A flattening device for circuit board production and processing

Abstract

The present invention relates to the technical field of flattening devices, and discloses a flattening device for circuit board production and processing, comprising an input mechanism, wherein two groups of equidistant brackets are vertically installed in the middle position of the upper surface of the input mechanism, wherein monitoring boards are vertically installed on the upper surfaces of the two groups of brackets, and the upper surfaces of the two groups of brackets are respectively vertically installed at the four corners of the bottom of the monitoring board, a camera is installed in the middle position of the lower surface of the monitoring board, and an irradiation device is installed at the bottom of the monitoring board near the camera, and the irradiation device provides an irradiation light source to the circuit board. The control system of the present invention can judge whether the amount of dust adhesion on the surface of the circuit board exceeds the rated range by analyzing the light intensity, thereby achieving the effect of automatically monitoring the amount of dust adhesion on the surface of the circuit board; driving the main scratch plate and the auxiliary scratch plate to perform scratching and cleaning operations on various parts of the surface of the circuit board to be flattened, thereby achieving the effect of automatically cleaning the dust on the surface of the circuit board to be flattened.

Description

Technical Field

[0001] The present invention relates to the technical field of flattening devices, and more particularly to a flattening device for producing and processing circuit boards. Background Art

[0002] The flattening device used in the production and processing of circuit boards is an important part of the circuit board processing production line. Among them, the common flattening device is mainly composed of a conveying mechanism, a film-applying mechanism, a film-laminating mechanism, a flattening mechanism, and a film-removing mechanism. The specific process of the flattening device for circuit board processing is as follows: the circuit board to be processed is placed on the conveying mechanism, and the release film and other required processing materials are prepared; the film-applying mechanism covers the release film on the surface of the circuit board to prepare for the subsequent film-laminating and flattening operations; the film-laminating mechanism tightly fits the circuit board and the release film to ensure that the release film can be firmly attached to the surface of the circuit board; the flattening mechanism flattens the solder mask layer on the circuit board, and makes the solder mask layer flat by applying appropriate pressure and temperature; after the flattening operation is completed, the film-removing mechanism peels off the release film from the surface of the circuit board to expose the flat solder mask layer;

[0003] Before the circuit boards were processed, we found that some of the circuit boards had uneven surfaces. The main reason for this phenomenon was that the board was damp, heated for too long, and other reasons, resulting in uneven surfaces on the circuit boards. The impact of this phenomenon was as follows: inaccurate positioning: on the automated surface mount line, uneven circuit boards will lead to inaccurate positioning, making it impossible for components to be accurately inserted or mounted on the holes and surface mount pads of the board, and may even damage the automatic insertion machine. At the same time, dust appeared on the surface of the circuit boards during processing, which reduced the flattening effect of the circuit boards during the flattening process. The main reason for this problem was that the presence of dust would increase the unevenness of the circuit board surface, making it difficult for the flattening process to achieve the ideal effect. The above situation can only be discovered through manual quality inspection, resulting in a certain amount of manpower waste.

[0004] Therefore, we are in urgent need of a flattening device for circuit board production and processing to solve the above-mentioned problems. Summary of the Invention

[0005] In order to overcome the above-mentioned defects of the prior art, the present invention provides a flattening device for circuit board production and processing to solve the problems existing in the above-mentioned background technology.

[0006] The present invention provides the following technical solution: a flattening device for producing and processing circuit boards, comprising:

[0007] Control base;

[0008] A flattening mechanism is used for flattening circuit boards. The flattening mechanism is mounted on the upper surface of the control base. An input mechanism is vertically mounted at the front end of the flattening mechanism near its inlet for inputting unflattened circuit boards. An output mechanism is vertically mounted at the back end of the flattening mechanism near its outlet for outputting flattened circuit boards.

[0009] A control device for monitoring the overall status of the circuit board, wherein the control device is mounted on the side of the front end of the flattening mechanism, wherein a control system is provided inside the control device;

[0010] Two groups of equidistant brackets are vertically installed in the middle position of the upper surface of the input mechanism, and monitoring boards are vertically installed on the upper surfaces of the two groups of brackets. The upper surfaces of the two groups of brackets are respectively vertically installed at the four corners of the bottom of the monitoring board. A camera is installed in the middle position of the lower surface of the monitoring board, and an illumination device is installed at the bottom of the monitoring board near the camera. The illumination device provides an illumination light source to the circuit board, and the camera collects the light intensity generated by the circuit board after illumination and transmits it to the control system.

