High-performance circuit board convenient for water-cooling heat dissipation connection and preparation method thereof

Abstract

The invention belongs to the technical field of circuit boards, and discloses a high-performance circuit board convenient for water-cooling heat dissipation connection, which comprises a plurality of mounting frames, a circuit board body is arranged between every two adjacent mounting frames, and connecting holes are formed in four corners of the circuit board body. The bottom of the mounting frame is fixedly connected with T-shaped blocks corresponding to the connecting holes, the T-shaped blocks are inserted into the corresponding connecting holes, and a water-cooling heat dissipation mechanism is arranged in the mounting frame. By arranging a plurality of mounting frames, U-shaped plates, connecting holes and T-shaped blocks, the mounting frames can be stacked, so that more space is saved, the connected circuit board body can be well protected, meanwhile, the circuit board is convenient to disassemble, and the mounting frames can be conveniently assembled after the circuit board body is placed on the U-shaped plate on the lower layer. And then the T-shaped blocks are inserted into the corresponding connecting holes by utilizing the downward overturning of the upper-layer mounting frame, so that the circuit board body can be quickly fixed.

Description

Technical Field

[0001] The present invention belongs to the technical field of circuit boards, and in particular is a high-performance circuit board that is convenient for water cooling and heat dissipation connection and a preparation method thereof. Background Art

[0002] The names of circuit boards include: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards, circuit boards, PCB boards, aluminum substrates, high-frequency boards, thick copper boards, impedance boards, PCBs, ultra-thin circuit boards, ultra-thin circuit boards, printed (copper etching technology) circuit boards, etc. Circuit boards miniaturize and visualize circuits, and play an important role in the mass production of fixed circuits and the optimization of electrical appliance layouts. Circuit boards need to be cooled during use to meet the needs of long-term use. Multilayer circuit boards are the product of the development of electronic information technology towards high speed, multi-function, large capacity, small size, thinness, and lightness.

[0003] For example, the application with publication number CN221058493U provides a circuit board assembly with water-cooling and heat dissipation function, including a mounting seat, the four corners of the upper end of the mounting seat are fixedly connected with threaded mounting rods, the four threaded mounting rods are interlaced and movably connected with the circuit board body, the outer surfaces of the four threaded mounting rods are threadedly connected with mounting mechanisms, the four mounting mechanisms are all located on the upper part of the circuit board body, and the lower end of the circuit board body is bonded and connected with a water-cooling and heat dissipation mechanism. The circuit board assembly with water-cooling and heat dissipation function described in the utility model is provided with a water-cooling and heat dissipation mechanism, which is bonded and connected to the lower end of the circuit board body through an adhesive layer, and then two connectors are connected to an external water pump, so that the coolant flows in the water-cooling pipe. Since the water-cooling pipe is a flat structure, the bottom of the circuit board body can be cooled, thereby improving the heat dissipation efficiency of the circuit board body; When the above device is in use, although it can dissipate heat from the bottom of the circuit board body through the water-cooling heat dissipation mechanism, the water-cooling heat dissipation effect is only general for a single side of the circuit board, which makes the other side of the circuit board body vulnerable to external compression and damage. In addition, additional fixings are also required for the connection of multi-layer circuit boards, and the connection method is not convenient enough, thereby reducing the practicality of the connection between the circuit board body and the water-cooling heat dissipation mechanism. Therefore, the present application provides a high-performance circuit board that is convenient for water-cooling heat dissipation connection and a preparation method thereof to meet the needs. Summary of the invention

[0004] In order to solve the problems raised in the above background technology, the present invention provides a high-performance circuit board that is convenient for water cooling and heat dissipation connection and a preparation method thereof.

[0005] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a high-performance circuit board that is convenient for water-cooling and heat dissipation connection, comprising a plurality of mounting frames, a circuit board body is arranged between each two adjacent mounting frames, connection holes are opened at the four corners of the circuit board body, a T-block corresponding to the connection hole is fixedly connected to the bottom of the mounting frame, and the T-block is plugged into the corresponding connection hole, a water-cooling heat dissipation mechanism is arranged inside the mounting frame, and the upper and lower adjacent water-cooling heat dissipation mechanisms are interconnected, a U-shaped plate is fixedly connected to the upper surface of the mounting frame, and the circuit board body is slidably arranged in the U-shaped plate, a positioning mechanism is arranged at the rear end of the mounting frame, and the rear ends of each two adjacent mounting frames are movably connected through the positioning mechanism, a locking mechanism is arranged at the front end of the mounting frame, and the front ends of each mounting frame are locked with each other through the locking mechanism, a second dustproof net is arranged on the front side of the mounting frame, and the second dustproof net is positioned on the locking mechanism.

