Battery piece production method, production equipment and battery piece

Abstract

The embodiment of the invention provides a battery piece production method, production equipment and a battery piece. The battery piece production method comprises the following steps: providing a silicon wafer; dispensing glue on the first surface and / or the second surface of the silicon wafer; the first surface and the second surface are arranged oppositely; arranging a welding strip on the silicon wafer, wherein the welding strip corresponds to the dispensing position; carrying out curing treatment on the dispensing position so as to pre-fix the welding strip; and welding the pre-fixed welding strip and the silicon wafer to form a battery piece. According to the battery piece production method provided by the invention, the solder strip is fixed on the silicon wafer in a mode of bonding and then welding the solder strip, so that the connection strength of the solder strip and the silicon wafer is improved, and the risk that the solder strip is easy to fall off in the transfer process of the silicon wafer is avoided.

Description

[0001] This application claims priority to the Chinese patent application filed with the China Patent Office on June 12, 2024, with application number 202421340901.0 and application name “Battery Cell Production Equipment and Battery Cells,” all contents of which are incorporated by reference into this application.

[0002] This application claims priority to the Chinese patent application filed with the China Patent Office on June 12, 2024, with application number 202421341615.6 and application name “Battery Cell Stringing Machine”, all contents of which are incorporated by reference into this application. Technical Field

[0003] The embodiments of the present application relate to the technical field of photovoltaic panel processing. More specifically, the embodiments of the present application relate to a cell production method, production equipment, and cell. Background Art

[0004] In related technologies, the cell's ribbons are fixed to the silicon wafer by first welding and then gluing. The ribbons are welded first, but the weld is weak, and there's a risk of the ribbons falling off during handling and flipping of the wafer.

[0005] In view of this, it is necessary to provide a new technical solution to solve the above technical problems. Summary of the Invention

[0006] The purpose of this application is to provide a battery cell production method, production equipment and new battery cell technology solutions.

[0007] In a first aspect, embodiments of the present application provide a method for producing a battery cell. The method for producing a battery cell is characterized by comprising the following steps:

[0008] Provide silicon wafers;

[0009] Dispensing glue on the first surface and / or the second surface of the silicon wafer to form a dispensing position; the first surface and the second surface are arranged opposite to each other;

[0010] Laying a welding strip on the silicon wafer, wherein the welding strip corresponds to the glue dispensing position;

[0011] Curing the glue dispensing position to pre-fix the soldering ribbon;

[0012] The pre-fixed soldering ribbon and the silicon wafer are welded to form a battery cell.

[0013] Optionally, providing the silicon wafer specifically includes:

[0014] A group of silicon wafers is provided, comprising a first silicon wafer and a second silicon wafer, wherein a first surface of the first silicon wafer and a second surface of the second silicon wafer are located at the same horizontal plane.

[0015] Optionally, the first surface of the first silicon wafer and the second surface of the second silicon wafer being on the same horizontal plane specifically includes:

[0016] One of the first silicon wafer and the second silicon wafer is flipped 180° so that the first surface of the first silicon wafer and the second surface of the second silicon wafer are in the same horizontal plane.

[0017] Optionally, dispensing glue on the first surface and the second surface of the silicon wafer specifically includes:

[0018] First, glue is applied to the first surface of the silicon wafer, and then glue is applied to the second surface of the silicon wafer.

[0019] Optionally, first applying glue to the first surface of the silicon wafer and then applying glue to the second surface of the silicon wafer specifically includes:

[0020] Placing the silicon wafer on a dispensing platform, wherein the second surface of the silicon wafer is in contact with the dispensing platform and the long side of the silicon wafer extends along a first direction;

[0021] dispensing glue on the first surface of the silicon wafer;

[0022] Transferring the silicon wafer with glue applied on one side from the first conveyor line to the second conveyor line, wherein the long side of the silicon wafer extends along the second direction when the silicon wafer is transferred to the second conveyor line, and the first direction is perpendicular to the second direction;

[0023] Transferring the silicon wafer with glue applied on one side from the second conveyor line to the third conveyor line, wherein the silicon wafer is turned 180° when it is transferred to the third conveyor line so that the first surface of the silicon wafer is in contact with the third conveyor line;

[0024] Transferring the silicon wafer on the third conveyor line to the dispensing platform, with the long side of the silicon wafer extending along the first direction;

[0025] Glue is applied to the second surface of the silicon wafer.

[0026] Optionally, the first conveyor line, the second conveyor line and the third conveyor line are all provided with glue-avoiding tooling.

[0027] Optionally, dispensing glue on the first surface and / or the second surface of the silicon wafer specifically includes:

[0028] The dispensing positions are arranged in a rectangular array on the first surface and / or the second surface of the silicon wafer, and adjacent dispensing positions are spaced apart.

[0029] Optionally, laying a solder strip on the silicon wafer specifically includes:

[0030] Provides soldering ribbons in pre-set lengths;

[0031] Disposing flux on the soldering ribbon;

[0032] Transfer the silicon wafers that have been glued to the ribbon placement platform;

[0033] A soldering ribbon provided with soldering flux is arranged on the surface having the glue dispensing position.

[0034] Optionally, in the case where both the first surface and the second surface of the silicon wafer have glue dispensing locations, placing a soldering ribbon provided with flux on the surface having the glue dispensing location specifically includes:

[0035] First, a soldering ribbon provided with soldering flux is laid on the soldering ribbon laying platform;

[0036] Then, the silicon wafer is placed on a soldering ribbon arrangement platform on which a soldering ribbon is arranged, wherein the soldering ribbon corresponds to a glue dispensing position on one surface of the silicon wafer;

[0037] Then cut the welding ribbon at the preset position;

[0038] Finally, the cut soldering ribbon is placed on the other surface of the silicon wafer, and the soldering ribbon corresponds to the glue dispensing position on the other surface of the silicon wafer.

[0039] Optionally, transferring the silicon wafer after dispensing to the ribbon placement platform specifically includes:

[0040] Transferring the silicon wafer after dispensing from the dispensing platform to the fourth conveyor line, and then transferring it to the first preset position through the fourth conveyor line;

[0041] The silicon wafer located at the first preset position is transferred to the soldering ribbon laying platform.

[0042] Optionally, after placing the soldering ribbon provided with soldering flux on the surface having the glue dispensing position, the method further includes:

[0043] The pressing mesh at the second preset position is placed on the soldering tape, and the silicon wafer provided with the pressing mesh is transferred to the curing platform.

[0044] Optionally, the first preset position and the second preset position are spaced apart along the second direction.

[0045] Optionally, after curing the glue point to pre-fix the solder ribbon, the method further includes:

[0046] The pressing screen is rotated from the curing platform to the second preset position.