[0011] Furthermore, four groups of electric lifting columns are vertically installed near the geometric center point of the lower surface of the monitoring plate. The four groups of electric lifting columns are symmetrically and equidistantly distributed with the geometric center point of the monitoring plate as the center of symmetry. The bottoms of the four groups of electric lifting columns are vertically installed with dust cleaning monitoring plates. The bottoms of the four groups of electric lifting columns are vertically installed at the four corners of the upper surface of the dust cleaning monitoring plate, and folding plates are installed on the sides of adjacent electric lifting columns. When the dust cleaning monitoring plate contacts the surface of the input mechanism, the dust cleaning monitoring plate, the electric lifting columns, the folding plate, the monitoring plate and the input mechanism can form an independent sealed space.

[0012] Furthermore, the monitoring board is embedded with a storage cylinder near its geometric center point, an air pump is installed through the middle position of the upper surface of the storage cylinder, a filter is installed at the output end of the air pump to block dust, a Y-shaped delivery pipe is installed through the middle position of the bottom of the storage cylinder, and two sets of independent air outlets are provided at the end of the Y-shaped delivery pipe away from the storage cylinder position, and a solenoid valve is installed in each set of air outlets to control the flow direction of gas.

[0013] Furthermore, an annular air pressure cabin is provided at the bottom of the cleaning monitoring plate, and a rubber plate is installed at the bottom of the cleaning monitoring plate near the air pressure cabin. The inner wall of the air pressure cabin is matched with the outer wall of the rubber plate, and the two can form an independent sealed space. An air pressure sensor is installed on the inner wall of the air pressure cabin, and a first delivery hole is provided on the inner wall of the cleaning monitoring plate to match a group of independent air outlets of the Y-shaped delivery pipe. The compressed air generated by the air pump is input into the air pressure cabin through a group of independent air outlets and the first delivery hole of the Y-shaped delivery pipe. The air pressure sensor collects the air pressure data inside the air pressure cabin and transmits it to the control system.

[0014] Furthermore, the dust cleaning monitoring plate is vertically installed with a first electric lifting column on the inner side surface near the other group of air outlet positions of the Y-shaped conveying pipe, and a main scratching plate is installed on the output end of the first electric lifting column. Sliders are installed on both sides of the main scratching plate, and the dust cleaning monitoring plate is provided with a corresponding slide rail on the inner side surface near the slider position to ensure that the slider moves parallel to the slide rail.

[0015] Furthermore, an independent air groove is provided inside the main scratch plate, and a second delivery hole adapted to another set of air outlets of the Y-shaped delivery pipe is provided on the outer wall of the main scratch plate, and the second delivery hole is in communication with the air groove, an auxiliary scratch plate is installed at the bottom of the main scratch plate away from the position of the first electric lifting column, and an adsorption hole is provided inside the main scratch plate near the position of the auxiliary scratch plate, and the adsorption hole is in communication with the air groove, and a lifting groove is provided in the middle position of the bottom of the air groove, an adsorption sponge is movably sleeved in the lifting groove, and a micro-electric control column is installed on the upper surface of the adsorption sponge, the upper surface of the micro-electric control column is installed inside the lifting groove, and the micro-electric control column inputs a stable working current to drive the adsorption sponge to contact the surface of the circuit board to be flattened to perform dust cleaning and dehumidification operations;

[0016] A hydraulic cabin is provided at the bottom of the main scratch plate near the position of the first electric lifting column. A rubber pad is installed on the inner wall of the bottom of the hydraulic cabin. An independent sealed space is provided between the rubber pad and the hydraulic cabin. A certain amount of hydraulic oil is stored in the sealed space, and a pressure sensor is installed in the hydraulic cabin for monitoring the pressure data in the sealed space and transmitting it to the control system.