[0006] Preferably, the water-cooling heat dissipation mechanism comprises a water-cooling pipe, both ends of which penetrate to the rear end of the installation frame and are connected to a connecting pipe through a joint, and two connecting pipes adjacent to each other are connected to each other.

[0007] Preferably, each of the connecting tubes is connected to two externally threaded tubes, and two upper and lower adjacent connecting tubes are detachably connected to a hose via the two externally threaded tubes, and the two connecting tubes at the bottom layer are both connected to the bottom tube via the externally threaded tubes.

[0008] Preferably, a plurality of second clamping frames and two opposite first clamping frames are fixedly connected to the inner wall of the installation frame, and the rear ends of the water cooling tubes are clamped in the corresponding second clamping frames, and the two sides of the water cooling tubes are respectively clamped in the two first clamping frames.

[0009] Preferably, the upper surface and the bottom surface of the installation frame are both fixedly connected with a first dustproof net, and the water cooling pipe is arranged between two first dustproof nets.

[0010] Preferably, the positioning mechanism includes two mounting shafts and two open sleeves, each of the mounting shafts is fixedly connected to the top of the rear end of the mounting frame, each of the open sleeves is fixedly connected to the bottom of the rear end of the mounting frame, and the two open sleeves located on the upper layer are both snapped into the two mounting shafts on the lower layer.

[0011] Preferably, each of the open sleeves is fixedly provided with a side convex plate and a slot on the side surface, a second positioning hole is provided on the side convex plate, an anti-slip plate is slidably provided in the slot, and the anti-slip plate is located below the mounting shaft, a pull rod is rotatably connected to the surface of the anti-slip plate, and the pull rod passes through the second positioning hole, a limit plate matched with the second positioning hole is fixedly provided on the surface of the pull rod, and a third compression spring is fixedly provided between the anti-slip plate and the side convex plate.

[0012] Preferably, the locking mechanism comprises an installation slot and a locking slot, the installation slot is arranged on the upper surface of the installation frame, and the installation slot passes through the front side of the installation frame, the locking slot is arranged at the bottom end of the installation frame, the inner wall of the installation slot is fixedly connected with a positioning shaft, a locking block and a T-shaped slider are slidably provided, and the locking block is clamped in the locking slot of the upper installation frame, the T-shaped slider is sleeved on the positioning shaft and extends to the outside of the installation slot, the side of the U-shaped plate is provided with a receiving groove adapted to the locking block, the surface of the positioning shaft is sleeved with a first compression spring, and the two ends of the first compression spring are respectively fixedly connected to the surface of the T-shaped slider and the inner wall of the installation slot, a second compression spring is fixedly connected between the locking block and the T-shaped slider, the T-shaped slider is provided with a first positioning hole, the front side of the U-shaped plate is fixedly connected with a fixing block, the fixing block is plugged with a latch, and the latch is adapted to the first positioning hole.

[0013] Preferably, the bottom end of the second dustproof net is hinged to the front side of the mounting frame, and an avoidance groove and a sliding groove are provided on the front side of the second dustproof net, and the avoidance groove is used to avoid the latch, the fixing block and the T-shaped slider, and a positioning pin is inserted into the inner wall of the sliding groove, and the bottom end of the positioning pin is inserted into the first positioning hole.

[0014] The present invention also proposes a method for preparing a high-performance circuit board that is convenient for water cooling and heat dissipation connection, comprising the following steps: 1. Chemical pretreatment of the circuit board body, including degreasing, decontamination, pickling and other chemical treatments, so as to better combine with the surface of the circuit board in the subsequent process; 2. Print the designed circuit diagram on the circuit board body using special printing technology; 3. Apply chemical substances to the printed circuit diagram to remove the unnecessary metal parts to form the wires and pads of the circuit diagram; 4. Print the relevant text, logo, etc. on the circuit board body through the equipment; 5. Punch holes are made at the four corners of the circuit board body, and finally a connection hole is formed to match the bottom of the T-block, and one side of the inner wall of the connection hole has an arc; 6. Assemble the circuit board body, including welding components, wiring, adjustment, etc.