[0047] Optionally, welding the pre-fixed welding ribbon and the silicon wafer to form a solar cell specifically includes:

[0048] transporting the silicon wafer from the curing platform to the welding platform;

[0049] The heating device located below the welding platform and the pressing head located above the welding platform cooperate to weld the pre-fixed welding strip and the silicon wafer.

[0050] In a second aspect, an embodiment of the present application further provides a battery cell production device, wherein the battery cell production device adopts the battery cell production method described in the first aspect to prepare battery cells.

[0051] Optionally, the battery cell production equipment includes:

[0052] A loading device, the loading device is used to provide silicon wafers;

[0053] A glue dispensing device, the glue dispensing device being used to dispense glue on the first surface and / or the second surface of the silicon wafer;

[0054] A solder strip processing device, the solder strip processing device is used to lay solder strips on the silicon wafer, the solder strips corresponding to the glue dispensing positions;

[0055] A curing device, the curing device is used to cure the glue point to pre-fix the welding ribbon;

[0056] A welding device is used to weld the pre-fixed welding ribbon and the silicon wafer to form a battery cell.

[0057] In a third aspect, an embodiment of the present application further provides a battery cell, wherein the battery cell is produced using the battery cell production method described in the first aspect.

[0058] According to the embodiments of the present application, the soldering ribbon is fixed to the battery cell by first silk-screen dispensing and then welding, thereby avoiding the risk of the soldering ribbon falling off during the transportation of the battery cell.

[0059] Other features and advantages of the present specification will become apparent from the following detailed description of exemplary embodiments of the present specification with reference to the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0060] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments of the specification and, together with the description, serve to explain the principles of the specification.

[0061] Figure 1 Shown is a flow chart of a battery cell production method provided in an embodiment of the present application.

[0062] Figure 2Shown is a framework diagram of the battery cell production equipment provided in an embodiment of the present application.

[0063] Figure 3 The following is a production flow chart of the battery cell provided in the embodiment of the present application: Figure 1 .

[0064] Figure 4 The following is a production flow chart of the battery cell provided in the embodiment of the present application: Figure 2 .

[0065] Figure 5 The following is a production flow chart of the battery cell provided in the embodiment of the present application: Figure 3 .

[0066] Description of reference numerals:

[0067] 60. Loading device;

[0068] 61. First transfer device;

[0069] 62, dispensing device; 621, dispensing platform; 622, first conveyor line; 623, second conveyor line; 624, third conveyor line;

[0070] 63. Welding ribbon processing device; 631. Welding ribbon pulling device; 632. Welding ribbon laying platform; 633. Six-axis manipulator; 634. Fourth conveyor line; A. First preset position; B. Second preset position;

[0071] 64. Curing device; 641. Curing platform; 642. Fifth conveyor line;

[0072] 65. Welding equipment; DETAILED DESCRIPTION

[0073] Various exemplary embodiments of the present application will now be described in detail with reference to the accompanying drawings. It should be noted that unless otherwise specifically stated, the relative arrangements of components and steps, numerical expressions and numerical values ​​set forth in these embodiments do not limit the scope of the present application.

[0074] The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the present disclosure, its application, or uses.

[0075] Techniques and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the techniques and equipment should be considered part of the specification.

[0076] In all examples shown and discussed herein, any specific values ​​should be interpreted as merely exemplary and not limiting. Therefore, other examples of the exemplary embodiments may have different values.

[0077] It should be noted that like reference numerals and letters refer to like items in the following figures, and therefore, once an item is defined in one figure, it need not be further discussed in subsequent figures.

[0078] Currently, the method for connecting the solder ribbon to the silicon wafer is to weld first and then glue. If this method is used, the welding bond strength is often weaker than the adhesive bond strength. After welding, the solder ribbon may fall off during the subsequent turnover of the silicon wafer. In addition, if the welding-first-then-glue method is used, the bonding method can only be achieved by dispensing glue with a dispenser. The location and amount of glue dispensed are difficult to control, resulting in uneven glue dispensing quality, which to a certain extent increases the overall thickness of the solar cell.

[0079] Based on the above technical problems, the present invention provides a method for producing a battery cell. Figure 1 , the battery cell production method includes the following steps:

[0080] S1: Provide silicon wafers;

[0081] S2: dispensing glue on the first surface and / or the second surface of the silicon wafer to form a glue dispensing position; the first surface and the second surface are arranged opposite to each other;

[0082] S3: Laying a soldering tape on the silicon wafer, wherein the soldering tape corresponds to the glue dispensing position;

[0083] S4: curing the glue dispensing position to pre-fix the soldering ribbon;

[0084] S5: Welding the pre-fixed soldering ribbon and the silicon wafer to form a battery cell.

[0085] In an embodiment of the present application, a battery cell production method is provided, which includes steps S1 to S5.

[0086] In step S1, providing silicon wafers mainly refers to loading the silicon wafers so that subsequent processes can proceed normally. During the loading process of the silicon wafers, a single silicon wafer can be loaded continuously or a group of silicon wafers (at least two silicon wafers) can be loaded continuously.

[0087] Silicon wafers are the basic materials of solar cells, and in this step, the bare panels of the solar cells, that is, the silicon wafers, are loaded. For example, a loading device 60 may be used to load the silicon wafers.

[0088] During the cell production process, two silicon wafers are often connected together through welding ribbons. Therefore, in this step, the two silicon wafers can be regarded as a group of silicon wafers and the silicon wafers can be loaded in the form of a group.

[0089] For example, during the cell production process, two silicon wafers are often arranged face-up and face-down, and connected together via a soldering ribbon. In this case, the loading device 60 may include a flipping mechanism that flips one of the two silicon wafers 180° so that when dispensing glue on a group of silicon wafers, the two silicon wafers are arranged face-up and face-down.

[0090] In a specific embodiment, step S1 specifically includes sub-step S10:

[0091] S10: Provide a group of silicon wafers, where the group of silicon wafers includes a first silicon wafer and a second silicon wafer, and a first surface of the first silicon wafer and a second surface of the second silicon wafer are in the same horizontal plane.

[0092] In step S10 , two silicon wafers are regarded as a group of silicon wafers, that is, when the silicon wafers are loaded, two adjacent silicon wafers are regarded as a group of silicon wafers and loaded simultaneously.

[0093] A group of silicon wafers includes a first silicon wafer and a second silicon wafer. The first surface of the first silicon wafer (i.e., the front side of the first silicon wafer) and the second surface of the second silicon wafer (i.e., the back side of the second silicon wafer) are arranged on the same horizontal plane, that is, the first silicon wafer and the second silicon wafer are arranged one front and one back, in preparation for the smooth progress of subsequent processing steps.