[0017] Furthermore, the control system includes a threshold range and an early warning unit. The threshold range includes a first threshold range, a second threshold range, and a third threshold range. The control system compares the real-time light intensity with the first threshold range. When the real-time light intensity is greater than the first threshold range, it is determined that the amount of dust adhering to the surface of the circuit board to be flattened exceeds the rated range.

[0018] The control system compares the real-time air pressure data with the second threshold range. When the real-time air pressure data is not within the second threshold range, it is determined that unevenness appears at the corners of the circuit board to be flattened. The control system compares the pressure data with the third threshold range. When the pressure data is not within the third threshold range, it is determined that unevenness appears on the surface of the circuit board to be flattened. When the above situation occurs, the control system drives the early warning unit to send an early warning message to the staff.

[0019] Technical effects and advantages of the present invention:

[0020] 1. The present invention can move the circuit board to be flattened to the surface of the input mechanism. Under the action of a stable working current, the input mechanism moves the circuit board to be flattened to the bottom of the monitoring plate. The irradiation device inputs a stable working current to provide an irradiation light source to the circuit board. The camera collects the light intensity generated by the circuit board after irradiation and transmits it to the control system. The control system analyzes the light intensity to determine whether the amount of dust adhering to the surface of the circuit board exceeds the rated range, thereby achieving the effect of automatically monitoring the amount of dust adhering to the surface of the circuit board.

[0021] 2. When the control system determines that the dust on the surface of the circuit board to be flattened exceeds the normal range, the air pump inputs a stable current to generate adsorbed air, which is then delivered to the surface of the circuit board to be flattened through the other set of air outlets, the second delivery holes, the air grooves, and the adsorption holes of the Y-shaped delivery tube. Simultaneously, the first electric lifting column inputs a stable operating current to drive the main and auxiliary scraping plates to scrape and clean the surface of the circuit board to be flattened, achieving the effect of automatically cleaning the dust on the surface of the circuit board to be flattened.

[0022] 3. The present invention uses an air pump to generate compressed air, which is fed into the air pressure chamber through a set of independent air outlets and a first delivery hole in a Y-shaped delivery tube, driving the rubber sheet into an expanded state. When the rubber sheet contacts the surface of the circuit board to be flattened, the air pressure sensor collects air pressure data inside the air pressure chamber and transmits it to the control system. The control system analyzes this air pressure data to determine whether there are any unevenness at the corners of the circuit board, thereby achieving the effect of automatically inspecting whether the circuit board surface is in a qualified state. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of the present invention.

[0024] Figure 2 for Figure 1 Schematic diagram of the overall structure of the central monitoring board from a top view.

[0025] Figure 3 for Figure 1 Schematic diagram of the main view of the overall structure of the central monitoring board.

[0026] Figure 4 for Figure 3 Schematic diagram of the internal structure of the middle folding plate.

[0027] Figure 5 for Figure 4 Schematic diagram of the overall structure of the medium dust cleaning monitoring board.

[0028] Figure 6 for Figure 4 Schematic diagram of the side structure section of the medium dust cleaning monitoring panel.

[0029] Figure 7 for Figure 5Side view of the overall structure of the middle scratch plate.

[0030] Figure 8 for Figure 7 Schematic diagram of the overall structural cross-section of the middle scratch plate.

[0031] The accompanying drawings are marked as follows: 1. Control base; 2. Flattening mechanism; 201. Output mechanism; 202. Input mechanism; 3. Control device; 4. Monitoring panel; 401. Bracket; 402. Electric lifting column; 403. Camera; 404. Illumination device; 5. Dust cleaning monitoring panel; 501. Folding plate; 502. Storage cylinder; 503. Air pump; 504. Y-shaped delivery pipe; 505. Rubber plate; 506. Main scratch plate; 507. Slide rail; 508. Air pressure cabin; 509. First delivery hole; 510. First electric lifting column; 511. Slider; 512. Rubber pad; 513. Adsorption sponge; 514. Auxiliary scratch plate; 515. Micro electric column; 516. Air groove; 517. Second delivery hole. DETAILED DESCRIPTION

[0032] The technical solutions of the present invention will be described clearly and completely below in conjunction with the accompanying drawings of the present invention. In addition, the forms of the various structures described in the following embodiments are merely examples. The flattening device for circuit board production and processing involved in the present invention is not limited to the various structures described in the following embodiments. All other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the present invention.