[0015] Compared with the prior art, the present invention has the following beneficial effects: The invention provides a plurality of installation frames, U-shaped plates, connection holes and T-shaped blocks, so that the installation frames can be stacked, which not only saves space but also provides a good protection effect for the connected circuit board body. It also has the effect of being easy to disassemble. The circuit board body only needs to be placed on the U-shaped plate of the lower layer, and then the upper installation frame is flipped downward to insert the T-shaped block into the corresponding connection hole, so that the circuit board body can be quickly fixed without using other components.

[0016] The present invention can interconnect various water-cooling and heat-dissipating mechanisms through the water-cooling and heat-dissipating mechanism, thereby ensuring that each circuit board body can obtain a very comprehensive cooling and heat-dissipating effect, and can also fully cool the upper and lower surfaces of the circuit board body at the same time, and when the two installation frames are subsequently flipped, the normal flow of the water-cooling liquid in each water-cooling pipe will not be affected.

[0017] The present invention can facilitate the rapid docking of two adjacent upper and lower mounting frames by arranging a positioning mechanism and a locking mechanism. It is only necessary to directly clamp the upper mounting frame on the lower mounting shaft through the open shaft sleeve, and utilize the anti-slip plate to prevent the rear ends of the two mounting frames from separating. The operation is more flexible, and the two mounting frames can be swung and flipped through the open shaft sleeve and the mounting shaft, so that it is convenient to directly place the circuit board body between the two mounting frames for connection, and it is also convenient for the subsequent removal of the circuit board body. The locking mechanism can be used to lock the front ends of the two mounting frames, thereby ensuring the locking effect between the upper and lower mounting frames, preventing the circuit board body from separating from the two mounting frames, thereby ensuring the normal use of the circuit board body and water-cooling heat dissipation. Moreover, when in use, it only needs to be swung downward, and the locking groove at the bottom of the upper mounting frame is used to squeeze the locking block until the locking block is inserted into the locking groove, thereby locking the upper mounting frame, and ensuring the locking effect between the two mounting frames. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a schematic diagram of the overall structure of the present invention; Figure 2 It is a rear view structural schematic diagram of the present invention; Figure 3 It is a schematic diagram of the connection between the circuit board body and the U-shaped board of the present invention; Figure 4 It is a structural schematic diagram of the installation frame of the present invention; Figure 5 It is a schematic diagram of the interior of the installation frame of the present invention; Figure 6 It is a bottom view schematic diagram of the installation frame of the present invention; Figure 7 It is a schematic diagram of the structure of the water cooling tube of the present invention; Figure 8 It is a side partial cross-sectional view of the present invention; Fig. 9 is a schematic structural diagram of the second dustproof net of the present invention; Fig.10 It is a partial cross-sectional view of the circuit board body of the present invention; Fig.11 It is a structural schematic diagram of the positioning mechanism of the present invention; Fig.12It is a schematic diagram of the connection between the anti-drop plate and the pull rod of the present invention; Fig.13 It is a schematic diagram of the connection between the side convex plate and the open shaft sleeve of the present invention; Fig.14 It is a structural schematic diagram of the locking mechanism of the present invention; Fig.15 It is a structural schematic diagram of the T-block of the present invention; Fig.16 For the present invention Figure 1 A magnified schematic diagram of the structure at center A; Fig.17 For the present invention Figure 2 A magnified schematic diagram of the structure at B in the middle; Fig.18 For the present invention Figure 3 A magnified schematic diagram of the structure at C in the middle; Fig.19 For the present invention Figure 8 A magnified schematic diagram of the structure at position D in the figure.