[0094] For example, in order to more specifically describe how to make the first surface of the first silicon wafer and the second surface of the second silicon wafer be at the same horizontal plane, sub-step S101 is introduced. The following is an explanation of step S101:

[0095] S101: flipping one of the first silicon wafer and the second silicon wafer by 180° so that the first surface of the first silicon wafer and the second surface of the second silicon wafer are in the same horizontal plane.

[0096] In step S101 , a specific operation is performed: one of the first silicon wafer and the second silicon wafer is flipped 180°.

[0097] The purpose of flipping the wafers is to adjust the position of the wafers so that the first surface of the first wafer (i.e., the front surface of the first wafer) and the second surface of the second wafer (i.e., the back surface of the second wafer) are on the same horizontal plane. Flipping the wafers 180° means turning the wafers upside down so that the surface that was originally facing up now faces down, and the surface that was originally facing down now faces up.

[0098] Through this flipping operation, it can be ensured that the two silicon wafers are arranged one front and one back, meeting the requirements of subsequent processing steps.

[0099] In step S2, glue is applied to the first surface and / or the second surface of the silicon wafer. For example, glue can be applied to the first surface of the silicon wafer (i.e., the front side of the silicon wafer), i.e., single-sided glue application; or glue can be applied to the second surface of the silicon wafer (i.e., the back side of the silicon wafer), i.e., single-sided glue application; or glue can be applied to both the first surface of the silicon wafer (i.e., the front side of the silicon wafer) and the second surface of the silicon wafer (i.e., the back side of the silicon wafer), i.e., double-sided glue application.

[0100] Preferably, during the production process of solar cells, it is often necessary to lay solder strips on both the front and back sides of each silicon wafer, so it is common to perform double-sided glue application on the silicon wafer.

[0101] Gluing refers to applying adhesive to the surface of the silicon wafer. This step is to better pre-fix the solder ribbon in the subsequent steps to avoid the risk of the solder ribbon falling off during the silicon wafer circulation process.

[0102] In this step, there are multiple possible dispensing methods, such as dispensing with a dispensing head, jet dispensing, or screen printing. For example, screen printing involves placing a screen printing screen over the surface of the silicon wafer where the adhesive is to be dispensed, and then applying adhesive with a scraper to print the adhesive onto the wafer surface. This method allows for better control of the amount of adhesive dispensed.

[0103] In a specific embodiment, taking double-sided glue dispensing on a silicon wafer as an example, step S2 of dispensing glue on the first surface and the second surface of the silicon wafer specifically includes sub-step S20:

[0104] Step S20: first apply glue to one surface of the silicon wafer, and then apply glue to the other surface of the silicon wafer.

[0105] In this step, by first applying glue to one surface of the silicon wafer and then applying glue to the other surface of the silicon wafer, it can be ensured that both the front and back sides of the silicon wafer are evenly covered with the welding device 65, providing a good foundation for the layout and fixation of the welding strip in the subsequent steps.

[0106] For example, taking the dispensing of glue on the first silicon wafer as an example, glue is first dispensed on the first surface of the first silicon wafer (ie, the front side of the first silicon wafer), and then glue is dispensed on the second surface of the first silicon wafer (ie, the back side of the first silicon wafer).

[0107] For example, taking the dispensing of glue on the second silicon wafer as an example, glue is first dispensed on the second surface of the second silicon wafer (ie, the back side of the second silicon wafer), and then glue is dispensed on the first surface of the second silicon wafer (ie, the front side of the second silicon wafer).

[0108] Further, refer to Figure 5 and Figure 3 Step S20 first dispenses glue on the first surface of the silicon wafer, and then dispenses glue on the second surface of the silicon wafer, specifically including sub-steps S201 to S206:

[0109] S201: placing the silicon wafer on the glue dispensing platform 621, wherein the second surface of the silicon wafer is in contact with the glue dispensing platform 621, and the long side of the silicon wafer extends along the first direction;

[0110] S202: applying glue to the first surface of the silicon wafer;

[0111] S203: Transferring the silicon wafer with glue applied on one side from the first conveyor line 622 to the second conveyor line 623, wherein the long side of the silicon wafer extends along a second direction when the silicon wafer is transferred to the second conveyor line 623, and the first direction is perpendicular to the second direction;

[0112] S204: Transferring the silicon wafer with glue applied on one side from the second conveyor line 623 to the third conveyor line 624, wherein the silicon wafer is turned 180 degrees when it is transferred to the third conveyor line 624, so that the first surface of the silicon wafer is in contact with the third conveyor line 624;

[0113] S205: Transferring the silicon wafer on the third conveyor line 624 to the dispensing platform 621, with the long side of the silicon wafer extending along the first direction;

[0114] S206: applying glue to the second surface of the silicon wafer.

[0115] In this embodiment, double-sided dispensing of glue on a first silicon wafer is taken as an example for description.

[0116] In step S201, the silicon wafer is first placed on the dispensing platform 621. Specifically, the first silicon wafer is placed on the dispensing platform 621, and the second surface (back surface) of the first silicon wafer is bonded to the dispensing platform 621 to prepare for subsequent dispensing of the first surface of the first silicon wafer.

[0117] It should be noted that when applying glue to both sides of the second silicon wafer, the second silicon wafer also needs to be placed on the glue dispensing platform 621. The difference from the placement of the first silicon wafer is that the first surface (i.e., the front surface) of the second silicon wafer is in contact with the glue dispensing platform 621 to prepare for subsequent glue dispensing on the second surface of the second silicon wafer.

[0118] Regardless of whether glue is dispensed on the first silicon wafer or the second silicon wafer, after the silicon wafer is placed on the glue dispensing platform 621, the long side of the silicon wafer extends along the first direction, setting a direction reference for subsequent operations.

[0119] It should be noted that the main purpose of limiting the placement direction of the silicon wafer on the dispensing platform 621 is to facilitate the dispensing process on the silicon wafer. Optionally, those skilled in the art can adjust the placement position and placement direction of the silicon wafer on the dispensing platform 621 according to the specific location and type of the dispensing equipment.

[0120] In step S202 , after the first silicon wafer is placed, glue is dispensed onto the first surface of the first silicon wafer.

[0121] Alternatively, after the first silicon wafer and the second silicon wafer are placed, glue may be dispensed on the first surface of the first silicon wafer and the second surface of the second silicon wafer at the same time; or glue may be dispensed on the first surface of the first silicon wafer first and then on the second surface of the second silicon wafer; or glue may be dispensed on the second surface of the second silicon wafer first and then on the first surface of the first silicon wafer.

[0122] In step S203 , the first silicon wafer with glue applied on one side is transferred to the second conveyor line 623 . Alternatively, both the first silicon wafer and the second silicon wafer with glue applied on one side are transferred to the second conveyor line 623 .