[0033] Reference Figures 1 to 4 As shown, the present invention provides a flattening device for producing and processing circuit boards, comprising:

[0034] Control base 1;

[0035] The flattening mechanism 2 is used for flattening circuit boards. The flattening mechanism 2 is mounted on the upper surface of the control base 1. An input mechanism 202 is vertically mounted on the front end of the flattening mechanism 2 near its inlet for inputting unflattened circuit boards. An output mechanism 201 is vertically mounted on the back end of the flattening mechanism 2 near its outlet for outputting flattened circuit boards.

[0036] The control device 3 is used to monitor the overall status of the circuit board, wherein the control device 3 is installed on the side of the front end of the flattening mechanism 2, wherein the control device 3 is provided with a control system;

[0037] Two groups of equidistant brackets 401 are vertically installed in the middle position of the upper surface of the input mechanism 202, wherein the upper surfaces of the two groups of brackets 401 are vertically installed with monitoring boards 4, and the upper surfaces of the two groups of brackets 401 are respectively vertically installed at the four corners of the bottom of the monitoring board 4. A camera 403 is installed in the middle position of the lower surface of the monitoring board 4, and an illumination device 404 is installed at the bottom of the monitoring board 4 near the camera 403. The illumination device 404 provides an illumination light source to the circuit board, and the camera 403 collects the light intensity generated by the circuit board after illumination and transmits it to the control system.

[0038] In the embodiment of the present application, the specific working process of this part of the application embodiment is: the circuit board to be flattened moves to the surface of the input mechanism 202, and under the action of a stable working current, the input mechanism 202 moves the circuit board to be flattened to the bottom of the monitoring board 4, and the irradiation device 404 inputs a stable working current to provide an irradiation light source to the circuit board. The camera 403 collects the light intensity generated by the circuit board after irradiation and transmits it to the control system. The control system analyzes the light intensity to determine whether the amount of dust adhering to the surface of the circuit board exceeds the rated range, thereby achieving the effect of automatically monitoring the amount of dust adhering to the surface of the circuit board.

[0039] Reference Figures 1 to 6 As shown, the present invention provides a flattening device for circuit board production and processing, wherein four groups of electric-controlled lifting columns 402 are vertically installed near the geometric center point on the lower surface of the monitoring plate 4, and the four groups of electric-controlled lifting columns 402 are symmetrically and equidistantly distributed with the geometric center point of the monitoring plate 4 as the symmetry center, and the bottoms of the four groups of electric-controlled lifting columns 402 are vertically installed with dust cleaning monitoring plates 5, and the bottoms of the four groups of electric-controlled lifting columns 402 are vertically installed at the four corners of the upper surface of the dust cleaning monitoring plate 5, and the sides of adjacent electric-controlled lifting columns 402 are installed with folding plates 501, and when the dust cleaning monitoring plate 5 contacts the surface of the input mechanism 202, the dust cleaning monitoring plate 5, the electric-controlled lifting columns 402, the folding plates 501, the monitoring plate 4 and the input mechanism 202 can form an independent sealed space;

[0040] The monitoring board 4 is embedded with a storage cylinder 502 near its geometric center point. An air pump 503 is installed through the middle of the upper surface of the storage cylinder 502. A filter is installed at the output end of the air pump 503 to block dust. A Y-shaped delivery pipe 504 is installed through the middle of the bottom of the storage cylinder 502. The end of the Y-shaped delivery pipe 504 away from the storage cylinder 502 is provided with two sets of independent air outlets. A solenoid valve is installed in each set of air outlets to control the flow direction of gas.

[0041] An annular air pressure cabin 508 is provided at the bottom of the cleaning monitoring plate 5, and a rubber plate 505 is installed at the bottom of the cleaning monitoring plate 5 near the air pressure cabin 508. The inner wall of the air pressure cabin 508 is matched with the outer wall of the rubber plate 505, and the two can form an independent sealed space, and an air pressure sensor is installed on the inner wall of the air pressure cabin 508. The inner wall of the cleaning monitoring plate 5 is provided with a first delivery hole 509 that is matched with a group of independent air outlets of the Y-shaped delivery pipe 504. The air pump 503 generates compressed air and inputs it into the air pressure cabin 508 through a group of independent air outlets of the Y-shaped delivery pipe 504 and the first delivery hole 509. The air pressure sensor collects the air pressure data inside the air pressure cabin 508 and transmits it to the control system.