[0019] In the figure: 1. installation frame; 2. second dustproof net; 3. U-shaped plate; 4. water cooling pipe; 5. first dustproof net; 6. installation shaft; 7. connecting pipe; 8. external threaded pipe; 9. hose; 10. bottom pipe; 11. circuit board body; 12. connecting hole; 13. locking groove; 14. first clamping frame; 15. second clamping frame; 16. T-shaped block; 17. open shaft sleeve; 18. side convex plate; 19. pull rod; 20. third compression spring; 21. anti-slip plate; 22. limit plate; 23. slot; 24. locking block; 25. first compression spring; 26. first positioning hole; 27. T-shaped slider; 28. positioning shaft; 29. ​​second compression spring; 30. installation groove; 31. storage groove; 32. second positioning hole; 33. latch; 34. fixing block; 35. avoidance groove; 36. positioning pin; 37. sliding groove. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0021] like Figures 1 to 19As shown, the present invention provides a high-performance circuit board that is convenient for water-cooling and heat dissipation connection, including a plurality of installation frames 1, a circuit board body 11 is arranged between each two adjacent installation frames 1, and connection holes 12 are opened at the four corners of the circuit board body 11, a T-block 16 corresponding to the connection hole 12 is fixedly connected to the bottom of the installation frame 1, and the T-block 16 is plugged into the corresponding connection hole 12, a water-cooling heat dissipation mechanism is arranged inside the installation frame 1, and the upper and lower adjacent water-cooling heat dissipation mechanisms are interconnected, a U-shaped plate 3 is fixedly connected to the upper surface of the installation frame 1, and the circuit board body 11 is slidably arranged in the U-shaped plate 3, a positioning mechanism is arranged at the rear end of the installation frame 1, and the rear ends of each two adjacent installation frames 1 are movably connected through the positioning mechanism, a locking mechanism is arranged at the front end of the installation frame 1, and the front ends of each installation frame 1 are locked with each other through the locking mechanism, and a second dustproof net 2 is arranged on the front of the installation frame 1, and the second dustproof net 2 is positioned on the locking mechanism.

[0022] By adopting the above scheme: by stacking the installation frames 1, it is possible to save more space, and the installation frames 1 can be used in conjunction with each other, so that the circuit board body 11 is located between the upper and lower installation frames 1, thereby ensuring the subsequent water-cooling and heat dissipation effect of the circuit board body 11. It is only necessary to place the circuit board body 11 on the lower installation frame 1, and then flip the upper installation frame 1 downward, so that the T-block 16 is inserted into the corresponding connecting hole 12, which is used to quickly fix the circuit board body 11. No other parts are needed, and the circuit board body 11 is also easy to disassemble and maintain. By setting the water-cooling and heat dissipation mechanisms to be interconnected, it is possible to ensure that the circuit board body 11 between the installation frames 1 obtains a more comprehensive cooling and heat dissipation effect, and fully cools the upper and lower circuit board bodies 11. Both sides are cooled at the same time. By setting the U-shaped plate 3, the stability of the circuit board body 11 when placed and connected can be guaranteed. By setting the positioning mechanism, the upper and lower adjacent installation frames 1 can be quickly connected more conveniently and the two installation frames 1 can be prevented from detaching. At the same time, the upper and lower installation frames 1 can be swung and flipped by the positioning mechanism, which is conducive to taking and placing the circuit board body 11. By setting the locking mechanism, when the front ends of the two installation frames 1 are close to each other, the two installation frames 1 can be locked to ensure the stability of the circuit board body 11 between the two installation frames 1. In addition, by setting the second dustproof net 2, the front of the installation frame 1 can be shielded and protected, and the locking effect between the two installation frames 1 can be prevented from being easily released.

[0023] like Figure 1 and Figure 2 As shown, the water cooling heat dissipation mechanism includes a water cooling pipe 4, both ends of which penetrate to the rear end of the installation frame 1 and are connected to a connecting pipe 7 through a joint, and two upper and lower adjacent connecting pipes 7 are connected to each other.

[0024] By adopting the above scheme, the water-cooling pipe 4 can be easily disassembled and assembled in the installation frame 1, which is convenient for subsequent replacement. It is only necessary to separate the two ends of the water-cooling pipe 4 from the two connecting pipes 7 respectively. By connecting the two upper and lower adjacent connecting pipes 7 to each other, it can be ensured that the water-cooling pipe 4 in each installation frame 1 can fully utilize the water-cooling liquid to water-cool the installation frame 1 for heat dissipation.

[0025] like Figure 1 , Figure 2 , Figure 3 , Figure 6 and Figure 7 As shown, each connecting tube 7 is connected to two external threaded tubes 8 , and a hose 9 is detachably connected between two adjacent connecting tubes 7 via the two external threaded tubes 8 , and the two connecting tubes 7 at the bottom layer are connected to a bottom tube 10 via the external threaded tubes 8 .