[0123] It should be noted that, whether the first silicon wafer with single-sided glue is transferred to the second conveyor line 623, or both the first silicon wafer and the second silicon wafer with single-sided glue are transferred to the second conveyor line 623, the silicon wafer placed on the second conveyor line 623 is rotated 90° compared to the silicon wafer placed on the first conveyor line 622, and the long side of the silicon wafer extends along the second direction, and the first direction and the second direction are perpendicular.

[0124] It should be noted that the main purpose of limiting the placement direction of the silicon wafers on the second conveyor line 623 is to facilitate the transportation of the silicon wafers in combination with the arrangement direction of the second conveyor line 623. Alternatively, those skilled in the art can adjust the placement direction of the silicon wafers on the second conveyor line 623 based on the arrangement direction and arrangement position of the second conveyor line 623.

[0125] In step S204, the first silicon wafer, which has been glued on one side, continues to flow to the third conveyor line 624. The silicon wafer on the third conveyor line 624 is flipped 180 degrees compared to the silicon wafer on the second conveyor line 623, thus preparing the un-glueized surface for glue application. The silicon wafer flows from the second conveyor line 623 to the third conveyor line 624.

[0126] Alternatively, the first silicon wafer and the second silicon wafer with single-sided glue applied are both transferred to the third conveyor line 624, and the first surface of the first silicon wafer placed on the third conveyor line 624 is bonded to the third conveyor line 624, that is, the second surface of the first silicon wafer is set upward, in preparation for glue application on the second surface of the first silicon wafer, and the second surface of the second silicon wafer placed on the third conveyor line 624 is bonded to the third conveyor line 624, that is, the first surface of the second silicon wafer is set upward, in preparation for glue application on the first surface of the second silicon wafer.

[0127] In step S205, the silicon wafers on the third conveyor line 624 are transferred back to the dispensing platform 621. That is, the flipped silicon wafers are transferred from the third conveyor line 624 back to the dispensing platform 621. For example, a four-claw device can be used to transport the silicon wafers on the third conveyor line 624 to the dispensing platform 621.

[0128] At this time, the long side of the silicon wafer located on the dispensing platform 621 extends along the first direction again, preparing to dispense glue on another surface, that is, preparing to dispense glue on the first surface of the first silicon wafer and the second surface of the second silicon wafer.

[0129] In step S206 , glue is dispensed on the first surface of the first silicon wafer and glue is dispensed on the second surface of the second silicon wafer, thereby completing double-sided glue dispensing on the first silicon wafer and double-sided glue dispensing on the second silicon wafer.

[0130] This process achieves efficient and accurate double-sided dispensing of silicon wafers through precise steps and the coordination of conveyor lines. Each step ensures that the silicon wafer is dispensed in the correct position and direction, thereby improving production efficiency and product quality.

[0131] In one embodiment, the first conveyor line 622 , the second conveyor line 623 and the third conveyor line 624 are all provided with glue-avoiding tooling.

[0132] In this embodiment, to ensure that the silicon wafers are not affected by the dispensing operation during transportation and to maintain their cleanliness and integrity, the first conveyor line 622, the second conveyor line 623, and the third conveyor line 624 are equipped with glue avoidance tools. The structures of the first conveyor line 622, the second conveyor line 623, and the third conveyor line 624 include, but are not limited to, conveyor belts.

[0133] It should be noted that after the silicon wafer is glued and before the glue is cured, the conveyor line for transporting the silicon wafer needs to be equipped with glue-avoiding tooling during the process of transferring the silicon wafer.

[0134] Glue avoidance tools are designed to prevent glue from splashing or flowing onto the conveyor line during the dispensing process, potentially contaminating the wafers or disrupting the normal operation of the conveyor line. These tools may use shielding, diversion, or suction methods to effectively prevent glue from contacting the conveyor line and non-dispensing areas of the wafer.

[0135] Alternatively, glue avoidance can be achieved through physical isolation, airflow control, or other methods to ensure that the printed adhesive remains clean during transfer. For example, a glue avoidance device can be implemented using a four-corner support fixture combined with a support structure with a grid to avoid glue spots.

[0136] Alternatively, the glue-avoiding device may be a glue-avoiding tool or a glue-avoiding conveyor belt. For example, avoidance structures such as gaps and holes may be provided on the glue-avoiding tool or the glue-avoiding conveyor belt to avoid the glue point position.

[0137] It should be noted that the embodiments of the present application do not limit the specific structure of the adhesive avoidance device, as long as the adhesive of the battery cell can be prevented from being contaminated and damaged during the transportation process.

[0138] This design ensures that the silicon wafers remain clean during conveying and flipping, providing a good foundation for subsequent soldering and other processing steps. Furthermore, the use of glue-avoiding tooling helps extend the service life of the conveyor line and reduces maintenance requirements caused by glue contamination.

[0139] In one embodiment, the dispensing on the first surface and / or the second surface of the silicon wafer further specifically includes: the dispensing positions are arranged in a rectangular array on the first surface and / or the second surface of the silicon wafer, and adjacent dispensing positions are spaced apart.

[0140] In this embodiment, the glue dispensing locations on the first surface and the second surface of the silicon wafer are arranged in a rectangular array, which means that there is a certain distance between adjacent glue dispensing locations.

[0141] The rectangular array of dispensing points ensures uniform and stable placement of the ribbon on the wafer. Because the ribbon needs to align with the dispensing points, precise placement of the dispensing points is crucial for securing the ribbon and the success of subsequent soldering steps.

[0142] In addition, the spacing between adjacent dispensing stations prevents glue from spreading or overflowing on the silicon wafer surface, thereby maintaining the cleanliness of the silicon wafer and the accuracy of dispensing. This spacing also helps control the heat-affected zone of the solder ribbon during the soldering process (for example, when soldering the solder ribbon between adjacent dispensing stations), preventing damage to the silicon wafer due to overheating.

[0143] In step S3, after forming the glue spot on the surface of the silicon wafer, a soldering tape is laid on the silicon wafer, and the soldering tape corresponds to the glue spot, so as to achieve the purpose of pre-fixing the soldering tape.

[0144] The solder ribbon is a metal strip used to connect the cells, usually made of copper or aluminum. In this step, the ribbon is precisely placed on the silicon wafer, corresponding to the location where the glue was previously dispensed.

[0145] In a specific embodiment, step S3 of laying out the soldering tape on the silicon wafer specifically includes sub-steps S30 to S33.

[0146] S30: Provide welding strips of preset length;

[0147] S31: placing flux on the soldering ribbon;

[0148] S32: Transferring the silicon wafer after dispensing to the ribbon placement platform 632;

[0149] S33: placing a soldering ribbon provided with soldering flux on the surface having the glue dispensing position.