[0042] In the embodiment of the present application, the end of the Y-shaped delivery tube 504 away from the storage cylinder 502 is made of a telescopic rubber material and has a certain degree of extensibility, ensuring that the Y-shaped delivery tube 504 can still work normally when one end is in a stretched state;

[0043] The folding plate 501 has a light-shielding property, which prevents external light sources from affecting the dust detection result on the surface of the circuit board to be flattened.

[0044] The specific working process of the embodiment of this part of the application is as follows: before the circuit board to be flattened is inspected for dust, the four sets of electrically controlled lifting columns 402 input a stable working current to drive the dust cleaning monitoring plate 5 to contact the surface of the circuit board to be flattened and perform a position limiting operation on it. At this time, the folding plate 501 is in a stretched state and surrounds the circuit board to be flattened, providing a stable lighting environment for the irradiation device 404, while preventing external light sources from affecting the light intensity collected by the camera 403, thereby ensuring the accuracy of dust detection on the circuit board surface;

[0045] Before the dust cleaning monitoring plate 5 contacts the surface of the input mechanism 202, the air pump 503 generates compressed air which is input into the air pressure chamber 508 through a group of independent air outlets and the first delivery hole 509 of the Y-shaped delivery pipe 504, driving the rubber plate 505 to be in an expanded state. When the rubber plate 505 contacts the surface of the circuit board to be flattened, the air pressure sensor collects the air pressure data inside the air pressure chamber 508 and transmits it to the control system. The control system analyzes the air pressure data to determine whether there are any unevenness at the corners of the circuit board, thereby achieving the effect of automatically inspecting whether the surface of the circuit board is in a qualified state.

[0046] Reference Figures 5 to 8As shown, the present invention provides a flattening device for circuit board production and processing, wherein a first electric lifting column 510 is vertically mounted on the inner side surface of the dust cleaning monitoring plate 5 near another group of air outlets of the Y-shaped conveying pipe 504, a main scraping plate 506 is mounted on the output end of the first electric lifting column 510, and sliders 511 are mounted on both sides of the main scraping plate 506, and a sliding rail 507 adapted to the cleaning monitoring plate 5 is opened on the inner side surface near the position of the slider 511 to ensure that the slider 511 moves parallel to the slide rail 507;

[0047] The main scraping plate 506 is provided with an independent air groove 516 inside, and the outer wall of the main scraping plate 506 is provided with a second delivery hole 517 adapted to another set of air outlets of the Y-shaped delivery pipe 504, and the second delivery hole 517 is in communication with the air groove 516, and the main scraping plate 506 is provided with an auxiliary scraping plate 514 at the bottom away from the first electric lifting column 510, and the main scraping plate 506 is provided with an adsorption hole inside near the auxiliary scraping plate 514, and the adsorption hole is in communication with the air groove 516, and a lifting groove is provided in the middle position of the bottom of the air groove 516, an adsorption sponge 513 is movably sleeved in the lifting groove, and a micro-electric control column 515 is installed on the upper surface of the adsorption sponge 513, and the upper surface of the micro-electric control column 515 is installed inside the lifting groove, and the micro-electric control column 515 inputs a stable working current to drive the adsorption sponge 513 to contact the surface of the circuit board to be flattened to perform dust cleaning and dehumidification operations;

[0048] A hydraulic cabin is provided at the bottom of the main scratch plate 506 near the first electric lifting column 510. A rubber pad 512 is installed on the inner wall of the bottom of the hydraulic cabin. An independent sealed space is provided between the rubber pad 512 and the hydraulic cabin. A certain amount of hydraulic oil is stored in the sealed space, and a pressure sensor is installed in the hydraulic cabin for monitoring the pressure data in the sealed space and transmitting it to the control system.