[0026] By adopting the above scheme, the water-cooling tubes 4 in each installation frame 1 can be easily connected to each other, ensuring that the water-cooling liquid can fully flow into each water-cooling tube 4, and when the upper and lower installation frames 1 are flipped over, the hose 9 can also ensure the normal connection state without squeezing the connecting tube 7 and the water-cooling tube 4.

[0027] like Figure 5 As shown, the inner wall of the installation frame 1 is fixedly connected with a plurality of second clamping frames 15 and two opposite first clamping frames 14, and the rear ends of the water cooling tubes 4 are clamped in the corresponding second clamping frames 15, and the two sides of the water cooling tubes 4 are clamped in the two first clamping frames 14 respectively.

[0028] By adopting the above scheme, the water cooling pipe 4 can be conveniently and quickly fixed in the installation frame 1 through the setting of the first clamping frame 14 and the second clamping frame 15, which is conducive to the subsequent connection of the two ends of the water cooling pipe 4, and also ensures the overall stability.

[0029] like Figure 1 , Figure 2 , Figures 4 to 6 As shown, the upper surface and the bottom surface of the installation frame 1 are both fixedly connected with the first dustproof nets 5 , and the water cooling pipe 4 is arranged between the two first dustproof nets 5 .

[0030] The above solution is adopted: by setting the first dustproof net 5, the water-cooling pipe 4 can be protected, and at the same time, the water-cooling heat dissipation effect of the water-cooling pipe 4 is guaranteed, and the water-cooling pipe 4 is prevented from being exposed to the outside.

[0031] like Figures 1 to 4 , Figure 6 and Fig.17As shown, the positioning mechanism includes two mounting shafts 6 and two open shaft sleeves 17, each mounting shaft 6 is fixedly connected to the top of the rear end of the mounting frame 1, each open shaft sleeve 17 is fixedly connected to the bottom of the rear end of the mounting frame 1, and the two open shaft sleeves 17 located on the upper layer are both snapped into the two mounting shafts 6 on the lower layer.

[0032] The above scheme is adopted: through the setting of the installation shaft 6 and the open shaft sleeve 17, the bottom end of the open shaft sleeve 17 is open, so it is convenient to connect and position the upper and lower installation frames 1, and the upper installation frame 1 is directly pressed downward into the installation shaft 6 through the open shaft sleeve 17, so that the upper and lower installation frames 1 can be fixed, and the operation is more convenient, which is more suitable for the installation and use of multi-layer circuit board bodies 11, and when any one of the circuit board bodies 11 is disassembled and replaced, it is only necessary to flip the corresponding upper installation frame 1, which will not affect the disassembly and assembly of other circuit board bodies 11, and the operation is more flexible and convenient.

[0033] like Figures 11 to 13 and Fig.17 As shown, the side of each open sleeve 17 is fixedly connected with a side convex plate 18 and a slot 23, a second positioning hole 32 is opened on the side convex plate 18, an anti-slip plate 21 is slidably arranged in the slot 23, and the anti-slip plate 21 is located below the mounting shaft 6, the surface of the anti-slip plate 21 is rotatably connected with a pull rod 19, and the pull rod 19 passes through the second positioning hole 32, the surface of the pull rod 19 is fixedly connected with a limit plate 22 adapted to the second positioning hole 32, and a third compression spring 20 is fixedly connected between the anti-slip plate 21 and the side convex plate 18.

[0034] The above scheme is adopted: when the open shaft sleeve 17 is clamped onto the mounting shaft 6, the mounting shaft 6 will squeeze the bottom surface of the anti-slip plate 21, thereby pushing the anti-slip plate 21 to slide to one side until the mounting shaft 6 is above the anti-slip plate 21, and the anti-slip plate 21 is blocked under the mounting shaft 6 by the elastic force of the third compression spring 20, thereby preventing the open shaft sleeve 17 from easily detaching from the mounting shaft 6, and also ensuring that the upper mounting frame 1 is flipped and swung around the mounting shaft 6 through the open shaft sleeve 17. When it is necessary to separate and remove the upper mounting frame 1 from the lower mounting frame 1, it is only necessary to pull the pull rod 19 and rotate it so that the limit plate 22 rests on the surface of the side convex plate 18, thereby allowing the anti-slip plate 21 to move away from the mounting shaft 6, so that the opening at the bottom of the open shaft sleeve 17 is normally opened, and then the upper mounting frame 1 can be directly removed.