[0150] In step S30 , for example, a soldering ribbon processing device 63 may provide a soldering ribbon of a preset length.

[0151] Exemplarily, the ribbon processing device 63 includes a ribbon pulling device 631 and a ribbon laying platform 632 . The ribbon pulling device 631 includes a ribbon stretching assembly, which is used to lay the ribbon on the surface of the silicon wafer.

[0152] The main function of the ribbon stretching assembly is to stretch the ribbon to the required length through a certain amount of mechanical force and technical manipulation. The stretched ribbon needs to be precisely placed on the dispensing position of the silicon wafer.

[0153] Optionally, the solder ribbon pulling device 631 may further include a solder ribbon unwinding module, a solder ribbon buffer module, a flux module and a cutter module, etc., through the cooperation of these modules, the solder ribbon can be arranged on the battery cell.

[0154] This step involves preparing the appropriate length of solder ribbon to ensure that it covers all the dispensing locations on the silicon wafer.

[0155] In step S31, applying flux to the solder ribbon can be understood as follows: the solder ribbon released by the solder ribbon unwinding module and the solder ribbon buffer module passes through the flux module, and then the flux is applied to the solder ribbon. For example, the flux can be applied to the solder ribbon by dipping or applying the flux.

[0156] To help improve wettability and fluidity during soldering, thereby improving soldering quality and reliability.

[0157] In step S32, the silicon wafer with glue applied is transferred to the ribbon placement platform 632. Specifically, the silicon wafer with glue applied is transferred to the ribbon placement platform 632 to prepare for ribbon placement. This step ensures that the silicon wafer is in the correct position for subsequent ribbon placement operations.

[0158] In step S33, the soldering ribbon is precisely placed on the surface of the silicon wafer with the glue dispensing position. Since the soldering ribbon has been provided with soldering flux, this will facilitate the soldering process between the soldering ribbon and the silicon wafer.

[0159] Through these sub-steps, step S3 ensures that the soldering ribbon can be accurately placed on the glue dispensing position on the silicon wafer, providing a good foundation for the soldering process in subsequent steps.

[0160] It should be noted that the above sub-steps S30 to S33 define a specific implementation method for laying solder strips on silicon wafers. Optionally, step S32 and step S33 can be interchanged.

[0161] Furthermore, in the case where both the first surface and the second surface of the silicon wafer have glue dispensing locations, step S33 of placing a soldering ribbon provided with flux on the surface having the glue dispensing location specifically includes the following sub-steps S331 to S33:

[0162] S331: First, lay the soldering ribbon with flux on the soldering ribbon laying platform 632;

[0163] S332: placing the silicon wafer on a soldering ribbon placement platform 632 on which a soldering ribbon is placed, wherein the soldering ribbon corresponds to a glue dispensing position on one surface of the silicon wafer;

[0164] S333: then cutting the welding strip at a preset position;

[0165] S334: Finally, the cut soldering ribbon is placed on the other surface of the silicon wafer, and the soldering ribbon corresponds to the glue dispensing position on the other surface of the silicon wafer.

[0166] In step S331 , the soldering ribbon is pre-placed on the soldering ribbon placement platform 632 , ready to be aligned with one of the surfaces of the silicon wafer.

[0167] In step S332, the silicon wafer is placed on a platform on which a soldering ribbon has been laid, ensuring that the soldering ribbon is precisely aligned with a glue dispensing position on one surface of the silicon wafer.

[0168] In step S333 , the soldering ribbon is cut at an appropriate position so as to lay a new soldering ribbon segment for the other surface of the silicon wafer.

[0169] In step S334 , the cut solder ribbon segment is repositioned and placed on the other surface of the silicon wafer, ensuring that it is also aligned with the glue dispensing position on that surface.

[0170] Through these sub-steps, step S33 ensures that the solder ribbon can be accurately laid out on the glue dispensing locations on the first and second surfaces of the silicon wafer. This double-sided solder ribbon laying is crucial for the subsequent soldering and electrical connection of the cell, as it ensures that the cell has good conductivity and mechanical stability.

[0171] In a specific embodiment, referring to Figure 3 Step S32 transfers the silicon wafer that has completed dispensing to the solder tape placement platform 632, which specifically includes the following sub-steps S321 to S322.

[0172] S321: transferring the glue-dispensed silicon wafer from the glue-dispensing platform 621 to the fourth conveyor line 634, and then transferring the silicon wafer to the first preset position A via the fourth conveyor line 634;

[0173] S322 : Transferring the silicon wafer located at the first preset position A to the solder ribbon placement platform 632 .

[0174] In step S321, the glue-dispensed silicon wafer is first transferred from the glue dispensing platform 621 to the fourth conveyor line 634. This step is performed by a robotic arm, conveyor belt, or other automated equipment to transfer the silicon wafer from the glue dispensing process to the next process. The silicon wafer moves steadily on the fourth conveyor line 634 until it reaches a specific position.

[0175] It should be noted that the fourth conveyor line 634 also needs to be equipped with glue-avoiding tooling.

[0176] Specifically, the double-sided glued silicon wafer located on the glue dispensing platform 621 can be transferred to the first conveyor line 622, and then transferred to the fourth conveyor line 634 through the first conveyor line 622. For example, a transfer motion mechanism can be provided between the first conveyor line 622 and the fourth conveyor line 634 to transfer the double-sided glued silicon wafer from the first conveyor line 622 to the fourth conveyor line 634 through the transfer motion mechanism.

[0177] In step S322, the silicon wafer at the first preset position A is transferred to the ribbon placement platform 632. At the first preset position A, sensors or markers can be used to identify the position of the silicon wafer, ensuring accurate transfer to the ribbon placement platform 632. This transfer is also accomplished using a robotic arm, conveyor belt, or other automated equipment.

[0178] Through these sub-steps, step S32 ensures that the silicon wafer after glue dispensing can be smoothly and accurately transferred from the glue dispensing platform 621 to the solder ribbon laying platform 632, preparing for the subsequent solder ribbon laying process.

[0179] In one embodiment, referring to Figure 4 After the step S33 of placing the soldering ribbon provided with soldering flux on the surface having the glue dispensing position, the method further includes the step S34:

[0180] S34 : placing the pressing mesh at the second preset position B on the soldering ribbon, and transferring the silicon wafer with the pressing mesh to the curing platform 641 .

[0181] In step S34, a pressing screen at a preset position is first placed on the welding ribbon, for example, by using a robotic arm, a conveyor belt or other automated equipment to complete the placement process of the pressing screen.

[0182] The function of the screen press is to apply a certain amount of pressure to the solder ribbon, making it fit more tightly to the glue dispensing position of the silicon wafer. At the same time, the screen press can also help eliminate bubbles between the solder ribbon and the silicon wafer, improving the welding quality.