[0049] In the embodiment of the present application, the specific working process of this part of the embodiment of the application is as follows: when the control system determines that the dust on the surface of the circuit board to be flattened exceeds the normal range, the air pump 503 inputs a stable current to generate adsorbed air and delivers the air to the surface of the circuit board to be flattened through another group of air outlets, the second delivery hole 517, the air groove 516 and the adsorption hole of the Y-shaped delivery tube 504. At the same time, the first electric lifting column 510 inputs a stable working current to drive the main scraping plate 506 and the auxiliary scraping plate 514 to scrape and clean the surface of the circuit board to be flattened, thereby achieving the effect of automatically cleaning the dust on the surface of the circuit board to be flattened;

[0050] When the rubber pad 512 contacts the surface of the circuit board to be flattened, the pressure sensor monitors the pressure data in the sealed space and transmits it to the control system. The control system determines whether the surface of the circuit board to be flattened is uneven by the real-time changes in the pressure data, thereby achieving the effect of automatically detecting the surface of the circuit board.

[0051] Reference Figures 1 to 8 As shown, the present invention provides a flattening device for circuit board production and processing. The control system includes a threshold range and an early warning unit. The threshold range pre-stores a first threshold range, a second threshold range, and a third threshold range. The control system compares the real-time light intensity with the first threshold range. When the real-time light intensity is greater than the first threshold range, it is determined that the amount of dust adhering to the surface of the circuit board to be flattened exceeds the rated range.

[0052] The control system compares the real-time air pressure data with the second threshold range. When the real-time air pressure data is not within the second threshold range, it is determined that unevenness appears at the corners of the circuit board to be flattened. The control system compares the pressure data with the third threshold range. When the pressure data is not within the third threshold range, it is determined that unevenness appears on the surface of the circuit board to be flattened. When the above situation occurs, the control system drives the early warning unit to send an early warning message to the staff.

[0053] In the embodiment of the present application, the warning unit is composed of a wireless communication device and a system, which uses wireless signals to remind staff to check;

[0054] The threshold unit simulates the simulated light intensity collected by the camera 403 when the dust content on the surface of the circuit board to be flattened is at a normal value, and integrates the simulated light intensity to form a first threshold range;

[0055] The threshold unit simulates the simulated air pressure data generated by the air pressure sensor when there are no unevenness at the corners of the circuit board to be flattened, and integrates the simulated air pressure data to form a second threshold range;

[0056] The threshold unit simulates the simulated air pressure data generated by the pressure sensor when the outer wall of the circuit board to be flattened does not have any unevenness, and integrates the simulated pressure data to form a third threshold range.

[0057] The specific workflow of this application is as follows:

[0058] Dust level detection: The circuit board to be flattened moves to the surface of the input mechanism 202. Under the action of a stable operating current, the input mechanism 202 moves the circuit board to the bottom of the monitoring board 4. The irradiation device 404 inputs a stable operating current to provide a light source for irradiating the circuit board. The camera 403 collects the light intensity generated by the irradiated circuit board and transmits it to the control system. The control system analyzes the light intensity to determine whether the dust level on the circuit board surface exceeds the rated range, thereby achieving the effect of automatically monitoring the dust level on the circuit board surface.

[0059] Before the circuit board to be flattened is inspected for dust, the four sets of electrically controlled lifting columns 402 input a stable operating current, driving the dust cleaning monitoring plate 5 to contact the surface of the circuit board to be flattened and perform a position limiting operation on it. At this time, the folding plate 501 is in a stretched state and surrounds the circuit board to be flattened, providing a stable lighting environment for the irradiation device 404. At the same time, it prevents external light sources from affecting the light intensity collected by the camera 403, thereby ensuring the accuracy of dust detection on the circuit board surface.