[0035] like Figures 4 to 6 , Figure 8 , Fig.18 and Fig.19As shown, the locking mechanism includes a mounting groove 30 and a locking groove 13, the mounting groove 30 is arranged on the upper surface of the mounting frame 1, and the mounting groove 30 passes through the front of the mounting frame 1, the locking groove 13 is arranged at the bottom end of the mounting frame 1, the inner wall of the mounting groove 30 is fixedly connected with a positioning shaft 28, and a locking block 24 and a T-shaped slider 27 are slidably arranged, and the locking block 24 is clamped in the locking groove 13 of the upper mounting frame 1, the T-shaped slider 27 is sleeved on the positioning shaft 28 and extends to the outside of the mounting groove 30, and the U-shaped plate 3 A receiving groove 31 matched with the locking block 24 is opened on the side, the surface of the positioning shaft 28 is sleeved with a first compression spring 25, and the two ends of the first compression spring 25 are respectively fixedly connected to the surface of the T-shaped slider 27 and the inner wall of the mounting groove 30, a second compression spring 29 is fixedly connected between the locking block 24 and the T-shaped slider 27, a first positioning hole 26 is opened on the T-shaped slider 27, a fixing block 34 is fixedly connected to the front of the U-shaped plate 3, a pin 33 is inserted on the fixing block 34, and the pin 33 is matched with the first positioning hole 26.

[0036] By adopting the above scheme: when the circuit board body 11 is placed in the U-shaped plate 3 of the lower layer, the upper installation frame 1 can be flipped downward, so that the locking groove 13 at the bottom of the upper installation frame 1 can squeeze the locking block 24 until the locking block 24 is inserted into the locking groove 13, thereby locking the upper installation frame 1, ensuring the locking effect between the two installation frames 1, and also ensuring the stability of the circuit board body 11 after connection. When it is necessary to release the locking effect of the two installation frames 1, it is only necessary to move the T-shaped slider 27 to drive the locking block 24 to move to the storage groove 31 for storage, so that the locking block 24 is away from the locking groove 13, and then the pin 33 is inserted into the first positioning hole 26 to prevent the T-shaped slider 27 from resetting, and the upper installation frame 1 can be flipped upward to open, so as to maintain the circuit board body 11.

[0037] like Figure 1 , Figure 8 , Fig.16 and Fig.19 As shown, the bottom end of the second dustproof net 2 is hinged on the front side of the mounting frame 1, and an avoidance groove 35 and a sliding groove 37 are provided on the front side of the second dustproof net 2. The avoidance groove 35 is used to avoid the latch 33, the fixing block 34 and the T-shaped slider 27. A positioning pin 36 is inserted into the inner wall of the sliding groove 37, and the bottom end of the positioning pin 36 is inserted into the first positioning hole 26.

[0038] The above scheme can protect the front of the installation frame 1, effectively prevent the T-shaped slider 27 from being accidentally moved, and avoid misunderstanding to remove the lock between the upper and lower installation frames 1. When the water-cooling pipe 4 needs to be replaced and maintained or the circuit board body 11 needs to be disassembled, it is only necessary to push the positioning pin 36 upward to make the positioning pin 36 contact the positioning of the T-shaped slider 27, and then flip the second dustproof net 2 downward to remove the obstruction on the front of the installation frame 1, and then push the T-shaped slider 27 to move so that the T-shaped slider 27 is moved and stored in the storage groove 31, thereby releasing the locking effect on the bottom of the upper installation frame 1, and then the upper installation frame 1 can be flipped backward normally.

[0039] The present invention also proposes a method for preparing a high-performance circuit board that is convenient for water cooling and heat dissipation connection, comprising the following steps: 1. Chemical pretreatment of the circuit board body 11, including chemical treatments such as degreasing, decontamination, pickling, etc., so as to better bond with the surface of the circuit board in the subsequent process; 2. Print the designed circuit diagram on the circuit board body 11 using a special printing technology; 3. Apply chemical substances to the printed circuit diagram to remove the unnecessary metal parts to form the wires and pads of the circuit diagram; 4. Print relevant texts, logos, etc. on the circuit board body 11 through equipment; 5. The four corners of the circuit board body 11 are punched and processed, and finally a connection hole 12 is processed to match the bottom end of the T-block 16, and one side of the inner wall of the connection hole 12 has a curvature; 6. Assemble the circuit board body 11, including welding components, wiring, adjustment, etc.