[0183] Next, the silicon wafer with the press screen is transferred to the curing platform 641. There, the solder ribbon and glue are cured under certain time and temperature conditions, ensuring a firm bond between the ribbon and the wafer. This step is crucial for ensuring the strength of the connection between the ribbon and the wafer.

[0184] Through step S34, the adhesion of the soldering ribbon on the silicon wafer and the soldering quality can be further improved, providing a solid foundation for the battery cell processing and electrical connection in subsequent steps.

[0185] Optionally, when the pressing mesh cover is provided on the welding strip, the welding strip can be fitted to the glue dispensing position by cooperating with the pressing mesh through a magnetic device.

[0186] Specifically, the magnetic device is used in conjunction with the pressing mesh. When the pressing mesh cover is placed on the welding strip, the magnetic device ensures close contact between the pressing mesh and the welding strip through magnetic force, so that the welding strip is firmly pressed on the welding strip.

[0187] For example, through precise control of magnetic force, the magnetic suction device can ensure that the soldering ribbon and the glue dispensing position are accurately fitted, avoiding the offset or misalignment problems that may occur in traditional methods.

[0188] For example, when curing the first (front) surface of the cell, a press mesh combined with a magnetic device can be used to securely attach the solder ribbon to the dispensing area. When curing the second (back) surface of the cell, the magnetic force is used to press the cell downward as much as possible to facilitate the bonding of the solder ribbon to the silicon wafer.

[0189] In one embodiment, referring to Figure 3 , the first preset position A and the second preset position B are spaced apart along the second direction.

[0190] In this embodiment, the positions of the first preset position A and the second preset position B are limited so that a mechanism such as a robotic arm can be set between the first preset position A and the second preset position B, and the placement of the silicon wafer and the pressing net can be achieved by the same robotic arm.

[0191] Optionally, the robotic arm may be a six-axis robot 633 .

[0192] In step S4, the adhesive dispensing area is cured to pre-fix the solder ribbon and enhance the mechanical connection strength between the ribbon and the silicon wafer. Curing involves hardening the soldering device 65 by heating or other methods, thereby firmly securing the ribbon to the silicon wafer. This step is a pre-fixing process, ensuring that the ribbon does not move during the subsequent soldering steps.

[0193] In this step, the glue dispensing position where the soldering tape is arranged is cured. On the one hand, the soldering device 65 is fixed and the connection with the silicon wafer is strengthened. On the other hand, the soldering device 65 is fixed to improve the connection reliability of the soldering tape and the adhesive.

[0194] Alternatively, the curing method may be thermal curing, UV curing, or other curing techniques. The specific curing method and parameters (such as temperature, time, light intensity, etc.) may be adjusted according to the properties of the adhesive and soldering ribbon used.

[0195] In one embodiment, referring to Figure 4 After the step S4 cures the glue point to pre-fix the solder strip, the step S41 is further included:

[0196] S41: rotating the screen pressing device from the curing platform 641 to the second preset position B.

[0197] Specifically, in this step, after the press has completed its curing and pressing, it needs to be removed from the curing platform 641 and rotated back to its original second preset position B. This operation is to prepare for the processing of the next silicon wafer or solar cell, ensure that the press can be reused, and free up space on the curing platform 641 for subsequent processing steps. For example, the press is rotated from the curing platform 641 to the second preset position B via the fifth conveyor line 642.

[0198] Through step S41, the press screen is effectively recycled and reused, improving production efficiency and resource utilization. At the same time, this also ensures that the next silicon wafer can be processed on the curing platform 641 in a timely manner, thereby maintaining the continuity and efficiency of the production line.

[0199] In step S5, the ribbon is permanently connected to the silicon wafer using a welding technique (such as pressure welding, laser welding, ultrasonic welding, or other welding techniques). After welding is completed, a complete cell is formed and can be further used in the assembly of solar panels.

[0200] In a specific embodiment, step S5 of welding the pre-fixed soldering ribbon and the silicon wafer to form a solar cell specifically includes the following sub-steps S51 to S52.

[0201] S51: transporting the silicon wafer from the curing platform 641 to the welding platform;

[0202] S52: The heating device located below the welding platform and the pressing head located above the welding platform cooperate to weld the pre-fixed welding ribbon and the silicon wafer.

[0203] In step S51, first, the silicon wafer is transferred from the curing platform 641 to the welding platform. This step is usually completed by automated equipment, such as a robotic arm or a conveyor belt, to ensure that the silicon wafer can be accurately and stably transferred to the welding platform.

[0204] In step S52, after the silicon wafer reaches the soldering platform, a heating device located below the platform begins operating, heating the solder ribbon on the wafer. Simultaneously, a pressure head located above the platform descends, contacting the ribbon and applying a certain amount of pressure. The combined effect of heat and pressure melts and flows the solder between the ribbon and the silicon wafer, filling the weld seam and forming a secure solder joint.

[0205] Through sub-steps S51 and S52, step S5 completes the process of welding the pre-fixed solder ribbon to the silicon wafer to form the cell. This process ensures that the electrical and mechanical connection between the solder ribbon and the silicon wafer meets the requirements, laying a solid foundation for subsequent cell testing and assembly.

[0206] Optionally, in order to ensure the reliability of welding between the welding ribbon and the silicon wafer, the pressure head is located between two adjacent dispensing positions, and one or more welding positions are formed between the two adjacent dispensing positions through the cooperation of the heating device and the pressure head.

[0207] Therefore, this embodiment provides a cell production method that adjusts the method for securing the solder ribbon to the silicon wafer. Specifically, the method employs a method of first applying glue and then welding the ribbon. This method ensures that after the adhesive cures, the bond between the ribbon and the adhesive is strong, preventing the ribbon from falling off during wafer rotation. Furthermore, by first applying glue to the cell, the thickness and dosage of the adhesive can be better controlled, thereby better controlling the overall thickness of the cell.

[0208] The present application also provides a battery cell production device, which uses the battery cell production method described above to prepare battery cells.

[0209] In this embodiment, the cell production equipment adopts the above cell production method to prepare the cell, that is, the cell production equipment first dispenses glue on the soldering ribbon and then welds the soldering ribbon to fix the soldering ribbon on the silicon wafer.

[0210] In one embodiment, referring to Figure 2 , the battery cell production equipment includes:

[0211] A loading device 60, the loading device 60 is used to provide silicon wafers;

[0212] a glue dispensing device 62, the glue dispensing device 62 being used to dispense glue on the first surface and / or the second surface of the silicon wafer;

[0213] A solder strip processing device 63, the solder strip processing device 63 is used to lay solder strips on the silicon wafer, the solder strips corresponding to the glue dispensing positions;

[0214] A curing device 64, the curing device 64 is used to cure the glue point to pre-fix the soldering ribbon;

[0215] The welding device 65 is used to weld the pre-fixed welding ribbon and the silicon wafer to form a battery cell.