[0060] When the control system determines that the dust on the surface of the circuit board to be flattened exceeds the normal range, the air pump 503 inputs a stable current to generate adsorbed air and delivers it to the surface of the circuit board to be flattened through another set of air outlets, the second delivery hole 517, the air groove 516 and the adsorption hole of the Y-shaped delivery tube 504. At the same time, the first electric lifting column 510 inputs a stable working current to drive the main scraping plate 506 and the auxiliary scraping plate 514 to scrape and clean the surface of the circuit board to be flattened, thereby achieving the effect of automatically cleaning the dust on the surface of the circuit board to be flattened;

[0061] Circuit board surface inspection: Before the dust cleaning monitoring plate 5 contacts the surface of the input mechanism 202, the air pump 503 generates compressed air which is input into the air pressure chamber 508 through a set of independent air outlets and the first delivery hole 509 of the Y-shaped delivery pipe 504, driving the rubber plate 505 into an expanded state. When the rubber plate 505 contacts the surface of the circuit board to be flattened, the air pressure sensor collects the air pressure data inside the air pressure chamber 508 and transmits it to the control system. The control system analyzes the air pressure data to determine whether there are any unevenness at the corners of the circuit board, thereby achieving the effect of automatically inspecting whether the circuit board surface is in a qualified state.

[0062] When the rubber pad 512 contacts the surface of the circuit board to be flattened, the pressure sensor monitors the pressure data in the sealed space and transmits it to the control system. The control system determines whether the surface of the circuit board to be flattened is uneven by the real-time changes in the pressure data, thereby achieving the effect of automatically detecting the surface of the circuit board.

[0063] Finally, a few points should be explained: First, in the description of this application, it should be noted that, unless otherwise specified or limited, the terms "mounted," "connected," and "connected" should be understood in a broad sense, and may refer to mechanical or electrical connections, internal communication between two components, or direct connection. "Up," "down," "left," and "right" are only used to indicate relative positional relationships. When the absolute positions of the objects being described change, the relative positional relationships may also change.

[0064] Secondly: The drawings of the embodiments disclosed in the present invention only involve structures related to the embodiments disclosed in the present invention. Other structures may refer to conventional designs. The same embodiment and different embodiments of the present invention may be combined with each other without conflict.

[0065] Finally: The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A flattening device for circuit board production and processing, characterized in that: include: Control base (1); A flattening mechanism (2) is used for flattening circuit boards, wherein the flattening mechanism (2) is mounted on the upper surface of the control base (1), an input mechanism (202) is vertically mounted at the front end of the flattening mechanism (2) near its inlet, for inputting unflattened circuit boards, and an output mechanism (201) is vertically mounted at the back end of the flattening mechanism (2) near its outlet, for outputting flattened circuit boards; A control device (3) is used to monitor the overall state of the circuit board, wherein the control device (3) is installed on the side of the front end of the flattening mechanism (2), and a control system is provided inside the control device (3); Two groups of equidistant brackets (401) are vertically mounted at the middle position of the upper surface of the input mechanism (202), wherein a monitoring board (4) is vertically mounted on the upper surface of each of the two groups of brackets (401), and the upper surfaces of the two groups of brackets (401) are respectively vertically mounted at the four corners of the bottom of the monitoring board (4), a camera (403) is mounted at the middle position of the lower surface of the monitoring board (4), and an irradiation device (404) is mounted at a position near the camera (403) at the bottom of the monitoring board (4), the irradiation device (404) provides a light source for irradiating the circuit board, and the camera (403) collects the light intensity generated by the circuit board after irradiation and transmits it to the control system; Four groups of electric-controlled lifting columns (402) are vertically mounted on the lower surface of the monitoring plate (4) near the geometric center point. The four groups of electric-controlled lifting columns (402) are symmetrically and equidistantly distributed with the geometric center point of the monitoring plate (4) as the symmetry center. The bottoms of the four groups of electric-controlled lifting columns (402) are vertically mounted with dust cleaning monitoring plates (5). The bottoms of the four groups of electric-controlled lifting columns (402) are vertically mounted at the four corners of the upper surface of the dust cleaning monitoring plate (5). Folding plates (501) are installed on the sides of adjacent electric-controlled lifting columns (402). When the dust cleaning monitoring plate (5) contacts the surface of the input mechanism (202), the dust cleaning monitoring plate (5), the electric-controlled lifting columns (402), the folding plates (501), the monitoring plate (4) and the input mechanism (202) can form an independent sealed space. The monitoring board (4) is embedded with a storage cylinder (502) near its geometric center point, an air pump (503) is installed through the middle position of the upper surface of the storage cylinder (502), and a filter is installed at the output end of the air pump (503) for blocking dust, a Y-shaped delivery pipe (504) is installed through the middle position of the bottom of the storage cylinder (502), and the end of the Y-shaped delivery pipe (504) away from the storage cylinder (502) is provided with two sets of independent air outlets, and each set of air outlets is installed with a solenoid valve for controlling the flow direction of gas; A first electric lifting column (510) is vertically mounted on the inner side surface of the dust cleaning monitoring panel (5) near another group of air outlets of the Y-shaped conveying pipe (504), and a main scraping plate (506) is mounted on the output end of the first electric lifting column (510); An independent air groove (516) is provided inside the main scratch plate (506), and a second delivery hole (517) adapted to another set of air outlets of the Y-shaped delivery pipe (504) is provided on the outer wall of the main scratch plate (506), and the second delivery hole (517) is in communication with the air groove (516). An auxiliary scratch plate (514) is installed at the bottom of the main scratch plate (506) away from the first electric lifting column (510), and an adsorption hole is provided inside the main scratch plate (506) near the auxiliary scratch plate (514), and the adsorption hole is in communication with the air groove (516), and a lifting groove is provided in the middle position of the bottom of the air groove (516), an adsorption sponge (513) is movably sleeved in the lifting groove, and a micro electric control column (515) is installed on the upper surface of the adsorption sponge (513).

