 of the curved convex side of the support plate 30 and bonded and fixed. Figure 3 The transformer 101 shown in the figure is similarly configured to sandwich the piezoelectric sheet 2 between two curved support members 103. In the transformer 201 of the third embodiment, the curved shape of the support member 103 has a constant curvature in the X direction, but the curvature in the X direction may be different depending on the position, for example, the support member 103 may be curved in a manner that forms a quadratic function curve. Furthermore, the support member 103 may also be a three-dimensional curved shape having curvature in both the X direction and the Y direction.

[0072] In the converter of each of the above-mentioned embodiments, a piezoelectric element 20 (or 20A, 20B) is formed on the piezoelectric sheet 2 (or 102) and is continuously formed along the surface of the sheet. A plurality of vibration parts (v) are formed in a single element area DA where the piezoelectric element 20 is formed. Therefore, the process of forming the piezoelectric element 20 is easier than the structure in which a plurality of independent piezoelectric elements are arranged on the surface of the substrate. In addition, since there is no need to individually set a wiring path for each vibration part (v), the wiring structure can be made single, so the manufacturing process is simplified and can be manufactured at a low cost. In addition, the size of the piezoelectric element 20 that contributes to the vibration in each vibration part (v) is determined by the inner diameter of the hole 35. By processing the hole 35 with high precision in advance so that the inner diameter is the same in multiple holes 35, the deviation in the size of the deformable piezoelectric element 20 can be extremely small in each vibration part (v), and the vibration characteristics in each vibration part (v) can be uniformly formed.

[0073] In addition, the transducer of each embodiment can also be used as a piezoelectric sensor or an ultrasonic sensor. If an ultrasonic wave of about 40kHz is applied to the transducer, the piezoelectric element 20 in each vibration part (v) is deformed by the pressure wave. At this time, the ultrasonic wave can be detected by measuring the voltage generated between the lower surface electrode layer 21 and the upper surface electrode layer 22 of the piezoelectric element.

[0074] In the converter of the above-mentioned embodiment, a plurality of holes 35 having the same inner diameter are opposed to the element area DA of the piezoelectric element 20 which is continuous in the surface direction, thereby forming a plurality of vibration parts (v) having the same resonance frequency. However, a plurality of first holes having the same inner diameter and a plurality of second holes having the same inner diameter but different from the first holes may be formed in the vibration plate, and the plurality of first holes and the plurality of second holes may be opposed to the same element area DA. In this case, a plurality of first vibration parts opposed to the first holes and a plurality of second vibration parts opposed to the second holes may be formed in the same element area DA. Since the resonance frequencies of the first vibration part and the second vibration part are different from each other, ultrasonic waves of different frequencies can be generated simultaneously or alternately from the first vibration part and the second vibration part by applying a driving voltage corresponding to the resonance frequency of each hole. The number of types of holes may further be three or more.

Claims

1. A transducer having a piezoelectric element, comprising a flexible substrate and a piezoelectric element formed on a surface of the flexible substrate, characterized in that: On the surface of the flexible substrate, an element region is formed in which the piezoelectric element is continuous in the surface direction. A support member having a higher rigidity than the flexible substrate and having a plurality of holes is provided, the flexible substrate is overlapped on the support member, and the plurality of holes are opposite to the element region. The flexible substrate is in a free state inside the plurality of holes, and is fixed to the supporting member in regions outside the holes.

2. The transducer having a piezoelectric element according to claim 1, wherein: The plurality of holes overlapping the element region have the same inner diameter.

3. The transducer having a piezoelectric element according to claim 1, wherein: The supporting members are overlapped on each of the two surfaces of the flexible substrate, and the areas of the supporting members where the holes are not formed are fixed to the respective surfaces of the flexible substrate in a state in which the centers of the holes of the two supporting members coincide with each other.

4. The transducer having a piezoelectric element according to any one of claims 1 to 3, wherein: The support member overlapping the device region is bent.

5. A method for manufacturing a transducer having a piezoelectric element, the transducer having a flexible substrate and a piezoelectric element formed on a surface of the flexible substrate, the method comprising the following steps: A step of forming an element region where the piezoelectric element is continuous in a surface direction on the surface of the flexible substrate; a step of forming a supporting member using a material having higher rigidity than the flexible substrate, the supporting member having a plurality of holes formed therein; and The flexible substrate is overlapped on the supporting member so that the plurality of holes are opposite to the element region, the flexible substrate is made free inside the plurality of holes, and the flexible substrate is fixed to the supporting member in the region other than the holes.

6. The method for manufacturing a transducer having a piezoelectric element according to claim 5, wherein: In the step of forming the device region, On the surface of the flexible substrate, a lower surface electrode layer, a piezoelectric material layer and an upper surface electrode layer are stacked in sequence.

7. The method for manufacturing a transducer having a piezoelectric element according to claim 5, wherein: In the step of forming the device region, A piezoelectric element is formed by laminating a lower surface electrode layer on the lower surface of a piezoelectric material layer formed of a polymer piezoelectric material and laminating an upper surface electrode layer on the upper surface. The piezoelectric element is fixed to the surface of the flexible substrate.

8. The method for manufacturing a transducer having a piezoelectric element according to any one of claims 5 to 7, wherein: Before or after the step of overlapping the flexible substrate and the supporting member, The method includes the step of bending the supporting member.

Citation Information

Patent Citations

  • Ultrasonic transducer and production method for same

    WO2020202351A1