[0040] The working principle and use process of the present invention are as follows: when connecting the circuit board body 11 and the installation frame 1, it is only necessary to place the circuit board body 11 between the two installation frames 1, and then swing the upper installation frame 1 downward so that the T-block 16 on the upper installation frame 1 is inserted into the corresponding connection hole 12 on the circuit board body 11, thereby ensuring the fixation of the circuit board body 11 without using other additional parts. When the front ends of the upper and lower installation frames 1 are close to each other, the locking groove 13 at the bottom of the upper installation frame 1 can squeeze the locking block 24 until the locking block 24 is inserted into the locking groove 13, thereby locking the upper installation frame 1, ensuring the locking effect between the two installation frames 1, and also ensuring the stability of the circuit board body 11 after connection, and then flip the second dustproof net 2 upward so that the positioning pin 36 positions the T-slider 27 to prevent the two installation frames 1 from separating due to the random movement of the T-slider 27. By repeating the above steps, multiple circuit board bodies 11 can be connected between each upper and lower installation frames 1, and the water-cooling pipes 4 are interconnected and flow-connected to ensure the water-cooling heat dissipation effect of the circuit board body 11, and can also provide a good protection effect for the circuit board body 11 to prevent the circuit board body 11 from being crushed. When the circuit board body 11 is disassembled, it is only necessary to push the positioning pin 36 upward to release the positioning of the T-shaped slider 27, then flip the second dustproof net 2 downward, and push the T-shaped slider 27 to move so that the locking block 24 is separated from the locking groove 13, so that the upper installation frame 1 can be normally flipped open, and then the circuit board body 11 can be directly taken out from the U-shaped plate 3 of the lower layer. When the two installation frames 1 are opened, it is also convenient to maintain and clean the water-cooling pipe 4, and the operation is more flexible. The installation frames 1 can be stacked for use when connecting different numbers of circuit board bodies 11.

[0041] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0042] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A high-performance circuit board that facilitates water cooling and heat dissipation connection, comprising a plurality of mounting frames (1), characterized in that: A circuit board body (11) is arranged between each two adjacent installation frames (1), and connection holes (12) are provided at four corners of the circuit board body (11). A T-shaped block (16) corresponding to the connection hole (12) is fixedly connected to the bottom of the installation frame (1), and the T-shaped block (16) is plugged into the corresponding connection hole (12). A water-cooling heat dissipation mechanism is arranged inside the installation frame (1), and upper and lower adjacent water-cooling heat dissipation mechanisms are interconnected. A U-shaped plate (3) is fixedly connected to the upper surface of the installation frame (1), and the circuit board body (11) is slidably arranged in the U-shaped plate (3). A positioning mechanism is arranged at the rear end of the installation frame (1), and the rear ends of each two adjacent installation frames (1) are movably connected through the positioning mechanism. A locking mechanism is arranged at the front end of the installation frame (1), and the front ends of the installation frames (1) are locked with each other through the locking mechanism. A second dustproof net (2) is arranged on the front of the installation frame (1), and the second dustproof net (2) is positioned on the locking mechanism.

2. A high-performance circuit board that facilitates water cooling and heat dissipation connection according to claim 1, characterized in that: The water-cooling heat dissipation mechanism comprises a water-cooling pipe (4), both ends of which penetrate the rear end of the installation frame (1) and are connected to a connecting pipe (7) via a joint, and two upper and lower adjacent connecting pipes (7) are connected to each other.

3. A high-performance circuit board that facilitates water cooling and heat dissipation connection according to claim 2, characterized in that: Each of the connecting tubes (7) is connected to two externally threaded tubes (8), and two upper and lower adjacent connecting tubes (7) are detachably connected to a hose (9) via the two externally threaded tubes (8), and the two connecting tubes (7) at the bottom layer are both connected to a bottom tube (10) via the externally threaded tubes (8).

4. A high-performance circuit board that facilitates water cooling and heat dissipation connection according to claim 2, characterized in that: The inner wall of the installation frame (1) is fixedly connected with a plurality of second clamping frames (15) and two opposite first clamping frames (14), and the rear ends of the water cooling tubes (4) are clamped in the corresponding second clamping frames (15), and the two sides of the water cooling tubes (4) are respectively clamped in the two first clamping frames (14).