2. A flattening device for circuit board production and processing according to claim 1, characterized in that: The bottom of the cleaning monitoring plate (5) is provided with an annular air pressure chamber (508), and a rubber plate (505) is installed at the bottom of the cleaning monitoring plate (5) near the air pressure chamber (508). The inner wall of the air pressure chamber (508) is matched with the outer wall of the rubber plate (505), and the two can form an independent sealed space. The inner wall of the air pressure chamber (508) is provided with a first delivery hole (509) matched with a group of independent air outlets of the Y-shaped delivery pipe (504). The compressed air generated by the air pump (503) is input into the air pressure chamber (508) through a group of independent air outlets of the Y-shaped delivery pipe (504) and the first delivery hole (509). The air pressure sensor collects the air pressure data inside the air pressure chamber (508) and transmits it to the control system.

3. The flattening device for circuit board production and processing according to claim 1, characterized in that: Slide blocks (511) are installed on both sides of the main scraping plate (506), and the dust cleaning monitoring plate (5) is provided with a slide rail (507) adapted thereto on the inner side surface close to the position of the slide block (511), ensuring that the slide block (511) moves parallel to the slide rail (507).

4. The flattening device for producing and processing a circuit board according to claim 2, characterized in that: The upper surface of the micro electric control column (515) is installed inside the lifting slot, and the micro electric control column (515) inputs a stable working current to drive the adsorption sponge (513) to contact the surface of the circuit board to be flattened, thereby performing dust cleaning and dehumidification operations; A hydraulic cabin is provided at the bottom of the main scratch plate (506) near the first electric lifting column (510), and a rubber pad (512) is installed on the inner wall of the bottom of the hydraulic cabin. An independent sealed space can be formed between the rubber pad (512) and the hydraulic cabin, and hydraulic oil is stored in the sealed space. A pressure sensor is installed in the hydraulic cabin for monitoring the pressure data in the sealed space and transmitting it to the control system.

5. The flattening device for producing and processing a circuit board according to claim 4, characterized in that: The control system includes a threshold range and an early warning unit. The threshold range includes a first threshold range, a second threshold range, and a third threshold range. The control system compares the real-time light intensity with the first threshold range. When the real-time light intensity is greater than the first threshold range, it is determined that the amount of dust adhering to the surface of the circuit board to be flattened exceeds the rated range. The control system compares the real-time air pressure data with the second threshold range. When the real-time air pressure data is not within the second threshold range, it is determined that unevenness appears at the corners of the circuit board to be flattened. The control system compares the pressure data with the third threshold range. When the pressure data is not within the third threshold range, it is determined that unevenness appears on the surface of the circuit board to be flattened. When the above situation occurs, the control system drives the early warning unit to send an early warning message to the staff.

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