[0216] In this embodiment, the battery cell production equipment includes a loading device 60, which is specifically responsible for automatically and accurately transferring the battery cells to the dispensing device 62 for subsequent processing.

[0217] Optionally, the loading device 60 includes a flipping mechanism to flip one silicon wafer in a group of silicon wafers (two silicon wafers) by 180°.

[0218] The cell production equipment also includes a dispensing device 62, which forms a specific adhesive (i.e., a dispensing position) on the silicon wafer by dispensing. There are many dispensing schemes, such as dispensing with a dispensing head, spraying, or screen printing. Taking the screen printing dispensing method as an example, the screen printing screen is placed on the silicon wafer, the scraper is dipped in the welding device 65, and the welding device 65 is printed on the silicon wafer where the adhesive needs to be printed. By first dispensing glue on the silicon wafer and then welding the cell, the amount of glue can be better controlled.

[0219] The dispensing device 62 can perform single-sided dispensing on a silicon wafer, forming adhesive on one surface of the silicon wafer. Alternatively, the dispensing device 62 can perform double-sided dispensing on a silicon wafer, forming adhesive on two opposing surfaces of the silicon wafer. When the dispensing device 62 performs double-sided dispensing on a silicon wafer, it first dispenses adhesive on the first surface of the silicon wafer, then, through a flipping mechanism or other processing, dispenses adhesive on the second surface of the silicon wafer.

[0220] Optionally, the dispensing device 62 includes a dispensing platform 621. The main function of the dispensing platform 621 is to support the battery cell and provide stable support for the battery cell during the dispensing process. For example, during the dispensing process, the platform needs to ensure that the position of the battery cell is accurate and stable so that the scraper dipped in the welding device 65 can accurately apply the welding device 65 to the battery cell according to a predetermined pattern or path.

[0221] Optionally, depending on the actual application of the cell, the dispensing device 62 can process a group of silicon wafers (two silicon wafers) simultaneously. When processing a group of silicon wafers simultaneously, the first surface (i.e., the front surface) of one silicon wafer and the second surface (the back surface) of the other silicon wafer can be processed simultaneously.

[0222] Optionally, a first transfer device 61 is provided between the loading device 60 and the gluing device 62, and the first transfer device 61 is used to transfer the silicon wafer to the gluing device 62, wherein the silicon wafer can be a double-sided silicon wafer without gluing (that is, the silicon wafer of the loading device 60 is transferred to the gluing device 62) or the silicon wafer is a single-sided glued cell wafer (that is, the silicon wafer of the third conveyor line 624 is transferred to the gluing position).

[0223] Optionally, a second transfer device is provided on one side of the dispensing platform 621 to facilitate the normal flow of the cells in the process line. The main function of the second transfer device is to accurately transfer the cells after dispensing to the first conveyor line 622. Specifically, the second transfer device transfers the silicon wafers from the first conveyor line 622 to the second conveyor line 623 or directly transfers the silicon wafers from the first conveyor line 622 to the fourth conveyor line 634, depending on the dispensing state of the cell (adhesive formed on one side or both sides).

[0224] The cell production equipment also includes a solder ribbon processing device 63, which may include one or more solder ribbon reels and a precise control mechanism to ensure that the solder ribbon can be evenly laid on the silicon wafer according to a preset route and density.

[0225] Specifically, the solder tape processing device 63 is used to lay solder tape on the battery cell, wherein the solder tape is adhered to the surface of the glue dispensing position, that is, the height of the laid solder tape is higher than the height of the welding device 65, so that the solder tape becomes a protective structure to isolate the adhesive, preventing the adhesive from touching other components during the transmission of the battery cell.

[0226] Optionally, the solder strip processing device 63 can simultaneously lay solder strips on a group of silicon wafers or multiple groups of silicon wafers. That is, in the embodiment of the present application, the glue dispensing positions are first formed on the silicon wafers, and then the solder strips are laid on the silicon wafers based on the arrangement of the glue dispensing positions.

[0227] The battery cell production equipment also includes a curing device 64, which cures the adhesive on which the solder strip is laid. On the one hand, it fixes the welding device 65 and strengthens the connection with the battery cell. On the other hand, it fixes the welding device 65 and improves the connection reliability of the solder strip and the adhesive.

[0228] Alternatively, the curing device 64 may use thermal curing, UV curing or other curing techniques. Specific curing methods and parameters (such as temperature, time, light intensity, etc.) may be adjusted according to the properties of the adhesive and soldering ribbon used.

[0229] The cell production equipment also includes a welding device 65, which typically uses pressure welding, laser welding, ultrasonic welding, or other welding techniques. Welding parameters and conditions (such as welding temperature, welding time, welding pressure, etc.) will ensure a strong connection between the solder ribbon and the silicon wafer.

[0230] Therefore, this embodiment provides a cell production device that adjusts the method for securing the solder ribbon to the silicon wafer. Specifically, the solder ribbon is secured by first applying glue and then welding the ribbon. This method ensures that after the adhesive cures, the bond between the ribbon and the adhesive is strong, preventing the ribbon from falling off during wafer rotation. Furthermore, by first applying glue to the cell, the thickness and dosage of the adhesive can be better controlled, thereby better controlling the overall thickness of the cell.

[0231] The present application also provides a cell. The cell is produced using the cell production method described above. For example, the cell may be a photovoltaic cell.

[0232] Specifically, the battery cell includes a silicon wafer, a soldering ribbon, an adhesive, and a soldering portion, wherein the soldering ribbon connected to the adhesive is at least partially exposed, and the soldering portion connects the soldering ribbon and the silicon wafer.

[0233] In this embodiment, the silicon wafer is the main structure of the cell, providing support and foundation for the entire cell. The soldering ribbon typically serves as a conductive path within the cell, transmitting the current generated by the photovoltaic effect. The soldering ribbon must possess excellent electrical conductivity, mechanical strength, and corrosion resistance. Common soldering ribbon materials include metals or alloys such as copper, silver, and aluminum.

[0234] In this embodiment, an adhesive is first applied to the silicon wafer, and then the solder ribbon is bonded to the adhesive and cured. This allows at least a portion of the solder ribbon, which is connected to the adhesive, to be exposed. The adhesive secures the solder ribbon to the cell, ensuring a tight fit and stable connection between the ribbon and the cell. The soldering portion connects the ribbon and the cell through welding, enhancing the strength and stability of the electrical connection between the ribbon and the cell.