5. A high-performance circuit board that facilitates water cooling and heat dissipation connection according to claim 2, characterized in that: The upper surface and the bottom surface of the installation frame (1) are both fixedly connected with a first dustproof net (5), and the water cooling pipe (4) is arranged between two first dustproof nets (5).

6. A high-performance circuit board that facilitates water cooling and heat dissipation connection according to claim 1, characterized in that: The positioning mechanism comprises two mounting shafts (6) and two open shaft sleeves (17), each of the mounting shafts (6) being fixedly connected to the top of the rear end of the mounting frame (1), each of the open shaft sleeves (17) being fixedly connected to the bottom of the rear end of the mounting frame (1), and the two open shaft sleeves (17) located at the upper layer are both snap-fitted into the two mounting shafts (6) at the lower layer.

7. A high-performance circuit board that facilitates water cooling and heat dissipation connection according to claim 6, characterized in that: The side surface of each open shaft sleeve (17) is fixedly connected with a side convex plate (18) and a slot (23), the side convex plate (18) is provided with a second positioning hole (32), an anti-slip plate (21) is slidably arranged in the slot (23), and the anti-slip plate (21) is located below the mounting shaft (6), the surface of the anti-slip plate (21) is rotatably connected with a pull rod (19), and the pull rod (19) passes through the second positioning hole (32), the surface of the pull rod (19) is fixedly connected with a limit plate (22) adapted to the second positioning hole (32), and a third compression spring (20) is fixedly connected between the anti-slip plate (21) and the side convex plate (18).

8. A high-performance circuit board that facilitates water cooling and heat dissipation connection according to claim 1, characterized in that: The locking mechanism comprises a mounting groove (30) and a locking groove (13); the mounting groove (30) is provided on the upper surface of the mounting frame (1), and the mounting groove (30) passes through the front surface of the mounting frame (1); the locking groove (13) is provided at the bottom end of the mounting frame (1); the inner wall of the mounting groove (30) is fixedly connected with a positioning shaft (28), and a locking block (24) and a T-shaped slide block (27) are slidably provided thereon; the locking block (24) is clamped in the locking groove (13) of the upper mounting frame (1); the T-shaped slide block (27) is sleeved on the positioning shaft (28) and extends to the outside of the mounting groove (30); the U-shaped plate (3) is A receiving groove (31) matched with the locking block (24) is provided on the side surface, a first compression spring (25) is sleeved on the surface of the positioning shaft (28), and two ends of the first compression spring (25) are respectively fixedly connected to the surface of the T-shaped slider (27) and the inner wall of the mounting groove (30), a second compression spring (29) is fixedly connected between the locking block (24) and the T-shaped slider (27), a first positioning hole (26) is provided on the T-shaped slider (27), a fixing block (34) is fixedly connected to the front surface of the U-shaped plate (3), a latch (33) is plugged into the fixing block (34), and the latch (33) is matched with the first positioning hole (26).

9. A high-performance circuit board that facilitates water cooling and heat dissipation connection according to claim 8, characterized in that: The bottom end of the second dustproof net (2) is hinged to the front side of the installation frame (1); an avoidance groove (35) and a sliding groove (37) are provided on the front side of the second dustproof net (2); the avoidance groove (35) is used to avoid the latch (33), the fixing block (34) and the T-shaped sliding block (27); a positioning pin (36) is inserted into the inner wall of the sliding groove (37); and the bottom end of the positioning pin (36) is inserted into the first positioning hole (26).

10. A method for preparing a high-performance circuit board that is convenient for water cooling and heat dissipation connection according to any one of claims 1 to 9, characterized in that: The following steps are involved:

1. Chemical pretreatment of the circuit board body (11), including chemical treatments such as degreasing, decontamination, pickling, etc., so as to better bond with the surface of the circuit board in subsequent processes; 2. Printing the designed circuit diagram on the circuit board body (11) using a special printing technology; 3. Apply chemical substances to the printed circuit diagram to remove the unnecessary metal parts to form the wires and pads of the circuit diagram; 4. Printing relevant text, logo, etc. on the circuit board body (11) by means of a device; 5. The four corners of the circuit board body (11) are punched to form a connection hole (12) that matches the bottom of the T-block (16), and one side of the inner wall of the connection hole (12) has a curvature; 6. Assembling the circuit board body (11), including welding components, wiring, adjustment, etc.

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