[0235] The above embodiments focus on the differences between the various embodiments. As long as the different optimization features between the various embodiments are not contradictory, they can be combined to form a better embodiment. Considering the simplicity of the text, they will not be repeated here.

[0236] Although some specific embodiments of the present application have been described in detail by way of example, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present application. It should be understood by those skilled in the art that the above examples may be modified without departing from the scope and spirit of the present application. The scope of the present application is defined by the appended claims.

Claims

1. A method for producing a battery cell, characterized in that: The following steps are involved: Provide silicon wafers; Dispensing glue on the first surface and / or the second surface of the silicon wafer to form a dispensing position; the first surface and the second surface are arranged opposite to each other; Arranging a welding strip on the silicon wafer, wherein the welding strip corresponds to the glue dispensing position; Curing the glue dispensing position to pre-fix the welding strip; The pre-fixed welding strip and the silicon wafer are welded to form a battery cell.

2. The battery cell production method according to claim 1, characterized in that: The provision of silicon wafers specifically includes: A group of silicon wafers is provided, wherein the group of silicon wafers includes a first silicon wafer and a second silicon wafer, wherein a first surface of the first silicon wafer and a second surface of the second silicon wafer are in the same horizontal plane.

3. The battery cell production method according to claim 2, characterized in that: The first surface of the first silicon wafer and the second surface of the second silicon wafer being at the same horizontal plane specifically include: One of the first silicon wafer and the second silicon wafer is flipped 180 degrees, so that the first surface of the first silicon wafer and the second surface of the second silicon wafer are in the same horizontal plane.

4. The battery cell production method according to claim 1, characterized in that: The dispensing of glue on the first surface and the second surface of the silicon wafer specifically includes: Firstly, glue is applied to one surface of the silicon wafer, and then glue is applied to the other surface of the silicon wafer.

5. The battery cell production method according to claim 4, characterized in that: The step of first applying glue to the first surface of the silicon wafer and then applying glue to the second surface of the silicon wafer specifically includes: Placing the silicon wafer on a glue dispensing platform (621), wherein the second surface of the silicon wafer is in contact with the glue dispensing platform (621), and the long side of the silicon wafer extends along a first direction; Dispensing glue on the first surface of the silicon wafer; Transferring the silicon wafer with glue applied on one side from the first conveyor line (622) to the second conveyor line (623), wherein the long side of the silicon wafer extends along a second direction when the silicon wafer is transferred to the second conveyor line (623), and the first direction is perpendicular to the second direction; Transferring the silicon wafer with glue applied on one side from the second conveying line (623) to the third conveying line (624), wherein when the silicon wafer is transferred to the third conveying line (624), the silicon wafer is flipped 180° so that the first surface of the silicon wafer is in contact with the third conveying line (624); Transferring the silicon wafer on the third conveying line (624) to the glue dispensing platform (621), wherein the long side of the silicon wafer extends along the first direction; Glue is dispensed on the second surface of the silicon wafer.

6. The battery cell production method according to claim 5, characterized in that: The first conveyor line (622), the second conveyor line (623) and the third conveyor line (624) are all provided with glue-avoiding tooling.

7. The battery cell production method according to claim 1, characterized in that: The dispensing of glue on the first surface and / or the second surface of the silicon wafer specifically includes: The dispensing positions are arranged in a rectangular array on the first surface and / or the second surface of the silicon wafer, and adjacent dispensing positions are spaced apart.

8. The battery cell production method according to claim 1, characterized in that: The step of laying out the welding strip on the silicon wafer specifically comprises: Provides solder strips in preset lengths; Disposing soldering flux on the soldering ribbon; Transferring the silicon wafer after the dispensing to the welding ribbon laying platform (632); A soldering ribbon provided with soldering flux is arranged on the surface having the glue dispensing position.

9. The battery cell production method according to claim 8, characterized in that: In the case where both the first surface and the second surface of the silicon wafer have glue dispensing positions, arranging a soldering ribbon provided with solder flux on the surface having the glue dispensing positions specifically includes: Firstly, a soldering tape provided with soldering flux is laid on the soldering tape laying platform (632); Then, the silicon wafer is placed on a solder strip placement platform (632) on which a solder strip is placed, wherein the solder strip corresponds to a glue point on one of the surfaces of the silicon wafer; Then cut the welding strip at the preset position; Finally, the cut soldering tape is arranged on the other surface of the silicon wafer, and the soldering tape corresponds to the glue dispensing position on the other surface of the silicon wafer.

10. The battery cell production method according to claim 8, characterized in that: The process of transferring the silicon wafer after dispensing to the welding ribbon laying platform (632) specifically includes: Transferring the silicon wafer on which the dispensing has been completed from the dispensing platform (621) to the fourth conveying line (634), and then transferring the silicon wafer to the first preset position (A) through the fourth conveying line (634); The silicon wafer located at the first preset position (A) is transferred to the solder tape placement platform (632).

11. The battery cell production method according to claim 7, characterized in that: After the soldering tape provided with soldering flux is arranged on the surface having the dispensing position, the method further comprises: The pressing mesh at the second preset position (B) is placed on the soldering tape, and the silicon wafer provided with the pressing mesh is transferred to the curing platform (641).

12. The battery cell production method according to claim 11, characterized in that: The first preset position (A) where the silicon wafer is located and the second preset position (B) are arranged at intervals along the second direction.

13. The battery cell production method according to claim 11, characterized in that: After curing the glue point to pre-fix the solder strip, the method further includes: The pressing screen is rotated from the curing platform (641) to the second preset position (B).

14. The battery cell production method according to claim 1, characterized in that: The step of welding the pre-fixed welding strip and the silicon wafer to form a battery cell specifically includes: The silicon wafer is transported from the curing platform (641) to the welding platform; The heating device located below the welding platform and the pressing head located above the welding platform cooperate to weld the pre-fixed welding strip and the silicon wafer.

15. A battery cell production device, characterized in that: The battery cell production equipment adopts the battery cell production method according to any one of claims 1 to 14 to prepare the battery cells.

16. The battery cell production equipment according to claim 15, characterized in that: The battery cell production equipment comprises: A loading device (60), the loading device (60) is used to provide silicon wafers; A glue dispensing device (62), the glue dispensing device (62) being used for dispensing glue on the first surface and / or the second surface of the silicon wafer; A solder strip processing device (63), the solder strip processing device (63) being used to lay solder strips on the silicon wafer, the solder strips corresponding to the glue dispensing positions; A curing device (64), the curing device (64) being used to perform a curing process on the glue dispensing position to pre-fix the welding strip; A welding device (65) is used to weld the pre-fixed welding strip and the silicon slice to form a battery cell.

17. A battery cell, characterized in that: The battery cell is a battery cell prepared by the battery cell production method according to any one of claims 1 to 14.

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